Display device and method of manufacturing the same

Abstract

The application relates to the technical field of display devices, and discloses a display device and a manufacturing method thereof. The display device comprises a display module, the display module comprises a non-pouring area and a pouring area arranged at least partially around the non-pouring area; an injection-molded edge sealing part is arranged on the non-light-emitting side of the display module and located in the region of the pouring area adjacent to the non-pouring area, the injection-molded edge sealing part comprises edge sealing glue, the edge sealing glue is arranged around the non-pouring area, and the edge sealing glue is configured to be in sealed cooperation with the injection-molded module. The display device can completely avoid the risk of generating mold marks.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display device and its manufacturing method. Background Technology

[0002] Currently, the assembly method of AMOLED watch modules with the whole device is mainly to bond the cover plate on the display module to the mid-frame. However, in order to avoid the connection of the mid-frame to the display panel's display function, this method of fixing the display module to the mid-frame requires a safety distance between the edge of the mid-frame and the display panel, which will affect the design of the narrow bezel of the whole device. Summary of the Invention

[0003] This application provides a display device and a method for manufacturing the same, which can completely avoid the risk of mold formation.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] A display device, comprising:

[0006] The display module includes a non-cast area and a cast area that at least partially surrounds the non-cast area;

[0007] The injection-molded edge sealing portion is disposed on the non-light-emitting side of the display module and located in the area adjacent to the non-casting area of ​​the casting area. The injection-molded edge sealing portion includes edge sealing adhesive, which is disposed around the non-casting area and configured to seal with the injection-molded module.

[0008] Optionally, the injection-molded edge sealing portion further includes a limiting member, which includes a first baffle and a second baffle. The first baffle is located on the side of the edge sealing adhesive adjacent to the non-casting area and is arranged around the non-casting area. The second baffle is located on the side of the edge sealing adhesive away from the non-casting area and is arranged around the edge sealing adhesive.

[0009] The height of the edge sealing adhesive along the first direction is less than the height of the first baffle and the second baffle along the first direction, where the first direction is the thickness direction of the display module.

[0010] Optionally, the display module includes a display panel, and the limiting member further includes a base plate. The base plate is located between the edge sealing adhesive and the non-light-emitting side of the display panel and is disposed around the non-casting area. The side of the base plate adjacent to the non-casting area is connected to the first baffle, and the side of the base plate away from the non-casting area is connected to the second baffle.

[0011] Optionally, the injection-molded edge sealing portion further includes an adhesive layer, which is located on the side of the injection-molded edge sealing portion facing the non-light-emitting side of the display panel, and the injection-molded edge sealing portion is connected to the display module through the adhesive layer.

[0012] Optionally, the edge sealing adhesive is at least one of epoxy resin adhesive, thermosetting adhesive, UV curing adhesive, and moisture curing adhesive.

[0013] Optionally, the edge sealing adhesive is a hot melt adhesive.

[0014] Optionally, the display module further includes a cover plate and a circuit board. The cover plate is disposed on the light-emitting side of the display panel. The display panel includes a main body and a bonding part. The main body is located between the cover plate and the circuit board. The bonding part is folded to the side of the main body away from the cover plate to connect with the circuit board.

[0015] The injection-molded edge sealing portion is located on the side of the binding portion opposite to the main body portion.

[0016] Optionally, the area where the edges of the injection-molded sealing portion and the binding portion overlap has an assembly gap with the display module;

[0017] The display device also includes sealant to fill the assembly gaps.

[0018] Optionally, the injection-molded sealing portion is disposed around the circuit board.

[0019] Optionally, the height of the sealing adhesive along the first direction is greater than or equal to the thickness of the circuit board.

[0020] Optionally, it also includes an encapsulation part, which is located on the non-light-emitting side of the display module and is injection molded into the casting area. The encapsulation part covers the portion of the sealing adhesive of the injection-molded edge portion that is away from the non-casting area.

[0021] Optionally, it also includes a middle frame having a receiving cavity for placing the display module, the display module being fixedly connected to the middle frame via the encapsulation portion.

[0022] This application also provides a method for manufacturing a display device, using an injection mold. The injection mold includes a side shell, a connecting shell, and a mold head. The side shell is sleeve-shaped and forms a receiving space. The mold head is located within the receiving space and is configured to cooperate with the sealing adhesive of the injection sealing portion. The connecting shell is located between the side shell and the mold head, and one end of the mold head is connected to one end of the side shell through the connecting shell.

[0023] The manufacturing method includes:

[0024] An injection-molded edge sealing portion is provided on the non-light-emitting side of the display module. The injection-molded edge sealing portion is located in the area of ​​the casting area adjacent to the non-casting area. The injection-molded edge sealing portion includes an edge sealing adhesive disposed around the non-casting area.

[0025] The assembly of the display module and the injection-molded encapsulation part is placed in the receiving space of the injection mold, wherein the inner wall of the side shell is in sealed contact with the edge of the display module, and the end of the mold head away from the connecting shell is inserted into the liquid sealing adhesive of the injection-molded edge sealing part, and the mold head is not in contact with the display module. The injection-molded edge sealing part, the mold head, the connecting shell, the side shell and the display module cooperate to form a sealed injection cavity.

