A wiring method and a wiring system for signal lines of a printed circuit board

Abstract

This invention discloses a routing method and system for signal lines on a printed circuit board. The signal lines include dynamic lines and static lines. The method includes: establishing an equivalent transmission line model of the signal lines based on their basic parameters, including characteristic impedance, signal frequency, and target crosstalk rate; performing crosstalk simulation on the equivalent transmission line model to obtain the actual crosstalk rate; and designing the spacing between the dynamic and static lines and the dielectric layer thickness between them based on the relationship between the actual and target crosstalk rates. This invention avoids the problems of excessive crosstalk rate and wasted board space caused by traditional routing methods, maximizing the utilization of printed circuit board routing space resources.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and in particular to a wiring method and wiring system for signal lines on a printed circuit board. Background Technology

[0002] As high-speed, large-scale digital integrated circuits rapidly develop towards higher speeds, lower power consumption, and higher density, the integration level of printed circuit boards (PCBs) is also increasing, and the density of components and related signal traces is also increasing. This makes it easier for signals to couple and cause crosstalk, interfering with the normal operation of the circuit. For hardware engineers designing PCBs, the risk of directly using experience values ​​for routing is also increasing. On the one hand, overly dense routing can cause crosstalk to exceed the threshold. On the other hand, when space allows, engineers usually increase the spacing between traces as much as possible to reduce crosstalk, which also increases the internal space of the board and causes unnecessary waste of internal space resources. Summary of the Invention

[0003] This invention provides a wiring method and system for signal lines on printed circuit boards to avoid problems such as excessive crosstalk and wasted board space caused by traditional wiring methods, thereby maximizing the utilization of wiring space resources on printed circuit boards.

[0004] In a first aspect, the present invention provides a method for routing signal lines on a printed circuit board, the signal lines including dynamic lines and static lines, comprising:

[0005] An equivalent transmission line model of the signal line is established based on the basic parameters of the signal line, including the characteristic impedance of the signal line, the signal frequency, and the target crosstalk rate.

[0006] Crosstalk simulation is performed on the equivalent transmission line model of the signal line to obtain the actual crosstalk rate;

[0007] The routing design is based on the relationship between the actual crosstalk rate and the target crosstalk rate, including the spacing between dynamic and static lines and the thickness of the dielectric layer between them.

[0008] Optionally, the routing design may be based on the relationship between the actual crosstalk rate and the target crosstalk rate, including adjusting the spacing between dynamic and static lines and the dielectric layer thickness between them.

[0009] The actual crosstalk rate is less than the target crosstalk rate. The routing design is based on the initial line spacing between dynamic and static lines and the initial dielectric layer thickness between dynamic and static lines.

[0010] Optionally, the routing design may be based on the relationship between the actual crosstalk rate and the target crosstalk rate, including adjusting the spacing between dynamic and static lines and the dielectric layer thickness between them.

[0011] The actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located on the same layer. Crosstalk simulation is performed on the equivalent transmission line model of the signal line with the line spacing between the dynamic line and the static line as the variable to obtain the minimum line spacing corresponding to the target crosstalk rate.

[0012] The minimum line spacing corresponding to the target crosstalk rate is used as the line spacing between dynamic and static lines, and the initial dielectric layer thickness between dynamic and static lines is used for routing design.

[0013] Optionally, the routing design may be based on the relationship between the actual crosstalk rate and the target crosstalk rate, including adjusting the spacing between dynamic and static lines and the dielectric layer thickness between them.

[0014] If the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on different layers, the routing design is carried out based on whether the spacing between the dynamic and static lines can be adjusted, as well as the thickness of the dielectric layer between the dynamic and static lines.

[0015] Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located on different layers. The line spacing between the dynamic line and the static line can be adjusted. Based on the preset database of line spacing, crosstalk simulation is performed on the equivalent transmission line model of the signal line to obtain the minimum line spacing corresponding to the target crosstalk rate, while keeping the thickness of the dielectric layer unchanged.

[0016] The minimum line spacing corresponding to the target crosstalk rate is used as the line spacing between dynamic and static lines, and the initial dielectric layer thickness between dynamic and static lines is used for routing design.

[0017] Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located in different layers. The spacing between the dynamic line and the static line cannot be adjusted. Crosstalk simulation is performed on the equivalent transmission line model of the signal line with the dielectric layer thickness between the dynamic line and the static line as a variable to obtain the minimum dielectric layer thickness corresponding to the target crosstalk rate.

