Bearing jig and laser processing equipment
By designing a flexible and hard combination adsorption end combination, the warping and damage problems of the stage when fixing the wafer are solved, and effective fixing and protection of the wafer is achieved.
Patent Information
- Application Number
- CN202420516122.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-15
AI Technical Summary
Existing stages cannot effectively solve the problem of wafer warping when fixing wafers, and it is also easy to cause wafer damage.
A load-bearing fixture is designed, using a combination of a flexible first adsorbent and a hard second adsorbent. The wafer is first adsorbed and buffered through the flexible adsorbent end, and then the hard adsorbent end is adsorbed and fixed to avoid slip damage, and the movement of the adsorbent end is achieved by adjusting the drive member to adapt to the wafer shape.
It effectively solves the problem of wafer warping, while protecting the wafer structure, reducing the risk of fragmentation during processing.
Smart Images
Figure CN222626537U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of carrier technology, and more specifically, relates to a carrier fixture and laser processing equipment. Background Art
[0002] During the wafer processing, it is generally necessary to use a carrier to fix the wafer. It can be understood that the processing accuracy of the wafer depends to a large extent on the fixing accuracy of the carrier.
[0003] The wafer structure is relatively thin and brittle, and generally has a certain curvature. During the processing, the edge warping caused by this curvature will affect the processing accuracy. Therefore, when using a carrier to fix the wafer, the wafer needs to be fixed to a flat state to avoid edge warping.
[0004] Since the fixing setting scheme of the carrier for the wafer disclosed in the related art is unreasonable, the wafer is often damaged during the process of fixing the wafer and resisting wafer warping as well as the subsequent processing.
[0005] Therefore, how to solve the wafer warping while protecting the wafer structure remains to be solved. Utility Model Content
[0006] The present application provides a supporting fixture that can solve the problem of wafer warping while protecting the wafer structure.
[0007] The technical solution adopted in the present application is: to provide a carrying fixture, including a carrying member, the carrying member having a first surface, the first surface of the carrying member being provided with a first adsorption member and a second adsorption member, and the adsorption direction of the first adsorption member and the second adsorption member is defined as a first direction; along the first direction, the distance between the adsorption end of the first adsorption member and the first surface is greater than the distance between the adsorption end of the second adsorption member and the first surface, and the first adsorption member is a flexible structure; when the first adsorption member adsorbs a workpiece, the workpiece can be moved to be adsorbed by the second adsorption member.
[0008] Furthermore, the second adsorption component is a rigid structure.
[0009] Furthermore, the second adsorption component is configured as an adsorption groove and / or an adsorption hole recessed in the first surface of the carrier, and the first surface of the carrier is also recessed with an installation groove and / or an installation hole, and the first adsorption component is arranged in the installation groove and / or the installation hole.
[0010] Furthermore, the adsorption end of the first adsorption component is reciprocatably movable relative to the second adsorption component along the first direction.
[0011] Furthermore, the supporting fixture also includes an adjusting driving member, which is disposed on the supporting member and is drivingly connected to the first adsorption member, and the adjusting driving member can drive the first adsorption member to reciprocate along the first direction.
[0012] Furthermore, the supporting member includes a first carrier and a second carrier, the table top of the first carrier and the table top of the second carrier are parallel to the first surface and are arranged on the same side along the first direction, and the table top of the first carrier and the table top of the second carrier are both provided with the first adsorption component and the second adsorption component; the first carrier can be moved to extend out or retract into the second carrier along the first direction, and the first carrier can extend out of the second carrier along the first direction so that the table top of the first carrier protrudes out of the table top of the second carrier, and the first carrier can be retracted into the second carrier along the first direction so that the table top of the first carrier is coplanar with the table top of the second carrier.
[0013] Furthermore, the first carrier and the second carrier are circular structures and are concentrically arranged, the first adsorption component and the second adsorption component arranged on the first carrier are respectively distributed centrally symmetrically about the center of the first carrier, and the first adsorption component and the second adsorption component arranged on the second carrier are respectively distributed centrally symmetrically about the center of the second carrier; the supporting fixture also includes a first driving component, the first driving component and the second carrier are relatively fixedly arranged, the first driving component is drivingly connected to the first carrier, and the first driving component can drive the first carrier to move along the first direction to extend out or retract into the second carrier.
