A method and system for detecting the distribution of multiple elements within an object

Abstract

The present application relates to a kind of method and system for detecting the distribution of multiple elements inside object, belong to element analysis and imaging field.It includes emitting negative muon beam to the object to be measured, using array detector system to capture escape radiation, obtain the position information and voltage signal when escape radiation is captured by the detector system;Based on the voltage signal, obtain the total energy spectrum corresponding to all the captured escape radiation;Based on the total energy spectrum, determine the element that needs to be imaged;Based on the energy spectrum range of the element, determine the escape radiation to be analyzed for imaging;Based on the position information of the escape radiation to be analyzed, obtain the spatial point corresponding to the escape radiation to be analyzed;Based on the spatial point, imaging is carried out, and the three-dimensional distribution of the element inside the object to be measured is obtained.The method of the present application has little nuclear pollution, and compared with the imaging method based on small hole imaging principle, more number of rays can be captured in the same time, the detection efficiency is improved, and fast imaging is realized.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of element analysis and imaging, and particularly relates to a method and system for detecting the distribution of multiple elements inside an object. BACKGROUND

[0002] Material element analysis and imaging technology is widely used in different scientific fields. Existing multiple element analysis technologies, such as X-Ray Fluorescence (XRF), Proton-induced X-ray Emission (PIXE), Rutherford Backscattering Spectrometry (RBS), Nuclear Reaction Analysis (NRA), etc., all have some problems, such as low X-ray energy generated by electron transition, easy nuclear pollution when using neutrons for element analysis, etc.

[0003] In the field of material element analysis and imaging, μ - Element analysis and imaging using μ - The current methods for element analysis and imaging using μ SUMMARY

[0004] In view of the above analysis, the present application aims to provide a method and system for detecting the distribution of multiple elements inside an object, using a negative μ - When using an array detector to capture the rays, no rays need to be shielded, and all captured rays are used for fast imaging.

[0005] In one aspect, the present application provides a method for detecting the distribution of multiple elements inside an object, specifically comprising the following steps:

[0006] Emitting a negative μ

[0007] Based on the voltage signal, obtaining a total energy spectrum corresponding to all the captured escape rays;

[0008] Determining the elements that need to be imaged based on the total energy spectrum;

[0009] Determining the escape rays to be analyzed for imaging based on the energy spectrum range of the elements;

[0010] Based on the position information of the escape rays to be analyzed, obtaining the spatial points corresponding to the escape rays to be analyzed.

[0011] imaging based on the spatial points to obtain a three-dimensional distribution of the element inside the object to be measured.

[0012] Further, the detector system comprises a first detector plane in horizontal direction and a second detector plane in vertical direction; when detecting the object to be measured using the detector system, the object to be measured is placed in a space range surrounded by the two detector planes;

[0013] The spatial points corresponding to the analyzed escape rays comprise spatial points corresponding to the first detector plane and the second detector plane respectively;

[0014] Imaging based on the spatial points to obtain a horizontal and vertical distribution of the element inside the object to be measured.

[0015] Further, the obtaining of the spatial points corresponding to the first detector plane and the second detector plane comprises:

[0016] A plurality of mathematical planes parallel to the first detector plane and the second detector plane are respectively constructed;

[0017] Based on the position information of the analyzed escape rays captured by the first detector plane or the second detector plane, a straight line where the escape rays are located is determined;

[0018] Based on the intersection of the straight line and each of the mathematical planes, the spatial points corresponding to the escape rays of the first detector plane or the second detector plane are obtained.

[0019] Further, the first detector plane and the second detector plane respectively comprise two layers of detectors; the two layers of detectors are respectively composed of pixel units, the pixel units work independently of each other, the first layer of detectors is on the side close to the object to be measured, and the second layer of detectors is on the side away from the object to be measured.

[0020] Further, the capturing of the escape rays using the array detector system to obtain the position information and the voltage signal of the escape rays captured by the detector system comprises:

[0021] The pixel units of the first layer of the two layers of detectors detect the escape rays and generate a first voltage signal, and the pixel units of the second layer of the two layers of detectors capture the escape rays and convert the energy of the captured escape rays into a second voltage signal;

[0022] The position information comprises the central position coordinates of the pixel units generating the first and second voltage signals respectively; and the voltage signal comprises the second voltage signal.

