A transfer auxiliary plate, a chip transfer method and a display panel

Abstract

The present application relates to a transfer auxiliary plate, a chip transfer method and a display panel. The transfer auxiliary plate comprises a substrate body, the thickness of which is not less than the height of the chip to be transferred; a chip accommodating area is arranged on the substrate body, the depth of the chip accommodating area is not less than the height of the chip to be transferred, the cross-sectional area of the chip accommodating area is not less than the maximum cross-sectional area of the chip to be transferred, and the chip accommodating area is used to accommodate the chip to be transferred in cooperation with a receiving substrate; and a plurality of chip blocking parts are arranged on the substrate body and correspond to the positions of the chip accommodating area, the chip blocking parts can block the entrance of the chip accommodating area, so that the chip to be transferred cannot enter or exit the chip accommodating area through the entrance. Only the chip blocking parts are used to block the positions where the chips are not needed to be transferred at present, and in the fluid transfer, additional differentiated design of the structure of the chip or the receiving substrate is not needed to realize the selection, so that the process complexity of the chip and the receiving substrate is low, and mass production is facilitated.

Description

Technical Field

[0001] This invention relates to the field of chip transfer, and more particularly to a transfer auxiliary board, a chip transfer method, and a display panel. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) is an emerging display technology. Compared with conventional display technologies, displays based on Micro LED technology have the characteristics of fast response speed, self-illumination, high contrast, long lifespan, and high photoelectric efficiency.

[0003] In the Micro LED industry, millions or even tens of millions of LED (Light Emitting Diode) chips are transferred from a growth substrate to a circuit backplane at least once. In fluid transfer schemes, the chips are typically placed in a fluid, and then the fluid is oscillated or its flow is controlled to allow the chips to fall into corresponding receiving slots. However, selective transfer in fluid transfer schemes increases the difficulty of manufacturing different chips and backplanes, resulting in high process complexity and hindering mass production. Therefore, it is usually only used for single-color displays.

[0004] Therefore, how to achieve simple and efficient selective transfer in fluid transfer processes is an urgent problem to be solved. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a transfer auxiliary board, a chip transfer method and a display panel, which aims to solve the problem that the selective transfer scheme in the current fluid transfer scheme increases the manufacturing difficulty of different chips and backplanes, the process complexity and is not conducive to mass production.

[0006] A transfer auxiliary board includes: a substrate body with a thickness not less than the height of the chip to be transferred;

[0007] A chip accommodating area is provided on the substrate body. The depth of the chip accommodating area is not less than the height of the chip to be transferred, and the cross-sectional area is not less than the maximum cross-sectional area of ​​the chip to be transferred. The chip accommodating area is used to cooperate with the receiving substrate to accommodate the chip to be transferred.

[0008] Multiple chip blocking portions are provided on the substrate body and correspond to the position of the chip receiving area. The chip blocking portions can block the entrance of the chip receiving area so that the chip to be transferred cannot enter or exit the chip receiving area through the entrance.

[0009] The aforementioned transfer auxiliary board, through the cooperation of the chip accommodating area and the chip blocking part, enables the chip to be transferred to selectively fall only into the chip accommodating area that is not blocked by the chip blocking part. Thus, selective chip transfer is also achieved during the fluid transfer process. Furthermore, using the transfer auxiliary board of this embodiment, it is only necessary to use the chip blocking part to block the position where the chip does not need to be transferred. There is no need to make additional differentiated designs on the structure of the chip or the receiving substrate to achieve the selection, which reduces the process complexity of the chip and the receiving substrate and is conducive to mass production.

[0010] Optionally, the chip blocking part is movably connected to the substrate body, and the chip blocking part is movable to switch between a first state and a second state;

[0011] When the chip blocking part is in the first state, it blocks the entrance of the chip accommodating area so that the chip to be transferred cannot enter the corresponding chip accommodating area; when the chip blocking part is in the second state, the chip to be transferred can enter the chip accommodating area.

[0012] Understandably, the chip blocking part, which is movably connected to the substrate body, can flexibly control the area where the chip to be transferred can be moved, thus having good applicability.

[0013] Optionally, the chip blocking portion includes an elastic rotating member disposed between the substrate body and the blocking object. The elastic rotating member rotates under the action of an external force and drives the blocking object to rotate, and returns to its original position after the external force is removed.

[0014] It is understandable that the chip blocking part can be restored to its original position by means of the elastic rotating part, which can ensure that the chip blocking part is in a uniform default state when it is not driven by external force in some implementation processes.

[0015] Optionally, the transfer auxiliary plate includes at least two sets of chip blocking parts, which rotate under the action of external force, and the blocking parts of different sets of chip blocking parts rotate to a predetermined posture under the action of external force of different magnitudes.

[0016] It is understandable that by configuring different groups of chip blocking parts to rotate to a predetermined posture under different magnitudes of external force, differentiated control of different groups of chip blocking parts can be achieved. In some implementation processes, by controlling different flow rates of the fluid, the fluid can exert different magnitudes of force on the chip blocking object, thereby controlling the rotation of the corresponding chip blocking part.

[0017] Optionally, the block rotates horizontally relative to the substrate body under the action of an external force, and the rotation axis of the chip blocking part of different groups is located in at least one of the width direction and length direction of the corresponding chip accommodating area.

[0018] It is understandable that by setting adjacent chip blocking parts to be staggered in a certain direction, the mutual interference between chip blocking parts can be reduced when the fluid flows in that direction.

[0019] Based on the same inventive concept, this application also provides a chip transfer method, comprising:

[0020] The aforementioned transfer auxiliary board is disposed on the receiving substrate, and the chip accommodating area is positioned opposite to the area on the receiving substrate where the chip is disposed.

[0021] The chip to be transferred is brought into the unobstructed chip receiving area by fluid transfer;

[0022] The chip to be transferred on the receiving substrate is bonded to the receiving substrate.

[0023] The aforementioned chip transfer method utilizes the transfer auxiliary board to ensure that the chip is selectively transferred only to positions not blocked by chip obstructions during the fluid transfer process. Furthermore, it requires no modifications to the structure of the chip or the receiving substrate, does not increase the manufacturing difficulty or process complexity of the chip or the receiving substrate, and is conducive to mass production.

[0024] Optionally, the chip blocking portion includes at least two sets, and the blocking elements of the chip blocking portion rotate under the action of an external force. The blocking elements of different sets of chip blocking portions rotate to a predetermined posture under the action of external forces of different magnitudes; the step of transferring the chip to be transferred into the chip receiving area by fluid transfer includes:

[0025] The flow rate of the fluid is controlled to a first speed. Under the action of the fluid at the first speed, the obstruction of the first group of chip obstruction parts rotates to the predetermined posture. The fluid carries the first group of chips to be transferred. The first group of chips to be transferred falls into the chip receiving area that is not obstructed and has no chips.

