Onboard power supply equipment and vehicles

Abstract

This application provides an on-board power supply device and a vehicle. The on-board power supply device includes a power conversion circuit and an upper PCB board, a lower PCB board, and a heat sink, which are sequentially stacked and fixed to a base shell. This design ensures high stability of the heat sink, upper PCB board, lower PCB board, and base shell, resulting in a stronger overall structure of the on-board power supply device. The upper and lower PCB boards support multiple power switching transistors of the power conversion circuit, allowing for a more flexible distribution of the power conversion circuit and reducing the horizontal area of ​​the on-board power supply device. The base shell supports the upper PCB board, lower PCB board, heat sink, and multiple transformers, ensuring high stability of the heat sink, upper PCB board, lower PCB board, and multiple transformers, further enhancing the overall structural strength of the on-board power supply device.

Description

Technical Field

[0001] This application relates to the field of vehicle power supply technology, and in particular to an on-board power supply device and a vehicle. Background Technology

[0002] The on-board power supply unit is a crucial component of electric vehicles. It converts electrical energy from an external power source into direct current (DC) to power the high-voltage battery pack and low-voltage electrical equipment. The power conversion circuit of the on-board power supply unit comprises numerous components used to achieve power conversion. With the increasing demands for autonomous driving in electric vehicles and the use of various low-voltage electrical devices within the vehicle, the power required for low-voltage supply is constantly rising. This has led to a rapid increase in the size of the power conversion circuit in the on-board power supply unit, impacting the overall vehicle layout and interior space. Furthermore, the power conversion circuit requires a cooling system to dissipate heat, and the sheer number of components directly affects the structural strength of the on-board power supply unit's installation. Summary of the Invention

[0003] This application provides an on-board power supply device and a vehicle.

[0004] In a first aspect, embodiments of this application provide an on-board power supply device, which includes a power conversion circuit, an upper PCB board, a lower PCB board, a base shell, and a heat sink. The lower PCB board, the upper PCB board, and the heat sink are sequentially stacked and fixed to the base shell. The power conversion circuit includes multiple power switching transistors and multiple transformers. The upper and lower PCB boards support the multiple power switching transistors. The base shell supports the upper PCB board, the lower PCB board, the heat sink, and the multiple transformers.

[0005] The sequential stacking of the heat sink, upper PCB board, and lower PCB board reduces the internal space occupied by the vehicle power supply unit. All three are fixed to and supported by the base shell, ensuring high stability and overall structural strength. When external forces are applied to the vehicle power supply unit, the lower PCB board, upper PCB board, heat sink, power conversion circuit, and base shell will not easily shift relative to each other, promoting stable operation of the vehicle power supply unit.

[0006] In this design, both the upper and lower PCB boards are used to carry a portion of the power switching transistors, so that the power conversion circuit is distributed on the two stacked PCB boards. Compared with distributing the power conversion circuit on a single PCB board, this implementation method makes the distribution of the power conversion circuit more flexible and can reduce the area of ​​the vehicle power supply device on the horizontal plane.

[0007] The lower PCB board, upper PCB board, and heat sink are stacked in sequence, with the heat sink located on the side of the upper PCB board away from the bottom shell. This allows the heat sink to cool the heat-generating components on the upper PCB board, enabling the power conversion circuit to operate within a suitable temperature range.

[0008] The power switching transistors are carried by the upper and lower PCB boards, and the transformer is supported by the bottom shell. This allows the upper, lower, and bottom PCB boards to all carry a part of the power conversion circuit. The components of the power conversion circuit are distributed in different positions inside the vehicle power supply device. This optimizes the layout of the power conversion circuit and improves the space utilization of the vehicle power supply device, which is conducive to the miniaturization design of the vehicle power supply device.

[0009] In one possible implementation, the vehicle-mounted power supply device includes a cover plate that, when combined with the bottom shell, forms a receiving cavity for housing the lower PCB board, the upper PCB board, the heat sink, and the plurality of transformers. The lower PCB board, the upper PCB board, the heat sink, and the cover plate are stacked sequentially along the height direction of the vehicle-mounted power supply device.

[0010] In this implementation, the housing cavity protects the internal lower PCB board, upper PCB board, heat sink, and multiple transformers from external environmental influences. In the height direction of the vehicle power supply unit, the upper PCB board is positioned closer to the cover plate than the lower PCB board. The heat sink is located between the cover plate and the upper PCB board, and it is used to cool the power switching transistors on the upper PCB board. This implementation, by stacking the lower PCB board, upper PCB board, heat sink, and cover plate sequentially, allows for a more compact arrangement of these components, which helps to reduce the size of the vehicle power supply unit.

[0011] In one possible implementation, the power conversion circuit includes an AC / DC conversion circuit, a low-voltage DC conversion circuit, and a high-voltage DC conversion circuit. The AC / DC conversion circuit receives AC power and supplies power to at least one of the high-voltage DC conversion circuit or the low-voltage DC conversion circuit. The low-voltage DC conversion circuit receives the power supplied from at least one of the AC / DC conversion circuit or the high-voltage DC conversion circuit and outputs a first DC power. The high-voltage DC conversion circuit receives the power supplied from the AC / DC conversion circuit and outputs a second DC power, the voltage of which is higher than that of the first DC power.

[0012] In this implementation, an external power source inputs AC power to the power conversion circuit. The AC power is then transmitted to at least one of a low-voltage DC conversion circuit and a high-voltage DC conversion circuit after passing through an AC / DC conversion circuit. The high-voltage DC conversion circuit receives the AC power and converts it into a second type of DC power, which is then used to power the battery. Alternatively, the high-voltage DC conversion circuit converts the AC power into the second type of DC power and uses it to power the low-voltage DC conversion circuit. The low-voltage DC conversion circuit receives the AC power and converts it into a first type of DC power, which is then used to power a first type of load. Alternatively, the low-voltage DC conversion circuit receives the second type of DC power, converts it back to the first type of DC power, and uses it to power a first type of load. The voltage of the second type of DC power is higher than that of the first type of DC power. The AC power supplied by the external power source undergoes AC / DC conversion and voltage changes after passing through the power conversion circuit, enabling the vehicle power supply device to power different types of vehicle loads and improving its adaptability.

[0013] In one possible implementation, the low-voltage DC-DC converter circuit includes a low-voltage transformer, a primary circuit, and a secondary circuit. The primary circuit receives power from at least one of the AC-DC converter circuit or the high-voltage DC-DC converter circuit, and the secondary circuit outputs a first DC current. The upper PCB board carries multiple power switches of the primary circuit in the low-voltage DC-DC converter circuit. The lower PCB board carries multiple power switches of the secondary circuit in the low-voltage DC-DC converter circuit. The bottom housing secures the low-voltage transformer of the low-voltage DC-DC converter circuit.

[0014] In this implementation, the upper PCB board and the lower PCB board are used to carry multiple power switching transistors of the primary circuit and the secondary circuit, respectively, so that the low-voltage DC-DC conversion circuit is distributed on the upper PCB board and the lower PCB board. Compared with using a single PCB board to carry all the power switching transistors of the low-voltage DC-DC conversion circuit, the distribution of components is more flexible.

[0015] In this implementation, the low-voltage transformer is fixedly connected to both the upper and lower PCB boards, allowing other components electrically connected to the low-voltage transformer to be installed on the upper and lower PCB boards respectively. This avoids all components in the power conversion circuit being concentrated on either the upper or lower PCB board, effectively reducing the mounting area of ​​the upper and lower PCB boards and facilitating the miniaturization of the vehicle power supply device.

[0016] In this implementation, the low-voltage transformer is also fixed to the bottom shell, so that the low-voltage transformer, the lower PCB board, the upper PCB board, and the heat sink are all fixed to the bottom shell, thereby making the overall structural strength of these components in the vehicle power supply device stronger.

[0017] In one possible implementation, the bottom shell includes a plurality of first protrusions and two shielding protrusions. The plurality of first protrusions are distributed in the bottom shell region between the two shielding protrusions, and the height of the plurality of first protrusions is less than the height of the two shielding protrusions along the height direction of the vehicle power supply device. The plurality of first protrusions are used to fix the lower PCB board. The two shielding protrusions are used to fix the upper PCB board. The two shielding protrusions and the upper PCB board constitute a shielding area for the lower PCB board, which is used to reduce electrical interference received by the lower PCB board.

[0018] In this implementation, the lower PCB board is located in the shielding area between two shielding protrusions. The lower PCB board, with its lower height, is fixed to the bottom shell by the lower first protrusion, while the upper PCB board, with its higher angle, is fixed by the higher shielding protrusion. This allows the upper and lower PCB boards to be stacked and fixed to the bottom shell sequentially, thereby improving the overall structural strength of the vehicle power supply device and reducing its size. Furthermore, the shielding protrusions can reuse the upper PCB board to form the shielding area of ​​the lower PCB board, which helps ensure the shielding effect of the shielding protrusions on the lower PCB board, minimizing electrical interference between the lower PCB board and devices located on the other side of the shielding protrusions. In this implementation, the shielding protrusions simultaneously serve as support, fixation, and shielding mechanisms.

[0019] In one possible implementation, the bottom shell includes a bottom plate, a front sidewall, a rear sidewall, a left sidewall, and a right sidewall. The front sidewall and the rear sidewall are arranged opposite to each other, and the left sidewall and the right sidewall are arranged opposite to each other. The bottom plate, the front sidewall, the rear sidewall, the left sidewall, and the right sidewall form a groove structure. Along the height direction of the vehicle-mounted power supply device, the height of any one of the front sidewall, the rear sidewall, the left sidewall, and the right sidewall is greater than the height of the upper PCB board.

[0020] In this implementation, the height of the upper PCB board refers to the distance between the upper PCB board and the bottom board. The height of any side wall in the bottom shell is greater than the height of the upper PCB board, so that the upper PCB board is located inside the bottom shell, and there is space above the upper PCB board to accommodate the heat sink or multiple power switching transistors on the upper surface of the upper PCB board.

[0021] In one possible implementation, the lower PCB board and the plurality of transformers are laid flat on top of the base plate, the upper PCB board is stacked on top of the lower PCB board and the plurality of transformers, the heat sink is stacked on top of the upper PCB board, and the orthographic projection of the lower PCB board on the base plate and the orthographic projection of the heat sink on the base plate are misaligned.

[0022] In this implementation, the lower PCB board and multiple transformers being laid flat on top of the base plate means that the orthographic projections of the lower PCB board and multiple transformers on the base plate do not overlap. For example, the lower PCB board and multiple transformers can be arranged along the left-right or front-back direction of the vehicle power supply device. This flat arrangement allows for full utilization of the space above the base plate, resulting in a more compact distribution of the lower PCB board and multiple transformers within the base shell, which is beneficial for miniaturizing the vehicle power supply device.

[0023] In this implementation, the upper PCB board is stacked on top of the lower PCB board and multiple transformers, so that the upper PCB board covers the lower PCB board and multiple transformers, and it is convenient to electrically connect the transformers to the lower surface of the upper PCB board by plugging them in.

[0024] In this implementation, since multiple transformers are laid flat with the lower PCB board, the orthographic projection of the lower PCB board on the base plate and the orthographic projection of the heat sink on the base plate are misaligned. This allows the heat sink to be stacked more with the multiple transformers in the height direction, which is beneficial to improving the heat dissipation effect of the heat sink on the multiple transformers, thereby improving the heat dissipation effect of the vehicle power supply device and increasing the power of the vehicle power supply device.

[0025] In one possible implementation, the front sidewall includes multiple electrical interfaces, and the rear sidewall includes cooling channel interfaces. The lower PCB board is located closer to the front sidewall than the heatsink, and both the lower and upper PCB boards are used to electrically connect to at least one of the multiple electrical interfaces. The heatsink is located closer to the rear sidewall than the lower PCB board, and the heatsink is used to connect to the cooling channel interfaces.

[0026] In this implementation, multiple electrical interfaces are located on the front side wall, and the cooling channel interface is located on the rear side wall. This isolates the electrical interfaces and the cooling channel interface in physical space, preventing coolant leakage from the cooling channel interface from affecting the electrical performance of the electrical interfaces and making the vehicle power supply device safer.

[0027] In this implementation, since the front sidewall is equipped with an electrical interface, the secondary circuit of the low-voltage DC-DC converter is located on the lower PCB board. The lower PCB board is set close to the front sidewall along the front-rear direction of the vehicle power supply device, which facilitates the transmission of the first DC power output from the secondary circuit of the low-voltage DC-DC converter to the first type of load through the electrical interface. This shortens the distance between the output end of the secondary circuit of the low-voltage DC-DC converter and the electrical interface, making the layout of the vehicle power supply device more reasonable.

[0028] In this implementation, because the rear sidewall has a cooling channel interface, the heatsink is positioned closer to the rear sidewall than the lower PCB board. This results in a shorter connection distance between the heatsink and the cooling channel interface, which is more conducive to ensuring the seal between the heatsink and the cooling channel interface. Furthermore, the lower PCB board is further away from the cooling channel interface on the rear sidewall, preventing damage to the lower PCB board from coolant leakage from the cooling channel.

[0029] In one possible implementation, the front sidewall includes a first DC power interface and a control signal interface. The power conversion circuit outputs a first DC power through the first DC power interface and receives a control signal through the control signal interface. The lower surface of the upper PCB board includes a control signal connector for electrically connecting the control signal interface and the upper PCB board. The upper surface of the lower PCB board includes at least a portion of a low-voltage filter circuit for electrically connecting the first DC power interface and the lower PCB board.

