communication equipment

Abstract

A communication device (10) includes a dielectric substrate (130), a flat-plate radiating element (121) formed on the dielectric substrate (130), a housing (50) covering the dielectric substrate (130), and a rib (51). The rib (51) is configured to contact the housing (50) and the dielectric substrate (130). Feeding points (SP1, SP2) to which high-frequency signals from an RFIC (110) are supplied are formed on the radiating element (121). When viewed from above in a normal direction to the dielectric substrate (130), the rib (51) contacts the dielectric substrate (130) in a region (RG1) on the central side of the radiating element (121) relative to the feeding points (SP1, SP2).

Description

Technical Field

[0001] The present disclosure relates to a communication device, and more particularly to a technology for stabilizing antenna characteristics in a communication device including a patch antenna. Background Art

[0002] Japanese Patent Publication No. 2017-40497 (Patent Document 1) discloses an impact-resistant structure for protecting a patch antenna disposed inside an electronic device such as a satellite radio clock from impacts caused by falling or the like. In Japanese Patent Publication No. 2017-40497 (Patent Document 1), a gap is formed between the patch antenna and the retaining member, with escape portions formed at the corners and end corners of the patch antenna. When an impact is applied to the electronic device and the patch antenna moves relatively inside the electronic device, the escape portion is used to prevent the corners and end corners of the patch antenna from colliding with the retaining member. In addition, by providing a gentle convex shape on the face of the retaining member, the collision area in the event of a collision between the face of the retaining member and the planar area of the patch antenna can be expanded, thereby allowing the stress applied to the patch antenna to be diffused. These structures can be used to prevent damage to the patch antenna.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-40497 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] Electronic devices with communication functions are generally provided with a covering member for covering an antenna module. Such covering members include impact-resistant retaining members such as those disclosed in Japanese Patent Application Laid-Open No. 2017-40497 (Patent Document 1) or housings of electronic device bodies.

[0008] When a wide space is formed between the radiation surface of the radiation element in the antenna module and the cover member, if the cover member is deformed, the dielectric constant in the radiation direction of the radio wave may change, thereby changing the antenna frequency and failing to achieve the desired antenna characteristics.

[0009] Therefore, it is desirable to arrange a member between the covering member and the radiating element so as to fix the spacing between the covering member and the radiating element. However, when the member is arranged in such a manner as to widely cover the radiating element, there is a concern that the antenna frequency may change, thereby reducing the antenna characteristics or reducing the impact resistance.

[0010] The present disclosure has been made to solve such a problem, and an object thereof is to suppress degradation of antenna characteristics in a communication device and to fix the distance between a cover member and a radiating element.

[0011] Solutions for solving problems

[0012] The communication device disclosed herein comprises: a dielectric substrate; a flat-plate radiating element formed on the dielectric substrate; a cover member covering the dielectric substrate; and a pressing member. The pressing member is arranged to contact the cover member and the dielectric substrate. The radiating element has a feed point formed therein to receive a high-frequency signal from a feed circuit. When viewed from above from a direction normal to the dielectric substrate, the pressing member contacts the dielectric substrate in a region of the radiating element closer to the center than the feed point.

[0013] Effects of the Invention

[0014] In the communication device disclosed herein, the dielectric substrate and the pressing member disposed between the cover member and the radiating element contact each other in a region of the radiating element closer to the center than the feed point. Because the electric field intensity in the central portion of the radiating element is weaker than that in the surrounding portion, even if the pressing member contacts this portion, the impact on the impedance of the radiating element is minimal. This allows for suppressing degradation of antenna characteristics while maintaining a constant distance between the cover member and the radiating element. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a block diagram of a communication device according to an embodiment.

[0016] Figure 2 yes Figure 1 Cross-sectional view and top view of the antenna module in the communication device.

[0017] Figure 3 This is a diagram for explaining the influence of rib arrangement on reflection loss.

[0018] Figure 4 A diagram showing an example of the arrangement of ribs in an array antenna.

[0019] Figure 5 Is used to illustrate Figure 4 Graph of the gain in the example.

[0020] Figure 6 This is a cross-sectional view of a communication device according to Modification 1.

