Automatic solution preparation device and method and semiconductor processing system

Abstract

The present invention provides an automatic and precise preparation device, method, and semiconductor processing system for trace low-concentration solutions. The automatic solution preparation device includes: a pipeline; five rotary valves, wherein at least one optional through-hole of the first rotary valve receives at least one diluent, the common through-hole of the second rotary valve is connected to the common through-hole of the first rotary valve via a pipeline, the common through-hole of the third rotary valve is connected to a optional through-hole of the fourth rotary valve, at least one optional through-hole of the fourth rotary valve receives at least one stock solution, at least one optional through-hole of the fifth rotary valve is connected to a preparation liquid container via a pipeline, and one optional through-hole of the fifth rotary valve is connected to a waste liquid collection container or a waste liquid discharge pipeline via a pipeline; a first quantitative ring is connected between a optional through-hole of the second rotary valve and a optional through-hole of the third rotary valve; and a second quantitative ring is connected between the common through-hole of the fourth rotary valve and the common through-hole of the fifth rotary valve.

Description

Technical field

[0001] The present invention relates to the field of solution preparation, in particular to an automatic preparation device and method for trace low-concentration solutions and a semiconductor processing system. [Background Technology]

[0002] Semiconductor processing requires a variety of fluids with varying proportions, particularly ultra-clean, precise solutions composed of a variety of chemical solutions in varying proportions. Existing methods typically involve manually mixing different fluids using measuring cups or metering pumps. These methods cannot meet the stringent requirements for contamination concentration and ratio accuracy.

[0003] Therefore, it is urgent to propose an ultra-clean and more accurate automatic solution preparation solution to solve the above problems. [Summary of the invention]

[0004] One of the purposes of the present invention is to provide an automatic solution preparation device and method, which can realize automatic solution preparation and meet the requirements of low cross contamination and accurate preparation.

[0005] A second object of the present invention is to provide a semiconductor processing system that can automatically prepare various formula solutions, minimize cross contamination, and ensure accurate preparation.

[0006] To achieve the above-mentioned object, according to a first aspect of the present invention, there is provided an automatic solution preparation device, comprising: a pipeline; a first rotary valve, a second rotary valve, a third rotary valve, a fourth rotary valve and a fifth rotary valve, wherein each rotary valve comprises a common through-hole and a plurality of optional through-holes, and the common through-hole can be connected to one of the plurality of optional through-holes through an internal passage by controlled automatic rotation of the rotary valve, at least one optional through-hole of the first rotary valve receives at least one diluent through the pipeline, the common through-hole of the second rotary valve is connected to the common through-hole of the first rotary valve through a pipeline, the common through-hole of the third rotary valve is connected to one of the optional through-holes of the fourth rotary valve through a pipeline, at least one optional through-hole of the fourth rotary valve receives at least one raw liquid, at least one optional through-hole of the fifth rotary valve is connected to a preparation liquid container through a pipeline, and one optional through-hole of the fifth rotary valve discharges waste liquid through a pipeline; at least one first quantitative ring, wherein each first quantitative ring is connected between a optional through-hole of the second rotary valve and a optional through-hole of the third rotary valve; a second quantitative ring is connected between the common through-hole of the fourth rotary valve and the common through-hole of the fifth rotary valve. Surfaces that come into contact with chemical solutions can be made of pure and corrosion-resistant materials such as polytetrafluoroethylene, such as PFA pipes, PTFE valve components, and polytetrafluoroethylene or polypropylene containers.

[0007] According to a second aspect of the present invention, a method for automatically dispensing a solution using an automatic solution dispensing device is provided. The method includes controlling a first rotary valve, a second rotary valve, a third rotary valve, a fourth rotary valve, and a fifth rotary valve so as to: transfer a diluent into a first quantitative loop; transfer a stock solution into a second quantitative loop; and transfer the diluent and stock solution together into a preparation liquid container.

[0008] According to another aspect of the present invention, there is provided a semiconductor processing system comprising: a semiconductor processing apparatus comprising: a first chamber portion; a second chamber portion movable between an open position and a closed position relative to the first chamber portion, wherein when the second chamber portion is in the closed position relative to the first chamber portion, a microchamber is formed between the first chamber portion and the second chamber portion, and a semiconductor wafer can be accommodated in the microchamber; and when the second chamber portion is in the open position relative to the first chamber portion, the semiconductor wafer can be taken out or put in; wherein the first chamber portion has an inner wall surface facing the microchamber in the first chamber portion. The first groove is formed, and the second chamber part has a second groove formed on the inner wall surface of the second chamber part facing the microchamber. When the second chamber part is in the closed position relative to the first chamber part and a semiconductor wafer is accommodated in the microchamber, the first groove and the second groove are connected and jointly form an edge microprocessing space. The outer edge of the semiconductor wafer accommodated in the microchamber extends into the edge microprocessing space. The edge microprocessing space is connected to the outside through an edge processing through-hole, and the fluid enters or flows out of the edge microprocessing space through the edge processing through-hole; according to the automatic solution preparation device provided by the first aspect of the present invention.

[0009] Compared with the prior art, the present invention can realize automatic preparation of various formula solutions through five rotary valves, with low cross contamination and accurate preparation ratio.

Brief Description of the Drawings

[0010] The present invention will be more readily understood with reference to the accompanying drawings and the following detailed description, wherein like reference numerals correspond to like structural components, and wherein:

[0011] Figure 1a It is a structural schematic diagram of a semiconductor wafer;

[0012] Figure 1b for Figure 1a EE cross-sectional view;

[0013] Figure 1c A cross-sectional view of an outer edge portion of a semiconductor wafer before outer edge processing;

[0014] Figure 1d is a cross-sectional view of an outer edge portion of a semiconductor wafer after outer edge processing;

[0015] Figure 2a is a schematic cross-sectional view of a semiconductor processing device according to a first embodiment of the present invention;

[0016] Figure 2b for Figure 2a An enlarged schematic diagram of circle A in FIG;

[0017] Figure 3a for Figure 2a A bottom view of a first chamber portion of a semiconductor processing apparatus;

[0018] Figure 3b for Figure 2a A top view of a second chamber portion of a semiconductor processing apparatus;

[0019] Figure 4a is a schematic cross-sectional view of a semiconductor processing device according to a second embodiment of the present invention;

[0020] Figure 4b for Figure 4a An enlarged schematic diagram of circle B in FIG;

[0021] Figure 5a for Figure 4a A bottom view of a first chamber portion of a semiconductor processing apparatus;

[0022] Figure 5b for Figure 4a A top view of a second chamber portion of a semiconductor processing apparatus;

[0023] Figure 6 A schematic diagram of the principle of a fluid processing device in one embodiment of the present invention;

[0024] Figure 7a and Figure 7b A schematic structural diagram of a fluid processing cup in one embodiment of the present invention is provided;

[0025] Figure 8a and Figure 8b A schematic structural diagram of another embodiment of the fluid processing cup of the present invention is provided; and

[0026] Figure 8c Shows the formation Figure 8a and Figure 8b A schematic diagram of a cup blank for a fluid handling cup is shown;

[0027] Figure 9 Schematic diagram of the structure of the automatic solution preparation device in one embodiment of the present invention. [Specific implementation method]

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The term "one embodiment" or "embodiment" as used herein means that the specific features, structures, or characteristics associated with the embodiment may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places in this specification does not necessarily refer to the same embodiment, nor does it necessarily refer to separate or selected embodiments that are mutually exclusive with other embodiments. The terms "multiple" and "several" as used herein mean two or more. The term "and / or" as used herein means "and" or "or."

