Edge-removed glass and forming method thereof

Abstract

The present invention relates to edge-defilmed glass and a forming method thereof. The edge-defilmed glass comprises a glass plate, at least one surface of which is provided with a transparent conductive film; the surface of the glass plate provided with the transparent conductive film comprises a coating area and a defilming area, the defilming area is located at the edge of the glass plate, the transparent conductive film in the defilming area is completely removed and / or partially removed, and the width x of the defilming area is ≥ 10 mm; the glass plate also comprises a mold contact area located at the edge, the mold contact area at least partially overlaps with the defilming area, and the width y of the mold contact area is less than x. In the present invention, the width of the defilming area at the edge of the glass plate of the edge-defilmed glass is greater than the width of the mold contact area, so that the area with the largest tensile stress formed by the mold contact area can overlap with the compressive stress formed by the defilming area, thereby reducing the overall tensile stress of the glass plate, improving the overall strength of the glass, and reducing the risk of edge breakage of the glass plate.

Description

Technical Field

[0001] The present invention relates to the technical field of glass. Background Art

[0002] For glass coated with transparent conductive film, if the film is not removed at the edge of the glass plate, after the glass plates are combined to form laminated glass, the coated edge will be exposed to the air and will oxidize and discolor, or even corrode the film layer, which will lead to a reduction in the conductive cross-sectional area and the generation of hot spots, which may lead to a series of risks in use.

[0003] However, after the film is removed from the edge of the glass plate, the glass plate undergoes a high-temperature heat treatment of at least 560°C and a bending forming treatment. During the cooling and annealing process, the tensile stress generated by the contact between the glass plate and the annealing mold will be superimposed on the tensile stress generated by the film removal, resulting in an increase in the overall tensile stress of the glass plate, and thereby an increased risk of cracking at the edge of the glass plate. Summary of the invention

[0004] In order to overcome the defects of the prior art mentioned above, the technical problem to be solved by the present invention is how to reduce the risk of edge breakage of the film-removed edge glass plate.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: an edge-de-filmed glass, comprising: a glass plate, at least one surface of which is provided with a transparent conductive film;

[0006] The surface of the glass plate provided with the transparent conductive film comprises a coating area and a film removal area, the film removal area is located at the edge of the glass plate, the transparent conductive film in the film removal area is completely removed and / or partially removed, and the width x of the film removal area is ≥ 10 mm;

[0007] The glass plate includes an edge compressive stress zone and an edge tensile stress zone in sequence from the edge of the glass plate inward, the compressive stress of the edge compressive stress zone is greater than or equal to 9 MPa, and the tensile stress of the edge tensile stress zone is less than or equal to 7 MPa.

[0008] Furthermore, the glass plate includes a coating compressive stress zone and a coating tensile stress zone adjacent to the coating compressive stress zone and located on a side of the coating compressive stress zone away from an edge of the glass plate. The glass plate also includes a mold compressive stress zone and a mold tensile stress zone adjacent to the mold compressive stress zone and located on a side of the mold compressive stress zone away from an edge of the glass plate. The coating compressive stress zone and the mold tensile stress zone at least partially overlap.

[0009] Furthermore, the edge compressive stress zone includes an overlapping area of ​​the coating compressive stress zone and the mold compressive stress zone, and the edge tensile stress zone includes an overlapping area of ​​the coating tensile stress zone and the mold tensile stress zone and an overlapping area of ​​the coating compressive stress zone and the mold tensile stress zone.

[0010] Furthermore, the glass plate also includes a mold contact area located at the edge, the mold contact area at least partially overlaps with the film removal area, and the width of the mold contact area y<x, the coating compressive stress area is located in the film removal area, and the mold compressive stress area is located in the mold contact area.

[0011] Furthermore, the width of the coating compressive stress zone is the same as that of the film removal zone, and the width of the coating tensile stress zone is 30 to 90 mm; the width of the mold compressive stress zone is the same as that of the mold contact zone, and the width of the mold tensile stress zone is 10 to 20 mm.

[0012] Furthermore, the width y of the mold contact area is 8 to 12 mm.

[0013] Furthermore, the width of the mold contact area is y≤x-5mm.

[0014] Furthermore, the width of the mold contact area y≤x-10mm.

[0015] Furthermore, the width of the mold contact area y≤x-15mm.

[0016] Furthermore, the width x of the film removal zone is 20 to 40 mm.

[0017] Furthermore, the film removal area includes a complete film removal area close to the edge of the glass plate and a partial film removal area close to the coating area, and the width of the partial film removal area is 0 to 5 mm.

