Optical module with heat dissipation mechanism

Abstract

This invention discloses an optical module with a heat dissipation mechanism, comprising a main body, the main body including a housing with openings at both ends and an optical conversion component disposed inside the housing. The housing is integrally formed from a left side panel, a right side panel, an upper panel, and a lower panel. The center portions of the lower panel and the upper panel are respectively provided with a first mounting hole and a second mounting hole, and a first heat dissipation component and a second heat dissipation component are respectively disposed at the first mounting hole and the second mounting hole. The heat dissipation components are in direct contact with the optical conversion circuit board, which can further improve heat dissipation efficiency. Graphene with a high thermal conductivity is selected as the raw material for the first heat dissipation component and the second heat dissipation component to ensure heat dissipation efficiency. Improved heat dissipation efficiency helps the optical module to operate for a long time and expand the signal volume of optical communication.

Description

Technical Field

[0001] This invention relates to the field of optical modules, and more particularly to an optical module with a heat dissipation mechanism. Background Technology

[0002] An optical module is an optoelectronic device that performs photoelectric and electro-optical conversion. The transmitting end of the optical module converts electrical signals into optical signals, and the receiving end converts optical signals into electrical signals. Therefore, in optical communication, the optical module that transmits and receives optical signals plays an important role.

[0003] In the process of photoelectric conversion, the circuit board, the light emitting component and the light receiving component need to work together to finally realize the photoelectric conversion. The circuit board has various resistors, which will dissipate heat when working, thus affecting the normal operation of the optical module. Therefore, optical modules on the market often need external heat dissipation components or timer switches for heat dissipation to ensure the normal operation of the optical module. Summary of the Invention

[0004] To overcome the shortcomings of existing technical solutions, the present invention provides an optical module with a heat dissipation mechanism, which can solve the problems mentioned in the background art.

[0005] The technical solution adopted by the present invention to solve its technical problem is: an optical module with a heat dissipation mechanism, including a structural body, the structural body including a housing with openings at both the front and rear ends and an optical conversion component disposed inside the housing, the housing being integrally formed from a left side plate, a right side plate, an upper plate and a lower plate, the center of the lower plate and the upper plate being respectively provided with a first mounting hole and a second mounting hole, and a first heat dissipation component and a second heat dissipation component being respectively disposed at the first mounting hole and the second mounting hole;

[0006] The optical conversion component consists of an optical conversion circuit board and an optical emitting component and an optical receiving component respectively disposed at both ends of the optical conversion circuit board. The optical emitting component and the optical receiving component both protrude through the opening of the housing.

[0007] The first heat dissipation component includes an integrally formed tray and a limiting member. The limiting member is disposed on the upper end face of the tray, the light conversion circuit board is placed on the upper end face of the tray, the limiting member is disposed at the corner of the light conversion circuit board, and the tray is disposed in the first mounting hole.

[0008] The second heat dissipation component includes an integrally formed heat dissipation plate and a heat-conducting component. The heat-conducting component is disposed on the lower end face of the heat dissipation plate, and the other end of the heat-conducting component is in contact with the light conversion circuit board. The heat dissipation plate is disposed in the second mounting hole.

[0009] Furthermore, the left side panel, right side panel, upper panel, and lower panel are all made of aluminum alloy.

[0010] Furthermore, both the first and second heat dissipation components use graphene as the raw material.

[0011] Furthermore, the side of the tray is in close contact with the inner wall of the first mounting hole, and the side of the heat sink is in close contact with the inner wall of the second mounting hole and are fixedly connected by glue.

