Light emitting component and light module

Abstract

The application discloses a light emitting assembly and a light module. The light emitting assembly comprises a body, an adapter, two light emitting assemblies, a combiner and a converging lens. The body is provided with a first positioning groove, a second positioning groove, a containing groove and a through hole. One end of the containing groove is communicated with the first positioning groove and the second positioning groove respectively, and the other end of the containing groove is communicated with the through hole. The groove bottom of the first positioning groove and the groove bottom of the second positioning groove are communicated. The adapter is fixedly connected with the body and corresponds to the through hole. Each light emitting assembly comprises a heat-conducting base and at least one light emitting chip arranged on the heat-conducting base. When the two light emitting assemblies are respectively arranged in the first positioning groove and the second positioning groove, the surfaces of the two heat-conducting bases provided with the light emitting chips face each other, and each light emitting chip emits a light beam towards the containing groove. The combiner is arranged on the groove bottom of the containing groove and combines the light beams emitted by the light emitting chips into one light beam. The converging lens is arranged in the through hole and converges the one light beam emitted from the combiner to the fiber core of the adapter.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an optical emitting component and an optical module. Background Technology

[0002] In modern communication systems, network traffic demands are growing rapidly. Therefore, fiber optic broadband has gradually become the mainstream, making optical modules extremely important. Existing optical modules typically employ Wavelength Division Multiplexing (WDM) technology, which combines multiple light-emitting chips placed on the same plane in the optical transmitting component into a single beam. This allows more optical signals to be carried through a single fiber optic cable, increasing the optical signal transmission capacity and thus improving information transmission efficiency.

[0003] However, the design of placing multiple light-emitting chips on the same plane may result in the heat generated by the multiple light-emitting chips not being effectively dissipated through the support base, which may shorten the lifespan of the light-emitting chips or require additional cooling chips to be placed between the multiple light-emitting chips and the support base.

[0004] Therefore, how to provide a solution to the above-mentioned technical problems is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides an optical emitting component and an optical module, which can solve the problem that in the design of existing optical emitting components where multiple light-emitting chips are placed on the same plane, the heat generated by the multiple light-emitting chips cannot be effectively dissipated through the support base, which may shorten the service life of the light-emitting chips or require additional cooling chips to be set between the multiple light-emitting chips and the support base.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] This application provides an optical emitting component, comprising: a body, an adapter, a first light-emitting component, a second light-emitting component, a combiner, and a converging lens. The body has a first positioning groove, a second positioning groove, a receiving groove, and a through hole. One end of the receiving groove is connected to both the first and second positioning grooves, and the other end is connected to the through hole. The bottoms of the first and second positioning grooves are connected. The adapter is fixed to the outer surface of the body and includes an optical fiber ferrule, which is positioned corresponding to the through hole. The first light-emitting component includes: a first heat-conducting substrate and N first light-emitting chips disposed on the first heat-conducting substrate, where N is a positive integer. When the first light-emitting component is installed in the first positioning groove, the surface of the first heat-conducting substrate with the N first light-emitting chips faces the bottom of the first positioning groove, and the N first light-emitting chips emit a light beam toward the receiving groove. The second light-emitting component includes: a second heat-conducting substrate and M second light-emitting chips disposed on the second heat-conducting substrate, where M is a positive integer; when the second light-emitting component is installed in the second positioning slot, the surface of the second heat-conducting substrate with the M second light-emitting chips faces the bottom of the second positioning slot, and the M second light-emitting chips are used to emit light beams toward the receiving slot. A beam combiner is disposed at the bottom of the receiving slot to combine the light beams emitted by the N first light-emitting chips and the M second light-emitting chips into a single light beam. A converging lens is disposed in the through hole to converge the single light beam emitted from the beam combiner to the fiber optic ferrule.

[0008] This application provides an optical module, which includes: an optical receiving component and an optical emitting component of this application.

