Light-emitting chip packaging structure and packaging method

Abstract

The present application relates to the field of LED packaging technology, and in particular to a light-emitting chip packaging structure and packaging method. The light-emitting chip packaging structure includes a substrate, a light-emitting chip, a light-shielding cover, and a light-transmitting cover. The substrate is provided with a plurality of plug-in holes that are narrow at the top and wide at the bottom. The light-emitting chip is provided on the upper side of the substrate. The light-shielding cover is annular and made of a heat-conductive material. It is provided on the periphery of the light-emitting chip. The side of the light-shielding cover facing the substrate is provided with a plurality of plug-in balls that are compatible with the plug-in holes. The plug-in balls are elastic and located in the plug-in holes. The plurality of plug-in balls are spaced apart in the circumferential direction of the light-emitting chip. The light-shielding cover is provided with a plurality of air inlet holes. The air inlet holes extend from the inner side wall of the light-shielding cover facing the light-emitting chip to the interior of the plug-in balls. The light-shielding cover and the substrate are sealed. The light-transmitting cover has an annular connecting portion that is sealed to the top of the light-shielding cover. The present application has the effect of enhancing the connection stability between the light-transmitting cover and the substrate.

Description

Technical Field

[0001] The present application relates to the field of LED packaging technology, and in particular to a light-emitting chip packaging structure and packaging method. Background Art

[0002] LED packaging involves attaching a light-emitting chip to a substrate, then attaching a light-transmitting cover to the substrate, covering the chip and allowing it to emit light. The high heat generated by the light-emitting chip raises the temperature inside the light-transmitting cover, causing the gas inside to expand. Due to the weak connection between the light-transmitting cover and the substrate, the cover can easily fall off when subjected to external forces, affecting the performance of the LED device. Summary of the Invention

[0003] In order to enhance the connection stability between the light-transmitting cover and the substrate, the present application provides a light-emitting chip packaging structure and a packaging method.

[0004] The present application provides a light-emitting chip packaging structure and packaging method using the following technical solutions:

[0005] In a first aspect, the present application provides a light-emitting chip packaging structure, comprising:

[0006] A base plate, wherein the base plate is provided with a plurality of plug holes which are narrow at the top and wide at the bottom;

[0007] A light-emitting chip is arranged on the upper side of the substrate;

[0008] a light shield, annular in shape and made of a heat-conductive material, disposed around the periphery of the light-emitting chip; a plurality of plug-in balls adapted to the plug-in holes protruding from a side of the light shield facing the substrate; the plug-in balls are elastic and located within the plug-in holes; the plurality of plug-in balls are spaced apart in the circumferential direction of the light-emitting chip; the light shield is provided with a plurality of air inlet holes, the air inlet holes extending from the inner side wall of the light shield facing the light-emitting chip to the interior of the plug-in balls; and a sealing arrangement is formed between the light shield and the substrate; and

[0009] The light-transmitting cover has an annular connecting portion, and the connecting portion is sealed and connected to the top of the light-shielding cover.

[0010] By adopting the above technical solution, the light-emitting chip generates heat when it emits light, which increases the temperature in the sealed space, thereby causing the gas in the sealed space to expand. Since the plug-in ball is elastic, the expanded gas enters the plug-in ball from the air inlet hole, causing the plug-in ball to expand.

[0011] The expansion of the plug-in ball can, on the one hand, reduce the pressure in the sealed space and the thrust on the light-transmitting cover, thereby reducing the possibility of the light-transmitting cover and the light-shielding cover falling off and enhancing the connection stability between the light-transmitting cover and the substrate; on the other hand, it can enhance the strength of the plug-in ball in the plug-in hole. The greater the expansion of the plug-in ball, the stronger the connection stability between the light-shielding cover and the substrate.

[0012] The plug-in hole runs through the base plate and is narrow at the top and wide at the bottom. Firstly, it is convenient for processing to form the plug-in hole, secondly, it serves as a limit for the plug-in ball, and thirdly, it is convenient to observe whether each plug-in ball is inserted into the plug-in hole.

