Display device, display module and manufacturing method thereof

Abstract

A display device, a display module and a manufacturing method thereof. The display module comprises a display panel (1), a protective layer (2), a cover plate (3) and a conductive medium (4), the display panel (1) has a display area (101) and a peripheral area (102) located outside the display area (101). The protective layer (2) is arranged on one side of the display panel (1), and the protective layer (2) covers at least part of the peripheral area (102) and the display area (101); the protective layer (2) comprises a conductive heat dissipation layer (21). The cover plate (3) is arranged on the side of the display panel (1) away from the protective layer (2), and the cover plate (3) is electrically connected with the heat dissipation layer (21) through the conductive medium (4). The display module of the present disclosure can prevent display abnormalities.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular to a display device, a display module and a manufacturing method of the display module. BACKGROUND

[0002] The display module is an essential component of electronic devices such as mobile phones and computers. OLED (Organic Light Emitting Diode) display modules using OLED as a light emitting element are widely used. However, the current display module still has problems such as color deviation and other display abnormalities, which need to be solved urgently.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art.

[0004] DISCLOSURE

[0005] The purpose of the present disclosure is to provide a display device, a display module and a manufacturing method thereof.

[0006] According to one aspect of the present disclosure, a display module is provided, comprising:

[0007] a display panel having a display area and a peripheral area located outside the display area;

[0008] a protective layer provided on one side of the display panel, the protective layer covering at least part of the peripheral area and the display area; the protective layer comprising a conductive heat dissipation layer;

[0009] a cover plate provided on the side of the display panel away from the protective layer;

[0010] a conductive medium, the cover plate being electrically connected to the heat dissipation layer through the conductive medium.

[0011] In an exemplary embodiment of the present disclosure, the cover plate comprises a transparent substrate and a conductive layer, the transparent substrate having a middle area and an edge area located outside the middle area; the middle area covers the display area, and the edge area covers the peripheral area; the conductive layer is provided on the surface of the transparent substrate away from the display panel, and is electrically connected to the heat dissipation layer through the conductive medium, the conductive layer comprising at least a middle wire located in the middle area.

[0012] In an exemplary embodiment of the present disclosure, the conductive layer further comprises an edge wire, the edge wire being located in the edge area and arranged around the middle area; each of the middle wires is connected to the edge wire, and the edge wire is connected to the heat dissipation layer.

[0013] In one exemplary embodiment of this disclosure, the number of intermediate wires is multiple, and they intersect to form a grid structure.

[0014] In one exemplary embodiment of this disclosure, the intermediate conductor includes a first intermediate conductor and a second intermediate conductor. The first intermediate conductor extends along the row direction and is spaced apart along the column direction. The second intermediate conductor extends along the column direction and is spaced apart along the row direction. The second intermediate conductor intersects with the first intermediate conductor.

[0015] In one exemplary embodiment of this disclosure, the display area is provided with an opening, and the conductive layer further includes a clearance wire, the orthographic projection of the clearance wire on the display panel at least partially surrounding the opening; the clearance wire is connected to at least one of the intermediate wires.

[0016] In one exemplary embodiment of this disclosure, the conductive medium extends from the outer side of the display panel edge across the edge of the display panel to connect the conductive layer and the heat dissipation layer.

[0017] In one exemplary embodiment of this disclosure, the boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body region and a connection region located outside the main body region, the connection region being connected to the main body region;

[0018] The connection area is connected to the conductive layer through the conductive medium.

[0019] In an exemplary embodiment of this disclosure, in a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the connecting region onto the transparent substrate and the boundary of the transparent substrate is a first distance;

[0020] In a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the main body region onto the transparent substrate and the boundary of the transparent substrate is the second distance;

[0021] The first distance is less than the second distance.

[0022] In one exemplary embodiment of this disclosure, the cover plate further includes:

[0023] An insulating layer, at least covering the intermediate conductor, wherein the insulating layer is a transparent insulating material.

[0024] In one exemplary embodiment of this disclosure, the edge region of the transparent substrate bends toward the side closer to the protective layer.

[0025] In one exemplary embodiment of this disclosure, the protective layer further includes:

[0026] An adhesive layer is provided on the side of the display panel opposite to the cover plate;

[0027] A buffer layer is bonded to the surface of the adhesive layer opposite to the cover plate;

[0028] A reinforcing layer is provided on the surface of the buffer layer opposite to the cover plate;

[0029] The heat dissipation layer is disposed on the surface of the reinforcing layer opposite to the cover plate.

[0030] In one exemplary embodiment of this disclosure, the orthographic projection of the connecting region onto the transparent substrate is at least partially located in the edge region;

[0031] The display module also includes:

[0032] A light-shielding layer is disposed on the surface of the transparent substrate near the display panel and located in the edge area; the light-shielding layer is made of a conductive material.

[0033] At least a portion of the connection area is electrically connected to the light-shielding layer.

[0034] In one exemplary embodiment of this disclosure, the display panel includes:

[0035] Drive backplane;

[0036] A light-emitting layer is disposed on the side of the drive backplate opposite to the protective layer;

[0037] A back film is disposed on the surface of the driving back plate opposite to the light-emitting layer;

[0038] The adhesive layer is bonded to the surface of the back film away from the light-emitting layer; the boundary of the adhesive layer is located inside the boundary of the back film, and there is a gap between the adhesive layer and the boundary of the back film.

[0039] The conductive layer is electrically connected to the heat dissipation layer through a conductive medium, and the conductive medium extends from the outside of the edge of the display panel across the edge of the display panel to connect the conductive layer and the heat dissipation layer.

[0040] The conductive medium is electrically connected to the spacer region.

[0041] In one exemplary embodiment of this disclosure, the cover plate has a main area and a peripheral area located outside the main area; the main area covers the display area, the peripheral area covers the outer perimeter area, and the conductive medium is connected to the peripheral area;

[0042] The conductive medium extends from the outer edge of the display panel across the edge of the display panel, connecting the cover plate and the heat dissipation layer.

[0043] In one exemplary embodiment of this disclosure, the peripheral region includes a plurality of contact regions spaced apart circumferentially along the main body region, and the conductive medium is connected to the contact regions.

[0044] In one exemplary embodiment of this disclosure, the outer peripheral surface of the cover plate is surrounded by a plurality of circumferentially distributed side surfaces, and the connection between two adjacent side surfaces is a corner; any corner is located within a contact area; the conductive medium connected to any contact area covers the corner within the contact area.

[0045] According to one aspect of this disclosure, a method for manufacturing a display module is provided, comprising:

[0046] A display panel is formed, the display panel having a display area and a peripheral area located outside the display area;

[0047] A cover plate is formed on one side of the display panel;

[0048] A protective layer is formed on the side of the display panel opposite to the cover plate, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer includes a conductive heat dissipation layer;

[0049] The cover plate is electrically connected to the heat dissipation layer through a conductive medium.

