Two-dimensional material transfer apparatus and two-dimensional material transfer method

Abstract

The application belongs to the technical field of two-dimensional material processing and preparation, and particularly relates to a two-dimensional material transfer device and a two-dimensional material transfer method. The two-dimensional material transfer device of the application comprises a two-dimensional material attaching module, the two-dimensional material attaching module comprises a first positioning unit for placing a growth substrate and a second positioning unit for fixing a target substrate, a two-dimensional material transfer module is arranged adjacent to the two-dimensional material attaching module, the two-dimensional material transfer module has a solution pool for storing a dissolving solution, the second positioning unit is movable to a first station to attach the growth substrate to the target substrate, and the second positioning unit is further movable to a second station to immerse the growth substrate in the solution pool. The device can realize the combination of the growth substrate and the target substrate and the removal of the growth substrate on the same device, and can automatically complete most steps of two-dimensional material transfer, thereby greatly improving the transfer efficiency. Meanwhile, large-area transfer of two-dimensional material can be realized.

Description

Technical Field

[0001] This application belongs to the field of two-dimensional material processing and preparation technology, specifically relating to a two-dimensional material transfer device and a two-dimensional material transfer method. Background Technology

[0002] Two-dimensional materials are materials in which electrons can move freely in only two dimensions at the nanoscale (planar motion), such as nanofilms, superlattices, and quantum wells. Due to their excellent physicochemical properties, two-dimensional materials have enormous application potential in the fields of electronics, optoelectronics, and sensing. Today, two-dimensional materials have become the "darling" of industry and academia.

[0003] Before performing processes such as photolithography and etching on two-dimensional materials, they need to be transferred from the growth substrate to the target substrate. However, there is a severe lack of related processes and equipment in the industry. Existing solutions are mostly transfer methods used in laboratories for experiments, which have low transfer efficiency and small transfer area, and are prone to damaging two-dimensional materials, and cannot achieve the high-efficiency, wafer-level transfer required by the industry. Summary of the Invention

[0004] This application provides a two-dimensional material transfer device that can solve the technical problems of low efficiency and low industrialization of two-dimensional material transfer, and can realize large-area transfer of two-dimensional materials.

[0005] This application also provides a two-dimensional material transfer method that can solve the technical problems of low two-dimensional material transfer efficiency and difficulty in cleaning after transfer.

[0006] On one hand, embodiments of this application provide a two-dimensional material transfer device, including...

[0007] The two-dimensional material bonding module includes a first positioning unit for placing a growth substrate on which two-dimensional materials have been grown, and a second positioning unit for fixing a target substrate.

[0008] A two-dimensional material transfer module is arranged adjacent to the two-dimensional material bonding module. The two-dimensional material transfer module has a solution pool for storing the dissolving liquid.

[0009] The second positioning unit can move along a preset path to the first station to make the growth substrate fit with the target substrate. The second positioning unit can also move along a preset path to the second station to immerse the growth substrate in the solution pool.

[0010] According to the first aspect of this application, a two-dimensional material bonding module and a two-dimensional material transfer module are disposed on a base.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the solution pool and the first positioning unit are arranged adjacent to each other on the base.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the second positioning unit is disposed on the base by a moving mechanism, the moving mechanism including a first moving mechanism that can move along a first direction and a second moving mechanism that can move along a second direction.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the first direction is perpendicular to the surface of the base, the second direction is parallel to the surface of the base, the second moving mechanism is disposed on the base, the first moving mechanism is disposed on the second moving mechanism, and the second positioning unit is disposed on the first moving mechanism.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the second positioning unit includes

[0015] The first adsorption component for adsorbing the target substrate.

[0016] A second adsorption component for generating adsorption force on the growth substrate placed on the first positioning unit.

[0017] The second adsorption component is located on the side of the first adsorption component that is away from the second positioning unit.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the first adsorption component includes a push-pull suction cup and a push-pull seat for providing a push-pull track for the suction cup. The suction cup is used to adsorb a target substrate, and the surface of the suction cup used to adsorb the target substrate faces the second positioning unit.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the surface of the suction cup for adsorbing the target substrate is provided with an annular groove, and a vacuum channel connecting the annular groove and an external vacuum device is provided inside the suction cup.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the second adsorption component includes an electromagnet, an electrostatic generator, or a van der Waals stamp.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the first positioning unit includes a support plate for placing a growth substrate, the support plate being rotatably mounted on a base via a support assembly.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the support assembly includes a flexible universal joint for supporting the load-bearing plate.