[0018] Furthermore, the compressive stress of the edge compressive stress zone is greater than or equal to 25 MPa, and the tensile stress of the edge tensile stress zone is less than or equal to 6 MPa.

[0019] The beneficial effect of the edge-defilmed glass of the present invention is that the width of the defilmed area at the edge of the glass is changed, so that the distribution of the tensile stress band and the compressive stress band at the edge of the glass plate is changed, thereby reducing the maximum tensile stress at the edge of the glass plate, thereby reducing the overall tensile stress of the glass plate, improving the overall strength of the glass, and reducing the risk of edge breakage of the glass plate.

[0020] Another technical solution adopted by the present invention is: a method for forming edge-removed glass, characterized in that it comprises the following steps:

[0021] Plating a transparent conductive film on the surface of the glass plate;

[0022] Completely and / or partially remove the transparent conductive film located at the edge of the glass plate to form a film removal area and a film coating area, wherein the width x of the film removal area is ≥ 10 mm;

[0023] The glass plate after film removal is heated, bent and cooled for annealing, so that the edge of the glass plate forms an edge compressive stress zone with a compressive stress greater than or equal to 9 MPa and an edge tensile stress zone with a tensile stress less than or equal to 7 MPa.

[0024] Furthermore, the area where the mold contacts the edge of the glass plate during cooling and annealing is the mold contact area, the width of the mold contact area is y, the mold contact area at least partially overlaps with the film removal area, and the width of the mold contact area y<x.

[0025] Furthermore, the width y of the mold contact area is 8 to 12 mm.

[0026] Furthermore, the width x of the film removal zone is 20 to 40 mm.

[0027] Furthermore, the width y of the mold contact area and the width x of the film removal area satisfy y≤x-5mm.

[0028] Furthermore, during the cooling and annealing process of the glass plate, the contact position between the mold and the edge of the glass plate is heated and kept warm.

[0029] Furthermore, the step of completely and / or partially removing the transparent conductive film at the edge of the glass plate to form a film removal area and a film coating area comprises the following steps:

[0030] Determine the location of the film removal area and the coating area;

[0031] The film removal area includes a complete film removal area near the edge of the glass plate and a partial film removal area near the coating area, wherein the transparent conductive film in the complete film removal area is completely removed, and the transparent conductive film in the partial film removal area is partially removed.

[0032] The beneficial effect of the edge film-removed glass forming method of the present invention is that by controlling the width of the glass plate film removal, the stress area formed by the contact between the mold and the glass plate during the annealing process of the glass plate overlaps or offsets the stress area formed by the film removal, thereby forming a new stress distribution at the edge of the glass plate, reducing the overall edge tensile stress of the glass plate, thereby reducing the risk of the glass plate breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 The figure shows the structure schematic diagram of the edge film removal glass in the present invention;

[0034] Figure 2 The figure shows a schematic diagram of the cooling annealing process of the edge film-removed glass in the present invention;

[0035] Figure 3 The figure shows the stress distribution diagram of the edge-film-removed glass in the present invention;

[0036] Figure 4 The figure shows a schematic diagram of the film removal area of ​​the edge film removal glass in the present invention;

[0037] Description of labels:

[0038] 1. Glass plate; 2. Transparent conductive film; 3. Coating area; 4. De-coating area; 41. Complete de-coating area; 42. Partial de-coating area; 5. Mold contact area; 6. Coating compressive stress area; 7. Coating tensile stress area; 8. Mold compressive stress area; 9. Mold tensile stress area; 10. Annealing mold; 11. Heating and heat preservation device. DETAILED DESCRIPTION

[0039] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.

[0040] Please refer to Figure 1 and Figure 2 As shown, Figure 1 The edge-film-removed glass of the present invention is shown from a top view, comprising: a glass plate 1, wherein a transparent conductive film 2 is provided on at least one surface of the glass plate 1;

[0041] The surface of the glass plate 1 provided with the transparent conductive film 2 includes a coating area 3 and a film removal area 4, wherein the film removal area 4 is located at the edge of the glass plate 1, and the transparent conductive film 2 in the film removal area 4 is completely removed and / or partially removed, and the width x of the film removal area 4 is ≥ 10 mm; in addition, Figure 1 It is also shown that the film removal area 4 is arranged around the coating area 3, that is, the outer boundary of the coating area 3 is defined by the film removal area 4. In some embodiments, the width of the film removal area 4 may not be completely equal to that of other parts in some parts. In addition, Figure 1 The glass plate 1 shown is rectangular. In some embodiments, the glass plate may also be in other shapes such as a trapezoid or a triangle.