[0050] In one exemplary embodiment of this disclosure, the cover plate is electrically connected to the heat dissipation layer via a conductive medium; including:

[0051] A conductive material is formed that extends across the edge of the display panel and connects to the heat dissipation layer via the outer side of the display panel edge;

[0052] The conductive material is cured to obtain the conductive medium.

[0053] According to one aspect of this disclosure, a display device is provided, comprising the display module described in any one of the foregoing claims.

[0054] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0055] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0056] Figure 1This is a cross-sectional view of one embodiment of the module shown in this disclosure.

[0057] Figure 2 This is a partial cross-sectional view of one embodiment of the module shown in this disclosure.

[0058] Figure 3 This is a circuit diagram of the pixel circuit of one embodiment of the display module.

[0059] Figure 4 This is a schematic diagram of the conductive layer of one embodiment of the module shown in this disclosure.

[0060] Figure 5 This is a schematic diagram of the conductive layer of another embodiment of the module shown in this disclosure.

[0061] Figure 6 This disclosure shows a schematic diagram of the heat dissipation layer and conductive medium of one embodiment of the display module.

[0062] Figure 7 This is a schematic diagram of a heat dissipation layer according to one embodiment of the module shown in this disclosure.

[0063] Figure 8 This is a partial cross-sectional view of another embodiment of the module shown in this disclosure.

[0064] Figure 9 This is a partial cross-sectional view of another embodiment of the module shown in this disclosure.

[0065] Figure 10 This is a partial cross-sectional view of one embodiment of the module shown in this disclosure.

[0066] Figure 11 for Figure 10 Top view of the implementation method.

[0067] Figure 12 This is a cross-sectional view of one embodiment of the display device of this disclosure.

[0068] Explanation of reference numerals in the attached figures:

[0069] 1. Display panel; 101. Display area; 102. Peripheral area; 100. Opening; 11. Driver backplane; 12. Light-emitting layer; 13. Encapsulation layer; 14. Back film; 141. Spacer area;

[0070] 2. Protective layer; 21. Heat dissipation layer; 22. Adhesive layer; 23. Buffer layer; 24. Reinforcing layer; 211. Main body area; 212. Connection area;

[0071] 3. Cover plate; 31. Transparent substrate; 311. Middle area; 312. Edge area; 32. Conductive layer; 321. Middle conductor; 3211. First middle conductor; 3212. Second middle conductor; 322. Edge conductor; 323. Avoidance conductor; 33. Isolation layer; 301. Body area; 302. Peripheral area; 3021. Contact area; 30. Side; 300. Corner;

[0072] 4. Conductive medium;

[0073] 5. Polarizing film;

[0074] 6. Optical adhesive layer;

[0075] 7. Border;

[0076] 8. Light-blocking layer. Detailed Implementation

[0077] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0078] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0079] In related technologies, an OLED display module includes a driving backplane and an array of light-emitting layers distributed on one side of the driving backplane. The light-emitting layers may include multiple light-emitting elements. The display module can be divided into a display area and a peripheral area located outside the display area, with the light-emitting elements located within the display area.

[0080] The driving backplane may include a substrate and driving circuitry disposed on the substrate. The driving circuitry may include pixel circuitry located within the display area and peripheral circuitry located in the peripheral area. The peripheral circuitry is connected to the pixel circuitry and includes a light-emitting control circuit, a gate driving circuit, and a source driving circuit. Specifically, the light-emitting control circuitry can output light-emitting control signals to the pixel circuitry; the gate driving circuitry can output write control signals and reset control signals to the pixel circuitry; the source driving circuitry can output data signals to the pixel circuitry; and the driving circuitry can also output a first power supply signal, a second power supply signal, and a reset signal to the pixel circuitry.

[0081] The light-emitting element of the light-emitting layer can be an OLED, i.e., an organic light-emitting diode, which can have a first terminal and a second terminal. The first terminal can be the anode, and the second terminal can be the cathode. The first terminal of the light-emitting element can be connected to the pixel circuit, and the second terminal is used to input a second power signal.

[0082] By controlling the peripheral circuit to input light-emitting control signals, write control signals, reset control signals, data signals, first power signals, second power signals, and reset signals to the pixel circuit and the light-emitting element, the light-emitting element can be made to emit light to display an image.

[0083] In addition, to protect the display module, a transparent cover plate can be installed on the light-emitting side of the display module, that is, the side where the light-emitting layer faces away from the driving backplate. To ensure product reliability meets standards, testing is required before market release. Taking the copper rod test as an example, the testing process is as follows: with the display module displaying a static image normally, a scribing machine or other similar equipment is used to simulate the sliding motion of a human finger, continuously rubbing the cover plate surface for a certain period of time, such as 8 hours. If any display abnormalities such as color distortion or a black screen appear in the static image before the test ends, the test result is considered a failure.

[0084] Through extensive research, the inventors discovered that the different materials of the copper rod and the cover plate result in different binding forces on electrons. During repeated friction tests on the copper rod, electrons gradually transfer from the copper rod to the surface of the cover plate, gradually forming random charge accumulations in localized areas. Since the cover plate is typically made of glass, it has high resistivity and a large dielectric constant, making it difficult for both positive and negative charges to move. When the charge accumulates to a certain extent locally, it interferes with the driving circuit below, thus affecting the displayed image.

[0085] Specifically, the charge accumulated on the cover plate causes a decrease in the overall potential of the display module, leading to a decrease in the substrate potential, and further causing a shift in the Vth (threshold voltage) of the transistors in the pixel circuit. For example, negative charges can cause the Vth of the driving transistor to be forward biased, resulting in an abnormal increase in the driving current. The brightness of the light emitted by the light-emitting element depends on the magnitude of the driving current; the larger the driving current, the greater the brightness. Therefore, the increase in driving current caused by charge accumulation relative to the predetermined driving current results in localized over-brightness of the light-emitting elements. For the red (R), green (G), and blue (B) light-emitting elements, the green light-emitting element has the highest quantum efficiency (the efficiency of exciton transitions into low-energy electrons and the release of photons) and the fastest brightening. Therefore, when the transistors of the three colors of light-emitting elements are shifted equally, the overall image appears more green, resulting in a localized green tint.

[0086] To address the aforementioned problems, this disclosure provides a display module, such as... Figure 1 , Figure 2 and Figure 4 As shown, the display module may include a display panel 1, a protective layer 2, a cover plate 3, and a conductive medium 4, wherein:

[0087] The display panel 1 has a display area 101 and a peripheral area 102 located outside the display area 101. A protective layer 2 is disposed on one side of the display panel 1, covering at least a portion of the peripheral area 102 and the display area 101; the protective layer 2 includes a conductive heat dissipation layer 21. A cover plate 3 is disposed on the side of the display panel 1 opposite to the protective layer 2, and the cover plate 3 is electrically connected to the heat dissipation layer 21 through a conductive medium 4.

[0088] The display module of this embodiment can be grounded during use. During copper rod testing, the charge accumulated on the cover plate 3 due to friction of the copper rod can be conducted along the conductive medium 4 to the heat dissipation layer 21 and connected to the ground. This reduces the charge accumulated on the cover plate 3, avoids interference with the pixel circuit, and prevents color distortion problems such as green tint and other display abnormalities caused by charge accumulation during testing.