[0026] Curing the liquid edge sealant;

[0027] Liquid injection molding material is injected into the sealed injection cavity;

[0028] The liquid injection molding material is solidified to form an encapsulation part;

[0029] Remove the injection mold.

[0030] Optionally, the step of providing an injection-molded sealing portion on the non-light-emitting side of the display module includes:

[0031] Liquid sealing adhesive is applied to the area of ​​the display module adjacent to the non-casting area in the casting area.

[0032] Optionally, the liquid edge-sealing adhesive is at least one of epoxy resin adhesive, thermosetting adhesive, UV-curable adhesive, and moisture-curable adhesive.

[0033] Optionally, when the sealing adhesive is a hot melt adhesive, after the injection-molded sealing portion is provided on the non-light-emitting side of the display module, it includes:

[0034] The edge-sealing adhesive in the injection-molded edge-sealing part is heated and melted to form a liquid edge-sealing adhesive.

[0035] This application provides a display device and its manufacturing method, which includes a display module and an injection-molded edge sealing portion. The display module includes a non-casting area and a casting area surrounding the non-casting area. The injection-molded edge sealing portion is disposed on the non-light-emitting side of the display module and is located in the area of ​​the casting area adjacent to the non-casting area. The injection-molded edge sealing portion includes an edge sealing adhesive disposed around the non-casting area, and the edge sealing adhesive is configured to seal with the injection mold. When it is necessary to injection mold a sealing edge in the gating area of ​​the display module, during the assembly of the injection mold, the mold head on the injection mold, which originally needs to be interference-fitted with the display device, can be inserted into the sealing glue of the injection sealing edge without contacting the display module. The injection mold, the gating area of ​​the display module, and the injection sealing edge form an injection cavity. The sealing effect of the injection sealing edge can completely isolate the gating area from the non-gating area. During the process of pouring the injection material into the injection cavity, it can prevent the injection material from entering the non-gating area. Furthermore, since the mold head of the injection mold does not come into contact with the display module during the injection process, the mold head of the injection mold does not exert extrusion force on the display module, and there is no risk of mold marks on the display device. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0038] Figure 3 This is a schematic diagram of the assembly of a display module and an injection mold provided in an embodiment of this application;

[0039] Figure 4 This is a state diagram of a display module provided in an embodiment of this application;

[0040] Figure 5 This is a schematic diagram of the planar structure of a display device provided in an embodiment of this application;

[0041] Figure 6 This is a schematic diagram of the assembly of a display device and an injection mold provided in an embodiment of this application;

[0042] Figure 7 This is a state diagram of the injection molding process of a display device provided in the embodiments of this application;

[0043] Figure 8 This is an exploded view of a display device provided in an embodiment of this application;

[0044] Figure 9 This is a cross-sectional view of a display device provided in an embodiment of this application;

[0045] Figure 10This is a schematic diagram of the structure of an injection-molded edge sealing part provided in an embodiment of this application;

[0046] Figure 11 This is a cross-sectional view of a display device provided in an embodiment of this application;

[0047] Figure 12 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0048] Figure 13 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0049] Figure 14 This is a schematic diagram of the planar structure of a display device provided in an embodiment of this application;

[0050] Figure 15 This is a cross-sectional view of a display device provided in an embodiment of this application;

[0051] Figure 16 This is a schematic diagram of the assembly of a display device and an injection mold provided in an embodiment of this application;

[0052] Figure 17 This is a flowchart illustrating a method for manufacturing a display device provided in an embodiment of this application;

[0053] Figure 18 for Figure 6 A magnified view of region E in the middle.

[0054] icon:

[0055] 1-Display module; 11-Cover plate; 12-Polarizing film; 13-Display panel; 131-Main body; 132-Binding part; 14-Composite film layer; 15-Circuit board; 16-Optical adhesive; 17-Spacer; A1-Non-casting area; A2-Casting area; 2-Injection molding edge sealing part; 21-Edge sealing adhesive; 221-First baffle; 222-Second baffle; 223-Base plate; 23-Adhesive layer; 3-Injection mold; 31-Mold head; 32-Side shell; 33-Connecting shell; 301-Lower mold frame; 302-Lower mold core; 303-Upper mold frame; 304-Upper mold core; 305-Inlet; 306-Outlet; 4-Injection material; 5-Sealant; 6-Encapsulation part; Q-Injection cavity; J-Assembly gap. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0057] In related technologies, such as Figure 1 The diagram shows the bonding of the cover plate 011 of the display module 01 to the middle frame 02. Figure 1 As shown, a safety distance needs to be reserved between the middle frame 02 and the display panel in the display module 01, which is not conducive to the narrow bezel design of the entire display device; in order to reduce the overall bezel, edge injection molding technology can be used, such as... Figure 2 As shown, the injection molding process is used to pour the injection molding material into the edge area of ​​the display module 03 to form the encapsulation part 04 of the whole assembly. The encapsulation part 04 formed in this way can enter the interior of the display module, and there is no need to reserve a safe distance between the pouring area and the display area. By bonding the middle frame 05 to this encapsulation part 04, the overall bezel of the device can be reduced.

