A laser cleaning apparatus and method

Abstract

The application discloses a kind of laser cleaning equipment and cleaning method.It includes: first centering boss, second centering boss, centering slider, manual handle, guide rail, horizontal positioning plate, rotary table, base, control cabinet, laser cleaning head and infrared distance measuring device, horizontal positioning plate is fixed on base and fixed to be cleaned cylinder workpiece;Guide rail is fixed on centering slider, first centering boss is set on guide rail, centering slider is set on horizontal positioning plate, second centering boss is fixed on centering slider, manual handle is connected with centering slider and controls centering slider to move;Rotary table is connected with horizontal positioning plate and base, to drive horizontal positioning plate to rotate;Infrared distance measuring device is fixed on laser cleaning head, measures the distance between laser cleaning head and to be cleaned cylinder workpiece;Control cabinet is connected with laser cleaning head and infrared distance measuring device, according to the distance measured by infrared distance measuring device, controls laser cleaning head to clean to be cleaned cylinder workpiece.The application can improve the surface quality of laser cleaning.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser cleaning, in particular to a laser cleaning device and a cleaning method. BACKGROUND

[0002] The laser cleaning technology is a method for removing the pollution layer on the metal surface by focusing the laser on the metal surface and using high-density laser energy. In the laser cleaning, the focal depth of the laser beam at the focusing position is generally 1-2mm, and the energy density of the laser will be reduced to be insufficient to remove the pollution layer on the metal surface beyond the focal depth range.

[0003] In order to ensure the quality of laser cleaning, it is necessary to ensure that the surface to be cleaned is within the focal depth range during cleaning. In actual production, the parts may be deformed during processing, resulting in that the deformed parts exceed the focal depth range of the laser during cleaning, and the cleaning effect is poor. Therefore, it is necessary to perform secondary cleaning on the deformed parts during cleaning. The traditional way is to manually position the area that has not been cleaned for secondary cleaning. This way is inefficient, and due to the positioning error, some areas that have been cleaned will be cleaned again, resulting in poor cleaning effect. SUMMARY

[0004] The technical problem solved by the present application is to overcome the shortcomings of the prior art and provide a laser cleaning device and a cleaning method.

[0005] The technical solution of the present application is:

[0006] In a first aspect, the embodiments of the present application provide a laser cleaning device, characterized in that the device comprises: a first centering protrusion, a second centering protrusion, a centering slider, a manual handle, a guide rail, a horizontal positioning plate, a rotary table, a base, a control cabinet, a laser cleaning head and an infrared distance measuring device, wherein

[0007] The horizontal positioning plate is fixed on the base to fix the cylinder workpiece to be cleaned;

[0008] The guide rail is fixed on the centering slider, the first centering protrusion is arranged on the guide rail, the centering slider is arranged on the horizontal positioning plate, the second centering protrusion is fixed on the centering slider, and the manual handle is connected with the centering slider to control the movement of the centering slider, so as to clamp the cylinder workpiece to be cleaned;

[0009] The rotary table is connected with the horizontal positioning plate and the base to drive the horizontal positioning plate to rotate;

[0010] The infrared distance measuring device is fixed on the laser cleaning head to measure the distance between the laser cleaning head and the cylinder workpiece to be cleaned;

[0011] The control cabinet is connected with the laser cleaning head and the infrared distance measuring device, and controls the laser cleaning head to clean the to-be-cleaned cylindrical workpiece according to the distance measured by the infrared distance measuring device.

[0012] Optionally, the guide rails are two cylindrical stainless steel guide rails, and the diameter of the guide rails is 15 mm.

[0013] Optionally, the guide rails are fixed on the centering slider and pass through the first centering block and the second centering block.

[0014] Optionally, the control cabinet comprises recording software, which is configured to receive data fed back by the infrared distance measuring device in real time, adjust the distance between the laser cleaning head and the surface of the workpiece, and control the start and termination of the laser cleaning program.

[0015] Optionally, the infrared light beam of the infrared distance measuring device and the laser light beam of the laser cleaning head are located on the same plane.

[0016] In a second aspect, an embodiment of the present application provides a cleaning method applied to the device described in any of the above embodiments, and the method comprises the following steps.

[0017] Adjusting the height of the first centering block to adapt the height of the horizontal positioning plate to the height of the to-be-cleaned cylindrical workpiece, and placing the to-be-cleaned cylindrical workpiece on the horizontal positioning plate;

[0018] Adjusting the height of the laser cleaning head to be the same as the height of the to-be-cleaned area of the to-be-cleaned cylindrical workpiece;

[0019] Starting the infrared distance measuring device and the control cabinet, and measuring the distance between the laser cleaning head and the to-be-cleaned area based on the infrared distance measuring device;

[0020] The control cabinet controls the laser cleaning head to perform the cleaning operation when the distance reaches a set value.