[0021] Figure 7 This is a cross-sectional view of a communication device according to Modification 2.

[0022] Figure 8 This is a cross-sectional view of a communication device according to Modification 3.

[0023] Figure 9 It is a cross-sectional view of a communication device according to Modification 4.

[0024] Figure 10 This is a cross-sectional view of a communication device according to Modification 5.

[0025] Figure 11 It is a cross-sectional view of a communication device according to modification example 6.

[0026] Figure 12 This is a cross-sectional view of a communication device according to Modification 7.

[0027] Figure 13 It is a cross-sectional view of a communication device according to Modification 8.

[0028] Figure 14 It is a cross-sectional view of a communication device according to modification example 9.

[0029] Figure 15 It is a cross-sectional view of a communication device according to Modification 10. DETAILED DESCRIPTION

[0030] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the drawings, identical or corresponding parts are denoted by the same reference numerals, and their description will not be repeated.

[0031] [Basic Structure of Communication Device]

[0032] Figure 1 This is an example of a block diagram of a communication device 10 according to this embodiment. The communication device 10 is, for example, a portable terminal such as a mobile phone, smartphone, or tablet, a personal computer with communication functionality, or a base station. An example of radio waves in the frequency band used in the antenna module 100 according to this embodiment is radio waves in the millimeter wave band with center frequencies of 28 GHz, 39 GHz, or 60 GHz, but radio waves in frequency bands other than these can also be used.

[0033] Reference Figure 1 The communication device 10 includes an antenna module 100 and a BBIC 200 constituting a baseband signal processing circuit. The antenna module 100 includes an RFIC 110, an example of a feed circuit, and an antenna device 120. The communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120. It also down-converts the high-frequency signal received by the antenna device 120 and processes the signal using the BBIC 200.

[0034] exist Figure 1In order to facilitate the description, only the structures corresponding to four radiating elements 121 among the plurality of radiating elements 121 constituting the antenna device 120 are shown, and the structures corresponding to the other radiating elements 121 having the same structure are omitted. Figure 1 , an example is shown in which antenna device 120 is formed of multiple radiating elements 121 arranged in a two-dimensional array. However, there need not be multiple radiating elements 121, and antenna device 120 may also be formed by a single radiating element 121. Alternatively, a one-dimensional array may be formed in which multiple radiating elements 121 are arranged in a row. In this embodiment, the description is based on an example in which radiating element 121 is a patch antenna having a substantially square flat plate shape. However, the shape of radiating element 121 may also be circular, elliptical, or other polygonal shape such as a hexagon.

[0035] The RFIC 110 includes switches 111A to 111D, 113A to 113D, and 117 , power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, a signal combiner / demultiplexer 116 , a mixer 118 , and an amplifier circuit 119 .

[0036] When transmitting a high-frequency signal, switches 111A to 111D and 113A to 113D are switched to the power amplifiers 112AT to 112DT side, and switch 117 is connected to the transmission-side amplifier of amplifier circuit 119. When receiving a high-frequency signal, switches 111A to 111D and 113A to 113D are switched to the low-noise amplifiers 112AR to 112DR side, and switch 117 is connected to the reception-side amplifier of amplifier circuit 119.

[0037] The signal transmitted from BBIC 200 is amplified by amplifier circuit 119 and then up-converted by mixer 118. The up-converted high-frequency transmission signal is split into four by signal combiner / demultiplexer 116 and fed to different radiating elements 121 via four signal paths. By independently adjusting the phase shifting degrees of phase shifters 115A to 115D arranged in each signal path, the directivity of antenna device 120 can be adjusted. Furthermore, attenuators 114A to 114D adjust the strength of the transmission signal.

[0038] The high-frequency signals received by the radiating elements 121 are combined via four different signal paths by the signal combiner / demultiplexer 116. The combined signals are down-converted by the mixer 118, amplified by the amplifier circuit 119, and then transmitted to the BBIC 200.

[0039] RFIC 110 is formed, for example, as a monolithic integrated circuit component including the aforementioned circuit structure. Alternatively, the devices corresponding to each radiating element 121 in RFIC 110 (switch, power amplifier, low-noise amplifier, attenuator, phase shifter) may be formed as a monolithic integrated circuit component for each radiating element 121.