[0012] Furthermore, a sealing plate is provided at the opening of the housing, and one end of both the light emitting component and the light receiving component protrudes through the sealing plate;

[0013] Furthermore, the left and right side plates are provided with equally spaced heat dissipation fins on their outward-facing sides;

[0014] Furthermore, multiple optical conversion components are soldered onto the optical conversion circuit board, and these optical conversion components are connected to each other via transmission lines.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: The optical module of the present invention with a heat dissipation mechanism is provided with a first heat dissipation component and a second heat dissipation component. Heat dissipation components are provided at both the upper and lower ends of the optical conversion circuit board, which mainly generates heat. This enables the heat generated by the optical conversion circuit board to be conducted out of the casing more quickly. At the same time, the heat dissipation components are directly in contact with the optical conversion circuit board, which can further improve the heat dissipation efficiency. Furthermore, the use of graphene, which has a high thermal conductivity, as the raw material for the first and second heat dissipation components ensures heat dissipation efficiency. Improving heat dissipation efficiency helps the optical module to operate for a long time and expands the signal volume of optical communication. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 This is a partial structural diagram of the present invention;

[0018] Figure 3 This is a schematic diagram of the internal structure of the present invention.

[0019] Numbering in the diagram: 1-Casing; 2-Optical conversion assembly; 3-Left side panel; 4-Right side panel; 5-Upper panel; 6-Lower panel; 7-First mounting hole; 8-Second mounting hole; 9-First heat dissipation assembly; 10-Second heat dissipation assembly; 11-Optical conversion circuit board; 12-Optical emission assembly; 13-Optical receiving assembly; 14-Support plate; 15-Limiting component; 16-Heat dissipation plate; 17-Heat conduction component; 18-Sealing plate; 19-Heat dissipation fins. Detailed Implementation

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The following is combined with Figure 1-3 A detailed description of an optical module with a heat dissipation mechanism according to the present invention is provided: An optical module with a heat dissipation mechanism includes a main body, the main body including a housing 1 with openings at both the front and rear ends and a light conversion component 2 disposed inside the housing 1. The housing 1 is integrally formed from a left side plate 3, a right side, an upper plate 5 and a lower plate 6. The center portions of the lower plate 6 and the upper plate 5 are respectively provided with a first mounting hole 7 and a second mounting hole 8. A first heat dissipation component 9 and a second heat dissipation component 10 are respectively disposed at the first mounting hole 7 and the second mounting hole 8.

[0022] The optical conversion component 2 consists of an optical conversion circuit board 11 and an optical emitting component 12 and an optical receiving component 13 respectively disposed at both ends of the optical conversion circuit board 11. The optical emitting component 12 and the optical receiving component 13 both protrude through the opening of the housing 1.

[0023] The optical transmitting component 12 is used to transmit electrical signals to the outside through the interface, while the optical receiving component 13 is used to receive optical signals, and the optical conversion circuit board 11 disposed between the two is used to convert the optical signals into electrical signals.

[0024] The first heat dissipation component 9 includes an integrally formed tray 14 and a limiting member 15. The limiting member 15 is disposed on the upper end surface of the tray 14. The light conversion circuit board 11 is placed on the upper end surface of the tray 14. The limiting member 15 is disposed at the corner of the light conversion circuit board 11. The tray 14 is disposed in the first mounting hole 7.

[0025] The limiting component 15 is located at the corner of the light conversion circuit board 11, which can prevent the light conversion circuit board 11 from being loosened due to relative displacement during use, thus affecting normal use.

[0026] The second heat dissipation component 10 includes an integrally formed heat dissipation plate 16 and a heat conduction component 17. The heat conduction component 17 is disposed on the lower end face of the heat dissipation plate 16, and the other end of the heat conduction component 17 is in contact with the light conversion circuit board 11 downward. The heat dissipation plate 16 is disposed in the second mounting hole 8.

[0027] The heat-conducting component 17 also serves to press the light conversion circuit board 11.

[0028] Preferably, the left side plate 3, the right side plate, the upper plate 5 and the lower plate 6 are all made of aluminum alloy, which has the advantages of low cost and stable structure.

[0029] Preferably, both the first heat dissipation component 9 and the second heat dissipation component 10 use graphene as raw material. The reason for using graphene is that graphene has a high thermal conductivity.

[0030] Preferably, the side of the support plate 14 is in close contact with the inner wall of the first mounting hole 7, and the side of the heat sink 16 is in close contact with the inner wall of the second mounting hole 8 and is fixedly connected by glue.