[0013] The high-temperature gas in the sealed space enters the air inlet hole and the plug-in ball, and can transfer the heat to the substrate through the light shield and the plug-in ball, and dissipate the heat through the substrate; since the plug-in ball is located in the plug-in hole, the plug-in ball can also directly exchange heat with the external environment, thereby improving the heat dissipation performance of the packaging structure.

[0014] Optionally, the connecting portion is provided with a positioning column protruding toward the light shield, the light shield is provided with a limiting hole adapted to the positioning column, the light shield is provided with a glue injection groove on the inner side wall of the limiting hole, and the notch of the glue injection groove faces the limiting hole.

[0015] By adopting the above technical solution, glue is injected into the limiting hole and the glue injection groove, and the positioning column is inserted into the limiting hole. After the glue is solidified, it can form a whole with the positioning column, so that the whole formed by the positioning column and the glue is snapped into the connecting part, which can enhance the connection stability between the light-transmitting cover and the light-shielding cover.

[0016] Optionally, there are multiple glue injection grooves, which are evenly distributed around the limiting hole.

[0017] By adopting the above technical solution, parts of the light-transmitting cover in all directions are snapped onto the light-shielding cover, thereby improving the connection stability between the light-transmitting cover and the light-shielding cover.

[0018] Optionally, the inner side wall of the light shield is arranged in a bowl shape that is narrow at the bottom and wide at the top.

[0019] By adopting the above technical solution, the light emitting range of the light emitting chip can be increased.

[0020] Optionally, a reflective layer is provided on the inner side wall of the light shield.

[0021] By adopting the above technical solution, the light irradiated on the light shield can be reflected by the reflective layer, thereby improving the utilization rate of the light emitted by the light-emitting chip.

[0022] Optionally, a plurality of the plug-in balls are evenly spaced in a circumferential direction of the light-emitting chip.

[0023] By adopting the above technical solution, parts of the light shield in all directions are clamped on the substrate, thereby improving the stability of the light shield being fixed on the substrate.

[0024] Optionally, one end of the plug-in ball facing away from the light-transmitting cover protrudes from the base plate and forms a guide portion in a tapered shape.

[0025] By adopting the above technical solution, on the one hand, the tapered guide portion is easier to insert into the plug hole. After the guide portion is located in the plug hole, force is applied to the light shield, making it easier to insert the plug into the plug hole; on the other hand, the tapered guide portion can increase the contact area between the plug ball and the external environment, thereby improving the heat dissipation efficiency of the light-emitting chip.

[0026] Optionally, the outer side wall of the guide portion is provided with a hard heat-conducting layer.

[0027] By adopting the above technical solution, after the tip of the hard thermal conductive layer is inserted into the plug hole, on the one hand, the hard thermal conductive layer can play a guiding role, so that the guide part moves into the plug hole; on the other hand, the setting of the hard thermal conductive layer can reduce the friction between the substrate and the guide part, making it easier to insert the guide part into the plug hole.

[0028] In a second aspect, the present application further provides a light-emitting chip packaging method, comprising the following steps:

[0029] Providing a substrate, forming a plurality of plug holes that are narrow at the top and wide at the bottom on the substrate;

[0030] Providing a light-emitting chip, and disposing the light-emitting chip on the upper side of the substrate so that the plurality of plug holes are located at the periphery of the light-emitting chip;

[0031] A ring-shaped light shield made of a heat-conducting material is provided, wherein a plurality of plug-in balls are protruded from one side of the light shield, and the plug-in balls are adapted to the plug-in holes and are elastic; a plurality of air inlet holes are provided on the light shield, and the air inlet holes extend from the inner side wall of the light shield to the interior of the plug-in balls; the light shield is arranged around the periphery of the light-emitting chip, so that the plurality of plug-in balls can be inserted into the plug-in holes;

[0032] Performing a sealing process between the light shield and the substrate; and

[0033] A light-transmitting cover with an annular connecting portion is provided, and the connecting portion is sealed and connected to the top of the light-shielding cover.