[0030] First embodiment:

[0031] Precision edge etching of semiconductor wafers is a challenging process. It requires achieving micron-level precision etching of the wafer edge without damaging or contaminating the remaining thin film. In epitaxial wafer manufacturing and advanced integrated circuit manufacturing, wafer edge etching is a critical step in ensuring the quality of thin film formation and improving chip yield. Furthermore, precise edge contamination extraction from semiconductor wafers is a challenging process. This involves precisely scanning the wafer edge with a small amount of a chemical mixture, dissolving and extracting any contaminants into an extraction solution. A detection instrument then measures the contaminant concentration in the extraction solution, and a formula is used to calculate the number of atoms, ions, or molecules of the contaminant per unit area of the wafer edge.

[0032] Please refer to Figures 1a to 1d ,in: Figure 1a 4 shows a schematic structural diagram of a semiconductor wafer 400. Figure 1b for Figure 1a EE cross-sectional view; Figure 1c A partial cross-sectional view of an outer edge of a semiconductor wafer before outer edge processing; Figure 1d This is a cross-sectional view of the outer edge of a semiconductor wafer after outer edge processing. Figures 1a to 1d As shown, semiconductor wafer 400 includes a base layer 401 and a thin film layer 402 formed on a first side surface and a second side surface of base layer 401. After a targeted etching process is performed on the outer edge of semiconductor wafer 400, thin film layer 402 on the outer edge of semiconductor wafer 400 is removed, and the first side surface and the second side surface of base layer 401 are exposed.

[0033] Please refer to Figures 2a to 3b , which shows a schematic structural diagram of a semiconductor processing device 100 provided by a first embodiment of the present invention, wherein: Figure 2a is a schematic cross-sectional view of a semiconductor processing device according to a first embodiment of the present invention; Figure 2b for Figure 2aAn enlarged schematic diagram of circle A in FIG; Figure 3a for Figure 2a A bottom view of a first chamber portion of a semiconductor processing apparatus; Figure 3b for Figure 2a A top view of a second chamber portion of a semiconductor processing apparatus in FIG.

[0034] Please refer to Figures 2a to 3b The semiconductor processing apparatus 100 includes a first chamber portion 110 and a second chamber portion 120. The first chamber portion 110 includes a first chamber plate 119 and a flange 118 extending from a periphery of the first chamber plate 119. The second chamber portion 120 includes a second chamber plate 129 and a flange 128 extending from a periphery of the second chamber plate 129.

[0035] The first chamber section 110 is movable between an open position and a closed position relative to the second chamber section 120. When the first chamber section 110 is in the closed position relative to the second chamber section 120, the flange 118 cooperates with the flange 128 to form a microchamber 140 between the first chamber plate 118 and the second chamber plate 128. A semiconductor wafer 400 to be processed can be accommodated within the microchamber 140, awaiting subsequent processing. When the first chamber section 110 is in the open position relative to the second chamber section 120, the flange 118 separates from the flange 128, allowing the semiconductor wafer 400 to be removed from or placed into the microchamber 140.

[0036] A first annular groove 116 is formed on the side of the first chamber portion 110 facing the microchamber 140, and a second groove 126 is formed on the side of the second chamber portion 120 facing the microchamber 140. When the second chamber portion 120 is in the closed position relative to the first chamber portion 110 and the semiconductor wafer 400 is accommodated in the microchamber, the first groove 116 and the second groove 126 jointly form an edge microprocessing space 130, and the outer edge of the semiconductor wafer 400 accommodated in the microchamber extends into the edge microprocessing space 130.

[0037] like Figures 2a to 3bAs shown, in this embodiment, the first groove 116 and the second groove 126 are annular grooves. When the second chamber portion 120 is in the closed position relative to the first chamber portion 110 and the semiconductor wafer 400 is accommodated in the microchamber, the wall surface 117 of the first chamber portion 110 located inside the first groove 116 abuts against the first side surface of the semiconductor wafer 400 to be processed, and the wall surface 127 of the second chamber portion 120 located inside the second groove 126 abuts against the second side surface of the semiconductor wafer 400 to be processed. The first groove 116 and the second groove 126 together enclose the closed, annular outer edge microprocessing space 130, and the outer edge of the semiconductor wafer 400 to be processed can extend outward into the edge microprocessing space 130.

[0038] Therefore, in this embodiment, the edge micro-processing space 130 can achieve targeted processing of the entire outer edge portion of the semiconductor wafer 400 to be processed.

[0039] Of course, the first groove 116 and the second groove 126 can also be configured as arc-shaped grooves with an arc angle less than 360 degrees. In this case, a closed, arc-shaped outer edge micro-processing space 130 with an arc angle less than 360 degrees is formed between the first groove 116 and the second groove 126. Accordingly, a portion of the outer edge of the semiconductor wafer 400 to be processed extends outward into the edge micro-processing space 130. Therefore, in this case, the edge micro-processing space 130 only performs targeted processing on a portion of the outer edge of the semiconductor wafer 400 to be processed.

[0040] The first chamber portion 110 has at least two edge processing through-holes 112 extending from the outside through the first chamber portion 110 to communicate with the edge micro-processing space 130. At least one edge processing through-hole serves as a fluid inlet, and at least one edge processing through-hole serves as a fluid outlet. In this embodiment, four edge processing through-holes are provided. Of course, the second chamber portion 120 may also be provided with edge processing through-holes communicating with the edge micro-processing space 130.

[0041] During application, a processing fluid can enter the edge micro-processing space 130 through one edge processing through-hole 112. The fluid entering the edge micro-processing space 130 can flow within the edge micro-processing space 130. At this time, the processing fluid can contact and process the outer edge of the semiconductor wafer 400 to be processed. The fluid that has processed the semiconductor wafer 400 to be processed can flow out through another edge processing through-hole 112, or through an edge processing through-hole provided on the second chamber portion 120 and connected to the edge micro-processing space 130. During the processing process, the processing fluid can be continuously or periodically introduced into the edge micro-processing space 130 through one edge processing through-hole 112. The fluid in the edge micro-processing space 130 can flow during the processing process, thereby speeding up the processing speed.

[0042] Of course, the treatment may be an etching treatment of the outer edge of the semiconductor wafer 400 to be processed to remove the thin film layer on the outer edge of the semiconductor wafer 400 to be processed, or it may be a targeted cleaning of the outer edge of the semiconductor wafer 400 to be processed, etc. In addition, the treatment may also be a treatment fluid (such as an extraction solution) that dissolves the contaminants on the outer edge of the semiconductor wafer 400 to be processed and collects them into the extraction solution, then uses a detection instrument to measure the concentration of the contaminants in the extraction solution, and then calculates the number of atoms, ions, or molecules of the contaminants per unit area of the wafer edge according to a formula.

[0043] Take the etching and removal of the thin film layer on the outer edge of the semiconductor wafer 400 to be processed as an example. Figures 1a to 1d and Figures 2a to 3b As shown, when it is necessary to corrode and remove the thin film layer on the first side and the second side of the outer edge of the semiconductor wafer 400 to be processed, it is only necessary to pass the corresponding processing fluid that has a corrosive effect on the thin film layer into the edge micro-processing space 130 through an edge processing through-hole 112. The processing fluid flows in the edge micro-processing space 130 and directly contacts the first side surface and the second side surface of the outer edge of the semiconductor wafer 400 to be processed. The processing fluid corrodes inwardly along the direction perpendicular to the first side and the second side of the semiconductor wafer 400 to be processed, so that the thin film layer 402 on the first side surface and the second side surface of the outer edge of the semiconductor wafer 400 to be processed is continuously corroded and removed. As shown Figure 1d As shown, after processing is completed, the thin film layer 402 on the first and second side surfaces of the outer edge of the semiconductor wafer 400 is etched away, exposing the first and second side surfaces of the substrate layer 401 at the outer edge of the semiconductor wafer 400. The fluid that has processed the semiconductor wafer 400 to be processed flows out through other edge processing through holes.

[0044] As can be seen, based on the edge micro-processing space 130, the semiconductor processing apparatus 100 of this embodiment only consumes a small amount of processing fluid to achieve targeted etching of the outer edge of a semiconductor wafer 400 to be processed, significantly reducing processing costs. Furthermore, compared to conventional dry-process apparatuses, the semiconductor processing apparatus 100 of this embodiment has significant advantages in terms of simple structure, ease of use, and low operator skill requirements.