[0023] Further, the relationship of the coordinates (x', y', z') of the spatial points satisfies:

[0024]

[0025] wherein (i,j,k)=(x2-x1,y2-y1,z2-z1), represents the direction vector of the escape ray; (x1,y1,z1), (x2,y2,z2) represent the center position coordinates of the pixel units of the first and second voltage signals generated by the two layers of detectors of the first or second detector plane respectively; z'=z1-nΔz, n represents the interval number between the mathematical plane where the spatial point is located and z1, and Δz represents the interval between adjacent mathematical planes.

[0026] Further, the time difference Δt between the generation of the first voltage signal and the second voltage signal satisfies 333≤Δt≤666 ps.

[0027] Further, the total energy spectrum corresponding to all the captured escape rays based on the voltage signals comprises:

[0028] The total energy spectrum corresponding to the escape rays captured by the first detector plane and the total energy spectrum corresponding to the escape rays captured by the second detector plane are obtained based on the energy information of all the escape rays captured by the first detector plane and the second detector plane respectively.

[0029] wherein the energy information is calculated by the following formula:

[0030]

[0031] wherein, represents the voltage signal generated by the known ray energy E; U0 represents the second voltage signal, and E0 represents the energy information of the escape ray.

[0032] Further, the detector system further comprises a third detector plane, which is perpendicular to the first and second detector planes respectively; when the detector system is used to detect the object to be detected, the object to be detected is placed in the space range surrounded by the three detector planes.

[0033] The spatial point corresponding to the escape ray to be analyzed comprises spatial points corresponding to the first detector plane, the second detector plane and the third detector plane respectively.

[0034] Based on the spatial point, imaging is performed to obtain the three-dimensional distribution of the element inside the object to be detected.

[0035] In another aspect, the present application also provides a system for detecting the distribution of multiple elements inside an object, comprising:

[0036] A negative muon beam source is used to emit a negative muon beam to the object to be detected.

[0037] An array detector system is used to capture escape rays and obtain the position information and voltage signal of the escape rays when they are captured by the detector system.

[0038] The signal processing module is used to obtain the spatial point corresponding to the escape ray based on the position information and voltage signal;

[0039] A computer imaging module is used to obtain element distribution maps in the horizontal and vertical directions based on the spatial points.

[0040] The present invention can achieve at least one of the following beneficial effects:

[0041] By emitting μ on the test object - mesons, using μ - It possesses extremely strong penetrating power and the ability to emit high-energy X-rays (μ-X rays) when trapped by atoms, enabling multi-element analysis and imaging of analytes. Due to μ... - The number of atoms trapped in the nucleus and undergoing nuclear reactions is very small compared to the number of Avogadro's constants. Experimental tests have shown that there is almost no nuclear contamination, thus it has the characteristic of low contamination compared to traditional imaging methods.

[0042] By capturing high-energy rays generated during detection without shielding them, the detector area is greatly increased, allowing for the capture of a greater number of rays in the same amount of time. This significantly shortens detection time, improves detection efficiency, and enables rapid imaging.

[0043] Other features and advantages of the invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained from what is particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0044] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0045] Figure 1 This is a flowchart of the method in Example 1;

[0046] Figure 2 This is a schematic diagram of the target sample in Example 2;

[0047] Figure 3 This is a schematic diagram illustrating the use of an array detector system to detect rays in Example 2;

[0048] Figure 4 This is the total energy spectrum corresponding to the first detector plane in Example 2;

[0049] Figure 5 This is the total energy spectrum corresponding to the second detector plane in Example 2;

[0050] Figure 6 This is a schematic diagram illustrating the principle of calculating spatial points in Example 2;

[0051] Figure 7 This is a two-dimensional diagram of the Ti element density distribution corresponding to the first detector plane in Example 2;

[0052] Figure 8 This is a two-dimensional diagram of the Ti element density distribution corresponding to the second detector plane in Example 2;

[0053] Figure 9 This is a comparison chart of the X-ray energies detected using the method of Example 2 and the pinhole imaging method, respectively, in Example 2. Detailed Implementation

[0054] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0055] Method Implementation Examples

[0056] Example 1

[0057] A specific embodiment of the present invention discloses a method and system for detecting the distribution of multiple elements inside an object, specifically including the following steps:

[0058] Step S01: Emit a negative muon beam to the object under test, use an array detector system to capture the escape ray, and obtain the position information and voltage signal of the escape ray when it is captured by the detector system.

[0059] Specifically, a negative muon beam is emitted towards the object under test using a negative muon beam source with pre-set parameters.