[0021] After the first cleaning is completed, performing cleaning inspection based on the laser light beam emitted by the laser cleaning head;

[0022] When the cleaning inspection result indicates that the cleaning result does not reach a set result, rotating the rotary table to control the laser cleaning head to perform secondary cleaning on the to-be-cleaned cylindrical workpiece.

[0023] Compared with the prior art, the embodiment of the present application has the advantages that: the embodiment of the present application measures the distance between the laser cleaning head and the surface of the workpiece to be cleaned by using the infrared distance measuring device, and adjusts the position of the laser cleaning head to the appropriate position by the control cabinet, so as to ensure the cleaning effect; the embodiment of the present application solves the problem of unqualified areas after one cleaning caused by workpiece deformation, accurately positions the unqualified areas after one cleaning and performs secondary cleaning, avoids the problem of uneven cleaning quality caused by inaccurate manual positioning, and effectively improves the surface quality of laser cleaning. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A structural schematic diagram of a laser cleaning equipment provided by the embodiment of the present application is shown in the figure.

[0025] Figure 2 A structural schematic diagram of a control cabinet provided by the embodiment of the present application is shown in the figure.

[0026] Figure 3 A structural schematic diagram of a laser cleaning head provided by the embodiment of the present application is shown in the figure.

[0027] Figure 4 A step flowchart of a cleaning method provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0028] Embodiment one

[0029] Reference Figure 1 A structural schematic diagram of a laser cleaning equipment provided by the embodiment of the present application is shown in the figure. As shown in the figures of Figure 1 , Figure 2 and Figure 3 , the laser cleaning equipment can include: a first centering protrusion 1, a second centering protrusion 2, a centering sliding block 3, a manual handle 4, a guide rail 5, a horizontal positioning plate 6, a rotary table 7, a base 8, a control cabinet 9, a laser cleaning head 10, and an infrared distance measuring device 11.

[0030] The equipment can fix the end face of the side of the workpiece to be cleaned with the horizontal positioning plate 6 as the reference, and can realize the centering positioning and fastening of workpieces with different diameters through the adjustment of the centering protrusions 1 and 2, the centering sliding block 3 and the manual handle 4, can realize the clamping of cylinder bodies with different lengths through the adjustment of the height of the first centering protrusion 1 on the guide rail 5, and can meet the laser cleaning needs of cylinder bodies with different lengths.

[0031] The above positioning and fastening device is connected with the rotary table 7, and the cleaning of the circumferential welding area of the cylinder body is realized by rotating the rotary table 7; the real-time measurement of the distance between the laser cleaning head and the surface to be cleaned is realized by the infrared distance measuring device 11, and the obtained distance data is fed back to the control cabinet 9, the control cabinet 9 can realize the control of the distance between the laser cleaning head and the surface to be cleaned and the start and stop of the laser cleaning program.

[0032] The present application can be used for laser cleaning of circumferential welding area of cylinder with different diameters and lengths.

[0033] The horizontal positioning plate 6, the first centering block 1, the second centering block 2, the centering slider 3, the manual handle 4 and the guide rail 5 are main clamping parts of the workpiece to be cleaned.

[0034] The first centering block 1 is located on the guide rail 5 and can slide up and down on the guide rail to adjust the height.

[0035] The second centering block 2 is fixed on the centering slider 3, and the centering slider 3 is moved by rotating the manual handle 4 to clamp workpieces with different diameters.

[0036] The guide rail 5 is two cylindrical stainless steel rods with a diameter of 15 mm, which are fixed on the centering slider 3 and penetrate the first centering block 1 and the second centering block 2.

[0037] The turntable 7 is connected with the horizontal positioning plate 6 and the base 8, and can drive the horizontal positioning plate 6 and the upper assembly to rotate 360°.

[0038] The infrared distance measuring device 11 is fixed on the laser cleaning head 10, and the infrared beam and the laser beam are located in the same plane to ensure accurate distance measurement.

[0039] The control cabinet 9 contains recording software, which can receive and record the data fed back by the infrared distance measuring device in real time, adjust the distance between the laser cleaning head and the workpiece surface, and control the start and stop of the laser cleaning program.