[0040] [Structure of the antenna module]

[0041] Figure 2 yes Figure 1 Cross-sectional view of the antenna module 100 in the communication device 10 ( Figure 2 (A)) and top view ( Figure 2 (B)). Figure 2 In the communication device 10 , the antenna module 100 is housed in the housing 50 .

[0042] The antenna module 100 includes a dielectric substrate 130, a ground electrode GND, and feed lines 141 and 142 in addition to the radiating element 121 and the RFIC 110. Figure 2 In the figure, antenna module 100 is described as having two radiating elements 121. However, the number of radiating elements 121 may be one, or three or more. Furthermore, radiating element 121 may have a single feeding point, in which case a single feeding line is also required. In the following description, the thickness direction of antenna module 100 is defined as the Z-axis, and the X-axis and Y-axis define the plane perpendicular to the Z-axis. In the figures, the positive direction of the Z-axis is sometimes referred to as the upper surface, and the negative direction is sometimes referred to as the lower surface.

[0043] The dielectric substrate 130 may be, for example, a low-temperature co-fired ceramic (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of epoxy, polyimide, or other resins, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) with a relatively low dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluorine-based resins, a multilayer resin substrate formed by laminating multiple resin layers made of PET (polyethylene terephthalate), or a ceramic multilayer substrate other than LTCC. Furthermore, the dielectric substrate 130 does not necessarily have to be a multilayer structure and may also be a single-layer substrate.

[0044] The dielectric substrate 130 has a substantially rectangular shape when viewed from the normal direction (Z-axis direction), and the radiating element 121 is arranged on its upper surface 131 (the surface in the positive direction of the Z-axis). Figure 2 In FIG. 1 , two radiating elements 121 are arranged adjacent to each other along the X axis. In addition, a ground electrode GND is arranged on the layer on the lower surface 132 side of the dielectric substrate 130 so as to face the radiating element 121. The radiating element 121 may be arranged as follows: Figure 2 It may be disposed in a manner exposed to the upper surface 131 of the dielectric substrate 130 as in the example of FIG. 1 , or may be disposed near the upper surface 131 of the inner layer of the dielectric substrate 130 .

[0045] The RFIC 110 is mounted on the lower surface 132 of the dielectric substrate 130 via solder bumps 150. Alternatively, the RFIC 110 and the dielectric substrate 130 may be connected using a multi-pole connector instead of soldering.

[0046] Each radiating element 121 receives a high-frequency signal from the RFIC 110 via feed lines 141 and 142. Feed line 141 extends from the RFIC 110 through the ground electrode GND and connects to a feed point SP1 from the bottom surface of the radiating element 121. Feed line 142 extends from the RFIC 110 through the ground electrode GND and connects to a feed point SP2 from the bottom surface of the radiating element 121.

[0047] In each radiating element 121, a feed point SP1 is formed at a position offset from the center of the radiating element 121 in the positive direction of the Y axis. Supplying a high-frequency signal to feed point SP1 causes radio waves polarized in the Y axis to be radiated from the radiating element 121. Furthermore, a feed point SP2 is formed at a position offset from the center of the radiating element 121 in the negative direction of the X axis. Supplying a high-frequency signal to feed point SP2 causes radio waves polarized in the X axis to be radiated from the radiating element 121. In other words, antenna module 100 is a dual-polarization antenna module capable of radiating radio waves in two different polarization directions.

[0048] The antenna module 100 is arranged inside the housing 50 so that the distance GP between the dielectric substrate 130 and the housing 50 becomes a predetermined distance. The housing 50 is provided with a pressing member (rib) 51 protruding from the inner surface of the housing 50. The tip portion of the rib 51 is formed into a spindle shape or a spherical shape. When viewed from above from the normal direction of the dielectric substrate 130, the tip of the rib 51 contacts the dielectric substrate 130 in a region RG1 near the center of the radiating element 121. The region RG1 is a region of the radiating element 121 that is closer to the center than the feeding points SP1 and SP2. Figure 2 In the top view of (B), the dotted line portion indicates the region RG1. In addition, the region RG1 may be as follows Figure 2As shown in (B), the area inside the quadrilateral with the feed points SP1 and SP2 as vertices may be the area inside the circle with the distance from the center of the radiating element 121 to the feed point as the radius. Furthermore, the contact area between the rib 51 and the dielectric substrate 130 may slightly extend beyond the area RG1.

