Microfluidic channel heat spreader and electronic device

Abstract

This invention relates to a jet microchannel heat sink and an electronic device. The jet microchannel heat sink includes a substrate comprising multiple jet channels, multiple first microchannel units, and multiple nozzles. The height of the sidewall of each first microchannel is less than the height of the sidewall of the jet channel, so that the jet working fluid impacting the jet channel through the nozzle flows along the sidewall of the jet channel into the first microchannel and converges with the microchannel working fluid within the first microchannel. Heat exchange through the nozzle impacting the jet channel effectively eliminates hot spots and adapts to areas with high heat generation. By setting multiple first microchannels between adjacent jet channels for heat exchange, areas with low heat generation are adapted, resulting in a more uniform temperature distribution for connected electronic devices. Simultaneously, the combination of jet channels and microchannels reduces the jet impact area, thereby avoiding the high pump power consumption caused by relying entirely on jet impact heat exchange and reducing operating costs.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and in particular to a jet microchannel heat sink and electronic device. Background Technology

[0002] With the rapid development of integration and miniaturization of electronic devices, highly integrated circuits and micro-sized electronic devices are widely used, leading to a continuous increase in the power and heat flux density of electronic devices. Moreover, most of the heat of the components is concentrated in a few core areas, which can easily cause high temperatures in local areas, forming hot spots and threatening the working life and reliability of electronic devices.

[0003] In related technologies, microchannel heat sinks or jet impingement heat sinks are generally used to dissipate heat from electronic devices. Microchannel heat sinks increase the contact area between the refrigerant and the components compared to ordinary liquid-cooled heat sinks, but their cooling effect is poor in areas with high heat generation. Jet impingement heat sinks generate a strong convective cooling effect due to the high-speed impact of the fluid on the heated surface, effectively eliminating hot spots. However, the cooling effect is good only in the stagnant area where the jet directly impacts; in non-stagnant areas, the heat transfer coefficient decreases sharply, resulting in a large temperature gradient and poor cooling of the electronic devices. Summary of the Invention

[0004] Therefore, it is necessary to provide a jet microchannel heat sink that solves the problem of poor cooling effect of existing cooling methods.

[0005] A jet microchannel heat sink, comprising:

[0006] The substrate is constructed with multiple jet channels, multiple first microchannel units, and multiple nozzles; the jet channels and the first microchannel units are arranged alternately along a first direction; the liquid outlet of each nozzle is configured to correspond one-to-one with each jet channel;

[0007] The first microchannel unit includes a plurality of first microchannels arranged at intervals along the first direction;

[0008] The height of the sidewall of each of the first microchannels is less than the height of the sidewall of the jet channel, so that the jet working medium impacted by the nozzle into the jet channel flows into the first microchannel along the sidewall of the jet channel and converges with the microchannel working medium in the first microchannel.

[0009] The aforementioned jet microchannel heat sink uses a jet of working fluid formed through nozzles. This jet impacts the jet channel and flows along its walls, thereby cooling the substrate. After impact, the working fluid continues to flow along the channel walls. Because the height of the sidewall of the first microchannel is less than that of the jet channel, the working fluid flows into the first microchannel along its sidewall. The working fluid exiting the jet channel does not flow back in, preventing the formation of eddies that would increase pressure drop, reduce heat exchange efficiency, and affect cooling in the jet region. Once the working fluid enters the first microchannel, it flows along its walls, exchanging heat with the substrate and carrying away heat. Simultaneously, it converges with the incoming jet fluid before exiting. This nozzle-driven jet channel impact heat exchange effectively eliminates hot spots in electronic devices and is suitable for areas with high heat generation. By setting multiple microchannels between adjacent jet channels for heat exchange, the system can adapt to areas with low heat generation, resulting in a more uniform temperature distribution across the electronic components and thus improving cooling performance. Furthermore, the combination of jet channels and microchannels reduces the area affected by the jet impact, avoiding the high pump power consumption associated with relying solely on jet impact heat exchange and lowering operating costs.

[0010] In one embodiment, along the first direction, the height of the sidewalls of the plurality of first microchannels between adjacent jet channels increases or decreases sequentially.