[0009] In the embodiments of the light emitting component of this application, by dispersing multiple light-emitting chips on different planes (i.e., multiple light-emitting chips are dispersed on the first heat-conducting substrate and the second heat-conducting substrate), the multiple light-emitting chips have two heat dissipation paths (i.e., the multiple light-emitting chips dissipate heat through the first heat-conducting substrate and the second heat-conducting substrate), which can disperse heat conduction and avoid heat accumulation on the same path. It can effectively help the multiple light-emitting chips to dissipate heat without the need for additional cooling chips. Attached Figure Description

[0010] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are configured to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0011] Figure 1 This is a perspective view of an embodiment of the light emitting component according to this application;

[0012] Figure 2 for Figure 1 A cross-sectional view of the light emitting component along line segment AA;

[0013] Figure 3 for Figure 1 A first-view explosion diagram of a light-emitting component;

[0014] Figure 4 for Figure 1 A second-view explosion diagram of a light-emitting component;

[0015] Figure 5 for Figure 3 A bottom-view schematic diagram of the optical path of the optical emitting component;

[0016] Figure 6 for Figure 3 A side view of the optical path of the optical emitting component;

[0017] Figure 7 This is an exploded view of an embodiment of the light emitting component according to this application;

[0018] Figure 8 for Figure 7 A bottom-view schematic diagram of the optical path of the optical emitting component;

[0019] Figure 9 for Figure 7 A side view of the optical path of the optical emitting component;

[0020] Figure 10 for Figure 3 A first-view explosion diagram of the first light-emitting component;

[0021] Figure 11 for Figure 3 A second-view explosion diagram of the first light-emitting component;

[0022] Figure 12 for Figure 3 A first-view explosion diagram of the second light-emitting component;

[0023] Figure 13 for Figure 3 A second-view explosion diagram of the second light-emitting component; and

[0024] Figure 14 This is a schematic diagram of an embodiment of an optical module according to this application. Detailed Implementation

[0025] The embodiments of the present invention will be described below with reference to the accompanying drawings. In these drawings, the same reference numerals denote the same or similar components or method flows.

[0026] It must be understood that the use of terms such as "comprising" or "including" in this specification is configured to indicate the presence of specific technical features, values, method steps, work processes, and / or components, but does not preclude the addition of more technical features, values, method steps, work processes, components, or any combination thereof.

[0027] It is important to understand that when a component is described as "connected" or "coupled" to another component, it can be a direct connection or coupling to other components, and there may be intermediate components. Conversely, when a component is described as "directly connected" or "directly coupled" to another component, there are no intermediate components.

[0028] Please see Figures 1 to 4 , Figure 1 This is a perspective view of an embodiment of the light emitting component according to this application. Figure 2 for Figure 1 A cross-sectional view of the light-emitting component along line segment AA. Figure 3 for Figure 1 A first-person view of the explosion of the light-emitting component. Figure 4 for Figure 1 A second-view explosion diagram of a light-emitting component. (See diagram for example.) Figures 1 to 4 As shown, the light emitting assembly 1 includes: a body 11, an adapter 12, a first light-emitting component 13, a second light-emitting component 14, a combiner 15, and a converging lens 16. The body 11 has a first positioning groove 111, a second positioning groove 112, a receiving groove 113, and a through hole 114. One end of the receiving groove 113 communicates with both the first and second positioning grooves 111 and 112, respectively, and the other end communicates with the through hole 114. The bottom of the first positioning groove 111 and the bottom of the second positioning groove 112 are connected. The opening of the first positioning groove 111 faces upwards towards the light emitting assembly 1, and the opening of the second positioning groove 112 faces downwards towards the light emitting assembly 1. In this embodiment, the bottom of the first positioning groove 111 and the bottom of the second positioning groove 112 are partially connected, but this embodiment is not intended to limit the scope of this application.

[0029] In this embodiment, the adapter 12 is fixed to the outer surface of the body 11 and includes an optical fiber ferrule 121, which is disposed corresponding to the through hole 114. The optical fiber inside the optical fiber ferrule 121 can be a single-mode optical fiber or a multimode optical fiber.