[0023] or

[0024] The support assembly includes a flexible universal joint for supporting the load-bearing plate, and springs distributed around the outer periphery of the flexible universal joint, with one end of the springs connected to the load-bearing plate and the other end connected to the base.

[0025] or

[0026] The support assembly includes multiple springs for supporting the support plate, with one end of the springs connected to the support plate and the other end connected to the base.

[0027] According to any of the foregoing embodiments of the first aspect of this application, guide protrusions that cooperate with the push-pull track on the push-pull base are provided on opposite sides of the suction cup.

[0028] According to any of the foregoing embodiments of the first aspect of this application, a limiting block is provided on the push-pull base to restrict the pushing stroke of the suction cup towards the push-pull base.

[0029] and / or

[0030] Locking screws for securing the suction cups are provided on the push-pull rail.

[0031] Secondly, embodiments of this application provide a two-dimensional material transfer method, applied to the two-dimensional material transfer apparatus as described above, including...

[0032] The target substrate is fixed on the second positioning unit.

[0033] The growth substrate on which the two-dimensional material has been grown is placed on the first positioning unit.

[0034] The second positioning unit is controlled to move to the first station so that the target substrate is attached to the growth substrate.

[0035] The second positioning unit is controlled to move to the second station so that the growth substrate is immersed in the dissolution solution in the dissolution tank.

[0036] After the dissolving solution has completely reacted with the growth substrate, the second positioning unit is controlled to leave the dissolving tank.

[0037] According to the embodiments of the second aspect of this application, the dissolving solution is FeCl3 solution, NaOH solution, or KOH solution, and / or the growth substrate is made of copper, nickel, or sapphire.

[0038] The two-dimensional material transfer device of this application embodiment, through a second positioning unit that can move between different workstations, enables the bonding of the growth substrate and the target substrate and the removal of the growth substrate on the same device, and can automatically complete most of the steps of two-dimensional material transfer, greatly improving the transfer efficiency.

[0039] The two-dimensional material transfer method of this application moves the bonded growth substrate and target substrate into a dissolution pool, controls the immersion of the growth substrate in the dissolution solution, avoids unnecessary separation between the target substrate and the dissolution solution, makes subsequent cleaning easier, and improves transfer efficiency. Attached Figure Description

[0040] Figure 1This is a schematic diagram of the structure of a two-dimensional material transfer device provided in one embodiment of this application;

[0041] Figure 2 This is a schematic diagram showing the bonding of the growth substrate and the target substrate;

[0042] Figure 3 This is a partial structural schematic diagram of a two-dimensional material transfer device provided in one embodiment of this application;

[0043] Figure 4 This is a partial structural schematic diagram of a two-dimensional material transfer device provided in one embodiment of this application;

[0044] Figure 5 This is a partial structural schematic diagram of a two-dimensional material transfer device provided in one embodiment of this application. Detailed Implementation

[0045] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0046] Please refer to Figure 1 and Figure 2 The two-dimensional material transfer apparatus 100 provided in the first aspect of this application includes a two-dimensional material bonding module 1 and a two-dimensional material transfer module 2. The two-dimensional material bonding module 1 can bond two different thin film materials together, and the two-dimensional material transfer module 2 is used to remove a portion of the two thin film materials bonded together. The thin film materials can be a growth substrate S2 on which two-dimensional material S1 is grown and a target substrate S3 to receive the transferred two-dimensional material S1. Based on this, the two-dimensional material bonding module 1 is used to bond the growth substrate S2 and the target substrate S3 together to form a... Figure 2 In the aforementioned thin film stack, the two-dimensional material S1 is located between the growth substrate S2 and the target substrate S3, and is bonded to the target substrate S3; the two-dimensional material transfer module 2 is used to remove the growth substrate S2 from the bonded thin film stack, leaving the bonded two-dimensional material S1 and the target substrate S3, and finally realizes the transfer of the two-dimensional material S1 from the growth substrate S2 to the target substrate S3.