[0026] The flow rate of the fluid is controlled to a second speed. Under the action of the fluid at the second speed, the obstructions of the first group of chip obstructions and the obstructions of the second group of chip obstructions rotate to the predetermined posture. The fluid carries the second group of chips to be transferred, and the second group of chips to be transferred falls into the chip receiving area that is not obstructed and has no chips.

[0027] It is understandable that by controlling the state of different groups of chip blocking sections with different flow rates, the control of chip blocking sections can be achieved simply and reliably, thereby achieving the effect of selectively transferring the chip.

[0028] Based on the same inventive concept, this application also provides a display panel, including a circuit board and a light-emitting chip;

[0029] The light-emitting chip is transferred to the die-bonding region of the circuit substrate using the chip transfer method described above and then bonded.

[0030] The circuit board and light-emitting chip of the aforementioned display panel do not need to be formed as additional structures for the fluid transfer process. Overall, its manufacturing process is less complex and conducive to mass production. Attached Figure Description

[0031] Figure 1 A schematic diagram of the transfer auxiliary plate provided in an embodiment of the present invention. Figure 1 ;

[0032] Figure 2 for Figure 1 A top-down view;

[0033] Figure 3 A schematic diagram of the rotation of the obstruction provided in an embodiment of the present invention. Figure 1 ;

[0034] Figure 4 A schematic diagram illustrating the rotation of an obstruction driven by fluid, provided in an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of the rotation of the obstruction provided in an embodiment of the present invention. Figure 2 ;

[0036] Figure 6 for Figure 5 A top-down view;

[0037] Figure 7 A schematic diagram illustrating the sliding of an obstacle according to an embodiment of the present invention;

[0038] Figure 8 A schematic diagram of an obstruction blocking two chip accommodating areas provided in an embodiment of the present invention;

[0039] Figure 9 A schematic diagram illustrating the deformation of a self-elastic barrier provided in an embodiment of the present invention;

[0040] Figure 10 This is a schematic diagram of the misalignment of the chip blocking part provided in an embodiment of the present invention;

[0041] Figure 11 A schematic flowchart of a chip transfer method provided in another optional embodiment of the present invention;

[0042] Figure 12 A schematic flowchart of Example 1 of the chip transfer method provided in another optional embodiment of the present invention;

[0043] Figure 13 A schematic diagram of a transfer auxiliary board disposed on a receiving substrate in Example 1 of a chip transfer method provided in another optional embodiment of the present invention;

[0044] Figure 14 for Figure 13 A schematic diagram showing the first set of chips to be transferred located in the chip accommodating area;

[0045] Figure 15 for Figure 14 A schematic diagram showing the position configuration of the transfer auxiliary board;

[0046] Figure 16 for Figure 15 A schematic diagram showing the second set of chips to be transferred located in the chip accommodating area;

[0047] Figure 17 for Figure 16 A schematic diagram showing the position configuration of the transfer auxiliary board;

[0048] Figure 18 for Figure 17 A schematic diagram showing the third set of chips to be transferred located in the chip accommodating area;

[0049] Figure 19 A schematic flowchart of Example 2 of the chip transfer method provided in another optional embodiment of the present invention;

[0050] Figure 20 A top view of a transfer auxiliary board disposed on a receiving substrate in Example 2 of a chip transfer method provided in another optional embodiment of the present invention;

[0051] Figure 21 A schematic diagram of transferring the first group of chips to be transferred in Example 2 of the chip transfer method provided in another optional embodiment of the present invention;

[0052] Figure 22 A schematic diagram of transferring the second group of chips to be transferred in Example 2 of another optional embodiment of the chip transfer method provided by the present invention;

[0053] Figure 23 A schematic flowchart of Example 3 of the chip transfer method provided in another optional embodiment of the present invention;

[0054] Figure 24 A schematic diagram of transferring the first group of chips to be transferred in Example 3 of a chip transfer method provided in another optional embodiment of the present invention;

[0055] Figure 25 A schematic diagram of transferring the second group of chips to be transferred in Example 3 of another optional embodiment of the chip transfer method provided by the present invention;

[0056] Explanation of reference numerals in the attached figures:

[0057] 1-Substrate body; 2-Chip accommodating area; 21-First chip accommodating area; 22-Second chip accommodating area; 3-Block; 30-Chip blocking part; 31-First group of chip blocking parts; 32-Second group of chip blocking parts; 33-Third group of chip blocking parts; f-Fluid; 4-Receiving substrate; 5-Pad; G-First group of chips to be transferred; B-Second group of chips to be transferred; R-Third group of chips to be transferred. Detailed Implementation

[0058] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0060] Selective transfer schemes in current fluid transfer solutions increase the difficulty of manufacturing different chips and backplanes, increase process complexity, and are not conducive to mass production.

[0061] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0062] Example:

[0063] This embodiment provides a transfer auxiliary board, including a substrate body, a chip accommodating area, and multiple chip blocking portions. The thickness of the substrate body is not less than the height of the chip to be transferred. The substrate body can be made of materials including but not limited to ceramics, metals, polymers (such as plastics), etc., as long as it does not affect normal fluid transfer. In practical applications, a rigid material can be selected for the substrate body for greater stability. The chip accommodating area is located on the substrate body, with a depth not less than the height of the chip to be transferred and a cross-sectional area not less than the maximum cross-sectional area of ​​the chip to be transferred. The chip accommodating area is used to cooperate with the receiving substrate to accommodate the chip to be transferred. During fluid transfer, the chip falls into the chip accommodating area and contacts the receiving substrate. The chip can be held within the chip accommodating area during the transfer process and is no longer washed away by the fluid movement. The maximum cross-sectional area of ​​the chip to be transferred includes the maximum value of its cross-sectional area at all points. The cross-sectional area of ​​the chip accommodating area is not less than this maximum cross-sectional area, so that the chip to be transferred can fall into it without being stuck. In practical applications, the chip accommodating area can be designed to be the same size as or slightly larger than the size of the chip to be transferred when its tolerance is at its maximum, that is, just large enough to accommodate one chip to be transferred without significant offset. A chip blocking portion is disposed on the substrate body, and the chip blocking portion corresponds to the chip receiving area. It can block the entrance of the chip receiving area, so that the chip to be transferred cannot enter or exit the chip receiving area through the entrance. Each chip blocking portion can correspond to one chip receiving area, that is, it can block the chip receiving area from having a chip. Each chip blocking portion can also correspond to more than one chip receiving area, that is, it can block the entrance of more than one chip receiving area at the same time.

