Wafer grabbing device for front and back surface flipping

Abstract

The application provides a wafer grabbing device for front-back surface turning, comprising: a first jaw assembly for clamping a wafer; a second jaw assembly for clamping a wafer, the directions in which the first jaw assembly and the second jaw assembly clamp the wafer are opposite; and a turning driving assembly connected with the first jaw assembly and the second jaw assembly and used for turning the first jaw assembly and the second jaw assembly. The wafer grabbing device can grab the wafer through the two upper and lower jaw assemblies, and the wafer can be placed on a corresponding processing station through a turning mechanism, so that the carrying efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of single-wafer cleaning in semiconductor processing, and more particularly to a wafer gripping device for flipping wafers. Background Technology

[0002] The wafer manufacturing process includes cleaning, film growth, tempering, etching, exposure, development, and ion implantation, all of which involve wafer handling. During handling, wafers must be protected from impacts, drops, and strong shocks, while also avoiding cross-contamination. The wafer cleaning process removes contaminants generated during the wafer's shaping and polishing processes due to contact with various organic substances, particles, and metals. It is a crucial step in wafer manufacturing, and wafer handling is an essential step in the cleaning process, with extremely stringent requirements. Currently, most wafer handling devices only handle one wafer at a time, only taking a new wafer into the process area after processing and sending it away. This results in low handling efficiency and low wafer processing efficiency. Summary of the Invention

[0003] Based on the existing problems, the present invention provides a wafer gripping device for flipping the wafer to both sides, aiming to solve technical problems such as wafer processing efficiency in the prior art.

[0004] A wafer gripping device for flipping wafers side-to-side, comprising:

[0005] The first jaw assembly is used to clamp the wafer;

[0006] The second jaw assembly is used to clamp the wafer, and the first jaw assembly and the second jaw assembly clamp the wafer in opposite directions;

[0007] A flip drive assembly is connected to a first jaw assembly and a second jaw assembly, and is used to flip the first jaw assembly and the second jaw assembly.

[0008] Furthermore, the flip drive component includes:

[0009] First cylinder;

[0010] The drive gear is connected to the first cylinder via a gear shaft;

[0011] The driven gear meshes with the driving gear;

[0012] The chuck mounting base has its first end fixed to the gear shaft of the driven gear, and its second end is used to mount the first chuck assembly and the second chuck assembly.

[0013] Furthermore, the tilt drive assembly also includes a gearbox;

[0014] The driving gear and driven gear are housed in the gearbox;

[0015] The first end of the chuck mounting base passes through the gearbox and is fixed to the driven gear.

[0016] Furthermore, the flip drive assembly is vertically movable and connected to a fixed bracket.

[0017] Furthermore, both the first jaw assembly and the second jaw assembly include:

[0018] The fixed disc is fixedly connected to the second end of the claw mounting base;

[0019] The drive disc is rotatably mounted on the fixed disc;

[0020] Multiple claw fingers;

[0021] Multiple claw arms, each corresponding to a claw finger, are distributed on the drive disk along the circumference of the drive disk, with the first end of each claw arm connected to a claw finger.

[0022] Multiple links correspond one-to-one with the claw arms. The first end of the link is connected to the second end of the corresponding claw arm via a pin, and the second end of the link is connected to the drive disc via a pin.

[0023] The traction drive mechanism is connected to the second end of one of the claw arms and the first end of the connecting rod via a traction rope and a common pin.

[0024] Furthermore, both the first gripper assembly and the second gripper assembly further include:

[0025] The chuck body is fixed on the fixed disc, and the drive disc is embedded inside the chuck body;

[0026] The claw arm extends outside the claw body.

[0027] Furthermore, both the first gripper assembly and the second gripper assembly further include:

[0028] Multiple reset modules are provided, each corresponding to one of the jaw arms; the first end of each reset module is fixed to the jaw body, and the second end of each reset module is connected to the corresponding jaw arm.

[0029] Furthermore, the drive disc is also equipped with guide members that correspond one-to-one with the chuck arms, which guide the extension and retraction of the chuck arms.

[0030] Furthermore, it also includes:

[0031] An angle detector, located at the edge of the drive disk, is used to detect the rotation angle of the drive disk;

[0032] Furthermore, the upper end of the claw fingers facing the drive disk has an arc-shaped groove surface.