[0040] After the cylindrical workpiece is fixed by the process equipment, the control cabinet and the infrared distance measuring device can realize automatic laser focusing and secondary cleaning of the area not cleaned in place.

[0041] The specific use process of the equipment provided in the embodiment of the present application can include the following steps:

[0042] Step one, adjust the height of the first centering block 1 so that the height from the horizontal positioning plate 6 is not less than 2 / 3 of the total length of the cylinder workpiece to be cleaned, so as to ensure that the workpiece to be cleaned will not fall due to unstable center of gravity, then assemble the workpiece to be cleaned, place the workpiece to be cleaned on the horizontal positioning plate 6, and rotate the manual handle 4 so that the second centering block 2 tightly abuts against the cylinder workpiece to be cleaned, thereby completing the clamping of the workpiece to be cleaned.

[0043] Step two, after the workpiece is clamped, the height of the laser cleaning head 10 is adjusted to be the same as the height of the area to be cleaned, the infrared distance measuring device 11 and the control cabinet 9 are turned on, the infrared distance measuring device 11 feeds back the distance L1 between the laser cleaning head 10 and the surface to be cleaned to the control cabinet 9, the control cabinet 9 compares L1 with the focal length L0 of the laser beam, obtains the difference between the actual distance between the laser cleaning head 10 and the surface of the workpiece to be cleaned and the focal length of the laser beam by using the formula ΔL=L1-L0, if ΔL<0, the laser cleaning head 10 is controlled to move away from the surface of the workpiece to be cleaned by ΔL, if ΔL>0, the laser cleaning head 10 is controlled to move towards the surface of the workpiece to be cleaned by ΔL, during the adjustment of the laser cleaning head 10, the infrared distance measuring device 11 constantly feeds back the measured data to the control cabinet 9 until ΔL=0, the control cabinet 9 controls the laser cleaning head 10 to stop moving, then the control cabinet 9 controls the rotation of the turntable 7 and the light emission of the laser cleaning head 10, and the cleaning starts.

[0044] Step three, after the laser cleaning starts, the control cabinet 9 starts timing at the same time, and the distance measuring results fed back by the infrared distance measuring device 11 are corresponded with the time. The difference between the actual distance between the laser cleaning head 10 and the surface of the workpiece at each moment and the focal length of the laser beam is obtained by using the formula ΔL=L n -L0, compared with the focal depth h of the laser beam, if ΔL≤h, it proves that the cleaning at this position is in place and does not need to be cleaned twice; if ΔL>h, the time t n at this moment is recorded. n t n+1 , the area scanned by the laser at the moment t n ~t n+1 needs to be cleaned twice. The time period t n ~t n+1 (n=1, 3, 5, …) and t n (n=1, 3, 5, …) when the difference ΔL n (n=1, 3, 5, …) between the actual distance between the laser cleaning head and the surface of the workpiece and the focal length of the laser beam is recorded during the whole cleaning process.

[0045] Step four, after the first cleaning is completed, it is judged, if ΔL≤h during the whole cleaning process, the cleaning is qualified, steps one to three are repeated to clean the next workpiece; if n>0, the workpiece is cleaned twice, the turntable 7 is rotated, the laser cleaning head 10 only emits light during the time period t n ~t n+1 (n=1, 3, 5, …), and does not emit light at other times, at the same time, ΔL n (n=1, 3, 5, …) recorded during the first cleaning is judged, if ΔL n <0, the laser cleaning head 10 is controlled to move towards the surface of the workpiece to be cleaned by ΔL, if ΔL>0, the laser cleaning head 10 is controlled to move away from the surface of the workpiece to be cleaned by ΔL. nMove towards the direction away from the surface to be cleaned before the time arrives -ΔL n The distance, if ΔL n >0, then control the laser cleaning head 10 at t n Move ΔL towards the surface to be cleaned before the time arrives. n Repeat the above steps until all unqualified areas are cleaned.

[0046] Example 2

[0047] Reference Figure 4 The diagram illustrates a step flowchart of a cleaning method provided by an embodiment of the present invention, as follows: Figure 4 As shown, the cleaning method may include the following steps:

[0048] Step 401: Adjust the height of the first centering protrusion so that the height of the horizontal positioning plate matches the height of the workpiece to be cleaned, and place the workpiece to be cleaned on the horizontal positioning plate.

[0049] The embodiments of the present invention can be applied to the laser cleaning equipment in Embodiment 1 above.