[0047] Please continue reading. Figure 1 and Figure 2The two-dimensional material bonding module 1 and the two-dimensional material transfer module 2 are arranged adjacent to each other. The two-dimensional material bonding module 1 includes a first positioning unit 11 and a second positioning unit 12. The first positioning unit 11 is used to place the growth substrate S2 on which the two-dimensional material S1 is grown, and the second positioning unit 12 is used to fix the target substrate S3. The two-dimensional material transfer module 2 has a solution pool 21 for storing the dissolving liquid. The second positioning unit 12 can move along a preset path to the first station and the second station. At the first station, the bonding of the growth substrate S2 and the target substrate S3 is completed. At the second station, the growth substrate can be immersed in the solution pool and the dissolving liquid in the solution pool 21 is used to dissolve the growth substrate S2, leaving only the two-dimensional material S1 and the target substrate S3.

[0048] The two-dimensional material transfer apparatus 100 disclosed in this application utilizes a second positioning unit 12 that can move between different workstations to achieve the bonding of the growth substrate and the target substrate as well as the removal of the growth substrate on the same device. It can automatically complete most of the steps of two-dimensional material transfer, greatly improving the transfer efficiency.

[0049] Please continue reading. Figure 1 In some embodiments, the two-dimensional material bonding module 1 and the two-dimensional material transfer module 2 are disposed on the base 3. The solution pool 21 and the first positioning unit 11 are disposed adjacent to each other; preferably, the solution pool 21 and the first positioning unit 11 are disposed adjacent to each other on the base 3. The first station is mainly located at the location of the first positioning unit 11, and the second station is mainly located at the location of the solution pool 21. By disposing the first positioning unit 11 and the solution pool 21 adjacent to each other, the first station and the second station are adjacent to each other, which can reduce the movement of the second positioning unit 12 and improve the transportation efficiency.

[0050] Please see Figure 1 , Figure 3 and Figure 4 In some embodiments, the second positioning unit 12 is mounted on the base 3 via a moving mechanism, which includes a first moving mechanism 13 and a second moving mechanism 14. The first moving mechanism 13 can move along a first direction, and the second moving mechanism 14 can move along a second direction, thereby enabling the second positioning unit 12 to move in two dimensions to transfer between the first and second workstations. Alternatively, the moving mechanism may also include a third moving mechanism (not shown in the figure), which can move along a third direction, thereby enabling the second positioning unit 12 to move in three dimensions. The movement dimension of the second positioning unit 12 can be determined according to the specific application.

[0051] Please continue reading. Figure 1In some embodiments, the first direction is perpendicular to the surface of the base 3, the second direction is parallel to the surface of the base 3, the second moving mechanism 14 is disposed on the base, the first moving mechanism 13 is disposed on the second moving mechanism 14, and the second positioning unit 12 is disposed on the first moving mechanism 13. Figure 1 In the indicated orientation, the second positioning unit 12 can move up and down through the first moving mechanism 13 to move closer to or away from the first positioning unit 11 and the solution pool 21; the second positioning unit 12 can move horizontally through the second moving mechanism 14 to transfer between the solution pool 21 and the first positioning unit 11.

[0052] There are various ways to implement the first moving mechanism 13 and the second moving mechanism 14, for example, Figure 4 As shown, the second moving mechanism 14 is slidably mounted on the base 3 via a slide rail, thereby driving the first moving mechanism 13 and the second positioning unit 12 to move in the horizontal direction; similarly, the first moving mechanism 13 is slidably mounted on the second moving mechanism 14 via a slide rail, and the second positioning unit 12 is mounted on the first moving mechanism 13, thereby driving the second positioning unit 12 to move in the vertical direction.

[0053] exist Figure 3 and Figure 4 In the embodiment shown, the second moving mechanism 14 includes a vertically arranged moving plate 141, which can move along a track arranged on the base 3; a track 142 extending in a vertical direction is provided on the moving plate, which cooperates with the first moving mechanism 13 so that the first moving mechanism 13 can slide along the vertically extended track 142.