[0018] The minimum dielectric layer thickness corresponding to the target crosstalk rate is used as the dielectric layer thickness between dynamic and static lines, and the initial line spacing between dynamic and static lines is used for routing design.

[0019] Optionally, crosstalk simulation of the equivalent transmission line model of the signal line can be used to obtain the actual crosstalk rate, including:

[0020] The signal line is a microstrip line. Crosstalk simulation is performed on the far end of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate.

[0021] Alternatively, if the signal line is a stripline, crosstalk simulation can be performed on the near end of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate.

[0022] Optionally, after designing the routing based on the relationship between the actual crosstalk rate and the target crosstalk rate, the following steps are also included:

[0023] Crosstalk simulation verification was performed on the equivalent transmission line model of the signal line based on the actual line spacing between the dynamic and static lines and the actual dielectric layer thickness between the dynamic and static lines.

[0024] Optionally, before establishing the equivalent transmission line model of the signal line based on its basic parameters, the following steps are also included:

[0025] The signal line is a microstrip line, and the characteristic impedance of the signal line is determined according to formula (1);

[0026]

[0027] Where Z0 is the characteristic impedance of the signal line, E r Where is the dielectric constant of the printed circuit board material, W is the signal line width, T is the copper thickness of the signal line, and H is the distance from the signal line to the reference plane.

[0028] The signal line is a stripline, and its characteristic impedance is determined according to formula (2).

[0029]

[0030] Where Z0 is the characteristic impedance of the signal line, E r Where is the dielectric constant of the printed circuit board material, W is the signal line width, T is the copper thickness of the signal line, and H is the distance from the signal line to the reference plane.

[0031] The target crosstalk rate of the signal line is determined according to formula (3);

[0032]

[0033] Where k0 is the target crosstalk rate threshold set by the user for the signal line, and V i The peak value of the dynamic line incident voltage, V c This represents the peak value of the crosstalk voltage of the static line.

[0034] Secondly, the present invention provides a wiring system for signal lines of a printed circuit board, including the wiring method for signal lines of a printed circuit board as described in any embodiment of the present invention.

[0035] This invention establishes an equivalent transmission model for the signal line based on its basic parameters. Crosstalk simulation is then performed on this model to obtain the actual crosstalk rate. Based on the relationship between the actual and target crosstalk rates, routing design is implemented for the spacing between dynamic and static lines, as well as the dielectric layer thickness between them. This avoids problems such as excessive crosstalk and wasted board space caused by traditional routing methods, maximizing the utilization of printed circuit board routing space resources.

[0036] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a structural diagram of a signal line on a printed circuit board provided in an embodiment of the present invention;

[0039] Figure 2 This is a flowchart of a signal line routing method for a printed circuit board provided in an embodiment of the present invention;

[0040] Figure 3 This is an equivalent transmission line model for signal lines on a printed circuit board provided in an embodiment of the present invention;

[0041] Figure 4 This is a flowchart of another signal line routing method for a printed circuit board provided in an embodiment of the present invention. Detailed Implementation

[0042] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0043] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0044] This invention provides a method for routing signal lines on a printed circuit board. Figure 1 This is a structural diagram of a signal line on a printed circuit board according to an embodiment of the present invention, for reference. Figure 1 The signal lines include dynamic line 01 and static line 02, where TX is the signal transmitting end and RX is the signal receiving end. Voltmeters V1 and V2 are installed at both ends of static line 02 to detect voltage changes. During signal transmission, dynamic line 01 affects static line 02, causing crosstalk between signals. Near-end crosstalk occurs at voltmeter V1 on static line 02, and far-end crosstalk occurs at voltmeter V2 on static line 02. Figure 2 This is a flowchart illustrating a signal line routing method for a printed circuit board according to an embodiment of the invention. (Refer to...) Figure 2 The wiring methods for signal lines on printed circuit boards include:

[0045] Step 110: Establish the equivalent transmission line model of the signal line based on the basic parameters of the signal line, including the characteristic impedance of the signal line, the signal frequency, and the target crosstalk rate.

