Electron gun test platform

Abstract

The application relates to an electron gun test platform, which comprises a test cavity; a parallel transfer module and a moving carrier module are arranged in the test cavity; the moving carrier module is fixed to the inner wall of the test cavity, the top of the moving carrier module is suitable for placing a silicon wafer or a silicon wafer carrier box, and the parallel transfer module is arranged on the side of the moving carrier module; the parallel transfer module comprises a driving device, a fixing seat, a moving frame and a clamping piece; the fixing seat is fixedly installed on the side of the moving carrier module and is fixed to the inner wall of the test cavity; the driving device is fixed to the fixing seat, the output end of the driving device is fixedly connected with one side of the moving frame, and the other side of the moving frame is rotationally connected with the clamping piece; the clamping piece is suitable for clamping the silicon wafer carrier box, and the driving device drives the clamping piece to move on the top of the moving carrier module. The application effectively solves the errors caused by the connection gap when the silicon wafer is taken and placed, and the repeated positioning errors of the moving module and the vacuum feeding device.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and more particularly to an electron gun testing platform. Background Technology

[0002] In the manufacturing process of the electron gun, the electron gun testing platform is used to ensure that the silicon wafer is placed and positioned to meet the electron gun testing requirements, such as wafer placement deviation. The main working principle of this platform is to break the vacuum pressure and use a vacuum feed device to send the silicon wafer to the required position for electron gun testing on the moving platform. The accuracy and speed of placement determine the speed and stability of parameter adjustment during electron gun testing.

[0003] Existing electron gun testing platforms mainly push silicon wafers to two-dimensional XY motion modules through vacuum feeding devices, but this method of connection will result in gap errors. Summary of the Invention

[0004] In view of this, this application proposes an electron gun testing platform, which effectively solves the errors caused by the connection gap when picking up and placing silicon wafers, as well as the repetitive positioning errors of the motion module and vacuum feed device.

[0005] According to one aspect of this application, an electron gun testing platform is provided, including a testing chamber;

[0006] The test chamber is equipped with a parallel transfer module and a moving vehicle module;

[0007] The mobile carrier module is fixed to the inner wall of the test chamber. The top of the mobile carrier module is suitable for placing silicon wafers or silicon wafer carriers. The parallel transfer module is located on the side of the mobile carrier module.

[0008] The parallel transfer module includes a drive unit, a fixed base, a moving frame, and a clamping component;

[0009] The fixing seat is fixedly installed on the side of the mobile carrier module, and the fixing seat is fixed to the inner wall of the test cavity;

[0010] The driving device is fixed on the fixed base, and the output end of the driving device is fixedly connected to one side of the movable frame, while the other side of the movable frame is rotatably connected to the clamping member.

[0011] The clamping member is adapted to clamp the silicon wafer carrier, and the driving device drives the clamping member to move on top of the mobile carrier module.

[0012] In one possible implementation, the movable frame includes a first rotating member and a second rotating member;

[0013] The output end of the drive device is fixedly connected to the first rotating member, and the other end of the first rotating member is hinged to the clamping member.

[0014] The fixed frame is provided with a hinge seat, one side of the second rotating member is hinged to the hinge seat, and the other side of the second rotating member is hinged to the clamping member;

[0015] The second rotating component rotates synchronously with the first rotating component.

[0016] In one possible implementation, the clamping member is provided with a first hinge rod and a second hinge rod on the side facing the first rotating member;

[0017] Both the first hinge rod and the second hinge rod are fixed to the clamping member. The side of the first rotating member that is not fixedly connected to the driving device is hinged to the first hinge rod, and the side of the second rotating member that is not hinged to the hinge part is hinged to the second hinge rod.

[0018] In one possible implementation, the clamping member includes a first component and a second component, both of which are plate-shaped and connected in an "L" shape. The second component has a clamping portion on the side of the plate facing away from the first component for clamping the silicon wafer carrier.

[0019] The mobile frame assembly is rotatably connected to the side plate of the first component facing away from the second component, and the clamping part is positioned facing the top of the mobile vehicle module.