[0045] It can be seen that the semiconductor processing device 100 provided in this embodiment can achieve targeted processing of the outer edge of the semiconductor wafer 400 to be processed. In addition, by controlling the flow rate of the processing fluid in the semiconductor wafer 400 to be processed, the amount of processing fluid can be saved. Figure 2a to Figure 2b As shown, in this embodiment, the first chamber portion 110 further includes a first recessed portion 115 formed on the inner wall surface of the first chamber portion 110 facing the microchamber, and the first recessed portion is located inside the first groove 116. The second chamber portion 120 further includes a second recessed portion 125 formed on the inner wall surface of the second chamber portion 120 facing the microchamber, and the second recessed portion is located inside the second groove 126. The first recessed portion 115 and the second recessed portion 125 are also annular. When the second chamber portion 120 is located in the closed position relative to the first chamber portion 110 and the semiconductor wafer 400 to be processed is accommodated in the microchamber, a partial area of the second side surface of the semiconductor wafer 400 to be processed covers the top of the second recess 125 to form a second inner microspace, and a partial area of the first side surface of the semiconductor wafer 400 to be processed covers the top of the first recess 115 to form a first inner microspace. The first inner microspace and the second inner microspace are located inside the edge microprocessing space 130.

[0046] Correspondingly, the first chamber portion 110 has a first inner processing through-hole communicating with the first recessed portion 115, and the second chamber portion 120 has a second inner processing through-hole communicating with the second recessed portion 125. When the edge of the semiconductor wafer 400 is etched using the edge micro-processing space 130, liquid or gas, such as water or nitrogen, can be introduced into the first recessed portion 115 and the second recessed portion 125, i.e., into the first inner micro-space and the second inner micro-space, to prevent the liquid in the edge micro-processing space 130 from penetrating inward.

[0047] Likewise, the first recessed portion 115 and the second recessed portion 125 may also be arc-shaped.

[0048] Continue to refer to Figure 2a to Figure 2bAs shown, in this embodiment, when the second chamber portion 120 and the first chamber portion 110 are in the closed position, a micro chamber 140 is further formed in the middle thereof, the second chamber portion 120 has a middle processing through hole 123 communicating with the micro chamber 140, and the first chamber portion 110 has a middle processing through hole 113 communicating with the micro chamber 140.

[0049] References Figure 2b As shown, the first chamber portion 110 has a sealing joint portion 210 located outside the first groove 116, and the second chamber portion 120 has a joint groove 122 corresponding to the sealing joint portion 210. The sealing joint portion 210 includes a guide surface 211 located at the end and an inner surface 212 located inside. When the second chamber portion 120 is in the closed position relative to the first chamber portion 110, the end of the sealing joint portion 210 extends into the joint groove 122, and the end portion of the inner surface 212 thereof seals with the groove wall of the joint groove 122. The upper end portion of the inner surface 212 forms the outer side surface of the outer edge micro-processing space 130. This can further reduce the space of the outer edge micro-processing space 130. In addition, the sealing surface between the end portion of the inner surface 212 of the sealing joint 210 and the groove wall of the joint groove 122 is located below the outer edge micro-processing space 130, and the sealing surface is perpendicular to the extension direction of the semiconductor wafer 400. Such an arrangement can make the wall surface 117 of the first chamber portion 110 located on the inner side of the first groove 116 more tightly against the first side surface of the semiconductor wafer 400 to be processed, and the wall surface 127 of the second chamber portion 120 located on the inner side of the second groove 126 more tightly against the second side surface of the semiconductor wafer 400 to be processed, thereby preventing the corrosive liquid from penetrating inward.

[0050] exist Figure 2b In an embodiment, during the closing process of the second chamber portion 120 relative to the first chamber portion 110, the inner surface 212 of the sealing joint 210 can realize the center positioning of the semiconductor wafer 140, that is, if the center of the semiconductor wafer 140 deviates from the desired center when placed, then the inner surface 212 of the sealing joint 210 can also be pressed against the semiconductor wafer 140 so that its center is corrected to the desired center. In one example, when edge processing is performed, the center deviation of the semiconductor wafer 140 is required to be no more than 0.2 mm. By adopting the method of the present invention, the center deviation can be adjusted to within 0.1 mm. The guide surface 211 can guide the sealing joint 210 into the joint groove 122 when the first chamber portion 110 and the second chamber portion 120 are closed. The sealing joint 210 can be stuck in the joint groove 122.

[0051] References Figure 2aAs shown, the first chamber portion 110 includes a positioning groove 114, and the second chamber portion 120 includes a positioning post 124, which can ensure that the first chamber portion 110 and the second chamber portion 120 are properly positioned when closed. During the closing process of the first chamber portion 110 and the second chamber portion 120, the positioning post 124 first engages with the positioning groove 114 to achieve initial positioning, and then the end of the sealing joint 210 extends into the joint groove 122.

[0052] In one embodiment, the semiconductor processing device 100 of the present invention is utilized to carry out the silicon oxide wafer edge etching process. Specifically, the method may include closing the cavity, HF acid etching, DIW rinsing, IPA rinsing and nitrogen drying, and then opening the cavity to take out the wafer. The specific process of HF acid etching, DIW (deionized water) rinsing and IPA (isopropyl alcohol) rinsing can be operated with reference to the above-mentioned process. In particular, during the HF acid etching process, liquid or gas, such as water or nitrogen, may be introduced into the first recessed portion 115 and the second recessed portion 125 to prevent the liquid in the edge micro-processing space 130 from infiltrating inwardly.

[0053] As described above, the semiconductor processing device 100 of the present invention can also be used to extract and detect contaminants on the outer edge of the semiconductor wafer 400 to be processed, using various single or mixed liquids to react with the contaminants on the edge of the wafer, dissolving them and collecting them in the liquid; then, a detection instrument is used to qualitatively and quantitatively measure the contaminants in the extracted liquid, and the method is similar, so it will not be repeated here.

[0054] Second embodiment

[0055] Please refer to Figures 4a to 5b , which shows a schematic structural diagram of a semiconductor processing device 200 provided by a second embodiment of the present invention, wherein: Figure 4a is a schematic cross-sectional view of a semiconductor processing device according to a first embodiment of the present invention; Figure 4b for Figure 4a An enlarged schematic diagram of circle B in FIG; Figure 5a for Figure 4a A bottom view of a first chamber portion of a semiconductor processing apparatus; Figure 5b for Figure 4a A top view of a second chamber portion of a semiconductor processing apparatus in FIG.

[0056] The semiconductor processing device 200 in the second embodiment has a structure that is largely identical to that of the semiconductor processing device 100 in the first embodiment, and therefore the identical parts thereof are labeled identically. The main difference between the two is that the sealing joint 310 of the semiconductor processing device 200 and the sealing joint 210 of the semiconductor processing device 100 have some differences in structure.

[0057] like Figure 4b As shown, the first chamber portion 110 has the sealing joint portion 310 located outside the first groove 116 , and the second chamber portion 120 has a joint groove 122 corresponding to the sealing joint portion 210 .

[0058] The sealing joint 310 includes a guide surface 311 at its distal end, an inner surface 312 at its inner upper end, and a protrusion 313 at its distal end. When the second chamber portion 120 is in the closed position relative to the first chamber portion 110, the distal end of the sealing joint 310 extends into the engagement groove 122, with the protrusion 313 sealingly engaging the groove wall of the engagement groove 122. The inner surface 312 forms the outer side of the outer micro-processing space 130. The inner surface 312 is spaced a distance from the outer edge of the semiconductor wafer 400.

