Wire Bonding Area Anti-Interference Production Device and Method

Abstract

The present application discloses a production device for preventing interference in the wire bonding area, including a workbench, a first transfer track, a second transfer track and a deflection track, wherein the first transfer track and the second transfer track are arranged on the workbench; the deflection track is arranged between the first transfer track and the second transfer track, the deflection track is rotatably arranged on the workbench, a bearing plate is slidably arranged on the deflection track, and the bearing plate is used to carry the lead frame; when the deflection track rotates, the first transfer track and the second transfer track move synchronously to the side away from the deflection track. After the first transfer track transfers the lead frame to the deflection track, the rotation of the deflection track can drive the lead frame to deflect a certain angle on the horizontal plane. During the solid crystal process, when the wafer is transferred to the substrate of the lead frame, the wafer can be deflected relative to the substrate without adjusting the fixed angle of the wafer, which is convenient for wire bonding in semiconductor packaging.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular, to a wire bonding area anti-interference production device and method. Background Art

[0002] The key technologies in semiconductor packaging technology are die bonding technology and wire bonding technology. Die bonding is also known as Die Bond or chip mounting. Die bonding is the process of bonding a wafer to a designated area of a lead frame through a colloid (usually a conductive or insulating colloid for LEDs), forming a thermal or electrical path, and providing conditions for the subsequent wire bonding technology. Wire Bonding is a process that uses fine metal wires and utilizes heat, pressure, and ultrasonic energy to tightly bond the metal leads to the substrate pads, achieving electrical interconnection between the chip and the substrate and information communication between chips. Under ideal control conditions, electron sharing or atomic interdiffusion occurs between the lead and the substrate, enabling atomic-level bonding between the two metals.

[0003] Usually during die bonding, the wafer is placed inside the base island of the lead frame, and the wafer is placed exactly in the middle of the base island. It is more convenient to perform wire bonding, that is, more convenient to perform wire bonding when most wafers are placed exactly in the middle of the base island. However, the wire bonding points of some wafers are offset from the bonding points on the lead frame. When the wafer is placed exactly in the middle of the base island of the lead frame, during the wire bonding process, the gold wire not only has to deflect but also the gold wire is too long. The current method can only set a motor at the position of the die bonding swing arm suction head. Although the motor can drive the suction nozzle and the wafer to rotate, it will cause the loading at the material taking end of the fixed swing arm to be heavier, reducing the accuracy of the die bonding swing arm. Therefore, there is currently no equipment and method to solve the above technical problems. Summary of the Invention

[0004] In order to facilitate the bonding process between the wafer and the lead frame substrate during wire bonding, the present application provides a wire bonding area anti-interference production device and method.

[0005] In a first aspect, the present application provides a wire bonding area anti-interference production device, adopting the following technical solution:

[0006] A wire bonding area anti-interference production device includes:

[0007] A workbench;

[0008] A first transfer track, arranged on the workbench;

[0009] A second transfer track, arranged on the workbench;

[0010] The deflection track is arranged between the first transfer track and the second transfer track. The deflection track is rotatably arranged on the workbench, and a carrier plate is slidably arranged on the deflection track. The carrier plate is used for carrying a lead frame.

[0011] When the deflection track rotates, the first transfer track and the second transfer track move synchronously to the side away from the deflection track, so as to leave a gap for the movement of the deflection track between the first transfer track and the deflection track and between the second transfer track and the deflection track.

[0012] Based on the above technical solution, after the first transfer track transfers the lead frame onto the deflection track, the rotation of the deflection track can drive the lead frame to deflect a certain angle on the horizontal plane. During the die bonding process, when transferring the die onto the substrate of the lead frame, the deflection of the die relative to the substrate can be achieved without additionally adjusting the fixing angle of the die, which is convenient for wire bonding in semiconductor packaging.

[0013] Preferably, the deflection track is rotatably connected to the workbench through a main shaft, and a synchronous driving structure is connected to the main shaft. The first transfer track and the second transfer track are connected with sliding seats, and the synchronous driving structure is matched with the sliding seats to synchronously drive the first transfer track and the second transfer track to slide when the deflection track rotates.

[0014] Preferably, the synchronous driving structure includes a first cam and a second cam fixedly connected to the main shaft. The first cam and the second cam are parallel to each other, and the first cam and the second cam are arranged in a structure symmetric about the center of the main shaft. The first cam and the second cam each have a first abutting portion and a second abutting portion for abutting against the sliding seats. The first abutting portion and the second abutting portion are both close to the two sliding seats, so that the first transfer track and the second transfer track can be driven to slide when the deflection track rotates in both forward and reverse directions.