[0030] The first light-emitting component 13 includes a first heat-conducting substrate 131 and N first light-emitting chips 132 disposed on the first heat-conducting substrate 131, where N is a positive integer; the second light-emitting component 14 includes a second heat-conducting substrate 141 and M second light-emitting chips 142 disposed on the second heat-conducting substrate 141, where M is a positive integer; wherein, N and M can be the same or different. In this embodiment, N can be, but is not limited to, 2, and M can be, but is not limited to, 2. The wavelengths of the light beams emitted by different first light-emitting chips 132 and different second light-emitting chips 142 are all different, and the first light-emitting chips 132 and the second light-emitting chips 142 can be, but are not limited to, laser chips. When the first light-emitting component 13 is installed in the first positioning groove 111, the first heat-conducting substrate 131 has two surfaces S1 of the first light-emitting chips 132 facing the bottom of the first positioning groove 111, and the two first light-emitting chips 132 are used to emit light beams of different wavelengths toward the receiving groove 113; when the second light-emitting component 14 is installed in the second positioning groove 112, the second heat-conducting substrate 141 has two surfaces S2 of the second light-emitting chips 142 facing the bottom of the second positioning groove 112, and the two second light-emitting chips 142 are used to emit light beams of different wavelengths toward the receiving groove 113.

[0031] Specifically, when the first light-emitting component 13 is installed in the first positioning groove 111 and the second light-emitting component 14 is installed in the second positioning groove 112, the surface S1 of the first heat-conducting substrate 131 with two first light-emitting chips 132 faces each other and the surface S2 of the second heat-conducting substrate 141 with two second light-emitting chips 142 faces each other, and both the two first light-emitting chips 132 and the two second light-emitting chips 142 emit light beams toward the receiving groove 113 that communicates with the first positioning groove 111 and the second positioning groove 112.

[0032] In this embodiment, the beam combiner 15 is disposed at the bottom of the receiving groove 113 and is used to combine the light beams emitted by the two first light-emitting chips 132 and the two second light-emitting chips 142 into one beam (that is, to combine four beams of different wavelengths into one beam); the converging lens 16 is disposed in the through hole 114 and is used to converge the beam emitted from the beam combiner 15 to the fiber optic ferrule 121.

[0033] Therefore, in this embodiment, the light emitting component 1 realizes the emission of four light emitting beams. The heat generated by the two first light-emitting chips 132 is dissipated through the first heat-conducting substrate 131, and the heat generated by the two second light-emitting chips 142 is dissipated through the second heat-conducting substrate 141, thus avoiding the accumulation of heat in multiple light chips on the same path and solving the heat dissipation problem existing in the prior art.

[0034] In one embodiment, the first light-emitting component 13 may further include a first circuit board 133 electrically connected to the two first light-emitting chips 132, and the second light-emitting component 14 may further include a second circuit board 143 electrically connected to the two second light-emitting chips 142; the first circuit board 133 is used to provide an electrical signal to drive the two first light-emitting chips 132 to emit light beams, and the second circuit board 143 is used to provide an electrical signal to drive the two second light-emitting chips 142 to emit light beams. Since the sidewall of the first positioning groove 111 away from the receiving groove 113 can be provided with an opening 1111 communicating with the outside, and the sidewall of the second positioning groove 112 away from the receiving groove 113 can be provided with an opening 1121 communicating with the outside, the first circuit board 133 can extend out of the first positioning groove 111 through the opening 1111 communicating with the outside to receive the electrical signal from the outside and transmit the electrical signal to the two first light-emitting chips 132; the second circuit board 143 can extend out of the second positioning groove 112 through the opening 1121 communicating with the outside to receive the electrical signal from the outside and transmit the electrical signal to the two second light-emitting chips 142.

[0035] In one embodiment, the light emitting assembly 1 may further include a cover plate 17, which covers the opening 1131 of the receiving groove 113. Therefore, the cover plate 17 can be used to protect the multiplexer 15 and prevent moisture and / or dust from entering the receiving groove 113 and affecting the optical function of the multiplexer 15.

[0036] In one embodiment, the combiner 15 may be a thin film filter (TFF) or an arrayed waveguide grating (AWG).

[0037] Please see Figures 2 to 6 , Figure 5 for Figure 3 A bottom-view schematic diagram of the optical path of the light emitting component. Figure 6 for Figure 3 A side view diagram of the optical path of the light emitting component. (See diagram below.) Figures 2 to 6 As shown, when the combiner 15 is a thin-film filter, the light-incident surface of the combiner 15 is provided with two thin-film filters 151 corresponding to the two second light-emitting chips 142, and the light-emitting surface of the combiner 15 is provided with a reflective film 152 and a light-emitting port 153. The two thin-film filters 151 and the reflective film 152 are obliquely opposite to each other. The light beams emitted by the two second light-emitting chips 142 enter the combiner 15 through the corresponding two thin-film filters 151 and are transmitted in a straight line. The light beams emitted by the two first light-emitting chips 132 enter the combiner 15 and are reflected by the reflective film 152 and the two thin-film filters 151, so as to combine with the light beams emitted by the two second light-emitting chips 142 and entering the combiner 15 to form a single light beam emitted from the light-emitting port 153.