[0020] In one possible implementation, the mobile vehicle module includes a mobile module;

[0021] The mobile module is fixedly installed on the bottom inner wall of the test chamber. A mobile platform is movably mounted on the mobile module. The mobile module drives the mobile platform to move. The top of the mobile platform is suitable for placing the silicon wafer or the silicon wafer carrier.

[0022] In one possible implementation, a transition isolation cavity is also included, which is connected to the test cavity;

[0023] The transition isolation cavity is equipped with a transport module, and the top of the transport module is suitable for placing silicon wafers or silicon wafer carriers.

[0024] An isolation door is provided at the connection between the transition isolation cavity and the test cavity, and the isolation door isolates the transition isolation cavity and the test cavity;

[0025] The isolation door is equipped with a lifting assembly for controlling the opening or closing of the isolation door;

[0026] The transition isolation cavity is provided with a pick-up and drop-off port on the side opposite to the test cavity. An end cap is detachably installed at the pick-up and drop-off port, and the end cap covers the pick-up and drop-off port.

[0027] In one possible implementation, the lifting assembly includes a lifting motor and a rotating lead screw;

[0028] The lifting motor is fixedly installed on the bottom inner wall of the test chamber, and the output end of the lifting motor is positioned facing the top of the test chamber;

[0029] The rotating lead screw is fixedly connected to the output end of the lifting motor;

[0030] The isolation door has a connecting part on its side wall, and the connecting part has an internal thread that matches the rotating lead screw.

[0031] In one possible implementation, there are two lifting assemblies, which are respectively located on both sides of the isolation door.

[0032] In one possible implementation, the top of the test chamber is provided with a mounting hole, which penetrates the top sidewall of the test chamber;

[0033] The mounting hole is located at the top of the parallel transfer module;

[0034] The mounting hole is suitable for mounting an electron gun.

[0035] In one possible implementation, the drive unit and the moving frame are fixedly connected by a beryllium copper tapered bushing;

[0036] The moving device and the clamping member are rotatably connected by a beryllium copper conical bushing.

[0037] This embodiment of the electron gun testing platform includes a testing chamber. A parallel moving module and a moving carrier module are both installed within the testing chamber. The top of the moving carrier module is used to place silicon wafers or wafer carriers, and the moving carrier module can move within the testing chamber. The parallel transfer module is used to clamp the wafer carriers, and the fixing base in the parallel transfer module is fixed to the testing chamber, providing mounting components for the drive device, the moving frame, and the clamping components. When the silicon wafer is transported to the moving carrier module, the drive device drives the moving frame to rotate, causing the clamping components on the moving frame to move towards the side of the wafer carrier where the silicon wafer is placed, and the clamping components clamp the wafer carrier. Then, the drive device drives the clamping components holding the wafer carrier to move towards the moving carrier module, placing the wafer carrier on top of the moving carrier module, completing the placement of the silicon wafer. This embodiment of the electron gun testing platform effectively solves the errors in the connection gap caused by picking up and placing silicon wafers, as well as the repetitive positioning errors of the moving module and the vacuum feed device, through the above structure.

[0038] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0039] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0040] Figure 1 This shows a front view of the electron gun testing platform according to an embodiment of this application;

[0041] Figure 2 A left view of the electron gun testing platform according to an embodiment of this application is shown;

[0042] Figure 3 A top view of the electron gun testing platform according to an embodiment of this application is shown;

[0043] Figure 4 This is a front view of the parallel transfer module of the electron gun test platform according to an embodiment of this application;

[0044] Figure 5 The left view shows the parallel transfer module of the electron gun test platform according to an embodiment of this application. Detailed Implementation