[0015] Preferably, a guide rod is arranged between the two sliding seats. The guide rod slidably penetrates between the two sliding seats, and a return spring is sleeved on the guide rod. Both ends of the return spring are fixedly connected to the two sliding seats respectively.

[0016] Preferably, a support seat is arranged at the bottom of the carrier plate, and a guide rail is arranged in the deflection track. The support seat is slidably matched with the guide rail.

[0017] Preferably, an extension plate is arranged at the bottom of the carrier plate. The extension plate is fixedly connected with a rack, and a driving gear is rotatably connected in the deflection track. The driving gear meshes with the rack, and the driving gear rotates to drive the carrier plate to move.

[0018] Preferably, a vacuum suction hood is provided at the bottom of the carrier plate. The vacuum suction hood is connected to a vacuum air pipe. Vacuum suction holes are provided on the carrier plate. The vacuum air pipe is connected to the vacuum suction holes through the vacuum suction hood for adsorbing the lead frame.

[0019] Preferably, a vacuum air channel is formed on the main shaft. The vacuum air pipe passes through the deflection track and is connected to the vacuum air channel. Two vacuum air supply pipes are provided on the workbench. One ends of the vacuum air supply pipes are abutted against the main shaft. The vacuum air channel has two vacuum air inlets for communicating with the two vacuum air supply pipes when the main shaft rotates forward and backward.

[0020] Preferably, both ends of the deflection track are arc-shaped. The ends of the first transfer track and the second transfer track close to the deflection track are also arc-shaped to facilitate the smooth deflection of the deflection track.

[0021] In a second aspect, the present application provides a production method for preventing interference in the wire bonding area, adopting the following technical solutions:

[0022] A production method for preventing interference in the wire bonding area, adopting the above-mentioned production device for preventing interference in the wire bonding area, includes the following steps:

[0023] Transfer the lead frame to the deflection track;

[0024] Rotate the deflection track so that the deflection track drives the lead frame to deflect;

[0025] Move the wafer to the substrate of the lead frame so that the angle of the wafer relative to the substrate is deflected;

[0026] Move the carrier plate to facilitate the placement of the wafer.

[0027] In summary, the present application includes the following beneficial technical effects:

[0028] After the first transfer track transfers the lead frame to the deflection track, the rotation of the deflection track can drive the lead frame to deflect a certain angle on the horizontal plane. During the die bonding process, when transferring the wafer to the substrate of the lead frame, the deflection of the wafer relative to the substrate can be achieved without additionally adjusting the fixed angle of the wafer, which is convenient for wire bonding in semiconductor packaging;

[0029] During the process of the carrier plate driving the lead frame to move, the vacuum suction holes on the carrier plate can adsorb the lead frame, so that the lead frame can be stably driven for transfer, making the die bonding stage more stable. Description of the Drawings

[0030] Figure 1Illustrates the schematic structural diagram of the positional relationship between the wafer and the lead frame in the related art;

[0031] Figure 2 Illustrates the schematic structural diagram of the positional relationship between the wafer and the lead frame after improvement for the related art;

[0032] Figure 3 Illustrates the schematic overall structure diagram of an anti-interference production device for a wire bonding area according to an embodiment of the present application;

[0033] Figure 4 Illustrates the top view of the structure of an anti-interference production device for a wire bonding area according to an embodiment of the present application;

[0034] Figure 5 Illustrates the schematic partial structure diagram of an anti-interference production device for a wire bonding area according to an embodiment of the present application;

[0035] Figure 6 Illustrates the schematic internal structure diagram of the workbench of an anti-interference production device for a wire bonding area according to an embodiment of the present application;

[0036] Figure 7 Illustrates Figure 4 the top view of the structure of;

[0037] Figure 8 Illustrates the schematic structural diagram of the deflection track of an anti-interference production device for a wire bonding area according to an embodiment of the present application;

[0038] Figure 9 Illustrates Figure 6 the enlarged schematic structural diagram of part A in;

[0039] Figure 10 Illustrates the schematic internal structure diagram within the deflection track of an anti-interference production device for a wire bonding area according to an embodiment of the present application;

[0040] Figure 11 Illustrates Figure 10 the schematic sectional structure diagram of.