[0089] The basic structure of the display module according to the present disclosure will be described in detail below:

[0090] like Figure 1 and Figure 2 As shown, the display panel 1 can be used to emit light to display images, and it may include a driving backplate 11 and a light-emitting layer 12 located on one side of the driving backplate 11, wherein:

[0091] The driving backplane 11 may include a substrate and a driving circuit layer. The substrate is a flat plate structure, and its material can be a rigid material such as glass or a soft material such as polyimide. The driving circuit layer may be disposed on one side of the substrate and includes driving circuits. The display panel 1 may be at least divided into a display area 101 and a peripheral area 102 located outside the display area 101. Correspondingly, the driving circuit layer may include pixel circuits located at least partially within the display area 101 and peripheral circuits located within the peripheral area 102. The pixel circuits may be 7T1C, 7T2C, 6T1C, or 6T2C, etc., as long as they can drive the light-emitting elements to emit light. No special limitation is made on their structure here. The number of pixel circuits is the same as the number of light-emitting elements, and they are connected to each light-emitting element in a one-to-one correspondence so as to control the light emission of each light-emitting element separately. Here, nTmC indicates that a pixel circuit includes n transistors (represented by the letter "T") and m capacitors (represented by the letter "C").

[0092] The peripheral circuit is located in the peripheral area 102 and is connected to the pixel circuit. It is used to input driving signals to the pixel circuit to control the light-emitting element to emit light. The peripheral circuit, connected to the pixel circuit, includes a light-emitting control circuit, a gate driving circuit, a source driving circuit, and a power supply circuit. Specifically, the light-emitting control circuit can output light-emitting control signals to the pixel circuit; the gate driving circuit can output write control signals and reset control signals to the pixel circuit; the source driving circuit can output data signals to the pixel circuit; and the driving circuit can also output a first power supply signal, a second power supply signal, and a reset signal to the pixel circuit.

[0093] The following example uses a 7T1C pixel circuit to illustrate the structure and driving method of the pixel circuit:

[0094] like Figure 3 As shown, the pixel circuit may include seven transistors and a storage capacitor, namely, driving transistor DT, first transistors T1 to sixth transistors T6, and storage capacitor Cst, wherein:

[0095] The control terminal of the first transistor T1 can be used to receive the write control signal Scan, the first terminal is used to receive the data signal Vdata, and the second terminal is connected to the first terminal of the driving transistor DT.

[0096] The control terminal of the second transistor T2 is used to receive the write control signal Scan. The first terminal is connected to the second terminal of the driving transistor DT, and the second terminal is connected to the control terminal of the driving transistor DT.

[0097] The control terminal of the third transistor T3 is used to receive the light emission control signal EM, the first terminal is used to receive the first power supply signal VDD, and the second terminal is connected to the first terminal of the driving transistor DT.

[0098] The control terminal of the fourth transistor T4 is used to receive the reset control signal Reset, the first terminal is used to receive the reset signal Vinit, and the second terminal is connected to the control terminal of the driving transistor DT.

[0099] The control terminal of the fifth transistor T5 is used to receive the reset control signal Reset, the first terminal is used to receive the reset signal Vinit, and the second terminal is connected to the first terminal of the light-emitting element OLED.

[0100] The control terminal of the sixth transistor T6 is used to receive the light emission control signal EM. The first terminal is connected to the second terminal of the driving transistor DT, and the second terminal is connected to the first terminal of the light-emitting element OLED.

[0101] The first terminal of the storage capacitor Cst is connected to the first terminal of the third transistor T3 to input the first power supply signal VDD, and the second terminal is connected to the control terminal of the driving transistor DT.

[0102] The aforementioned driving transistor DT and transistors T1 through T6 are all P-type thin-film transistors; the first power supply signal VDD is a high-level signal, and the second power supply signal VSS is a low-level signal; the light-emitting element OLED is an organic light-emitting diode, with its first terminal being the anode and its second terminal being the cathode. Driving transistor DT and transistors T1 through T6 are all turned on when the voltage is low and turned off when the voltage is high.

[0103] The aforementioned pixel circuit driving methods include:

[0104] During the reset phase, the fourth transistor T4 and the fifth transistor T5 are turned on, the first transistor T1, the second transistor T2, the third transistor T3 and the sixth transistor T6 are turned off, and the reset signal Vinit is transmitted to the control terminal of the driving transistor DT and the first terminal of the light-emitting element OLED.

[0105] During the data writing phase, the first transistor T1 and the second transistor T2 are turned on, while the third transistor T3, the fourth transistor T4, the fifth transistor T5, and the sixth transistor T6 are turned off, so that the data signal Vdata is transmitted to the control terminal of the driver transistor DT through the first transistor T1, the driver transistor DT, and the second transistor T2.

[0106] During the light-emitting stage, the third transistor T3 and the sixth transistor T6 are turned on, while the first transistor T1, the second transistor T2, the fourth transistor T4, and the fifth transistor T5 are turned off, so as to transmit the signal at the second end of the driving transistor DT to the first end of the light-emitting element OLED in order to control the light-emitting element OLED to emit light.

[0107] The aforementioned driving circuit layer may include multiple thin-film transistors and capacitors. The thin-film transistors may be top-gate or bottom-gate type thin-film transistors. Each thin-film transistor may include an active layer, a gate, a source, and a drain. The gate may be a dual gate or a single gate. The active layers of each thin-film transistor are arranged in the same layer, the gates are arranged in the same layer, and the source and drain are arranged in the same layer to simplify the process.

[0108] The structure of the driving backplane 11 is illustrated below using a top-gate thin-film transistor as an example:

[0109] The driving backplane 11 may include a substrate and a driving circuit layer on one side of the substrate. The driving circuit layer may include an active layer, a first gate insulating layer, a gate, a second gate insulating layer, an interlayer dielectric layer, a source / drain layer, and a planarization layer. The active layer is disposed on one side of the substrate, and the first gate insulating layer covers the active layer and the substrate. The gate is disposed on the surface of the first gate insulating layer away from the substrate and is directly opposite the active layer. The second gate insulating layer covers the gate and the first gate insulating layer. The interlayer dielectric layer covers the second gate insulating layer. The source / drain layer is disposed on the surface of the interlayer dielectric layer away from the substrate and includes a source and a drain. The source and drain are connected to the two ends of the active layer through contact holes. The planarization layer covers the source / drain layer and the interlayer dielectric layer. Of course, the driving circuit layer may also include other film layers, as long as they can drive the light-emitting element to emit light, which will not be described in detail here.

[0110] like Figure 1 As shown, the light-emitting layer 12 is disposed on one side of the driving backplate 11. For example, the light-emitting layer 12 is disposed on the surface of the planarization layer facing away from the substrate. The light-emitting layer 12 is located within the display area 101. The light-emitting layer 12 may include a plurality of arrayed light-emitting units, each light-emitting unit including a plurality of light-emitting elements.