[0034] By adopting the above technical solution, the light-emitting chip generates heat when it emits light, which increases the temperature in the sealed space, thereby causing the gas in the sealed space to expand. The expansion of the plug-in ball can, on the one hand, reduce the pressure in the sealed space and reduce the thrust on the light-transmitting cover, thereby reducing the possibility of the light-transmitting cover and the light-shielding cover falling off, and enhancing the connection stability between the light-transmitting cover and the substrate; on the other hand, it can enhance the strength of the plug-in ball in the plug-in hole. The greater the expansion of the plug-in ball, the stronger the connection stability between the light-shielding cover and the substrate.

[0035] The plug-in hole runs through the base plate and is narrow at the top and wide at the bottom. Firstly, it is convenient for processing to form the plug-in hole, secondly, it serves as a limit for the plug-in ball, and thirdly, it is convenient to observe whether each plug-in ball is inserted into the plug-in hole.

[0036] The high-temperature gas in the sealed space enters the air inlet hole and the plug-in ball, and can transfer the heat to the substrate through the light shield and the plug-in ball, and dissipate the heat through the substrate; since the plug-in ball is located in the plug-in hole, the plug-in ball can also directly exchange heat with the external environment, thereby improving the heat dissipation performance of the packaging structure.

[0037] Optionally, the step of “inserting the plurality of plug-in balls into the plug-in holes” includes:

[0038] Each plug-in ball is used to block each plug-in hole, and a vacuum device is used to suck the plug-in ball into the plug-in hole.

[0039] By adopting the above technical solution, the plug-in ball is easier to be inserted into the plug-in hole, and the possibility of damaging the plug-in ball can be reduced by using negative pressure suction.

[0040] Optionally, after “sealing the space between the light shield and the substrate”, the method further includes:

[0041] The plug-in ball is pressed toward the substrate to discharge gas in the plug-in ball, so that the plug-in ball blocks the plug-in hole.

[0042] By adopting the above technical solution, before installing the light-transmitting cover, the gas in the plug-in ball is discharged. After the gas in the sealed space expands, the expanded gas fills the plug-in ball to make the plug-in ball bulge. On the one hand, compared with the case where the gas in the plug-in ball is not discharged, the pressure in the sealed space can be reduced, and the thrust on the light-transmitting cover can be reduced, thereby reducing the possibility of the light-transmitting cover and the light-shielding cover falling off, and enhancing the connection stability between the light-transmitting cover and the substrate; on the other hand, the plug-in ball is squeezed to fit with the inner wall of the plug-in hole, which can enhance the sealing performance of the plug-in hole.

[0043] In summary, this application includes at least one of the following beneficial technical effects:

[0044] 1. When the light-emitting chip emits light, it generates heat, which causes the gas in the sealed space to expand. The expanded gas enters the plug-in ball from the air inlet hole, causing the plug-in ball to expand. On the one hand, it can reduce the pressure in the sealed space, reduce the thrust on the light-transmitting cover, and enhance the connection stability between the light-transmitting cover and the substrate; on the other hand, it can enhance the strength of the plug-in ball to be restrained in the plug-in hole;

[0045] 2. The high-temperature gas in the sealed space enters the air inlet and the plug-in ball, and can transfer the heat to the substrate through the light shield and the plug-in ball, and dissipate heat through the substrate; because the plug-in ball is located in the plug-in hole, the plug-in ball can also directly exchange heat with the external environment, thereby improving the heat dissipation performance of the packaging structure;

[0046] 3. The end of the plug ball facing away from the light-transmitting cover has a guide portion, making it easier to insert the plug into the plug hole; the tapered guide portion can increase the contact area between the plug ball and the external environment, thereby improving the heat dissipation efficiency of the light-emitting chip;

[0047] 4. A hard heat-conducting layer is provided on the outer wall of the guide part. After the tip of the hard heat-conducting layer is inserted into the plug hole, on the one hand, the hard heat-conducting layer can play a guiding role, so that the guide part moves into the plug hole; on the other hand, the setting of the hard heat-conducting layer can reduce the friction between the guide part and the substrate, making it easier to insert the guide part into the plug hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 1 is a schematic structural diagram of the light-emitting chip packaging structure in Example 1 of the present application;

[0049] Figure 2 yes Figure 1 A partial enlarged schematic diagram of point A in the middle;

[0050] Figure 3 This is a schematic structural diagram of the light-emitting chip packaging structure in Example 2 of the present application;

[0051] Figure 4 yes Figure 3 A partial enlarged schematic diagram of point B in the middle.