[0064] In some implementations, the depth of the chip accommodating region is less than twice the height of the chip to be transferred, that is, the depth of the chip accommodating region is between one and two times the height of the chip to be transferred (inclusive). This ensures that the chip accommodating region can hold at most one chip to be transferred, avoiding the accumulation of excess chips in the chip accommodating region.

[0065] It is understood that during the fluid transfer process, the position of the chip accommodating area corresponds to the area on the receiving substrate where the chip is placed. That is, the chip accommodating area is designed according to the required position of the chip on the receiving substrate. The receiving substrate can be any substrate capable of supporting the chip, including but not limited to circuit boards, temporary substrates, etc. Taking a circuit board as an example, multiple chips can be placed on it (e.g., a display backplane with multiple light-emitting chips). The circuit board may include areas for electrical connection, such as pads and conductive layers for soldering the chip. Therefore, the position of the chip accommodating area corresponds to the area for electrical connection, such as the pads and conductive layers. After the transferred chip falls into the chip accommodating area, its electrodes can directly contact the pads or conductive layers on the circuit board. It is understood that when the area on the receiving substrate where the chip is placed has structures such as pads and conductive layers, the depth of the chip accommodating area referred to in this embodiment is not less than the height of the chip to be transferred plus the height of the pads and conductive layers.

[0066] In one example, the chip blocking portion can close one end of the chip accommodating area and is an integral structure with the substrate body. For example, see... Figure 1 As shown, the substrate body 1 of this example transfer auxiliary board has two types of chip receiving areas. The first chip receiving area 21 is a groove-shaped structure, with the depth extending along the thickness direction of the substrate body 1. It is understood that the depth of the groove is greater than the height of the chip to be transferred. The bottom of the groove forms a chip blocking portion, preventing the chip from entering the chip receiving area from the bottom side of the groove. The second chip receiving area 22 is a through-hole structure, extending along the thickness direction of the substrate body 1 and opening on both sides of the substrate body 1. The opening on the same side as the bottom of the groove is the entrance for the chip to fall into the second chip receiving area 22. When the transfer auxiliary board is placed on the receiving substrate, the first chip receiving area 21 and the surface of the receiving substrate cooperate to form a closed space capable of accommodating the chip to be transferred; the second chip receiving area 22 and the surface of the receiving substrate cooperate to form a receiving groove capable of accommodating the chip to be transferred, into which the chip can fall. Figure 2 As shown, Figure 1 The diagram above shows a top view of the transfer auxiliary board. In the transfer auxiliary board of the example above, one end of the through hole is closed to form a bottomed groove structure, thereby blocking the chip from entering. It is understood that the chip blocking part does not necessarily have to completely close the through hole; it only needs to be able to block the chip from entering. Of course, the chip blocking part is not limited to being an integral structure with the substrate body. In other embodiments, the chip blocking part can be set as an independent structure, which may make the transfer process more flexible.

[0067] In some embodiments, the chip blocking portion is movably connected to the substrate body. The chip blocking portion can switch between a first state and a second state. When the chip blocking portion is in the first state, it blocks the entrance to the chip receiving area, preventing the chip to be transferred from entering the corresponding chip receiving area. When the chip blocking portion is in the second state, the chip to be transferred can enter the chip receiving area. The switching of the chip blocking portion can be controlled by non-contact forces such as magnetism, or directly by the force of fluid flow or other external forces acting directly on the chip blocking portion. In these embodiments, the chip blocking portion is similar to a gate, which can selectively open or close the chip receiving area. By controlling the state of the chip blocking portion, the chip receiving area can be selectively opened, ensuring that the chip to be transferred in the current fluid remains only in the corresponding area.

[0068] The movement of the chip blocking portion includes, but is not limited to, translation and rotation. In some embodiments, the chip blocking portion includes a barrier rotatably connected to the substrate body, which, when rotated to a predetermined posture, does not obstruct the entrance to the chip accommodating area. The barrier can be a rigid or elastic structure; in some examples, the barrier can be an ultra-thin structure, such as an elastic ultra-thin structure. The material of the barrier includes, but is not limited to, metal, gallium nitride, or polymer.

[0069] As an example, one end of the barrier is rotatably connected to the substrate body. The barrier can rotate horizontally relative to the substrate body around the part where it is connected. When the barrier rotates to a certain angle, it blocks the entrance to the chip accommodating area. The rotation of the barrier can be an unrestricted 360-degree horizontal rotation relative to the substrate body, or it can be restricted to a certain range for better control, for example, limiting the rotation range of the barrier to 10 degrees, meaning the barrier can only rotate a maximum of 10 degrees. Figure 3 As shown, the rotation range of the obstruction 3 is limited to 10 degrees, and the obstruction 3 is located on the right side of the chip accommodating area 2 (with reference to the direction shown in the figure); Figure 3 As shown in Figure a, the length direction of the obstruction 3 is parallel to the length direction of the chip accommodating region 2 (using this as a 0-degree reference), as... Figure 3 As shown in b, the obstruction 3 can rotate 10 degrees clockwise. At this time, the obstruction 3 blocks the chip receiving area 2. Although it does not completely block the entrance of the chip receiving area 2, the chip to be transferred can no longer fall into the chip receiving area 2 through the remaining space. It can be understood that the shape of the obstruction is not limited to the strip-shaped object exemplified in this example, but can also be, but is not limited to, cylindrical, sheet-like objects of any shape.

[0070] When the obstruction has a certain volume, such as a cylindrical object, the flow of fluid can be used to directly push the obstruction to rotate. Based on the above... Figure 4For example, if the flow direction of fluid f is set to left to right, then the obstruction 3 can be made to rotate counterclockwise. If the obstruction 3 is currently in the second state (that is, it has rotated 10 degrees), then... Figure 3 If the state of b in the fluid is such that the obstruction 3 is pushed back to the 0-degree position by the fluid f (i.e., ...), then the obstruction 3 will be pushed back to the 0-degree position by the fluid f (i.e., ...). Figure 3 (Regarding state 'a' in the example), due to the limited rotation range, the obstruction 3 will not continue to rotate counterclockwise after being pushed back to 0 degrees. Similarly, setting the flow direction of fluid f to right to left will allow the obstruction 3 to rotate clockwise, which will not be elaborated further here. It is understandable that certain rotation limitations during obstruction control simplify the process. For example, in this example, simply controlling the left and right flow direction of the fluid is sufficient to easily switch the obstruction between the first and second states. Depending on actual needs, the rotation range of the obstruction can also include, but is not limited to, 15, 20, 25, 30, 35, 40, 45 degrees, etc. In practical applications, the obstruction's rotation can also require an external force greater than a certain threshold to initiate, preventing unplanned rotation caused by slight fluid flow or external impact.