[0111] In some embodiments of this disclosure, the light-emitting element is an OLED, which may include a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked along a direction away from the driving backplate 11, wherein:

[0112] The first electrode can be disposed on the side of the planarization layer facing away from the substrate, and connected to the drain of a thin-film transistor in a pixel circuit through a contact hole. This thin-film transistor can be a driving transistor or other transistors, depending on the structure of the pixel circuit, and is not specifically limited here. The light-emitting functional layer may include a hole injection layer, a hole transport layer, a recombination light-emitting layer, an electron transport layer, and an electron injection layer stacked sequentially along the direction facing away from the driving backplate 11. Furthermore, an electron blocking layer may be disposed between the hole transport layer and the recombination light-emitting layer. The second electrode can extend to the peripheral region 102 and be connected to the power signal terminal to receive power signals. The specific principle of OLED light emission will not be detailed here.

[0113] like Figure 1As shown, to facilitate defining the range of each light-emitting element, the light-emitting layer 12 may further include a pixel definition layer, which may be disposed on the surface of the driving circuit layer away from the substrate, and has multiple openings that expose each first electrode in a one-to-one correspondence. A light-emitting functional layer is stacked on the area where the first electrode is located within the opening. The light-emitting functional layers of each light-emitting element are independently spaced apart. The light-emitting colors of different light-emitting functional layers can be the same or different. A second electrode covers the light-emitting functional layers, allowing each light-emitting element to share the same second electrode. Each light-emitting element can be defined through the aforementioned multiple openings, and the boundary of any light-emitting element is the boundary of the light-emitting functional layer within its corresponding opening.

[0114] Of course, in other embodiments of this disclosure, the light-emitting functional layer of each light-emitting element may belong to the same continuous light-emitting film layer. This light-emitting film layer simultaneously covers the surfaces of each first electrode and pixel definition layer facing away from the substrate. The area of ​​the light-emitting film layer located within the opening and stacked on the first electrode is the light-emitting functional layer of the light-emitting element, and adjacent light-emitting functional layers are connected through other areas of the light-emitting film layer. That is to say, each light-emitting element may share the light-emitting film layer.

[0115] In some embodiments of this disclosure, each light-emitting unit may include multiple light-emitting elements with different light-emitting colors, and each light-emitting element emits monochromatic light or quasi-monochromatic light.

[0116] In addition, such as Figure 2 As shown, the display panel 1 may further include an encapsulation layer 13, which covers the surface of the light-emitting layer 12 away from the driving backplate 11 and covers all the light-emitting elements, thereby protecting the light-emitting layer 12 and preventing external water and oxygen from corroding the light-emitting elements. At the same time, the boundary of the encapsulation layer 13 extends into the peripheral area 102 but does not exceed the peripheral area 102, which can also protect the peripheral circuits of the peripheral area 102.

[0117] In some embodiments of this disclosure, thin-film encapsulation (TFE) can be used to achieve encapsulation. The encapsulation layer 13 may include a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the surface of the light-emitting layer 12 away from the driving backplate 11. The organic layer may be disposed on the surface of the first inorganic layer away from the driving backplate 11, and the boundary of the organic layer is defined inside the boundary of the first inorganic layer. The second inorganic layer covers the organic layer and the first inorganic layer that is not covered by the organic layer. The second inorganic layer can block water and oxygen intrusion, and the flexible organic layer can achieve planarization.

[0118] like Figure 1 and Figure 2As shown, the protective layer 2 is disposed on one side of the display panel 1. For example, the protective layer 2 may be disposed on the side of the driving backplate 11 away from the light-emitting layer 12. At the same time, the protective layer 2 may cover at least a portion of the peripheral area 102 and the display area 101. For example, the boundary of the protective layer 2 is located within the peripheral area 102 and has a specified distance from the boundary of the peripheral area 102.

[0119] The protective layer 2 may include a heat dissipation layer 21 to dissipate heat from the display panel 1. The heat dissipation layer 21 may be made of copper or other metals with good thermal conductivity, or it may be made of non-metallic materials, such as graphene. Of course, since a material with high electrical conductivity is used, the heat dissipation layer 21 can also conduct electricity.

[0120] Furthermore, in some embodiments of this disclosure, such as Figure 2 As shown, the protective layer 2 may further include an adhesive layer 22, a buffer layer 23, and a reinforcing layer 24, wherein:

[0121] The buffer layer 23 can be bonded to the backlight side of the display panel 1, i.e., the side of the drive backplate 11 away from the light-emitting layer 12, via the adhesive layer 22. The adhesive layer 22 can be an EMBO mesh adhesive, which facilitates air venting while achieving bonding, and if the display panel 1 is a flexible display panel 1, the mesh adhesive can adapt to the bending of the display panel 1. Of course, other adhesives can also be used for the adhesive layer 22. The buffer layer 23 can be foam or other flexible materials to provide cushioning for the display panel 1 and also to provide light shielding.

[0122] The reinforcing layer 24 can be disposed on the side of the buffer layer 23 away from the display panel 1. The reinforcing layer 24 can be used to improve the strength of the protective layer 2, making it less prone to breakage and damage. The material of the reinforcing layer 24 can be polyimide or other flexible materials. However, if the display panel 1 is a flexible display panel 1, then the reinforcing layer 24 should be a flexible material so that the display panel 1 can be bent. The aforementioned heat dissipation layer 21 can be disposed on the surface of the reinforcing layer 24 away from the display panel 1.

[0123] like Figure 1 and Figure 2 As shown, the cover plate 3 can be disposed on the side of the display panel 1 away from the protective layer 2, that is, the cover plate 3 is disposed on the side of the light-emitting layer 12 away from the driving back plate 11, for the purpose of protecting the display panel 1. The area of ​​the cover plate 3 can be larger than the area of ​​the display panel 1, so that the edge of the cover plate 3 can extend beyond the edge of the display panel 1. Of course, the boundary of the edge area 312 can also coincide with the boundary of the peripheral area 102. The cover plate 3 can be a transparent structure to allow light emitted from the light-emitting layer 12 to pass through.

[0124] In some embodiments of this disclosure, at least a portion of the edge of the cover plate 3 may be bent toward the side closer to the protective layer 2, and both the display panel 1 and the protective layer 2 may be planar structures, with the bent area of ​​the cover plate 3 located outside the boundary between the display panel 1 and the protective layer 2; or, the edges of the display panel 1 and the protective layer 2 may also be bent, and the bent areas may match and fit with the bent areas of the cover plate 3.

[0125] Furthermore, such as Figure 1 and Figure 2 As shown, the display module may also include a polarizer 5, which may be disposed between the encapsulation layer 13 and the cover plate 3. The polarizer 5 may be a circular polarizer to reduce the reflection of external light by the display module. An optical adhesive layer 6 may be provided between the polarizer 5 and the cover plate 3. The optical adhesive layer 6 can be used to achieve planarization so as to fit with the cover plate 3 and at the same time reduce the optical path difference at different positions.