[0042] like Figure 2 As shown, Figure 2The present invention shows a schematic diagram of a partial cross section of a glass plate 1 placed on an annealing mold 10 during a cooling annealing process, wherein the annealing mold 10 is located below the glass plate 1 and supports the glass plate 1, and a heating and heat preservation device 11 for heating and heat preservation of the annealing mold 10 is provided on one side of the annealing mold 10, the heating and heat preservation device 11 is not in direct contact with the glass plate 1, and the annealing mold 10 is at least partially in contact with the glass plate 1, so the glass plate 1 also includes a mold contact area 5 located at the edge, the mold contact area 5 at least partially overlaps with the film removal area 4, and the width of the mold contact area 5 is y<x; wherein the heating and heat preservation device 11 heats one side of the annealing mold 10 to heat the annealing mold 10, and the position where the edge of the glass plate 1 contacts the annealing mold 10 is the mold contact area 5, and the mold contact area 5 is indirectly heated and heat preserved under the action of the heating and heat preservation device 11. By heating and keeping the mold contact area 5 warm, a uniform transition temperature difference zone can be formed at the edge of the glass plate 1 during the annealing process, thereby forming a new stress distribution and reducing the overall tensile stress of the glass plate 1 .

[0043] The glass plate 1 includes an edge compressive stress zone and an edge tensile stress zone in sequence from the edge of the glass plate 1 inward, the compressive stress of the edge compressive stress zone is greater than or equal to 9 MPa, and the tensile stress of the edge tensile stress zone is less than or equal to 7 MPa.

[0044] In a specific embodiment, a transparent conductive film 2 is coated on one surface of the glass plate 1, and the transparent conductive film 2 is not coated on the other surface, the mold contact area 5 is located on the surface not coated with the transparent conductive film 2, and the mold contact area 5 overlaps with the film removal area 4 in the thickness direction. In addition, in some embodiments, the film removal area 4 surrounds the film coating area 3.

[0045] Among them, the transparent conductive film 2 can be directly deposited on the surface of the glass plate 1 by chemical vapor deposition (CVD) or physical vapor deposition (PVD), for example, by magnetron sputtering deposition; and, preferably, the transparent conductive film 2 can withstand high-temperature heat treatment, such as heat treatment processes of bending processes such as bending or tempering. Specifically, the transparent conductive film 2 may include a metal layer, a metal alloy layer or a metal oxide layer, the metal layer may be selected from at least one of gold (Au), silver (Ag), copper (Cu), aluminum (Al) or molybdenum (Mo), the metal alloy layer may be selected from a silver alloy, and the metal oxide layer may be selected from indium tin oxide, fluorine-doped tin dioxide, aluminum-doped tin dioxide, gallium-doped tin dioxide, boron-doped tin dioxide, tin zinc oxide or antimony-doped tin oxide; for example, when the transparent conductive film 2 includes a silver layer or a silver alloy layer, the silver layer or the silver alloy layer is located between at least two dielectric layers, and the dielectric layer contains at least one of zinc oxide, tin oxide, indium oxide, titanium oxide, silicon oxide, aluminum oxide, silicon nitride, silicon carbide, aluminum nitride or titanium metal layer. The film removal area 4 may be formed by pre-masking film removal, chemical etching film removal, laser film removal or mechanical friction film removal.

[0046] Among them, the formation of the edge tensile stress band and the edge compressive stress band is related to the distribution between the film removal area 4 and the mold contact area 5. The coating area 3 with the transparent conductive film 2 on the surface of the glass plate 1 has a high reflectivity to infrared rays. Therefore, during the subsequent heating and bending process of the glass plate 1, there will be an obvious temperature difference between the coating area 3 and the film removal area 4 on the glass plate 1 due to the difference in infrared reflectivity. The boundary between the coating area 3 and the film removal area 4 is called the film removal boundary line. With the film removal boundary line as the boundary, the surface of the glass plate 1 located on the side of the film removal area 4 cools faster, so the film removal area 4 will form compressive stress, and the part of the coating area 3 close to the film removal boundary line cools slower, so tensile stress will be formed in the part of the coating area 3 close to the film removal boundary line, and the closer to the film removal boundary line, the greater the tensile stress. In addition to the tensile stress and compressive stress formed on the surface of the glass plate 1 due to the film removal, during the cooling and annealing process of the glass plate 1, the edge of the glass plate 1 contacts the mold, and the edge line of the mold contact area 5 close to the inner side of the glass plate 1 is called the mold contact boundary line. With the mold contact boundary line as the boundary, since the temperature of the mold itself is relatively low, the cooling speed of the glass plate 1 in the mold contact area 5 is relatively fast, while the cooling speed of the part located on the surface of the glass plate 1 close to the mold contact boundary line is relatively slow. Therefore, tensile stress will be formed on the part of the surface of the glass plate 1 close to the mold contact boundary line, and the closer to the mold contact boundary line, the greater the tensile stress. In addition, the width of the film removal area 4 at the edge of the glass plate 1 is greater than the width of the mold contact area 5, so that the area with the largest tensile stress formed by the mold contact area 5 can overlap with the compressive stress formed by the film removal area 4.