[0052] Explanation of the accompanying reference numerals: 1. Substrate; 11. Plug-in hole; 2. Light-emitting chip; 3. Light shield; 31. Plug-in ball; 31a. Guide portion; 31b. Hard heat-conducting layer; 32. Air inlet; 33. Limiting hole; 34. Glue injection groove; 35. Sealant; 4. Transparent cover; 41. Connecting portion; 42. Positioning column; 5. Reflective layer; 6. Sealed space. DETAILED DESCRIPTION

[0053] The following will be combined with the Figure 1-4, clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this application.

[0054] In the description of this application, it should be understood that the terms "longitudinal", "transverse", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting this application. In the description of this application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0055] Reference numerals and / or reference letters may be repeated in different examples throughout this application. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed. The following describes a semiconductor package with a heat dissipation structure in accordance with this application in detail, with reference to specific embodiments.

[0056] Example 1

[0057] Example 1 of the present application discloses a light emitting chip packaging structure. Figure 1 The light emitting chip packaging structure includes a substrate 1, a light emitting chip 2, a light shield 3 and a light transparent cover 4.

[0058] Substrate 1 is provided with circuitry, which can be located on its surface or within it. Multiple insertion holes 11, narrow at the top and wide at the bottom, are provided throughout the substrate 1 to facilitate its processing and production. A light-emitting chip 2 is disposed on the upper side of the substrate 1 and electrically connected to the circuitry on the substrate 1, enabling light emission from the light-emitting chip 2.

[0059] The light shield 3 is annular and made of a thermally conductive material. It is positioned around the light-emitting chip 2, forming a seal between the light shield 3 and the substrate 1. Specifically, the bottom surface of the light shield 3 can be fixedly connected to the substrate 1 using a thermally conductive adhesive. Alternatively, a sealing layer can be formed on the substrate 1, wrapping around the bottom of the light shield 3 to achieve a sealed connection between the light shield 3 and the substrate 1. Heat generated by the light-emitting chip 2 can be transferred to the substrate 1 through the light shield 3. In an optional embodiment, the substrate 1 can be made of a material with good thermal conductivity, such as a metal substrate or a ceramic substrate, to facilitate rapid conduction of heat generated by the light-emitting chip 2 during operation, thereby extending its service life.

[0060] The inner wall of the light shield 3 may be a straight cylinder. In this embodiment, the inner wall of the light shield 3 is in a bowl shape that is narrow at the bottom and wide at the top, which can increase the light emission range of the light emitting chip 2 .

[0061] Furthermore, a reflective layer 5 is provided on the inner wall of the light shield 3. The inner wall of the light shield 3 can be polished or plated with a high-reflective material to form the reflective layer 5, so that the light irradiated on the light shield 3 can be reflected by the reflective layer 5, thereby improving the utilization rate of the light emitted by the light-emitting chip 2.

[0062] The side of the light shield 3 facing the substrate 1 is provided with a plurality of plug-in balls 31 adapted to the plug-in holes 11. The plug-in balls 31 are elastic and are located in the plug-in holes 11. The plug-in balls 31 are spherical in shape with a narrow top and a wide bottom. The plurality of plug-in balls 31 are spaced apart in the circumferential direction of the light-emitting chip 2.

[0063] The plug hole 11 passes through the substrate 1 and is narrow at the top and wide at the bottom. Firstly, it is convenient to process the substrate 1 to form the plug hole 11 ; secondly, it serves as a limit for the plug balls 31 ; and thirdly, it is convenient to observe whether each plug ball 31 is inserted into the plug hole 11 .