[0126] In addition, the display module may also include a touch layer, which may be disposed between the encapsulation layer 13 and the cover plate 3, and the orthographic projection of the touch layer on the display panel 1 shall at least cover the display area 101. The touch layer may adopt a self-capacitive or mutual-capacitive touch structure. For example, the touch layer may be external, or it may be an on-cell method such as FMLOC (Flexible Multi-Layer On Cell). There are no special limitations on its specific structure, as long as it can realize the touch function. Users can operate on the side of the cover plate 3 away from the display panel 1, and the touch layer senses the touch position to realize interaction.

[0127] The display module may also include a light-shielding layer 8, which may be disposed between the cover plate 3 and the display panel 1. The material of the light-shielding layer 8 may be ink or opaque photoresist, etc. The orthographic projection of the light-shielding layer 8 on the display panel 1 is located in the peripheral area 102 and is disposed around the display area 101. The light-shielding layer 8 can block at least a part of the peripheral area 102 of the display panel 1.

[0128] The following is a detailed description of the scheme for improving color cast in the display module according to the embodiments of this disclosure:

[0129] like Figure 1 and Figure 2 As shown, since the heat dissipation layer 21 of the protective layer 2 is made of metal and has conductive properties, the cover plate 3 and the heat dissipation layer 21 can be electrically connected through the conductive medium 4, thereby discharging the charge on the cover plate 3.

[0130] In some embodiments of this disclosure, to facilitate charge guidance, a conductive layer 32 can be provided in the cover plate 3, and a conductive path can be established between the conductive layer 32 and the heat dissipation layer 21. When the heat dissipation layer 21 is grounded, the charge accumulated on the conductive layer 32 can be conducted to the heat dissipation layer 21 and finally guided to a preset ground terminal connected to the heat dissipation layer 21, avoiding interference with the pixel circuit. Specifically, the cover plate 3 may include a transparent substrate 31 and a conductive layer 32, wherein:

[0131] The transparent substrate 31 has a central region 311 and an edge region 312 located outside the central region 311. The central region 311 covers the display area 101, and the boundary of the central region 311 may coincide with the boundary of the display area 101. The edge region 312 may cover the peripheral region 102, and the boundary of the edge region 312 may be located outside the peripheral region 102. That is, the area of ​​the transparent substrate 31 may be larger than the area of ​​the display panel 1, so that the edge of the transparent substrate 31 may extend beyond the edge of the display panel 1. Of course, the boundary of the edge region 312 may also coincide with the boundary of the peripheral region 102. The material of the transparent substrate 31 may be a transparent material such as glass, and no special limitation is made here.

[0132] like Figure 4 and Figure 5 As shown, the conductive layer 32 is disposed on the surface of the transparent substrate 31 facing away from the display panel 1 and is connected to the heat dissipation layer 21. The conductivity of the material of the conductive layer 32 is higher than that of the transparent substrate 31. The conductivity of the conductive layer 32 can be 10 times, 20 times, 100 times, etc., of the transparent substrate 31, without any special limitation. For example, the material of the conductive layer 32 can include transparent conductive materials such as ITO (indium tin oxide), which ensures conductivity while avoiding obstruction of light. Of course, it can also include other transparent conductive materials such as IZO (indium zinc oxide), which will not be listed here. In addition, the conductive layer 32 can also use other conductive materials, as long as it does not affect the image display and can conduct electricity.

[0133] The conductive layer 32 may include an intermediate conductor 321, which may be located in the intermediate region 311. That is, the orthogonal projection of the intermediate conductor 321 on the display panel 1 is located in the display area 101, so as to conduct the charge within the display area 101 to the heat dissipation layer 21. In use, the heat dissipation layer 21 can be grounded, that is, the potential of the heat dissipation layer 21 can be made 0, so as to guide the charge of the conductive layer 32 to the heat dissipation layer 21 and finally to a preset ground terminal. The ground terminal can be grounded through the ground terminal of the electronic device using the display module of this disclosure. Of course, the conductive layer 32 may be a continuous planar film layer, as long as it can conduct charge.

[0134] In some embodiments of this disclosure, such as Figure 1As shown, at least a portion of the edge of the cover plate 3 bends toward the protective layer 2. At this time, at least a portion of the edge region 312 of the transparent substrate 31 bends toward the protective layer 2, while the middle region 311 is a planar structure.

[0135] The structure of conductive layer 32 is described below:

[0136] like Figure 4 and Figure 5 As shown, there are multiple intermediate wires 321, which intersect to form a grid structure. In some embodiments of this disclosure, the intermediate wires 321 may include first intermediate wires 3211 and second intermediate wires 3212 extending in a straight line. The first intermediate wires 3211 extend along the row direction and are spaced apart along the column direction. The second intermediate wires 3212 extend along the column direction and are spaced apart along the row direction. Each second intermediate wire 3212 intersects with each first intermediate wire 3211. The row direction may be as follows: Figure 4 and Figure 5 The X direction and column direction can be... Figure 4 and Figure 5 In the Y direction, the two are perpendicular to each other.

[0137] It should be noted that, Figure 4 and Figure 5 The row and column directions are merely illustrative examples and do not constitute a specific limitation on the intermediate guide 321. Those skilled in the art will know that the row and column directions will change accordingly if the rotation is performed.

[0138] like Figure 4 and Figure 5 As shown, the spacing T1 between two adjacent first intermediate conductors 3211 and the spacing T2 between two adjacent second intermediate conductors 3212 can both be 1cm-3cm, such as 1cm, 2cm, or 3cm, but T1 and T2 can be different. The spacing between two adjacent first intermediate conductors 3211 can be the sum of the width of the gap between two adjacent first intermediate conductors 3211 and the line width of one first intermediate conductor 3211, that is, the distance between the center lines of two adjacent first intermediate conductors 3211. Similarly, the spacing between two adjacent second intermediate conductors 3212 can be the sum of the width of the gap between two adjacent second intermediate conductors 3212 and the line width of one second intermediate conductor 3212, that is, the distance between the center lines of two adjacent second intermediate conductors 3212.

[0139] In some embodiments of this disclosure, for a rectangular display module, if the first direction is the width direction and the second direction is the length direction; if the aspect ratio of the display module is 16:9, then eight first intermediate guide wires 3211 and four second intermediate guide wires 3212 can be provided. The spacing between two adjacent intermediate guide wires 321 is 2 cm.

[0140] like Figure 4 and Figure 5 As shown, in order to facilitate the connection of the intermediate conductor 321 to the heat dissipation layer 21, in some embodiments of this disclosure, the conductive layer 32 further includes an edge conductor 322. The edge conductor 322 is located in the edge region 312 of the transparent substrate 31, and the edge conductor 322 is arranged around the intermediate region 311. Each intermediate conductor 321 is connected to the edge conductor 322, and the edge conductor 322 can be connected to the heat dissipation layer 21.