[0058] Specifically, the process of forming the encapsulation part of the display module edge using injection molding technology can be as follows: First, clean the surface of the display module to maintain its cleanliness; second, place the display module into the injection mold, assemble the injection mold, and the display module and the injection mold fit together to form an injection cavity; third, perform injection molding, filling the injection cavity with injection material through the inlet on the injection mold, and when injection material overflows from the outlet on the injection mold, it indicates that the injection cavity is full of injection material; fourth, cure the injection material at high temperature; fifth, remove residual material from the inlet and outlet of the injection mold; sixth, demold, that is, remove the display module from the injection mold, completing the entire injection molding process. Specifically, the state of the injection mold and display module after the above steps two through four are assembled can be as follows: Figure 3 As shown, the inventors of this application have discovered that, during the injection molding process, in order to prevent the injection material from overflowing from the injection cavity 061, the mold head 062, which contacts the surface of the display module 03, needs to be interference-fitted with the display module 03, for example... Figure 3 During the high-temperature curing process, areas A and B in the display module 03 experience interference fit between the injection mold 06 and the display module 03. This interference forces the injection mold to exert pressure on the product, causing micro-deformation of the display module. Consequently, this results in uneven light scattering (C) on the surface of the display module. Figure 4 As shown, this will manifest as a brightness and darkness in the display of the module's screen, i.e., a printing problem.

[0059] To address the aforementioned problems, this application provides a display device, such as... Figure 5 As shown, it includes:

[0060] Display module 1, which includes a non-casting area A1 and a casting area A2 that at least partially surrounds the non-casting area A1;

[0061] The injection sealing part 2 is disposed on the non-light-emitting side of the display module 1 and is located in the area of ​​the casting area A2 adjacent to the non-casting area A1. The injection sealing part 2 includes sealing adhesive 21, which is disposed around the non-casting area A1 and is configured to seal with the injection mold.

[0062] The display device provided in this application embodiment includes a display module 1 and an injection-molded edge sealing portion 2. The display module 1 includes a non-casting area A1 and a casting area A2 that at least partially surrounds the non-casting area A1. The injection-molded edge sealing portion 2 is disposed on the non-light-emitting side of the display module 1 and is located in the area of ​​the casting area A2 adjacent to the non-casting area A1. The injection-molded edge sealing portion 2 includes an edge sealing adhesive 21 disposed around the non-casting area A1, and the edge sealing adhesive 21 is configured to seal with the injection mold. When it is necessary to injection mold the edge sealing portion in the casting area A2 of the display module 1, during the assembly of the injection mold, such as... Figure 6 As shown, the mold head 31 on the injection mold 3, which originally needed to be interference-fitted with the display device, can be inserted into the sealing glue 21 of the injection sealing part 2 without contacting the display module 1. The injection mold 3, the pouring area A2 of the display module 1, and the injection sealing part 2 form the injection cavity Q. The sealing effect of the injection sealing part 2 can completely isolate the pouring area A2 from the non-pouring area A1. During the process of pouring the injection molding material 4 into the injection cavity Q, such as Figure 7 As shown, it can prevent the injection material 4 from entering the non-casting area A1. Furthermore, since the mold head of the injection mold 3 does not come into contact with the display module 1 during the injection process, the mold head of the injection mold 3 does not exert extrusion force on the display module 1, and there is no risk of mold marks being generated on the display device.

[0063] The aforementioned display module 1 has a display area and a non-display area surrounding the display area. Since the injection molding material 4 is actually poured in the non-light-emitting side of the display module 1 in the casting area A2, it has no impact on the display function of the display module 1. Therefore, a part of the casting area A2 of the aforementioned display module 1 can overlap with the display area of ​​the display module 1, and there is no need to reserve a safe distance between the casting area A2 and the display area. Thus, the bezel of the display device can be greatly reduced.

[0064] In the embodiments of this application, such as Figure 6As shown, the above-mentioned injection molding edge sealing part 2 may only include edge sealing adhesive 21. That is, during the manufacturing process of the display device, liquid edge sealing adhesive 21 can be directly applied to the non-casting area A1 of the display module 1. During the assembly of the injection mold 3, the mold head 31 of the injection mold 3 is inserted into the liquid edge sealing adhesive 21, and no extrusion pressure is generated on the display module 1. After the edge sealing adhesive 21 is cured, it can achieve a seal between the display module 1 and the injection mold 3. During the sealing process, the injection mold 3 does not apply pressure to the display module 1, which can completely avoid the risk of mold marks and carry out the injection molding process.

[0065] In the above structure, the material of the edge sealing adhesive 21 can be at least one of epoxy resin, thermosetting adhesive, ultraviolet curing adhesive (UV adhesive), and moisture curing adhesive, or other suitable adhesive systems, which are not limited here. Specifically, the epoxy resin adhesive can be a single-component or two-component adhesive, and a curing agent can be added to the liquid epoxy resin adhesive to make it cure; the thermosetting adhesive is liquid at room temperature and can be cured by high-temperature curing, and the curing temperature can be selected according to the selected adhesive system, for example, an adhesive system with a curing temperature of about 70°C can be used; the ultraviolet curing adhesive is liquid at room temperature and can be cured by ultraviolet irradiation; and the moisture curing adhesive can be cured by leaving it at room temperature.