[0060] Specifically, the parameters include energy level and beam size.

[0061] Specifically, the choice of muon energy depends on the depth to which the characteristic X-rays can penetrate the object to be characterized. Optionally, the energy range is 45-150 MeV / c.

[0062] Optionally, the diameter of the beam spot size ranges from 2mm to 216mm.

[0063] Specifically, the array detector system includes a first detector plane in the horizontal direction and a second detector plane in the vertical direction. When using the detector system to detect the object to be tested, the object to be tested is placed within the space enclosed by the two detector planes.

[0064] Specifically, both the first and second detector planes include two layers of array detectors, each composed of pixel units, which operate independently. The array detector on the side closer to the object under test (DUT) is thinner than the one on the side farther from the DUT. Preferably, the first array detector on the side closer to the DUT consists of pixel units on the micrometer scale, with a thickness also on the micrometer scale, while the second array detector on the side farther from the DUT consists of pixel units on the millimeter scale, with a thickness also on the millimeter scale.

[0065] Optionally, the spacing between the two detector layers is 90mm-110mm; preferably, the spacing between the two detector layers is 100mm.

[0066] Optionally, each layer of the array detector uses CdZnTe as the material for the sensitive area.

[0067] During implementation, a negative muon beam is emitted towards the object under test using a negative muon beam source, μ - The motion within the test object exhibits both lateral and longitudinal diffusion, when μ - When it loses most of its kinetic energy, it is captured by atoms in the nearby region, producing high-energy μ-X-rays, which are captured by the detector system described above.

[0068] Specifically, when the detector system is used to detect the object under test, the pixel units of the first and second layer array detectors of the first and second detector planes generate two voltage signals for the captured escape rays. When the generation time difference Δt of the two voltage signals meets the preset condition and there are no other signals in between, the two signals are confirmed as a set of usable signals and are recorded as the first and second voltage signals respectively. Among them, the pixel unit of the first layer array detector is used to detect the escape rays and generate the first voltage signal, and the pixel unit of the second layer array detector is used to capture the escape rays and convert the energy of the captured escape rays into the second voltage signal.

[0069] Specifically, the preset conditions that the time difference Δt needs to meet are calculated based on the interval between the two detector layers and the speed of light (i.e., the speed of the escaping ray); for example, when the interval between the two detector layers is 100mm, 333≤Δt≤666ps.

[0070] Specifically, the position information of the escape ray when it is captured by the detector system includes the center position coordinates of the pixel units that generate the first and second voltage signals respectively; the voltage signal of the escape ray when it is captured by the detector system includes the second voltage signal.

[0071] Step S02: Obtain the total energy spectrum corresponding to all the escape rays that have been captured based on the voltage signal.

[0072] Specifically, the energy information of the escape ray is obtained based on the voltage signal, and the total energy spectrum of the escape ray captured by the first and second detector planes is obtained based on all the energy information of the first and second detector planes respectively.

[0073] Specifically, the energy information is calculated using the following formula:

[0074]

[0075] in, This indicates that a voltage signal U will be generated from a known ray energy E; U0 represents the second voltage signal, and E0 represents the energy information of the escape ray; specifically, calibration is performed using a ray with known energy to obtain... For example, Na 22 The radioactive source will produce gamma rays with an energy of 1.275 MeV.

[0076] Specifically, since all the energy information of each detector plane may correspond to μ-X-rays produced by multiple elements, and each element has its own μ-X-ray characteristic wavelength, the magnitude of which depends on the characteristic energy released during the energy level transition, the corresponding total energy spectrum of each detector plane shows the characteristic energy of μ-X-ray photons corresponding to different elements.

[0077] Step S03: Determine the elements to be imaged based on the total energy spectrum.

[0078] Specifically, different characteristic peaks in the total energy spectrum of the first or second detector plane correspond to the corresponding elements. One or more elements that need to be imaged are selected, and one element is imaged on the corresponding first or second detector plane each time.

[0079] Step S04: Determine the escape rays to be analyzed for imaging based on the energy spectrum range of the element.

[0080] Specifically, select the energy spectrum range corresponding to the element to be imaged, and select the escape rays corresponding to the energy information within that energy spectrum range as the escape rays to be analyzed.

[0081] Step S05: Calculate the corresponding spatial point of the escape ray to be analyzed based on the position information of the escape ray to be analyzed.