[0050] During the cleaning process of the cylindrical workpiece, firstly, the height of the first centering protrusion can be adjusted so that its height from the horizontal positioning plate is not less than 2 / 3 of the total length of the cylindrical workpiece to be cleaned, ensuring that the workpiece to be cleaned will not tip over due to instability. Then, assemble the workpiece by placing it on the horizontal positioning plate and turning the manual crank handle until the second centering protrusion is just flush against the workpiece, completing the clamping of the cylindrical workpiece.

[0051] After clamping the cylinder to be cleaned, proceed to step 402.

[0052] Step 402: Adjust the height of the laser cleaning head to be the same as the height of the area to be cleaned on the workpiece cylinder.

[0053] After clamping the cylinder to be cleaned, the height of the laser cleaning head can be adjusted to be the same as the height of the area to be cleaned on the workpiece.

[0054] After adjusting the height of the laser cleaning head to be the same as the height of the area to be cleaned on the workpiece cylinder, proceed to step 403.

[0055] Step 403: Start the infrared ranging device and control cabinet, and measure the distance between the laser cleaning head and the area to be cleaned based on the infrared ranging device.

[0056] Step 404: When the distance reaches the set value, the control cabinet controls the laser cleaning head to perform the cleaning operation.

[0057] After the height of the laser cleaning head is adjusted to be the same as the height of the to-be-cleaned area of the to-be-cleaned cylindrical workpiece, the infrared distance measuring device and the control cabinet can be turned on, the infrared distance measuring device feeds back the distance L1 between the laser cleaning head and the to-be-cleaned surface to the control cabinet, the control cabinet compares L1 with the focal length L0 of the laser beam, obtains the difference between the actual distance between the laser cleaning head and the to-be-cleaned surface and the focal length of the laser beam by using the formula ΔL = L1 - L0, if ΔL < 0, the laser cleaning head is controlled to move away from the to-be-cleaned surface by ΔL, if ΔL > 0, the laser cleaning head is controlled to move towards the to-be-cleaned surface by ΔL, during the adjustment of the laser cleaning head, the infrared distance measuring device constantly feeds back the measured data to the control cabinet, until ΔL = 0, the control cabinet controls the laser cleaning head to stop moving, then the control cabinet controls the rotation table to rotate and the laser cleaning head to emit light, and the cleaning starts.

[0058] Step 405: After the first cleaning is completed, the cleaning inspection is performed based on the laser beam emitted by the laser cleaning head.

[0059] Step 406: When the cleaning inspection result indicates that the cleaning result does not reach the set result, the rotation table is rotated to control the laser cleaning head to perform secondary cleaning on the to-be-cleaned cylindrical workpiece.

[0060] After the laser cleaning starts, the control cabinet starts timing at the same time, and the ranging result fed back by the infrared distance measuring device is corresponded with the time. The formula ΔL = L n -L0 is used to obtain the difference between the actual distance between the laser cleaning head 10 and the surface of the workpiece and the focal length of the laser beam at each time, compared with the focal depth h of the laser beam, if ΔL ≤ h, it is proved that the cleaning at this position is in place, and secondary cleaning is not needed; if ΔL > h, the time t n at this time is recorded, and the area scanned by the laser at the time t n+1 is the unqualified area, which needs to be cleaned secondarily. n The time period t n+1 ~ t n (n = 1, 3, 5,...) and t n+1 (n = 1, 3, 5,...) in the entire cleaning process are recorded, and the difference ΔLn (n = 1, 3, 5,...) between the actual distance between the laser cleaning head and the surface of the workpiece and the focal length of the laser beam at the time t n (n = 1, 3, 5,...) is recorded.

[0061] After the first cleaning is completed, it is judged that, if ΔL ≤ h in the entire cleaning process, the cleaning is qualified, and the above steps are repeated to clean the next workpiece; if n > 0, the workpiece is cleaned secondarily, the rotation table 7 is rotated, and the laser cleaning head 10 only cleans at t n ~ t n+1(n = 1, 3, 5,...) light emitting period, the rest of the time no light emitting, while the first cleaning recorded ΔL n (n = 1, 3, 5,...) to determine, if ΔL n <0, then control the laser cleaning head 10 at t n The moment before reaching the direction away from the distance of ΔL n If ΔL n > 0, then control the laser cleaning head 10 at t n The moment before reaching the direction close to the distance of ΔL n The above steps are repeated until the entire cleaning of the unqualified area is completed

[0062] The specific embodiments described in the present application can enable those skilled in the art to more fully understand the present application, but in no way limit the present application. Therefore, those skilled in the art should understand that modifications or equivalent replacements of the present application can still be made; and all technical solutions and improvements that do not deviate from the spirit and technical essence of the present application should be covered in the protection scope of the present application patent.