[0071] In some embodiments, one side of the barrier is rotatably connected to the substrate body, and the barrier can be flipped relative to the substrate body around the portion where it is connected to the substrate body. The barrier can be sheet-like, such as... Figure 5 As shown in Figure a, one side of the barrier 3 is connected to the substrate body. In the first state, the barrier 3 acts as a cover, covering at least part of the entrance to the chip receiving area 2, preventing the chip to be transferred from falling in. Figure 5 As shown in b, in the second state, the barrier 3 is lifted, fully opening the entrance to the chip receiving area 2, allowing the chip to be transferred to fall in. In this example, the rotation of the barrier can also be achieved using fluid flow, for example... Figure 6As shown, fluid f flows perpendicularly from the side of the obstruction 3 away from the side connected to the substrate body 1 towards the side connected to the substrate body 1. The fluid f within the chip housing area 2 flows at a slower speed, while the fluid f outside the area flows at a faster speed. The pressure difference formed on both sides of the obstruction 3 can provide a force to lift the obstruction 3 to a certain extent. Furthermore, when the angle between the obstruction 3 and the substrate body 1 is greater than 0 degrees (in this example, 0 degrees is defined as the obstruction 3 being in the first state and parallel to the substrate body 1; and 180 degrees is defined as the obstruction 3 being in the second state and parallel to the substrate body 1), the direct impact of fluid f on the obstruction 3 also provides a force to lift the obstruction 3. In this example, when the obstruction is in the second state, the angle between it and the substrate body can be greater than or equal to 90 degrees. For example, if the rotation range of the obstruction is not limited, the maximum angle with the substrate body can be 180 degrees. In some implementations, the obstruction can be rotated in the opposite direction by the reverse flow of fluid, returning to the position in the first state. Alternatively, the rotation range of the obstruction can be limited so that it can form an angle of less than 180 degrees with the substrate body, such as 90 degrees, or 80 degrees, 75 degrees, etc., which are less than 90 degrees. In some applications, the obstruction is set to form an angle of slightly less than 90 degrees with the substrate body. When the fluid flow rate decreases or stops, the obstruction will automatically return to the position of the first state.

[0072] In some embodiments, the chip blocking portion includes an elastic rotating member disposed between the substrate body and the blocking object. This elastic rotating structure allows the chip blocking portion to automatically return to a preset state; examples include, but are not limited to, a rotating spring structure and an adhesive block structure. As a more specific example, the adhesive block adheres one end of the strip-shaped blocking object to the substrate body. During the transfer process, provided that the adhesive block does not separate from the blocking object or the substrate body and the deformation of the adhesive block is less than a predetermined deformation, when the blocking object is subjected to an external force, it can drive the adhesive block to rotate. The adhesive block can have a certain degree of elasticity. When the external force is removed, it drives the blocking object to rotate back to its original position, realizing the switching between the first state and the second state. Therefore, in some embodiments, the inclusion of an elastic rotating member ensures that the chip blocking portion is in a uniform default state when not driven by external force, facilitating unified control.

[0073] In some embodiments, the barrier is slidably connected to the substrate body, and the barrier can translate relative to the substrate body within a certain range along a predetermined direction. The barrier is connected to the substrate body via a sliding connection structure, such as... Figure 7 As shown in Figure a, when the obstruction 3 slides to the first position range, it blocks the entrance of the chip accommodating area 2, as follows: Figure 7 As shown in Figure b, when the obstruction 3 slides to the second position range, the entrance to the chip accommodating region 2 opens. In fact, the sliding obstruction in this example can conveniently correspond to multiple chip accommodating regions simultaneously, for example... Figure 8 In the example, the obstruction 3 spans two adjacent chip accommodating regions 2 along its length. Therefore, the obstruction 3 corresponds to these two chip accommodating regions 2, simultaneously blocking and opening the entrances to both regions. Of course, in practical applications, it is not limited to two chip accommodating regions; it can also span an entire row or column. For example, in the manufacturing process of display panels, it is necessary to selectively transfer multiple colors of light-emitting chips. Since the light-emitting chips in the same row or column may be of the same color, methods including but not limited to those described above can be used to simultaneously control an entire row or column of chip accommodating regions, ensuring that light-emitting chips of the same color fall into the same row or column of chip accommodating regions during a single transfer.

[0074] In some embodiments, the chip blocking portion includes a self-elastic blocking element that deforms when subjected to an external force (e.g., the impact of fluid flow), thereby achieving a switch between a first state and a second state. For example... Figure 9 As shown in Figure a, the obstruction 3 is in its first state when it is not subjected to external force, blocking the entrance to the chip accommodating area 2, as shown in Figure a. Figure 9 As shown in b, the obstruction 3 deforms under the action of fluid flow, thereby switching to the second state to open the entrance of the chip accommodating area 2. It can be understood that when the fluid flow rate is lower than a certain threshold, the deformation of the obstruction decreases and it can automatically return to the first state.

[0075] To facilitate more flexible selective transfer, the switching conditions for the first and second states of the chip blocking section can be differentiated. During the transfer process, by controlling the corresponding chip blocking section to be in the second state, the corresponding chip receiving area can be placed into the chip. Then, by controlling another part of the chip blocking section to be in the second state, the chip receiving area corresponding to this part of the chip blocking section can be placed into another type of chip. It can be seen that the transfer auxiliary board of this embodiment can achieve the effect of selectively placing chips in any region based on the pre-designed differentiated switching conditions for the chip blocking sections.

[0076] As mentioned earlier, during the fluid transfer process, the force of the fluid flow can be used to cause the obstructions in the chip blocking section to rotate. Therefore, the obstructions can be set to start rotating under different magnitudes of external force, thereby achieving differentiated control of the chip blocking section. The transfer auxiliary board includes at least two sets of chip blocking sections. The obstructions in different sets of chip blocking sections rotate to a predetermined posture under different magnitudes of external force. This predetermined posture is the posture in which the obstructions do not block the entrance of the chip receiving area, that is, at this time the chip blocking section is in a second state. For example, the obstructions in the first set of chip blocking sections start to rotate under an external force of not less than a first force, and the obstructions in the second set of chip blocking sections start to rotate under an external force of not less than a second force, where the first force and the second force are different.