[0033] The beneficial technical effects of the present invention are as follows: the wafer gripping device of the present invention can grip two wafers continuously in a short period of time, and place each wafer on the corresponding processing station through the flipping mechanism, thereby improving the handling efficiency and wafer processing efficiency. Attached Figure Description

[0034] Figure 1-4 This is a schematic diagram of the structure of a wafer gripping device for flipping the wafer to its front and back sides according to the present invention.

[0035] Figure 5 This is a schematic diagram of the gripper finger structure of a wafer gripping device for flipping the wafer to its front and back sides according to the present invention.

[0036] in,

[0037] 1-First gripper assembly;

[0038] 101 - Fixed disc;

[0039] 102 - Drive disk;

[0040] 103-Claw claw fingers;

[0041] 104-Claw arm;

[0042] 105-Connecting rod;

[0043] 106 - Reset Module;

[0044] 107-Claw body;

[0045] 108 - Sealing sleeve;

[0046] 109 - Angle detector;

[0047] 110 - Traction drive mechanism;

[0048] 111 - Towing rope;

[0049] 2-Second gripper assembly;

[0050] 3- Flip drive component;

[0051] 301 - First Cylinder;

[0052] 302 - Drive Gear;

[0053] 303 - Driven gear;

[0054] 304 Stainless Steel - Claw Mounting Base;

[0055] 305 - Gearbox;

[0056] 4-Fixed bracket. Detailed Implementation

[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0059] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0060] See Figure 1-4 The present invention provides a wafer gripping device for flipping wafers, comprising:

[0061] The first jaw assembly (1) is used to clamp the wafer;

[0062] The second jaw assembly (2) is used to clamp the wafer, and the first jaw assembly (1) and the second jaw assembly (2) clamp the wafer in opposite directions;

[0063] The flip drive assembly (3) is connected to the first claw assembly (1) and the second claw assembly (2) and is used to flip the first claw assembly (1) and the second claw assembly (2).

[0064] As an application example of the present invention, for instance, when using a wafer gripping device to feed a wafer into the cleaning position for cleaning, the first gripper assembly (1) can be facing downwards to grip a wafer to be cleaned and feed it into the cleaning position. Then, the second gripper assembly (2) can be facing downwards to remove the cleaned wafer and transfer it to another processing station. After that, the first gripper assembly (1) grips the next wafer to be cleaned. By using the first gripper assembly (1) to grip the uncleaned wafer and the second gripper assembly (2) to grip the cleaned wafer, the use of the same gripper assembly to grip both cleaned and uncleaned wafers is avoided, thus preventing contamination of the cleaned wafer.

[0065] This invention uses only one reversible gripper to grip the wafer, reducing the configuration cost of a single wafer gripper at a processing station and improving the space utilization of the processing station.

[0066] Furthermore, the flip drive component (3) includes:

[0067] First cylinder (301);

[0068] The drive gear (302) is connected to the first cylinder (301) via a gear shaft;

[0069] The driven gear (303) meshes with the driving gear (302);

[0070] The first end of the chuck mounting base (304) is fixed on the gear shaft of the driven gear (303), and the second end of the chuck mounting base (304) is equipped with the first chuck assembly (1) and the second chuck assembly (2).

[0071] Furthermore, the tilt drive assembly (3) also includes a gearbox (305);

[0072] The driving gear (302) and the driven gear (303) are disposed in the gearbox (305);

[0073] The first end of the chuck mounting base (304) passes through the gearbox (305) and is fixed to the driven gear (303).

[0074] Furthermore, the flip drive assembly (3) is mounted on the fixed bracket (4).

[0075] Furthermore, the flip drive assembly (3) is movable up and down on the fixed bracket (4).

[0076] A cylinder is used as the driving source, which is connected to the gear shaft to drive the gear meshing transmission. The driving gear (302) and the driven gear (303) are made of metal and their surfaces are specially treated. The special treatment refers to the chemical anti-corrosion coating treatment on the surface to ensure its strength and resistance to chemical corrosion.

[0077] Furthermore, the upper end of the fixed bracket (4) is provided with a first position detection module and the lower end is provided with a second position detection module. The first position detection module is used to detect whether the movement of the flip drive component (3) exceeds the upper preset boundary.