[0030] In this implementation, the control signal connector is placed on the lower surface of the upper PCB board, and part of the low-voltage filter circuit is placed on the upper surface of the lower PCB board, which can make full use of the space between the upper and lower PCB boards.

[0031] In one possible implementation, a shielding cover is provided between the upper PCB board and the lower PCB board. The shielding cover, combined with the lower surface of the upper PCB board, forms a control signal shielding cavity, which accommodates a control signal connector. The shielding cover, combined with the upper surface of the lower PCB board, forms a low-voltage filter shielding cavity, which accommodates at least a portion of the low-voltage filter circuitry.

[0032] In this implementation, the space between the upper and lower PCB boards is used to place a shielding cover, making full use of the space between the two PCB boards. Furthermore, the shielding cover and the two PCB boards can form a shielding wall to shield the electrical components on both PCB boards. The shielding cover isolates the control signal connector and at least part of the low-voltage filter circuitry, preventing interference from the low-voltage filter circuitry to the signals transmitted in the control signal connector and improving signal transmission quality.

[0033] In one possible implementation, the radiator includes an upper cooling channel, the bottom shell includes a lower cooling channel, and the rear sidewall includes a cooling channel interface. The cooling channel interface is used to connect an external cooling system with the lower cooling channel and the upper cooling channel. The external cooling system is used to exchange cooling medium with the lower cooling channel and the upper cooling channel through the cooling channel interface.

[0034] In this implementation, the upper cooling channel can be used to cool and dissipate heat from the power switching transistors on the upper PCB board, while the lower cooling channel can cool and dissipate heat from multiple transformers, inductors, capacitors, and other components fixed to the bottom shell. Furthermore, the cooling channels are connected through the cooling channel interface, allowing the coolant to circulate between the two cooling channels, thereby improving the cooling effect uniformity of the vehicle power supply device and enhancing its temperature uniformity.

[0035] In one possible implementation, the cooling channel interface includes two radiator interfaces disposed on the upper surface of the rear sidewall. The two radiator interfaces are respectively used to connect the inlet and outlet of the upper cooling water channel. In this implementation, the radiator interfaces connect the external cooling system and the upper cooling channel, and have a guiding effect on the coolant flow.

[0036] In one possible implementation, the cooling channel interface further includes two external cooling system interfaces, which are located on the side surface of the rear sidewall opposite to the upper PCB board. The two external cooling system interfaces are respectively used to connect the outlet and inlet of the external cooling system. Coolant enters the cooling channel inside the vehicle power supply unit through the external cooling system interfaces.

[0037] In one possible implementation, the cooling channel interface further includes two bottom shell connection ports, which are respectively used to connect the inlet and outlet of the lower cooling water channel. The bottom shell connection ports connect the external cooling system and the lower cooling channel, guiding the coolant flow. The external cooling system interface is connected to both the radiator interface and the bottom shell connection ports. Coolant enters the upper and lower cooling channels through the external cooling system interface, flows through the upper and lower cooling channels, and then exits from the external cooling system interface. In this implementation, the connection between the radiator interface and the bottom shell connection ports connects the upper and lower cooling channels, which helps increase the contact area between the coolant and the vehicle power supply device.

[0038] In one possible implementation, the power conversion circuit includes an AC filter, a PFC capacitor, a PFC inductor, a low-voltage transformer, an LLC transformer, and an HVDC filter. The PFC capacitor, the PFC inductor, and the LLC transformer are arranged adjacent to each other near the rear wall of the vehicle power supply device. The PFC capacitor and the AC filter are arranged adjacent to each other near the right side wall of the vehicle power supply device. The HVDC filter and the LLC transformer are arranged adjacent to each other near the left side wall of the vehicle power supply device.

[0039] In this implementation, the devices in the power conversion circuit are positioned close to at least one side wall of the vehicle power supply device, so that other devices can be placed in the empty areas between the front and right side walls and between the left and right side walls, thereby improving the utilization rate of the internal space of the vehicle power supply device.

[0040] In one possible implementation, the base plate includes a first shielding protrusion, a second shielding protrusion, a third shielding protrusion, and a fourth shielding protrusion. The first and second shielding protrusions constitute a lower PCB board mounting area, which accommodates the lower PCB board. The first shielding protrusion and the right side wall constitute an AC filter mounting area, which accommodates the AC filter. The second shielding protrusion and the left side wall constitute an HVDC filter mounting area, which accommodates the HVDC filter. The third shielding protrusion and the right side wall constitute a PFC capacitor mounting area, which accommodates the PFC capacitor. The fourth shielding protrusion and the rear side wall constitute a PFC inductor mounting area, which accommodates the PFC inductor.

[0041] In this implementation, the first shielding protrusion, the second shielding protrusion, the third shielding protrusion, and the fourth shielding protrusion divide the base plate into multiple mounting areas, including a lower PCB board mounting area, an AC filter mounting area, an HVDC filter mounting area, a PFC capacitor mounting area, and a PFC inductor mounting area. Setting up mounting areas helps to improve the ease of installation of the power conversion circuit, and can also provide a certain degree of protection for the components inside the mounting area. Furthermore, it can shield and isolate the components within the mounting area, thereby improving the electromagnetic compatibility of the vehicle power supply device.

[0042] Secondly, this application provides a vehicle including a first type of load, a battery, and an on-board power supply device as described in any of the above claims. The power conversion circuit outputs a first DC power and a second DC power. The first DC power is used to supply power to the first type of load, and the second DC power is used to supply power to the battery. The voltage of the second DC power is greater than the voltage of the first DC power. The on-board power supply device provided by this application has a smaller size, higher overall structural strength, and better electromagnetic compatibility. When applied to a vehicle, it helps to optimize the overall vehicle layout. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0044] Figure 1 This is a schematic diagram of the structure of a vehicle provided in one embodiment of this application;

[0045] Figure 2 This is a schematic diagram illustrating an application scenario of an on-board power supply device provided in an embodiment of this application.

[0046] Figure 3 An exploded view of an on-board power supply device provided in one embodiment of this application;

[0047] Figure 4 A schematic diagram of the structure of an on-board power supply device provided in one embodiment of this application;

[0048] Figure 5 A schematic diagram of the structure of the upper PCB board and the lower PCB board provided in one embodiment of this application;

[0049] Figure 6 A schematic diagram of the structure of the upper PCB board and the lower PCB board provided in one embodiment of this application;

[0050] Figure 7 A schematic diagram of the structure of the upper PCB board and the lower PCB board provided in one embodiment of this application;

[0051] Figure 8 A schematic diagram illustrating an application scenario of the power conversion circuit provided in one embodiment of this application;

[0052] Figure 9 A schematic diagram of the structure of the upper PCB board, the lower PCB board, and the power conversion circuit provided in one embodiment of this application;

[0053] Figure 10 A schematic diagram of the structure of an on-board power supply device provided in one embodiment of this application;

[0054] Figure 11 A schematic diagram of the structure of the bottom shell and the upper PCB board provided in one embodiment of this application;

[0055] Figure 12 A schematic diagram of the structure of the bottom shell provided in one embodiment of this application;

[0056] Figure 13 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0057] Figure 14 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0058] Figure 15 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0059] Figure 16 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0060] Figure 17 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0061] Figure 18 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0062] Figure 19 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0063] Figure 20 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0064] Figure 21 A schematic diagram of the structure of the base and power conversion circuit provided in one embodiment of this application;

[0065] Figure 22 A schematic diagram of the structure of the base and power conversion circuit provided in one embodiment of this application;

[0066] Figure 23 A schematic diagram of the structure of the upper PCB board, the lower PCB board, and part of the power conversion circuit provided in one embodiment of this application;

[0067] Figure 24 A schematic diagram of the structure of the upper PCB board, the lower PCB board, and part of the power conversion circuit provided in one embodiment of this application;

[0068] Figure 25 A schematic diagram of the structure of the upper PCB board, the lower PCB board, and part of the power conversion circuit provided in one embodiment of this application;

[0069] Figure 26 A schematic diagram of the structure of the upper PCB board, the lower PCB board, and part of the power conversion circuit provided in one embodiment of this application;

[0070] Figure 27 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0071] Figure 28 A schematic diagram of the structure of the lower PCB board and part of the power conversion circuit provided in one embodiment of this application;

[0072] Figure 29 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0073] Figure 30 A schematic diagram of the structure of the bottom shell and electrical interface provided in one embodiment of this application;

[0074] Figure 31 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0075] Figure 32 A schematic diagram of the control signal connector and low-voltage filter circuit in an on-board power supply device provided in one embodiment of this application;

[0076] Figure 33 A schematic diagram of the upper PCB board and part of the power conversion circuit provided in one embodiment of this application;

[0077] Figure 34 A schematic diagram of the upper PCB board and part of the power conversion circuit provided in one embodiment of this application;

[0078] Figure 35 A schematic diagram of the structure of the lower PCB board and part of the power conversion circuit provided in one embodiment of this application;

[0079] Figure 36 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0080] Figure 37 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0081] Figure 38 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0082] Figure 39 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0083] Figure 40 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0084] Figure 41 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0085] Figure 42 A schematic diagram of the structure of the shielding cover provided in one embodiment of this application;

[0086] Figure 43 A schematic diagram of the structure of the shielding cover provided in one embodiment of this application;

[0087] Figure 44 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0088] Figure 45 A schematic diagram of the structure of the first shielding cover provided in an embodiment of this application;

[0089] Figure 46 A schematic diagram of the structure of the second shielding cover provided in one embodiment of this application;

[0090] Figure 47 A schematic diagram of the structure of the shielding cover provided in one embodiment of this application;

[0091] Figure 48 A schematic diagram of the structure of the shielding cover and the bottom shell provided in one embodiment of this application;

[0092] Figure 49 A schematic diagram of the shielding cover and upper PCB board provided in one embodiment of this application;

[0093] Figure 50 A schematic diagram of the shielding cover and the lower PCB board provided in one embodiment of this application;

[0094] Figure 51 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0095] Figure 52 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0096] Figure 53 A schematic diagram of the structure of the signal filtering shield and control signal connector provided in one embodiment of this application;

[0097] Figure 54 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0098] Figure 55 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0099] Figure 56 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0100] Figure 57 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0101] Figure 58 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0102] Figure 59 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0103] Figure 60 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0104] Figure 61 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0105] Figure 62 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0106] Figure 63 A cross-sectional view of an on-board power supply device provided in one embodiment of this application;

[0107] Figure 64 A schematic diagram of the upper PCB board and heat sink provided in one embodiment of this application;

[0108] Figure 65 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0109] Figure 66 A schematic diagram of the upper cooling channel and power switching transistor provided in one embodiment of this application;

[0110] Figure 67 A schematic diagram of the cover plate and upper PCB board provided in one embodiment of this application;

[0111] Figure 68 A schematic diagram of the upper cooling channel provided in one embodiment of this application;

[0112] Figure 69 A schematic diagram of the upper cooling channel provided in one embodiment of this application;

[0113] Figure 70 A schematic diagram of the upper cooling channel provided in one embodiment of this application;

[0114] Figure 71 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0115] Figure 72 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0116] Figure 73 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0117] Figure 74 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0118] Figure 75 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0119] Figure 76 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0120] Figure 77 A partial enlarged view of an on-board power supply device provided in one embodiment of this application;

[0121] Figure 78 A partial enlarged view of an on-board power supply device provided in one embodiment of this application;

[0122] Figure 79 A partial structural schematic diagram of an on-board power supply device provided in one embodiment of this application;

[0123] Figure 80 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0124] Figure 81 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0125] Figure 82 A partial exploded view of an on-board power supply device provided in one embodiment of this application;

[0126] Figure 83 A schematic diagram of the structure of the bottom shell in an embodiment of the vehicle power supply device provided in this application;

[0127] Figure 84 This is a schematic diagram of the structure of a shielding protrusion provided in one embodiment of this application;

[0128] Figure 85 This is a schematic diagram of the structure of a shielding protrusion provided in one embodiment of this application;

[0129] Figure 86 A schematic diagram of the structure of the bottom shell and the upper PCB board provided in one embodiment of this application;

[0130] Figure 87 A schematic diagram of the structure of the base and power conversion circuit provided in one embodiment of this application;

[0131] Figure 88 A schematic diagram of the structure of the bottom shell in an embodiment of the vehicle power supply device provided in this application;

[0132] Figure 89 A schematic diagram of the structure of the third and fourth shielding protrusions provided in one embodiment of this application;

[0133] Figure 90 This is a schematic diagram of the structure of the bottom shell of the vehicle-mounted power supply device provided in one embodiment of this application. Detailed Implementation

[0134] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0135] In this document, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0136] In this article, directional terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", and "outer" are defined relative to the orientation of the structure as shown in the attached drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the structure.

[0137] In this document, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0138] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0139] PCB: Printed Circuit Board, refers to the carrier on which electronic components are electrically connected.

[0140] AC: AC is an abbreviation for Alternating Current, and AC filter refers to the filter in an AC-DC conversion circuit.

[0141] PFC stands for Power Factor Correction. PFC capacitors represent capacitors in AC-DC conversion circuits, and PFC inductors represent inductors in AC-DC conversion circuits.

[0142] HVDC: HVDC generally refers to high-voltage direct current transmission. HVDC filters are filters in high-voltage direct current conversion circuits. HVDC filters can also be called high-voltage direct current filters.