[0038] Specifically, the thin-film filter 151 is a bandpass filter used to allow light beams of a specific wavelength emitted by the corresponding second light-emitting chip 142 to pass through, while reflecting light beams of other wavelengths. The light beams emitted by the two second light-emitting chips 142 and passing through the corresponding two thin-film filters 151 into the combiner 15 can pass straight through the output port 153 and illuminate the converging lens 16. The light beams emitted by the two first light-emitting chips 132, after entering the combiner 15, are reflected by the reflective film 152 and the thin-film filter 151, so as to combine with the light beams emitted by the two second light-emitting chips 142 and passing through the corresponding two thin-film filters 151 into a single light beam emitted from the output port 153. The output port 153 may be provided with an anti-reflection film 1531 to increase the transmittance of the single light beam emitted from the output port 153.

[0039] In another embodiment, please refer to Figures 7 to 9 , Figure 7 This is an exploded view of an embodiment of the light emitting component according to this application. Figure 8 for Figure 7 A bottom-view schematic diagram of the optical path of the light emitting component. Figure 9 for Figure 7 A side view diagram of the optical path of the light emitting component. (See diagram below.) Figures 7 to 9 As shown, Figure 7 Light emitting component 2 and Figure 3 The difference between the light emitting components 1 is that... Figure 7 The number of thin-film filters 251 provided in the combiner 25 is greater than that in the other two types of filters. Figure 3 The multiplexer 25 has a large number of thin-film filters 151. Specifically, when the multiplexer 25 is a thin-film filter, the light-incident surface of the multiplexer 25 is provided with four thin-film filters 251 corresponding to the two first light-emitting chips 132 and the two second light-emitting chips 142 (i.e., one thin-film filter 251 corresponds to one first light-emitting chip 132, and one thin-film filter 251 corresponds to one second light-emitting chip 142). The light-exit surface of the multiplexer 25 is provided with a reflective film 252 and a light-exit port 253. The two thin-film filters 251 and the reflective film 252 corresponding to the two second light-emitting chips 142 are obliquely oriented. In a relative configuration, the light beams emitted by the two second light-emitting chips 142 enter the combiner 25 through the corresponding two thin-film filters 251 and are transmitted in a straight line; the light beams emitted by the two first light-emitting chips 132 enter the combiner 25 through the corresponding two thin-film filters 251, and are reflected by the reflective film 252 and the non-corresponding thin-film filters 251, so as to combine with the light beams emitted by the two second light-emitting chips 142 and entering the combiner 25 through the corresponding two thin-film filters 251 to form a single light beam emitted from the output port 253.

[0040] Specifically, the thin-film filter 251 is a bandpass filter used to allow light beams of a specific wavelength emitted by the corresponding light-emitting chip (i.e., the first light-emitting chip 132 or the second light-emitting chip 142) to pass through, while reflecting light beams of other wavelengths. The light beams emitted by the two second light-emitting chips 142 and entering the combiner 25 through the corresponding two thin-film filters 251 can directly illuminate the converging lens 16. The light beams emitted by the two first light-emitting chips 132, after entering the combiner 25 through the corresponding two thin-film filters 251, are reflected by the reflective film 252 and the thin-film filters 251 corresponding to the two second light-emitting chips 142, so as to combine with the light beams emitted by the two second light-emitting chips 142 and entering the combiner 25 through the corresponding two thin-film filters 251 to form a single light beam emitted from the light exit port 253. The light exit port 253 may be provided with an anti-reflection film 2531 to increase the transmittance of the single light beam emitted from the light exit port 253.