[0041] Explanation of reference numerals: 100, wafer; 200, lead frame; 10, workbench; 11, vacuum supply pipe; 20, first transfer track; 21, first sliding seat; 30, second transfer track; 31, second sliding seat; 40, deflection track; 41, carrier plate; 411, vacuum adsorption hole; 42, main shaft; 421, vacuum airway; 422, vacuum inlet; 43, synchronous drive structure; 431, first cam; 432, second cam; 44, support seat; 45, guide rail; 47, extension plate; 48, rack; 49, drive gear; 50, guide rod; 51, return spring; 60, vacuum adsorption cover; 61, vacuum pipe. Detailed implementation manners

[0042] Reference Figure 1 , in the current semiconductor device packaging structure, the wafer 100 is usually placed in the middle position of one of the substrates of the lead frame 200, and the edge of the wafer 100 is flush with the edge of the substrate. When the span between the wire bonding points on the wafer 100 and the wire bonding points on the lead frame 200 is relatively large, it will increase the difficulty of the wire bonding operation. Refer to Figure 2 , if the wafer 100 is deflected by a certain angle, the difficulty of the wire bonding operation will be reduced. However, when all the wafers 100 in the same batch need to be deflected by a certain angle, it is very difficult to accurately adjust the wafer 100 to the appropriate angle during the die bonding operation. Therefore, there is a great difficulty in the die bonding process.

[0043] The following will further elaborate on this application in conjunction with the attached Figures 3 - 11 drawings.

[0044] The embodiment of this application discloses a wire bonding area anti-interference production device. Refer to Figure 3 , the wire bonding area anti-interference production device includes a workbench 10, a first transfer track 20, a second transfer track 30, and a deflection track 40. The first transfer track 20, the second transfer track 30, and the deflection track 40 are all arranged on the workbench 10, and the deflection track 40 is arranged between the first transfer track 20 and the second transfer track 30. The deflection track 40 is rotationally connected to the workbench 10. After the first transfer track 20 transfers the lead frame 200 to the deflection track 40, the rotation of the deflection track 40 can drive the lead frame 200 to deflect by a certain angle on the horizontal plane. During the die bonding process, that is, when transferring the wafer 100 to the substrate of the lead frame 200, the deflection of the wafer 100 relative to the substrate can be achieved without additionally adjusting the fixing angle of the wafer 100, which is convenient for wire bonding in semiconductor packaging.

[0045] Reference Figure 4 , both ends of the deflection track 40 are set to be arc-shaped, and the ends of the first transfer track 20 and the second transfer track 30 close to the deflection track 40 are also set to be arc-shaped. When the deflection track 40 rotates, the arc-shaped setting can enable the deflection track 40 to rotate smoothly, avoiding the phenomenon of jamming between the deflection track 40, the first transfer track 20, and the second transfer track 30.

[0046] Reference Figure 5 , a main shaft 42 is fixedly connected to the bottom of the deflection track 40, and the deflection track 40 is rotationally connected to the workbench 10 through the main shaft 42. A driving motor and a gear set are fixedly connected inside the workbench 10, the driving motor drives the main shaft 42 to rotate through the gear set, and the main shaft 42 drives the deflection track 40 to rotate.

[0047] When the deflection track 40 rotates, the first transfer track 20 and the second transfer track 30 move synchronously to the side away from the deflection track 40, so as to leave a gap for the movement of the deflection track 40 between the first transfer track 20 and the deflection track 40 and between the second transfer track 30 and the deflection track 40, preventing the deflection track 40 from jamming during rotation.

[0048] Refer to Figure 5 , a first sliding seat 21 is fixedly connected to the bottom of the first transfer track 20, a second sliding seat 31 is fixedly connected to the bottom of the second transfer track 30, both the first sliding seat 21 and the second sliding seat 31 are slidably connected to the workbench 10, and a sliding groove for the movement of the first transfer track 20 and the second transfer track 30 is formed on the workbench 10. A synchronous driving structure 43 is connected to the main shaft 42, and the synchronous driving structure 43 cooperates with the sliding seat to synchronously drive the first transfer track 20 and the second transfer track 30 to slide when the deflection track 40 rotates.

[0049] Refer to Figure 6 and Figure 7 , the synchronous driving structure 43 includes a first cam 431 and a second cam 432 fixedly connected to the main shaft 42. The first cam 431 and the second cam 432 are parallel to each other, and the first cam 431 and the second cam 432 are arranged in a structure symmetric about the center of the main shaft 42. The first cam 431 and the second cam 432 each have a first abutting portion and a second abutting portion for abutting against the sliding seat, and there are two symmetric first abutting portions and second abutting portions. The first abutting portion and the second abutting portion on the same side of the main shaft 42 abut against the first sliding seat 21 or the second sliding seat 31.