[0049] The housing 50 of the communication device 10 may deform significantly due to external forces. This deformation may change the distance GP between the housing 50 and the dielectric substrate 130, causing a change in the dielectric constant in the direction of radio wave radiation. This change in dielectric constant may cause the resonant frequency of the radiating element to change, potentially preventing the desired antenna characteristics from being achieved.

[0050] In the communication device 10 of this embodiment, the ribs 51 formed on the housing 50 can suppress variations in the distance GP between the dielectric substrate 130 and the housing 50, thereby preventing degradation of antenna characteristics. Furthermore, since the ribs 51 press the radiating element 121, it is also possible to suppress detachment of the radiating element 121 from the dielectric substrate 130.

[0051] Figure 3 5 is a diagram for explaining the influence of the configuration of the rib 51 on the reflection loss of the antenna module. Figure 3 In the figure, a one-dimensional array antenna module 100A (top) is shown, in which four radiating elements 121A to 121D are arranged in a row, and the reflection loss caused by the presence or absence of ribs 51 and the difference in the pressing position of the ribs 51 are compared (bottom). In the antenna module 100A, the sides of each roughly square radiating element 121 are arranged to be tilted 45° relative to the X-axis and the Y-axis, and the two polarization directions are also tilted 45° relative to the X-axis and the Y-axis. In addition, Figure 3 This is an example of simulation results when the target frequency band is the 39 GHz band.

[0052] exist Figure 3 The middle portion of FIG shows variations in the pressing position of rib 51 (comparative examples). Comparative Example 1 shows an example in which no rib 51 is provided. Comparative Example 2 shows an example in which rib 51 is provided so as to press radiating element 121 in region RG2 along the Y axis. Comparative Example 3 shows an example in which rib 51 is provided so as to press radiating element 121 in a cross-shaped region RG3 passing through the center of radiating element 121. Comparative Example 4 shows an example in which rib 51 is provided so as to press radiating element 121 in region RG4 on the outer periphery of radiating element 121.

[0053] exist Figure 3In the graph showing the reflection loss at the bottom of the graph, the solid line LN10 represents the case of the present embodiment, and the dotted line LN11 represents the case of the comparative example 1. In addition, the single-dot chain line LN12, the double-dot chain line LN13, and the single-dot chain line LN14 represent comparative examples 2 to 4, respectively. Figure 3 In the figures, the change in the frequency of the minimum value of the return loss in the present embodiment and other comparative examples 2 to 4 is compared with that in the comparative example 1 in which no rib is provided as a reference.

[0054] Reference Figure 3 In Comparative Example 1, which lacks ribs, the minimum values of the return loss occur at resonant frequencies f1 and f2. In this embodiment, the minimum values also occur at approximately the same frequencies. On the other hand, in Comparative Examples 2 to 4, the minimum values corresponding to resonant frequencies f1 and f2 shift toward lower frequencies. This indicates that the impedance changes due to the electric field strength of radiating element 121, resulting in a shift in the resonant frequency.

[0055] By making the rib 51 contact the radiating element 121 while avoiding the end portion of the radiating element 121 where the electric field intensity increases as in the present embodiment, the influence of the rib 51 on the antenna characteristics can be minimized.

[0056] Next, use Figure 4 and Figure 5 , indicating that Figure 3 In the communication device of the antenna module 100A having four radiating elements 121A to 121D, the influence on directivity when the number of ribs 51 pressing the radiating element 121 is changed is shown.

[0057] Figure 4 (A) is a cross-sectional view of a communication device 10X as a comparative example in which the rib 51 is not formed. Figure 4 (B) is a cross-sectional view of a communication device 10A in which the rib 51 is formed by pressing the radiation elements 121A and 121D at both ends. Figure 4 (C) is a cross-sectional view of the communication device 10B in which the rib 51 is formed so as to press all four radiating elements 121A to 121D.