[0031] Preferably, a sealing plate 18 is provided at the opening of the housing 1, and one end of the light emitting component 12 and the light receiving component 13 both protrude through the sealing plate 18;

[0032] Preferably, the left side plate 3 and the right side plate 4 are provided with equally spaced heat dissipation fins 19 on the outward side. The heat dissipation fins 19 can increase the contact area between the left side plate 3 and the right side plate 4 and the outside world, and further improve the heat dissipation efficiency.

[0033] Preferably, a plurality of optical conversion components are soldered on the optical conversion circuit board 11, and the optical conversion components are connected to each other through transmission lines.

[0034] Working principle: Heat dissipation is mainly achieved through two heat dissipation paths;

[0035] 1. Through the first heat dissipation component 9: the heat at the lower end of the light conversion circuit board 11 can directly contact the external environment through the tray 14 and the first mounting hole 7, and use the principle of heat conduction to conduct the working heat generated inside out of the environment.

[0036] The lower end of the heat-conducting component 17 of the second heat dissipation component 10 is in direct contact with the light conversion circuit board 11. The heat of the light conversion circuit board 11 can be conducted upward through the heat-conducting component 17, and finally dissipated through the heat sink 16 and through the second mounting hole 8 to contact the external environment and dissipate the internal working heat.

[0037] In summary, the optical module with a heat dissipation mechanism of the present invention includes a first heat dissipation component and a second heat dissipation component. Heat dissipation components are located at both the upper and lower ends of the light conversion circuit board, which is the main source of heat. This allows for faster heat conduction of the heat generated by the light conversion circuit board to the outside of the housing. Furthermore, the heat dissipation components are in direct contact with the light conversion circuit board, further improving heat dissipation efficiency. The use of graphene, with its high thermal conductivity, as the raw material for both the first and second heat dissipation components ensures efficient heat dissipation. Improved heat dissipation efficiency facilitates long-term operation of the optical module and expands the signal capacity of optical communication.

[0038] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An optical module with a heat dissipation mechanism, characterized in that, The device includes a main structure, which includes a housing with openings at both the front and rear ends and a light conversion component disposed inside the housing. The housing is integrally formed from a left side panel, a right side panel, an upper panel, and a lower panel. The center of the lower panel and the upper panel are respectively provided with a first mounting hole and a second mounting hole. A first heat dissipation component and a second heat dissipation component are respectively disposed at the first mounting hole and the second mounting hole. The optical conversion component consists of an optical conversion circuit board and an optical emitting component and an optical receiving component respectively disposed at both ends of the optical conversion circuit board. The optical emitting component and the optical receiving component both protrude through the opening of the housing. The first heat dissipation component includes an integrally formed tray and a limiting member. The limiting member is disposed on the upper end face of the tray, the light conversion circuit board is placed on the upper end face of the tray, the limiting member is disposed at the corner of the light conversion circuit board, and the tray is disposed in the first mounting hole. The second heat dissipation component includes an integrally formed heat dissipation plate and a heat-conducting component. The heat-conducting component is disposed on the lower end face of the heat dissipation plate, and the other end of the heat-conducting component is in contact with the light conversion circuit board downward. The heat dissipation plate is disposed in the second mounting hole. The housing has a sealing plate at the opening, and one end of the light emitting component and the light receiving component both protrude through the sealing plate. The left and right side plates have equidistantly distributed heat dissipation fins. Multiple light conversion components are soldered onto the light conversion circuit board, and the light conversion components are connected to each other through transmission lines.

2. The optical module with a heat dissipation mechanism according to claim 1, characterized in that: The left side panel, right side panel, upper panel, and lower panel are all made of aluminum alloy.

3. The optical module with a heat dissipation mechanism according to claim 1, characterized in that: Both the first and second heat dissipation components use graphene as the raw material.

4. The optical module with a heat dissipation mechanism according to claim 1, characterized in that: The side of the tray is in close contact with the inner wall of the first mounting hole, and the side of the heat sink is in close contact with the inner wall of the second mounting hole and are fixedly connected by glue.

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