[0143] LVDC: LVDC generally refers to high voltage direct current transmission. LVDC filters are filters in low voltage direct current conversion circuits. LVDC filters can also be called low voltage filters.

[0144] In this article, "high voltage" and "low voltage" refer to the relative magnitude of voltage. "High voltage" means that the voltage of "high voltage" is relatively higher than that of "low voltage," and does not represent specific voltage values.

[0145] Parallelism: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, allowing for situations where the parallelism is not absolute due to factors such as assembly tolerances, design tolerances, and structural flatness.

[0146] Perpendicularity: The perpendicularity defined in this application is not limited to an absolute perpendicular intersection (with an included angle of 90 degrees). It is permissible for non-absolute perpendicular intersections caused by factors such as assembly tolerances, design tolerances, and structural flatness. It is permissible for errors within a small angular range, such as an assembly error range of 80 to 100 degrees, which can all be understood as a perpendicular relationship.

[0147] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a vehicle 1 provided in an embodiment of this application. In one implementation, the vehicle 1 includes a vehicle body 11 and wheels 12. An on-board power supply device 10 is installed on the vehicle body 11. The on-board power supply device 10 is used to provide power to the electrical components in the vehicle 1 and drive the wheels 12 to rotate.

[0148] Vehicle 1 refers to a wheeled vehicle driven or towed by a power unit, used for transporting people or goods on roads, or for special engineering operations. Vehicle 1 includes electric vehicles (EVs), pure electric vehicles (PEVs / BEVs), hybrid electric vehicles (HEVs), range-extended electric vehicles (REEVs), plug-in hybrid electric vehicles (PHEVs), and new energy vehicles. In some embodiments, vehicle 1 includes passenger cars and various special-purpose vehicles with specific functions, such as emergency rescue vehicles, water trucks, sewage suction trucks, cement mixer trucks, crane trucks, and medical vehicles. Vehicle 1 can also be a driving robot. The number of wheels 12 of vehicle 1 can be three or more; this application does not impose any limitation on this.

[0149] Please see Figure 2 , Figure 2 This is a schematic diagram of an application scenario for an on-board power supply device 10 provided in an embodiment of this application. In one implementation, the on-board power supply device 10 is electrically connected to an external power source 13, a vehicle controller 14, a first type of load 15, and a second type of load 16.

[0150] In one embodiment, the external power source 13 may be an AC mains grid, an AC charging station, or an uninterruptible power system (UPS). In this case, the external power source 13 is an AC power source. The vehicle-mounted power supply unit 10 is used to electrically connect to the external power source 13 and receive AC power. Exemplarily, the vehicle-mounted power supply unit 10 converts the received AC power into DC power. The vehicle-mounted power supply unit 10 provides DC power to the first type of load 15 and the second type of load 16.

[0151] In one embodiment, the first type of load 15 is a low-voltage load. Exemplarily, the first type of load 15 includes at least one of a low-voltage battery, headlights, windshield wipers, air conditioning, audio system, USB port, instrument panel, and control display. Exemplarily, the low-voltage battery may also power other first type of loads 15. Exemplarily, the second type of load 16 is a battery, which may also be referred to as a power battery when used to power an electric motor in a power system.

[0152] The vehicle power supply device 10 is electrically connected to the vehicle controller 14, which sends control signals to the vehicle power supply device 10 to optimize the energy distribution of the vehicle.

[0153] Please see Figure 3 and Figure 4 , Figure 3 An exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 4 This is a schematic diagram of the structure of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the on-board power supply device 10 includes a base shell 100, a lower PCB board 300, an upper PCB board 200, a power conversion circuit 600, a heat sink 400, and a cover plate 500 (e.g., Figure 3 (As shown). The bottom shell 100 and the cover plate 500 combine to form a receiving cavity, in which the lower PCB board 300, the upper PCB board 200, the heat sink 400, and the power conversion circuit 600 are located (in combination with) Figure 3 and Figure 4 (As shown). Both the upper PCB board 200 and the lower PCB board 300 contain a portion of the power conversion circuit 600 (e.g., ...). Figure 3 As shown, the power conversion circuit 600 receives AC power and outputs at least two different types of DC power, which is used to power a first-class load and a second-class load. Cooling channels are provided in both the heat sink 400 and the base shell 100, and these channels are used to cool the power conversion circuit 600. For example, the cooling channels can be used to cool components such as the transformer 650, capacitors, and inductors in the power conversion circuit 600. The base shell 100 includes multiple protrusions, some of which support and fix at least one of the upper PCB board 200, the lower PCB board 300, the heat sink 400, and components such as the transformer 650, capacitors, and inductors in the power conversion circuit 600. Some of the protrusions and the sidewalls of the base shell 100 form at least one shielding area, which is used to shield components located within the shielding area from electrical interference with external components.

[0154] The vehicle power supply device 10 provided in this application embodiment, through the arrangement of the structure, positional relationship, and relative interaction of the bottom shell 100, lower PCB board 300, upper PCB board 200, power conversion circuit 600, heat sink 400, and cover plate 500, makes the layout of the lower PCB board 300, upper PCB board 200, power conversion circuit 600, and heat sink 400 more compact, the vehicle power supply device 10 more miniaturized, and makes the fixing between the various components of the vehicle power supply device 10 more reliable, the electrical connection more stable, the electrical interference lower, the cooling effect better, and the power density higher.

[0155] Please continue reading. Figure 3In one embodiment, a lower PCB board 300, an upper PCB board 200, and a heat sink 400 are sequentially stacked and fixed to a base shell 100. The power conversion circuit 600 includes multiple power switching transistors 660 and multiple transformers 650. The upper PCB board 200 and the lower PCB board 300 support the multiple power switching transistors 660. The base shell 100 supports the upper PCB board 200, the lower PCB board 300, the heat sink 400, and the multiple transformers 650.

[0156] In this embodiment, along the height direction X of the vehicle power supply device 10, the lower PCB board 300, the upper PCB board 200, and the heat sink 400 are stacked sequentially. The heat sink 400 is located on the side of the upper PCB board 200 away from the lower PCB board 300. The heat sink 400, the upper PCB board 200, and the lower PCB board 300 are all fixedly connected to the bottom shell 100, which makes the fixation stability of the heat sink 400, the upper PCB board 200, the lower PCB board 300, and the bottom shell 100 high, and makes the overall structure of the vehicle power supply device 10 stronger.

[0157] In this embodiment, the lower PCB board 300, upper PCB board 200, heat sink 400, and power conversion circuit 600 inside the vehicle power supply device 10 are directly or indirectly fixedly connected to the bottom shell 100. This helps to improve the overall structural stability of the vehicle power supply device 10. When the external environment applies external force to the vehicle power supply device 10, the lower PCB board 300, upper PCB board 200, heat sink 400, and power conversion circuit 600 will not easily undergo relative displacement with the bottom shell 100, which is conducive to the vehicle power supply device 10 working in a stable state.

[0158] In this power conversion circuit 600, the power switch 660 refers to a power electronic device capable of power conversion, including but not limited to IGBTs (Insulated Gate Bipolar Transistors), silicon carbide power transistors, silicon transistors, MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), and diodes. The transformer 650 in the power conversion circuit 600 is a device that uses the principle of electromagnetic induction to change AC voltage. In this embodiment, the power switch 660 and transformer 650 work together to convert AC power into at least two types of DC power after passing through the power conversion circuit 600, meeting the power supply needs of at least two types of loads.

[0159] In this embodiment, the power conversion circuit 600 includes multiple power switching transistors 660 and multiple transformers 650 for power conversion. The upper PCB board 200 and the lower PCB board 300 are both used to carry a portion of the power switching transistors 660, so that the power conversion circuit 600 is distributed on the two stacked PCB boards, the upper PCB board 200 and the lower PCB board 300. Compared with distributing the power conversion circuit 600 on a single PCB board, this embodiment makes the distribution of the power conversion circuit 600 more flexible and can reduce the area of ​​the vehicle power supply device 10 in the horizontal plane.

[0160] In this embodiment, the power switching transistor 660 is supported by the upper PCB board 200 and the lower PCB board 300, and the transformer 650 is supported by the bottom shell 100. This allows the upper PCB board 200, the lower PCB board 300, and the bottom shell 100 to all carry a portion of the power conversion circuit 600. The components of the power conversion circuit 600 are distributed in different positions inside the vehicle power supply device 10, which optimizes the layout of the power conversion circuit 600 and improves the space utilization of the vehicle power supply device 10, thereby facilitating the miniaturization design of the vehicle power supply device 10.

[0161] Please continue reading. Figure 3 In one embodiment, the cover plate 500 of the vehicle power supply device 10 is combined with the bottom shell 100 to form a receiving cavity, which is used to receive the lower PCB board 300, the upper PCB board 200, the heat sink 400 and a plurality of transformers 650, wherein: along the height direction X of the vehicle power supply device 10, the lower PCB board 300, the upper PCB board 200, the heat sink 400 and the cover plate 500 are stacked in sequence.

[0162] In this embodiment, the housing cavity is used to protect the lower PCB board 300, upper PCB board 200, heat sink 400, and multiple transformers 650 inside from the influence of the external environment. In the height direction X of the vehicle power supply device 10, the upper PCB board 200 is positioned closer to the cover plate 500 than the lower PCB board 300. The heat sink 400 is disposed between the cover plate 500 and the upper PCB board 200, and the heat sink 400 can be used to cool the power switching transistors 660 of the upper PCB board 200.

[0163] In this embodiment, the lower PCB board 300, the upper PCB board 200, the heat sink 400, and the cover plate 500 are stacked in sequence, which makes the arrangement of these components more compact and helps to reduce the size of the vehicle power supply device 10.

[0164] In one embodiment, the cover plate 500 is detachably connected to the bottom shell 100. When the internal components of the vehicle power supply device 10 need to be repaired or replaced, the detachable connection helps to reduce the difficulty and cost of operation. For example, the detachable connection can be a screw connection.

[0165] In one embodiment, the cover plate 500 and the bottom shell 100 are detachably connected at their opposite end edges in the height direction X of the vehicle power supply device 10. This design allows the cover plate 500 and the bottom shell 100 to be connected at a position on the periphery of the receiving cavity, without occupying the internal space of the vehicle power supply device 10, and facilitates the assembly and disassembly of the cover plate 500 and the bottom shell 100.

[0166] Please see Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the structure of the upper PCB board 200 and the lower PCB board 300 provided in one embodiment of this application. Figure 6 This is a schematic diagram of the structure of the upper PCB board 200 and the lower PCB board 300 provided in one embodiment of this application. In one implementation, the upper PCB board 200 and the lower PCB board 300 are spaced apart (e.g., Figure 5 As shown). The surface area of ​​the upper PCB board 200 is larger than the surface area of ​​the lower PCB board 300 (e.g. Figure 6 As shown), the surfaces of both the upper PCB board 200 and the lower PCB board 300 are perpendicular to the height direction X of the vehicle power supply device 10 (e.g., ...). Figure 6 (As shown).

[0167] In this embodiment, a gap is provided between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device 10. This provides space for the power conversion circuit 600 to be arranged opposite each other between the upper PCB board 200 and the lower PCB board 300, which helps to save the volume required for installing the power conversion circuit 600. The area of ​​the upper PCB board 200 is larger than that of the lower PCB board 300, allowing a larger number and / or larger power conversion circuits 600 to be installed on the upper PCB board 200. This flexible use of the installation space on the upper PCB board 200 and the lower PCB board 300 helps to improve the space utilization rate of the vehicle power supply device 10. The height direction X of the vehicle power supply device 10 is the direction in which the surface of the lower PCB board 300 points to the surface of the upper PCB board 200. The surface of the upper PCB board 200 and the surface of the lower PCB board 300 are set parallel to each other, which is conducive to fixing the upper PCB board 200, the lower PCB board 300 and the bottom shell 100 with screws.

[0168] Please continue reading. Figure 5In one embodiment, the surface of the upper PCB board 200 is arranged parallel to the surface of the lower PCB board 300, and the surfaces of the upper PCB board 200 and the lower PCB board 300 are perpendicular to the height direction X of the vehicle power supply device 10.

[0169] In this embodiment, by setting the surface of the upper PCB board 200 and the surface of the lower PCB board 300 to be parallel and perpendicular to the height direction X of the vehicle power supply device 10, the installation operation is more convenient when the upper PCB board 200, the lower PCB board 300 and the bottom shell 100 are fixed by screws or other means. At the same time, it helps to improve the stability of the connection between the upper PCB board 200, the lower PCB board 300 and the bottom shell 100.

[0170] Please continue reading. Figure 6 In one embodiment, the upper PCB board 200 includes an upper front side 210 and an upper rear side 220 disposed opposite to each other along the longitudinal direction Y of the vehicle power supply device 10, and the lower PCB board 300 includes a lower front side 310 and a lower rear side 320 disposed opposite to each other along the longitudinal direction Y. In the longitudinal direction Y of the vehicle power supply device 10, the lower front side 310 and the lower rear side 320 are located between the upper front side 210 and the upper rear side 220.

[0171] In this embodiment, the upper front side 210 refers to the front side of the upper PCB board 200, and the upper rear side 220 refers to the rear side of the upper PCB board 200. The lower front side 310 refers to the front side of the lower PCB board 300, and the lower rear side 320 refers to the rear side of the lower PCB board 300. To distinguish the front and rear sides of the upper PCB board 200 and the lower PCB board 300, they are named upper front side 210, upper rear side 220, lower front side 310, and lower rear side 320, respectively.