[0077] For example, by differentiating the structural designs of different groups of chip blocking parts, the blocking objects of different groups of chip blocking parts can rotate to a predetermined posture under the action of external forces of different magnitudes. For example, the volume, weight, and elastic coefficient of the blocking object itself can be set, and the strength of the elastic rotating component can also be set, such as the elastic coefficient of the rotational spring structure, the volume or strength of the adhesive block structure, etc. In other example structures, the elastic coefficient of the blocking object itself, the friction coefficient between the sliding connection structures, etc., can also be set to achieve a similar effect. By differentiating the design of parameters including but not limited to the above, the blocking objects of different groups of chip blocking parts can have different degrees of movement under the same magnitude of external force, thereby achieving the effect of rotating to a predetermined posture under the action of external forces of different magnitudes.

[0078] In practical applications, the flow rate of the fluid is positively correlated with the force exerted on the obstacle. Therefore, different external forces can be applied by controlling the flow rate of the fluid. As a more specific implementation, the obstacle of the first group of chip blocking parts rotates to a predetermined posture when the flow rate of the fluid is not less than v1, the obstacle of the second group of chip blocking parts rotates to a predetermined posture when the flow rate of the fluid is not less than v2, and the obstacle of the third group of chip blocking parts rotates to a predetermined posture when the flow rate of the fluid is not less than v3, where v1 < v2 < v3. It can be understood that when the flow rate of the fluid is v1, the obstacle of the first group of chip blocking parts rotates to a predetermined posture to open the entrance of the corresponding chip accommodating area; when the flow rate of the fluid is v2, the obstacles of both the first group of chip blocking parts and the second group of chip blocking parts rotate to a predetermined posture; when the flow rate of the fluid is v3, the obstacles of the first group of chip blocking parts, the second group of chip blocking parts, and the third group of chip blocking parts all rotate to a predetermined posture. It should be noted that there is actually no limitation on the positional relationship of each group of chip blocking parts. As a specific example, when manufacturing a display panel using a transfer auxiliary plate, the grouping of the chip blocking parts can be based on the colors of each light-emitting chip. The chip blocking parts corresponding to the positions where red light-emitting chips are to be set are grouped into one group, the chip blocking parts corresponding to the positions where green light-emitting chips are to be set are grouped into one group, and the chip blocking parts corresponding to the positions where blue light-emitting chips are to be set are grouped into one group. Using such a grouping method, different-color light-emitting chips are selectively dropped into the corresponding chip accommodating areas and transferred.

[0079] The flow of the fluid is affected by an object to a certain extent. For example, in some of the above embodiments, the chip blocking part has a certain volume, which hinders the flow of the fluid. However, the chip blocking part in the above example requires the flow rate of the fluid to meet certain conditions. In fact, the chip blocking part in the front (referring to the fluid flow direction) weakens the force exerted by the fluid on the subsequent chip blocking part, which reduces the control sensitivity of the chip blocking part. To optimize the rotation of the obstacle of the chip blocking part on the transfer auxiliary plate under the action of the fluid, in some embodiments, the adjacent chip blocking parts in the fluid flow direction can be arranged in a staggered manner to reduce the interference between the chip blocking parts.

[0080] As a specific example, the obstacle of the chip blocking part is configured to rotate horizontally with respect to the substrate main body under an external force, and the rotation axes of different groups of chip blocking parts are different in position in at least one of the width direction and the length direction of their corresponding chip accommodating areas. For example Figure 10The chip blocking section 30 comprises three groups, staggered along the length of the chip accommodating region 2. When the fluid flows in the left-right direction (referring to the direction shown in the figure), the interference between adjacent chip blocking sections 30 is greatly reduced, ensuring the control sensitivity of each chip blocking section 30. It can be understood that, taking three chip blocking sections in the same row as a unit, the transfer auxiliary board may include multiple units of chip blocking sections. Since the chip blocking sections in the same group are spaced one unit apart in the left-right direction (i.e., the distance between three chip blocking sections), the spacing between chip blocking sections in the same group located in the same position in each chip accommodating region is relatively large, and the interference between them is controlled to a small degree.

[0081] The transfer auxiliary board of this embodiment, through the cooperation of the chip accommodating area and the chip blocking part, enables the chip to be transferred to selectively fall only into the chip accommodating area that is not blocked by the chip blocking part. Thus, selective chip transfer is also achieved during the fluid transfer process. Furthermore, the transfer auxiliary board of this embodiment only needs to use the chip blocking part to block the position where the chip does not need to be transferred. There is no need to make additional differentiated designs to the structure of the chip or the receiving substrate to achieve the selection. It does not increase the manufacturing difficulty and process complexity of the chip and the receiving substrate, which is conducive to mass production.

[0082] Another optional embodiment of the present invention:

[0083] This embodiment provides a chip transfer method that utilizes the transfer auxiliary board described in the above embodiment to transfer the chip, and uses fluid to achieve selective chip transfer. Please refer to [link to previous document]. Figure 11 The chip transfer method in this embodiment includes:

[0084] S101. Place the transfer auxiliary board on the receiving substrate;

[0085] The transfer auxiliary board is the transfer auxiliary board provided in the above embodiment. It should be understood that the chip accommodating area is positioned opposite to the area on the receiving substrate where the chip is disposed. When the chip falls into the chip accommodating area, the chip is also located in the area on the receiving substrate where it needs to be disposed. In this embodiment, the receiving substrate and the sidewalls of the chip accommodating area together form a groove-shaped structure capable of accommodating the chip, and the chip also contacts the receiving substrate when it falls into the chip accommodating area.

[0086] S102, The chip to be transferred is made to fall into the unobstructed chip receiving area by fluid transfer;

[0087] This step can involve transferring a single chip or multiple selective transfers to achieve the transfer of multiple chips.

[0088] S103. Bond the chip to be transferred on the receiving substrate to the receiving substrate;

[0089] Bonding includes, but is not limited to, soldering. It should be noted that step S103 can be performed after a single fluid transfer. For example, if multiple sets of chips to be transferred need to be transferred onto the receiving substrate through multiple fluid transfers, bonding can be performed after each set falls into the chip receiving area. After bonding is completed, the next transfer or other fabrication steps can continue. Alternatively, in a process requiring multiple transfers, step S103 can be performed after all the chips to be transferred have fallen onto the receiving substrate; that is, after multiple fluid transfers have been performed on all the chips to be transferred, all the chips to be transferred are bonded at once.