[0059] The sealing surface formed by the protrusion 313 of the sealing joint 310 and the groove wall of the joint groove 122 is located below the outer edge micro-processing space 130, and the sealing surface is perpendicular to the extension direction of the semiconductor wafer 400. Such an arrangement can make the wall surface 117 of the first chamber part 110 located on the inner side of the first groove 116 abut more tightly against the first side surface of the semiconductor wafer 400 to be processed, and the wall surface 127 of the second chamber part 120 located on the inner side of the second groove 126 abut more tightly against the second side surface of the semiconductor wafer 400 to be processed, thereby preventing the corrosive liquid from penetrating inward.

[0060] exist Figure 4b In the embodiment, during the closing process of the second chamber portion 120 relative to the first chamber portion 110, the protrusion 313 of the sealing joint 310 can realize the center positioning of the semiconductor wafer 140, that is, if the center of the semiconductor wafer 140 deviates from the desired center when it is placed, then the protrusion 313 of the sealing joint 310 can also be pressed against the semiconductor wafer 140 so that its center is corrected to the desired center.

[0061] Since there is still a distance between the inner surface 312 and the outer edge of the semiconductor wafer 400 , the semiconductor wafer 140 is not easily clamped by the sealing joint 310 when the second chamber portion 120 is separated from the first chamber portion 110 .

[0062] In another embodiment, the semiconductor wafer 140 may be centrally positioned without using the bumps 313 , that is, the bumps 313 may not contact the edge of the semiconductor wafer 140 . Instead, the center of the semiconductor wafer 140 may be centrally positioned using the edge of the wall of the first groove 116 .

[0063] Third embodiment

[0064] Figure 6 FIG. 1 is a schematic diagram showing the principle of a fluid processing device 600 according to an embodiment of the present invention.

[0065] In one embodiment, the fluid processing device 600 of the present invention can work in conjunction with the semiconductor processing device 100 or 200 of the first and second embodiments to form a semiconductor processing system. Specifically, the fluid processing device 600 can introduce fluid into the edge micro-processing space 130 through the edge processing through-holes, and can also lead fluid out of the edge micro-processing space 130 through the edge processing through-holes. In one embodiment, the extraction solution containing pollutants drawn out from the edge micro-processing space 130 can be introduced into the fluid processing device 600. The extraction solution can be diluted or otherwise processed in the fluid processing device 600 and then transferred to one or more detection instruments to measure the concentration of pollutants in the extraction solution. Of course, in other embodiments, the fluid processing device can also work in conjunction with other devices to provide fluid or lead fluid thereto.

[0066] like Figure 6 As shown, the fluid processing device 600 includes a fluid container 610 , a first rotary valve 621 , a second rotary valve 622 , and a pipeline 630 connecting the various components.

[0067] Each rotary valve 621 and 622 includes a common through hole and a plurality of optional through holes (1-8). By rotating each rotary valve 620, the common through hole can be connected to any one of the plurality of optional through holes (1-8) through an internal passage, and the optional through holes are not connected to each other. The number of the optional through holes can be selected as needed. The rotation of each rotary valve can be automatically controlled by an external control unit. When the external control unit determines that each rotary valve rotates to a certain optional through hole, the rotary valve can rotate to that certain optional through hole.

[0068] exist Figure 6In the illustrated embodiment, optional through-holes 1, 5, and 8 of the first rotary valve 621 are sealed with plugs, while optional through-hole 2 is connected to a first nitrogen port via a pipeline. This first nitrogen port can be used to input nitrogen from the top of the container 610, providing positive pressure and purging nitrogen from top to bottom into the fluid container 610. Optional through-hole 3 of the first rotary valve 621 is connected to a first sample inlet via a pipeline, which is used to introduce a first liquid sample into the fluid container 610. Optional through-hole 4 of the first rotary valve 621 is connected to a first cleaning solution inlet via a pipeline, which is used to introduce a cleaning solution into the fluid container 610. Optional through-holes 1, 5, and 8 of the second rotary valve 622 are sealed with plugs, while optional through-hole 2 is connected to a second nitrogen port via a pipeline, which is used to input nitrogen from the bottom of the container 610. When liquid is present at the bottom of the container, nitrogen input from the bottom must pass through the liquid at the bottom of the container and enter the space above the liquid. When the nitrogen passes through the liquid at the bottom of the container, it stirs the liquid and helps mix the liquid. This can be used to purge nitrogen gas from the bottom to the top of the fluid container 610. The optional through-hole 3 of the second rotary valve 622 is connected to the second sample introduction port via a pipeline. The second sample introduction port is used to deliver a second liquid sample into the fluid container 610 from the bottom of the fluid container 610. The optional through-hole 4 of the second rotary valve 622 is connected to the second cleaning solution port via a pipeline. The second cleaning solution port is used to deliver a cleaning solution from the bottom of the fluid container 610. The optional through-hole 7 of the second rotary valve 622 is connected to the sample outlet via a pipeline to draw the liquid sample from the fluid container 610. The optional through-hole 6 of the second rotary valve 622 is connected to the second waste outlet via a pipeline to draw waste liquid / waste gas (waste liquid, waste gas, or a mixture of waste gas and waste liquid). Typically, the optional through hole 1 of each rotary valve 621 and 622 is the initial selection position of the valve, and the optional through hole 1 is sealed by a plug. In this case, the various hole positions of the rotary valves 621 and 622 are not connected to each other.

[0069] In another embodiment, the nitrogen gas may also be replaced by other stable gases (such as inert gases, etc.), and the nitrogen ports may also be collectively referred to as gas ports. In this embodiment, two rotary valves are shown. In fact, three or more rotary valves may also be provided to mix and draw out a plurality of liquid samples. In any case, at least one rotary valve (such as the second rotary valve 622) has an optional through-hole connected to the sample outlet for discharging the mixed liquid sample. Each rotary valve has a connecting hole connected to the nitrogen port, a connecting hole connected to the sample introduction port, and a connecting hole connected to the cleaning solution port.

[0070] The fluid container 610 has a cavity formed within it. The top of the fluid container 610 is provided with one or more through-holes communicating with the cavity, and the bottom of the fluid container 610 is provided with one or more through-holes communicating with the cavity. One through-hole 613 located in the top (e.g., a through-hole located on the side of the top) can be connected to a common through-hole of the first rotary valve 621 via a pipeline 630. Another through-hole 613 located in the top (e.g., a through-hole located in the center of the top) can be connected to a first waste outlet via a pipeline 630 to remove waste liquid or gas. A through-hole located in the bottom can be connected to a common through-hole of the second rotary valve 621 via a pipeline 630.

[0071] Figure 7a and Figure 7b A schematic structural diagram of a fluid container 610 in one embodiment of the present invention is given. Figure 7a and Figure 7b As shown, the fluid container 610 includes a cup body 611 and a cup cover 612. The cup cover 612 and the cup body 611 can be sealed by tightening with threads. In other embodiments, the cup cover 612 can be integrally provided with the cup body 611. In this case, the "cup cover" is no longer a cover that can be removed from the cup body. The cup cover in this article is a broad concept and does not only refer to the cover of the cup. A cavity 619 is defined in the cup body 611. The cup cover 612 is provided with a plurality of through holes 613, which are connected to the cavity 619, wherein one through hole 613 is located at the top of the cup cover 612, and the other through holes are located on the side of the cup cover 612. A through hole 613 is also provided at the bottom of the cup body 611, which is connected to the cavity 619. Combined Figure 6 As shown, in Figure 7a and Figure 7b When the fluid container 610 is used in the fluid processing device 600, a through hole 613 of the cup cover 612 (such as a through hole located on the side of the cup cover) can be connected to the common through hole of the first rotary valve 621 through a pipeline 630, and a through hole 613 of the cup cover 612 (such as a through hole located at the top) can discharge waste liquid or waste gas through the pipeline 630, and a through hole located at the bottom can be connected to the common through hole of the second rotary valve 622 through the pipeline 630.