[0050] When the driving motor drives the main shaft 42 to rotate through the gear set, the main shaft 42 drives the first cam 431 and the second cam 432 to rotate synchronously. The first cam 431 or the second cam 432 will simultaneously push the first sliding seat 21 and the second sliding seat 31, causing the first sliding seat 21 and the second sliding seat 31 to move towards both sides, so that the first transfer track 20 and the second transfer track 30 can be separated from the deflection track 40.

[0051] Refer to Figure 6 and Figure 7 , a guide rod 50 is arranged between the two sliding seats. The guide rod 50 slidably penetrates between the two sliding seats. A return spring 51 is sleeved on the guide rod 50. The first end of the return spring 51 is fixedly connected to the first sliding seat 21, and the second end of the return spring 51 is fixedly connected to the second sliding seat 31. When the first sliding seat 21 and the second sliding seat 31 are not abutted by the first cam 431 and the second cam 432, under the action of the return spring 51, the first sliding seat 21 and the second sliding seat 31 are reset.

[0052] Refer toFigure 8 On the deflection track 40, a carrier plate 41 is slidably arranged. The carrier plate 41 is used to carry the lead frame 200. When the lead frame 200 is transferred into the deflection track 40 by the first transfer track 20, the carrier plate 41 can play a role in supporting.

[0053] Refer to Figure 8 and Figure 9 Refer to

[0054] Refer to Figure 10 and Figure 11 At the bottom of the carrier plate 41, a support base 44 is arranged. In the deflection track 40, a guide rail 45 is arranged. The support base 44 is in sliding fit with the guide rail 45. At the bottom of the carrier plate 41, an extension plate 47 is arranged. The extension plate 47 is fixedly connected with a rack 48. In the deflection track 40, a driving gear 49 is rotatably connected. The driving gear 49 meshes with the rack 48. The driving gear 49 rotates to drive the carrier plate 41 to move. The driving gear 49 can be driven to rotate by a driving motor. There are two sets of symmetrically arranged driving gears 49 and racks 48, which can make the movement of the carrier plate 41 driving the lead frame 200 more stable.

[0055] Refer to Figure 10 and Figure 11 At the bottom of the carrier plate 41, a vacuum suction cover 60 is arranged. The vacuum suction cover 60 is communicated with a vacuum air pipe 61. On the carrier plate 41, vacuum suction holes 411 are arranged. The vacuum air pipe 61 is connected with the vacuum suction holes 411 through the vacuum suction cover 60 to adsorb the lead frame 200.

[0055] Refer to Figure 10 and Figure 11 On the main shaft 42, a vacuum air channel 421 is opened. The vacuum air pipe 61 passes through the deflection track 40 and is connected with the vacuum air channel 421. On the workbench 10, two vacuum air supply pipes 11 are arranged. One ends of the vacuum air supply pipes 11 are abutted against the main shaft 42. The vacuum air channel 421 has two vacuum air inlets 422, which are used to communicate with the two vacuum air supply pipes 11 when the main shaft 42 rotates forward and backward. When the main shaft drives the deflection track 40 to rotate a certain deflection angle, one of the vacuum air inlets 422 is connected with one of the vacuum air supply pipes 11 to realize the conduction of the vacuum air path. The arrangement of the two vacuum air inlets 422 and the two vacuum air supply pipes 11 enables the main shaft 42 to introduce vacuum through the vacuum air inlets 422 whether it rotates forward or backward, so as to realize the negative pressure adsorption of the lead frame 200.

[0056] The embodiment of the present application also discloses a production method for preventing interference in the wire bonding area. The above-mentioned production device for preventing interference in the wire bonding area is adopted. It includes the following steps:

[0057] Transfer the lead frame 200 to the deflection track 40;

[0058] Rotate the deflection track 40 so that the deflection track 40 drives the lead frame 200 to deflect;

[0059] Move the wafer 100 onto the substrate of the lead frame 200 such that the angle of the wafer 100 relative to the substrate is deflected;

[0060] Move the carrier plate 41 to facilitate the placement of the wafer 100.