[0011] By setting the sidewall heights of multiple first microchannels to vary sequentially, the working fluid flows out of the jet channel and into the lower first microchannel, ensuring that the working fluid flowing out of the jet channel does not flow back into the jet channel. This guarantees the heat exchange effect between the working fluid in each jet channel and the corresponding jet region. Furthermore, the flow of the working fluid into the microchannel also prolongs the contact time between the working fluid and the microchannel, thereby improving the heat exchange effect and ultimately enhancing the cooling efficiency of electronic devices.

[0012] In one embodiment, along the first direction, the height of the sidewalls of the plurality of first microchannels between adjacent jet channels decreases sequentially and then increases sequentially.

[0013] This design ensures that the working fluid flows out of the jet channel and into the first micro-channel, which is at a lower height. The working fluid exiting the jet channel does not flow back into it, preventing the formation of eddies that would increase the pressure drop and reduce heat exchange efficiency. It also prevents the backflowing working fluid from affecting the original working fluid (those that enter the jet channel directly without passing through the first micro-channel), thus guaranteeing the heat exchange between the original working fluid and the corresponding jet region, and consequently ensuring the cooling effect of the jet on high-heat areas.

[0014] In one embodiment, the substrate further includes a first microchannel liquid inlet chamber and a first microchannel liquid outlet chamber distributed along a second direction, wherein the first microchannel is connected to both the first microchannel liquid inlet chamber and the first microchannel liquid outlet chamber;

[0015] The jet channel is not connected to the liquid inlet chamber of the first microchannel; the second direction is perpendicular to the first direction.

[0016] By setting a first microchannel inlet chamber and a first microchannel outlet chamber at intervals, the working fluid in the microchannels can flow unidirectionally. Furthermore, after being pumped into the inlet chamber, the working fluid is evenly distributed into multiple first microchannels, where it then flows. Since the jet channel is not connected to the first microchannel inlet chamber (i.e., both end faces of the jet channel along the second direction are closed), the jet working fluid in the jet channel only flows along the wall to the first microchannel and then to the first microchannel outlet chamber, without flowing into other jet channels. This prevents interference between the jet working fluids within the jet channel, effectively ensuring the heat exchange efficiency of the original jet working fluid.

[0017] In one embodiment, the substrate is further configured with a second microchannel unit, which is distributed at intervals from the first microchannel unit;

[0018] The second microchannel unit includes a plurality of spaced-apart second microchannels.

[0019] By setting up a second microchannel unit, not only can the space inside the heat sink be effectively utilized, improving the space utilization rate of the heat sink, but the contact area between the microchannel working fluid and the electronic device can also be increased, that is, the cooling contact area between the heat sink and the electronic device can be increased, thereby improving the cooling heat exchange effect.

[0020] In one embodiment, the jet channel and the first microchannel are located in a first region of the substrate; the second microchannel is located in a second region of the substrate, and the first region and the second region do not overlap.

[0021] By arranging the jet channel and the first microchannel in the first region, the greater cooling demand of the first region is met. Furthermore, the arrangement of the first microchannel ensures a more uniform temperature distribution in the first region, improving the cooling effect. By arranging the second microchannel in the second region, the cooling demand of the second region is met, and the uniformity of cooling is ensured, resulting in a more uniform temperature distribution across the entire electronic device, thus guaranteeing its operational reliability. This zoning arrangement not only ensures effective cooling and heat exchange but also reduces pump power consumption and lowers operating costs.

[0022] In one embodiment, the second microchannel includes a first microchannel segment distributed along the first direction and a second microchannel segment distributed along the second direction, wherein the first microchannel segment and the second microchannel segment are connected.

[0023] The first and second microchannel segments make the second microchannel L-shaped, which, compared to a straight design, maximizes the use of space within the substrate, increases the flow path of the working fluid in the microchannel, thereby extending the heat exchange time and improving heat exchange efficiency.

[0024] In one embodiment, the substrate further includes a second microchannel liquid inlet chamber and a second microchannel liquid outlet chamber, wherein the second microchannel is connected to both the second microchannel liquid inlet chamber and the second microchannel liquid outlet chamber;

[0025] The second microchannel liquid inlet chamber is spaced apart from the first microchannel liquid inlet chamber, and the second microchannel liquid outlet chamber is spaced apart from the first microchannel liquid outlet chamber.