[0014] The present application also provides a laser processing equipment, including a frame, a laser processing device and a carrying device, the carrying device including a carrier and a carrying fixture as described in any of the above embodiments, the laser processing device and the carrier are respectively arranged on the frame, the carrying fixture is arranged on the carrier, the laser head of the laser processing device and the carrying fixture can be relatively movably arranged, and the laser head of the laser processing device can process the wafer carried by the carrying fixture.
[0015] Furthermore, the supporting device also includes a second driving member, which is arranged on the supporting base and is drivingly connected to the supporting fixture, and the second driving member can drive the supporting fixture to reciprocate along the first direction; the laser head of the laser processing device is arranged relative to the supporting fixture along the first direction.
[0016] Furthermore, the first direction is defined to be perpendicular to a horizontal plane, and a second direction and a third direction are defined to be parallel to the horizontal plane, and the first direction, the second direction and the third direction are respectively perpendicular to each other; and the carrier is movably arranged on the frame along the second direction and the third direction.
[0017] When the carrying fixture of the present application is used to carry a wafer, the first adsorption component is first used to contact and adsorb the wafer. The first adsorption component is made of a flexible material, which can not only adsorb the wafer but also provide buffering protection through soft contact. It should be noted that as the degree of adsorption of the wafer by the adsorption end of the first adsorption component increases, the adsorption end of the first adsorption component will gradually deform and fit more closely with the wafer. During this process, the wafer gradually approaches the first adsorption component, and thus the wafer gradually approaches the adsorption end of the second adsorption component, until it contacts the adsorption end of the second adsorption component and can be adsorbed.
[0018] Of course, when used to solve the problem of wafer warping, the setting range of the first adsorption component and the second adsorption component can be correspondingly adsorbed near the edge of the wafer. When the adsorption end of the first adsorption component is in the process of adsorbing the wafer, the wafer is fixed by the first adsorption component. When the adsorption end of the second adsorption component adsorbs the wafer, it can avoid relative slip between the wafer and the adsorption end of the second adsorption component and cause scratches and other damages. It can achieve the effect of solving the warping while protecting the wafer structure during the wafer fixing process.
[0019] Furthermore, after the supporting fixture of the present application fixes the wafer, the stress generated by the energy absorbed when the wafer is processed can be released through the flexible first adsorption component, thereby reducing the risk of wafer breakage during the processing process and further achieving the effect of protecting the wafer structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0021] Figure 1 A schematic diagram of the three-dimensional structure of a carrying fixture provided in an embodiment of the present application;
[0022] Figure 2 For along Figure 1 The cross-sectional structure diagram along the AA line;
[0023] Figure 3 A schematic diagram of the framework of the laser processing equipment provided in an embodiment of the present application.
[0024] Among them, the reference numerals in the figure are:
[0025] 10. Laser processing equipment; 11. Rack; 12. Laser processing device; 121. Laser head; 13. Carrying device; 100. Carrying fixture; 110. Carrying member; 111. Adsorption groove; 112. Mounting groove; 113. First carrier; 114. Second carrier; 115. First surface; 120. First adsorption member; 130. Second adsorption member; 140. Adjustment drive member; 200. Carrying base. DETAILED DESCRIPTION
[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0028] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0029] In addition, the terms "second" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "second" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0030] The related technology discloses the use of a hard adsorption part to solve the problem of wafer warping, and the wafer is directly contacted with the adsorption end of the hard adsorption part for adsorption. During the placement of the wafer, scratches are often generated due to the direct contact between the wafer and the adsorption end of the hard adsorption part. At the same time, when the wafer is adsorbed to combat warping, the friction between the wafer and the adsorption end of the hard adsorption part will also scratch the wafer. Moreover, after the wafer is adsorbed and fixed on the adsorption end of the hard adsorption part, the stress generated during the processing of the wafer will not be effectively released, thereby increasing the risk of wafer breakage.
[0031] See also Figure 1 , the carrying fixture 100 provided in the embodiment of the present application is now described. The carrying fixture 100 provided in the embodiment of the present application includes a carrying member 110, the carrying member 110 has a first surface 115, the first surface 115 of the carrying member 110 is provided with a first adsorption member 120 and a second adsorption member 130, and the adsorption direction of the first adsorption member 120 and the second adsorption member 130 is defined as a first direction, denoted as X; along the first direction, the distance between the adsorption end of the first adsorption member 120 and the first surface 115 is greater than the distance between the adsorption end of the second adsorption member 130 and the first surface 115, and the first adsorption member 120 is a flexible structure; when the first adsorption member 120 adsorbs the workpiece, the workpiece can move to be adsorbed by the second adsorption member 130.