[0064] In an optional embodiment, the shading cover 3 and the plug ball 31 can be integrally injection molded to ensure the strength of the connection between the shading cover 3 and the plug ball 31. The shading cover 3 and the plug ball 31 are both elastic and can be made of thermally conductive silicone, thermally conductive insulating elastic rubber, etc.

[0065] The light shield 3 is provided with a plurality of air inlet holes 32, which extend from the inner side wall of the light shield 3 facing the light emitting chip 2 to the interior of the plug-in ball 31. It should be noted that the plug-in ball 31 is provided with air inlet holes 32 that communicate with the outside world. Since the plug-in ball 31 has a certain thickness and the air inlet holes 32 are relatively small, the plug-in ball 31 is not as elastic as a balloon, and the plug-in ball 31 will not be compressed by atmospheric pressure like a balloon. Therefore, the plug-in ball 31 is located in the plug-in hole 11, can adapt to the plug-in hole 11, block the plug-in hole 11, and achieve a seal between the light shield 3 and the substrate 1.

[0066] By inserting the plug balls 31 into the plug holes 11, the connection strength between the light shield 3 and the substrate 1 can be enhanced. In an optional embodiment, multiple plug balls 31 are evenly spaced around the circumference of the light emitting chip 2, so that parts of the light shield 3 in all directions are snapped onto the substrate 1, improving the stability of the light shield 3 fixed to the substrate 1.

[0067] The light-transmitting cover 4 has an annular connecting portion 41 , which is sealed to the top of the light-shielding cover 3 . In an optional embodiment, the connecting portion 41 and the top of the light-shielding cover 3 can be directly connected by a sealant.

[0068] In order to enhance the strength of the connection between the light-transmitting cover 4 and the light-shielding cover 3, in this embodiment, see Figure 2The connecting portion 41 is provided with a positioning column 42 protruding toward the light shield 3, and the light shield 3 is provided with a limiting hole 33 adapted to the positioning column 42. The inner side wall of the light shield 3 with the limiting hole 33 is provided with a glue injection groove 34, and the notch of the glue injection groove 34 faces the limiting hole 33.

[0069] With such arrangement, when glue is injected into the top of the light shield 3, the sealant 35 can cover the top of the light shield 3, and at the same time, the sealant 35 can flow into the limiting hole 33 and the glue injection groove 34, and the positioning column 42 is inserted into the limiting hole 33. After the sealant 35 is cured, it can form a whole with the positioning column 42, so that the whole formed by the positioning column 42 and the sealant 35 is snapped into the connecting part 41, which can enhance the connection stability between the light transparent cover 4 and the light shield 3.

[0070] In an optional embodiment, multiple glue injection grooves 34 are provided, evenly distributed around the circumference of the limiting hole 33, so that portions of the light-transmitting cover 4 in all directions are snapped onto the light-shielding cover 3, thereby improving the connection stability between the light-transmitting cover 4 and the light-shielding cover 3. Multiple glue injection grooves 34 can also be provided at intervals along the thickness direction of the light-shielding cover 3.

[0071] The implementation principle of the light-emitting chip packaging structure in Example 1 of the present application is:

[0072] The light shield 3 is sealed and connected to the substrate 1, the plug ball 31 blocks the plug hole 11, and the light transparent cover 4 is sealed and connected to the light shield 3 to form a sealed space 6. The light emitting chip 2 is located in the sealed space 6, which can reduce the possibility of external water and oxygen causing damage to the light emitting chip 2.

[0073] Generally, when the light-emitting chip 2 emits light, it generates heat, which increases the temperature in the sealed space 6, thereby causing the gas in the sealed space 6 to expand. If the light-transmitting cover 4 is directly installed on the substrate 1 through the sealant 35, the expanded gas in the sealed space 6 will exert an outward thrust on the light-transmitting cover 4, making it easy for the light-transmitting cover 4 to fall off.