[0026] By setting a second microchannel inlet chamber and a second microchannel outlet chamber with intervals, the working fluid in the microchannel can flow in one direction. At the same time, when the working fluid is pumped into the second microchannel inlet chamber, it can be evenly distributed into multiple second microchannels and flow in the second microchannels, thereby cooling the position of the electronic device corresponding to the second region.

[0027] In one embodiment, the jet microchannel heat sink further includes a jet generating cavity, which is connected to the nozzle; the jet working fluid enters the nozzle through the jet generating cavity.

[0028] By setting up a jet generating chamber, the jet working medium can be gathered in the jet generating chamber and then evenly distributed to multiple nozzles, and impacted into the jet channel through the nozzles. There is no need to set up a jet inflow pipe corresponding to the number of nozzles, which reduces manufacturing costs and reduces the space occupied by the radiator.

[0029] An electronic device includes an electronic component and a jet microchannel heat sink as described above connected to the electronic component.

[0030] By using jet microchannel heat sinks to cool down the heat-generating areas of electronic devices, the lifespan of electronic devices can be extended, thereby improving the operational reliability and stability of electronic equipment. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a jet microchannel heat sink provided in an embodiment of the present invention;

[0032] Figure 2 for Figure 1 The diagram shown is a first-view illustration of a jet microchannel heat sink.

[0033] Figure 3 for Figure 1 The diagram shown is a jet microchannel heat sink viewed from a second perspective.

[0034] Figure 4 for Figure 3 A schematic diagram of the AA section in the jet microchannel heat sink shown;

[0035] Figure 5 for Figure 4 A magnified view of point B in the jet microchannel heat sink shown;

[0036] Figure 6 for Figure 1 The diagram shown is a third-person view of the jet microchannel heat sink.

[0037] Figure 7 for Figure 6 A schematic diagram of the CC section in the jet microchannel heat sink shown.

[0038] Reference numerals: 10, jet microchannel radiator; 100, substrate; 101, first region; 102, second region; 110, jet channel; 120, nozzle; 130, first microchannel; 140, first microchannel inlet chamber; 150, first microchannel outlet chamber; 160, second microchannel; 161, first microchannel branch; 162, second microchannel branch; 170, second microchannel inlet chamber; 180, second microchannel outlet chamber; 190, jet generating chamber; 200, jet inlet pipe; 210, jet inlet port; 300, microchannel inlet pipe; 310, first microchannel inlet port; 320, second microchannel inlet port; 400, microchannel outlet pipe; 410, first microchannel outlet port; 420, second microchannel outlet port; 500, connector. Detailed Implementation

[0039] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0040] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0045] like Figures 1 to 5 As shown, an embodiment of the present invention provides a jet microchannel heat sink 10, including a substrate 100. The substrate 100 is constructed with a plurality of jet channels 110, a plurality of first microchannel units, and a plurality of nozzles 120. The jet channels 110 and the first microchannel units are alternately arranged along a first direction. The liquid outlet of each nozzle 120 corresponds one-to-one with each jet channel 110. The first microchannel unit includes a plurality of first microchannels 130 spaced apart along the first direction. The height of the sidewall of each first microchannel 130 is less than the height of the sidewall of the jet channel 110, so that the jet working fluid impacting the jet channel 110 through the nozzle 120 flows into the first microchannel 130 along the sidewall of the jet channel 110 and converges with the microchannel working fluid in the first microchannel 130. The first direction is indicated by the X direction in the figure, and the second direction is indicated by the Y direction. Figure 1 Taking the view shown as an example, both the first and second directions are parallel to the horizontal plane. Taking the base 100 as a rectangular plate as an example, the first direction is the length direction of the base 100, and the second direction is the width direction of the base 100.