[0032] When the carrying fixture 100 of the embodiment of the present application is used to carry a wafer, the first adsorption component 120 is first used to contact and adsorb the wafer. The first adsorption component 120 is made of a flexible material, which can not only adsorb the wafer but also provide buffering protection through soft contact. It should be noted that as the degree of adsorption of the wafer by the adsorption end of the first adsorption component 120 increases, the adsorption end of the first adsorption component 120 will gradually deform and gradually become closer to the wafer. During this process, the wafer gradually approaches the first adsorption component 120, and thus the wafer gradually approaches the adsorption end of the second adsorption component 130, until it contacts the adsorption end of the second adsorption component 130 and can be adsorbed.
[0033] Of course, when used to solve the problem of wafer warping, the arrangement range of the first adsorption component 120 and the second adsorption component 130 can correspond to the adsorption effect near the edge of the wafer. When the adsorption end of the first adsorption component 120 is in the process of adsorbing the wafer, the wafer is fixed by the first adsorption component 120. When the adsorption end of the second adsorption component 130 is in the adsorption effect on the wafer, it can avoid relative slippage between the wafer and the adsorption end of the second adsorption component 130 and cause scratches and other damages. It can achieve the effect of solving the warping while protecting the wafer structure during the wafer fixing process.
[0034] Furthermore, after the supporting fixture 100 of the embodiment of the present application fixes the wafer, the stress generated by absorbing energy when the wafer is processed can be released through the flexible first adsorption component 120, thereby reducing the risk of wafer breakage during the processing process and further achieving the effect of protecting the wafer structure.
[0035] It should be noted that the first adsorption component 120 in the embodiment of the present application can be any adsorption component that meets the flexible adsorption requirements, such as a rubber suction cup or a silicone suction cup, etc. The first adsorption component 120 in the specific embodiment of the present application takes a rubber suction cup as an example. Similarly, the second adsorption component 130 can be a flexible structure or a rigid structure. The embodiment of the present application takes the second adsorption component 130 as a rigid structure as an example, such as a ceramic suction cup or a metal suction cup, etc. The second adsorption component 130 in the specific embodiment of the present application takes a ceramic suction cup as an example. The first adsorbent 120 is first used to adsorb the wafer to fix the wafer with soft contact, thereby providing buffering protection for the wafer; the first adsorbent 120 is then used to drive the wafer to contact and adsorb the second adsorbent 130. The adsorption of the wafer by the second adsorbent 130 can enhance the firmness of the wafer fixation and effectively resist the warping of the wafer, that is, the second adsorbent 130 can make up for the lack of firmness caused by the flexibility of the first adsorbent 120 in fixing the wafer, while the first adsorbent 120 can make up for the disadvantage of damage to the wafer caused by the hard contact during the adsorption of the wafer by the second adsorbent 130 and help release stress during wafer processing.
[0036] In the process of the first adsorbing member 120 adsorbing the wafer, the first adsorbing member 120 can also be set to be movable, and the first adsorbing member 120 is controlled to move so that the wafer gradually approaches the second adsorbing member 130, so that it is adsorbed by the second adsorbing member 130. In the embodiment of the present application, the first adsorbing member 120 is set to be reciprocatingly movable along the first direction as an example, and the first adsorbing member 120 is controlled to move along the first direction, and the adsorption end of the first adsorbing member 120 is adjusted to a certain distance from the adsorption end of the second adsorbing member 130, so that when the adsorption end of the first adsorbing member 120 is in a state of adsorbing the wafer, the adsorption end of the second adsorbing member 130 can contact and adsorb the wafer.
[0037] Of course, the second adsorption component 130 can also be set to be reciprocatingly movable along the first direction, and the second adsorption component 130 can be controlled to move along the first direction, and the adsorption end of the second adsorption component 130 can be adjusted to a certain distance from the adsorption end of the first adsorption component 120, so that when the adsorption end of the first adsorption component 120 is in a wafer adsorption state, the adsorption end of the second adsorption component 130 can contact and adsorb the wafer.