[0072] Figure 8a and Figure 8b A schematic structural diagram of the fluid container 610 in another embodiment of the present invention is given. Figure 8a and Figure 8bAs shown, the fluid container 610 includes a cup body 614, a cup head 615 located at one end of the cup body 614, and a cup tail 616 located at the other end of the cup body 614. The cup body 614, the cup head 615, and the cup tail 616 are integrated. A cavity 619 is defined in the cup body 614. A plurality of through holes 613 are provided on the cup head 615, and the through holes are connected to the cavity 619, wherein one through hole 613 is located at the top of the cup head 615, and the other through holes are located on the side of the cup head 615. A plurality of through holes 613 are provided on the cup tail 616, and the through holes are connected to the cavity 619, wherein one through hole 613 is located at the bottom of the cup body 615, and the other through holes are located on the side of the cup tail 615. In one embodiment, Figure 8c Shows the formation Figure 8a and Figure 8b Schematic diagram of the cup blank 617 of the fluid container 610 shown. Figure 8c As shown, two cup blanks 617 are welded together to form Figure 8a and Figure 8b A fluid container 610 is shown.

[0073] Combine Figure 6 As shown, in Figure 8a and Figure 8b When the fluid container 610 is used in the fluid processing device 600, a through hole 613 of the cup head 615 (for example, a through hole located on the side of the cup head 615) can be connected to the common through hole of the first rotary valve 621 through a pipeline 630, a through hole 613 of the cup head 615 (for example, a through hole located in the center of the cup head 615) can discharge waste liquid or waste gas through the pipeline 630, and a through hole of the cup tail 615 can be connected to the common through hole of the second rotary valve 622 through the pipeline 630.

[0074] The working principle of the fluid processing device 600 is described below.

[0075] 1. The fluid container 610 receives the first liquid sample through the first rotary valve 621 .

[0076] Before receiving the first liquid sample, the first rotary valve 621 and the second rotary valve 622 are both rotated to the optional through hole 1 (i.e., the optional through hole 1 and the shared through hole are connected), and there is no liquid in each pipeline. The first rotary valve 621 is rotated to the optional through hole 3, and the first liquid sample enters the fluid container 610 through the pipeline 630 and the first rotary valve 621. If there are bubbles in the first liquid sample, these bubbles will be discharged through the through hole and pipeline at the top of the fluid container 610 to remove waste liquid or waste gas. After the first liquid sample is received, the first rotary valve 621 is rotated to the optional through hole 2, and all the liquid in the pipeline 630 between the first rotary valve 621 and the fluid container 610 is sent to the fluid container 610 by nitrogen.

[0077] Second, the fluid container 610 receives the second liquid sample through the second rotary valve 622 .

[0078] Before receiving the second liquid sample, the first rotary valve 621 and the second rotary valve 622 are both rotated to the optional through hole 1 (i.e., the optional through hole 1 and the shared through hole are connected), and there is no liquid in each pipeline. The second rotary valve 622 is rotated to the optional through hole 3, and the second liquid sample enters the fluid container 610 through the pipeline 630 and the second rotary valve 622. If there are bubbles in the second liquid sample, these bubbles will be removed through the through hole and pipeline at the top of the fluid container 610 to remove waste liquid or waste gas. After the second liquid sample is received, the second rotary valve 622 is rotated to the optional through hole 2, and all the liquid in the pipeline 630 between the second rotary valve 622 and the fluid container 610 is sent to the fluid container 610 by nitrogen.

[0079] 3. The fluid container 610 mixes the liquid sample.

[0080] The second rotary valve 622 is rotated to the optional through hole 2, and nitrogen gas is introduced into the fluid container 610 for bubbling. The liquid samples (e.g., the first liquid sample and the second liquid sample) in the fluid container 610 are mixed uniformly by bubbling. After the bubbling is completed, the second rotary valve 622 is switched to the optional through hole 1.

[0081] 4. Draw the liquid sample out of the fluid container 610.

[0082] The second rotary valve 622 is rotated to the optional through-hole 7 , and the liquid sample in the fluid container 610 is drawn out through the optional through-hole 7 of the second rotary valve 622 .

[0083] 5. Cleaning the fluid container 610.

[0084] After the liquid sample in the fluid container 610 is drawn out, or when needed, the first rotary valve 621 can be rotated to the optional through-hole 4 to introduce the cleaning solution into the fluid container 610. The excess cleaning solution can overflow through the through-hole at the top of the fluid container 610 for waste removal. The second rotary valve 622 can also be simultaneously switched to the optional through-hole 6 to allow the cleaning solution in the fluid container 610 to be discharged into the waste. The first rotary valve 621 can be switched to the optional through-hole 2 to blow the cleaning solution in the connecting pipeline 630 between the first rotary valve 621 and the fluid container 610 into the fluid container 610.

[0085] Switch the second rotary valve 622 to the optional through hole 4 to introduce the cleaning solution into the fluid container 610. The excess cleaning solution can overflow through the through hole at the top of the fluid container 610 to discharge the waste liquid. Switch the second rotary valve 622 to the optional through hole 2 to blow the cleaning solution in the connecting pipeline 630 between the second rotary valve 622 and the fluid container 610 into the fluid container 610.

[0086] Finally, the second rotary valve 622 is switched to the optional through hole 6 to drain all the cleaning solution in the fluid container 610 into the waste liquid. The first rotary valve 621 and the second rotary valve 622 are switched to the optional through hole 1 to complete the cleaning of the fluid container 610 and the pipeline 630.

[0087] In this way, the fluid container 610 can conveniently realize the introduction, mixing and extraction of liquid samples, as well as the cleaning of the fluid container 620.

[0088] The fluid container 610 can be connected to multiple rotary valves and set with multiple liquid sample inlets for receiving liquid samples from different sources. Each passage is equipped with a corresponding cleaning port (a port for connecting a cleaning solution) for cleaning the fluid container 610 and the connecting pipelines to prevent cross contamination.

[0089] The lowest point of the bottom of the fluid container 610 has a through hole connected to a rotary valve for drawing out liquid samples and draining the cleaning solution in the fluid container 610. It can also be configured as an inlet for liquid samples. Multiple liquid sample outlets can also be provided for transferring samples to different liquid sample consumption ends.

[0090] For non-uniform liquid samples, such as those containing bubbles, the bubbles are directly discharged through the through-hole at the top center of the fluid container 610 after entering the fluid container 610. If the composition ratios of the liquid sample differ before and after entering the fluid container 610, the liquid sample will initially mix naturally. If this natural mixing is uneven, nitrogen bubbling can be introduced through the through-hole at the bottom center of the fluid container 610 to further mix the sample. This design ensures that the liquid sample is uniform and bubble-free upon exiting, facilitating ease of use at the user end.

[0091] The total capacity of the fluid container 610 is typically less than 200 ml, such as 5 ml or 30 ml. The fluid processing device 600 of the present invention can be used to mix multiple liquid samples into a desired mixed liquid sample in real time, and the mixed liquid sample can be supplied to an external device, such as a semiconductor processing device, thereby achieving online real-time processing.

[0092] In one embodiment, the first liquid sample can be an extraction solution containing contaminants drawn from the edge micro-processing space 130, and the second liquid sample can be a dilution solution. The liquid sample drawn from the sample outlet can be introduced into a detection instrument to measure the concentration of contaminants in the extraction solution. This allows for online, real-time detection of edge contaminants.

[0093] According to another aspect of the present invention, a fluid processing method based on the fluid processing device 600 is provided, comprising: receiving a first liquid sample and a second liquid sample in the fluid container 610 via a first rotary valve 621; mixing the liquid samples in the fluid container 610; draining the liquid samples from the fluid container 610; and cleaning the fluid processing device 600. The details are similar to those described for the fluid processing device 600 and will not be repeated here.

[0094] Fourth embodiment

[0095] Figure 9 FIG. 1 is a schematic diagram showing the principle of an automatic solution preparation device 900 according to an embodiment of the present invention.