[0141] In some embodiments of this disclosure, the edge conductor 322 may be a closed ring structure, disposed within the edge region 312 and surrounding the middle region 311, with both ends of each middle conductor 321 connected to the edge conductor 322. This ring structure may be a circular ring, a rectangular ring, etc., and its shape may be the same as the shape of the middle region 311, depending on the specific shape of the middle region 311. Simultaneously, the edge conductor 322 is connected to the heat dissipation layer 21. Of course, in other embodiments of this disclosure, the edge conductor 322 may also be a "U" shape or other partially closed curved structure, which may surround the middle region 311 but not completely enclose it.

[0142] In addition, such as Figure 5 As shown, the display area 101 of the display panel 1 may have an opening 100. The opening 100 may penetrate the light-emitting layer 12 and the driving circuit layer of the display panel 1 and expose the substrate, or it may penetrate the substrate. On the side of the protective layer 2 facing away from the display panel 1, a camera device corresponding to the opening 100 may be provided, so that images can be captured through the display module. Correspondingly, the conductive layer 32 also includes a bypass wire 323. The orthographic projection of the bypass wire 323 on the display panel 1 at least partially surrounds the opening 100, and the bypass wire 323 is connected to at least an intermediate wire 321. When the opening 100 is located on the extension path of an intermediate wire 321, the bypass wire 323 can bypass the opening 100 so that the intermediate wire 321 can be connected to the edge wire 322, or directly connected to the heat dissipation layer 21.

[0143] In some embodiments of this disclosure, such as Figure 5 As shown, the clearance wire 323 can be a closed ring structure surrounding the opening 100. An intermediate wire 321 is connected to the clearance wire 323, and the clearance wire 323 can divide the intermediate wire 321 into two segments, which are then connected through the clearance wire 323. The intermediate wire 321 can be either a first intermediate wire 3211 or a second intermediate wire 3212, without any special limitation here.

[0144] The connection method between the conductive layer 32 and the heat dissipation layer 21 is described below:

[0145] like Figure 1 ,Figure 4 , Figure 5 and Figure 7 As shown, the conductive layer 32 and the heat dissipation layer 21 can be electrically connected through the conductive medium 4. The conductive medium 4 can be electrically connected to the conductive layer 32 on the surface of the transparent substrate 31 away from the protective layer 2, and can be electrically connected to the edge of the heat dissipation layer 21 from the outside of the edge of the transparent substrate 31 and the edge of the display panel 1.

[0146] The conductive medium 4 can be a conductive adhesive or other material that connects the conductive layer 32 and the heat dissipation layer 21, without special limitation. For example, the conductive adhesive may include a matrix and conductive fillers, wherein the matrix may include epoxy resin, acrylate resin, polyurethane, etc. The matrix may account for 15%-25% of the conductive adhesive by weight. The conductive fillers may include metal powders such as gold, silver, copper, aluminum, zinc, iron, nickel, etc., and may also include graphite or other conductive compounds. The conductive fillers may account for 30%-60% of the conductive adhesive by weight. In addition, the conductive adhesive may also include solvents and additives, such as water, alcohols, etc. The solvent may account for 10%-20% of the conductive adhesive by weight. The additives may be crosslinking agents, coupling agents, etc.

[0147] In some embodiments of this disclosure, such as Figure 6 and Figure 7 As shown, the boundary of the heat dissipation layer 21 is located inside the boundary of the transparent substrate 31, making the area of ​​the heat dissipation layer 21 smaller than that of the transparent substrate 31. Simultaneously, the heat dissipation layer 21 includes a main body region 211 and a connecting region 212 located outside the main body region 211. The number of connecting regions 212 can be one or more. The boundary of the orthographic projection of the main body region 211 onto the transparent substrate 31 can be located within the outer perimeter region 102, meaning the range of the main body region 211 is not smaller than the middle region 311, and the boundary of the orthographic projection of the connecting region 212 onto the transparent substrate 31 is also located within the edge region 312. For example, the shape of the main body region 211 can be a rectangular structure with rounded corners, and the connecting region 212 can be an arc-shaped area located at the four corners of the rectangle and protruding outwards.

[0148] The connection area 212 is connected to the main body area 211, and the connection area 212 is connected to the conductive layer 32 through the conductive medium 4. Since the connection area 212 is located outside the main body area 211, the connection area 212 is closer to the edge of the transparent substrate 31 than the middle area 311. Without adding the conductive medium 4, the connection area 212 can increase the contact surface between the conductive medium 4 and the heat dissipation layer 21, shorten the extension path of the conductive medium 4, make the contact more sufficient and the connection more stable, and facilitate the full conduction between the heat dissipation layer 21 and the conductive layer 32.

[0149] Furthermore, such as Figure 6As shown, in the direction parallel to the intermediate region 311, the distance between the boundary of the orthographic projection of the connecting region 212 onto the transparent substrate 31 and the boundary of the transparent substrate 31 can be defined as the first distance S1; the distance between the boundary of the orthographic projection of the main body region 211 onto the transparent substrate 31 and the boundary of the transparent substrate 31 can be defined as the second distance S2; the first distance S1 is less than the second distance S2, that is, the distance between the connecting region 212 and the boundary of the transparent substrate 31 is closer than the distance between the main body region 211 and the boundary of the transparent substrate 31. The boundary of the orthographic projection of the connecting region 212 onto the transparent substrate 31 is arc-shaped, and the first distance S1 is the distance between the arc and the closest point on the boundary of the transparent substrate 31. For example, the first distance S1 can be 0.3mm-0.5mm, such as 0.3mm, 0.4mm, or 0.5mm; the second distance S2 can be 0.9mm-1.1mm, such as 0.9mm, 1mm, or 1.1mm.

[0150] Furthermore, in some embodiments of this disclosure, such as Figure 1 As shown, the cover plate 3 may also include an insulating layer 33, which can cover at least a portion of the conductive layer 32 and the transparent substrate 31. The insulating layer 33 is a transparent insulating material used to protect the conductive layer 32 and the transparent substrate 31 from wear and corrosion. Meanwhile, users can perform touch operations on the side of the insulating layer 33 facing away from the display substrate 1. Therefore, the insulating layer 33 can be made of a fingerprint-resistant material to prevent fingerprint formation. For example, the insulating layer 33 can be made of an oleophobic material; once oil from fingers comes into contact with the insulating layer 33, it will form tiny oil droplets, preventing the formation of fingerprint patterns.

[0151] The boundary of the orthographic projection of the isolation layer 33 onto the transparent substrate 31 can be located within the edge region 312, thereby completely covering the middle region 311 and at least partially covering the edge region 312. Furthermore, the boundary of the orthographic projection of the isolation layer 33 onto the transparent substrate 31 can be made to coincide with the boundary of the transparent substrate 31, thereby completely covering the conductive layer 32 and the transparent substrate 31 not covered by the conductive layer 32.