[0038] It can be understood that, taking the supporting fixture 100 of the embodiment of the present application as an example of acting on a wafer, the wafer structure is a flat thin sheet, so the adsorption end of the first adsorption member 120 on the supporting member 110 protrudes from the adsorption end of the second adsorption member 130 and the first surface 115 of the supporting member 110 along the first direction away from the supporting member 110, so that the adsorption end of the first adsorption member 120 contacts the wafer before the adsorption end of the second adsorption member 130 and the supporting member 110; and the adsorption end of the second adsorption member 130 can be protruding from the first surface 115 of the supporting member 110 along the first direction, or can be coplanar, as long as it can satisfy that the adsorption end of the first adsorption member 120 is prior to the adsorption end of the second adsorption member 130 and both can finally be adsorbed and act on the wafer.
[0039] Among them, in the embodiment of the present application, the first surface 115 of the carrier 110 is taken as an example of a horizontal plane. When the adsorption end of the second adsorption component 130 is coplanar with the first surface 115 of the carrier 110, when the adsorption end of the second adsorption component 130 adsorbs on the wafer, the first surface 115 of the carrier 110 supports the wafer, which helps to improve the firmness of the wafer fixation and the structural stability during processing.
[0040] Of course, if the workpiece being acted on is other non-flat structures, as long as the adsorption end of the first adsorption component 120 acts on the workpiece before the adsorption end of the second adsorption component 130, and finally when the adsorption end of the first adsorption component 120 is in a state of adsorbing the workpiece, the adsorption end of the second adsorption component 130 can contact and adsorb the workpiece, it should be included in the protection scope of the present application. In addition, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should also be included in the protection scope of the present application.
[0041] See also Figure 1 and Figure 2 Furthermore, the second adsorption component 130 in the above embodiment is configured as an adsorption groove 111 and / or adsorption hole recessed on the corresponding side of the carrier 110. Specifically, taking the adsorption groove 111 as an example, it can be understood that the second adsorption component 130 is a groove structure that can be configured with an adsorption effect and is opened on the first surface 115 of the carrier 110, that is, the second adsorption component 130 and the carrier 110 are an integral structure, and the adsorption end of the second adsorption component 130 is the notch of the adsorption groove 111, and is coplanar with the first surface 115 of the carrier 110.
[0042] The first surface 115 of the carrier 110 is also provided with a mounting groove 112 and / or a mounting hole. Specifically, taking the mounting groove 112 as an example, the first adsorbent 120 is disposed in the mounting groove 112, and the adsorbing end of the first adsorbent 120 protrudes from the notch of the mounting groove 112 along the first direction so as to adsorb the wafer. Therefore, when the adsorbing end of the second adsorbent 130 is in the state of adsorbing the wafer, the adsorbing end of the first adsorbent 120 is coplanar with the adsorbing end of the second adsorbent 130 and the first surface 115 of the carrier 110, respectively.
[0043] Among them, the movable setting of the first adsorption component 120 relative to the supporting component 110 along the first direction can specifically be that the first adsorption component 120 is directly movably connected to the supporting component 110, or it can be indirectly movably connected through an intermediate component. The embodiment of the present application specifically takes an adjustable movable connection setting as an example.
[0044] In one embodiment, the carrier fixture 100 may further include an adjustable driving member 140, which is disposed on the carrier 110, and is drivingly connected to the first adsorption member 120, and the adjustable driving member 140 can drive the first adsorption member 120 to reciprocate along the first direction. In this embodiment, the first adsorption member 120 is driven and adjusted to move along the first direction by the adjustable driving member 140, and the adjustable driving member 140 can be a manual driving member or an automatic driving member, as long as it can drive the first adsorption member 120 to move and position along the first direction, and the setting position of the adjustable driving member 140 is taken as an example of being set at the bottom of the carrier 110 along the first direction, so as to provide sufficient working space for the wafer.
[0045] Furthermore, the carrier 110 of the above-mentioned embodiment may include a first carrier 113 and a second carrier 114. The table top of the first carrier 113 and the table top of the second carrier 114 are arranged on the same side along the first direction, that is, both are horizontal upward planes. For example, the table top of the first carrier 113 and the table top of the second carrier 114 are both provided with a first adsorption component 120 and a second adsorption component 130; the first carrier 113 can be moved to extend out or retract into the second carrier 114 along the first direction. The first carrier 113 can extend out of the second carrier 114 along the first direction so that the table top of the first carrier 113 protrudes from the table top of the second carrier 114. The first carrier 113 can be retracted into the second carrier 114 along the first direction so that the table top of the first carrier 113 and the table top of the second carrier 114 can be coplanar.