[0074] In the present application, an air inlet 32 ​​communicating with the sealed space 6 is provided on the light shield 3. Since the plug-in ball 31 is elastic, the expanded gas enters the plug-in ball 31 from the air inlet 32 ​​to expand the plug-in ball 31.

[0075] The high-temperature gas in the sealed space 6 enters the air inlet 32 ​​and the plug-in ball 31, and can transfer heat to the substrate 1 through the light shield 3 and the plug-in ball 31, and dissipate heat through the substrate 1; since the plug-in ball 31 is located in the plug-in hole 11, the plug-in ball 31 can also directly exchange heat with the external environment, thereby improving the heat dissipation performance of the packaging structure.

[0076] The expansion of the plug-in ball 31 can, on the one hand, reduce the pressure in the sealed space 6 and the thrust on the light-transmitting cover 4, thereby reducing the possibility of the light-transmitting cover 4 and the light-shielding cover 3 falling off, and enhancing the connection stability between the light-transmitting cover 4 and the substrate 1; on the other hand, it makes the outer wall of the plug-in ball 31 fit more closely with the inner wall of the plug-in hole 11, which can enhance the strength of the plug-in ball 31 to be limited in the plug-in hole 11. The greater the expansion of the plug-in ball 31, the stronger the connection stability between the light-shielding cover 3 and the substrate 1, and at the same time enhances the sealing performance of the plug-in ball 31 blocking the plug-in hole 11, thereby ensuring the sealing performance of the light-emitting chip packaging structure.

[0077] Example 2

[0078] Reference Figure 3 and Figure 4 The difference between Example 2 and Example 1 is that the end of the plug ball 31 facing away from the light-transmitting cover 4 protrudes from the substrate 1 and forms a tapered guide portion 31a. The outer wall of the guide portion 31a is provided with a hard heat-conducting layer 31b. The hard heat-conducting layer 31b can be made of a metal layer and is bonded to the outer wall of the guide portion 31a. Of course, other embodiments do not require the hard heat-conducting layer 31b.

[0079] During the process of inserting the plug ball 31 into the plug hole 11, the guide portion 31a is placed opposite to the plug hole 11, and the tapered guide portion 31a is easier to insert into the plug hole 11. After the guide portion 31a is located in the plug hole 11, force is applied to the light shield 3, so that the plug-in object is easier to be inserted into the plug hole 11; on the other hand, the tapered guide portion 31a can increase the contact area between the plug ball 31 and the external environment, thereby improving the heat dissipation efficiency of the light-emitting chip 2.

[0080] Since the hard heat-conducting layer 31b is fixedly connected to the guide portion 31a, the guide portion 31a is elastic and the hard heat-conducting layer 31b is not elastic, when the expanding gas enters the plug-in ball 31, the other parts of the plug-in ball 31 except the guide portion 31a are deformed, so that the outer wall of the plug-in ball 31 fits more closely with the inner wall of the plug-in hole 11, thereby improving the sealing performance of the plug-in ball 31 in blocking the plug-in hole 11.

[0081] After the tip of the hard heat-conducting layer 31b is inserted into the plug hole 11, on the one hand, the hard heat-conducting layer 31b can play a guiding role, so that the guide part 31a moves into the plug hole 11; on the other hand, the setting of the hard heat-conducting layer 31b can reduce the friction between it and the substrate 1, making it easier for the guide part 31a to be inserted into the plug hole 11.

[0082] Example 3

[0083] Embodiment 3 of the present application discloses a light-emitting chip packaging method, comprising the following steps:

[0084] Step 1: Provide a substrate 1 and form a plurality of plug holes 11 on the substrate 1 that are narrow at the top and wide at the bottom.

[0085] The substrate 1 can be a metal substrate 1 or a ceramic substrate 1 or other materials with good thermal conductivity. A circuit is provided on the substrate 1. The cross-section of the inner wall of the plug hole 11 in the thickness direction of the substrate 1 can be a straight line or a concave arc. The plug hole 11 can be formed by laser drilling towards the lower side of the substrate 1, and the laser etching depth is controlled to form a plug hole 11 that is narrow at the top and wide at the bottom.