[0152] If the isolation layer 33 completely covers the middle conductor 321 and the edge conductor 322, in order to ensure that the conductive medium 4 can be connected to the edge conductor 322, in some embodiments of this disclosure, a via exposing the edge conductor 322 can be provided on the isolation layer 33. The conductive medium 4 can extend from the surface of the isolation layer 33 away from the transparent substrate 31 into the via, thereby connecting with the edge conductor 322. Alternatively, in some embodiments of this disclosure, before forming the isolation layer 33, the edge conductor 322 can be connected to the heat dissipation layer 21 through the conductive medium 4, and then the isolation layer 33 can cover the conductive layer 32, the conductive medium 4, and the transparent substrate 31.

[0153] Of course, in other embodiments of this disclosure, the boundary of the isolation layer 33 coincides with the boundary of the intermediate region 311, so that the edge wire 322 is not covered by the isolation layer 33. In this case, the edge wire 322 can be directly connected to the heat dissipation layer 21 through the conductive medium 4.

[0154] The following is a detailed explanation of the specific principles by which this display module prevents charge accumulation and improves color distortion:

[0155] During the repeated friction process of the copper rod test, electrons gradually transfer from the copper rod to the surface of the cover plate 3, and negative charges accumulate locally on the cover plate 3; at the same time, due to friction, electrons are lost locally on the cover plate 3, which is equivalent to positive charges accumulating locally on the cover plate 3.

[0156] Due to the path formed by the conductive layer 32 and the heat dissipation layer 21, and the characteristic that charges tend to accumulate in materials with higher conductivity, the charges on the cover plate 3 reach the nearby intermediate conductor 321 in the shortest and fastest way. When the charges accumulate on the intermediate conductor 321, a potential difference is formed relative to the grounded heat dissipation layer 21. Under the action of the Coulomb force in the electric field, the charges move along the conductive medium 4 towards the heat dissipation layer 21, and are finally conducted by the heat dissipation layer 21 to the grounding point of the drive circuit board. In this process, the charge accumulation on the cover plate 3 is eliminated, avoiding interference with the thin-film transistors of the pixel circuit, thereby improving display anomalies such as color cast.

[0157] Furthermore, in another embodiment of this disclosure, such as Figure 8 As shown, the orthographic projection of the connection area 212 of the heat dissipation layer 21 onto the transparent substrate 31 is at least partially located in the edge area 312. The display module also includes a light-shielding layer 8, which can be disposed on the surface of the transparent substrate 31 near the display panel 1 and located in the edge area 312; the light-shielding layer 8 is a conductive light-shielding material, for example, the light-shielding layer 8 can be made of conductive black ink. Of course, other materials can also be used, as long as they can block light and conduct electricity.

[0158] At least a portion of the connection region 212 can be electrically connected to the light-shielding layer 8 to discharge the charge on the transparent substrate 31. For example, at least a portion of the connection region 212 can be bent towards the transparent substrate 31 and directly overlap with the light-shielding layer 8, and can be electrically connected via conductive adhesive or other media. The aforementioned conductive medium 4 can be connected to both the light-shielding layer 8 and the connection region 212 simultaneously, or it can be connected only to the connection region 212 without being connected to the light-shielding layer 8.

[0159] In yet another embodiment of this disclosure, such as Figure 9As shown, the surface of the driving backplate 11 facing away from the light-emitting layer 12 can be covered with a back film 14 to protect the driving backplate 11, and the boundary of the back film 14 can coincide with the boundary of the driving backplate 11. The material of the back film 14 can be resin or other materials, and it can be a multilayer or single-layer structure. An adhesive layer 22 can be bonded to the surface of the back film 14 facing away from the light-emitting layer 12, and the boundary of the adhesive layer 22 is located within the boundary of the back film 14. There is a gap region 141 between the boundary of the adhesive layer 22 and the boundary of the back film 14, and the gap region 141 is the area of ​​the back film 14 not covered by the adhesive layer 22.

[0160] While electrically connecting the conductive layer 32 and the heat dissipation layer 21, the conductive medium 4 also extends to the region corresponding to the spacer region 141 and is electrically connected to the spacer region 141, thereby discharging the charge on the back film 14.

[0161] like Figure 10 and Figure 11 As shown, in some embodiments of this disclosure, charge can be conducted without the aforementioned conductive layer 32. For example, the cover plate 3 is made of a transparent material and does not include the aforementioned conductive layer 32. It may have a body region 301 and a peripheral region 302 located outside the body region 301. The body region 301 covers the display area 101, and the peripheral region 302 covers the outer perimeter region 102. The conductive medium 4 connects the peripheral region 302 and the heat dissipation layer 21, and the charge on the cover plate 3 can also be guided to the heat dissipation layer 21 through the conductive medium 4.

[0162] Furthermore, there may be multiple contact points between the conductive medium 4 and the peripheral region 302. For example, the peripheral region 302 includes multiple contact regions 3021 that are circumferentially spaced along the body region 301, and the conductive medium 4 is connected to the contact regions 3021.

[0163] Furthermore, the outer periphery of the cover plate 3 can be formed by multiple circumferentially distributed side surfaces 30. The connection point between two adjacent side surfaces 30 is a corner 300. The number of side surfaces 30 is not specifically limited here; it can be three, four, five, etc. Adjacent side surfaces 30 can be directly connected or connected through a curved transition, so that the orthographic projection of the cover plate 3 on the display panel 1 is a polygon or a polygon with curved corners. Any corner 300 is located within a contact area 3021, and each contact area 3021 has one corner 300. The conductive medium 4 connected to a contact area 3021 covers the corner 300 within the contact area 3021; ​​that is, each corner 300 of the cover plate 3 is covered with the conductive medium 4.

[0164] This disclosure provides a method for manufacturing a display module, which can be any of the display modules described in the above embodiments, and its specific structure will not be repeated here. The manufacturing method of this disclosure may include steps S110-S140, wherein:

[0165] Step S110: Form a display panel, the display panel having a display area and a peripheral area located outside the display area;

[0166] Step S120: Form a cover plate on one side of the display panel;

[0167] Step S130: A protective layer is formed on the side of the display panel opposite to the cover plate, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer includes a conductive heat dissipation layer.

[0168] Step S140: Electrically connect the cover plate to the heat dissipation layer through a conductive medium.

[0169] Details of the structures involved in each step of the manufacturing method disclosed herein have been described in detail in the embodiments of the display module, and will not be repeated here. Step S140 may include:

[0170] A conductive material is formed that extends across the edge of the display panel and connects to the heat dissipation layer via the outer side of the display panel edge;

[0171] The conductive material is cured to obtain the conductive medium.

[0172] It should be noted that although the various steps of the manufacturing method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0173] This disclosure also provides a display device, which may include the display module of any of the above embodiments. The specific structure and beneficial effects of the display module can be referred to the above embodiments of the display module, and will not be described in detail here.

[0174] In addition, such as Figure 12 As shown, the display device may also include a bezel 7, and the display module may be placed within the area surrounded by the bezel 7, which can protect the display module.