[0047] Please refer to Figure 3As shown, Figure 3 The stress distribution diagram of the edge-defilmed glass shown from the perspective of the front side of the glass plate. In some embodiments, the glass plate 1 includes a coating compressive stress zone 6 located in the film removal zone 4 and a coating tensile stress zone 7 adjacent to the coating compressive stress zone 6 and located on the side of the coating compressive stress zone 6 away from the edge of the glass plate 1. The glass plate 1 also includes a mold compressive stress zone 8 located in the mold contact zone 5 and a mold tensile stress zone 9 adjacent to the mold compressive stress zone 8 and located on the side of the mold compressive stress zone 8 away from the edge of the glass plate 1. The coating compressive stress zone 6 and the mold tensile stress zone 9 at least partially overlap.

[0048] In some embodiments, the edge compressive stress band includes an overlapping area between the coating compressive stress zone 6 and the mold compressive stress zone 8, and the edge tensile stress band includes an overlapping area between the coating tensile stress zone 7 and the mold tensile stress zone 9 and an overlapping area between the coating compressive stress zone 6 and the mold tensile stress zone 9.

[0049] In some embodiments, the width of the coating compressive stress zone 6 is the same as the width of the film removal zone 4, and the width of the mold compressive stress zone 8 is the same as the width of the mold contact zone 5. Since the width x of the film removal zone 4 is greater than the width y of the mold contact zone 5, part of the coating compressive stress zone 6 can overlap with the mold compressive stress zone 8, thereby increasing the overall compressive stress. The overlapping area of ​​the coating compressive stress zone 6 and the mold compressive stress zone 8 is located in the edge compressive stress zone; the remaining part of the coating compressive stress zone 6 will overlap with part of the mold tensile stress zone 9, and the tensile stress and compressive stress in this part will offset each other, thereby reducing the maximum value of the overall tensile stress to a preset range. The tensile stress of the mold tensile stress zone 9 that overlaps in this part is much greater than the compressive stress of the coating compressive stress zone 6, so this partial area is located in the edge tensile stress band; most of the coating tensile stress zone 7 is located outside the area of ​​the mold tensile stress zone 9, and a small part of the coating tensile stress zone 7 overlaps with the remaining part of the mold tensile stress zone 9, and this partial area is located in the edge tensile stress band. Although the tensile stresses of the coating tensile stress zone 7 and the mold tensile stress zone 9 are superimposed on each other in this partial area, since the maximum tensile stress value of the coating tensile stress zone 7 is much lower than the maximum tensile stress of the mold tensile stress zone 9, the overall tensile stress of this partial area can still be controlled within a preset range.

[0050] In addition, in some further embodiments, the projections of the mold compressive stress zone 8 and the mold tensile stress zone 9 in the thickness direction of the glass plate 1 are both located within the coating compressive stress zone 6. At this time, the mold compressive stress zone 8 and the coating compressive stress zone 6 overlap, and the edge compressive stress of the glass plate 1 is increased, while the mold tensile stress zone 9 and the coating compressive stress zone 6 overlap, and the overall tensile stress of the glass plate 1 is greatly reduced.

[0051] In some embodiments, the width of the coating compressive stress zone 6 is the same as the width of the film removal zone 4, and the width of the coating tensile stress zone 7 is 30 to 90 mm; the width of the mold compressive stress zone 8 is the same as the width of the mold contact zone 5, and the width of the mold tensile stress zone 9 is 10 to 20 mm.