[0086] Step 2: Provide a light emitting chip 2 , and dispose the light emitting chip 2 on the upper side of the substrate 1 so that the plurality of plug holes 11 are located outside the light emitting chip 2 .

[0087] The light emitting chip 2 is electrically connected to the circuit on the substrate 1 , and the substrate 1 controls the light emission of the light emitting chip 2 .

[0088] Step 3: Provide a ring-shaped light shield 3 made of heat-conducting material, with multiple plug-in balls 31 protruding from one side of the light shield 3. The plug-in balls 31 are adapted to the plug-in holes 11 and are elastic; multiple air inlet holes 32 are set on the light shield 3, and the air inlet holes 32 extend from the inner wall of the light shield 3 to the inside of the plug-in balls 31.

[0089] The sunshade 3 and the plug-in ball 31 can be integrally injection-molded, and the air inlet 32 ​​can be formed simultaneously during the injection molding process of the sunshade 3 and the plug-in ball 31, or can be formed by punching holes in the sunshade 3 and the plug-in ball 31 after the sunshade 3 and the plug-in ball 31 are injection-molded.

[0090] The light shield 3 is disposed on the periphery of the light emitting chip 2 so that the plurality of plug balls 31 are inserted into the plug holes 11 .

[0091] In one embodiment, the plug ball 31 can be inserted into the insertion hole 11 by pressing the light shield 3. Because the plug ball 31 is elastic and the insertion hole 11 is narrow at the top and wide at the bottom, inserting the plug ball 31 into the insertion hole 11 can be somewhat difficult. Furthermore, repeated squeezing of the plug ball 31 may damage the plug ball 31. Therefore, in another alternative embodiment, a vacuum device can be used to suck the plug ball 31 into the insertion hole 11, making it easier to insert the plug ball 31 into the insertion hole 11. Using negative pressure suction can reduce the possibility of damage to the plug ball 31.

[0092] Step 4: performing sealing treatment between the light shield 3 and the substrate 1 .

[0093] The bottom surface of the light shield 3 and the substrate 1 can be directly sealed by the sealant 35 , or a circle of sealant 35 can be formed around the bottom of the light shield 3 to seal the bottom of the light shield 3 .

[0094] Step 5: Provide a light-transmitting cover 4 with an annular connecting portion 41 , and seal the connecting portion 41 to the top of the light-shielding cover 3 . The connecting portion 41 and the top of the light-shielding cover 3 may be sealed by a sealant 35 .

[0095] Example 4

[0096] The difference between Example 4 and Example 3 is that between Step 4 and Step 5, the process further includes: squeezing the plug ball 31 toward the substrate 1 to expel the gas inside the plug ball 31 so that the plug ball 31 blocks the plug hole 11. Of course, in other embodiments, the gas inside the plug ball 31 may not be squeezed out.

[0097] Before installing the light-transmitting cover 4, the gas in the plug-in ball 31 is discharged. After the gas in the sealed space 6 expands, the expanded gas fills the plug-in ball 31 to make the plug-in ball 31 bulge. On the one hand, compared with the case where the gas in the plug-in ball 31 is not discharged, the pressure in the sealed space 6 can be reduced, and the thrust on the light-transmitting cover 4 can be reduced, thereby reducing the possibility of the light-transmitting cover 4 and the light-shielding cover 3 falling off, and enhancing the connection stability between the light-transmitting cover 4 and the substrate 1; on the other hand, the plug-in ball 31 is squeezed to fit with the inner wall of the plug-in hole 11, which can enhance the sealing performance of the plug-in hole 11.