[0046] The signal line can be a microstrip line or a stripline. The characteristic impedance of the signal line can be determined based on its material parameters such as linewidth, copper thickness, and layer stack-up. Furthermore, the target crosstalk rate can be determined by the peak incident voltage of the dynamic line (01) and the peak crosstalk voltage of the static line. Figure 3 This is an equivalent transmission line model for signal lines on a printed circuit board provided in an embodiment of the present invention, with reference to... Figure 3 The signal line can be divided into shorter segments L1 to Ln (infinitely small in the extreme case). These segments contain all the characteristics of the signal line, such as loss and inductance (L1 to Ln). L1 ~L Ln ) and capacitor (C L1 ~C Ln ) characteristics, and mutual capacitance (C) will occur between dynamic line 01 and static line 02.m1 ~C mn ) and mutual inductance (L m1 ~L mn ).

[0047] Step 120: Perform crosstalk simulation on the equivalent transmission line model of the signal line to obtain the actual crosstalk rate.

[0048] In particular, the higher the signal frequency in a signal line, the shorter the signal rise time, and the greater the crosstalk effect. Determining the minimum rise time of the current wiring signal can be used for subsequent modeling and simulation. Based on the existing basic parameters of the signal line, an equivalent transmission line model of the current signal line can be established using ANSYS simulation software, and the actual crosstalk rate of the signal line can be calculated.

[0049] Step 130: Based on the relationship between the actual crosstalk rate and the target crosstalk rate, design the wiring for the spacing between dynamic and static lines and the dielectric layer thickness between dynamic and static lines.

[0050] The wiring design of the printed circuit board can be determined by the relationship between the actual crosstalk rate and the target crosstalk rate. This can reduce the impact of crosstalk while avoiding wasting space on the board and maximizing the utilization of PCB wiring space resources.

[0051] This invention establishes an equivalent transmission model for the signal line based on its basic parameters. Crosstalk simulation is then performed on this model to obtain the actual crosstalk rate. Based on the relationship between the actual and target crosstalk rates, routing design is implemented for the spacing between dynamic and static lines, as well as the dielectric layer thickness between them. This avoids problems such as excessive crosstalk and wasted board space caused by traditional routing methods, maximizing the utilization of printed circuit board routing space resources.

[0052] Optionally, the routing design based on the relationship between the actual crosstalk rate and the target crosstalk rate includes: if the actual crosstalk rate is less than the target crosstalk rate, the routing design is carried out according to the initial line spacing and the initial dielectric layer thickness between the dynamic and static lines.

[0053] If the actual crosstalk rate is less than the target crosstalk rate, it means that the actual crosstalk rate formed by the initial line spacing and initial dielectric layer thickness between the dynamic and static lines has not reached the target crosstalk rate threshold. In this case, the routing design can be carried out according to the initial line spacing and initial dielectric layer thickness between the current dynamic and static lines.

[0054] Optionally, the routing design may be based on the relationship between the actual crosstalk rate and the target crosstalk rate, including adjusting the spacing between dynamic and static lines and the dielectric layer thickness between them.

[0055] If the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on the same layer, crosstalk simulation is performed on the equivalent transmission line model of the signal line with the line spacing between the dynamic and static lines as the variable to obtain the minimum line spacing corresponding to the target crosstalk rate. The minimum line spacing corresponding to the target crosstalk rate is used as the line spacing between the dynamic and static lines, and the initial dielectric layer thickness between the dynamic and static lines is used for routing design.

[0056] In this scenario, if the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on the same layer, then the initial dielectric layer thickness between the dynamic and static lines remains unchanged. The line spacing between the dynamic and static lines is used as a variable, and an appropriate step size and range are set. The step size can be set to one or several times the line width of the signal line. Crosstalk simulation is performed based on the set variable data set to obtain the minimum line spacing value corresponding to the target crosstalk rate. Then, the routing design is carried out according to the minimum line spacing value and the initial dielectric layer thickness. This ensures that the signal line crosstalk rate is controlled within the target range and avoids wasting board space by using excessively large line spacing.

[0057] Optionally, the routing design may be based on the relationship between the actual crosstalk rate and the target crosstalk rate, including adjusting the spacing between dynamic and static lines and the dielectric layer thickness between them.

[0058] If the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on different layers, the routing design is carried out based on whether the spacing between the dynamic and static lines can be adjusted, as well as the thickness of the dielectric layer between the dynamic and static lines.