[0078] The second position detection module is used to detect whether the downward movement of the flip drive component (3) exceeds the lower preset boundary;

[0079] An overload alarm device is connected to the first position detection module and the second position detection module respectively, and is used to generate an alarm message when the movement of the flip drive component (3) exceeds the upper preset boundary or the lower preset boundary.

[0080] The up-and-down movement and flipping drive assembly (3) allows the first jaw assembly (1) and the second jaw assembly (2) to move up and down to place the wafer in a processing station such as a cleaning position or to remove the wafer from a processing station such as a cleaning position. When the first jaw assembly (1) or the second jaw assembly (2) moves up and down beyond its range, the wafer cannot be accurately placed in the processing station or accurately removed from the processing station.

[0081] Furthermore, both the first jaw assembly (1) and the second jaw assembly (2) include:

[0082] A fixed disc (101) is fixedly connected to the second end of the claw mounting base (304);

[0083] The drive disk (102) is rotatably mounted on the fixed disk (101);

[0084] Multiple claw fingers (103);

[0085] Multiple claw arms (104), corresponding one-to-one with claw fingers (103), are distributed on the drive disk (102) along the circumferential direction. The first end of the claw arm (104) is connected to the claw finger (103).

[0086] Multiple connecting rods (105) correspond one-to-one with the claw arms (104). The first end of the connecting rod (105) is connected to the second end of the corresponding claw arm (104) by a pin, and the second end of the connecting rod (105) is connected to the drive disc (102) by a pin.

[0087] The traction drive mechanism (110) is connected by a traction rope (111) to the second end of one of the claw arms (104) and the first end of the connecting rod (105) via a common pin.

[0088] Furthermore, both the first claw assembly (1) and the second claw assembly (2) further include:

[0089] The claw body (107) is fixed on the fixed disk (101), and the driving disk (102) is embedded inside the claw body (107).

[0090] The claw arm (104) extends outside the claw body (107).

[0091] Furthermore, both the first claw assembly (1) and the second claw assembly (2) further include:

[0092] Multiple reset modules (106) are provided, each corresponding to a claw arm (104). The first end of each reset module (106) is fixed to the claw body (107), and the second end of each reset module (106) is connected to the corresponding claw arm (104). The claw fingers of this invention only grip the side of the wafer, eliminating the need for contact with the front or back of the wafer, thus protecting the wafer and preventing contamination or damage.

[0093] The traction drive mechanism is a second cylinder. The cylinder power causes the gripper fingers to overcome the reset module and open. After the power is lost, the gripper fingers can automatically reset. The cylinder power is transmitted to the connecting rod through the traction rope, and then to each gripper arm through the rotating drive disk, driving the gripper fingers to open. After the wafer is gripped, the power is lost, and the elastic force of the reset module drives the gripper fingers to clamp the wafer.

[0094] The reset module is located between the chuck arm and the chuck body. After the power is lost, the chuck arm is reset by the reset module. The reset module can adapt to the gripping of wafers with different outer diameters. It has strong wafer gripping adaptability, and the gripping size can be automatically adjusted, which improves the safety of wafer production and the application range of wafer gripping. It has strong versatility.

[0095] Furthermore, the reset module (106) is a spring.

[0096] The main function of this invention is to use gripper fingers to grasp wafers and enter the cleaning chamber for process cleaning, and then grasp the wafers again to return them to the next process. According to program control, the gripper fingers move up and down and rotate with the device, opening or closing to grasp the wafers and place them stably in the cleaning chuck. The gripper fingers can automatically extend and retract according to the size of the wafer being cleaned. The gripper fingers are driven by a traction component, which, through a conversion mechanism, gripper arms, connecting rods, and a drive disk, evenly transmits the clamping force to each gripper finger. After placing the wafer, the gripper fingers return to their original position via a reset module. The reset module can control the clamping force, providing excellent protection for the wafer.

[0097] Preferably, the number of claw fingers is greater than 3, and they are evenly distributed along the circumference.