[0052] In the case where the transparent conductive film 2 in the coating area 3 remains intact and the transparent conductive film 2 in the film removal area 4 is completely removed, the area located on the side of the film removal boundary line close to the edge of the glass plate 1 is the coating compressive stress area 6, and the area located on the side of the film removal boundary line close to the center of the glass plate 1 by 30 to 90 mm is the coating tensile stress area 7. For example, the area within the range of 30 mm from the film removal boundary line close to the center of the glass plate 1 is the coating tensile stress area 7, or the area within the range of 40 mm from the film removal boundary line close to the center of the glass plate 1 is the coating tensile stress area 7. , or the area within 50 mm of the de-filming boundary line close to the center of the glass plate 1 is the coating tensile stress area 7, or the area within 60 mm of the de-filming boundary line close to the center of the glass plate 1 is the coating tensile stress area 7, or the area within 70 mm of the de-filming boundary line close to the center of the glass plate 1 is the coating tensile stress area 7, or the area within 80 mm of the de-filming boundary line close to the center of the glass plate 1 is the coating tensile stress area 7, or the area within 90 mm of the de-filming boundary line close to the center of the glass plate 1 is the coating tensile stress area 7, etc., the width of the coating tensile stress area 7 is The degree is naturally formed by the surface stress during the annealing process of the glass plate. The numerical values ​​of the areas in the above range are only examples. The numerical values ​​of the actual range of the coating tensile stress zone 7 are not specifically limited in the present invention. When the annealing mold 10 is not heated and kept warm, the mold contact boundary line is used as the boundary, and the area located on the side of the edge of the glass plate 1 near the mold contact boundary line is the mold compressive stress zone 8, and the area located 10 to 20 mm from the center of the glass plate 1 near the mold contact boundary line is the mold tensile stress zone 9. For example, the area 10 mm from the side of the center of the glass plate 1 near the mold contact boundary line is the mold tensile stress zone 9, or the area 12 mm from the side of the center of the glass plate 1 near the mold contact boundary line is the mold tensile stress zone 9, or the area 15 mm from the side of the center of the glass plate 1 near the mold contact boundary line is the mold tensile stress zone 9, or the area 20 mm from the side of the center of the glass plate 1 near the mold contact boundary line is the mold tensile stress zone 9. The width of the mold tensile stress zone 9 is naturally formed by the surface stress during the annealing process of the glass plate. The numerical values ​​of the areas in the above range are only examples. The numerical values ​​of the actual range of the mold tensile stress zone 9 are not specifically limited in the present invention.

[0053] In some embodiments, the width x of the film removal area 4 is 20-40 mm. In some specific embodiments, the width x of the film removal area 4 is 20 mm, 25 mm, 30 mm, 35 mm, 40 mm, etc.

[0054] In some embodiments, the width y of the mold contact area 5 is 8 to 12 mm. In some specific embodiments, the width y of the mold contact area 5 is 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc.

[0055] In some embodiments, the width of the mold contact area 5 is y≤x-5 mm.

[0056] In some further embodiments, the width of the mold contact area 5 is y≤x-10 mm.

[0057] In some further embodiments, the width y of the mold contact area 5 is ≤x-15 mm. The greater the difference in width between the film removal area 4 and the mold contact area 5, the higher the overlap between the mold tensile stress area 9 and the film removal compressive stress area, thereby enabling the overall edge tensile stress of the glass plate 1 to be controlled within a lower range, thereby improving the strength of the glass plate 1.

[0058] Please refer to Figure 4 As shown, in some embodiments, the film removal area 4 includes a complete film removal area 41 near the edge of the glass plate 1 and a partial film removal area 42 near the coating area 3, and the width of the partial film removal area 42 is 0 to 5 mm. Among them, the reflectivity of the partial film removal area 42 to infrared rays is between the complete film removal area 41 and the coating area 3, so there can be a smaller temperature gradient between the complete film removal area 41 and the coating area 3, thereby forming a uniform transition zone between the coating tensile stress and the coating compressive stress, and reducing the overall tensile stress. In some specific embodiments, the width of the partial film removal area 42 can be 0mm, 1mm, 2mm, 3mm, 4mm, 5mm, etc. In addition, in some embodiments, after the transparent conductive film 2 in the partial film removal area 42 is partially removed, the remaining transparent conductive film 2 forms a grid shape, or after the partial transparent conductive film 2 is partially removed, the film removal pattern is in a grid shape. In addition, the partial film removal area 42 can further prevent the edge of the transparent conductive film 2 from oxidative corrosion.