[0066] Optionally, such as Figure 8 , Figure 9 as well as Figure 10 As shown, the injection-molded edge sealing portion 2 may further include a limiting member, which may have a first baffle 221 and a second baffle 222. The first baffle 221 is located on the side of the edge sealing adhesive 21 adjacent to the non-casting area A1 and is arranged around the non-casting area A1. The second baffle 222 is located on the side of the edge sealing adhesive 21 away from the non-casting area A1 and is arranged around the edge sealing adhesive 21. The height of the edge sealing adhesive 21 along the first direction is less than the height of the first baffle 221 and the second baffle 222 along the first direction. The first direction is the thickness direction of the display module 1. The first baffle 221 and the second baffle 222 can prevent the edge sealing adhesive 21 from flowing to other areas when the edge sealing adhesive 21 is in a liquid state.

[0067] The materials of the first baffle 221 and the second baffle 222 can be plastic, such as PET plastic, or metal, etc. There are no restrictions here, and it depends on the actual situation.

[0068] Specifically, the display module includes a display panel, such as... Figure 10As shown, the aforementioned limiting member may further include a base plate 223, which is located between the edge sealing adhesive 21 and the non-light-emitting side of the display panel and surrounds the non-casting area A1. The side of the base plate 223 adjacent to the non-casting area A1 is connected to the first baffle 221, and the side of the base plate 223 away from the non-casting area A1 is connected to the second baffle 222. The base plate 223 can serve as a supporting component for the edge sealing adhesive 21, and the limiting member can cooperate to form a placement space for the edge sealing adhesive 21. The limiting member can be formed by stamping from metal material.

[0069] It should be noted that the aforementioned casting area A2 at least partially surrounds the non-casting area A1, and the injection molding sealing part 2 is located in the casting area A2. Therefore, the setting of the sealing glue 21, the first baffle 221, the second baffle 222, and the bottom plate 223 around the non-casting area A1 in the injection molding sealing part means that the casting area A2 is set around the non-casting area A1. The shape and structure of the first baffle 221, the second baffle 222, and the bottom plate 223 can be determined according to the shape of the casting area A1. For example, if the casting area A2 partially surrounds the non-casting area A1, then the structure in the injection molding sealing part 2 is also partially surrounding the non-casting area A1. If the casting area A2 fully surrounds the non-casting area A1, then the structure in the injection molding sealing part 2 is also set to fully surround the non-casting area A1.

[0070] Specifically, such as Figure 8 and Figure 9 As shown, the injection-molded edge sealing portion 2 may also include an adhesive layer 23. The adhesive layer 23 is located on the side of the injection-molded edge sealing portion 2 facing the non-light-emitting side of the display panel. The injection-molded edge sealing portion 2 can be connected to the display module 1 through the adhesive layer 23 to ensure the fixed bonding between the edge sealing portion and the display module 1.

[0071] When the limiting member does not have a base plate 223, the first baffle 221 and the second baffle 222 can be directly bonded to the adhesive layer, such as... Figure 9 As shown, the adhesive layer 23 functions to support the edge sealing adhesive 21, and the injection-molded edge sealing part 2 can be assembled onto the display module 1 through the adhesive layer 23; when the limiting member has a base plate 223, the base plate 223 is bonded to the adhesive layer 23, and the injection-molded edge sealing part 2 is assembled onto the display module 1 through the adhesive layer 23, as shown. Figure 10 As shown. Specifically, the adhesive layer 23 can be pressure-sensitive adhesive (PSA) or other materials, which are not limited here.

[0072] Specifically, when the injection-molded edge sealing part 2 has a limiting member, the material of the aforementioned edge sealing adhesive 21 can also be at least one of epoxy resin adhesive, thermosetting adhesive, ultraviolet curing adhesive (UV adhesive) and moisture curing adhesive. In the process of manufacturing the display device, the limiting member can be bonded to the adhesive layer 23 first, and then bonded to the display module 1, and then the edge sealing adhesive 21 can be applied in the space enclosed by the limiting member.

[0073] In addition, when the injection-molded edge sealing part 2 has a limiting component, the aforementioned edge sealing adhesive 21 can also be a hot melt adhesive. It is solid at room temperature and becomes a flowable liquid when heated to a certain temperature. Different types of hot melt adhesives have different melting points, which are roughly distributed between 65°C and 135°C. Furthermore, hot melt adhesives have very fast softening and curing speeds, melting or curing within a few seconds. This makes its application in the injection molding process of display devices have a relatively small impact on production time. In practical applications, hot melt adhesives with curing temperatures generally in the range of 60°C to 65°C can be used. During the manufacturing process of the display device, the edge sealing adhesive 21, the limiting component, and the adhesive layer 23 can be assembled together first, and then directly bonded to the display module 1. Before assembling the display device with the injection mold 3, the hot melt adhesive needs to be melted first, so that the mold head 31 of the injection mold 3 can be inserted into the edge sealing adhesive 21 without generating extrusion pressure on the display module 1. This achieves both a seal between the display device and the injection mold 3 and completely avoids the influence of mold marks.