[0098] Furthermore, the portion of each claw arm (104) extending beyond the claw body (107) is sealed by a sealing sleeve (108). The sealing sleeve (108) covers the claw arm (104) extending beyond the claw body, isolating the claw arm (104) from the outside world and effectively preventing cross-contamination. The sealing sleeve (108) is made of engineering rubber.

[0099] Furthermore, the drive disc (108) is also equipped with guide members that correspond one-to-one with the claw arms (104), and the guide members guide the extension and retraction movement of the claw arms (104). The claw arms are connected to the connecting rod through the guide members, and can freely extend and retract synchronously according to a given angle direction.

[0100] Furthermore, it also includes:

[0101] An angle detector (109) is set on the edge of the drive disk (102) to detect the rotation angle of the drive disk (102).

[0102] According to the program control, the angle detector (109) detects whether the rotation angle of the drive disk is within the preset range, and an alarm is triggered if excessive rotation occurs.

[0103] According to the program control, if the rotation angle of the drive disk does not reach the preset rotation angle, it cannot pick up the wafer.

[0104] See Figure 5 Furthermore, the upper end of the claw finger (103) facing the drive disk (102) is an arc-shaped groove surface.

[0105] The arc-shaped groove is a special design for the gripper fingers, which can automatically adjust the position and angle of the wafer to help the wafer self-align. At the same time, the reset module helps the gripper arm to automatically extend and retract according to the position of the wafer, clamping the wafer and avoiding uneven force on the wafer during clamping.

[0106] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should recognize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer gripping device for flipping wafers side-to-side, characterized in that, include: The first jaw assembly is used to clamp the wafer; The second jaw assembly is used to clamp the wafer, and the first jaw assembly and the second jaw assembly clamp the wafer in opposite directions; A flipping drive component, connected to the first jaw assembly and the second jaw assembly, is used to flip the first jaw assembly and the second jaw assembly; The flip drive component includes: First cylinder; The drive gear is connected to the first cylinder via a gear shaft; The driven gear meshes with the driving gear; A chuck mounting base, wherein the first end of the chuck mounting base is fixed to the gear shaft of the driven gear, and the second end of the chuck mounting base is used to mount the first chuck assembly and the second chuck assembly; Both the first jaw assembly and the second jaw assembly include: A fixed disc is fixedly connected to the second end of the claw mounting base; A drive disk is rotatably mounted on the fixed disk; Multiple claw fingers; Multiple claw arms, each corresponding to a claw finger, are distributed on the drive disk along the circumference of the drive disk, and the first end of each claw arm is connected to a claw finger. Multiple connecting rods correspond one-to-one with the claw arms. The first end of each connecting rod is connected to the second end of the corresponding claw arm via a pin, and the second end of each connecting rod is connected to the drive disc via a pin. The traction drive mechanism is connected to the second end of one of the claw arms and the first end of the connecting rod via a traction rope and a common pin.

2. The wafer gripping device for flipping wafers according to claim 1, characterized in that, The tilting drive assembly also includes a gearbox; The driving gear and the driven gear are disposed in the gearbox; The first end of the chuck mounting base passes through the gearbox and is fixed to the driven gear.

3. A wafer gripping device for flipping wafers according to claim 2, characterized in that, The flip drive assembly is movably connected to a fixed bracket.

4. A wafer gripping device for flipping wafers according to claim 1, characterized in that, The first jaw assembly and the second jaw assembly each further include: The chuck body is fixed on the fixed disc, and the drive disc is embedded inside the chuck body; The claw arm extends outside the claw body.

5. A wafer gripping device for flipping wafers according to claim 4, characterized in that, The first jaw assembly and the second jaw assembly each further include: Multiple reset modules are provided, each corresponding to one of the jaw arms; the first end of each reset module is fixed to the jaw body, and the second end of each reset module is connected to the corresponding jaw arm.

6. A wafer gripping device for flipping wafers according to claim 1, characterized in that, The drive disc is also provided with guide members that correspond one-to-one with the claw arms, and the guide members guide the extension and retraction movement of the claw arms.

7. A wafer gripping device for flipping wafers according to claim 1, characterized in that, Also includes: An angle detector is disposed on the edge of the drive disk to detect the rotation angle of the drive disk.

8. A wafer gripping device for flipping wafers according to claim 1, characterized in that, The upper end of the claw finger facing the drive disk has an arc-shaped groove surface.

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