[0045] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0046] It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0048] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0049] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0050] Figure 1 This is a front view of the electron gun test platform according to an embodiment of this application. Figure 2 The left view shows an embodiment of the electron gun test platform of this application. Figure 3 This is a top view of the electron gun test platform according to an embodiment of this application. Figure 4 This is a front view of the parallel transfer module 200 of the electron gun test platform according to an embodiment of this application. Figure 5 This is a left view of the parallel transfer module 200 of the electron gun test platform according to an embodiment of this application. Figure 1 , Figure 2 , Figure 3 , Figure 4 or Figure 5As shown, the electron gun test platform includes a test chamber 100. Inside the test chamber 100 are a parallel transfer module 200 and a moving carrier module 300. The moving carrier module 300 is fixedly connected to the inner wall of the test chamber 100. A silicon wafer or wafer carrier is placed on the top of the moving carrier module 300. The parallel transfer module 200 is located beside the moving carrier module 300. The parallel transfer module 200 includes a drive unit 210, a fixed base 220, a moving frame 230, and a clamping member 240. The fixed base 220 is fixedly installed beside the moving carrier module 300 and is fixed to the inner wall of the test chamber 100. The drive unit 210 is fixedly installed on the fixed base 220. The output shaft of the drive unit 210 is fixedly connected to one side of the moving frame 230, and the other side of the moving frame 230 is rotatably connected to the clamping member 240. The clamping member 240 is used to clamp the silicon wafer carrier, and the driving device 210 drives the clamping member 240 to move on top of the moving carrier module 300.

[0051] This embodiment of the electron gun testing platform includes a testing chamber 100. A parallel transfer module and a moving carrier module 300 are both installed within the testing chamber 100. The top of the moving carrier module 300 is used to place silicon wafers or silicon wafer carriers, and the moving carrier module 300 can move within the testing chamber 100. The parallel transfer module 200 is used to clamp the silicon wafer carriers, and the fixing base 220 in the parallel transfer module 200 is fixed to the testing chamber 100, providing mounting components for the drive device 210, the moving frame 230, and the clamping member 240. When the silicon wafer is transported to the moving carrier module 300, the drive device 210 drives the moving frame 230 to rotate, causing the clamping member 240 on the moving frame 230 to move towards the side of the silicon wafer carrier where the silicon wafer is placed, and the clamping member 240 clamps the silicon wafer carrier. Subsequently, the drive device 210 moves the clamping member 240 holding the silicon wafer carrier towards the moving carrier module 300, and places the silicon wafer carrier on top of the moving carrier module 300, completing the placement of the silicon wafer. The electron gun testing platform of this application embodiment effectively solves the errors caused by the connection gap when picking up and placing silicon wafers, as well as the repetitive positioning errors of the motion module and the vacuum feed device, through the above-described structure.

[0052] In one possible implementation, the movable frame 230 includes a first rotating member 231 and a second rotating member 232. The output end of the drive device 210 is fixedly connected to the first rotating member 231, and the other end of the first rotating member 231 is hinged to the clamping member 240. A hinge seat is provided on the fixed frame. One side of the second rotating member 232 is hinged to the hinge seat, and the other side of the second rotating member 232 is hinged to the clamping frame. When the drive device 210 drives the first rotating member 231 to rotate, the second rotating member 232 rotates synchronously with the first rotating member 231. By configuring the movable frame 230 as a first rotating member 231 and a second rotating member 232, the structure of this embodiment is made more stable.

[0053] Furthermore, in one possible implementation, the clamping member 240 has a first hinge rod 260 and a second hinge rod 250 on the side facing the first rotating member 231. Both the first hinge rod 260 and the second hinge rod 250 are fixed to the clamping member 240. The side of the first rotating member 231 not fixedly connected to the driving device 210 is hinged to the first hinge rod 260, and the side of the second rotating member 232 not hinged to the hinged part is hinged to the second hinge rod 250. This further optimizes the structure of the embodiment of this application.

[0054] It should be noted here that, in one possible implementation, both the first rotating member 231 and the second rotating member 232 are plate-shaped, and the hinge seat is rod-shaped. The hinge seat is positioned above the driving device 210, and after the first rotating member 231 and the second rotating member 232 are installed, they are arranged in parallel. Thus, the first rotating member 231, the second rotating member 232, the clamping member 240, and the fixed base 220 form a parallelogram-shaped translational mechanism, making the structure of this embodiment more stable.

[0055] It should also be noted here that, in one possible implementation, the plate surface of the second rotating member 232 and the plate surface of the first rotating member 231 are both disposed facing the fixed base 220, and the second rotating member 232 is disposed adjacent to the fixed base 220.