[0046] Specifically, the working fluid is formed into a jet through the nozzle 120. The jet impacts the jet channel 110 and flows along the wall of the jet channel 110, thereby cooling the substrate 100. After the jet impact, the working fluid flows along the wall of the jet channel 110. Since the height of the sidewall of the first microchannel 130 is less than the height of the sidewall of the jet channel 110, the working fluid flows into the first microchannel 130 along the sidewall of the jet channel 110. The working fluid flowing out of the jet channel 110 does not flow back into the jet channel 110, preventing the formation of eddies in the jet channel 110 that would increase the pressure drop of the working fluid, worsen the heat exchange effect, and affect the cooling effect of the jet region. After the working fluid enters the first microchannel 130, it flows along the wall of the first microchannel 130, not only exchanging heat with the substrate 100 and carrying away the heat from the substrate 100, but also converging with the jet working fluid flowing into the first microchannel 130 before being discharged. The jet channel 110 is impacted by the nozzle 120 for heat exchange, effectively eliminating hot spots in the electronic device and adapting to areas with high heat generation. By setting multiple first microchannels 130 between adjacent jet channels 110 for heat exchange, areas with low heat generation are adapted, resulting in a more uniform temperature distribution across the electronic device and thus improving the cooling effect. Furthermore, the combination of jet channels 110 and microchannels reduces the area of ​​jet impact, thus avoiding the high pump power consumption caused by relying solely on jet impact heat exchange and reducing operating costs.

[0047] In one embodiment, the sidewalls of the plurality of first microchannels 130 have different heights. Specifically, as Figure 4 and Figure 5 As shown, in another embodiment, along the first direction (X direction), the height of the sidewalls of the plurality of first microchannels 130 between adjacent jet channels 110 decreases sequentially and then increases sequentially.

[0048] Specifically, the two adjacent jet channels 110 are named the left jet channel 110 and the right jet channel 110, respectively. Since the sidewall height of the first microchannel 130 between the left jet channel 110 and the right jet channel 110 first decreases and then increases, that is to say, the multiple first microchannels 130 are approximately symmetrically distributed, and the sidewall of the first microchannel 130 with the lowest height is used as the center of symmetry. Part of the jet working medium in the left jet channel 110 flows from left to right to the central first microchannel 130; part of the jet working medium in the right jet channel 110 flows from right to left to the central first microchannel 130 and merges with the microchannel working medium in the first microchannel 130. The jet working medium flowing out of the jet channel 110 does not flow back into the jet channel 110, reducing the impact of the returning jet working medium on the original jet working medium (i.e., the jet working medium that enters the jet channel 110 directly without passing through the first microchannel 130), ensuring the heat exchange effect between the original jet working medium and the corresponding jet region, and thus ensuring the cooling effect of the jet on the high-heat region. For example, the sidewall heights of the multiple first microchannels 130 are successively 0.75 times, 0.5 times, and 0.25 times the sidewall height of the jet channel 110.

[0049] In one embodiment, the bottom wall of the jet channel 110 and the bottom wall of the first microchannel 130 can be rectangular or arc-shaped. Preferably, the bottom wall is arc-shaped, thereby increasing the working flow area, extending the contact time between the working fluid and the wall surface, and improving the heat exchange effect. The curvature varies according to the pressure of the jet generating chamber 190; the higher the pressure, the smaller the curvature, with a curvature range of π / 6-π. The substrate 100 is made of copper, silicon, aluminum alloy, or other materials with high thermal conductivity. The jet working fluid or microchannel working fluid can be water or liquid metal, etc. The distance between the nozzle 120 and the bottom wall of the jet channel 110 is 0.2-0.4 times the height of the side wall of the jet channel 110, the width of the jet channel 110 is 1.5-2 times the diameter of the nozzle 120, and the ratio of the side wall height to the width of the jet channel 110 is 5:1 to ensure the jet impact effect. The width of the first microchannel 130 is 0.5 times the width of the jet channel 110.

[0050] In another embodiment, along the first direction, the height of the sidewalls of the plurality of first microchannels 130 between adjacent jet channels 110 increases or decreases sequentially.