[0074] In the embodiments of this application, such as Figure 11 As shown, the above-mentioned display module 1 may include a cover plate 11, a display panel 13, and a circuit board 15. The cover plate 11 covers the light-emitting side of the display panel 13. The display panel 13 may include a main body 131 and a bonding part 132. The main body 131 is located between the cover plate 11 and the circuit board 15. The bonding part 132 is folded to the side of the main body 131 away from the cover plate 11 to connect with the circuit board 15. The injection molding sealing part 2 may be located on the side of the bonding part 132 away from the main body 131, so that the display module does not generate mold marks during the injection molding process.

[0075] For example, the aforementioned display module 1 may specifically include a cover plate (CG) 11, a polarizer (POL) 12, a display panel (PNL) 13, a composite film layer (SCF) 14, and a circuit board 15. The polarizer 12 is located on the light-emitting side of the main body 131 of the display panel, and the composite film layer 14 is located on the non-light-emitting side of the main body 131 of the display panel. The cover plate 11 covers the side of the polarizer 12 away from the main body 131 of the display panel. The cover plate 11 and the polarizer 12 can be bonded together by optical adhesive 16. The circuit board 15 is located on the side of the composite film layer 14 away from the main body 131 of the display panel. The bonding part 132 of the display panel is folded onto the side of the composite film layer 14 away from the main body 131 of the display panel and connected to the circuit board 15. A spacer 17 may also be provided between the bonding part 132 and the composite film layer 14. The injection-molded edge sealing part 2 is located on the side of the bonding part 132 away from the main body 131.

[0076] The composite film layer 14 may include an adhesive layer, a foam layer, a polyimide layer and a metal layer sequentially disposed on the non-light-emitting side of the display panel body; the circuit board may be a flexible circuit board (FPC).

[0077] Specifically, such as Figure 9 and Figure 11 As shown, the edge of the circuit board 15 can be recessed relative to the edge of the composite film layer 14, the injection-molded edge sealing portion 2 can be provided around the circuit board 15, and the injection-molded edge sealing portion 2 can be fixedly bonded to the side of the composite film layer 14 opposite to the display panel body portion 131; as Figure 11 As shown, when the injection molding edge sealing portion 2 only includes edge sealing adhesive 21, during the application of edge sealing adhesive 21, the inner side of the edge sealing adhesive 21 can contact the edge of the circuit board 14, using the edge of the circuit board to prevent the flow of the edge sealing adhesive 21; while when the injection molding edge sealing portion 2 includes a limiting member, such as Figure 8 As shown, due to the limiting effect of the limiting component on the flow of the sealing adhesive 21, the position of the injection-molded sealing part 2 is not limited by the edge position of the circuit board, and the injection-molded sealing part 2 does not need to contact the edge of the recessed circuit board.

[0078] Optionally, when the injection-molded edge sealing portion 2 has a limiting member, the circuit board 15 may not need to be recessed. In this case, the injection-molded edge sealing portion 2 can be fixedly bonded to the side of the circuit board 15 away from the composite film layer 14, and the sealing requirement can still be achieved. The position of the injection-molded edge sealing portion 2 is not limited here and can be determined according to the actual situation.

[0079] Specifically, the height of the sealing adhesive 21 in the injection-molded edge sealing portion 2 along the first direction can be greater than or equal to the thickness of the circuit board. For example, when the injection-molded edge sealing portion 2 only includes the sealing adhesive 21, since the edge of the circuit board is needed to prevent the flow of the sealing adhesive 21 during the application process, the height of the sealing adhesive 21 along the first direction can be equal to the thickness of the circuit board. However, when the injection-molded edge sealing portion 2 includes a limiting member, since the limiting member restricts the flow of the sealing adhesive 21, the height of the sealing adhesive 21 along the first direction can be set according to the height of the limiting member along the first direction. It can be set to be greater than or equal to the thickness of the circuit board, which can ensure the sealing effectiveness of the injection-molded edge sealing portion 2. Alternatively, the height of the sealing adhesive 21 along the first direction can be less than the thickness of the circuit board, depending on the actual situation.

[0080] In this embodiment, the area where the edges of the injection-molded sealing portion 2 and the binding portion 132 overlap has an assembly gap J with the display module 1, such as... Figure 12 As shown, the left and right sides of the injection-molded sealing edge 2 of the binding part 132 on the display module 1 have a height difference, resulting in an assembly gap J between the injection-molded sealing edge 2 and the surface of the display module. Therefore, the display device may further include a sealant 5 filled in the assembly gap J, such as... Figure 13 As shown, this can prevent the leakage of injection molding material 4 during the injection molding process.

[0081] Specifically, the sealant 5 mentioned above can be formed by a dispensing process. It can be dispensed automatically by equipment or manually. The sealant can be a UV-curable adhesive (UV adhesive) or a Tuffy adhesive, etc. There are no restrictions here, and it depends on the actual situation.