[0054] Please see Figure 4In some embodiments, the second positioning unit 12 includes a first adsorption component 121 and a second adsorption component 122. The first adsorption component 121 is used to adsorb the target substrate S3, and the second adsorption component 122 is used to generate an adsorption force on the growth substrate S2 placed on the first positioning unit 11 to adsorb the growth substrate S2. The second adsorption component 122 is located on the side of the first adsorption component 121 away from the second positioning unit 12. The first adsorption component 121 directly contacts the target substrate S3 and adsorbs the target substrate S3; the second adsorption component 122 does not directly contact the growth substrate S2, but adsorbs the growth substrate S2 by generating an adsorption force, so that the growth substrate S2 and the target substrate S3 are attached together, while the two-dimensional material S1 is located on the surface of the growth substrate S2 facing the target substrate S3. By setting the first adsorption component 121 and the second adsorption component 122 respectively, the time for the first adsorption component 121 and the second adsorption component 122 to generate the adsorption force can be controlled separately, so that the target substrate S3 can be adsorbed separately at different stages, or the target substrate S3 and the growth substrate S2 can be adsorbed simultaneously. Meanwhile, by setting up a large-area first adsorption component 121 and a large-area second adsorption component 122, large-area transfer of two-dimensional materials can also be achieved.

[0055] Please continue reading. Figure 4 In some embodiments, the first adsorption component 121 includes a suction cup 1211. An annular groove 1211a is provided on the surface of the suction cup 1211 facing the first positioning unit 11. A vacuum channel (not shown in the figure) is provided inside the suction cup 1211, connecting the annular groove 1211a and an external vacuum device. The vacuum channel is connected to the external vacuum device via a pipe 1211b. The surface of the suction cup 1211 facing the first positioning unit 11 is the adsorption surface 1211c for adsorbing the target substrate S3. The surface of the adsorption surface 1211c can be a finely machined surface to improve the adhesion between the adsorption surface 1211c and the target substrate S3. In use, the target substrate S3 is placed on the adsorption surface 1211c, and the external vacuum device is controlled to create a vacuum environment between the annular groove 1211a and the target substrate S3, thereby adsorbing the target substrate S3. Of course, other methods can also be used to adsorb the target substrate S3, such as electrostatic adsorption.

[0056] Please continue reading. Figure 3In some embodiments, the suction cup 1211 is a push-pull type, and the first adsorption component 121 further includes a push-pull seat 1212 for providing a push-pull track 1212a for the suction cup 1211. Similar to a drawer, the suction cup 1211 can be pulled out from the push-pull seat 1212 or pushed into the push-pull seat 1212. When it is necessary to attach the target substrate S3 to the suction cup 1211, the suction cup 1211 is pulled out, the target substrate S3 is attached to the adsorption surface 1211c of the suction cup 1211, the external vacuum device is controlled to work, and the target substrate S3 is adsorbed by negative pressure. After the target substrate S3 is stably adsorbed on the adsorption surface 1211c, the suction cup 1211 is pushed into the push-pull seat 1212 for the next step of attaching with the growth substrate S2. Of course, the suction cup 1211 can be converted to different positions in other ways. For example, the suction cup 1211 can also be set as a flip-type or rotating structure.

[0057] Depending on the material of the growth substrate, different types of second adsorption components 122 can be selected. For example, if the growth substrate is made of nickel, the second adsorption component 122 can be an electromagnet; if the growth substrate is made of copper, the second adsorption component 122 can also be an electrostatic generator to generate an electrostatic force that can adsorb copper foil. The second adsorption component 122 can also be a van der Waals stamp.

[0058] Please see Figure 5 In some embodiments, the first positioning unit 11 includes a support plate 111 for placing the growth substrate S2, the support plate 111 being rotatably mounted on the base 3 via a support assembly 112. The support assembly 112 keeps the support plate 111 generally horizontal, but it can tilt under the action of external force.

[0059] Specifically, there are various ways to implement the support component 112. For example, the support component 112 can be a flexible universal joint, and the bearing plate 111 is set on the base 3 through the flexible universal joint.

[0060] For example, the support assembly 112 includes a flexible universal joint 1121 for supporting the bearing plate 111, and springs 1122 distributed around the outer periphery of the flexible universal joint 1121. One end of the spring 1122 is connected to the bearing plate 111, and the other end is connected to the base 3. The spring 1122 can be a preload spring or a tension spring.

[0061] For example, the support assembly 112 includes multiple springs for supporting the carrier plate 111, with one end of the springs connected to the carrier plate 111 and the other end connected to the base 3.

[0062] The support components 112 with the above-mentioned structural forms can make the bearing plate 111 roughly horizontal. Due to the rotatability and compressibility of the flexible universal joint and spring, the bearing plate 111 can be adaptively tilted under the action of external force.