[0175] The display device may also include a driving circuit board, which may be a flexible circuit board that can be connected to the display panel 1 and bent to the side of the protective layer 2 away from the cover plate 3. The driving circuit board can output driving signals to the display panel 1 to display images. At the same time, the heat dissipation layer 31 can also be connected to the driving circuit board, so that the heat dissipation layer 31 can be grounded through the driving circuit board, thereby dissipating the charge accumulated on the conductive layer 32.

[0176] The display device disclosed herein may be a mobile phone, tablet computer, wearable device (smart bracelet, watch), laptop computer, television or other similar device with image display function, which will not be listed here.

[0177] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display module, wherein, include: The display panel has a display area and a peripheral area located outside the display area; A protective layer is disposed on one side of the display panel, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer includes a conductive heat dissipation layer; A cover plate is disposed on the side of the display panel opposite to the protective layer; A conductive medium is used, and the cover plate is electrically connected to the heat dissipation layer through the conductive medium. The cover plate includes a transparent substrate, a conductive layer, and an insulating layer; The transparent substrate has a central area and an edge area located outside the central area; the central area covers the display area, and the edge area covers the peripheral area; The conductive layer is disposed on the surface of the transparent substrate opposite to the display panel and is electrically connected to the heat dissipation layer through the conductive medium. The material of the conductive layer is a transparent conductive material. The conductive layer includes at least a central conductor located in the central area. The conductive layer also includes an edge conductor located in the edge area and arranged around the central area. Each of the central conductors is connected to the edge conductor, and the edge conductor is connected to the heat dissipation layer. The boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body area and a connection area located outside the main body area, wherein the connection area is connected to the main body area; The connection area is connected to the conductive layer through the conductive medium; In a direction parallel to the main body area, the distance between the boundary of the orthographic projection of the connecting area onto the transparent substrate and the boundary of the transparent substrate is a first distance; In a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the main body region onto the transparent substrate and the boundary of the transparent substrate is the second distance; The first distance is less than the second distance; An insulating layer at least covers the intermediate conductor, and the insulating layer is made of a transparent insulating material.

2. The display module according to claim 1, wherein, The number of intermediate wires is multiple, and they intersect to form a grid structure.

3. The display module according to claim 2, wherein, The intermediate conductor includes a first intermediate conductor and a second intermediate conductor. The first intermediate conductor extends along the row direction and is spaced apart along the column direction. The second intermediate conductor extends along the column direction and is spaced apart along the row direction. The second intermediate conductor intersects with the first intermediate conductor.

4. The display module according to claim 2, wherein, The display area is provided with an opening, and the conductive layer also includes a guide wire, the orthographic projection of which on the display panel at least partially surrounds the opening; The avoidance conductor is connected to at least one of the intermediate conductors.

5. The display module according to any one of claims 2-4, wherein, The conductive medium extends from the outside of the display panel edge, crossing the edge of the display panel to connect the conductive layer and the heat dissipation layer.

6. The display module according to any one of claims 2-4, wherein, The edge region of the transparent substrate curves toward the side closer to the protective layer.

7. The display module according to any one of claims 2-4, wherein, The protective layer also includes: An adhesive layer is provided on the side of the display panel opposite to the cover plate; A buffer layer is bonded to the surface of the adhesive layer opposite to the cover plate; A reinforcing layer is provided on the surface of the buffer layer opposite to the cover plate; The heat dissipation layer is disposed on the surface of the reinforcing layer opposite to the cover plate.

8. The display module according to claim 7, wherein, The orthographic projection of the connection area onto the transparent substrate is at least partially located in the edge area; The display module also includes: A light-shielding layer is disposed on the surface of the transparent substrate near the display panel and located in the edge area; the light-shielding layer is made of a conductive material. At least a portion of the connection area is electrically connected to the light-shielding layer.

9. The display module according to claim 8, wherein, The display panel includes: Drive backplane; A light-emitting layer is disposed on the side of the drive backplate opposite to the protective layer; A back film is disposed on the surface of the driving back plate opposite to the light-emitting layer; The adhesive layer is bonded to the surface of the back film away from the light-emitting layer; the boundary of the adhesive layer is located inside the boundary of the back film, and there is a gap between the adhesive layer and the boundary of the back film. The conductive layer is electrically connected to the heat dissipation layer through a conductive medium, and the conductive medium extends from the outside of the edge of the display panel across the edge of the display panel to connect the conductive layer and the heat dissipation layer. The conductive medium is electrically connected to the spacer region.

10. The display module according to claim 1, wherein, The cover plate has a main area and a peripheral area located outside the main area; the main area covers the display area, the peripheral area covers the outer perimeter area, and the conductive medium is connected to the peripheral area; The conductive medium extends from the outer edge of the display panel across the edge of the display panel, connecting the cover plate and the heat dissipation layer.

11. The display module according to claim 10, wherein, The peripheral area includes multiple contact areas spaced circumferentially along the main body area, and the conductive medium is connected to the contact areas.

12. The display module according to claim 11, wherein, The outer peripheral surface of the cover plate is formed by a plurality of circumferentially distributed side surfaces, and the connection between two adjacent side surfaces is a corner; any corner is located within a contact area. The conductive medium connected to any of the contact areas covers the corners within the contact areas.

13. A method for manufacturing a display module, wherein, include: A display panel is formed, the display panel having a display area and a peripheral area located outside the display area; A cover plate is formed on one side of the display panel; the cover plate includes a transparent substrate, a conductive layer, and an insulating layer. The transparent substrate has a central area and an edge area located outside the central area; the central area covers the display area, and the edge area covers the peripheral area; The conductive layer is disposed on the surface of the transparent substrate opposite to the display panel and is electrically connected to the heat dissipation layer through a conductive medium. The material of the conductive layer is a transparent conductive material. The conductive layer includes at least a central conductor located in the central area. The conductive layer also includes an edge conductor located in the edge area and arranged around the central area. Each of the central conductors is connected to the edge conductor, and the edge conductor is connected to the heat dissipation layer. The boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body area and a connection area located outside the main body area, wherein the connection area is connected to the main body area; The connection area is connected to the conductive layer through the conductive medium; In a direction parallel to the main body area, the distance between the boundary of the orthographic projection of the connecting area onto the transparent substrate and the boundary of the transparent substrate is a first distance; In a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the main body region onto the transparent substrate and the boundary of the transparent substrate is the second distance; The first distance is less than the second distance; An insulating layer, at least covering the intermediate conductor, wherein the insulating layer is a transparent insulating material; A protective layer is formed on the side of the display panel opposite to the cover plate, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer includes a conductive heat dissipation layer; The cover plate is electrically connected to the heat dissipation layer through a conductive medium.

14. The manufacturing method according to claim 13, wherein, Electrically connecting the cover plate to the heat dissipation layer via a conductive medium; including: A conductive material is formed that extends across the edge of the display panel and connects to the heat dissipation layer via the outer side of the display panel edge; The conductive material is cured to obtain the conductive medium.

15. A display device, wherein, Includes the display module as described in any one of claims 1-12.

Images