[0172] In this embodiment, in the longitudinal direction Y of the vehicle power supply device 10, the upper front side 210 and the upper rear side 220 of the upper PCB board 200 are located outside the lower front side 310 and the lower rear side 320 of the lower PCB board 300, respectively. The outer side of the lower front side 310 refers to the side of the lower front side 310 that is away from the lower rear side 320 in the longitudinal direction Y, and the outer side of the lower rear side 320 refers to the side of the lower rear side 320 that is away from the lower front side 310 in the longitudinal direction Y. The distance between the upper front side 210 and the upper rear side 220 in the front-rear direction Y of the vehicle power supply device 10 is D1, and the distance between the lower front side 310 and the lower rear side 320 in the front-rear direction Y of the vehicle power supply device 10 is D2. Setting D1>D2 ensures that the orthographic projection of the upper PCB board 200 onto the lower PCB board 300 in the front-rear direction Y can cover the lower PCB board 300. This is beneficial for mounting larger components on the upper PCB board 200, while also allowing the larger components to be fixed to the bottom shell 100, thus improving the overall stability of the vehicle power supply device 10.

[0173] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of the upper PCB board 200 and the lower PCB board 300 provided in one embodiment of the present application. In one embodiment, the upper PCB board 200 includes an upper left side 230 and an upper right side 240 disposed opposite each other in the left-right direction Z of the vehicle power supply device 10, and the lower PCB board 300 includes a lower left side 330 and a lower right side 340 disposed opposite each other in the front-back direction Y. In the left-right direction Z of the vehicle power supply device 10, the lower left side 330 and the lower right side 340 are located between the upper left side 230 and the upper right side 240.

[0174] In this embodiment, the upper left side 230 refers to the left side of the upper PCB board 200, and the upper right side 240 refers to the right side of the upper PCB board 200. The lower left side 330 refers to the left side of the lower PCB board 300, and the lower right side 340 refers to the right side of the lower PCB board 300. To distinguish the left and right sides of the upper PCB board 200 and the lower PCB board 300, they are named upper left side 340, upper right side 240, lower left side 330, and lower right side 340, respectively.

[0175] In this embodiment, in the left-right direction Z of the vehicle power supply device 10, the upper left side 230 and the upper right side 240 of the upper PCB board 200 are located outside the lower left side 330 and the lower right side 340 of the lower PCB board 300, respectively. The outer side of the lower left side 330 refers to the side of the lower left side 330 that is farther away from the lower right side 340 in the left-right direction ZZ, and the outer side of the lower right side 340 refers to the side of the lower right side 340 that is farther away from the lower left side 330 in the left-right direction Z. The spacing between the upper left side 230 and the upper right side 240 in the left-right direction Z of the vehicle power supply device 10 is D3, and the spacing between the lower left side 330 and the lower right side 340 in the left-right direction Z of the vehicle power supply device 10 is D4. Setting D3>D4 ensures that the orthographic projection of the upper PCB board 200 onto the lower PCB board 300 in the left-right direction Z can cover the lower PCB board 300. This is beneficial for mounting larger components on the upper PCB board 200, while also allowing the larger components to be fixed to the bottom shell 100, thus improving the overall stability of the vehicle power supply device 10.

[0176] Please see Figure 8 , Figure 8 This is a schematic diagram illustrating an application scenario of the power conversion circuit 600 provided in one embodiment of this application. In one embodiment, the power conversion circuit 600 includes an AC / DC conversion circuit 610, a low-voltage DC / DC conversion circuit 630, and a high-voltage DC / DC conversion circuit 620. Specifically: the AC / DC conversion circuit 610 receives AC power and supplies power to at least one of the high-voltage DC / DC conversion circuit 620 or the low-voltage DC / DC conversion circuit 630. The low-voltage DC / DC conversion circuit 630 receives power from at least one of the AC / DC conversion circuit 610 or the high-voltage DC / DC conversion circuit 620 and outputs a first DC power. The high-voltage DC / DC conversion circuit 620 receives power from the AC / DC conversion circuit 610 and outputs a second DC power, the voltage of which is higher than that of the first DC power.

[0177] In this embodiment, the external power supply 13 inputs AC power to the power conversion circuit 600. The AC power is then transmitted to at least one of the low-voltage DC conversion circuit 630 and the high-voltage DC conversion circuit 620 after passing through the AC / DC conversion circuit 610. The high-voltage DC conversion circuit 620 receives the AC power and converts it into a second type of DC power, which is then used to power the second type of load 16. Alternatively, the high-voltage DC conversion circuit 620 converts the AC power into the second type of DC power and uses it to power the low-voltage DC conversion circuit 630. The low-voltage DC conversion circuit 630 receives the AC power and converts it into a first type of DC power, which is then used to power the first type of load. Alternatively, the low-voltage DC conversion circuit 630 receives the second type of DC power, converts it into the first type of DC power, and uses it to power the first type of load. The voltage of the second type of DC power is higher than that of the first type of DC power. The AC power supplied by the external power supply 13 undergoes AC / DC conversion and voltage changes after passing through the power conversion circuit 600, enabling the vehicle power supply device 10 to power different types of vehicle loads and improving its adaptability.

[0178] In one embodiment, the voltage of the first DC power supply is 12V, the first type of load is a low-voltage load, the second type of load is a high-voltage load, and the voltage of the second DC power supply is 200-750V. In other embodiments, the specific voltage values ​​of the first and second DC power supplies can be set as needed, but the voltage of the second DC power supply must be greater than the voltage of the first DC power supply.

[0179] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of the upper PCB board 200, the lower PCB board 300, and the power conversion circuit 600 provided in one embodiment of this application. In one embodiment, the AC / DC conversion circuit 610, the high-voltage DC conversion circuit 620, and a portion of the low-voltage DC conversion circuit 630 are disposed on the upper PCB board 200, and the portion of the low-voltage DC conversion circuit 630 is disposed on the lower PCB board 300.

[0180] In this embodiment, the AC / DC conversion circuit 610 and the high-voltage DC conversion circuit 620 are fixedly connected to the upper PCB board 200, and the low-voltage DC conversion circuit 630 is fixedly connected to both the upper PCB board 200 and the lower PCB board 300. This facilitates the arrangement of components on the upper PCB board 200 and the lower PCB board 300 according to the different functions of the AC / DC conversion circuit 610, the high-voltage DC conversion circuit 620, and the low-voltage DC conversion circuit 630, resulting in a more rational layout of the power conversion circuit 600. In one embodiment, some of the AC / DC conversion circuits 610, some of the high-voltage DC conversion circuits 620, and some of the low-voltage DC conversion circuits 630 located on the upper PCB board 200 are situated around at least two sides of the lower PCB board 300.

[0181] It should be noted that, Figure 9 The power conversion circuit 600 shown is only a schematic representation of the arrangement of different components and does not represent its specific structure, size, or positional relationship.

[0182] Please refer to the following: Figure 9 and Figure 10 , Figure 10 This is a schematic diagram of the structure of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the lower surface 260 of the upper PCB board 200 and the upper surface 350 of the lower PCB board 300 are disposed opposite to each other (e.g., Figure 9 (As shown). The upper surface 250 of the upper PCB board 200 is used to carry multiple power switches 660 of the AC / DC conversion circuit 610, multiple power switches 660 of the high-voltage DC conversion circuit 620, and multiple power switches 660 of the primary circuit (in combination with...). Figure 9 and Figure 10 (As shown). The upper surface 350 of the lower PCB board 300 is used to carry multiple power switching transistors 660 of the secondary circuit (in combination with...). Figure 9 and Figure 10 (As shown).

[0183] In this embodiment, the lower surface 260 of the upper PCB board 200 and the upper surface 350 of the lower PCB board 300 are positioned opposite each other along the height direction X of the vehicle power supply device 10. Since the lower surface 260 of the upper PCB board 200 is used to mount a large number of components, placing some power switching transistors 660 on the upper surface 250 of the upper PCB board 200 facilitates the overall layout of the AC / DC conversion circuit 610, the high-voltage DC conversion circuit 620, and the low-voltage DC conversion circuit 630 on the upper PCB board 200. In one embodiment, some power switching transistors 660 are located between the upper surface 250 of the upper PCB board 200 and the heat sink 400, allowing the heat sink 400 to effectively cool the power switching transistors 660 and ensure that the operating efficiency of the power switching transistors 660 is not affected by temperature.

[0184] It should be noted that, Figure 9 The power switch 660 shown is only schematically illustrated and does not represent the specific structure, size, or positional relationship.

[0185] Please refer to the following: Figure 8 and Figure 10In one embodiment, the low-voltage DC-DC converter circuit 630 includes a low-voltage transformer 6310, a primary circuit 6300, and a secondary circuit 6320. The primary circuit 6300 receives power from at least one of the AC-DC converter circuit 610 or the high-voltage DC-DC converter circuit 620, and the secondary circuit 6320 outputs a first DC current. The upper PCB board 200 carries multiple power switching transistors 660 of the primary circuit 6300 in the low-voltage DC-DC converter circuit 630. The lower PCB board 300 carries multiple power switching transistors 660 of the secondary circuit 6320 in the low-voltage DC-DC converter circuit 630. The bottom housing 100 secures the low-voltage transformer 6310 of the low-voltage DC-DC converter circuit 630.

[0186] In this embodiment, the primary circuit 6300 is electrically connected to a portion of the power conversion circuit 600 on the upper PCB board 200. The primary circuit 6300 converts DC power into alternating positive and negative square waves. After passing through a low-voltage transformer 6310, the voltage of the square waves decreases. Finally, the secondary circuit 6320 converts the transformed square waves into a first DC power. For example, the DC voltage is 100V, the alternating positive and negative square wave voltage is +100V to -100V, the transformed square wave voltage is +12V to -12V, and the second DC voltage is 12V. This solution, by setting the primary circuit 6300, the low-voltage transformer 6310, and the secondary circuit 6320 in the low-voltage DC-DC conversion circuit 630, enables the on-board power supply device 10 to convert DC power into a second DC power and supply power to the battery.

[0187] In this embodiment, the upper PCB board 200 and the lower PCB board 300 are used to carry multiple power switching transistors 660 of the primary circuit 6300 and the secondary circuit 6320, respectively, so that the low-voltage DC-DC converter circuit 630 is distributed on the upper PCB board 200 and the lower PCB board 300. Compared with using a single PCB board to carry all the power switching transistors 660 of the low-voltage DC-DC converter circuit 630, the device distribution is more flexible.

[0188] In this embodiment, the low-voltage transformer 6310 is fixedly connected to both the upper PCB board 200 and the lower PCB board 300, so that other devices electrically connected to the low-voltage transformer 6310 can be respectively installed on the upper PCB board 200 and the lower PCB board 300. This avoids all devices in the power conversion circuit 600 being concentrated on the upper PCB board 200 or the lower PCB board 300, which can effectively reduce the area of ​​the mounting surface of the upper PCB board 200 and the lower PCB board 300, and is conducive to realizing the miniaturization design of the vehicle power supply device 10.

[0189] In this embodiment, the low-voltage transformer 6310 is also fixed to the bottom shell 100, so that the low-voltage transformer 6310, the lower PCB board 300, the upper PCB board 200, and the heat sink 400 are all fixed to the bottom shell 100, thereby making the overall structural strength of these components in the vehicle power supply device 10 higher.

[0190] Please see Figure 11 and Figure 12 , Figure 11 This is a structural schematic diagram of the bottom shell 100 and the upper PCB board 200 provided in one embodiment of this application. Figure 12 This is a schematic diagram of the structure of the bottom shell 100 provided in one embodiment of the present application. In one embodiment, the bottom shell 100 includes a bottom plate 170, a front sidewall 130, a rear sidewall 140, a left sidewall 150, and a right sidewall 160 (in combination). Figure 11 and Figure 12 As shown), the front sidewall 130 and the rear sidewall 140 are arranged opposite each other (e.g. Figure 12 As shown), the left side wall 150 and the right side wall 160 are arranged opposite each other (in combination). Figure 11 and Figure 12 As shown), the base plate 170, front sidewall 130, rear sidewall 140, left sidewall 150, and right sidewall 160 form a groove structure (as shown). Figure 11 (As shown). Wherein: along the height direction X of the vehicle-mounted power supply device 10, the height of any one of the front side wall 130, rear side wall 140, left side wall 150, and right side wall 160 is greater than the height of the upper PCB board 200 (e.g., ...). Figure 11 (As shown).

[0191] In this embodiment, the bottom shell 100 includes four side walls connected in sequence: a front side wall 130, a rear side wall 140, a left side wall 150, and a right side wall 160. The front side wall 130 and the rear side wall 140 are arranged along the longitudinal direction Y of the vehicle power supply device 10, where Y refers to the direction from the front side wall 130 to the rear side wall 140. The left side wall 150 and the right side wall 160 are arranged along the lateral direction Z of the vehicle power supply device 10, where Z refers to the direction from the left side wall 150 to the right side wall 160. The bottom plate 170 and the cover plate 500 are arranged along the vertical direction X of the vehicle power supply device 10, where X refers to the direction from the bottom plate 170 to the cover plate 500. The longitudinal direction Y and the lateral direction Z of the vehicle power supply device 10 intersect perpendicularly, and both intersect perpendicularly with the vertical direction X.