[0096] In one embodiment, the automatic solution preparation device 900 of the present invention can be used in conjunction with the fluid processing device 600 described in the third embodiment to form a fluid processing system. The prepared solution obtained by the automatic solution preparation device 900 can be used as a sample solution of the fluid processing device 600, or the mixed liquid sample obtained by the fluid processing device 600 can also be used as a stock solution of the automatic solution preparation device 900.

[0097] In another embodiment, the automatic solution preparation device 900 of the present invention can be used in conjunction with a semiconductor processing device 100 or 200 to form a semiconductor processing system. Specifically, the prepared solution provided by the automatic solution preparation device 900 can be introduced into the edge micro-processing space 130 through the edge processing through-holes, and fluid can also be drawn from the edge micro-processing space 130 through the edge processing through-holes to serve as a raw liquid for the automatic solution preparation device 900. Of course, in other embodiments, the fluid processing device can also work in conjunction with other devices to provide or extract fluid.

[0098] In yet another embodiment, the automatic solution preparation device 900 of the present invention, the fluid processing device 600 and the semiconductor processing device 100 or 200 can work together to form a semiconductor processing system.

[0099] like Figure 9 As shown, the automatic solution preparation device 900 includes a first rotary valve 911, a second rotary valve 912, a third rotary valve 913, a fourth rotary valve 914, a fifth rotary valve 915, one or more first quantitative rings 921 and 922 connected between the second rotary valve 912 and the third rotary valve 913, a second quantitative ring 923 connected between the fourth rotary valve 914 and the fifth rotary valve 915, and a pipeline 930 connected between the various components.

[0100] Each rotary valve 911-915 includes a common through hole and one or more optional through holes (1-8). The controlled automatic rotation of each rotary valve 911-915 can connect the common through hole with any one of the one or more optional through holes (1-8) through an internal passage, and the various optional through holes are not connected to each other. The common through hole is located in the center, and the various optional through holes are arranged around the common through hole. The number of the optional through holes can be selected as needed. Figure 9 The number of optional through holes for each rotary valve can be set as needed, such as 2, 3, 6, or other numbers. The rotation or rotation of each rotary valve can be automatically controlled by an external control unit. If the external control unit wants each rotary valve to rotate to a certain optional through hole, the rotary valve will automatically rotate to that selected through hole.

[0101] exist Figure 9 In the illustrated embodiment, optional through-holes 1, 3-6 of the first rotary valve 911 are sealed with plugs. Optional through-hole 2 is connected to a nitrogen port via a pipeline. This nitrogen port can be used to blow nitrogen into the first rotary valve 911 to provide positive pressure. Optional through-hole 8 of the first rotary valve 911 receives a first diluent 941 via a pipeline, while optional through-hole 7 of the first rotary valve 911 receives a second diluent 942 via a pipeline.

[0102] The optional through-holes 1-6 of the second rotary valve 912 are sealed with plugs. The optional through-holes 1, 4-8 of the third rotary valve 913 are sealed with plugs. The optional through-hole 8 of the second rotary valve 912 is connected to the optional through-hole 2 of the third rotary valve 913 via a first metering ring 921. The optional through-hole 7 of the second rotary valve 912 is connected to the optional through-hole 3 of the third rotary valve 913 via another first metering ring 922. The common through-hole of the second rotary valve 912 is connected to the common through-hole of the first rotary valve 911 via a pipeline 930.

[0103] The optional through-holes 1, 4-7 of the fourth rotary valve 914 are sealed with plugs. The optional through-hole 8 of the fourth rotary valve 914 is connected to the common through-hole of the third rotary valve 913 via pipeline 930. The optional through-hole 2 of the fourth rotary valve 914 receives the first stock solution 943 via pipeline 930, and the optional through-hole 3 of the fourth rotary valve 914 receives the second stock solution 944 via pipeline 930. The common through-hole of the fourth rotary valve 914 is connected to the common through-hole of the fifth rotary valve 915 via the second metering ring 923.

[0104] The optional through holes 1, 3-6 of the fifth rotary valve 915 are sealed with plugs. The optional through hole 8 of the fifth rotary valve 915 is used to discharge the first preparation liquid 945, and the optional through hole 7 of the fifth rotary valve 915 is used to discharge the second preparation liquid 946. The optional through hole 2 of the fifth rotary valve 915 is used to discharge the waste liquid 947 by vacuum.

[0105] In another embodiment, the nitrogen may also be replaced by other stable gases (such as inert gases, etc.). In this embodiment, two diluents, two stock solutions, and two preparation solutions are shown. In other embodiments, there may also be one diluent, one stock solution, and one preparation solution. In this case, each rotary valve also needs to seal the corresponding selection through-holes with a plug, leaving only the selection through-hole connected to one diluent, the selection through-hole connected to one stock solution, and the selection through-hole connected to one preparation solution. In another embodiment, there may also be three or more diluents, three or more stock solutions, and three or more preparation solutions. In this case, each rotary valve also needs to be provided with a corresponding number of selection through-holes connected to the corresponding diluents, a corresponding number of selection through-holes connected to the corresponding stock solutions, and a corresponding number of selection through-holes connected to the corresponding preparation solutions.

[0106] The quantitative ring is a section of tube with a certain internal volume. Its theoretical volume can be calculated by measuring the inner diameter and length of the tube. After the liquid fills the quantitative ring, a fixed volume of liquid can be obtained by switching the valves at both ends. The volume of the quantitative ring can be accurately measured by weight. Each quantitative ring 921, 922 and 923 can accommodate a certain volume of liquid, such as 1ml, 10ml, 100ml or smaller volume of liquid. The capacity provided by the quantitative ring is very accurate. The capacity of the first quantitative ring 921 and 922 can be different, and the capacity can be set as needed. The capacity of the second quantitative ring 923 can be different from the first quantitative ring 923, and the capacity can also be set according to the needs of the application. By preparing the capacity of the first quantitative ring and the second quantitative ring in advance, the ratio of the diluent and the original solution in the prepared liquid can be accurately set. Figure 9 In the embodiment given, two first quantitative rings 921 and 922 are used. In an alternative embodiment, only one first quantitative ring 921 may be used. In another embodiment, three or more first quantitative rings may be used. Figure 9 In the given embodiment, one second quantitative ring 923 is used. In other embodiments, multiple second quantitative rings may also be used.

[0107] The diluents 941 and 942, the stock solutions 943 and 944, and the prepared solutions 945 and 946 can be stored in corresponding containers or transferred in real time through pipelines. The waste liquid 947 can be placed in a waste liquid container or discharged through pipelines.

[0108] The following describes the working principle of the automatic solution dilution and preparation device 900 by taking the diluent, stock solution, and preparation solution as normal pressure and the waste liquid as negative pressure, and mixing the first diluent 941 and the first stock solution 943 in a certain proportion as an example.

[0109] First, the first diluent is transferred to the first quantitative loop 921 .

[0110] In one embodiment, the shared through-hole of the first rotary valve 911 is connected to its selected through-hole 8, that is, to the first diluent 941; the shared through-hole of the second rotary valve 912 is connected to its selected through-hole 8; the shared through-hole of the third rotary valve 913 is connected to its selected through-hole 2; the shared through-hole of the fourth rotary valve 914 is connected to its selected through-hole 8; and the shared through-hole of the fifth rotary valve 915 is connected to its selected through-hole 2, thereby connecting to a waste liquid container, wherein the waste liquid container is at a negative pressure. In this context, negative or positive pressure at a particular port can be used to drive the flow of liquid.