[0059] In some embodiments, the compressive stress of the edge compressive stress zone is greater than or equal to 25 MPa, and the tensile stress of the edge tensile stress zone is less than or equal to 6 MPa. In some further embodiments, the compressive stress of the edge compressive stress zone may be greater than or equal to 40 MPa, and the tensile stress of the edge tensile stress zone may be less than or equal to 3 MPa.

[0060] The present invention also provides a method for forming edge-removed glass, comprising the following steps:

[0061] S1, coating a transparent conductive film 2 on the surface of a glass plate 1;

[0062] S2, completely and / or partially removing the transparent conductive film 2 located at the edge of the glass plate 1 to form a film removal area 4 and a film coating area 3, wherein the width x of the film removal area 4 is ≥ 10 mm;

[0063] S3. The glass plate 1 after film removal is heated, bent and cooled for annealing, so that an edge of the glass plate 1 forms an edge compressive stress zone with a compressive stress greater than or equal to 9 MPa and an edge tensile stress zone with a tensile stress less than or equal to 7 MPa, wherein the area where the mold contacts the edge of the glass plate 1 during the cooling and annealing process is the mold contact area 5, the width of the mold contact area 5 is y, the mold contact area 5 at least partially overlaps with the film removal area 4, and the width of the mold contact area 5 y<x.

[0064] In step S1, the transparent conductive film 2 can be directly deposited onto the surface of the glass plate 1 by chemical vapor deposition (CVD) or physical vapor deposition (PVD), for example, by magnetron sputtering deposition; and, preferably, the transparent conductive film 2 can withstand high-temperature heat treatment, such as heat treatment processes of bending processes such as bending or tempering.

[0065] Among them, in step S3, when the glass plate 1 is heated and bent, the glass plate 1 is placed on a forming mold, and the glass is heated by a heating device so that it is bent under the action of gravity or pressure, and then the formed glass is placed on an annealing mold 10 for cooling and annealing.

[0066] In some embodiments, the width x of the film removal area 4 is 20-40 mm. In some specific embodiments, the width x of the film removal area 4 is 20 mm, 25 mm, 30 mm, 35 mm, 40 mm, etc.

[0067] In some embodiments, the width y of the mold contact area 5 is 8 to 12 mm. In some specific embodiments, the width y of the mold contact area 5 is 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc.

[0068] In some embodiments, the width y of the mold contact area 5 and the width x of the film removal area 4 satisfy y≤x-5 mm.

[0069] In some further embodiments, the width of the mold contact area 5 is y≤x-10 mm.

[0070] In some further embodiments, the width y of the mold contact area 5 is ≤x-15 mm. The greater the difference in width between the film removal area 4 and the mold contact area 5, the higher the overlap between the mold tensile stress area 9 and the film removal compressive stress area, thereby enabling the overall edge tensile stress of the glass plate 1 to be controlled within a lower range, thereby improving the strength of the glass plate 1.

[0071] In some embodiments, during the cooling and annealing process of the glass plate 1, the position where the mold contacts the edge of the glass plate 1 is heated and kept warm. By heating and keeping warm the position where the mold contacts the edge of the glass plate 1, a uniform transition temperature difference zone can be formed at the edge of the glass plate 1 during the annealing process, thereby forming a new stress distribution and reducing the tensile stress of the entire glass. In some specific embodiments, the heating and insulation device can directly heat the mold used for annealing, thereby reducing the temperature difference between the mold and the glass plate 1, thereby reducing the mold tensile stress of the glass plate 1.

[0072] In some embodiments, in step S2, completely and / or partially removing the transparent conductive film 2 at the edge of the glass plate 1 to form the film removal area 4 and the film coating area 3 includes the following steps:

[0073] S21, determining the positions of the film removal area 4 and the film coating area 3;

[0074] S22, the film removal area 4 includes a complete film removal area 41 close to the edge of the glass plate 1 and a partial film removal area 42 close to the coating area 3, wherein the transparent conductive film 2 in the complete film removal area 41 is completely removed, and the transparent conductive film 2 in the partial film removal area 42 is partially removed.