[0090] In traditional fluid transfer processes, the receiving substrate selectively receives chips by setting specific receiving structures. For example, receiving slots with specific shapes are formed on the receiving substrate. Simultaneously, during chip fabrication, the corresponding chips are made to match the shape of the corresponding receiving slots on the receiving substrate. By designing receiving slots with different shapes for different chips, chips with other shapes cannot fall into mismatched receiving slots, thus achieving selective placement of chips to be transferred on the receiving substrate. However, this also necessitates the creation of differentiated shapes in both the receiving substrate and chip fabrication, resulting in high manufacturing difficulty and process complexity, which is detrimental to mass production. However, this embodiment, by utilizing the transfer auxiliary board provided in the above embodiment, enables selective chip placement onto the receiving substrate during fluid transfer without any modifications to the structure of the chip or receiving substrate. The fabrication difficulty and process complexity of both the chip and receiving substrate are low, facilitating mass production.

[0091] On the other hand, the chip transfer method in this embodiment can achieve selective transfer of different regions multiple times by controlling the transfer auxiliary board.

[0092] To better understand the chip transfer method of this embodiment, this embodiment provides further examples of the chip transfer process in conjunction with a specific transfer auxiliary board.

[0093] Example 1:

[0094] In this example, the transfer auxiliary board includes a substrate body, a chip accommodating area, and a chip blocking part fixedly disposed on a portion of the chip accommodating area. That is, the chip blocking part is immovable, and the entrance to its corresponding chip accommodating area is always blocked. Figure 12 The chip transfer process includes:

[0095] S201. Place the transfer auxiliary board on the receiving substrate;

[0096] like Figure 13The receiving substrate 4 is a display panel. Taking a single pixel area as an example, each pixel area needs to have red, green, and blue light-emitting chips (also known as RGB chips) transferred onto it. On the transfer auxiliary board, the chip blocking part blocks two-thirds of the chip accommodating area. The position of the chip accommodating area 2 corresponds to the position of each chip in the pixel area. Among the three chip accommodating areas 2 corresponding to each pixel area, two chip accommodating areas 2 are blocked by the chip blocking part, and one chip accommodating area 2 is not blocked. In this example, the receiving substrate 4 also includes pads 5 for connecting to the electrodes of the chip.

[0097] S202, The first set of chips to be transferred is carried in the fluid and falls into the chip receiving area;

[0098] like Figure 14 As shown, only the chip accommodating area 2, which is not blocked by the chip blocking part, contains the first group of chips G to be transferred. During the first selective transfer of chips, one of the three light-emitting chips (red, green, and blue), such as a green light-emitting chip, can be transferred and placed on the display panel.

[0099] In some examples, to facilitate the subsequent transfer process and reduce the impact of the subsequent transfer process on the chip that has already fallen into the chip receiving area, a certain amount of adhesive material can be provided in the corresponding areas of the chip and / or the receiving substrate, so that the chip is initially bonded to the receiving substrate when it falls onto the receiving substrate.

[0100] S203. Solder the chip to be transferred on the receiving substrate to the pads of the receiving substrate.

[0101] For example, the fluid can be drained away, leaving only the chip to be transferred in the corresponding chip housing area, where it can be soldered to complete the bonding.

[0102] S204. Configure the relative positions of the transfer auxiliary board and the receiving substrate so that the chip accommodating area on the transfer auxiliary board that is not blocked is opposite to the position on the receiving substrate used to set the second group of chips to be transferred.

[0103] like Figure 15 The first group of chips G to be transferred remains in its original position. At this time, the position of the transfer auxiliary board changes. The entrance of the chip accommodating area 2 where the first group of chips G to be transferred is located is blocked by the chip blocking part. The first group of chips G to be transferred is essentially protected within the chip accommodating area 2. This also reduces the interference of external fluid flow on the already transferred first group of chips G during the subsequent fluid transfer process.

[0104] S205, The fluid carries the second set of chips to be transferred, and the second set of chips to be transferred falls into the chip accommodating area;

[0105] like Figure 16 As shown, only the chip accommodating area 2, which is not blocked by the chip blocking part, contains the second set of chips B to be transferred. During this selective transfer process, another type of the red, green, and blue light-emitting chips, such as the blue light-emitting chip, is placed on the display panel.

[0106] S206. Solder the chip to be transferred on the receiving substrate to the pads of the receiving substrate.

[0107] At this point, both the first and second sets of chips to be transferred were soldered onto the receiving substrate. During the fabrication of the display panel, the bonding of the two colors of light-emitting chips was completed.

[0108] S207. Configure the relative positions of the transfer auxiliary board and the receiving substrate so that the chip accommodating area on the transfer auxiliary board that is not blocked is opposite to the position on the receiving substrate used to set the third group of chips to be transferred.

[0109] like Figure 17 As shown, the first group of chips to be transferred G and the second group of chips to be transferred B remain in their original positions, the position of the transfer auxiliary board is moved laterally, the first group of chips to be transferred G and the second group of chips to be transferred B are protected in the chip accommodating area 2 with chip blocking parts, and the position on the receiving substrate 4 for setting the third group of chips to be transferred is open to the outside.

[0110] Understandably, the subsequent transfer process for the third group of chips to be transferred is similar to the aforementioned steps S202 to S203 or S204 to S205, except that the fluid carries the third group of chips to be transferred. The specific transfer process will not be described in detail here. In this selective transfer process, the last type of the red, green, and blue light-emitting chips that can be transferred, such as the red light-emitting chip, is placed on the display panel.

[0111] like Figure 18 As shown, after the transfer is completed, three different chips, including the third group of chips to be transferred R, are bonded to the corresponding positions on the receiving substrate 4. For example, the red, green, and blue light-emitting chips that make up pixels on the display panel are bonded to the display panel according to the pixel arrangement and position. It can be understood that the above chip transfer method is not actually limited to the transfer of light-emitting chips, that is, the application scenarios are not limited to the production and manufacturing of display panels.

[0112] In some embodiments, the chip blocking portion includes at least two sets, which rotate under the action of an external force, and different sets of chip blocking portions rotate to a predetermined posture under the action of external forces of different magnitudes; the chip to be transferred falls into the chip receiving area by fluid transfer, including:

[0113] The flow rate of the controlled fluid is set to a first velocity. Under the action of the fluid at the first velocity, the first set of chip blocking parts rotates to a predetermined posture. The fluid carries the first set of chips to be transferred, and the first set of chips to be transferred falls into the chip receiving area that is not blocked.

[0114] The flow rate of the controlled fluid is set to a second velocity. Under the influence of the fluid at this second velocity, the first and second sets of chip blocking sections rotate to a predetermined posture. The fluid carries a second set of chips to be transferred, which fall into an unblocked chip-containing area. It is understood that for three or more sets of chip blocking sections, more flow rate levels can be set, and a similar transfer method can be used. Based on this implementation, two more specific transfer processes are illustrated below.