[0046] In the embodiment of the present application, the first platform 113 is movable along the first direction to extend out of the second platform 114, specifically, the first platform 113 is movable upward along the first direction to extend out of the second platform 114; and the first platform 113 is movable along the first direction to be retracted into the second platform 114, specifically, the first platform 113 is movable downward along the first direction to be retracted into the second platform 114. Of course, correspondingly, the second platform 114 can also be raised and lowered along the first direction, thereby achieving the effect that the first platform 113 can be movable along the first direction to extend out or retract into the second platform 114.
[0047] It can be understood that the contour area of the first carrier 113 in this embodiment is smaller than the contour area of the second carrier 114, and the second carrier 114 can be sleeved on the first carrier 113 along the first direction. In the actual process of receiving the wafer, the carrier 110 first controls the first carrier 113 to protrude upward relative to the second carrier 114 so as to receive the wafer from the wafer loading robot. It should be noted that the wafer loading robot generally adopts a two-tooth fork shape. The first carrier 113 with a smaller contour size can facilitate the docking of the wafer and avoid collision with the loading robot. The first adsorption member 120 and the second adsorption member 130 described in any of the above embodiments are both provided on the first carrier 113 and the second carrier 114, so that the wafer can be protected during the process of being acted upon by each carrier.
[0048] After the first adsorption component 120 and the second adsorption component 130 on the first carrier 113 adsorb and fix the wafer, the first carrier 113 is controlled to be lowered relative to the second carrier 114, so that the portion of the wafer protruding from the first carrier 113 in the horizontal direction is adsorbed by the adsorption end of the first adsorption component 120 and the adsorption end of the second adsorption component 130 on the second carrier 114 in turn, until the table surface of the first carrier 113 is coplanar with the table surface of the second carrier 114. At this time, the adsorption end of the first adsorption component 120 and the adsorption end of the second adsorption component 130 on the first carrier 113 and the adsorption end of the first adsorption component 120 and the adsorption end of the second adsorption component 130 on the second carrier 114 are all coplanar with the table surface of the first carrier 113, thereby achieving the effect of fixing the wafer and resisting wafer warping and fixing it.
[0049] Specifically, in the embodiment of the present application, the contours of the first carrier 113 and the second carrier 114 are taken as a circle, and the first carrier 113 and the second carrier 114 are set to be concentrically arranged as an example. Of course, the first carrier 113 and the second carrier 114 can also be other shapes and other positional relationships to meet actual use requirements. The embodiment of the present application sets the circular and concentric first carrier 113 and the second carrier 114 to facilitate matching with conventional circular wafers, thereby achieving a better fixing effect.
[0050] Furthermore, the first adsorption component 120 and the second adsorption component 130 arranged on the first carrier 113 are respectively distributed centrally symmetrically about the center of the first carrier 113, and the first adsorption component 120 and the second adsorption component 130 arranged on the second carrier 114 are respectively distributed centrally symmetrically about the center of the second carrier 114. When the first carrier 113 receives the wafer, taking the concentric positioning of the wafer and the first carrier 113 as an example, the first adsorption component 120 and the second adsorption component 130 on the first carrier 113 and the second carrier 114 can exert a symmetrical adsorption force on the center of the wafer when adsorbing the wafer, so that the wafer is subjected to balanced force, which helps to improve the force safety and stability of the wafer structure.
[0051] There is no limit to the number of the first adsorbent 120 and the second adsorbent 130, as long as the first adsorbent 120 on each carrier can symmetrically adsorb the wafer and the second adsorbent 130 on each carrier can symmetrically adsorb the wafer. Specifically, in the embodiment of the present application, the second adsorbent 130 is set on each carrier as an example, and the structure of the second adsorbent 130 is symmetrically arranged about the center of the corresponding carrier, and the first adsorbent 120 is set on each carrier as an example, and the number of the first adsorbent 120 is symmetrically arranged about the center of the corresponding carrier.