[0063] When the second positioning unit 12 moves along the preset path to the first station, bringing the target substrate S3 to fit with the growth substrate S2, and exerts a force on the carrier plate 111, the carrier plate 111 will tilt, so that the target substrate S3 and the growth substrate S2 are tightly fitted together.

[0064] Please continue reading. Figure 4 In some embodiments, guide protrusions 1211d are provided on opposite sides of the suction cup 1211 to cooperate with the push-pull rail on the push-pull base 1212. Of course, rollers can also be provided on opposite sides of the suction cup 1211 to cooperate with the push-pull rail on the push-pull base 1212.

[0065] Please continue reading. Figure 3 In some embodiments, in order to precisely control the position of the suction cup 1211 being pushed into the push-pull seat 1212, a limit block 1212b is provided on the push-pull seat 1212. The limit block 1212b is located on the path of the suction cup 1211 advancing into the push-pull seat 1212. When the suction cup 1211 is pushed to the position where it abuts against the limit block 1212b, the suction cup 1211 cannot be pushed further, thereby limiting the advancing stroke of the suction cup 1211 into the push-pull seat 1212.

[0066] Please continue reading. Figure 3 In some embodiments, in order to fix the suction cup 1211 after it is pushed into the push-pull seat 1212, a locking screw 1212c for locking the suction cup 1211 is provided on the push-pull rail. When the suction cup 1211 is pushed into place, tightening the locking screw 1212c can fix the suction cup 1211.

[0067] The two-dimensional material transfer method provided in the first aspect of this application, applied to the two-dimensional material transfer apparatus described above, includes the following steps:

[0068] S1. Fix the target substrate S3 onto the second positioning unit 12;

[0069] S2. Place the growth substrate S2 on which the two-dimensional material S1 has been grown on the first positioning unit 11;

[0070] S3. Control the second positioning unit 12 to move to the first station so that the target substrate S3 is attached to the growth substrate S2;

[0071] S4. Control the second positioning unit 12 to move to the second station so that the growth substrate S2 is immersed in the dissolving solution in the dissolving pool.

[0072] S5. After the dissolving solution has completely reacted with the growth substrate, control the second positioning unit 12 to leave the dissolving pool.

[0073] The two-dimensional material transfer method in this embodiment moves the bonded growth substrate and target substrate into the dissolution pool, controls the immersion of the growth substrate in the dissolution solution, avoids unnecessary separation between the target substrate and the dissolution solution, makes subsequent cleaning easier, and improves transfer efficiency.

[0074] In some embodiments, the dissolving solution is an FeCl3 solution. In some embodiments, the growth substrate is made of nickel. The FeCl3 solution reacts away the nickel, leaving the two-dimensional material S1 and the target substrate S3. The dissolving solution can also be a NaOH solution or a KOH solution. The growth substrate can also be made of copper or sapphire.

[0075] by Figure 1 Taking the two-dimensional material transfer device shown as an example, the usage of the two-dimensional material transfer device will be explained:

[0076] 1. First, pull out the suction cup 1211, place the target substrate S3 on the adsorption surface 1211c of the suction cup 1211, and use the external vacuum device to adsorb and fix the target substrate S3; then push the suction cup 1211 back into the push-pull seat 1212; tighten the hand locking screw 1212c to fix the suction cup 1211.

[0077] 2. Raise the first adsorption component 121 to provide operating space for placing the growth substrate S2; place the growth substrate S2 (nickel substrate) on the support plate 111 with two-dimensional material S1 (such as graphene) grown on it.

[0078] 3. Lower the first adsorption component 121, and the suction cup 1211 presses down to contact the support plate 111. At this time, the support plate 111 will tilt, so that the target substrate S3 and the growth substrate S2 are tightly attached. Then the second adsorption component 122 (electromagnet) is energized, and the growth substrate S2 is subjected to magnetic force to keep it tightly attached to the target substrate S3.

[0079] 4. Raise the first adsorption component 121 and move the displacement stage toward the solution pool 21. Due to the magnetic force generated by the second adsorption component 122, the growth substrate S2 moves with the target substrate S3. When it moves above the solution pool 21, the first adsorption component 121 descends and immerses the substrate portion of the growth substrate S2 in the solution pool until the substrate portion is completely reacted by the dissolving liquid, after which the first adsorption component 121 rises.