[0115] Example 2:

[0116] In this example, the transfer auxiliary board includes a substrate body, a chip accommodating area, and a chip blocking part movably connected to the substrate body. When the chip blocking part is in a first state, the entrance to its corresponding chip accommodating area is blocked; when the chip blocking part is in a second state, the entrance to its corresponding chip accommodating area is open. In this example, the blocking element of the chip blocking part is connected to the substrate body via an elastic rotating member. The chip blocking part includes three sets. The blocking element of the first set of chip blocking parts rotates to a predetermined posture (i.e., in the second state) when the fluid flow rate is not less than v1; the blocking element of the second set of chip blocking parts rotates to a predetermined posture when the fluid flow rate is not less than v2; and the blocking element of the third set of chip blocking parts rotates to a predetermined posture when the fluid flow rate is not less than v3. Wherein v1... <v2<v3。

[0117] like Figure 19 The chip transfer process includes:

[0118] S301. Place the transfer auxiliary board on the receiving substrate;

[0119] like Figure 20 On the transfer auxiliary board, the chip blocking part blocks all chip receiving areas 2. Similar to the previous example, in the transfer scenario of the display panel, the position of the chip receiving area 2 can correspond to the position of each chip in the pixel area of ​​the display panel. Specifically, in this example, one end of the blocking part is set on the right side of the chip receiving area by an elastic rotating member (the directions indicated in this example are all referenced to the corresponding illustrated directions). When no other external force is applied, the blocking part forms a 10-degree angle with the chip receiving area and blocks the entrance of the chip receiving area.

[0120] S302, The first set of chips to be transferred is carried in the fluid and flows at a flow rate of v1, and the first set of chips to be transferred falls into the chip receiving area.

[0121] As shown Figure 21 in the figure, the fluid f carries the first group of chips G to be transferred and flows from left to right at a flow rate of v1. The blocking object of the first group of chip blocking parts 31 is pushed by the fluid f and rotates counterclockwise. Among them, the blocking object of the first group of chip blocking parts 31 rotates to be parallel to the chip accommodating area (or other postures that do not block the entrance of the chip accommodating area) under the action of the fluid f. Since the first group of chip blocking parts 31 no longer block the entrance of the chip accommodating area, the first group of chips G to be transferred can fall into the chip accommodating area corresponding to the first group of chip blocking parts 31.

[0122] For the second group of chip blocking parts 32 and the third group of chip blocking parts 33, the flow rate v1 at this time is not sufficient to switch them to the state of not blocking the entrance of the chip accommodating area. That is, the blocking objects of the second group of chip blocking parts 32 and the third group of chip blocking parts 33 have not started to rotate under the flow rate v1, or the rotation that occurs is not sufficient to move the blocking object away from the entrance of the chip accommodating area by enough position for the chips to be transferred to fall.

[0123] S303. The fluid does not carry chips and flows at a flow rate of v4 to clean the redundant chips to be transferred;

[0124] This flow rate v4 < v1. At this time, the blocking object of the first group of chip blocking parts also blocks the entrance of the corresponding chip accommodating area again under the action of the elastic rotating structure. That is, all the chip blocking parts are in the first state at this time. The system is cleaned with the cleaning agent at a flow rate of v4 to remove the redundant first group of chips to be transferred outside the chip accommodating area, and to avoid the remaining first group of chips to be transferred from falling into the areas where other groups of chips to be transferred are to be set along with the fluid during the subsequent chip transfer process. It can be understood that due to the protection of the chip accommodating area and the blocking of the blocking object, the interference to the chips already placed on the receiving substrate (such as the first group of chips to be transferred) is reduced during the cleaning process.

[0125] S304. The fluid carries the second group of chips to be transferred and flows at a flow rate of v2, and the second group of chips to be transferred fall into the chip accommodating area;

[0126] At this time, there is no residue of the first group of chips to be transferred in the system. As Figure 22 shown in the figure, the flow rate of the fluid f is set to v2. The blocking objects of the first group of chip blocking parts 31 and the second group of chip blocking parts 32 are pushed by the fluid f and rotate counterclockwise, and no longer block the entrance of the chip accommodating area 2. Since the chip accommodating area 2 corresponding to the first group of chip blocking parts 31 already contains the first group of chips G to be transferred, the second group of chips B carried by the fluid f can only fall into the chip accommodating area 2 corresponding to the second group of chip blocking parts 32.

[0127] As for the third group of chip blocking sections 33, the flow rate v2 at this time is insufficient to switch it to a state that does not block the entrance of the chip accommodating area.

[0128] It is understandable that after steps S301, S302, S303, and S304, the first and second sets of chips to be transferred have been deposited on the receiving substrate, and these two sets of chips are selectively positioned in corresponding locations. The subsequent transfer process for the third set of chips is similar to steps S303 to S304, except that the fluid carries the third set of chips to be transferred, and the flow rate is v3. The specific transfer process will not be described in detail here.

[0129] In this example, after the first to third groups of chips to be transferred have all landed on the receiving substrate, the process also includes:

[0130] S305. Solder all the chips to be transferred that have fallen onto the receiving substrate to the pads of the receiving substrate;

[0131] For example, after all transfers are completed, the remaining chips to be transferred in the system are cleaned with a cleaning agent at a flow rate of v4, and the fluid in the system is drained after cleaning. The transfer auxiliary board is removed, and all chips to be transferred are soldered. Of course, during the soldering process, a pressure head can be used to apply a certain pressure to the chips to be transferred on the receiving substrate for better bonding.

[0132] Example 3:

[0133] In this example, the structure of the transfer auxiliary board is similar to that in Example 2 above, except that this example only includes two sets of chip blocking sections, which block two-thirds of the chip receiving area. For example, during the transfer process of manufacturing the display panel, the first set of chip blocking sections blocks the chip receiving area corresponding to the position of the green light-emitting chip, the second set of chip blocking sections blocks the chip receiving area corresponding to the position of the blue light-emitting chip, while the chip receiving area corresponding to the position of the red light-emitting chip is not blocked by any chip blocking section. In this example, the blocking members of the first set of chip blocking sections also rotate to a predetermined posture when the fluid flow rate is not less than v5, and the blocking members of the second set of chip blocking sections rotate to a predetermined posture when the fluid flow rate is not less than v6. <v6。

[0134] In this example, such as Figure 23 ,include:

[0135] S401. Place the transfer auxiliary board on the receiving substrate;

[0136] S402, The first set of chips to be transferred is carried in the fluid and flows at a flow rate less than v5, and the first set of chips to be transferred falls into the chip receiving area.