[0082] Specifically, the spatial points corresponding to the escape rays to be analyzed include spatial points corresponding to the first detector plane and the second detector plane, respectively.

[0083] Specifically, the spatial point corresponding to the escape ray to be analyzed captured by each detector plane is calculated for the first detector plane and the second detector plane respectively.

[0084] Specifically, taking the first detector plane as an example, the steps include:

[0085] S05-1. Construct multiple mathematical planes parallel to the plane of the first detector.

[0086] Based on the first detector plane, a mathematical plane parallel to the detector plane is drawn at preset intervals in the direction of the object to be measured.

[0087] Preferably, the preset interval is 0.5mm.

[0088] Let the two-dimensional plane containing the detector plane in the horizontal direction be represented by the xy coordinate system, and the interval between each mathematical plane in the corresponding three-dimensional xyz coordinate system be represented by Δz = 0.5 mm.

[0089] like Figure 6 A schematic diagram of constructing the mathematical plane is given.

[0090] S05-2. Based on the position information of the escape ray to be analyzed captured by the detector plane, determine the straight line where the escape ray is located.

[0091] Specifically, the direction of the escape ray to be analyzed is represented as (i,j,k)=(x2-x1,y2-y1,z2-z1), where (i,j,k) represents the direction vector, and (x1,y1,z1) and (x2,y2,z2) are the center position coordinates of the pixel units that generate the first and second voltage signals, respectively.

[0092] Specifically, the straight line containing the escape ray is obtained by extending the escape ray in the opposite direction based on the direction of the escape ray to be analyzed.

[0093] S05-3. Based on the straight line and each of the mathematical planes, obtain the spatial point corresponding to the escape ray in that plane.

[0094] Specifically, the straight line intersects with multiple mathematical planes, resulting in multiple intersection points.

[0095] Let (x', y', z') represent the coordinates of the intersection point. Then the coordinates of the intersection point satisfy the following relationship:

[0096]

[0097] Where z' = z1 - nΔz, n represents the number of intervals between the mathematical plane containing the intersection point and z1;

[0098] Then there is

[0099] All intersection points are the spatial points corresponding to the escape rays in that plane.

[0100] Step S06: Based on the spatial points, perform imaging to obtain the three-dimensional distribution of the elements inside the object under test.

[0101] Specifically, based on the projection of all spatial points corresponding to each detector plane onto the detector plane, a two-dimensional density distribution map of the spatial points is obtained. The two-dimensional density distribution map is the distribution map of the element corresponding to the detector plane.

[0102] Specifically, the two-dimensional density distribution diagrams corresponding to the first detector plane and the second detector plane respectively show the three-dimensional distribution of the element inside the analyte.

[0103] As an improvement to this embodiment, the detector system may further include a third detector plane, which is perpendicular to the first and second detector planes respectively; the structure of the third detector plane is the same as that of the first and second detector planes, including the first and second layer array detectors used to obtain the position information and voltage signal when the escape ray is captured by the detector system.

[0104] When using the detector system to detect the object under test, the object under test is placed within the space enclosed by the three detector planes; correspondingly, the spatial points corresponding to the escape rays to be analyzed include spatial points corresponding to the first detector plane, the second detector plane, and the third detector plane, respectively; based on the spatial points corresponding to the three detector planes, the three-dimensional distribution of the element inside the object under test can be obtained; wherein, the spatial points corresponding to each detector plane are obtained in the same way as described in step S05.

[0105] This embodiment discloses a method for detecting the distribution of multiple elements inside an object, by utilizing μ - With its strong penetrating power and the ability to emit high-energy X-rays (μ-X rays) when captured by atoms, it can perform multi-element analysis and imaging of the analyte. Therefore, it has the advantage of low pollution compared to traditional imaging methods. By capturing the high-energy rays generated during detection without shielding the rays, the detector area is greatly increased, and more rays can be captured in the same amount of time. This can significantly shorten the detection time, improve the detection efficiency, and achieve rapid imaging.

[0106] Example 2

[0107] Another specific embodiment of the present invention discloses a method for detecting the distribution of multiple elements inside an object, specifically including the following steps:

[0108] Step S11: Emit a negative muon beam to the object under test, use an array detector system to capture the escape ray, and obtain the position information and voltage signal of the escape ray when it is captured by the detector system.

[0109] Specifically, a target sample with external dimensions of 26.5mm*26.5mm*69mm, composed of element Fe, and containing a small square region of Ti element of 8mm*8mm*2mm in the center was used as the analyte.