[0058] Figure 5 : is a graph showing the peak gain when the normal direction of the radiating element 121 (Z-axis direction, i.e., 0° direction) is the radiation direction. Figure 5 The horizontal axis shows the angle from the Z-axis direction to the X-axis direction, and the vertical axis shows the peak gain. Figure 5 In FIG. 1 , the peak gain of the communication device 10B is represented by a solid line LN20, the peak gain of the communication device 10A is represented by a dotted line LN21, and the peak gain of the communication device 10X of the comparative example is represented by a dashed line LN22. Figure 5 , which are also simulation results when the target frequency band is the 39 GHz band.

[0059] Reference Figure 5 ,exist Figure 4 Of the three communication devices shown, communication device 10B (solid line LN20) has the highest peak gain in the radiation direction. Furthermore, as the angle from the radiation direction increases, the peak gain of communication device 10B decreases compared to the peak gains of the other communication devices. This demonstrates that the placement of ribs 51 corresponding to each radiating element 121 creates a "lens effect" that concentrates energy in the radiation direction.

[0060] Communication device 10A (dashed line LN21), which has ribs 51 formed on both end radiating elements 121A and 121D, exhibits characteristics intermediate between communication device 10B and comparative example communication device 10X. Thus, the lens effect of gain tends to increase as the number of radiating electrodes provided with ribs 51 increases.

[0061] As described above, in a communication device, by arranging the ribs formed on the housing so that they contact the dielectric substrate at the center portion where the electric field strength of the radiating element is weak, it is possible to suppress the effect on impedance and minimize deformation of the housing. This prevents degradation of antenna characteristics while maintaining a constant distance between the housing and the radiating element.

[0062] Furthermore, in an array antenna in which a plurality of radiating elements are arranged in an array, gain characteristics can be improved by arranging ribs for a larger number of radiating elements.

[0063] Furthermore, while the above description describes a structure in which ribs are disposed between the housing of the communication device body and the antenna module, it is also possible that, if the antenna module is covered by a box or protective cover within the housing, ribs are disposed between the box or cover and the antenna module. Furthermore, the terms "housing," "box," and "cover" described above correspond to the "covering member" in this disclosure.

[0064] [Modification]

[0065] In the following description, variations of the shape of the dielectric substrate forming the radiating element and the arrangement of the ribs will be described.

[0066] (Variation 1)

[0067] Figure 6 : is a cross-sectional view of a communication device 10C according to Modification 1. Figure 6 In the antenna module 100C described above, Figure 2 The dielectric substrate 130 in the antenna module 100 described in the previous section is replaced with a dielectric substrate 130C. Figure 6 and the following Figures 7 to 15In the process, do not repeat Figure 2 Description of repeated elements. In addition, Figures 6 to 15 In the figure, the RFIC 110, the ground electrode GND, and the feeder wirings 141 and 142 are omitted.

[0068] Reference Figure 6 In the antenna module 100C of the first modification, a recess 135 is formed in the portion of the dielectric substrate 130C facing the rib 51 of the housing 50, and the radiating element 121 is arranged at the bottom of the recess 135. Furthermore, the rib 51 formed on the housing 50 contacts the radiating element 121 inside the recess 135. Figure 2 Similarly, the rib 51 is located in a region ( Figure 2 The region RG1) is in contact with the radiation element 121.

[0069] This structure allows the portion of dielectric substrate 130C surrounding recess 135 to be used as an area for arranging wiring, filters, etc., thereby increasing the degree of freedom in layout within the dielectric substrate. Furthermore, since rib 51 of housing 50 enters recess 135, positional deviation between the antenna module and housing 50 can be suppressed.

[0070] (Variation 2)

[0071] Figure 7 : is a cross-sectional view of a communication device 10D according to Modification 2. Figure 7 In the antenna module 100D described above, Figure 2 The dielectric substrate 130 in the communication device 10 described in the previous section is replaced with a dielectric substrate 130D.

[0072] Reference Figure 7 In antenna module 100D according to Modification 2, a recess 136 is formed in the portion of dielectric substrate 130D facing rib 51 of housing 50, and radiating element 121 is disposed at the bottom of recess 136. This improves the degree of freedom in layout within the dielectric substrate, similar to Modification 1.