[0051] Specifically, the bottom walls of the multiple first microchannels 130 are on the same horizontal plane, meaning the bottom walls of the multiple first microchannels 130 have the same height. By setting the sidewall heights of the multiple first microchannels 130 to vary sequentially, the jet working medium flows unidirectionally after exiting the jet channel 110, that is, it flows into the lower-height first microchannel 130, and the jet working medium exiting the jet channel 110 does not flow back into the jet channel 110, ensuring the heat exchange effect between the jet working medium in each jet channel 110 and the corresponding jet region; furthermore, by flowing the jet working medium into the microchannels, the flow path of the jet working medium is extended, which also extends the contact time between the jet working medium and the microchannels, thereby improving the heat exchange effect and thus improving the cooling efficiency of electronic devices. For example, from Figure 5 From the perspective of the first microchannel 130, taking the example of the sidewall height of the multiple first microchannels 130 decreasing sequentially, the jet working medium in the jet channel 110 will flow from left to right until it flows into the first microchannel 130 with the lowest height, and then flows out as the microchannel working medium in the first microchannel 130 flows out.

[0052] like Figures 3 to 5 As shown, in one embodiment, the jet microchannel heat sink 10 further includes a jet generating chamber 190, which is connected to the nozzle 120; the jet working fluid enters the nozzle 120 through the jet generating chamber 190.

[0053] By setting up a jet generating chamber 190, the jet working medium can be gathered in the jet generating chamber 190 and then evenly distributed to multiple nozzles 120, and impacted into the jet channel 110 through the nozzles 120. There is no need to set up a jet inflow pipe 200 corresponding to the number of nozzles 120, which reduces manufacturing costs and reduces the space occupied by the heat sink.

[0054] like Figure 1 and Figure 2 As shown, in one embodiment, the jet microchannel radiator 10 further includes a jet inlet conduit 200 for pumping the jet working fluid into the jet generating chamber 190. By providing the jet inlet conduit 200, the flow rate and volume of the jet working fluid can be controlled according to actual cooling requirements, making it more convenient to use. Understandably, the jet inlet conduit 200 has a jet inlet 210, which communicates with the jet generating chamber 190 to pump the jet working fluid into the jet generating chamber 190.

[0055] like Figures 4 to 7As shown, in one embodiment, the substrate 100 further includes a first microchannel liquid inlet chamber 140 and a first microchannel liquid outlet chamber 150 distributed along a second direction (Y direction). The first microchannel 130 is connected to both the first microchannel liquid inlet chamber 140 and the first microchannel liquid outlet chamber 150. The jet channel 110 is not connected to the first microchannel liquid inlet chamber 140.

[0056] By setting the first microchannel inlet chamber 140 and the first microchannel outlet chamber 150 at intervals, the microchannel working fluid can flow unidirectionally. Furthermore, after being pumped into the inlet chamber, the working fluid can be evenly distributed into multiple first microchannels 130, where it flows. Since the jet channel 110 is not connected to the first microchannel inlet chamber 140 (i.e., both end faces of the jet channel 110 along the second direction are closed), the jet working fluid within the jet channel 110 will only flow along the wall to the first microchannel 130 and then to the first microchannel outlet chamber 150, without flowing into other jet channels 110. This prevents interference between the jet working fluids within the jet channel 110, effectively ensuring the heat exchange effect of the original jet working fluid.

[0057] like Figure 6 and Figure 7 As shown, in one embodiment, the substrate 100 is further configured with a second microchannel unit, which is spaced apart from the first microchannel unit. The second microchannel unit includes a plurality of spaced second microchannels 160. The second microchannels 160 are also used for the flow of the microchannel working fluid. By setting the second microchannel unit, not only can the space within the heat sink be effectively utilized, improving the space utilization rate of the heat sink, but the contact area between the microchannel working fluid and the electronic device is also increased, i.e., the cooling contact area between the heat sink and the electronic device is increased, thereby improving the cooling heat exchange effect.

[0058] like Figure 2 and Figure 7 As shown, in one embodiment, the jet channel 110 and the first microchannel 130 are located in the first region 101 of the substrate 100; the second microchannel 160 is located in the second region 102 of the substrate 100, and the first region 101 and the second region 102 do not overlap.