[0098] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A light-emitting chip packaging structure, characterized in that: include: A substrate (1) is provided with a plurality of plug-in holes (11) which are narrow at the top and wide at the bottom; a light-emitting chip (2) is provided on the upper side of the substrate (1); a light shield (3) is annular and made of a heat-conducting material and is provided on the periphery of the light-emitting chip (2); a plurality of plug-in balls (31) which are adapted to the plug-in holes (11) are provided on the side of the light shield (3) facing the substrate (1); an air inlet hole which is communicated with the outside is provided inside the plug-in ball (31); the light shield (3) and the plug-in ball (31) are integrally injection-molded; the plug-in ball (31) is elastic and is located in the plug-in hole (11); a plurality of the plug-in balls (31) are provided on the side of the light shield (3) facing the substrate (1); ) are arranged at intervals in the circumferential direction of the light-emitting chip (2), the light shield (3) is provided with a plurality of air inlet holes (32), the air inlet holes (32) extend from the inner side wall of the light shield (3) facing the light-emitting chip (2) to the inside of the plug-in ball (31), and the light shield (3) and the substrate (1) are sealed; and a light-transmitting cover (4), the light-transmitting cover (4) having an annular connecting portion (41), the connecting portion (41) being sealed and connected to the top of the light shield (3); The connecting portion (41) is provided with a positioning column (42) protruding toward the light shield (3); the light shield (3) is provided with a limiting hole (33) adapted to the positioning column (42); the light shield (3) is provided with a glue injection groove (34) on the inner side wall of the limiting hole (33); the notch of the glue injection groove (34) faces the limiting hole (33).

2. The light-emitting chip packaging structure according to claim 1, wherein: A plurality of the glue injection grooves (34) are provided and are evenly distributed in the circumferential direction of the limiting hole (33).

3. The light-emitting chip packaging structure according to claim 1, wherein: The inner side wall of the light shield (3) is in a bowl shape that is narrow at the bottom and wide at the top.

4. The light-emitting chip packaging structure according to claim 3, wherein: The inner side wall of the light shield (3) is provided with a light reflecting layer (5).

5. The light-emitting chip packaging structure according to claim 1, wherein: The plurality of plug-in balls (31) are evenly spaced in the circumferential direction of the light-emitting chip (2).

6. The light-emitting chip packaging structure according to claim 1, wherein: One end of the plug-in ball (31) facing away from the light-transmitting cover (4) protrudes from the base plate (1) and forms a guide portion (31a) in a tapered shape.

7. The light-emitting chip packaging structure according to claim 6, wherein: The outer side wall of the guide portion (31a) is provided with a hard heat-conducting layer (31b).

8. A light-emitting chip packaging method, characterized in that: The method for preparing a light-emitting chip packaging structure as claimed in any one of claims 1 to 7 comprises the following steps: providing a substrate (1), forming a plurality of plug holes (11) which are narrow at the top and wide at the bottom on the substrate (1); providing a light-emitting chip (2), arranging the light-emitting chip (2) on the upper side of the substrate (1), so that the plurality of plug holes (11) are located outside the light-emitting chip (2); providing a light-shielding cover (3) which is annular and made of a heat-conducting material, a plurality of plug balls (31) protruding from one side of the light-shielding cover (3), the plug balls (31) being adapted to the plug holes (11) and having elasticity; arranging a plurality of air inlet holes (32) on the light-shielding cover (3), the air inlet holes (32) extending from the inner side wall of the light-shielding cover (3) to the inside of the plug balls (31); arranging the light-shielding cover (3) outside the light-emitting chip (2), so that the plurality of plug balls (31) are inserted into the plug holes (11); A sealing process is performed between the light shield (3) and the substrate (1); and a light-transmitting cover (4) having an annular connecting portion (41) is provided, and the connecting portion (41) is sealed and connected to the top of the light shield (3).

9. The light emitting chip packaging method according to claim 8, characterized in that: The step of "inserting the plurality of plug-in balls (31) into the plug-in holes (11)" includes: making each of the plug-in balls (31) block each of the plug-in holes (11), and using a vacuum device to suck the plug-in balls (31) into the plug-in holes (11); and / or, after "sealing the space between the light shield (3) and the substrate (1)", further includes: squeezing the plug-in balls (31) toward the substrate (1) to discharge the gas in the plug-in balls (31) so that the plug-in balls (31) block the plug-in holes (11).

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