[0111] When the common through hole of the first rotary valve 911 is connected to the optional through hole 8, the first diluent 941 is connected. The negative pressure in the waste liquid container allows the first diluent 941 to enter the first rotary valve 911 through the optional through hole 8 of the first rotary valve 911, and then exit from the common through hole of the first rotary valve 911, enter the second rotary valve 912 through the common through hole of the second rotary valve 912; then exit from the optional through hole 8 of the second rotary valve 912, pass through the first quantitative ring 921, enter the third rotary valve 913 through the optional through hole 2 of the third rotary valve 913; then flow out from the common through hole of the third rotary valve 913; and then enter from the optional through hole 8 of the fourth rotary valve 914. The first diluent 941 flows into the fourth rotary valve 914, comes out from the common through hole of the fourth rotary valve 914, passes through the third quantitative ring 923, and enters the fifth rotary valve 915 from the common through hole of the fifth rotary valve 915; finally, it comes out from the optional through hole 2 of the fifth rotary valve 915 and flows into the waste liquid container. The first diluent 941 is allowed to flow in the above-mentioned channel for a period of time. Since the waste liquid container is under negative pressure or vacuum, the first diluent 941 flows through the pipeline through each rotary valve, quantitative ring and connecting pipeline into the waste liquid container, flushing the rotary valve, quantitative ring and connecting pipeline and expelling bubbles.

[0112] Similarly, in another embodiment, a similar method can be used to transfer the first diluent to another first dosing ring 922. This only requires adjusting the second rotary valve 912 and the third rotary valve 913 to connect to the selected through hole corresponding to the other first dosing ring 922. That is, the second rotary valve 912 switches from selecting through hole 6 to selecting through hole 7, and the third rotary valve 913 switches from selecting through hole 2 to selecting through hole 3. At this time, since the first dosing ring has been replaced, the liquid ratio has changed. In yet another embodiment, a similar method can be used to transfer the second diluent 942 to the first dosing ring 921 or 922. This only requires adjusting the first rotary valve 911 from selecting through hole 8 to selecting through hole 7 connected to the second diluent 942.

[0113] Afterwards, the first stock solution 943 is transferred to the second quantitative ring 923 .

[0114] In one embodiment, the shared through-hole of the fourth rotary valve 914 is changed from being connected to its selected through-hole 8 to being connected to its selected through-hole 2, that is, to the first stock solution 943. Since the waste liquid container is under negative pressure or vacuum, the first stock solution 943 flows through the selected through-hole 2 of the fourth rotary valve 914 via the pipeline 930, enters the fourth rotary valve, exits from the shared through-hole of the fourth rotary valve 914, passes through the second metering ring 923, enters the rotary valve 915 through the shared through-hole of the fifth rotary valve 915, and then exits from the selected through-hole 2 of the fifth rotary valve 915 and flows into the waste liquid container. The first stock solution 943 is allowed to flow in this channel for a period of time to rinse the pipeline and expel bubbles.

[0115] Similarly, in another embodiment, a similar method can be used to transfer the second stock solution 944 to the second quantitative ring 923 , which only requires the fourth rotary valve 914 to switch from selecting through hole 2 to selecting through hole 3 , that is, to connect the second stock solution 944 .

[0116] Subsequently, the first dilution solution 941 and the first stock solution 943 are transferred to the container of the first preparation solution 945 .

[0117] In one embodiment, the shared through-hole of the first rotary valve 911 is changed from communicating with its selected through-hole 8 to communicating with its selected through-hole 2, the shared through-hole of the fourth rotary valve 914 is changed from communicating with its selected through-hole 2 to communicating with its selected through-hole 8, and the shared through-hole of the fifth rotary valve 915 is changed from communicating with its selected through-hole 2 to communicating with its selected through-hole 8. The nitrogen pressure causes all liquid in the pipeline 930, including the first diluent in the first metering loop 921 and the first stock solution 943 in the second metering loop 913, to enter the container of the first preparation solution 945 (e.g., a preparation bottle), thereby completing the automatic and precise preparation of a low-concentration chemical solution.

[0118] Similarly, in another embodiment, a similar method can be used to transfer the second diluent 942 and the second stock solution 944 to the container of the second preparation liquid 946 (such as the preparation bottle 2). At this time, the fifth rotary valve 915 needs to be switched from selecting through hole 8 to selecting through hole 7.

[0119] The concentration of the prepared solution (i.e., the first prepared solution 945) is C 稀 It can be calculated according to formula 1:

[0120] ◆C 原 = concentration of the first stock solution;

[0121] ◆V 定1 = volume of the first quantitative ring 921;

[0122] ◆V 定3 = volume of the second quantitative ring 923;

[0123] ◆V 连12 = the volume of the pipeline between the common through-hole of the first rotary valve 911 and the common through-hole of the second rotary valve 912;

[0124] ◆V 连34 = the volume of the pipe connection between the common through hole of the third rotary valve 913 and the optional through hole 8 of the fourth rotary valve 914;

[0125] ◆V 阀1 =Intrinsic volume of the first rotary valve 911

[0126] ◆V 阀2 = intrinsic volume of the second valve 912

[0127] ◆V 阀3 =Intrinsic volume of the third valve 913

[0128] ◆V 阀4 = Intrinsic volume of the fourth valve 914

[0129] ◆V 阀5 =Intrinsic volume of the fifth valve 915

[0130] ◆V 原 = Volume of the first stock solution = V 定3 +V 阀4 +V 阀5

[0131] ◆V 稀 = Volume of the first dilution = V 定1 +V 阀1 +V 阀2 +V 阀3 +V 连12 +V 连34

[0132] ◆

[0133] The amount of the first diluent in the whole dilution process is the sum of the valve head volumes of the first rotary valve, the second rotary valve and the third rotary valve, the volume of the first quantitative ring 921, the volume of the pipeline between the common through hole of the first rotary valve and the common through hole of the second rotary valve, and the volume of the pipeline between the common through hole of the third rotary valve and the selected through hole 8 of the fourth rotary valve. Different diluent amounts can be switched by selecting quantitative rings of different volumes between the second rotary valve and the third rotary valve (for example, selecting another first quantitative ring 922). The amount of stock solution in the dilution process is the sum of the valve head volumes of the fourth rotary valve and the fifth rotary valve, the volume of the second quantitative ring 923. When the volume of the second quantitative ring 923 is not changed, the volume of the stock solution is a fixed value. The dilution ratio of the stock solution can be changed by changing the first quantitative ring between the second rotary valve and the third rotary valve.

[0134] The automatic solution dilution device of the present invention has the following characteristics:

[0135] 1) One or more diluents and one or more stock solutions can be selected to prepare solutions with different ingredients;

[0136] 2) Select one or more dilution ratios to meet the needs of preparing solutions of different concentrations;

[0137] 3) Except for the pipeline between the preparation liquid bottle and the fifth rotary valve, which cannot be cleaned, all other components in the flow path are flushed with diluent or stock solution before preparation. The waste liquid after flushing is discharged into the waste liquid bottle. This flushing can ensure that no contamination is introduced during the solution preparation process;

[0138] 4) During the solution preparation process, the stock solution flows out first, and the diluent then flows out through the stock solution measurement and discharge path. All places in the pipeline where the stock solution flows are cleaned by the subsequent diluent, and all the stock solution is brought to the preparation liquid container by the diluent, ensuring that no stock solution is lost during the dilution process and cross contamination is minimized; ensuring the accuracy of the dilution.

[0139] 5) The solution preparation process is completed only by rotating the rotary valve. The volume quantitative repeatability of the dilution solution and the original solution is high. The inherent volume generated by the valve and connecting pipeline can be reduced by using the shortest and smallest inner diameter connecting pipeline possible. Through experiments, the precise weight method is used to accurately measure the total inherent volume of the device to achieve accurate automatic preparation of ultra-low concentration chemical solutions.

[0140] The above description fully discloses the specific embodiments of the present invention. It should be noted that any modifications made by those skilled in the art to the specific embodiments of the present invention do not depart from the scope of the claims. Accordingly, the scope of the claims of the present invention is not limited to the specific embodiments described above.