[0059] The substrate 100 is connected to the electronic device via connectors 500, such as studs. The first region 101 is a region with high heat generation, while the second region 102 is a region with low heat generation. By arranging the jet channel 110 and the first microchannel 130 in the first region 101, the high cooling demand of the first region 101 is met. Furthermore, the arrangement of the first microchannel 130 ensures a more uniform temperature distribution in the first region 101, improving the cooling effect. By arranging the second microchannel 160 in the second region 102, the cooling demand of the second region 102 is met, and the uniformity of cooling is ensured, resulting in a more uniform temperature distribution throughout the electronic device, thus guaranteeing the operational reliability of the electronic device. Taking a CPU as an example, the CPU's heat is mainly concentrated in the central region, while other regions have lower heat levels. Therefore, the jet channel 110 and the first microchannel 130 can be arranged in the central region, and the second microchannel 160 can be arranged in the non-central region, i.e., the edge region. By combining jet channel 110 and first micro channel 130 in the central area, hot spots are eliminated; by setting second micro channel 160 in the edge area, the temperature of the CPU surface is made more uniform. This partitioning not only ensures the cooling heat exchange effect, but also reduces pump power consumption and lowers operating costs.

[0060] like Figure 6 and Figure 7 As shown, in one embodiment, the second microchannel 160 includes a first microchannel segment 161 distributed along a first direction (X direction) and a second microchannel segment 162 distributed along a second direction (Y direction), wherein the first microchannel segment 161 and the second microchannel segment 162 are connected.

[0061] The first microchannel segment 161 and the second microchannel segment 162 make the second microchannel 160 L-shaped. Compared with a straight design, this maximizes the use of space within the substrate 100, increases the flow path of the working fluid in the microchannel, thereby extending the heat exchange time and improving the heat exchange efficiency. Multiple second microchannels 160 are evenly spaced.

[0062] like Figure 2 and Figure 7 As shown, in one embodiment, the substrate 100 further includes a second microchannel liquid inlet chamber 170 and a second microchannel liquid outlet chamber 180, and the second microchannel 160 is connected to both the second microchannel liquid inlet chamber 170 and the second microchannel liquid outlet chamber 180; the second microchannel liquid inlet chamber 170 is spaced apart from the first microchannel liquid inlet chamber 140, and the second microchannel liquid outlet chamber 180 is spaced apart from the first microchannel liquid outlet chamber 150.

[0063] In this way, the working fluid in the first microchannel 130 and the working fluid in the second microchannel 160 will not interfere with each other, ensuring the heat exchange effect of the corresponding area of ​​each channel. By setting the second microchannel inlet chamber 170 and the second microchannel outlet chamber 180 at intervals, the working fluid in the microchannel can flow in one direction. At the same time, when the working fluid in the microchannel is pumped into the second microchannel inlet chamber 170, it can be evenly distributed into multiple second microchannels 160 and flow in the second microchannels 160, thereby cooling the position of the electronic device corresponding to the second region 102.

[0064] like Figure 1 and Figure 2 As shown, in one embodiment, the jet microchannel radiator 10 further includes a microchannel liquid inlet pipe 300, which is used to pump the microchannel working fluid into the first microchannel liquid inlet chamber 140 and the second microchannel liquid inlet chamber 170. By providing the microchannel liquid inlet pipe 300, the flow rate and volume of the microchannel working fluid entering the first microchannel liquid inlet chamber 140 and the second microchannel liquid inlet chamber 170 can be controlled according to actual cooling requirements, making it more convenient to use. Understandably, the microchannel liquid inlet pipe 300 is also provided with a first microchannel liquid inlet 310 and a second microchannel liquid inlet 320. The first microchannel liquid inlet 310 is connected to the first microchannel liquid inlet chamber 140, and the second microchannel liquid inlet 320 is connected to the second microchannel liquid inlet chamber 170, so as to pump the microchannel working fluid into the first microchannel liquid inlet chamber 140 and the second microchannel liquid inlet chamber 170.

[0065] like Figure 1 and Figure 2 As shown, in one embodiment, the jet microchannel radiator 10 further includes a microchannel liquid outlet pipe 400, which is used to discharge the microchannel working fluid from the second microchannel liquid outlet chamber 180. By providing the microchannel liquid outlet pipe 400, the jet working fluid and microchannel working fluid gathered in the first microchannel liquid outlet chamber 150 can be conveniently discharged, while the microchannel working fluid in the second microchannel liquid outlet chamber 180 can be discharged, ensuring the stability and reliability of the working fluid flow within the radiator, thereby improving the cooling effect of the radiator. Understandably, the microchannel liquid outlet pipe 400 is also provided with a first microchannel liquid outlet 410 and a second microchannel liquid outlet 420, with the first microchannel liquid outlet 410 connected to the first microchannel liquid outlet chamber 150 and the second microchannel liquid outlet 420 connected to the second microchannel liquid outlet chamber 180.