[0110] Specifically, assuming a beam spot diameter of 2 mm, 106 μ-wavelength pulses with an energy of 73 MeV are emitted towards the target object. - When μ - When passing through the target sample, it may be captured by Fe and Ti atoms, producing corresponding characteristic X-rays.

[0111] Optionally, the size of the first detector plane of the array detector system is 26.5mm*69mm, the size of the second detector plane is 26.5mm*26.5mm, and each detector plane is 1mm away from the target sample.

[0112] An array detector system is used to record the location information and voltage signal of the detected escape rays.

[0113] Figure 2 The target sample of this embodiment is shown; Figure 3 This is a schematic diagram of using an array detector system to detect rays.

[0114] Step S12: Obtain the total energy spectrum corresponding to all the escape rays that have been captured based on the voltage signal.

[0115] like Figure 4 , Figure 5 The image shown is the total energy spectrum obtained from detecting the target sample in this embodiment: Figure 4 This is the total energy spectrum corresponding to the plane of the first detector; Figure 5 This is the total energy spectrum corresponding to the plane of the second detector.

[0116] Step S13: Determine the elements to be imaged based on the total energy spectrum.

[0117] Specifically, the detector has an energy resolution of 10 keV. In the total energy spectrum, 1235 keV is the Kα characteristic peak of Fe, 915 keV is the Kα characteristic peak of Ti, 515 keV is the characteristic peak generated by positron annihilation, and 265 keV is the Lα characteristic peak of Fe.

[0118] Step S14: Determine the escape rays to be analyzed for imaging based on the energy spectrum range of the element.

[0119] Specifically, the element Ti to be imaged is selected, and the corresponding energy range of 915 keV is chosen. Based on the energy information, the escape rays to be analyzed are determined.

[0120] Step S15: Calculate the corresponding spatial point of the escape ray to be analyzed based on the position information of the escape ray to be analyzed.

[0121] Specifically, such as Figure 6 This illustrates the calculation of the spatial point corresponding to the escape ray to be analyzed captured by each detector plane of the detector system.

[0122] Step S16: Based on the spatial points, perform imaging to obtain the three-dimensional distribution of the elements inside the object under test.

[0123] Specifically, Figure 7 A two-dimensional diagram of the Ti element density distribution corresponding to the first detector plane is shown; the area of ​​Ti element distribution is 8mm*2mm.

[0124] Figure 8 A two-dimensional diagram of the Ti element density distribution corresponding to the plane of the second detector is shown; the Ti element distribution area is 8mm*8mm as seen in the figure.

[0125] Figure 9 The comparison of X-ray energies detected using the method of this embodiment and the pinhole imaging method for the target sample is presented:

[0126] Figure 9 The upper part shows that, using the method of this embodiment, the first detector plane and the second detector plane detected 16,649 and 1,515 counts respectively at the 915 keV peak; Figure 9 The lower part shows the results using the pinhole imaging method, where the horizontal detector and the vertical detector detected 254 and 13 counts respectively at a peak of 915 keV. This demonstrates that when using the method of this embodiment, the number of effective rays detected is significantly increased, with detection efficiencies in the horizontal and vertical directions improved by 65.5 times and 116.5 times respectively.

[0127] System Implementation Examples

[0128] A system for detecting the distribution of multiple elements inside an object includes a negative muon beam source, an array detector system, a signal processing module, and a computer imaging module.

[0129] A negative muon beam source is used to emit a negative muon beam toward the object under test.

[0130] An array detector system is used to capture escape rays and obtain the position information and voltage signal of the escape rays when they are captured by the detector system.

[0131] The signal processing module is used to obtain the spatial point corresponding to the escape ray based on the position information and voltage signal.

[0132] A computer imaging module is used to obtain element distribution maps in the horizontal and vertical directions based on the spatial points.

[0133] Compared with the prior art, the beneficial effects of the system for detecting the distribution of multiple elements inside an object provided in this embodiment are basically the same as those provided in Embodiment 1, and will not be repeated here.

[0134] It should be noted that the above embodiments are based on the same inventive concept, and any parts not described repeatedly can be referenced from each other.