[0059] If the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on different layers, the spacing between the dynamic and static lines can be adjusted by considering whether the available space on the printed circuit board supports this adjustment. If there is sufficient space on the board, the spacing between the dynamic and static lines can be adjusted for routing design; if there is insufficient space, the thickness of the dielectric layer between the dynamic and static lines needs to be adjusted for routing design.

[0060] Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on different layers. The spacing between the dynamic and static lines can be adjusted. Based on a preset database of line spacing, crosstalk simulation is performed on the equivalent transmission line model of the signal lines to obtain the minimum line spacing corresponding to the target crosstalk rate, while keeping the thickness of the dielectric layer constant. The minimum line spacing corresponding to the target crosstalk rate is used as the line spacing between the dynamic and static lines, and the initial dielectric layer thickness between the dynamic and static lines is used for routing design.

[0061] If the printed circuit board has sufficient internal space to support adjustment of the spacing between dynamic and static lines, then the spacing between dynamic and static lines can be set as variables, while the initial dielectric layer thickness remains constant. By setting appropriate step sizes and ranges, a preset data set of line spacing can be obtained for crosstalk simulation. The minimum line spacing value corresponding to the target crosstalk rate can then be obtained. Routing design is then performed according to the minimum line spacing value and the initial dielectric layer thickness. This ensures that the signal line crosstalk rate is controlled within the target range while avoiding the waste of internal space caused by using excessively large line spacing.

[0062] Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic and static lines are located on different layers. The spacing between the dynamic and static lines cannot be adjusted. Crosstalk simulation is performed on the equivalent transmission line model of the signal line using the dielectric layer thickness between the dynamic and static lines as a variable to obtain the minimum dielectric layer thickness corresponding to the target crosstalk rate. The minimum dielectric layer thickness corresponding to the target crosstalk rate is used as the dielectric layer thickness between the dynamic and static lines, and the initial spacing between the dynamic and static lines is used for routing design.

[0063] In cases where insufficient space within the printed circuit board (PCB) prevents adjustment of the spacing between dynamic and static lines, the dielectric layer thickness between the dynamic and static lines can be set as a variable while maintaining a constant line spacing. Crosstalk simulation is performed with appropriate step sizes and ranges to obtain the minimum dielectric layer thickness corresponding to the target crosstalk rate. Routing design is then performed based on the initial line spacing and the minimum dielectric layer thickness. This invention can quantitatively determine the design parameters of PCB signal lines based on the target crosstalk value, reducing crosstalk rate while avoiding wasted board space and maximizing the utilization of PCB routing space resources.

[0064] Optionally, crosstalk simulation of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate includes: if the signal line is a microstrip line, crosstalk simulation is performed on the far end of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate; or, if the signal line is a stripline, crosstalk simulation is performed on the near end of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate.

[0065] In this case, the signal line is a microstrip line. Since the upper and lower dielectric layers of the microstrip line are different, the relative capacitive coupling is less than the relative inductive coupling. Therefore, the far-end crosstalk coupling of the microstrip line is relatively large. So, simulation software is used to simulate the far-end crosstalk of the equivalent transmission line model to calculate the actual crosstalk rate of the microstrip line. The signal line is a stripline. Since the upper and lower dielectric layers of the stripline are the same, the far-end crosstalk is usually much smaller than the near-end crosstalk. So, simulation software is used to simulate the near-end crosstalk of the equivalent transmission line model to calculate the actual crosstalk rate of the stripline.

[0066] Optionally, after designing the routing based on the relationship between the actual crosstalk rate and the target crosstalk rate, the following steps are also included:

[0067] Crosstalk simulation verification was performed on the equivalent transmission line model of the signal line based on the actual line spacing between the dynamic and static lines and the actual dielectric layer thickness between the dynamic and static lines.

[0068] Among them, the crosstalk parameters of printed circuit board lines can be tested and evaluated through parameter settings and simulation analysis of the simulation platform, thereby providing theoretical support for the optimization of printed circuit board design, improving design efficiency, reducing the problems of long development cycle and low success rate caused by repeated optimization of printed circuit boards and prototype production, and limiting the design parameter optimization process to the software design level before prototype production.