[0082] In this embodiment of the application, a packaging part 6 is also included, such as Figure 14 and Figure 15 As shown, the encapsulation part 6 is located on the non-light-emitting side of the display module and is injection molded into the casting area. The encapsulation part covers the portion of the sealing adhesive of the injection-molded edge portion that is away from the non-casting area. Specifically, the encapsulation part 6 can be formed on the edge of the non-light-emitting side of the display module by cooperating with the injection mold and the injection-molded edge portion. After the display device is manufactured, the encapsulation part 6 will cover the portion of the sealing adhesive that is away from the non-casting area. For example, when the injection-molded edge portion is only sealing adhesive, the encapsulation part 6 only covers a portion of the sealing adhesive. However, when the injection-molded edge portion has a limiting member, the encapsulation part 6 will cover the portion of the sealing adhesive that is away from the non-casting area and the second baffle. By sealing the injection-molded edge portion 2 on the display device with the injection mold 3, the encapsulation part 6 is formed by injection molding into the casting area A2 of the display module 1. This can prevent the injection molding material 4 forming the encapsulation part 6 from overflowing into the non-casting area A1 and can also avoid the generation of mold marks on the display device, thereby improving product quality.

[0083] In this embodiment, a middle frame is also included, which has a cavity for placing the display module. The display module 1 is fixedly connected to the middle frame through the encapsulation part 6, which enables the design of a narrow bezel.

[0084] The aforementioned display devices can be AMOLED wearable products, tablets, mobile phones, etc., and there are no restrictions within the town.

[0085] This application also provides a method for manufacturing a display device, using an injection mold 3, wherein, as Figure 16 As shown, the injection mold 3 may include a side shell 32, a connecting shell 33, and a mold head 31. The side shell 32 is sleeve-shaped and forms an accommodating space. The mold head 31 is located within the accommodating space and is configured to cooperate with the sealing adhesive of the injection sealing part. The connecting shell 33 is located between the side shell 32 and the mold head 31. One end of the mold head 31 is connected to one end of the side shell 32 through the connecting shell 33.

[0086] Specifically, such as Figure 6 As shown, the injection mold 3 can be formed by combining an upper mold and a lower mold. The lower mold can include a lower mold base 301 and a lower mold core 302. The upper mold can include an upper mold base 303 and an upper mold core 304. The aforementioned side shell 32, connecting shell 33 and mold head 31 can be formed on the upper mold core 304. The upper mold can form a glue inlet 305 and a glue outlet 306.

[0087] The manufacturing method of the above-mentioned display device, such as Figure 17 As shown, the specific steps may include:

[0088] S1701: An injection molding sealing part 2 is provided on the non-light-emitting side of the display module 1. The injection molding sealing part is located in the area of ​​the casting area adjacent to the non-casting area. The injection molding sealing part 2 includes sealing adhesive 21 provided around the non-casting area A1. Specifically, before providing the injection molding sealing part 2, the surface of the display module 1 can be cleaned to ensure the cleanliness of the surface of the display module 1.

[0089] S1702: The assembly of the display module 1 and the injection molding package 2 is placed within the receiving space of the injection mold 3, such as... Figure 6 or Figure 16 As shown, the inner wall of the side shell 32 is in sealed contact with the edge of the display module 1. The end of the mold head 31 away from the connecting shell 33 is inserted into the liquid sealing adhesive 21 of the injection sealing part 2, and the mold head 31 does not contact the display module 1. The injection sealing part 2, the mold head 31, the connecting shell 33, the side shell 32 and the display module 1 cooperate to form a sealed injection cavity Q. The edge of the display module 1 can be the edge of the cover plate. That is, when the display device is assembled with the injection mold 3, the inner wall of the side shell 32 is in sealed contact with the edge of the cover plate of the display module 1.

[0090] S1703: Cures the liquid sealing adhesive 21 to ensure the sealing effect of the injection cavity Q;

[0091] S1704: Injecting liquid injection material 4 into the sealed injection cavity Q, such as... Figure 7 As shown, the injection molding material 4 can be poured into the injection mold 3 through the injection port 305 on the injection mold 3. When the injection molding material 4 is seen overflowing at the outlet 306, it can be seen that the injection cavity Q is full of injection molding material 4. The injection molding material can be a resin material.

[0092] S1705: Solidify the liquid injection molding material 4 to form the encapsulation part 6;

[0093] S1706: Remove the injection mold 3 to complete the entire injection molding process. Before removing the injection mold 3, the residual injection material 4 at the inlet 305 and outlet 306 needs to be removed.

[0094] In the above-mentioned method for manufacturing the injection molding encapsulation structure, when the injection mold 3 is assembled, the mold head 31 on the injection mold 3, which originally needs to be interference-fitted with the display device, can be inserted into the sealing glue 21 of the injection sealing edge part 2 without contacting the display module 1. The injection mold 3, the pouring area A2 of the display module 1, and the injection sealing edge part 2 form a sealed injection cavity Q. The sealing effect of the injection sealing edge part 2 can completely isolate the pouring area A2 from the non-pouring area A1. During the process of pouring the injection molding material 4 into the injection cavity Q, the injection molding material 4 can be prevented from entering the non-pouring area A1. Furthermore, since the mold head of the injection mold 3 does not come into contact with the display module 1 during the injection process, the mold head of the injection mold 3 does not exert extrusion force on the display module 1, and there is no risk of mold marks being generated on the display module.