[0056] In one possible implementation, the clamping member 240 includes a first component 241 and a second component 242, both of which are plate-shaped and connected in an "L" shape. A clamping portion is provided on the side of the second component 242 facing away from the first component 241, for clamping a silicon wafer carrier. A movable frame 230 is rotatably connected to the side of the first component 241 facing away from the second component 242, with the clamping portion facing the top of the movable carrier module 300. Thus, by utilizing the structure of the clamping member 240, the clamping portion can be positioned at the top of the movable carrier module 300.

[0057] It should be noted here that, in one possible implementation, the clamping part is in the shape of a groove, and clamping members are provided on the groove walls opposite to the clamping part. The clamping members are in the shape of plates arranged along the groove walls of the clamping part. Thus, the silicon wafer carrier can be clamped more securely through the above structure.

[0058] It should also be noted here that, in one possible implementation, the mounting base 220 is an "L"-shaped plate, thereby allowing the drive device 210 to be fixedly mounted on one side of the mounting base 220, and the mounting base 220 is fixedly connected to the inner wall of the test chamber 100 on the side of the plate on which the drive device 210 is not fixed.

[0059] It should also be noted here that, in one possible implementation, the drive device 210 can be implemented using a motor, which will not be elaborated here.

[0060] In one possible implementation, the mobile carrier module 300 includes a mobile module fixedly mounted on the bottom inner wall of the test gun. A mobile platform is movably mounted on the mobile module, and the mobile module drives the mobile platform. The top of the mobile platform is used to place a silicon wafer or silicon wafer carrier. Thus, the mobile platform provides placement space for the silicon wafer or silicon wafer carrier, and the mobile module can control the movement of the mobile platform, thereby enabling the silicon wafer to be transported within the test chamber 100.

[0061] It should be noted here that, in one possible implementation, the moving module includes a first support base, a second support base, a third support base, a fourth support base, a first drive screw, a first stabilizing rod, a second drive screw, and a second stabilizing rod. Both the first and second support bases are plate-shaped and fixedly connected to the bottom inner wall of the test chamber 100. The plate surfaces of the first and second support bases are arranged opposite to each other, with a gap between them. The two ends of the first drive screw are rotatably connected to the first and second support bases, respectively, and the first drive screw has an extension end extending beyond the first support base. A drive motor is fixedly mounted on the extension end of the first drive screw to drive its rotation. The two ends of the first stabilizing rod are fixedly connected to the first and second support bases, respectively, and the first stabilizing rod and the first drive screw are arranged parallel to each other.

[0062] Both the third and fourth support seats are plate-shaped. The third support seat has a first connecting hole and a second connecting hole on its plate surface. The first connecting hole is a threaded hole and matches the first drive screw. The second connecting hole matches the first stabilizer bar. The fourth support seat has a third connecting hole and a fourth connecting hole on its plate surface. The third connecting hole is also threaded and matches the first drive screw. The fourth connecting hole matches the first stabilizer bar. This allows the third and fourth support seats to be rotatably mounted parallel to the first drive screw and the first stabilizer bar, enabling the first drive screw to drive the third and fourth support seats to move.

[0063] The two ends of the second drive screw are rotatably connected to the third and fourth support seats, respectively. The second drive screw has an extension end that extends beyond the third support seat, and a drive motor is fixedly mounted on the extension end of the second drive screw to drive its rotation. The two ends of the second stabilizing rod are fixedly connected to the third and fourth support seats, respectively, and the second stabilizing rod and the second drive screw are arranged parallel to each other. The moving platform is plate-shaped, and its bottom has a fifth and a sixth support seat. The fifth support seat has an internal threaded hole matching the second drive screw, and the sixth support seat has a through hole matching the second stabilizing rod. Thus, the moving platform can be moved by rotating the second drive screw. Therefore, this structure allows the silicon wafer to move within the test chamber 100.

[0064] It should also be noted here that, in one possible implementation, the first and second stabilizing bars are optical bars, which makes the movement of the silicon wafer more stable.