[0061] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0062] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0063] In the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0064] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0065] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0066] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0067] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A wire bonding area anti-interference production device, characterized in that Comprising: A workbench (10); A first transfer track (20), arranged on the workbench (10); A second transfer track (30), arranged on the workbench (10); A deflection track (40), arranged between the first transfer track (20) and the second transfer track (30), the deflection track (40) is rotatably arranged on the workbench (10), a carrier plate (41) is slidably arranged on the deflection track (40), and the carrier plate (41) is used for carrying a lead frame (200); When the deflection track (40) rotates, the first transfer track (20) and the second transfer track (30) move synchronously to the side away from the deflection track (40), so as to leave a gap for the movement of the deflection track (40) between the first transfer track (20) and the deflection track (40) and between the second transfer track (30) and the deflection track (40); The deflection track (40) is rotatably connected to the workbench (10) through a main shaft (42), a synchronous driving structure (43) is connected to the main shaft (42), the first transfer track (20) and the second transfer track (30) are connected with sliding seats, and the synchronous driving structure (43) is matched with the sliding seats to synchronously drive the first transfer track (20) and the second transfer track (30) to slide when the deflection track (40) rotates; The synchronous driving structure (43) includes a first cam (431) and a second cam (432) fixedly connected to the main shaft (42), the first cam (431) and the second cam (432) are parallel to each other, the first cam (431) and the second cam (432) are arranged in a structure that is centrosymmetric about the main shaft (42). When the driving motor drives the main shaft (42) to rotate through a gear set, the main shaft (42) drives the first cam (431) and the second cam (432) to rotate synchronously. The first cam (431) and the second cam (432) each have a first abutting portion and a second abutting portion for abutting against the sliding seats, and the first abutting portion and the second abutting portion are both close to the two sliding seats, so that the first transfer track (20) and the second transfer track (30) can be driven to slide when the deflection track (40) rotates forward and backward; A vacuum adsorption cover (60) is arranged at the bottom of the carrier plate (41), the vacuum adsorption cover (60) is communicated with a vacuum air pipe (61), vacuum adsorption holes (411) are arranged on the carrier plate (41), and the vacuum air pipe (61) is communicated with the vacuum adsorption holes (411) through the vacuum adsorption cover (60) for adsorbing the lead frame (200); A vacuum airway (421) is provided on the main shaft (42), and the vacuum pipe (61) passes through the deflection track (40) and is communicated with the vacuum airway (421); two vacuum supply pipes (11) are arranged on the workbench (10), and one ends of the vacuum supply pipes (11) are abutted against the main shaft (42). The vacuum airway (421) has two vacuum inlets (422) for communicating the two vacuum supply pipes (11) when the main shaft (42) rotates forward and backward. After the main shaft drives the deflection track (40) to rotate by a certain deflection angle, one of the vacuum inlets (422) is communicated with one of the vacuum supply pipes (11) to realize the conduction of the vacuum air path.

2. The wire bonding area anti-interference production device according to claim 1, characterized in that: A guide rod (50) is arranged between the two sliding seats. The guide rod (50) is slidably arranged between the two sliding seats. A return spring (51) is sleeved on the guide rod (50), and both ends of the return spring (51) are fixedly connected to the two sliding seats respectively.

3. The wire bonding area anti-interference production device according to claim 1, wherein: A support seat (44) is arranged at the bottom of the carrier plate (41). A guide rail (45) is arranged in the deflection track (40). The support seat (44) is slidably matched with the guide rail (45).

4. The wire bonding area anti-interference production device according to claim 3, characterized in that: An extension plate (47) is arranged at the bottom of the carrier plate (41). A rack (48) is fixedly connected to the extension plate (47). A driving gear (49) is rotatably connected in the deflection track (40). The driving gear (49) is meshed with the rack (48). The driving gear (49) rotates to drive the carrier plate (41) to move.

5. The wire bonding area anti-interference production device according to claim 1, characterized in that: Both ends of the deflection track (40) are arc-shaped. The ends of the first transfer track (20) and the second transfer track (30) close to the deflection track (40) are also arc-shaped to facilitate the smooth deflection of the deflection track (40).

6. A production method for preventing interference in the wire bonding area, characterized in that, Using the wire bonding area anti-interference production device according to any one of claims 1-5, comprising the following steps: S1: Transfer the lead frame (200) to the deflection track (40), and fix the lead frame (200) through the vacuum adsorption holes (411) on the carrier plate (41); S2: Drive the main shaft (42) to rotate through the driving motor and the gear set, so that the deflection track (40) drives the lead frame (200) to deflect. At the same time: The main shaft (42) drives the first cam (431) and the second cam (432) to rotate synchronously. Drive the first transfer track (20) and the second transfer track (30) to slide outwards through the synchronous drive structure (43). When the main shaft (42) rotates to a predetermined deflection angle, the vacuum inlet (422) is communicated with the vacuum supply pipe (11) to form a vacuum air path. S3: Move the wafer to the substrate of the lead frame (200) so that the angle of the wafer relative to the substrate is deflected; S4: Move the carrier plate (41) to facilitate the placement of the wafer (100).

Images