[0041] Please see Figures 10 to 13 , Figure 10 for Figure 3 A first-view explosion diagram of the first light-emitting component. Figure 11 for Figure 3 A second-view explosion diagram of the first light-emitting component. Figure 12 for Figure 3 A first-view explosion diagram of the second light-emitting component. Figure 13 for Figure 3 A second-view explosion diagram of the second light-emitting component. (See diagram for example.) Figure 10 and Figure 11 As shown, the first light-emitting component 13 may further include two first collimating lenses 134 disposed on the first heat-conducting substrate 131. Two first light-emitting chips 132 correspond one-to-one with the two first collimating lenses 134. The light beam emitted by each first light-emitting chip 132 passes through the corresponding first collimating lens 134 and enters the beam combiner 15 (i.e., each first collimating lens 134 is located in the optical path of the corresponding first light-emitting chip 132). Figure 12 and Figure 13 As shown, the second light-emitting component 14 may further include two second collimating lenses 144 disposed on the second heat-conducting substrate 141. The two second light-emitting chips 142 correspond one-to-one with the two second collimating lenses 144. The light beam emitted by each second light-emitting chip 142 enters the beam combiner 15 through the corresponding second collimating lens 144 (that is, each second collimating lens 144 is located in the optical path of the corresponding second light-emitting chip 142).

[0042] In one embodiment, the first collimating lens 134 and its corresponding first light-emitting chip 132, and the second collimating lens 144 and its corresponding second light-emitting chip 142, can be aligned using active alignment optical path technology. Therefore, when assembling the light emitting component 1, the second heat-conducting substrate 141, which is provided with two second light-emitting chips 142 and the second circuit board 143, can be first installed in the second positioning groove 112. Then, the two second collimating lenses 144 can be placed on the second heat-conducting substrate 141 using active alignment optical path technology. Next, the first heat-conducting substrate 131, which is provided with two first light-emitting chips 132 and the first circuit board 133, can be installed in the first positioning groove 111. Then, the two first collimating lenses 134 can be placed on the first heat-conducting substrate 131 using active alignment optical path technology. Based on the above assembly requirements, when the first light-emitting component 13 is installed in the first positioning groove 111 and the second light-emitting component 14 is installed in the second positioning groove 112, the two second collimating lenses 144 are closer to the receiving groove 113 than the two first collimating lenses 134 (e.g., Figure 2 (As shown); In addition, the first thermally conductive substrate 131 may include a U-shaped frame 1311 and a first thermally conductive body 1312. The U-shaped frame 1311 includes a bottom 13111 and a first sidewall portion 13112 and a second sidewall portion 13113 extending from both sides of the bottom 13111 respectively. The first sidewall portion 13112 and the second sidewall portion 13113 are connected to the first thermally conductive body 1312. Two first collimating lenses 134 are disposed on the top surface of the bottom 13111 of the U-shaped frame 1311, and two first light-emitting chips 132 are disposed on the first thermally conductive body 1312 (as shown). Figure 10 and Figure 11 (As shown).

[0043] In one embodiment, the first thermally conductive substrate 131 may include a first thermally conductive body 1312 and a first support 1313 and a second support 1314 disposed on the first thermally conductive body 1312. The first support 1313 supports two first light-emitting chips 132, and the second support 1314 supports a first circuit board 133. The height of the first support 1313 is greater than the height of the second support 1314, and the surfaces S3 of the two first light-emitting chips 132 and the first circuit board 133 that are electrically connected to the two first light-emitting chips 132 are at the same height (e.g., the surfaces S3 of the two first light-emitting chips 132 and the first circuit board 133 are at the same height). Figure 2 , Figure 10 and Figure 11(As shown). The first support 1313 and the second support 1314 can form a stepped structure. The first circuit board 133 is attached to the second support 1314 with adhesive 4 (e.g., thermally conductive adhesive) so that the surfaces S3 of the two first light-emitting chips 132 and the first circuit board 133 electrically connected to the two first light-emitting chips 132 are at the same height. Having the surfaces S3 of the two first light-emitting chips 132 and the first circuit board 133 electrically connected to the two first light-emitting chips 132 at the same height facilitates wire bonding and shortens the wire bonding length. The first circuit board 133 can be, but is not limited to, a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex board.