[0192] It should be noted that in this application, "front," "rear," "left," and "right" refer to relative relationships. When the placement of the vehicle-mounted power supply device 10 changes, the front-rear direction Y can also be the left-right direction Z, and the left-right direction Z can also be the front-rear direction Y. In one embodiment, the left side wall and the right side wall can be interchanged. In one embodiment, the front side wall and the rear side wall can be interchanged.

[0193] In this embodiment, the height of the upper PCB board 200 refers to the distance between the upper PCB board 200 and the bottom plate 170. The height of any side wall in the bottom shell 100 is greater than the height of the upper PCB board 200, so that the upper PCB board 200 is located inside the bottom shell 100, and there is space above the upper PCB board 200 to accommodate the heat sink 400 or multiple power switching transistors 660 on the upper surface of the upper PCB board 200.

[0194] Please see Figure 13 and Figure 14 , Figure 13 A partial exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 14 This is a partial structural diagram of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, a lower PCB board 300 and multiple transformers 650 are arranged flat on top of a base plate 170 (e.g., Figure 13 As shown). The upper PCB board 200 is stacked on top of the lower PCB board 300 and multiple transformers 650 (as shown). Figure 13 As shown). The heat sink 400 is stacked on top of the upper PCB board 200 (as shown). Figure 13 As shown). The orthographic projection of the lower PCB board 300 on the base plate 170 and the orthographic projection of the heat sink 400 on the base plate 170 are misaligned (e.g. Figure 14 (As shown).

[0195] In this embodiment, the lower PCB board 300 and the multiple transformers 650 being arranged flatly above the base plate 170 means that their orthographic projections on the base plate 170 do not overlap. In one embodiment, the lower PCB board 300 and the multiple transformers 650 can be arranged along the left-right direction Z or the front-back direction Y of the vehicle power supply device 10. This flat arrangement allows for full utilization of the space above the base plate 170, resulting in a more compact distribution of the lower PCB board 300 and the multiple transformers 650 within the base shell 100, which is beneficial for miniaturization of the vehicle power supply device 10.

[0196] In this embodiment, the upper PCB board 200 is stacked on top of the lower PCB board 300 and multiple transformers 650, so that the upper PCB board 200 covers the lower PCB board 300 and multiple transformers 650, and it is convenient to electrically connect the transformers 650 to the lower surface 260 of the upper PCB board 200 by plugging them in.

[0197] In one embodiment, the area of ​​the upper PCB board 200 is larger than the area of ​​the lower PCB board 300, so that the lower PCB board 300 and multiple transformers 650 can be laid flat between the upper PCB board 200 and the base plate 170.

[0198] In one embodiment, the plurality of transformers 650 includes an LLC transformer 6200 of a high-voltage DC-DC conversion circuit 620 and a low-voltage transformer 6310 of a low-voltage DC-DC conversion circuit 630.

[0199] In this embodiment, since the multiple transformers 650 are laid flat with the lower PCB board 300, the orthographic projection of the lower PCB board 300 on the base plate 170 and the orthographic projection of the heat sink 400 on the base plate 170 are misaligned. This allows the heat sink 400 to be stacked more with the multiple transformers 650 in the height direction X, which is beneficial to improving the heat dissipation effect of the heat sink 400 on the multiple transformers 650, thereby improving the heat dissipation effect of the vehicle power supply device 10 and increasing the power of the vehicle power supply device 10.

[0200] Please see Figure 15 , Figure 15 This is a partial exploded view of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the front sidewall 130 includes a plurality of electrical interfaces 1300, and the rear sidewall 140 includes a cooling channel interface 1400. The lower PCB board 300 is closer to the front sidewall 130 than the heat sink 400, and the lower PCB board 300 and the upper PCB board 200 are used to electrically connect at least one of the plurality of electrical interfaces 1300. The heat sink 400 is closer to the rear sidewall 140 than the lower PCB board 300, and the heat sink 400 is used to connect to the cooling channel interface 1400.

[0201] In one embodiment, the plurality of electrical interfaces 1300 include two first DC interfaces 1340, one second DC interface 1330, a power interface 1310, and a control signal interface 1320. The first DC interface 1340 is used to output a first DC power. The second DC interface 1330 is used to output a second DC power. The power interface 1310 is used to input AC power. The control signal interface 1320 is used to transmit signals.

[0202] In this embodiment, multiple electrical interfaces 1300 are disposed on the front side wall 130, and the cooling channel interface 1400 is disposed on the rear side wall 140, so that the electrical interfaces 1300 and the cooling channel interface 1400 are physically isolated, preventing the coolant leaking from the cooling channel interface 1400 from affecting the electrical performance of the electrical interfaces 1300, thus making the vehicle power supply device 10 safer.

[0203] In this embodiment, since the front sidewall 130 is provided with an electrical interface 1300, the secondary circuit 6320 of the low-voltage DC-DC converter 630 is located on the lower PCB board 300. The lower PCB board 300 is arranged close to the front sidewall 130 along the front-rear direction Y of the vehicle power supply device 10, which facilitates the transmission of the first DC power output by the secondary circuit 6320 of the low-voltage DC-DC converter 630 to the first type of load through the electrical interface 1300. This shortens the distance between the output end of the secondary circuit 6320 of the low-voltage DC-DC converter 630 and the electrical interface 1300, making the layout of the vehicle power supply device 10 more reasonable.

[0204] In this embodiment, since the rear sidewall 140 is provided with a cooling channel interface 1400, the heat sink 400 is positioned closer to the rear sidewall 140 than the lower PCB board 300. This results in a closer connection between the heat sink 400 and the cooling channel interface 1400, which is more conducive to ensuring the sealing between the heat sink 400 and the cooling channel interface 1400. Furthermore, the lower PCB board 300 is further away from the cooling channel interface 1400 of the rear sidewall 140, preventing damage to the lower PCB board 300 from coolant leakage from the cooling channel.

[0205] Please refer to the following: Figure 3 and Figure 16 In one embodiment, the power conversion circuit 600 is used to receive external power 13 through power interface 1310, and to output a first DC power through a first DC power interface 1340 and a second DC power through a second DC power interface 1330, wherein the voltage of the second DC power is higher than that of the first DC power. The lower PCB board 300 is used for electrical connection to the first DC power interface 1340 (e.g., ...). Figure 16 As shown), the upper PCB board 200 is used for electrical connection of the second DC power interface 1330 and the power interface 1310 (as shown). Figure 16 (As shown).

[0206] In this embodiment, the power conversion circuit 600 performs AC / DC conversion and voltage conversion functions. The power conversion circuit 600 converts the AC power input from the external power supply 13 via the power interface 1310 into a first DC power and a second DC power. The second DC power is output from the portion of the power conversion circuit 600 located on the upper PCB board 200 via the second DC power interface 1330, while the first DC power is output from the portion of the power conversion circuit 600 located on the lower PCB board 300 via the first DC power interface 1340. The voltage of the second DC power is higher than that of the first DC power, enabling the vehicle power supply device 10 to meet the power requirements of different loads.

[0207] In this embodiment, the stacked upper PCB board 200 and lower PCB board 300 are electrically connected to different interfaces. Compared to electrically connecting these different interfaces to a single PCB board, the electrical interface arrangement is more flexible, and the electrical isolation between the interfaces is higher and safer. Furthermore, by using the upper PCB board 200 and lower PCB board 300 to carry devices with different functions, the power conversion circuit 600 is rationally arranged on the upper PCB board 200 and lower PCB board 300, which is beneficial for the miniaturization design of the vehicle power supply device 10, thereby optimizing the overall vehicle layout.

[0208] Please see Figure 17 and Figure 18 , Figure 17 A partial exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 18 This is a partial exploded view of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the front sidewall 130 includes a first DC power interface 1340 and a control signal interface 1320. The power conversion circuit 600 outputs a first DC power through the first DC power interface 1340 and receives a control signal through the control signal interface 1320. The lower surface 260 of the upper PCB board 200 includes a control signal connector 2610, which electrically connects the control signal interface 1320 and the upper PCB board 200. The upper surface 350 of the lower PCB board 300 includes at least a portion of a low-voltage filter circuit 6400, which electrically connects the first DC power interface 1340 and the lower PCB board 300.

[0209] In this embodiment, the control signal connector 2610 is disposed on the lower surface 260 of the upper PCB board 200, and part of the low-voltage filter circuit 6400 is disposed on the upper surface 350 of the lower PCB board 300, so as to make full use of the space between the upper PCB board 200 and the lower PCB board 300.

[0210] In one embodiment, the low-voltage filter circuit 6400 includes a capacitor, an inductor, and a copper busbar. The capacitor portion can be disposed on the upper surface 350 of the lower PCB board 300, and the inductor and copper busbar portion can be disposed on the lower surface 360 ​​of the lower PCB board 300. In other embodiments, the configuration can be adjusted according to actual needs.

[0211] Please see Figure 19 and Figure 20 , Figure 19 This is a partial structural schematic diagram of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 20 This is a partial structural schematic diagram of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the power conversion circuit 600 includes an AC filter 6100, a PFC capacitor 6110, a PFC inductor 6120, a low-voltage transformer 6310, an LLC transformer 6200, and an HVDC filter 6210 (e.g., ...). Figure 19 (As shown). Specifically: the PFC capacitor 6110, PFC inductor 6120, and LLC transformer 6200 are arranged adjacent to each other near the rear sidewall 140 of the vehicle power supply unit 10 (e.g., ...). Figure 19 (As shown). The PFC capacitor 6110 and AC filter 6100 are arranged adjacent to each other on the right side wall 160 of the vehicle power supply unit 10 (as shown). Figure 19 (As shown). The HVDC filter 6210 and LLC transformer 6200 are arranged adjacent to each other on the left side wall 150 near the vehicle power supply unit 10 (as shown). Figure 20 (As shown).

[0212] In this embodiment, the devices in the power conversion circuit 600 are arranged close to at least one side wall of the vehicle power supply device 10, so that other devices can be arranged in the empty areas between the front side wall 130 and the right side wall 160 and between the left side wall 150 and the right side wall 160, thereby improving the utilization rate of the internal space of the vehicle power supply device 10.

[0213] Please continue reading. Figure 19 In one embodiment, the power conversion circuit 600 includes an AC filter 6100, a PFC capacitor 6110, a PFC inductor 6120, an HVDC filter 6210, an LLC transformer 6200, and a low-voltage transformer 6310. The AC filter 6100, PFC capacitor 6110, PFC inductor 6120, HVDC filter 6210, LLC transformer 6200, low-voltage transformer 6310, and the lower PCB board 300 are arranged flat on the bottom shell 100.

[0214] Among them, AC filter 6100 is the filter in AC-DC conversion circuit 610, and AC filter 6100 can also be called AC filter. HVDC filter 6210 is the filter in high voltage DC conversion circuit 620, and HVDC filter 6210 can also be called high voltage DC filter.

[0215] Among them, PFC capacitor 6110 is the capacitor in AC-DC conversion circuit 610, and PFC inductor 6120 is the inductor in AC-DC conversion circuit 610.

[0216] LLC transformer 6200 and low-voltage transformer 6310 are two transformers in power conversion circuit 600. LLC transformer 6200 is a transformer in high-voltage DC-DC conversion circuit 620, and can also be called a high-voltage transformer. Low-voltage transformer 6310 is a transformer in low-voltage DC-DC conversion circuit 630.

[0217] In this embodiment, the AC filter 6100, PFC capacitor 6110, PFC inductor 6120, HVDC filter 6210, LLC transformer 6200, and low-voltage transformer 6310 are all relatively large components in terms of volume and height within the vehicle power supply device 10. Arranging these components flat and close to the base 100 reduces the volume occupied by the power conversion circuit 600 in the height direction X, which is beneficial for miniaturizing the vehicle power supply device 10 and improves the ease of installation of the power conversion circuit 600. Here, height refers to the dimension in the height direction X of the vehicle power supply device 10.

[0218] In one embodiment, the AC filter 6100, PFC capacitor 6110, PFC inductor 6120, HVDC filter 6210, LLC transformer 6200 and low-voltage transformer 6310 are arranged around the sides of the lower PCB board 300. The components are arranged closely, which can improve the utilization rate of the internal space of the vehicle power supply device 10.

[0219] Please see Figure 21 and Figure 22 , Figure 21 This is a schematic diagram of the structure of the base shell 100 and the power conversion circuit 600 provided in one embodiment of this application. Figure 22 This is a schematic diagram of the structure of the bottom shell 100 and the power conversion circuit 600 provided in one embodiment of the present application. In one embodiment, the bottom plate 170, front sidewall 130, rear sidewall 140, left sidewall 150 and right sidewall 160 of the bottom shell 100 form a groove structure (in conjunction with...). Figure 21 and Figure 22As shown), the recessed structure is used to carry the AC filter 6100, HVDC filter 6210, PFC capacitor 6110, PFC inductor 6120, and LLC transformer 6200. The PFC capacitor 6110, PFC inductor 6120, and LLC transformer 6200 are arranged in sequence on the rear sidewall 140 near the vehicle power supply unit 10 (as shown). Figure 21 (As shown). The PFC capacitor 6110 and AC filter 6100 are arranged in a row on the left side wall 150 near the vehicle power supply unit 10 (as shown). Figure 22 (As shown). The HVDC filter 6210 and LLC transformer 6200 are arranged in sequence on the right side wall 160 near the vehicle power supply unit 10 (as shown). Figure 21 (As shown).