[0135] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for detecting the distribution of multiple elements inside an object, characterized in that, Includes the following steps: A negative muon beam is emitted toward the object under test, and an array detector system is used to capture the escape ray. The position information and voltage signal of the escape ray when it is captured by the detector system are obtained. The detector system includes a first detector plane in the horizontal direction and a second detector plane in the vertical direction. Each detector plane includes two layers of detectors. The escape ray is µ -X-rays; Based on the voltage signal, the total energy spectrum corresponding to all the escape rays that were captured is obtained; The elements that need to be imaged are determined based on the total energy spectrum. The escape rays to be analyzed for imaging are determined based on the energy spectrum range of the element. Based on the position information of the escape ray to be analyzed, the spatial point corresponding to the escape ray to be analyzed is obtained; the spatial point corresponding to the escape ray to be analyzed includes spatial points corresponding to the first detector plane and the second detector plane respectively; wherein, multiple mathematical planes parallel to the first detector plane and the second detector plane are constructed respectively; The line in which the escape ray is located is determined based on the position information of the escape ray captured by the first detector plane or the second detector plane. The spatial points corresponding to the first detector plane or the second detector plane of the escape ray are obtained based on the intersection of the straight line and each of the mathematical planes. The coordinates of the spatial point The relationship satisfies: ， ； in, , represents the direction vector of the escape ray; , The coordinates of the center position of the pixel unit representing the first and second voltage signals generated by the two layers of detectors on the first or second detector plane, respectively; , n represents the mathematical plane containing the spatial point and The number of intervals, This indicates the interval between adjacent mathematical planes; the mathematical planes are multiple mathematical planes constructed parallel to the first detector plane and the second detector plane; Based on the spatial points, imaging is performed to obtain the three-dimensional distribution of the element inside the object under test.

2. The method for detecting the distribution of multiple elements inside an object according to claim 1, characterized in that, When using the detector system to detect an object, the object is placed within the space enclosed by the two detector planes; Based on the spatial points, imaging is performed to obtain the three-dimensional distribution of the element inside the object under test.

3. The method for detecting the distribution of multiple elements inside an object according to claim 2, characterized in that, The two detector layers are each composed of pixel units, which operate independently of each other. The first detector layer is located on the side closer to the object being tested, and the second detector layer is located on the side farther away from the object being tested.

4. The method for detecting the distribution of multiple elements inside an object according to claim 3, characterized in that, The process of capturing escape rays using an array detector system and obtaining the position information and voltage signal of the escape ray when it is captured by the detector system includes: The pixel units of the first layer of the two-layer detector detect the escape ray and generate a first voltage signal, and the pixel units of the second layer of the two-layer detector capture the escape ray and convert the energy of the captured escape ray into a second voltage signal; The location information includes the center position coordinates of the pixel units that generate the first and second voltage signals respectively; the voltage signal includes the second voltage signal.

5. The method for detecting the distribution of multiple elements inside an object according to claim 4, characterized in that, The generation time difference between the first voltage signal and the second voltage signal satisfy .

6. The method for detecting the distribution of multiple elements inside an object according to claim 4, characterized in that, The total energy spectrum corresponding to all the escape rays captured based on the voltage signal includes: Based on the energy information of all escape rays captured by the first detector plane and the second detector plane, the total energy spectrum corresponding to the escape rays captured by the first detector plane and the total energy spectrum corresponding to the escape rays captured by the second detector plane are obtained respectively. The energy information is calculated using the following formula: ； in, Represents the known energy of the ray. E It will produce U The voltage signal; This indicates the second voltage signal. This indicates the energy information of the escape ray.

7. The method for detecting the distribution of multiple elements inside an object according to any one of claims 1-6, characterized in that, The detector system further includes a third detector plane, which is perpendicular to the first and second detector planes respectively; when using the detector system to detect the object to be tested, the object to be tested is placed within the space enclosed by the three detector planes; The spatial points corresponding to the escape rays to be analyzed include spatial points corresponding to the first detector plane, the second detector plane, and the third detector plane, respectively. Based on the spatial points, imaging is performed to obtain the three-dimensional distribution of the element inside the object under test.

8. A system for detecting the distribution of multiple elements inside an object by implementing the method of any one of claims 1-7, characterized in that, include: A negative muon beam source is used to emit a negative muon beam toward the object under test; An array detector system is used to capture escape rays and obtain the position information and voltage signal of the escape rays when they are captured by the detector system. The signal processing module is used to obtain the spatial point corresponding to the escape ray based on the position information and voltage signal; A computer imaging module is used to obtain element distribution maps in the horizontal and vertical directions based on the spatial points.

Images