[0044] In one embodiment, the second thermally conductive substrate 141 may include a second thermally conductive body 1411 and a third support 1412 and a fourth support 1413 disposed on the second thermally conductive body 1411. The third support 1412 supports two second light-emitting chips 142, and the fourth support 1413 supports a second circuit board 143. The height of the third support 1412 is greater than the height of the fourth support 1413. The surfaces S4 of the two second light-emitting chips 142 and the second circuit board 143 that are electrically connected to the two second light-emitting chips 142 are at the same height (e.g., ...). Figure 2 , Figure 12 and Figure 13 (As shown). The third support 1412 and the fourth support 1413 can form a stepped structure. The second circuit board 143 is attached to the fourth support 1413 with adhesive 5 (e.g., thermally conductive adhesive) so that the surfaces S4 of the two second light-emitting chips 142 and the second circuit board 143 that are electrically connected to the two second light-emitting chips 142 are at the same height. Having the surfaces S4 of the two second light-emitting chips 142 and the second circuit board 143 that are electrically connected to the two second light-emitting chips 142 at the same height facilitates wire bonding and shortens the wire bonding length. The second circuit board 143 can be, but is not limited to, a printed circuit board, a flexible circuit board, or a rigid-flex board.

[0045] Please see Figure 14 This is a schematic diagram of an embodiment of the optical module according to this application. Figure 14 As shown, the optical module 3 may include an optical receiving component 31 and an optical transmitting component 1. It should be noted that the optical module 3 may also include a housing, electrical interface circuits, and other necessary components, which will not be described in detail here.

[0046] In summary, in this application, the light-emitting component employs a design where multiple light-emitting chips are dispersed across different planes (i.e., multiple light-emitting chips are dispersed on the first and second heat-conducting substrates). This design provides two heat dissipation paths for the multiple light-emitting chips (i.e., the multiple light-emitting chips dissipate heat through the first and second heat-conducting substrates), thus dispersing heat conduction and preventing heat accumulation on the same path. This effectively helps the light-emitting chips dissipate heat without the need for additional cooling chips. Furthermore, the number of thin-film filters used in the thin-film filter serving as a combiner is adjusted through the optical path design of the first and second light-emitting components. This invention is not intended to be limiting. Rather, it encompasses modifications and similar arrangements that are obvious to those skilled in the art. Therefore, the scope of the claims should be interpreted in the broadest possible sense to include all obvious modifications and similar arrangements.

Claims

1. A light emitting component, characterized in that, include: The main body is provided with a first positioning groove, a second positioning groove, a receiving groove and a through hole. One end of the receiving groove is connected to the first positioning groove and the second positioning groove respectively, and the other end of the receiving groove is connected to the through hole. The bottom of the first positioning groove and the bottom of the second positioning groove are connected. The opening of the first positioning groove faces the top of the light emitting component, and the opening of the second positioning groove faces the bottom of the light emitting component. An adapter is fixed to the outer surface of the body and includes an optical fiber ferrule, wherein the optical fiber ferrule is provided corresponding to the through hole; The first light-emitting component includes: a first heat-conducting substrate and N first light-emitting chips disposed on the first heat-conducting substrate, where N is a positive integer; when the first light-emitting component is installed in the first positioning groove, the surface of the first heat-conducting substrate on which the N first light-emitting chips are disposed faces the bottom of the first positioning groove, and the N first light-emitting chips are used to emit light beams toward the receiving groove; The second light-emitting component includes: a second heat-conducting substrate and M second light-emitting chips disposed on the second heat-conducting substrate, where M is a positive integer; when the second light-emitting component is installed in the second positioning groove, the surface of the second heat-conducting substrate on which the M second light-emitting chips are disposed faces the bottom of the second positioning groove, and the M second light-emitting chips are used to emit light beams toward the receiving groove; A beam combiner, disposed at the bottom of the receiving slot, is used to combine the light beams emitted by the N first light-emitting chips and the M second light-emitting chips into a single light beam; and A converging lens is disposed within the through hole to converge the beam emitted from the multiplexer to the fiber optic ferrule. The surface of the first thermally conductive substrate with the N first light-emitting chips faces the surface of the second thermally conductive substrate with the M second light-emitting chips.

2. The light emitting component as described in claim 1, characterized in that, It also includes a cover plate that covers the opening of the receiving groove.

3. The light emitting component as described in claim 1, characterized in that, The combiner is a thin-film filter or an arrayed waveguide grating.