[0137] like Figure 24 As shown, fluid f carries the first group of chips G to be transferred from left to right at a velocity less than v5. Since some chip accommodating areas 2 are not equipped with chip blocking parts, the first group of chips G to be transferred falls into these chip accommodating areas 2. Both the first group of chip blocking parts 31 and the second group of chip blocking parts 32 maintain their blocking effect on the corresponding chip accommodating areas 2.

[0138] S403: The fluid does not carry chips and flows at a flow rate less than v5 to clean up excess chips to be transferred.

[0139] S404, The second set of chips to be transferred is carried in the fluid and flows at a flow rate of v5, and the second set of chips to be transferred falls into the chip receiving area.

[0140] like Figure 25 As shown, the fluid carrying the second set of chips B to be transferred flows from left to right at a flow rate v5. The obstruction of the first set of chip blocking parts 31 is pushed by the fluid to rotate counterclockwise. Since the first set of chip blocking parts 31 no longer blocks the entrance of the chip receiving area, the second set of chips B to be transferred can fall into the chip receiving area 2 corresponding to the first set of chip blocking parts 31. The obstruction of the second set of chip blocking parts 32 has not yet started to rotate at the flow rate v5, or the rotation that has occurred is insufficient to move the obstruction away from the entrance of the chip receiving area enough for the chips to be transferred to fall in.

[0141] The subsequent transfer process for the third group of chips to be transferred is similar to the aforementioned steps S403 to S404, except that the fluid carries the third group of chips to be transferred, and the flow rate is v6. The specific transfer process will not be described in detail here.

[0142] This example uses a similar scheme to Example 2 above for fluid transfer of the chip to be transferred. This example uses fewer chip blocking parts, and the difference in the magnitude of the external force required for the blocking parts to rotate is less.

[0143] It is understandable that when the chip blocking part of the transfer auxiliary board adopts a sliding connection form or achieves the switching between the first state and the second state through its own elastic deformation, the process of transferring the chip using the transfer auxiliary board is similar to that in Example 2 or Example 3 above. Similarly, by designing the blocking part of the chip blocking part to slide to a predetermined position or deform to a predetermined shape at different flow rates, the blocking or opening of the chip accommodating area can be achieved.

[0144] This embodiment utilizes the aforementioned transfer auxiliary board during the fluid transfer process of the chip, ensuring that the chip is positioned only in locations not blocked by chip obstructions, thus achieving selective chip transfer. Furthermore, it eliminates the need to modify the structure of the chip and the receiving substrate, does not increase the manufacturing difficulty or process complexity of the chip and the receiving substrate, and facilitates mass production.

[0145] This embodiment also provides a display panel including a circuit board and a light-emitting chip. The light-emitting chip is transferred to the die-bonding region of the circuit board using the chip transfer method described above in this embodiment and then bonded. This display panel can be applied to various display devices, such as various smart mobile terminals, PCs, monitors, and electronic advertising boards as display devices. In this embodiment, the circuit board and light-emitting chip of the display panel do not require additional structures for the fluid transfer process; overall, its manufacturing process has low complexity and is conducive to mass production.

[0146] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A transfer auxiliary plate, characterized in that, include: The substrate body has a thickness not less than the height of the chip to be transferred. A chip accommodating area is provided on the substrate body. The depth of the chip accommodating area is not less than the height of the chip to be transferred, and the cross-sectional area is not less than the maximum cross-sectional area of ​​the chip to be transferred. The chip accommodating area is used to cooperate with the receiving substrate to accommodate the chip to be transferred. Multiple chip blocking portions are provided on the substrate body and correspond to the position of the chip receiving area. The chip blocking portions can block the entrance of the chip receiving area so that the chip to be transferred cannot enter or exit the chip receiving area through the entrance. The chip blocking part is movably connected to the substrate body, and the chip blocking part can be moved to switch between a first state and a second state; When the chip blocking part is in the first state, it blocks the entrance of the chip accommodating area so that the chip to be transferred cannot enter the corresponding chip accommodating area; When the chip blocking part is in the second state, the chip to be transferred can enter the chip receiving area; The chip blocking part includes a blocking element that is rotatably connected to the substrate body. When the blocking element is rotated to a predetermined posture, it does not block the entrance of the chip accommodating area.

2. The transfer auxiliary plate as described in claim 1, characterized in that, The chip blocking part includes an elastic rotating member disposed between the substrate body and the blocking object. The elastic rotating member rotates under the action of an external force and drives the blocking object to rotate, and returns to its original position after the external force is removed.

3. The transfer auxiliary plate as described in claim 2, characterized in that, The transfer auxiliary board includes at least two sets of chip blocking parts. The blocking parts rotate under the action of external force, and the blocking parts of different sets of chip blocking parts rotate to a predetermined posture under the action of external force of different magnitudes.

4. The transfer auxiliary plate as described in claim 3, characterized in that, The obstruction rotates horizontally relative to the substrate body under the action of external force, and the rotation axis of the chip obstruction in different groups is at a different position in at least one of the width and length directions of the corresponding chip accommodating area.

5. The transfer auxiliary plate as described in any one of claims 1-4, characterized in that, The depth of the chip accommodating region is less than twice the height of the chip to be transferred.

6. A chip transfer method, characterized in that, include: The transfer auxiliary board according to any one of claims 1-5 is disposed on the receiving substrate, and the chip accommodating area is positioned opposite to the area on the receiving substrate where the chip is disposed. The chip to be transferred is brought into the unobstructed chip receiving area by fluid transfer; The chip to be transferred on the receiving substrate is bonded to the receiving substrate.

7. The chip transfer method as described in claim 6, characterized in that, The chip blocking part includes at least two groups. The blocking part of the chip blocking part rotates under the action of external force. The blocking parts of different groups of chip blocking parts rotate to a predetermined posture under the action of external force of different magnitudes. The step of transferring the chip to be transferred into the chip receiving area via fluid transfer includes: The flow rate of the fluid is controlled to a first speed. Under the action of the fluid at the first speed, the obstruction of the first group of chip obstruction parts rotates to the predetermined posture. The fluid carries the first group of chips to be transferred. The first group of chips to be transferred falls into the chip receiving area that is not obstructed and has no chips. The flow rate of the fluid is controlled to a second speed. Under the action of the fluid at the second speed, the obstructions of the first group of chip obstructions and the obstructions of the second group of chip obstructions rotate to the predetermined posture. The fluid carries the second group of chips to be transferred, and the second group of chips to be transferred falls into the chip receiving area that is not obstructed and has no chips.

8. A display panel, characterized in that, Including circuit boards and light-emitting chips; The light-emitting chip is transferred to the die-bonding region of the circuit substrate and bonded using the chip transfer method described in claim 6 or 7.

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