[0080] 5. Finally, loosen the locking screw 1212c, pull out the suction cup 1211, release the pressure to break the vacuum in the annular groove 1211a, remove the target substrate S3, and clean it to complete the transfer.

Claims

1. A two-dimensional material transfer device, characterized in that: include A two-dimensional material bonding module, comprising a first positioning unit for placing a growth substrate on which two-dimensional materials have been grown, and a second positioning unit for fixing a target substrate. A two-dimensional material transfer module is disposed adjacent to the two-dimensional material bonding module. The two-dimensional material transfer module has a solution pool for storing the dissolving liquid. The second positioning unit can move along a preset path to the first station to make the growth substrate fit with the target substrate. The second positioning unit can also move along a preset path to the second station to immerse the growth substrate in the solution pool.

2. The two-dimensional material transfer device according to claim 1, characterized in that: The two-dimensional material bonding module and the two-dimensional material transfer module are disposed on the base.

3. The two-dimensional material transfer device according to claim 2, characterized in that: The solution pool and the first positioning unit are arranged adjacent to each other on the base.

4. The two-dimensional material transfer device according to claim 2, characterized in that: The second positioning unit is mounted on the base via a moving mechanism, which includes a first moving mechanism that can move along a first direction and a second moving mechanism that can move along a second direction.

5. The two-dimensional material transfer device according to claim 4, characterized in that: The first direction is perpendicular to the surface of the base, the second direction is parallel to the surface of the base, the second moving mechanism is disposed on the base, the first moving mechanism is disposed on the second moving mechanism, and the second positioning unit is disposed on the first moving mechanism.

6. The two-dimensional material transfer device according to claim 1, characterized in that: The second positioning unit includes The first adsorption component for adsorbing the target substrate. A second adsorption component for generating adsorption force on the growth substrate placed on the first positioning unit. The second adsorption component is located on the side of the first adsorption component that is away from the second positioning unit.

7. The two-dimensional material transfer device according to claim 6, characterized in that: The first adsorption component includes a push-pull suction cup and a push-pull seat for providing a push-pull track for the suction cup. The suction cup is used to adsorb a target substrate, and the surface of the suction cup used to adsorb the target substrate faces the second positioning unit.

8. The two-dimensional material transfer device according to claim 7, characterized in that: The suction cup has an annular groove on its surface for adsorbing the target substrate, and a vacuum channel connecting the annular groove and an external vacuum device is provided inside the suction cup.

9. The two-dimensional material transfer device according to claim 6, characterized in that: The second adsorption component includes an electromagnet, an electrostatic generator, or a van der Waals stamp.

10. The two-dimensional material transfer device according to claim 2, characterized in that: The first positioning unit includes a support plate for placing the growth substrate, the support plate being rotatably mounted on the base via a support assembly.

11. The two-dimensional material transfer device according to claim 10, characterized in that: The support assembly includes a flexible universal joint for supporting the load-bearing plate. or The support assembly includes a flexible universal joint for supporting the bearing plate, and springs distributed around the outer periphery of the flexible universal joint, one end of the springs being connected to the bearing plate and the other end being connected to the base. or The support assembly includes multiple springs for supporting the support plate, with one end of each spring connected to the support plate and the other end connected to the base.

12. The two-dimensional material transfer device according to claim 7, characterized in that: The suction cup has guide ridges on its opposite sides that cooperate with the push-pull track on the push-pull base.

13. The two-dimensional material transfer device according to claim 12, characterized in that: A limiting block is provided on the push-pull base to restrict the pushing stroke of the suction cup towards the push-pull base. and / or The push-pull rail is equipped with locking screws for locking the suction cup.

14. A two-dimensional material transfer method, applied to the two-dimensional material transfer apparatus as described in any one of claims 1 to 13, characterized in that: The method includes The target substrate is fixed on the second positioning unit. The growth substrate on which the two-dimensional material has been grown is placed on the first positioning unit. The second positioning unit is controlled to move to the first station so that the target substrate fits into the growth substrate. The second positioning unit is controlled to move to the second work station so that the growth substrate is immersed in the dissolution solution in the dissolution tank. After the dissolving solution has completely reacted with the growth substrate, the second positioning unit is controlled to leave the dissolving tank.

15. The two-dimensional material transfer method according to claim 14, characterized in that: The dissolving solution is FeCl3 solution, NaOH solution, or KOH solution. And / or, The growth substrate is made of copper, nickel, or sapphire.

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