[0069] Specifically, Figure 4 This is a flowchart illustrating another signal line routing method for a printed circuit board provided in an embodiment of the present invention. (Refer to...) Figure 4 ,include:

[0070] Step 210: Input characteristic impedance, signal frequency, target crosstalk rate.

[0071] Step 220: Establish the equivalent transmission line model of the signal line.

[0072] Step 230: Determine if it is a microstrip line. If yes, proceed to step 240; otherwise, proceed to step 250.

[0073] Step 240: Perform far-end crosstalk simulation on the equivalent transmission line model to obtain the actual crosstalk rate.

[0074] Step 250: Perform near-end crosstalk simulation on the equivalent transmission line model to obtain the actual crosstalk rate.

[0075] Step 260: Determine whether the actual crosstalk rate is less than the target crosstalk rate. If yes, proceed to step 330; otherwise, proceed to step 270.

[0076] Step 270: Determine whether the static line and the dynamic line are on the same layer. If yes, proceed to step 280; otherwise, proceed to step 290.

[0077] Step 280: Using the line spacing between dynamic and static lines as variables, perform crosstalk simulation on the equivalent transmission line model of the signal line to obtain the minimum line spacing corresponding to the target crosstalk rate. Then proceed to step 310.

[0078] Step 290: Determine if the spacing between the dynamic and static lines can be adjusted. If yes, proceed to step 300; otherwise, proceed to step 320.

[0079] Step 300: Based on the preset database of line spacing, perform crosstalk simulation on the equivalent transmission line model of the signal line to obtain the minimum line spacing corresponding to the target crosstalk rate.

[0080] Step 310: Use the minimum line spacing corresponding to the target crosstalk rate as the line spacing between the dynamic and static lines, while keeping the dielectric layer thickness unchanged. Then execute step 330.

[0081] Step 320: Perform crosstalk simulation on the equivalent transmission line model of the signal line with the dielectric layer thickness as a variable to obtain the minimum dielectric layer thickness corresponding to the target crosstalk rate.

[0082] Step 330: Design the wiring based on the actual spacing between dynamic and static lines and the actual dielectric layer thickness.

[0083] Step 340: Perform crosstalk simulation verification based on the actual line spacing between dynamic and static lines and the actual dielectric layer thickness.

[0084] For example, different operating conditions can be set to simulate and verify the present invention. Taking a printed circuit board of a project as an example, the same layer stripline is first selected as the verification object. The coupling length of the dynamic line and the static line is about 30mm, the copper thickness is 1oz, the line width is 0.2mm, the rise time of the excitation signal is set to 1ns, and the target crosstalk rate is 5%. An equivalent transmission line model is established using ANSYS software. Through the distribution design of the dynamic line and the static line and the simulation results, the optimized electrical parameters of the signal line are determined. The printed circuit board is designed according to the optimized parameters. The comparison of parameters before and after optimization is shown in Table 1.

[0085] Table 1

[0086] Before optimization After optimization Line spacing 0.2mm 0.22mm Crosstalk rate 6.21％ 4.9％

[0087] Table 1 compares the same-layer routing parameters before and after optimization. Since the same-layer stripline was selected as the verification object, the dielectric layer thickness remained unchanged. The crosstalk rate of the printed circuit board can be reduced by optimizing the line spacing between dynamic and static lines corresponding to the target crosstalk rate. Optimizing the line spacing from 0.2mm to 0.22mm can reduce the crosstalk rate from 6.21% to 4.9%.

[0088] Secondly, a set of striplines with different layers were selected for verification. The coupling length of the dynamic and static lines was approximately 250 mm, the line width was 0.2 mm, the rise time of the excitation signal was set to 1 ns, and the target crosstalk rate was 5%. An equivalent transmission line model was established using ANSYS software. Based on the distribution design and simulation results of the dynamic and static lines, the optimized electrical parameters of the signal lines were determined. The printed circuit board was designed according to the optimized parameters. The comparison of parameters before and after optimization is shown in Table 2.

[0089] Table 2

[0090] Before optimization After optimization Line spacing 0.55mm 0.55mm Dielectric layer thickness 269μm 400μm Crosstalk rate 5.44％ 4.52％

[0091] Table 2 compares the routing parameters of different layers before and after optimization. Table 2 shows that when the spacing between dynamic and static lines cannot be adjusted, the crosstalk rate of the printed circuit board can be reduced by adjusting the dielectric layer thickness between the dynamic and static lines corresponding to the target crosstalk rate. Optimizing the dielectric layer thickness from 269 μm to 400 μm reduces the crosstalk rate from 5.44% to 4.52%.