[0220] In the AC / DC conversion circuit 610, the AC filter 6100 and the PFC capacitor 6110 are arranged along the front-rear direction Y of the vehicle power supply device 10, and the AC filter 6100 is located between the lower left side 330 and the left side wall 150 of the lower PCB board 300. The PFC capacitor 6110 and the PFC inductor 6120 are arranged along the left-right direction Z of the vehicle power supply device 10, and the PFC inductor 6120 is located between the lower rear side 320 and the rear side wall 140 of the lower PCB board 300.

[0221] In this embodiment, the AC filter 6100 and the PFC capacitor 6110 are located in the peripheral space of the lower left side 330 of the lower PCB board 300, and the PFC inductor 6120 is located in the peripheral space of the lower rear side 320 of the lower PCB board 300. By flexibly utilizing the mounting space between the upper PCB board 200 and the lower PCB board 300, it is beneficial to reduce the volume occupied by the power conversion circuit 600 in the vehicle power supply device 10.

[0222] In one embodiment, the AC filter 6100 is disposed near the front sidewall 130 of the vehicle power supply device 10 to facilitate electrical connection of the AC filter 6100 to the power interface 1310 of the electrical interface 1300 on the outside of the vehicle power supply device 10.

[0223] In the high-voltage DC-DC conversion circuit 620, the HVDC filter 6210 and LLC transformer 6200 are arranged along the front-rear direction Y of the vehicle power supply device 10, and the HVDC filter 6210 and AC filter 6100 are located on both sides of the lower PCB board 300 along the left-right direction Z of the vehicle power supply device 10. The PFC capacitor 6110, PFC inductor 6120 and LLC transformer 6200 are arranged sequentially along the left-right direction Z of the vehicle power supply device 10.

[0224] In this embodiment, the HVDC filter 6210 is located between the lower right side 340 and the right side wall 160 of the lower PCB board 300 (e.g., Figure 22 As shown, the LLC transformer 6200 is located in the peripheral space of the lower right side 340 and the lower rear side 320 of the lower PCB board 300. The PFC capacitor 6110, PFC inductor 6120 and LLC transformer 6200 are all set close to the rear side wall 140. By making flexible use of the installation space between the upper PCB board 200 and the lower PCB board 300, it is beneficial to reduce the volume occupied by the power conversion circuit 600 in the vehicle power supply device 10.

[0225] In one embodiment, the HVDC filter 6210 is disposed near the front sidewall 130 of the vehicle power supply device 10 to facilitate electrical connection of the HVDC filter 6210 to the second DC power interface 1330 in the electrical interface 1300 on the outside of the vehicle power supply device 10.

[0226] Please see Figure 23 and Figure 24 , Figure 23 This is a schematic diagram of the structure of the upper PCB board 200, the lower PCB board 300, and part of the power conversion circuit 600 provided in one embodiment of this application. Figure 24 This is a schematic diagram of the upper PCB board 200, lower PCB board 300, and part of the power conversion circuit 600 provided in one embodiment of this application. In one embodiment, the lengths of the AC filter 6100, PFC capacitor 6110, and PFC inductor 6120 in the height direction X of the vehicle power supply device 10 are all greater than the distance between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device 10 (in conjunction with...). Figure 23 and Figure 24 (As shown).

[0227] In this embodiment, the lengths of the AC filter 6100, PFC capacitor 6110, and PFC inductor 6120 in the height direction X of the vehicle power supply device 10 are H1, H2, and H3, respectively, and the distance between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device 10 is H4. This solution sets H1>H4, H2>H4, and H3>H4. On the one hand, since the lengths of the AC filter 6100, PFC capacitor 6110, and PFC inductor 6120 in the height direction X of the vehicle power supply device 10 are all relatively large, placing these components between the lower PCB board 300 and the base plate is more advantageous for reducing the overall height of the vehicle power supply device 10 compared to placing them between the upper PCB board 200 and the lower PCB board 300. On the other hand, since the upper PCB board 200, the lower PCB board 300 and the bottom shell 100 are stacked, the AC filter 6100, the PFC capacitor 6110 and the PFC inductor 6120 are placed on the periphery of the side of the lower PCB board 300, so that these devices can be directly fixedly connected to the bottom shell 100, reducing the installation difficulty and cost of the vehicle power supply device 10.

[0228] In one embodiment, the AC filter 6100 includes an AC filter inductor 6101 and an AC filter capacitor 6102. The AC filter inductor 6101 and the AC filter capacitor 6102 are stacked along the height direction X of the vehicle power supply device 10, and the AC filter inductor 6101 is located on the side of the AC filter capacitor 6102 away from the upper PCB board 200. This solution, by stacking the AC filter inductor 6101 and the AC filter capacitor 6102, helps to reduce the area occupied by the AC filter 6100 on the upper PCB board 200.

[0229] Please see Figure 25 , Figure 25 This is a schematic diagram of the structure of the upper PCB board 200, the lower PCB board 300 and part of the power conversion circuit 600 provided in one embodiment of this application. In one embodiment, the lengths of the LLC transformer 6200 and the HVDC filter 6210 in the height direction X of the vehicle power supply device 10 are both greater than the distance between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device 10.

[0230] In this embodiment, the lengths of the LLC transformer 6200 and the HVDC filter 6210 in the height direction X of the vehicle power supply device 10 are H5 and H6, respectively, and the distance between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device is H4. This solution sets H5>H4 and H6>H4. On the one hand, since the lengths of the LLC transformer 6200 and the HVDC filter 6210 in the height direction X of the vehicle power supply device 10 are both relatively large, placing these components between the lower PCB board 300 and the base plate is more advantageous for reducing the overall height of the vehicle power supply device 10 compared to placing them between the upper PCB board 200 and the lower PCB board 300. On the other hand, since the upper PCB board 200, the lower PCB board 300 and the bottom shell 100 are stacked, the LLC transformer 6200 and the HVDC filter 6210 are placed on the periphery of the side of the lower PCB board 300, so that these devices can be directly fixedly connected to the bottom shell 100, reducing the installation difficulty and cost of the vehicle power supply device 10.

[0231] Please see Figure 26 , Figure 26 This is a schematic diagram of the structure of the upper PCB board 200, the lower PCB board 300 and part of the power conversion circuit 600 provided in one embodiment of this application. In one embodiment, the length of the low-voltage transformer 6310 in the height direction X of the vehicle power supply device 10 is greater than the distance between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device 10.

[0232] In this embodiment, the length of the low-voltage transformer 6310 in the height direction X of the vehicle power supply device 10 is H7, and the distance between the upper PCB board 200 and the lower PCB board 300 in the height direction X of the vehicle power supply device 10 is H4. This design sets H7 > H4. On one hand, since the length of the low-voltage transformer 6310 in the height direction X of the vehicle power supply device 10 is relatively large, placing the low-voltage transformer 6310 between the lower PCB board 300 and the base plate is more advantageous in reducing the overall height of the vehicle power supply device 10 compared to placing it between the upper PCB board 200 and the lower PCB board 300. On the other hand, since the upper PCB board 200, the lower PCB board 300, and the base shell 100 are stacked, placing part of the low-voltage transformer 6310 on the periphery of the side of the lower PCB board 300 allows the low-voltage transformer 6310 to be directly fixedly connected to the base shell 100, reducing the installation difficulty and cost of the vehicle power supply device 10.

[0233] Please see Figure 27 , Figure 27This is a partial structural diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the AC filter 6100, PFC capacitor 6110, and PFC inductor 6120 are electrically connected to the upper PCB board 200. The HVDC filter 6210 and LLC transformer 6200 are electrically connected to the upper PCB board 200. The low-voltage transformer 6310 is electrically connected to both the upper PCB board 200 and the lower PCB board 300.

[0234] In this circuit, the AC filter 6100, PFC capacitor 6110, and PFC inductor 6120 are electronic components in the AC / DC conversion circuit 610. The AC filter 6100 receives AC power and filters out harmonics. The AC / DC conversion circuit 610 is electrically connected to the output of the AC filter 6100 and converts the AC power output by the AC filter 6100 into DC power. In this embodiment, the AC filter 6100, PFC capacitor 6110, and PFC inductor 6120 are electrically connected through the upper PCB board 200, enabling the vehicle power supply device 10 to convert power to DC power, thus providing a foundation for subsequent conversion of DC power into first DC power and second DC power.

[0235] The HVDC filter 6210 and LLC transformer 6200 are electronic components in the high-voltage DC-DC converter circuit 620. The input terminal of the LLC transformer 6200 is electrically connected to the AC-DC converter circuit 610, converting the DC output from the AC-DC converter circuit 610 into a second DC output. The output terminal of the LLC transformer 6200 is electrically connected to the HVDC filter 6210, which filters out harmonics in the second DC output from the LLC transformer 6200 and transmits it to the battery. In this embodiment, the HVDC filter 6210 and LLC transformer 6200 are electrically connected through the upper PCB board 200, enabling the on-board power supply device 10 to convert DC into a second DC output, thus meeting the battery's charging requirements.

[0236] In this circuit, the low-voltage transformer 6310 is an electronic component in the low-voltage DC-DC converter circuit 630. The low-voltage transformer 6310 is electrically connected to the upper PCB board 200 via the primary circuit 6300 and to the lower PCB board 300 via the secondary circuit 6320. The low-voltage transformer 6310 receives at least one of the DC power transmitted from the AC-DC converter circuit 610 and the second DC power transmitted from the high-voltage DC-DC converter circuit 620, and inputs a first DC power to a first type of load. In one embodiment, the power conversion circuit 600 further includes an LVDC filter 6400, which, along with the low-voltage transformer 6310, is electrically connected to the lower PCB board 300. In this embodiment, the LVDC filter 6400 is a filter in the low-voltage DC-DC converter circuit 630, and can also be referred to as a low-voltage filter. The output terminal of the low-voltage transformer 6310 is electrically connected to the LVDC filter 6400, which is used to filter out harmonics in the first DC power output by the low-voltage transformer 6310. This solution sets up a low-voltage transformer 6310 and an LVDC filter 6400 that are electrically connected through a lower PCB board 300, enabling the vehicle power supply device 10 to output the first type of DC power and meet the power requirements of the first type of load.

[0237] Please see Figure 28 , Figure 28 This is a schematic diagram of the structure of the lower PCB board 300 and part of the power conversion circuit 600 provided in one embodiment of the present application. In one embodiment, the low-voltage DC conversion circuit 630 further includes an LVDC filter 6400. The LVDC filter 6400 includes an LVDC filter copper busbar 6410, an LVDC filter magnetic ring 6420 and an LVDC filter capacitor 6430. The LVDC filter copper busbar 6410 and the LVDC filter magnetic ring 6420 are fixed to the lower surface 360 ​​of the lower PCB board 300, and the LVDC filter capacitor 6430 is inserted into the upper surface 350 of the lower PCB board 300.

[0238] The LVDC filter copper busbar 6410 is used to electrically connect the LVDC filter magnetic ring 6420 and the LVDC filter capacitor 6430. The LVDC filter magnetic ring 6420 acts as a filter inductor, and together with the LVDC filter capacitor 6430, they achieve the filtering effect on the first DC current.

[0239] In this embodiment, the LVDC filter copper busbar assembly 6410 is fixed to the lower PCB board 300 by screws, and the LVDC filter magnetic ring 6420 is electrically connected to the lower PCB board 300 and the LVDC filter capacitor 6430 through the LVDC filter copper busbar assembly 6410. The LVDC filter capacitor 6430 is provided with pins, and the LVDC filter capacitor 6430 is fixedly connected to the lower PCB board 300 through the pins.

[0240] In this embodiment, the LVDC filter copper busbar 6410, the LVDC filter magnetic ring 6420, and the LVDC filter capacitor 6430 are located on the upper surface 350 and the lower surface 360 ​​of the lower PCB board 300, respectively. Compared with placing all the LVDC filter copper busbar 6410, the LVDC filter magnetic ring 6420, and the LVDC filter capacitor 6430 on the upper surface 350 or the lower surface 360 ​​of the lower PCB board 300, this solution is beneficial to reducing the mounting area occupied by the LVDC filter 6400 on the same surface of the lower PCB board 300, and is beneficial to providing space for mounting other devices on the upper surface 350 or the lower surface 360 ​​of the lower PCB board 300.

[0241] In this embodiment, the LVDC filter capacitor 6430 is positioned close to the lower front side 310 of the lower PCB board 300, and the LVDC filter capacitor 6430 and the low-voltage transformer 6310 are spaced apart, which helps to provide space for installing other devices between the LVDC filter capacitor 6430 and the low-voltage transformer 6310.

[0242] Please see Figure 29 , Figure 29 This is a partial structural diagram of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, an upper PCB board 200 is stacked above an AC filter 6100, a PFC capacitor 6110, a PFC inductor 6120, an HVDC filter 6210, an LLC transformer 6200, a low-voltage transformer 6310, and a lower PCB board 300. The PFC capacitor 6110, PFC inductor 6120, and LLC transformer 6200 are arranged along the left-right direction (Z) of the on-board power supply device 10. The AC filter 6100 and PFC capacitor 6110 are arranged along the front-back direction (Y) of the on-board power supply device 10. The lower PCB board 300, low-voltage transformer 6310, and PFC inductor 6120 are arranged along the front-back direction (Y) of the on-board power supply device 10. The AC filter 6100, lower PCB board 300, and HVDC filter 6210 are arranged along the left-right direction (Z) of the on-board power supply device 10.