[0065] In one possible implementation, a transition isolation cavity 900 is also included, which is connected to the test cavity 100. A transport module 400 is installed inside the transition isolation cavity 900, and the top of the transport module 400 is used to place silicon wafers or wafer carriers. An isolation door 500 is provided at the connection between the transition isolation cavity 900 and the test cavity 100, isolating the two. A lifting assembly 600 is provided on the isolation door 500 to control its opening and closing. A pick-and-place port is provided on the side of the transition isolation cavity 900 opposite to the test cavity 100, and an end cap 700 is detachably installed at the pick-and-place port, covering the port. Therefore, during silicon wafer placement, the transition isolation chamber 900 and the test chamber 100 are first isolated using the isolation door 500. Then, the end cover 700 is removed, and the silicon wafer or wafer carrier is placed on the transport module 400. Next, the end cover 700 is installed, and the isolation door 500 is lowered using the lifting assembly 600. The silicon wafer or wafer carrier is then transported to one side of the test chamber 100 via the transport module 400. The clamping components hold the silicon wafer or wafer carrier, completing the silicon wafer transport. This structure ensures that the vacuum environment inside the test chamber 100 is not disrupted, guaranteeing the cleanliness of the internal environment and maintaining the vacuum level.

[0066] Furthermore, in one possible implementation, the lifting assembly 600 includes a lifting motor 610 and a rotating lead screw 620. The lifting motor 610 is fixedly mounted on the bottom inner wall of the test chamber 100, with its output end facing the top of the test chamber 100. The rotating lead screw 620 is fixedly connected to the output end of the lifting motor 610. A connecting portion 510 is provided on the side wall of the isolation door 500, and the connecting portion 510 has an internal thread that matches the rotating lead screw 620. This facilitates the lifting and lowering of the isolation door 500.

[0067] Furthermore, in one possible implementation, two lifting components 600 are provided, with each lifting component 600 positioned on one side of the isolation door 500. This makes the lifting of the isolation door 500 more stable.

[0068] It should be noted here that, in one possible implementation, the volume of the transition isolation cavity 900 is smaller than the volume of the test cavity 100. The transport module 400 can employ a motor lead screw transmission method.

[0069] It should also be noted here that, in one possible implementation, the transition isolation cavity 900 extends into the test cavity 100, and a lifting hole is provided at the bottom of the side of the transition isolation cavity 900 that extends into the test cavity 100. The lifting hole matches the isolation door 500, allowing the isolation door 500 to extend into the transition isolation cavity 900 through the lifting hole.

[0070] Furthermore, in one possible implementation, the test chamber 100 has a mounting hole at its top, which extends through the top side wall of the test chamber 100. The mounting hole is located at the top of the parallel transfer module 200 and is suitable for mounting the electron gun 800. This facilitates the installation of the electron gun 800.

[0071] In one possible implementation, the drive unit 210 and the moving frame 230 are fixedly connected by a beryllium copper conical bushing, and the moving unit and the clamping member 240 are rotatably connected by the beryllium copper conical bushing. The beryllium copper conical bushing ensures the rigidity of the overall structure and actively eliminates gaps, thereby achieving point-to-point transfer and providing positioning accuracy.

[0072] In summary, the workflow of the electron gun testing platform in this embodiment is as follows: The end cover 700 is opened, the silicon wafer carrier is placed into the loading / unloading port, and the silicon wafer carrier containing the silicon wafer is placed on the transport module 400. The end cover 700 is then installed. The lifting motor 610 drives the isolation door 500 to descend via the rotating screw 620. The transport module 400 sends the silicon wafer carrier into the test chamber 100 and then stops. The drive device 210 drives the first rotating rod to rotate, which in turn drives the second rotating rod to move. The first and second rotating rods then drive the clamping member 240 to move, clamping the silicon wafer carrier and placing it on the moving platform. It should be noted that the moving platform has a groove for placing the silicon wafer carrier. The moving module moves away from the transition isolation chamber 900, disengaging the silicon wafer carrier from the groove on the moving platform. Then, the drive device 210 drives the clamping member 240 to reset, and the testing begins. When it is necessary to replace the silicon wafer, the above process can be reversed to complete one cycle. Therefore, this embodiment replaces the linear motion of the module with a parallel linkage structure that enables point-to-point transfer, and adds a transition isolation cavity 900 to prevent the vacuum environment inside the vacuum cavity from being damaged. The silicon wafer carrier positioning groove can be directly observed by the human eye, thereby effectively improving the transfer positioning accuracy of the silicon wafer, the cleanliness of the environment inside the vacuum cavity and the maintenance of the vacuum level, and reducing energy consumption.