[0073] Furthermore, the surface of recess 136 facing housing 50 is formed into a spherical shape centered on the center of radiating element 121, and the radius of curvature of the spherical surface of recess 136 is larger than the radius of curvature of the tip of rib 51. This shape makes it easier for the tip of rib 51 to be located in the center of recess 136, making it easier to position rib 51 and radiating element 121.

[0074] (Variation 3)

[0075] Figure 8 : is a cross-sectional view of a communication device 10E according to Modification 3. Figure 8In the antenna module 100E described, Figure 2 The dielectric substrate 130 in the communication device 10 described in the previous section is replaced with a dielectric substrate 130E.

[0076] Reference Figure 8 In the antenna module 100E of the third modification, a protrusion 137 is formed on the portion of the dielectric substrate 130E that faces the rib 51 of the housing 50, and the radiating element 121 is arranged on the upper surface of the protrusion 137. Furthermore, the rib 51 formed on the housing 50 is in contact with the radiating element 121 on the protrusion 137.

[0077] Although Figure 8 Omitted in the figure, but there is a dielectric substrate 130E such as Figure 2 Since the RFIC 110 includes a power amplifier and a low noise amplifier, it may generate heat when transmitting and receiving radio waves. In the communication device 10E of the third modification, the distance between the housing 50 and the dielectric substrate 130E except for the protrusion 137 where the radiating element 121 is arranged is greater than Figure 2 Since the interval between the dielectric substrates 130E and 130E is large, the cooling effect of the dielectric substrate 130E can be improved.

[0078] In addition, if Figure 2 Since the amount of dielectric in the dielectric substrate is reduced compared to the dielectric substrate 130, the effective dielectric constant can be reduced. As a result, the bandwidth of the radiated radio waves can be expanded.

[0079] (Variation 4)

[0080] Figure 9 : is a cross-sectional view of a communication device 10F according to Modification 4. Figure 9 In the communication device 10F described above, Figure 2 The space between dielectric substrate 130 and housing 50 in communication device 10 described above, that is, the area around ribs 51, is filled with resin layer 160. This structure can further reduce the variation in the distance between housing 50 and dielectric substrate 130.

[0081] In addition, if Figure 3 As shown, when the end of the radiating element 121 is supported by a dielectric, the antenna characteristics are likely to be affected. Therefore, the resin layer 160 is preferably made of a material having a lower dielectric constant than the ribs 51 and the dielectric substrate 130 .

[0082] (Variation 5)

[0083] Figure 10This is a cross-sectional view of a communication device 10F1 according to Modification 5. In the communication device 10F according to Modification 4 described above, after the housing 50 is placed on the dielectric substrate 130, the space between the dielectric substrate 130 and the housing 50 is partially filled with a resin layer 160. Meanwhile, the communication device 10F1 according to Modification 5 includes an intermediate layer 165 having an opening 166 formed in a portion corresponding to the radiating element 121. The housing 50 is placed on the dielectric substrate 130 having the intermediate layer 165 formed thereon. Intermediate layer 165 is, for example, a resist serving as a protective film.

[0084] The opening 166 of the intermediate layer 165 is formed to a size corresponding to the outer shape of the rib 51 of the housing 50, so that the rib 51 can enter the opening 166. By setting the size of the opening 166 to be approximately the same as the size of the rib 51, it is possible to suppress movement of the rib 51 within the opening 166. Therefore, it is possible to suppress positional deviation of the housing 50 disposed on the radiating element 121 in the XY plane.

[0085] (Variation 6)

[0086] Figure 11 : is a cross-sectional view of a communication device 10G according to a sixth modification. Figure 11 In the communication device 10G described above, the ribs 138 are formed on the antenna module 100G instead of the ribs 51 formed on the housing 50 .

[0087] The rib 138 is formed in a columnar shape and is located in a region of the radiating element 121 closer to the center than the feed point when viewed from above in the normal direction of the dielectric substrate 130G. The rib 138 may be formed as part of the dielectric substrate 130G or by attaching a member separate from the dielectric substrate 130G to the dielectric substrate 130G.