[0075] In some embodiments, the film removal area 4 includes a complete film removal area 41 near the edge of the glass plate 1 and a partial film removal area 42 near the coating area 3, and the width of the partial film removal area 42 is 0 to 5 mm. The reflectivity of the partial film removal area 42 to infrared rays is between the complete film removal area 41 and the coating area 3, so there can be a smaller temperature gradient between the complete film removal area 41 and the coating area 3, thereby forming a uniform transition zone between the coating tensile stress and the coating compressive stress, and reducing the overall tensile stress. In some specific embodiments, the width of the partial film removal area 42 can be 0 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, etc. In addition, in some embodiments, after the transparent conductive film 2 in the partial film removal area 42 is partially removed, the remaining transparent conductive film 2 forms a grid shape, or after the partial transparent conductive film 2 is partially removed, the film removal pattern is in a grid shape. In addition, the partial film removal area 42 can further prevent the edge of the transparent conductive film 2 from oxidative corrosion.

[0076] Example

[0077] The edge-film-removed glass in Examples 1-3 described below is manufactured using the above-mentioned edge-film-removed glass forming method;

[0078] The edge-de-filmed glass in Embodiments 1-3 comprises: a glass plate 1, a transparent conductive film 2 being provided on one surface of the glass plate 1;

[0079] The surface of the glass plate 1 provided with the transparent conductive film 2 includes a coating area 3 and a film removal area 4, wherein the film removal area 4 is located at the edge of the glass plate 1, and the transparent conductive film 2 in the film removal area 4 is completely removed, and the width x of the film removal area 4 is 30 mm;

[0080] The glass plate 1 further comprises a mold contact area 5 located at the edge, the mold contact area 5 at least partially overlaps with the film removal area 4, and the width y of the mold contact area 5 is 10 mm;

[0081] The glass plate 1 includes an edge compressive stress zone and an edge tensile stress zone in sequence from the edge of the glass plate 1 to the inside. Detection points are selected in the edge compressive stress zone and the edge tensile stress zone around the glass plate 1 of Examples 1-3, and the compressive stress and tensile stress conditions are detected respectively. The detection points selected in Examples 1-3 and the compressive stress and tensile stress conditions of each point are shown in Table 1 below.

[0082] Table 1

[0083]

[0084] The glass plate 1 in the above-mentioned Embodiment 1, Embodiment 2 and Embodiment 3 is used as the inner glass plate 1 or the outer glass plate 1 of the laminated glass, so the glass plate 1 has an upper side, a lower side and left and right sides. In the edge compressive stress zone and the edge tensile stress zone of each side, a number of detection points with the same spacing are respectively selected at the positions where the tensile stress and the compressive stress are maximum, wherein detection points 1, 2, and 3 are detection points selected on the upper side of the glass plate 1, detection points 4, 5, 6 and 11, 12, and 13 are detection points selected on the left and right sides of the glass plate 1, respectively, and detection points 7, 8, 9, and 10 are detection points selected on the lower side of the glass plate 1.

[0085] It can be seen from Table 1 above that the tensile stress of the left and right sides of the glass plate 1 can be reduced to below 3MPa, or even below 2MPa, of the three-edge de-filmed glass manufactured by the above molding method, so that the left and right sides of the glass plate 1 can be better prevented from being broken; and the tensile stress of the upper and lower sides can also be reduced to below 6MPa, and the tensile stress of the upper side is less than that of the lower side, especially the tensile stress of the upper side can be reduced to below 5MPa, or even below 4MPa, which meets the edge strength requirements of the glass plate 1. Optionally, the tensile stress of the left side is less than that of the upper side, and / or the tensile stress of the right side is less than that of the upper side.

[0086] It can also be seen from Table 1 above that the compressive stress in the edge compressive stress zone of each side of the glass plate 1 of the three-side film-removed glass manufactured by the above molding method is increased to more than 25Mpa, so as to ensure that the glass edge has sufficient mechanical strength to help protect the glass edge. Among them, the compressive stress of the upper side edge is greater than the compressive stress of the lower side edge, the compressive stress of the upper side edge can be increased to more than 40Mpa, and the compressive stress of the lower side edge can be increased to more than 30Mpa. Optionally, the compressive stress of the upper side edge is greater than the compressive stress of the left side edge, and / or, the compressive stress of the upper side edge is greater than the compressive stress of the right side edge.

[0087] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An edge-removing glass, characterized in that: include: A glass plate, wherein a transparent conductive film is provided on at least one surface of the glass plate; The surface of the glass plate provided with the transparent conductive film comprises a coating area and a film removal area, the film removal area is located at the edge of the glass plate, the transparent conductive film in the film removal area is completely removed or partially removed, and the width x of the film removal area is ≥ 10 mm; The glass plate includes an edge compressive stress zone and an edge tensile stress zone in sequence from the edge of the glass plate inward, the compressive stress of the edge compressive stress zone is greater than or equal to 9 MPa, and the tensile stress of the edge tensile stress zone is less than or equal to 7 MPa; The film removal area includes a complete film removal area close to the edge of the glass plate and a partial film removal area close to the coating area, and the reflectivity of the partial film removal area to infrared rays is between that of the complete film removal area and the coating area.