[0073] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An electron gun testing platform, characterized in that, Including the test chamber; The test chamber is equipped with a parallel transfer module and a moving vehicle module; The mobile carrier module is fixed to the inner wall of the test chamber. The top of the mobile carrier module is suitable for placing silicon wafers or silicon wafer carriers. The parallel transfer module is located on the side of the mobile carrier module. The parallel transfer module includes a drive unit, a fixed base, a moving frame, and a clamping component; The fixing seat is fixedly installed on the side of the mobile carrier module, and the fixing seat is fixed to the inner wall of the test cavity; The driving device is fixed on the fixed base, and the output end of the driving device is fixedly connected to one side of the movable frame, while the other side of the movable frame is rotatably connected to the clamping member. The clamping member is adapted to clamp the silicon wafer carrier, and the driving device drives the clamping member to move on the top of the mobile carrier module; The electron gun test platform also includes a transition isolation chamber, which is connected to the test chamber; The transition isolation cavity is equipped with a transport module, and the top of the transport module is suitable for placing silicon wafers or silicon wafer carriers. An isolation door is provided at the connection between the transition isolation cavity and the test cavity, and the isolation door isolates the transition isolation cavity and the test cavity; The isolation door is equipped with a lifting assembly for controlling the opening or closing of the isolation door; The transition isolation cavity is provided with a pick-up and drop-off port on the side opposite to the test cavity. An end cap is detachably installed at the pick-up and drop-off port, and the end cap covers the pick-up and drop-off port.

2. The electron gun testing platform according to claim 1, characterized in that, The movable frame includes a first rotating component and a second rotating component; The output end of the drive device is fixedly connected to the first rotating member, and the other end of the first rotating member is hinged to the clamping member. The fixed base is provided with a hinge seat, one side of the second rotating member is hinged to the hinge seat, and the other side of the second rotating member is hinged to the clamping member; The second rotating component rotates synchronously with the first rotating component.

3. The electron gun testing platform according to claim 2, characterized in that, The clamping member is provided with a first hinge rod and a second hinge rod on the side facing the first rotating member; Both the first hinge rod and the second hinge rod are fixed to the clamping member. The side of the first rotating member that is not fixedly connected to the driving device is hinged to the first hinge rod, and the side of the second rotating member that is not hinged to the hinge seat is hinged to the second hinge rod.

4. The electron gun testing platform according to claim 1, characterized in that, The clamping component includes a first component and a second component. Both the first component and the second component are plate-shaped and connected in an "L" shape. The second component has a clamping part on the side of the plate facing away from the first component for clamping the silicon wafer carrier. The mobile frame assembly is rotatably connected to the side plate of the first component facing away from the second component, and the clamping part is positioned facing the top of the mobile vehicle module.

5. The electron gun testing platform according to claim 1, characterized in that, The mobile vehicle module includes a mobile module; The mobile module is fixedly installed on the bottom inner wall of the test chamber. A mobile platform is movably mounted on the mobile module. The mobile module drives the mobile platform to move. The top of the mobile platform is suitable for placing the silicon wafer or the silicon wafer carrier.

6. The electron gun testing platform according to claim 1, characterized in that, The lifting assembly includes a lifting motor and a rotating lead screw; The lifting motor is fixedly installed on the bottom inner wall of the test chamber, and the output end of the lifting motor is positioned facing the top of the test chamber; The rotating lead screw is fixedly connected to the output end of the lifting motor; The isolation door has a connecting part on its side wall, and the connecting part has an internal thread that matches the rotating lead screw.

7. The electron gun testing platform according to claim 1, characterized in that, There are two lifting components, which are respectively located on both sides of the isolation door.

8. The electron gun testing platform according to any one of claims 1 to 7, characterized in that, The test chamber is provided with a mounting hole at the top, and the mounting hole is provided through the top side wall of the test chamber; The mounting hole is located at the top of the parallel transfer module; The mounting hole is suitable for mounting an electron gun.

9. The electron gun testing platform according to any one of claims 1 to 7, characterized in that, The drive device and the moving frame are fixedly connected by a beryllium copper tapered bushing; The movable frame and the clamping member are rotatably connected by a beryllium copper conical bushing.

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