[0088] Even in a structure where the ribs are formed on the dielectric substrate side, since the ribs are formed in the central portion of the radiating element where the electric field strength is weak, it is possible to suppress degradation of antenna characteristics and maintain a constant distance between the housing and the radiating element.

[0089] (Variations 7 to 9)

[0090] Modifications 7 to 9 describe variations in rib arrangement when ribs are formed on some of the radiating elements in an antenna module having four or more radiating elements.

[0091] Figure 12 and Figure 13 The figures show a communication device 10H (Modification 7) and a communication device 10I (Modification 8) each including an antenna module 100H or 100I in which four radiating elements 121A to 121D are arranged one-dimensionally.

[0092] exist Figure 12 In the communication device 10H, ribs 51 are formed corresponding to the radiating elements 121A and 121D at both ends, but no ribs 51 are formed for the inner radiating elements 121B and 121C. Figure 13 In the communication device 10I, ribs 51 are formed corresponding to the inner radiating elements 121B and 121C, but ribs 51 are not formed for the radiating elements 121A and 121D at both ends.

[0093] Considering the mechanical strength of the housing 50, the communication device 10H, which supports the housing 50 at both ends, is preferred over the communication device 10I because it can minimize deformation of the housing 50. In the communication device 10I, deformation of the housing 50 is likely to be greater near the radiating elements 121A and 121D at both ends.

[0094] On the other hand, Figure 5 As described above, the formation of ribs 51 increases peak gain due to the lens effect. Therefore, focusing on gain characteristics, when ribs 51 are formed on the radiating elements 121B and 121C near the center of the array antenna, as in communication device 10I, the lens effect becomes more pronounced. Consequently, the peak gain of communication device 10I is improved compared to communication device 10H.

[0095] Figure 14 This figure shows a communication device 10J (Modification 9) having an antenna module 100J with five radiating elements 121A to 121E arranged one-dimensionally. In communication device 10J, ribs 51 are formed corresponding to radiating elements 121A and 121E at both ends and radiating element 121C in the center, while ribs 51 are not formed for radiating elements 121B and 121D. In other words, ribs 51 are formed for every other radiating element.

[0096] This structure can maintain the mechanical strength of the housing while improving the gain characteristics near the center. In addition, it can ensure a space between the antenna module and the housing, thereby also expecting a heat dissipation effect.

[0097] Furthermore, when more radiating elements are arranged in the antenna module, for example, ribs may be formed for every third radiating element. However, to ensure symmetry of the radio waves radiated from the entire array antenna, it is preferable to arrange the ribs symmetrically for the radiating elements.

[0098] As described above, in an antenna module in which a plurality of radiating elements are arranged in an array, the number and formation positions of the ribs can be determined in consideration of mechanical strength, gain characteristics, heat dissipation characteristics, and the like.

[0099] (Variation 10)

[0100] Figure 15 : is a cross-sectional view of a communication device 10K according to Modification 10. Figure 15 In the antenna module 100K of the communication device 10K described above, radiating elements 121 and 122 of different sizes are arranged adjacent to each other. In other words, the antenna module 100K is a dual-band antenna module capable of radiating radio waves of different frequency bands.

[0101] The size of the radiation element 122 is larger than that of the radiation element 121. Therefore, the frequency band (second frequency band) of the radio waves radiated from the radiation element 122 is lower than the frequency band (first frequency band) of the radio waves radiated from the radiation element 121.

[0102] Furthermore, in the communication device 10K, ribs 51 are formed on the high-frequency radiating element 121, but no ribs 51 are formed on the low-frequency radiating element 122. It is generally known that regarding the lens effect, if the spot diameter before entering the lens is set to D, the spot diameter after passing through the lens is set to d, the spot focal length is set to f, and the wavelength of the radio wave is set to λ, then the following equation (1) holds.

[0103] d=4·f·λ / (π·D)…(1)

[0104] That is, the shorter the wavelength of the radio wave, the smaller the spot diameter d after passing through the lens, resulting in a significant lens effect. Therefore, in a dual-band antenna module such as the antenna module 100K, where thinning ribs 51 are required for heat dissipation, forming ribs 51 on the radiating element on the relatively high-frequency side can suppress a decrease in gain characteristics and improve heat dissipation.