[0092] Simulation results show that the embodiments of the present invention can quantitatively design appropriate routing parameters according to the target crosstalk rate, which ensures that the signal line crosstalk is controlled within the target range, and avoids the waste of board space caused by using excessive line spacing, thereby maximizing the utilization of PCB routing space resources, improving PCB design efficiency, reducing the problems of long development cycle and low success rate caused by repeated PCB optimization and prototype manufacturing, and limiting the design parameter optimization process to the software design level before prototype manufacturing.

[0093] Optionally, before establishing the equivalent transmission line model of the signal line based on its basic parameters, the following steps are also included:

[0094] The signal line is a microstrip line, and the characteristic impedance of the signal line is determined according to formula (1);

[0095]

[0096] Among them, Z o E is the characteristic impedance of the signal line. r Where is the dielectric constant of the printed circuit board material, W is the signal line width, T is the copper thickness of the signal line, and H is the distance from the signal line to the reference plane.

[0097] The signal line is a stripline, and its characteristic impedance is determined according to formula (2).

[0098]

[0099] Among them, Z oE is the characteristic impedance of the signal line. r Where is the dielectric constant of the printed circuit board material, W is the signal line width, T is the copper thickness of the signal line, and H is the distance from the signal line to the reference plane.

[0100] The target crosstalk rate of the signal line is determined according to formula (3);

[0101]

[0102] Where, k o Set the target crosstalk rate threshold for the signal line for the user, where V i The peak value of the dynamic line incident voltage, V c This represents the peak value of the crosstalk voltage of the static line.

[0103] Specifically, the basic parameters of the signal line can be determined by the above formulas. If the signal line is a microstrip line, the characteristic impedance of the signal line can be determined by formula (1), the threshold of the target crosstalk rate can be determined by formula (3), and the equivalent transmission line model of the current microstrip line can be established using ANSYS simulation software. If the signal line is a stripline, the characteristic impedance of the signal line can be determined by formula (2), the threshold of the target crosstalk rate can be determined by formula (3), and the equivalent transmission line model of the current stripline can be established using ANSYS simulation software.

[0104] This invention also provides a wiring system for signal lines on a printed circuit board, including the wiring method for signal lines on a printed circuit board as described in any embodiment.

[0105] The present invention provides a wiring system for signal lines on a printed circuit board, which can quantitatively determine the design parameters of the signal lines on the printed circuit board according to the target crosstalk rate threshold. This can reduce the impact of crosstalk rate while avoiding wasting space on the board, thereby maximizing the utilization of wiring space resources on the printed circuit board.

[0106] This invention employs a software verification method to simulate and verify the crosstalk parameters of high-frequency circuit designs on printed circuit boards (PCBs). By establishing an equivalent transmission line model and setting a target crosstalk rate, simulation analysis is used to obtain the extreme points that satisfy the target crosstalk rate. This quantifies the minimum line spacing, dielectric layer thickness, and other design parameters, ensuring that design requirements are met while minimizing PCB space usage. This invention provides an advanced software simulation analysis method and verification strategy for improving PCB design efficiency and optimizing routing parameters, avoiding repeated optimization and prototyping based on experimental data, and reducing product development cycles and success rates. Using this invention, after the PCB design is completed, there is no need to fabricate prototypes or conduct experiments. Crosstalk parameters of the PCB circuits can be tested and evaluated through parameter settings and simulation analysis on a simulation platform. This provides theoretical support for PCB design optimization, improves design efficiency, and reduces the problems of long development cycles and low success rates caused by repeated PCB optimization and prototype fabrication. It confines the design parameter optimization process to the software design level before prototype fabrication.