[0095] In this embodiment of the application, the step S1701 above, which involves setting the injection-molded edge sealing portion 2 on the non-light-emitting side of the display module 1, includes: applying liquid sealing adhesive 21 to the area of ​​the casting area A2 of the display module 1 adjacent to the non-casting area A1. That is, the injection-molded edge sealing portion 2 can be set directly by applying liquid sealing adhesive 21 to the display module 1.

[0096] The injection-molded edge sealing portion 2 may or may not have a limiting component. The liquid edge sealing adhesive 21 can be at least one of epoxy resin, thermosetting adhesive, UV-curable adhesive, and moisture-curable adhesive. Specifically, the epoxy resin can be a single-component or two-component adhesive, and a curing agent can be added to the liquid epoxy resin to cure it. Thermosetting adhesive is liquid at room temperature and can be cured by high-temperature curing. The curing temperature can be selected according to the selected adhesive system. For example, an adhesive system with a curing temperature of about 70°C can be used. UV-curable adhesive is liquid at room temperature and can be cured by UV irradiation. Moisture-curable adhesive can be cured by leaving it at room temperature.

[0097] Specifically, when the injection-molded edge sealing portion 2 on the display device only includes edge sealing adhesive, the area of ​​the injection-molded edge sealing portion 2 that does not contact the bonding portion 132 of the display panel, such as... Figure 18As shown, the application width 'a' of the sealing adhesive 21 can be determined based on the distance the circuit board is recessed from the outer edge of the main body of the display panel, a = LD; where L is the distance between the outer edge of the circuit board and the outer edge of the main body of the display panel, and the design range can be 2.0mm to 3.5mm, for example, 2.3mm in actual application; where D is the distance between the edge of the top cover of the display device and the outer edge of the main body of the display panel, and D = 0.9mm in actual application; the application height H of the sealing adhesive 21 can be determined based on the design thickness of the circuit board and should be consistent with the design thickness of the circuit board. The flow of the sealing adhesive 21 is restricted by the edge of the circuit board. The thickness range of the circuit backplate can be 0.12mm to 0.285mm, and the application height of H can be 0.15mm in actual application. When designing the injection mold 3, the distance between the mold head 31 and the surface of the product display module 1 can be h = Hd. The mold head 31 is designed according to the glue application height. The mold head 31 is pressed with the edge sealing glue 21. In actual application, the pressing distance between the mold and the edge sealing glue 21 is d = 0.03mm, that is, the depth of the mold pressing into the edge sealing glue 21 can be 0.03mm. The width of the mold head 31 can be b = 0.5mm in actual application. The glue width on both sides of the mold head 31 is the same, which can be c = (LDb) / 2, and the actual application value can be 0.45mm. Specifically, the specific parameter values ​​of a, L, D, H, h, d, b, and c can be determined according to the actual situation and are not limited here.

[0098] The area where the injection-molded edge sealing part 2 contacts the bonding part 132 of the display panel, Figure 6 As shown in region F, due to the thickness difference between the areas of the display device with and without the bonding parts, the application height of the edge sealing adhesive 21 can be H1 = HT. B -T P The adhesive application width and the pressing distance between the mold head 31 and the sealing adhesive 21 are consistent with the area of ​​the injection-molded sealing part 2 that does not contact the bonding part of the display panel. Among them, T B The thickness of the spacer is 0.064 mm in practical applications; T P The thickness of the bonding part 132 can be 0.024 mm in practical applications; as mentioned above, the adhesive application height H can be 0.15 mm and the adhesive application height H1 can be 0.064 mm in practical applications.

[0099] Specifically, in order to reduce the application width of the edge sealing adhesive 21, the aforementioned mold head 31 can be designed as a thin sheet, such as... Figure 16 As shown, this helps to reduce the application width of the edge sealing adhesive 21, which can save more space for the assembly of the whole machine.

[0100] In this embodiment of the application, when the edge sealing adhesive 21 is a hot melt adhesive, the injection molding edge sealing part 2 needs to have a limiting member. After the above-mentioned S1701 step is to set the injection molding edge sealing part 2 on the non-light-emitting side of the display module 1, the step further includes the following step: heating and melting the edge sealing adhesive 21 in the injection molding edge sealing part 2 to form a liquid edge sealing adhesive 21.

[0101] Hot melt adhesives are solid at room temperature but become flowable liquids when heated to a certain temperature. Different types of hot melt adhesives have different melting points, generally ranging from 65°C to 135°C. Hot melt adhesives soften and cure very quickly, melting or solidifying within seconds. This minimizes the impact on production time when used in injection molding processes for display devices. In practical applications, hot melt adhesives with curing temperatures typically between 60°C and 65°C can be used.