[0066] Furthermore, one embodiment of the present invention also provides an electronic device, including an electronic component and the aforementioned jet microchannel heat sink 10. The microchannel heat sink is connected to the electronic component via a connector 500, such as a stud, to cool the heat-generating area of ​​the electronic component, thereby extending its service life and improving the operational reliability and stability of the electronic device. This electronic device can be a computer, and the electronic component can be a CPU. Because the aforementioned jet microchannel heat sink 10 is installed on the CPU, hot spots on the CPU can be effectively eliminated. Simultaneously, by providing multiple first microchannels 130 for heat exchange between adjacent jet channels 110, the cooling effect on other areas can be guaranteed, resulting in a more uniform temperature distribution across the CPU, thereby improving its service life and operational reliability.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A jet microchannel heat sink, characterized in that, include: The substrate (100) is constructed with multiple jet channels (110), multiple first microchannel units and multiple nozzles (120); the jet channels (110) and the first microchannel units are arranged alternately along a first direction; the liquid outlet of each nozzle (120) is correspondingly set with each jet channel (110); The first microchannel unit includes a plurality of first microchannels (130) arranged at intervals along the first direction; The height of the sidewall of each of the first microchannels (130) is less than the height of the sidewall of the jet channel (110), so that the jet working medium impacted by the nozzle (120) into the jet channel (110) flows into the first microchannel (130) along the sidewall of the jet channel (110) and converges with the microchannel working medium in the first microchannel (130). Along the first direction, the height of the sidewalls of the plurality of first microchannels (130) between adjacent jet channels (110) first decreases sequentially and then increases sequentially.

2. The jet microchannel heat sink according to claim 1, characterized in that, Along the first direction, the height of the sidewalls of the plurality of first microchannels (130) between adjacent jet channels (110) increases or decreases sequentially.

3. The jet microchannel heat sink according to claim 1, characterized in that, The substrate (100) further includes a first microchannel liquid inlet chamber (140) and a first microchannel liquid outlet chamber (150) distributed along the second direction, wherein the first microchannel (130) is connected to both the first microchannel liquid inlet chamber (140) and the first microchannel liquid outlet chamber (150); The jet channel (110) is not connected to the first microchannel liquid inlet chamber (140); the second direction is perpendicular to the first direction.

4. The jet microchannel heat sink according to claim 3, characterized in that, The substrate (100) is also constructed with a second microchannel unit, which is distributed at intervals from the first microchannel unit; The second microchannel unit includes a plurality of spaced-apart second microchannels (160).

5. The jet microchannel heat sink according to claim 4, characterized in that, The jet channel (110) and the first microchannel (130) are located in the first region (101) of the substrate (100); the second microchannel (160) is located in the second region (102) of the substrate (100), and the first region (101) and the second region (102) do not overlap.

6. The jet microchannel heat sink according to claim 4, characterized in that, The second microchannel (160) includes a first microchannel segment (161) distributed along the first direction and a second microchannel segment (162) distributed along the second direction, wherein the first microchannel segment (161) and the second microchannel segment (162) are connected.

7. The jet microchannel heat sink according to claim 4, characterized in that, The substrate (100) further includes a second microchannel liquid inlet chamber (170) and a second microchannel liquid outlet chamber (180), wherein the second microchannel (160) is connected to both the second microchannel liquid inlet chamber (170) and the second microchannel liquid outlet chamber (180); The second microchannel liquid inlet chamber (170) is spaced apart from the first microchannel liquid inlet chamber (140), and the second microchannel liquid outlet chamber (180) is spaced apart from the first microchannel liquid outlet chamber (150).

8. The jet microchannel heat sink according to claim 1, characterized in that, The jet microchannel heat sink further includes a jet generating chamber (190), which is connected to the nozzle (120); the jet working fluid enters the nozzle (120) through the jet generating chamber (190).

9. An electronic device comprising an electronic component and a jet microchannel heat sink as described in any one of claims 1-8 connected to the electronic component.

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