2. The edge-removed glass according to claim 1, characterized in that: The glass plate includes a coating compressive stress zone and a coating tensile stress zone adjacent to the coating compressive stress zone and located on a side of the coating compressive stress zone away from an edge of the glass plate. The glass plate also includes a mold compressive stress zone and a mold tensile stress zone adjacent to the mold compressive stress zone and located on a side of the mold compressive stress zone away from an edge of the glass plate. The coating compressive stress zone and the mold tensile stress zone at least partially overlap.

3. The edge-film-removing glass according to claim 2, characterized in that: The edge compressive stress zone includes an overlapping area of ​​the coating compressive stress zone and the mold compressive stress zone, and the edge tensile stress zone includes an overlapping area of ​​the coating tensile stress zone and the mold tensile stress zone and an overlapping area of ​​the coating compressive stress zone and the mold tensile stress zone.

4. The edge-removed glass according to claim 2, characterized in that: The glass plate also includes a mold contact area located at the edge, the mold contact area at least partially overlaps with the film removal area, and the width of the mold contact area y<x, the coating compressive stress area is located in the film removal area, and the mold compressive stress area is located in the mold contact area.

5. The edge-removed glass according to claim 4, characterized in that: The width of the coating compressive stress zone is the same as that of the film removal zone, and the width of the coating tensile stress zone is 30-90 mm; the width of the mold compressive stress zone is the same as that of the mold contact zone, and the width of the mold tensile stress zone is 10-20 mm.

6. The edge-removed glass according to claim 4, characterized in that: The width y of the mold contact area is 8 to 12 mm.

7. The edge-removed glass according to any one of claims 4 to 6, characterized in that: The width of the mold contact area is y≤x-5mm.

8. The edge-removed glass according to claim 6, characterized in that: The width of the mold contact area is y≤x-10mm.

9. The edge-film-removed glass according to claim 7, characterized in that: The width of the mold contact area is y≤x-15mm.

10. The edge-film-removed glass according to claim 1, characterized in that: The width x of the film removal zone is 20 to 40 mm.

11. The edge-film-removed glass according to claim 1, characterized in that: The width of the partial film removal area is 0 to 5 mm.

12. The edge-removed glass according to claim 1, characterized in that: The compressive stress of the edge compressive stress zone is greater than or equal to 25 MPa, and the tensile stress of the edge tensile stress zone is less than or equal to 6 MPa.

13. A method for forming edge-removed glass, characterized in that: The steps include: Plating a transparent conductive film on the surface of the glass plate; Completely and partially removing the transparent conductive film at the edge of the glass plate to form a film removal area and a film coating area, wherein the width x of the film removal area is ≥ 10 mm; The glass plate after the film is removed is heated, bent and cooled for annealing, so that the edge of the glass plate forms an edge compressive stress zone with a compressive stress greater than or equal to 9 MPa and an edge tensile stress zone with a tensile stress less than or equal to 7 MPa; The method of completely removing or partially removing the transparent conductive film at the edge of the glass plate to form a film removal area and a film coating area comprises the following steps: Determine the location of the film removal area and the coating area; The film removal area includes a complete film removal area near the edge of the glass plate and a partial film removal area near the coating area, wherein the transparent conductive film in the complete film removal area is completely removed, and the transparent conductive film in the partial film removal area is partially removed.

14. The method for forming edge-removed glass according to claim 13, characterized in that: The area where the mold contacts the edge of the glass plate during cooling and annealing is the mold contact area, the width of the mold contact area is y, the mold contact area at least partially overlaps with the film removal area, and the width of the mold contact area y<x.

15. The method for forming edge-removed glass according to claim 14, characterized in that: The width y of the mold contact area is 8 to 12 mm.

16. The method for forming edge-removed glass according to claim 13, characterized in that: The width x of the film removal zone is 20 to 40 mm.

17. The method for forming edge-removed glass according to any one of claims 14 to 15, characterized in that: The width y of the mold contact area and the width x of the film removal area satisfy y≤x-5mm.

18. The method for forming edge-removed glass according to claim 13, characterized in that: During the cooling and annealing process of the glass plate, the contact position between the mold and the edge of the glass plate is heated and kept warm.

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