[0102] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. A display device, wherein, include: The display module includes a non-cast area and a cast area that at least partially surrounds the non-cast area; The injection-molded edge sealing portion is disposed on the non-light-emitting side of the display module and located in the area adjacent to the non-casting area of ​​the casting area. The injection-molded edge sealing portion includes edge sealing adhesive, which is disposed around the non-casting area and configured to seal with the injection mold. In this process, the mold head of the injection mold is inserted into the liquid sealing adhesive of the injection sealing part, and the mold head does not contact the display module. The injection mold, the pouring area of ​​the display module, and the injection sealing part form a sealed injection cavity, thereby achieving a sealed fit between the sealing adhesive and the injection mold.

2. The display device according to claim 1, wherein, The injection-molded edge sealing portion also includes a limiting member, which includes a first baffle and a second baffle. The first baffle is located on the side of the edge sealing adhesive adjacent to the non-casting area and is arranged around the non-casting area. The second baffle is located on the side of the edge sealing adhesive away from the non-casting area and is arranged around the edge sealing adhesive. The height of the edge sealing adhesive along the first direction is less than the height of the first baffle and the second baffle along the first direction, where the first direction is the thickness direction of the display module.

3. The display device according to claim 2, wherein, The display module includes a display panel, and the limiting member also includes a base plate. The base plate is located between the edge sealing adhesive and the non-light-emitting side of the display panel and is arranged around the non-casting area. The side of the base plate adjacent to the non-casting area is connected to the first baffle, and the side of the base plate away from the non-casting area is connected to the second baffle.

4. The display device according to claim 3, wherein, The injection-molded edge sealing portion also includes an adhesive layer, which is located on the side of the injection-molded edge sealing portion facing the non-light-emitting side of the display panel. The injection-molded edge sealing portion is connected to the display module through the adhesive layer.

5. The display device according to claim 1, wherein, The edge sealing adhesive is at least one of epoxy resin adhesive, thermosetting adhesive, UV curing adhesive, and moisture curing adhesive.

6. The display device according to claim 2, wherein, The edge sealing adhesive is a hot melt adhesive.

7. The display device according to claim 1, wherein, The display module also includes a cover plate and a circuit board. The cover plate is disposed on the light-emitting side of the display panel. The display panel includes a main body and a bonding part. The main body is located between the cover plate and the circuit board. The bonding part is folded to the side of the main body away from the cover plate to connect with the circuit board. The injection-molded edge sealing portion is located on the side of the binding portion opposite to the main body portion.

8. The display device according to claim 7, wherein, There is an assembly gap between the area where the edges of the injection-molded sealing portion and the binding portion overlap and the display module; The display device also includes sealant to fill the assembly gaps.

9. The display device according to claim 7, wherein, The injection-molded edge sealing portion is arranged around the circuit board.

10. The display device according to claim 9, wherein, The height of the sealing adhesive along the first direction is greater than or equal to the thickness of the circuit board.

11. The display device according to any one of claims 1-10, wherein, It also includes an encapsulation part, which is located on the non-light-emitting side of the display module and is injection molded into the casting area. The encapsulation part covers the portion of the sealing adhesive of the injection-molded sealing part that is away from the non-casting area.

12. The display device according to claim 11, wherein, It also includes a mid-frame having a receiving cavity for placing the display module, the display module being fixedly connected to the mid-frame via the encapsulation portion.

13. A method for manufacturing a display device, wherein, An injection mold is used, the injection mold including a side shell, a connecting shell and a mold head, the side shell is sleeve-shaped and forms a receiving space, the mold head is located in the receiving space and is configured to cooperate with the sealing glue of the injection sealing part, the connecting shell is located between the side shell and the mold head, and one end of the mold head is connected to one end of the side shell through the connecting shell; The manufacturing method includes: An injection-molded edge sealing portion is provided on the non-light-emitting side of the display module. The injection-molded edge sealing portion is located in the area of ​​the casting area adjacent to the non-casting area. The injection-molded edge sealing portion includes an edge sealing adhesive disposed around the non-casting area. The assembly of the display module and the injection-molded edge sealing part is placed in the receiving space of the injection mold, wherein the inner wall of the side shell is in sealed contact with the edge of the display module, and the end of the mold head away from the connecting shell is inserted into the liquid edge sealing adhesive of the injection-molded edge sealing part, and the mold head is not in contact with the display module. The injection-molded edge sealing part, the mold head, the connecting shell, the side shell and the display module cooperate to form a sealed injection cavity. Curing the liquid edge sealant; Liquid injection molding material is injected into the sealed injection cavity; The liquid injection molding material is solidified to form an encapsulation part; Remove the injection mold.

14. The manufacturing method according to claim 13, wherein, The provision of an injection-molded sealing edge on the non-light-emitting side of the display module includes: Liquid sealing adhesive is applied to the area of ​​the display module adjacent to the non-casting area in the casting area.

15. The manufacturing method according to claim 14, wherein, The liquid edge-sealing adhesive is at least one of epoxy resin adhesive, thermosetting adhesive, UV curing adhesive, and moisture curing adhesive.

16. The manufacturing method according to claim 13, wherein, When the sealing adhesive is a hot melt adhesive, after the injection-molded sealing portion is provided on the non-light-emitting side of the display module, it includes: The edge-sealing adhesive in the injection-molded edge-sealing part is heated and melted to form a liquid edge-sealing adhesive.

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