Claims

1. An automatic solution preparation device, characterized in that: It includes: pipelines; a first rotary valve, a second rotary valve, a third rotary valve, a fourth rotary valve, and a fifth rotary valve, wherein each rotary valve comprises a common through-hole and a plurality of optional through-holes, wherein the common through-hole can be connected to one of the plurality of optional through-holes through an internal passage by controlled automatic rotation of the rotary valve; at least one optional through-hole of the first rotary valve receives at least one diluent through the pipeline; the common through-hole of the second rotary valve is connected to the common through-hole of the first rotary valve through a pipeline; the common through-hole of the third rotary valve is connected to one optional through-hole of the fourth rotary valve through a pipeline; at least one optional through-hole of the fourth rotary valve receives at least one raw liquid; at least one optional through-hole of the fifth rotary valve is connected to a preparation liquid container through a pipeline; and one optional through-hole of the fifth rotary valve discharges waste liquid through a pipeline; At least one first quantitative ring, wherein each first quantitative ring is connected between a selected through hole of the second rotary valve and a selected through hole of the third rotary valve; The second quantitative ring is communicated between the common through hole of the fourth rotary valve and the common through hole of the fifth rotary valve.

2. The automatic solution preparation device according to claim 1, characterized in that: The first rotary valve, the second rotary valve, the third rotary valve, the fourth rotary valve and the fifth rotary valve are controlled so that: transferring a diluent into a first dosing loop; transferring a stock solution into a second quantitative loop; The diluent and the stock solution are transferred together to a preparation liquid container.

3. The automatic solution preparation device according to claim 2, characterized in that: The delivering of a diluent into the first quantitative loop comprises: The controlled automatic rotation of the first rotary valve enables its common through-hole to receive a diluent through the corresponding optional through-hole; The controlled automatic rotation of the second rotary valve and the third rotary valve enables the first metering ring to communicate between the common through hole of the second rotary valve and the common through hole of the third rotary valve through the corresponding selected through hole; The controlled automatic rotation of the fourth rotary valve causes the common through hole of the fourth rotary valve to communicate with the common through hole of the third rotary valve via the corresponding optional through hole; The controlled automatic rotation of the fifth rotary valve causes the common through-hole of the fifth rotary valve to discharge the waste liquid through the corresponding optional through-hole.

4. The automatic solution preparation device according to claim 3, characterized in that: The transferring of a stock solution into the second quantitative loop comprises: The controlled automatic rotation of the fourth rotary valve causes the common through hole of the fourth rotary valve to receive a raw liquid through the corresponding optional through hole; The controlled automatic rotation of the fifth rotary valve causes the common through-hole of the fifth rotary valve to discharge the waste liquid through the corresponding optional through-hole.

5. The automatic solution preparation device according to claim 4, characterized in that: The step of transferring the diluent and the stock solution together to the preparation liquid container comprises: The controlled automatic rotation of the fifth rotary valve causes the common through hole of the fifth rotary valve to communicate with the preparation liquid container via the corresponding optional through hole; The first rotary valve is rotated so that the common through hole of the first rotary valve receives nitrogen through the corresponding optional through hole, so as to transfer the diluent and the original solution to the preparation liquid container.

6. The automatic solution preparation device according to claim 1, characterized in that: There are two first quantitative rings, and the volumes of the two first quantitative rings are different. The stock solution includes a first stock solution and a second stock solution, the preparation liquid container includes a first preparation liquid container and a second preparation liquid container, and the diluent includes a first diluent and a second diluent. By configuring the first rotary valve, the second rotary valve, and the third rotary valve, each dilution can be transferred to any one of the two first quantitative loops. By configuring the fourth rotary valve, each stock solution can be transferred to the second quantitative loop. The preparation liquid can be discharged into each preparation liquid container by configuring the fifth rotary valve.

7. The automatic solution preparation device according to claim 1, characterized in that: The waste liquid discharge point provides vacuum as negative pressure and nitrogen as positive pressure.

8. A semiconductor processing system comprising: A semiconductor processing apparatus includes: a first chamber portion; and a second chamber portion movable relative to the first chamber portion between an open position and a closed position, wherein when the second chamber portion is in the closed position relative to the first chamber portion, a microchamber is formed between the first chamber portion and the second chamber portion, wherein a semiconductor wafer can be accommodated in the microchamber, and when the second chamber portion is in the open position relative to the first chamber portion, the semiconductor wafer can be taken out of or placed in the microchamber. The first chamber portion has a first groove formed on an inner wall surface of the first chamber portion facing the microchamber, and the second chamber portion has a second groove formed on an inner wall surface of the second chamber portion facing the microchamber. When the second chamber portion is in the closed position relative to the first chamber portion and the semiconductor wafer is accommodated in the microchamber, the first groove and the second groove communicate with each other and together form an edge microprocessing space, wherein an outer edge of the semiconductor wafer accommodated in the microchamber extends into the edge microprocessing space, and the edge microprocessing space is communicated with the outside through an edge processing through-hole, and a fluid enters or flows out of the edge microprocessing space through the edge processing through-hole. The automatic solution preparation device according to any one of claims 1 to 7.

9. The semiconductor processing system according to claim 8, wherein: The solution prepared by the automatic solution preparation device is introduced into the edge micro-processing space; or, The processing liquid drawn out from the edge micro-processing space is used as a raw liquid of the automatic solution preparation device.

10. The semiconductor processing system according to claim 8, wherein: The first chamber portion has a sealing joint portion located outside the first channel, and the second chamber portion has a joint groove corresponding to the sealing joint portion; The first side surface, the second side surface and the outer end surface of the outer edge of the semiconductor wafer are exposed to the edge micro-processing space, one or more of the edge processing through holes serve as a fluid inlet, and one or more of the edge processing through holes serve as a fluid outlet. The edge micro-processing space is annular or arc-shaped, and the outer edge of the semiconductor wafer extends into the edge micro-processing space. The edge micro-processing space is a closed space and communicates with the outside through an edge processing through-hole; The top surface of the inner sidewall of the first groove abuts against the first side surface of the semiconductor wafer near the first chamber portion, and the top surface of the inner sidewall of the second groove abuts against the second side surface of the semiconductor wafer near the second chamber portion.

11. An automatic solution preparation method based on the automatic solution preparation device according to any one of claims 1 to 7, characterized in that: It includes: The first rotary valve, the second rotary valve, the third rotary valve, the fourth rotary valve and the fifth rotary valve are controlled so that: transferring a diluent into a first dosing loop; transferring a stock solution into a second quantitative loop; The diluent and the stock solution are transferred together to a preparation liquid container.

12. The automatic solution preparation method according to claim 11, characterized in that: The delivering of a diluent into the first quantitative loop comprises: The controlled automatic rotation of the first rotary valve enables its common through-hole to receive a diluent through the corresponding optional through-hole; The controlled automatic rotation of the second rotary valve and the third rotary valve enables the first metering ring to communicate between the common through hole of the second rotary valve and the common through hole of the third rotary valve through the corresponding selected through hole; The controlled automatic rotation of the fourth rotary valve causes the common through hole of the fourth rotary valve to communicate with the common through hole of the third rotary valve via the corresponding optional through hole; The controlled automatic rotation of the fifth rotary valve causes the common through-hole of the fifth rotary valve to discharge the waste liquid through the corresponding optional through-hole.

13. The automatic solution preparation method according to claim 12, characterized in that: The transferring of a stock solution into the second quantitative loop comprises: The controlled automatic rotation of the fourth rotary valve causes the common through hole of the fourth rotary valve to receive a raw liquid through the corresponding optional through hole; The controlled automatic rotation of the fifth rotary valve causes the common through-hole of the fifth rotary valve to discharge the waste liquid through the corresponding optional through-hole.

14. The automatic solution preparation method according to claim 12, characterized in that: The step of transferring the diluent and the stock solution together to the preparation liquid container comprises: The controlled automatic rotation of the fifth rotary valve causes the common through hole of the fifth rotary valve to communicate with the preparation liquid container via the corresponding optional through hole; The first rotary valve is rotated so that the common through hole of the first rotary valve receives nitrogen through the corresponding optional through hole, so as to transfer the diluent and the original solution to the preparation liquid container.

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