[0107] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0108] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for routing signal lines on a printed circuit board, wherein the signal lines include dynamic lines and static lines, characterized in that, include: An equivalent transmission line model of the signal line is established based on the basic parameters of the signal line, wherein the basic parameters of the signal line include the characteristic impedance of the signal line, the signal frequency, and the target crosstalk rate. Crosstalk simulation is performed on the equivalent transmission line model of the signal line to obtain the actual crosstalk rate; Based on the relationship between the actual crosstalk rate and the target crosstalk rate, the wiring design is carried out on the line spacing between the dynamic lines and the static lines, as well as the dielectric layer thickness between the dynamic lines and the static lines. The routing design, based on the relationship between the actual crosstalk rate and the target crosstalk rate, includes the following: [Further details on routing design would be needed here]. The actual crosstalk rate is less than the target crosstalk rate. The routing design is carried out according to the initial line spacing between the dynamic line and the static line and the initial dielectric layer thickness between the dynamic line and the static line. The actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located on the same layer. Crosstalk simulation is performed on the equivalent transmission line model of the signal line with the line spacing between the dynamic line and the static line as the variable to obtain the minimum line spacing corresponding to the target crosstalk rate. The minimum line spacing corresponding to the target crosstalk rate is used as the line spacing between the dynamic line and the static line, and the routing design is carried out based on the initial dielectric layer thickness between the dynamic line and the static line. If the actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located on different layers, the routing design is carried out on the spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line, depending on whether the spacing between the dynamic line and the static line can be adjusted.

2. The wiring method for signal lines on a printed circuit board according to claim 1, characterized in that, The actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located in different layers. The line spacing between the dynamic line and the static line can be adjusted. Based on the preset database of line spacing, crosstalk simulation is performed on the equivalent transmission line model of the signal line to obtain the minimum line spacing corresponding to the target crosstalk rate, while keeping the thickness of the dielectric layer unchanged. The minimum line spacing corresponding to the target crosstalk rate is used as the line spacing between the dynamic line and the static line, and the routing design is carried out based on the initial dielectric layer thickness between the dynamic line and the static line.

3. The wiring method for signal lines on a printed circuit board according to claim 1, characterized in that, The actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are located in different layers. The line spacing between the dynamic line and the static line cannot be adjusted. Crosstalk simulation is performed on the equivalent transmission line model of the signal line with the dielectric layer thickness between the dynamic line and the static line as a variable to obtain the minimum dielectric layer thickness corresponding to the target crosstalk rate. The minimum dielectric layer thickness corresponding to the target crosstalk rate is used as the dielectric layer thickness between the dynamic line and the static line, and the routing design is carried out based on the initial line spacing between the dynamic line and the static line.

4. The wiring method for signal lines on a printed circuit board according to claim 1, characterized in that, Crosstalk simulation of the equivalent transmission line model of the signal line yields the actual crosstalk rate, including: The signal line is a microstrip line. Crosstalk simulation is performed on the far end of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate. Alternatively, if the signal line is a stripline, crosstalk simulation is performed on the near end of the equivalent transmission line model of the signal line to obtain the actual crosstalk rate.

5. The wiring method for signal lines on a printed circuit board according to claim 1, characterized in that, After designing the wiring based on the relationship between the actual crosstalk rate and the target crosstalk rate, including the spacing between the dynamic lines and the static lines, and the dielectric layer thickness between the dynamic lines and the static lines, the following steps are also included: Crosstalk simulation verification was performed on the equivalent transmission line model of the signal line based on the actual line spacing between the dynamic and static lines and the actual dielectric layer thickness between the dynamic and static lines.

6. The wiring method for signal lines on a printed circuit board according to claim 1, characterized in that, Before establishing the equivalent transmission line model of the signal line based on its basic parameters, the following steps are also required: The signal line is a microstrip line, and the characteristic impedance of the signal line is determined according to formula (1); （1） wherein Z o is the characteristic impedance of the signal line, E r is the dielectric constant of the printed circuit board material, W is the signal line width, T is the copper thickness of the signal line, and H is the distance of the signal line to the reference plane; The signal line is a stripline, and the characteristic impedance of the signal line is determined according to formula (2); （2） wherein Z o is the characteristic impedance of the signal line, E r is the dielectric constant of the printed circuit board material, W is the signal line width, T is the copper skin thickness of the signal line, and H is the distance of the signal line to the reference plane; The target crosstalk rate of the signal line is determined according to formula (3); （3） Where, k o Set the target crosstalk rate threshold for the signal line for the user, where V i The peak value of the dynamic line incident voltage, V c This represents the peak value of the crosstalk voltage of the static line.

7. A wiring system for signal lines on a printed circuit board, characterized in that, The wiring method for signal lines of a printed circuit board as described in any one of claims 1-6.

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