[0243] In this embodiment, the AC filter 6100, PFC capacitor 6110, PFC inductor 6120, HVDC filter 6210, LLC transformer 6200, and low-voltage transformer 6310 are arranged closely around the side of the lower PCB board 300. In the AC / DC conversion circuit 610, the AC filter 6100 and PFC capacitor 6110 are arranged along the Y-direction of the vehicle power supply device 10 and are located near the lower left side 330 of the lower PCB board 300. The PFC capacitor 6110 and PFC inductor 6120 are arranged along the Z-direction of the vehicle power supply device 10 and are located near the upper rear side 220 of the upper PCB board 200. In the high-voltage DC conversion circuit 620, the LLC transformer 6200 and HVDC filter 6210 are arranged along the Y-direction of the vehicle power supply device 10 and are located near the lower right side 340 of the lower PCB board 300. Along the longitudinal direction Y of the vehicle power supply device 10, the low-voltage transformer 6310 is located between the lower PCB board 300 and the PFC inductor 6120, and the low-voltage transformer 6310 is positioned close to the lower rear side 320 of the lower PCB board 300. This solution provides a reasonable arrangement of components in the power conversion circuit 600, which helps to improve the utilization rate of the internal space of the vehicle power supply device 10.

[0244] Please see Figure 30 , Figure 31 and Figure 32 , Figure 30 This is a schematic diagram of the bottom shell and electrical interface of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 31 A partial exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 32 This is a schematic diagram of the structure of the control signal connector 2610 and the low-voltage filter circuit 6400 in the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the front sidewall 130 includes a control signal interface 1320, a power interface 1310, and a first DC power interface 1340 (e.g., ...). Figure 32 As shown), the lower surface 260 of the upper PCB board 200 includes a control signal connector 2610 (as shown). Figure 32 As shown), the upper surface 350 of the lower PCB board 300 includes a portion of the low-voltage filter circuit 6400 (e.g., Figure 32 (As shown). The control signal connector 2610 is used for electrical connection between the control signal interface 1320 and the upper PCB board 200 (e.g., as shown). Figure 31 (As shown). The low-voltage filter circuit 6400 is used to electrically connect the first DC interface 1340 and the lower PCB board 300 (as shown). Figure 31 As shown). The control signal connector 2610 overlaps with the projected portion of the low-voltage filter circuit 6400 (as shown). Figure 32 (As shown).

[0245] In this embodiment, the control signal connector 2610 is disposed on the lower surface 260 of the upper PCB board 200, and part of the low-voltage filter circuit 6400 is disposed on the upper surface 350 of the lower PCB board 300, thus making full use of the space between the upper PCB board 200 and the lower PCB board 300. In one embodiment, the low-voltage filter circuit 6400 includes a capacitor, an inductor, and a copper busbar. The capacitor portion can be disposed on the upper surface 350 of the lower PCB board 300, and the inductor and copper busbar portion can be disposed on the lower surface 360 ​​of the lower PCB board 300. In other embodiments, the configuration can be adjusted according to actual needs.

[0246] In this embodiment, the projection of the control signal connector 2610 in the height direction X of the vehicle power supply device 10 partially overlaps with the projection of the low-voltage filter circuit 6400 in the height direction X of the vehicle power supply device 10. This facilitates the provision of a shared shield between the control signal connector 2610 and the low-voltage filter circuit 6400, enabling the shielding structure to reduce electrical interference between the control signal connector 2610 and the low-voltage filter circuit 6400.

[0247] Please see Figure 33 and Figure 34 , Figure 33 This is a schematic diagram of the upper PCB board 200 and part of the power conversion circuit 600 provided in one embodiment of this application. Figure 34 This is a schematic diagram of the upper PCB board 200 and part of the power conversion circuit 600 provided in one embodiment of this application.

[0248] In one embodiment, a power connector 2600, a control signal connector 2610, and a second DC connector 2620 are fixed on the lower surface 260 of the upper PCB board 200. The power connector 2600 is used to plug into the power interface 1310 (in conjunction with...). Figure 33 and Figure 34 As shown), the control signal connector 2610 is used to plug into the control signal interface 1320 (in conjunction with...). Figure 33 and Figure 34 As shown), the second DC connector 2620 is used to plug into the second DC interface 1330 (in conjunction with...). Figure 33 and Figure 34 (As shown). The power connector 2600, control signal connector 2610, and second DC connector 2620 are arranged sequentially along the left-right direction Z of the vehicle power supply device 10 and are fixed to the upper front side 210 of the upper PCB board 200 (as shown). Figure 33 As shown), the power connector 2600 is located on the side of the AC filter 6100 away from the PFC capacitor 6110, and is electrically connected to the input terminal of the AC filter 6100 (as shown). Figure 33As shown), the second DC connector 2620 is located on the side of the HVDC filter 6210 away from the LLC transformer 6200 and is electrically connected to the output terminal of the HVDC filter 6210 (as shown). Figure 33 (As shown).

[0249] In one embodiment, the power connector 2600, control signal connector 2610, and second DC connector 2620 are pluggable connectors, all of which are fixed to the upper PCB board 200 and located on the upper front side 210 of the upper PCB board 200. The upper front side 210 of the upper PCB board 200 is located near the front sidewall 130 of the vehicle power supply device 10. In one embodiment, a power interface 1310, a control signal interface 1320, and a second DC interface 1330 are provided on one side of the vehicle power supply device 10 opposite to the front sidewall 130. The power interface 1310, the control signal interface 1320, and the second DC interface 1330 can be electrically connected to the power conversion circuit 600 by being plugged into the three connectors respectively, which helps to reduce the assembly difficulty of electrical connections.

[0250] In one embodiment, the power connector 2600 is located between the lower left side 330 of the lower PCB board 300 and the left side wall 150 of the vehicle power supply device 10. The power connector 2600, AC filter 6100, and PFC capacitor 6110 are arranged sequentially along the front-rear direction Y of the vehicle power supply device 10. The power connector 2600 is electrically connected to the input terminal of the AC filter 6100, so that the external power supply 13 is transmitted sequentially through the power interface 1310, the power connector 2600, and the AC filter 6100 to the PFC capacitor 6110 and the PFC inductor 6120, thereby converting the external power supply 13 into DC power.

[0251] In one embodiment, the second DC connector 2620 is located between the lower right side 340 of the lower PCB board 300 and the right side wall 160 of the vehicle power supply device 10. The second DC connector 2620, the HVDC filter 6210, and the LLC transformer 6200 are arranged sequentially along the front-rear direction Y of the vehicle power supply device 10. The second DC connector 2620 is electrically connected to the output terminal of the HVDC filter 6210, so that the DC power is transmitted sequentially through the LLC transformer 6200, the HVDC filter 6210, and the second DC connector 2620 to the second DC interface 1330, thereby converting the DC power into a second type of DC power and supplying power to the second type of load.

[0252] Please see Figure 35 , Figure 35This is a schematic diagram of the structure of the lower PCB board 300 and part of the power conversion circuit 600 provided in one embodiment of this application. In one embodiment, the vehicle power supply device 10 further includes two first DC interfaces 1340, and the LVDC filter copper busbar group 6410 includes a first LVDC filter copper busbar 6411 and a second LVDC filter copper busbar 6412. The first LVDC filter copper busbar 6411 and the second LVDC filter copper busbar 6412 are fixed to the lower PCB board 300 and extend to the outside of the lower front side 310 of the lower PCB board 300. The portion of the first LVDC filter copper busbar 6411 and the portion of the second LVDC filter copper busbar 6412 located on the outside of the lower front side 310 of the lower PCB board 300 are used to be fixed and electrically connected to the two first DC interfaces 1340 respectively.

[0253] In this embodiment, the first LVDC filter copper busbar 6411 is arranged in an "L" shape. The portion of the first LVDC filter copper busbar 6411 located on the inner side of the lower front side 310 of the lower PCB board 300 is arranged along the left-right direction Z of the vehicle power supply device 10, and the portion of the first LVDC filter copper busbar 6411 located on the outer side of the lower front side 310 of the lower PCB board 300 is arranged along the front-back direction Y of the vehicle power supply device 10. The second LVDC filter copper busbar 6412 extends along the front-back direction Y of the vehicle power supply device 10, and the two first DC power interfaces 1340 are arranged along the left-right direction Z of the vehicle power supply device 10. The first LVDC filter copper busbar 6411 and the second LVDC filter copper busbar 6412 are all fixedly connected to the two first DC power interfaces 1340 by screws.

[0254] Please refer to the following: Figures 23 to 26 as well as Figure 36 , Figure 36 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of the present application. In one embodiment, the lower surface 260 of the upper PCB board 200 includes a ribbon cable connector 2640 and a plurality of plug-in connectors 2630. The plurality of plug-in connectors 2630 are respectively used for electrically connecting the AC filter 6100, the HVDC filter 6210, the PFC capacitor 6110, the PFC inductor 6120, the low-voltage transformer 6310, and the LLC transformer 6200 (in combination). Figures 23 to 26 (As shown). The ribbon cable connector 2640 is used for electrical connection between the upper PCB board 200 and the lower PCB board 300 (in combination). Figure 26 and Figure 36 (As shown).

[0255] In one embodiment, the AC filter 6100, HVDC filter 6210, PFC capacitor 6110, PFC inductor 6120, low-voltage transformer 6310, and LLC transformer 6200 are all provided with plug-in terminals, which are inserted into the plug-in connector 2630, so that the AC filter 6100, HVDC filter 6210, PFC capacitor 6110, PFC inductor 6120, low-voltage transformer 6310, and LLC transformer 6200 are fixed to the lower surface 260 of the upper PCB board 200 and electrically connected to the upper PCB board 200. In other embodiments, the AC filter 6100, HVDC filter 6210, PFC capacitor 6110, PFC inductor 6120, low-voltage transformer 6310, and LLC transformer 6200 can also be fixed to the upper PCB board 200 by other means. For example, the fixing method can be a pin, screw, or solder connection.

[0256] Please see Figure 37 , Figure 37 This is a partial structural diagram of the vehicle power supply device 10 provided in one embodiment of this application. In this embodiment, the ribbon cable connector 2640 can also be referred to as a board-to-board connector. The ribbon cable connector 2640 of the upper PCB board 200 is located on the side of the HVDC filter 6210 away from the upper right side 240. The upper PCB board 200 and the lower PCB board 300 are fixedly connected, which can ensure the stability of the vehicle power supply device 10 in the overall structure. In addition, the ribbon cable connectors 2640 are located in the spacing area between different components on the upper PCB board 200, without increasing the area of ​​the upper PCB board 200, which is beneficial to reducing the size of the vehicle power supply device 10.

[0257] Please continue reading. Figures 23 to 26 as well as Figure 36 In one embodiment, the upper surface of the lower PCB includes a ribbon cable connector 2640 and a plug connector 2630 (combined with...). Figures 23 to 26 (As shown). Cable connector 2640 is used for electrical connection to the upper PCB. Plug connector 2630 is used for electrical connection to the low-voltage transformer 6310 (in conjunction with...). Figure 26 and Figure 36 (As shown).

[0258] In this embodiment, the upper PCB board 200 and the lower PCB board 300 are fixed and electrically connected by a ribbon cable connector 2640. The ribbon cable connector 2640 of the lower PCB board 300 is located near the right side 340 of the lower PCB board. The ribbon cable connector 2640 is located in the spacing area between different components on the lower PCB board 300, without increasing the area of ​​the lower PCB board 300, which helps to reduce the size of the vehicle power supply device 10.

[0259] Please see Figure 38 , Figure 38 This is a partial structural diagram of the vehicle power supply device 10 provided in one embodiment of this application. In this embodiment, the low-voltage transformer 6310 is provided with a plug-in terminal (not shown in the figure), which is inserted into the plug-in connector 2630, so that the low-voltage transformer 6310 is fixed to the upper surface 350 of the lower PCB board 300 and electrically connected to the lower PCB board 300. In some other embodiments, the low-voltage transformer 6310 can also be fixed to the lower PCB board 300 by other means. For example, the fixing method can be a pin, screw or solder connection.

[0260] Please see Figure 39 , Figure 39 This is a partial structural diagram of the vehicle-mounted power supply device 10 provided in one embodiment of the present application. In one implementation, the vehicle-mounted power supply device 10 further includes a top-layer PCB board 700, which is used to house a power distribution unit 17. The top-layer PCB board 700, the upper PCB board 200, and the lower PCB board 300 are arranged along the height direction X of the vehicle-mounted power supply device 10, and the top-layer PCB board 700 is fixedly connected to the upper PCB board 200. The power distribution unit 17 is used to distribute the power from the external power supply 13 to various devices and power transistors that require power.

[0261] In this embodiment, placing the power distribution unit 17 on the top PCB board 700 is beneficial to improving the integration of the vehicle power supply device 10, enhancing the functionality and practicality of the vehicle power supply device 10, and the top PCB board 700, upper PCB board 200 and lower PCB board 300 are stacked and arranged in parallel, which can reduce the installation difficulty.