[0105] The “radiating element 121 ” and the “radiating element 122 ” in this embodiment correspond to the “first radiating element” and the “second radiating element” in this disclosure, respectively.

[0106] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The scope of the present invention is indicated by the claims rather than the description of the embodiments above, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0107] Description of Reference Numerals

[0108] 10, 10A~10K, 10F1, 10X: communication device; 50: housing; 51, 138: rib; 100, 100A, 100C~100E, 100G~100K: antenna module; 110: RFIC; 111A~111D, 113A~113D, 117: switch; 112AR~112DR: low noise amplifier; 112AT~112DT: power amplifier; 114A~114D: attenuator; 115A~115D: phase shifter; 11 6: Signal combiner / demultiplexer; 118: Mixer; 119: Amplifier circuit; 120: Antenna device; 121, 121A to 121E, 122: Radiating element; 130, 130C to 130E, 130G: Dielectric substrate; 135, 136: Recess; 137: Protrusion; 141, 142: Feed wiring; 150: Solder bump; 160: Resin layer; 165: Intermediate layer; 166: Opening; 200: BBIC; GND: Ground electrode; SP1, SP2: Feed point.

Claims

1. A communication device comprising: dielectric substrate; a first radiating element in a flat plate shape, formed on the dielectric substrate; a covering member covering the dielectric substrate; and a pressing member arranged to be in contact with the cover member and the dielectric substrate, in, A feeding point to which a high-frequency signal from a feeding circuit is supplied is formed on the first radiating element. When viewed from above in the normal direction of the dielectric substrate, the pressing member contacts the dielectric substrate in a region of the first radiating element closer to the center than the feeding point. The pressing member is positioned to protrude from an inner surface of the covering member toward the first radiation element.

2. The communication device according to claim 1, wherein The pressing member is formed as a part of the covering member.

3. The communication device according to claim 1 or 2, wherein: A recess is formed on a surface of the dielectric substrate facing the cover member. The first radiation element is disposed at the bottom of the recess.

4. The communication device according to claim 1 or 2, wherein: A convex portion is formed on a surface of the dielectric substrate facing the cover member. The first radiation element is disposed on or near the upper surface of the convex portion.

5. The communication device according to claim 1 or 2, wherein: further comprising a resin layer that is filled around the pressing member between the covering member and the dielectric substrate, The dielectric constant of the resin layer is lower than the dielectric constant of the dielectric substrate and the dielectric constant of the pressing member. The communication device according to claim 1 or 2, wherein: further comprising a second flat-plate radiating element, the second radiating element being arranged adjacent to the first radiating element in the dielectric substrate; radiating radio waves of a first frequency band from the first radiating element, The second radiating element radiates radio waves in a second frequency band lower than the first frequency band. The pressing member is arranged corresponding to the first radiating element, but is not arranged corresponding to the second radiating element.

7. The communication device according to claim 1 or 2, wherein: When viewed in plan from a normal direction of the dielectric substrate, the pressing member is in contact with the dielectric substrate only in the region.

8. A communication device comprising: dielectric substrate; a plurality of flat-plate-shaped radiating elements, the plurality of radiating elements being arranged in a row on the dielectric substrate; a covering member covering the dielectric substrate; as well as a pressing member arranged to be in contact with the cover member and the dielectric substrate, Each of the plurality of radiating elements has a feeding point to which a high-frequency signal from a feeding circuit is supplied. The pressing member is arranged corresponding to at least a portion of the plurality of radiating elements. When viewed from above in the normal direction of the dielectric substrate, the pressing member contacts the corresponding radiating element at a region closer to the center of the feeding point than the feeding point. The pressing member is positioned to protrude from the inner surface of the covering member toward the corresponding radiation elements.

9. The communication device according to claim 8, wherein: The pressing members are arranged corresponding to the radiating elements arranged at both ends among the plurality of radiating elements.

10. The communication device according to claim 8 or 9, wherein: The number of the plurality of radiation elements is more than 3, The pressing member is arranged corresponding to the radiating element arranged in the center among the plurality of radiating elements.

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