[0063] The contents not described in detail in the specification of the present application belong to the common knowledge of those skilled in the art.

Claims

1. A laser cleaning method applied to a laser cleaning apparatus, characterized by, The laser cleaning equipment comprises a first centering protrusion, a second centering protrusion, a centering slider, a manual handle, a guide rail, a horizontal positioning plate, a rotary table, a base, a control cabinet, a laser cleaning head and an infrared distance measuring device, wherein The horizontal positioning plate is fixed on the base to fix a to-be-cleaned cylindrical workpiece; The guide rail is fixed on the centering slider, the first centering protrusion is arranged on the guide rail, the centering slider is arranged on the horizontal positioning plate, the second centering protrusion is fixed on the centering slider, and the manual handle is connected with the centering slider to control the movement of the centering slider to clamp the to-be-cleaned cylindrical workpiece; The rotary table is connected with the horizontal positioning plate and the base to drive the horizontal positioning plate to rotate; The infrared distance measuring device is fixed on the laser cleaning head to measure the distance between the laser cleaning head and the to-be-cleaned cylindrical workpiece; The control cabinet is connected with the laser cleaning head and the infrared distance measuring device to control the laser cleaning head to clean the to-be-cleaned cylindrical workpiece according to the distance measured by the infrared distance measuring device; The cleaning method comprises the following steps: Adjusting the height of the first centering protrusion to adapt the height of the horizontal positioning plate to the height of the to-be-cleaned cylindrical workpiece and placing the to-be-cleaned cylindrical workpiece on the horizontal positioning plate; Adjusting the height of the laser cleaning head to be the same as the height of the to-be-cleaned area of the to-be-cleaned cylindrical workpiece; Starting the infrared distance measuring device and the control cabinet and measuring the distance between the laser cleaning head and the to-be-cleaned area based on the infrared distance measuring device; When the distance reaches the set value, the control cabinet controls the laser cleaning head to perform a cleaning operation; after the laser cleaning starts, the control cabinet starts timing simultaneously and corresponds the ranging results feedback by the infrared ranging device with the time one by one; using the formula ΔL = L n - L0 to obtain the difference between the actual distance between the laser cleaning head and the workpiece surface and the laser beam focal length at each moment, and compare it with the laser beam depth of focus h. If ΔL ≤ h, it proves that the cleaning at this position is in place and no secondary cleaning is required; if ΔL > h, record the time t n , starting from t n , until the next moment t when ΔL < h n+1 , t n ~t n+1 The area scanned by the laser at this moment is the unqualified area and needs to be cleaned twice; record the time period t n ~t n+1 , n = 1, \alpha, 5, … and t n , n = 1, \alpha, 5, … The difference ΔL n between the actual distance between the laser cleaning head and the workpiece surface and the laser beam focal length at these moments, n = 1, \alpha, 5, …; It should be noted that there are some unclear symbols like "\alpha" in the original text which might be incorrect or need further clarification. If this is a specific symbol with a defined meaning in the relevant context, it should be translated accurately according to that meaning. Here I just translated it as "\alpha" as it's not clear what it represents. After the first cleaning is completed, performing cleaning inspection based on the laser beam emitted by the laser cleaning head; if ΔL≤h during the whole cleaning process, the cleaning is qualified; When the cleaning inspection result indicates that the cleaning result does not reach the set result, the rotary table is rotated to control the laser cleaning head to perform secondary cleaning on the to-be-cleaned cylinder. During the secondary cleaning, the laser cleaning head only emits light during the time period t n ~ t n+1 , n = 1, 3, 5, …, and the rest of the time does not emit light. Meanwhile, the ΔL n recorded during the first cleaning is judged. If ΔL n < 0, the laser cleaning head is controlled to move a distance of -ΔL n away from the to-be-cleaned surface before reaching the time t n . If ΔL n > 0, the laser cleaning head is controlled to move a distance of ΔL n towards the to-be-cleaned surface before reaching the time t n . The above steps are repeated until all unqualified areas are cleaned.

2. The laser cleaning method of claim 1, wherein, The guide rail is two cylindrical stainless steel guide rails, and the diameter of the guide rail is 15 mm.

3. The laser cleaning method of claim 1, wherein, The guide rail is fixed on the centering slider and penetrates through the first centering protrusion and the second centering protrusion.

4. The laser cleaning method of claim 1, wherein, The infrared beam of the infrared distance measuring device and the laser beam of the laser cleaning head are located on the same plane.

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