4. The light emitting component as described in claim 1, characterized in that, When the beam combiner is a thin-film filter, the light-incident surface of the beam combiner is provided with M+N thin-film filters corresponding to the N first light-emitting chips and the M second light-emitting chips. The light-exit surface of the beam combiner is provided with a reflective film and a light-exit port. The thin-film filters corresponding to the M second light-emitting chips and the reflective film are obliquely opposite to each other. The light beams emitted by the M second light-emitting chips enter the beam combiner through the corresponding M thin-film filters and are transmitted in a straight line. The light beams emitted by the N first light-emitting chips enter the beam combiner through the corresponding N thin-film filters, and after being reflected by the reflective film and non-corresponding thin-film filters, they are combined with the light beams emitted by the M second light-emitting chips and entering the beam combiner to form the single light beam emitted from the light-exit port.

5. The light emitting component as described in claim 1, characterized in that, When the beam combiner is a thin-film filter, the light-incident surface of the beam combiner is provided with M thin-film filters corresponding to the M second light-emitting chips, and the light-emitting surface of the beam combiner is provided with a reflective film and a light-emitting port. The M thin-film filters and the reflective film are obliquely opposite to each other. The light beams emitted by the M second light-emitting chips enter the beam combiner through the M thin-film filters and are transmitted in a straight line. The light beams emitted by the N first light-emitting chips enter the beam combiner and are reflected by the reflective film and the M thin-film filters, so as to combine with the light beams emitted by the M second light-emitting chips and entering the beam combiner to form the single light beam emitted from the light-emitting port.

6. The light emitting component as described in claim 4 or 5, characterized in that, The light outlet is equipped with an anti-reflection film.

7. The light emitting component as described in claim 1, characterized in that, The first light-emitting component further includes N first collimating lenses disposed on the first heat-conducting substrate, wherein each of the N first light-emitting chips corresponds to one of the N first collimating lenses, and the light beam emitted by each first light-emitting chip enters the combiner through the corresponding first collimating lens; the second light-emitting component further includes M second collimating lenses disposed on the second heat-conducting substrate, wherein each of the M second light-emitting chips corresponds to one of the M second collimating lenses, and the light beam emitted by each second light-emitting chip enters the combiner through the corresponding second collimating lens.

8. The light emitting component as described in claim 7, characterized in that, The first thermally conductive substrate includes a U-shaped frame and a first thermally conductive body. The U-shaped frame includes a bottom and a first sidewall portion and a second sidewall portion extending from both sides of the bottom, respectively. The first sidewall portion and the second sidewall portion are connected to the first thermally conductive body. The N first collimating lenses are disposed on the top surface of the bottom of the U-shaped frame. The N first light-emitting chips are disposed on the first thermally conductive body. The first sidewall portion and the second sidewall portion are connected to the end face of the first thermally conductive body facing the receiving groove / the wave combiner.

9. The light emitting component as described in claim 8, characterized in that, When the first light-emitting component is installed in the first positioning slot and the second light-emitting component is installed in the second positioning slot, the M second collimating lenses are closer to the receiving slot than the N first collimating lenses.

10. The light emitting component as claimed in claim 1, characterized in that, The first light-emitting component further includes: a first circuit board electrically connected to the N first light-emitting chips; the first heat-conducting substrate includes a first heat-conducting body and a first support and a second support disposed on the first heat-conducting body; the first support supports the N first light-emitting chips, and the second support supports the first circuit board; the height of the first support is greater than the height of the second support, and the surfaces of the N first light-emitting chips and the first circuit board that are electrically connected to the N first light-emitting chips are at the same height.

11. The light emitting component as claimed in claim 1, characterized in that, The second light-emitting component further includes: a second circuit board electrically connected to the M second light-emitting chips; the second heat-conducting substrate includes a second heat-conducting body and a third and a fourth support disposed on the second heat-conducting body; the third support supports the M second light-emitting chips, and the fourth support supports the second circuit board; the height of the third support is greater than the height of the fourth support, and the surfaces of the M second light-emitting chips and the second circuit board that are electrically connected to the M second light-emitting chips are at the same height.

12. An optical module, characterized in that, It includes an optical receiving component and an optical emitting component as described in any one of claims 1 to 11.

Images