[0052] Among them, the supporting fixture 100 may also include a first driving member (not shown in the figure), the first driving member (not shown in the figure) is relatively fixedly arranged with the second carrier 114, the first driving member (not shown in the figure) is drivingly connected to the first carrier 113, and the first driving member (not shown in the figure) can drive the first carrier 113 to move along the first direction to extend out or retract into the second carrier 114.
[0053] In the embodiment of the present application, taking the control of the first driving member (not shown in the figure) to drive the first platform 113 to be raised and lowered relative to the second platform 114 as an example, the first driving member (not shown in the figure) and the second platform 114 are relatively fixedly arranged, and taking the direct or indirect connection between the first driving member (not shown in the figure) and the second platform 114 as an example, so that the second platform 114 is used as the force basis for the movement of the first platform 113, thereby driving the first platform 113 to be raised and lowered relative to the second platform 114 by controlling the first driving member (not shown in the figure). Of course, the first driving member (not shown in the figure) and the first carrier 113 can also be relatively fixedly arranged, and the first driving member (not shown in the figure) can be drivingly connected to the second carrier 114. Taking the direct or indirect connection between the first driving member (not shown in the figure) and the first carrier 113 as an example, the first carrier 113 is used as the force basis for the movement of the second carrier 114, so that the first driving member (not shown in the figure) is controlled to drive the second carrier 114 to move up and down relative to the first carrier 113 to achieve the effect of the first carrier 113 moving along the first direction, extending out or retracting into the second carrier 114.
[0054] See also Figure 3 The embodiment of the present application also provides a laser processing device 10, including a frame 11, a laser processing device 12 and a carrying device 13, the carrying device 13 includes a carrier 200 and a carrying fixture 100 in any of the above embodiments, the laser processing device 12 and the carrier 200 are respectively arranged on the frame 11, the carrying fixture 100 is arranged on the carrier 200, the laser head 121 of the laser processing device 12 and the carrying fixture 100 can be relatively movably arranged, and the laser head 121 of the laser processing device 12 can process the wafer carried by the carrying fixture 100.
[0055] After the carrier jig 100 carries and fixes the wafer, the relative position is adjusted and positioned to a processable state by controlling the relative movement of the laser head 121 and the carrier jig 100, and then the laser head 121 is controlled to emit light to process the wafer. Among them, the relative movement of the laser head 121 and the carrier jig 100 can be along three-dimensional directions, specifically, the laser head 121 can be movable and adjusted in one direction combined with the carrier jig 100 being movable and adjustable in the remaining two directions, or the laser head 121 can be movable and adjusted in two directions combined with the carrier jig 100 being movable and adjustable in the remaining one direction, or any one of the laser head 121 and the carrier jig 100 can be movable in three directions, while the other is fixed, there is no specific limitation, and any conditions can be met. The relative movement and positioning process of the laser head 121 and the carrier jig 100 can be achieved by camera positioning, and the camera positioning setting is a conventional setting in the field and will not be described in detail.
[0056] It should also be noted that the coordination and arrangement of the frame 11, the laser processing device 12 and the carrying device 13 is also a conventional arrangement in the art and will not be elaborated on.
[0057] Furthermore, the carrying device 13 of the above embodiment may also include a second driving member (not shown in the figure), which is arranged on the carrier 200, and is drivingly connected to the carrying fixture 100. The second driving member (not shown in the figure) can drive the carrying fixture 100 to reciprocate along the first direction; the laser head 121 of the laser processing device 12 is arranged relative to the carrying fixture 100 along the first direction.
[0058] Controlling the second driving member (not shown in the figure) can drive the supporting fixture 100 to move up and down along the first direction. Specifically, the second driving member (not shown in the figure) is connected to the second carrier 114 for example. By driving the second carrier 114 to move along the first direction, the first carrier 113 and the first driving member (not shown in the figure) are synchronously moved to control the synchronous movement of the supported wafer along the first direction, so as to adjust the distance between the wafer and the laser head 121, and realize the effect of laser focus precision processing of the wafer. Of course, the specific control of the second driving member (not shown in the figure) to drive the lifting distance of the supporting fixture 100 can be assisted by setting a rangefinder, and the rangefinder is used to understand the distance from the wafer to the laser head 121 in real time, so as to assist the precise drive control of the second driving member (not shown in the figure). The specific setting of the rangefinder is a conventional setting in the field and will not be repeated.
[0059] Further, a second direction and a third direction parallel to the horizontal plane are defined, the second direction is denoted as Y, the third direction is denoted as Z, the first direction, the second direction and the third direction are perpendicular to each other, that is, the first direction, the second direction and the third direction constitute a three-dimensional direction. The embodiment of the present application takes the carrier 200 as an example in which it is movably arranged on the frame 11 along the second direction and the third direction respectively. By controlling the carrier 200 to move along the second direction and the third direction respectively, and then combining the movement of the carrying fixture 100 along the first direction, it is possible to adjust the position of the wafer carried on the carrying fixture 100 in the three-dimensional space, so as to achieve the effect of adjusting the relative position between the laser head 121 and the wafer. Of course, the laser head 121 can be fixed or movable.
[0060] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A load-bearing fixture, characterized in that: include: A carrier, wherein the carrier has a first surface, and a first adsorption member and a second adsorption member are disposed on the first surface of the carrier, and an adsorption direction of the first adsorption member and the second adsorption member is defined as a first direction; Along the first direction, the distance between the adsorption end of the first adsorption member and the first surface is greater than the distance between the adsorption end of the second adsorption member and the first surface, and the first adsorption member is a flexible structure; When the first suction member is sucking the workpiece, the workpiece may be moved to be sucked by the second suction member.
2. The carrying fixture according to claim 1, characterized in that: The second adsorption component is a rigid structure.
3. The load-bearing fixture according to claim 1, characterized in that: The second adsorption component is configured as an adsorption groove and / or an adsorption hole recessed in the first surface of the carrier. The first surface of the carrier is also recessed with an installation groove and / or an installation hole, and the first adsorption component is arranged in the installation groove and / or the installation hole.
4. The carrying fixture according to claim 1, characterized in that: The adsorption end of the first adsorption member is reciprocatably disposed relative to the second adsorption member along the first direction.
5. The carrying fixture according to claim 4, characterized in that: The bearing fixture further includes an adjusting driving member, which is disposed on the bearing member and is drivingly connected to the first adsorption member. The adjusting driving member can drive the first adsorption member to reciprocate along the first direction.
6. The load-bearing fixture according to any one of claims 1 to 5, characterized in that: The carrier comprises a first carrier and a second carrier, the table surface of the first carrier and the table surface of the second carrier are parallel to the first surface and are arranged on the same side along the first direction, and the table surface of the first carrier and the table surface of the second carrier are both provided with the first adsorption member and the second adsorption member; The first platform can be moved along the first direction to extend out of or retract into the second platform. The first platform can be extended out of the second platform along the first direction so that the table surface of the first platform protrudes beyond the table surface of the second platform. The first platform can be retracted into the second platform along the first direction so that the table surface of the first platform is coplanar with the table surface of the second platform.
7. The carrying fixture according to claim 6, characterized in that: The first carrier and the second carrier are circular structures and are concentrically arranged. The first adsorbent and the second adsorbent arranged on the first carrier are respectively centrally symmetrically distributed about the center of the first carrier, and the first adsorbent and the second adsorbent arranged on the second carrier are respectively centrally symmetrically distributed about the center of the second carrier; The carrying fixture also includes a first driving member, which is fixedly arranged relative to the second carrier, and is drivingly connected to the first carrier. The first driving member can drive the first carrier to move along the first direction to extend out or retract into the second carrier.
8. A laser processing device, characterized in that: The laser processing equipment includes a frame, a laser processing device and a carrying device, the carrying device includes a carrier and a carrying fixture as described in any one of claims 1 to 7, the laser processing device and the carrier are respectively arranged on the frame, the carrying fixture is arranged on the carrier, the laser head of the laser processing device and the carrying fixture can be relatively movably arranged, and the laser head of the laser processing device can process the wafer carried by the carrying fixture.
9. The laser processing equipment according to claim 8, characterized in that: The carrying device further includes a second driving member, which is disposed on the carrier and is drivingly connected to the carrying fixture, and the second driving member can drive the carrying fixture to reciprocate along the first direction; The laser head of the laser processing device and the supporting fixture are arranged opposite to each other along the first direction.
10. The laser processing equipment according to claim 9, characterized in that: The first direction is defined to be perpendicular to a horizontal plane, and a second direction and a third direction are defined to be parallel to the horizontal plane, wherein the first direction, the second direction and the third direction are respectively perpendicular to each other; The carrier is movably disposed on the frame along the second direction and the third direction respectively.