[0262] Please see Figure 40 and Figure 41 , Figure 40 This is a partial structural schematic diagram of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 41 This is a partial structural diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, a shielding cover 800 (e.g., ...) is provided between the upper PCB board 200 and the lower PCB board 300. Figure 40 (As shown). The shielding cover 800 is used to combine with the lower surface 260 of the upper PCB board 200 to form a control signal shielding cavity 800a (as shown). Figure 41 As shown), the control signal shielding cavity 800a is used to accommodate the control signal connector 2610. The shielding cover 800 is also used to combine with the upper surface 350 of the lower PCB board 300 to form a low-voltage filter shielding cavity 800b, which is used to accommodate at least a portion of the low-voltage filter circuitry (such as...). Figure 41 (As shown).

[0263] In this embodiment, the space between the upper PCB board 200 and the lower PCB board 300 is used to place the shielding cover 800, which can make full use of the space between the two PCB boards. Furthermore, the shielding cover 800 and the two PCB boards can form a shielding wall to shield the electrical components on the two PCB boards.

[0264] In this embodiment, the control signal connector 2610 and at least part of the low-voltage filter circuit 6400 are shielded and isolated by the shielding cover 800 to prevent the low-voltage filter circuit 6400 from interfering with the signal transmitted in the control signal connector 2610 and to improve the signal transmission quality.

[0265] Please refer to the following: Figure 41 , Figure 42 and Figure 43 , Figure 42 This is a schematic diagram of the structure of the shielding cover 800 provided in one embodiment of this application. Figure 43 This is a schematic diagram of the structure of a shielding cover 800 provided in one embodiment of this application. In one embodiment, the shielding cover 800 includes a first shielding cover 8100 disposed opposite to the vehicle power supply device 10 in the height direction X (e.g., ...). Figure 42 (as shown) and the second shielding cover 8110 (as shown) Figure 43 (As shown). The first shielding cover 8100 and the lower surface 260 of the upper PCB board 200 form a control signal shielding cavity 800a, which reduces electrical interference to the control signal connector 2610. The second shielding cover 8110 and the upper surface 350 of the lower PCB board 300 form a low-voltage filter shielding cavity 800b, which reduces electrical interference to the low-voltage filter circuit 6400.

[0266] In this embodiment, the control signal shielding cavity 800a can also be referred to as the first shielding cavity, and the low-voltage filter shielding cavity 800b can also be referred to as the second shielding cavity. The first shielding cover 8100 and the second shielding cover 8110 shield and isolate the control signal connector 2610 and at least part of the low-voltage filter circuit 6400 to avoid interference from the low-voltage filter circuit 6400 to the signal transmitted in the control signal connector 2610, thereby improving the signal transmission quality.

[0267] Please continue reading. Figure 40 In one embodiment, the shield 800 may also be called an LVDC shield. The shield 800 is used to shield the control signal connector 2610 located below the upper PCB board 200 and the low-voltage filter circuit 6400 located on the lower PCB board 300. The control signal connector 2610 is used to plug into the control signal interface 1320 on the outside of the bottom shell 100.

[0268] In this embodiment, the low-voltage filter circuit 6400 is also referred to as the LVDC filter 6400, which is used to filter out harmonics in the first DC power supply. The shielding cover 800 is located between the upper PCB board 200 and the lower PCB board 300 along the height direction X of the vehicle power supply device 10.

[0269] In this embodiment, a portion of the LVDC filter 6400 is fixed to the upper surface 350 of the lower PCB board 300, and a portion of the shielding cover 800 is located on the side close to the upper surface 350 of the lower PCB board 300. The portion of the shielding cover 800 is used to shield the portion of the LVDC filter 6400 located on the upper surface 350 of the lower PCB board 300.

[0270] In this embodiment, a partial shield 800 is located on the side near the lower surface 260 of the upper PCB board 200, and the partial shield 800 is used to shield the control signal connector 2610.

[0271] Please continue reading. Figure 41 , Figure 42 and Figure 43 In this embodiment, the first shielding cover 8100 is recessed toward the lower surface 260 away from the upper PCB board 200 (e.g., Figure 41 and Figure 42 As shown), the first shielding cover 8100 is disposed on the outside of the control signal connector 2610 along the height direction X of the vehicle power supply device 10. The second shielding cover 8110 is recessed toward the upper surface 350 away from the lower PCB board 300 (as shown). Figure 41 and Figure 43 As shown, the second shielding cover 8110 is disposed on the outside of part of the LVDC filter 6400 along the height direction X of the vehicle power supply device 10. The shielding cover 800 shields the control signal connector 2610 and part of the LVDC filter 6400 respectively, making full use of the space between the upper PCB board 200 and the lower PCB board 300. Moreover, the shielding cover 800 does not increase the volume occupied by the vehicle power supply device 10 in the height direction X, which is conducive to the miniaturization design of the vehicle power supply device 10.

[0272] Please see Figure 44 , Figure 44 This is a partial exploded view of the vehicle power supply device 10 provided in one embodiment of the present application. In one embodiment, the LVDC filter 6400 includes an LVDC filter capacitor 6430, which is located inside the second shield 8110.

[0273] In this embodiment, the LVDC filter capacitor 6430 is located on the upper surface 350 of the lower PCB board 300, and the second shielding cover 8110 is disposed on the outside of the LVDC filter capacitor 6430 along the height direction X of the vehicle power supply device 10. In one embodiment, the LVDC filter 6400 further includes an LVDC filter magnetic ring 6420. The LVDC filter capacitor 6430 and the LVDC filter magnetic ring 6420 form an LC circuit to achieve filtering of the first DC current.

[0274] Please see Figure 45 and Figure 46 , Figure 45 This is a schematic diagram of the structure of the first shield 8100 in the shield 800 provided in one embodiment of this application. Figure 46 This is a schematic diagram of the structure of the second shielding cover 8110 in the shielding cover 800 provided in one embodiment of this application. In one embodiment, the projected area of ​​the first shielding cover 8100 along the height direction X of the vehicle power supply device 10 on the upper PCB board 200 is smaller than the projected area of ​​the second shielding cover 8110 along the height direction X of the vehicle power supply device 10 on the upper PCB board 200 (in conjunction with...). Figure 45 and Figure 46 (As shown).

[0275] Please continue reading. Figure 44 In this embodiment, the vehicle power supply device 10 includes a front sidewall 130 and a rear sidewall 140 arranged opposite each other in the longitudinal direction Y. A first shielding cover 8100 is used to shield the control signal connector 2610, and a second shielding cover 8110 is used to shield a portion of the LVDC filter 6400. A portion of the LVDC filter 6400 is located on the side of the control signal connector 2610 away from the front sidewall 130 in the longitudinal direction Y, and the LVDC filter 6400 is relatively dispersed on the lower PCB board 300. Therefore, it is necessary to set the projected area of ​​the second shielding cover 8110 in the height direction X of the vehicle power supply device 10 to be larger than the projected area of ​​the first shielding cover 8100 in the height direction X of the vehicle power supply device 10, so that the shielding cover 8110 simultaneously satisfies the shielding effect for both the control signal connector 2610 and the LVDC filter 6400.

[0276] Please see Figure 42 and Figure 44 , Figure 42 This is a schematic diagram of the structure of the first shield 8100 in a shield 800 provided in one embodiment of this application. In one embodiment, the first shield 8100 includes a connector receiving groove 8101 and a signal filter receiving groove 8102 (e.g., ...). Figure 42 As shown), the signal filter receiving slot 8102 is located on the periphery of the connector receiving slot 8101, and the control signal connector 2610 is located inside the connector receiving slot 8101 (in conjunction with...). Figure 42 and Figure 44 As shown), the signal filter receiving slot 8102 is used to house the signal filter component 8103 (such as...). Figure 37 (As shown).

[0277] In this embodiment, the signal filtering device 8103 is used to filter the input signal. The signal filtering device 8103 is fixed to the lower surface 260 of the upper PCB board 200 and located on the periphery of the control signal connector 2610.

[0278] In this embodiment, the length of the signal filter component 8103 in the height direction X of the vehicle power supply device 10 is less than the length of the control signal connector 2610 in the height direction X of the vehicle power supply device 10. Therefore, the signal filter receiving groove 8102 is set in a stepped shape, and the bottom of the signal filter receiving groove 8102 is located on the side of the connector receiving groove 8101 away from the second shield 8110 in the height direction X.

[0279] This solution provides a connector receiving slot 8101 and a signal filter receiving slot 8102 in the first shielding cover 8100, enabling the first shielding cover 8100 to shield more devices, which is beneficial to enhancing the electromagnetic compatibility of the power conversion circuit 600.

[0280] Please refer to the following: Figure 43 and Figure 47 , Figure 47 This is a schematic diagram of the structure of a shielding cover 800 provided in one embodiment of this application. In one embodiment, the second shielding cover 8110 includes a filter receiving slot 8111 (e.g., Figure 43 As shown), the projection of the filter receiving slot 8111 along the height direction X of the vehicle power supply device 10 onto the upper PCB board 200 does not overlap with the projection of the connector receiving slot 8101 along the height direction X of the vehicle power supply device 10 onto the upper PCB board 200 (as shown). Figure 47 As shown), the recessed direction of the filter receiving groove 8111 is opposite to the recessed direction of the connector receiving groove 8101 (as shown). Figure 43 As shown), the filter housing slot 8111 is used to house part of the LVDC filter 6400.

[0281] In this embodiment, since both the filter receiving slot 8111 and the connector receiving slot 8101 need to occupy a certain space in the height direction X of the vehicle power supply device 10, and the concave direction of the filter receiving slot 8111 is opposite to that of the connector receiving slot 8101, the filter receiving slot 8111 and the connector receiving slot 8101 are arranged in an alternating manner in the height direction X of the vehicle power supply device 10, thereby improving the space utilization between the upper PCB board 200 and the lower PCB board 300.

[0282] In one embodiment, the LVDC filter 6400 is also referred to as a low-voltage filter circuit 6400, and the filter receiving slot 8111 is used to receive the LVDC filter capacitor 6430 (e.g., ...) in the LVDC filter 6400. Figure 38 or Figure 40 (As shown).

[0283] Please see Figure 48 , Figure 48 This is a schematic diagram of the shielding cover 800 and the base shell 100 provided in one embodiment of this application. In one embodiment, the shielding cover 800 is fixedly connected to the base shell 100 by screws.

[0284] In this embodiment, the shielding cover 800 is fixed to the bottom shell 100 with screws, which makes the shielding cover 800 more secure in the vehicle power supply device 10, which is conducive to the shielding cover 800 playing a stable shielding role.

[0285] Please see Figures 49 to 51 , Figure 49 This is a structural diagram of the shielding cover 800 and the upper PCB board 200. Figure 50 This is a structural diagram of the shielding cover 800 and the lower PCB board 300. Figure 51 This is a partial exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application. In one embodiment, the shielding cover 800 is fixedly connected to the upper PCB board 200 and the lower PCB board 300 by screws (in conjunction with...). Figure 49 and Figure 50 As shown). In the height direction X of the vehicle power supply device 10, the upper PCB board 200, the shielding cover 800, the lower PCB board 300, and the bottom shell 100 are stacked (as shown). Figure 51 (As shown).

[0286] Please see Figure 52 , Figure 52 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of the present application. In one embodiment, the vehicle power supply device 10 further includes a signal filter shield 820, an AC filter shield 830, and an HVDC filter shield 840 located above the upper PCB board 200. The AC filter shield 830 is used to shield the AC filter circuit of the power conversion circuit 600, and the HVDC filter shield 840 is used to shield the high voltage filter circuit of the power conversion circuit 600. The signal filter shield 820, the AC filter shield 830, and the HVDC filter shield 840 are fixed to the upper PCB board 200 and the bottom shell 100 by the fixing protrusion 1130 and the shielding protrusion 1120.

[0287] The AC filter circuit includes an AC filter 6100, which is used to filter out harmonics in the AC power. The high-voltage filter circuit includes an HVDC filter 6210, which is used to filter out harmonics in the second DC power.

[0288] In this embodiment, the signal filter shield 820, the AC filter shield 830, and the HVDC filter shield 840 are used to enhance the shielding effect on the signal transmission circuit, the AC filter circuit, and the high voltage filter circuit, respectively, which helps to improve the quality of signal transmission and reduce the electrical interference received by the power conversion circuit 600.

[0289] In this embodiment, the signal filter shield 820, AC filter shield 830, and HVDC filter shield 840 are all fixedly connected to the bottom shell 100 via the upper PCB board 200. Taking the AC filter shield 830 as an example, it is fixed by screws. The screws pass through the AC filter shield 830, the upper PCB board 200, and the bottom shell 100 in sequence along the height direction X of the vehicle power supply device 10, and are finally fixed to the fixing protrusion 1130 and the shielding protrusion 1120.

[0290] Please see Figure 53 , Figure 53 This is a schematic diagram of the signal filtering shield 820 and control signal connector 2610 provided in one embodiment of this application. In one embodiment, the orthographic projection of the signal filtering shield 820 on the upper PCB board 200 at least partially overlaps with the orthographic projection of the control signal connector 2610 on the upper PCB board 200. This allows the signal filtering shield 820 to effectively shield against external electromagnetic interference.

[0291] Please see Figure 54 and Figure 55 , Figure 54 This is a partial structural schematic diagram of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 55 This is a partial exploded view of the vehicle power supply device 10 provided in one embodiment of this application. In this embodiment, the signal filtering shield 820 is disposed near the upper front side 210 of the upper PCB board 200, and the signal filtering shield 820 covers at least part of the control signal connector 2610 in the height direction X. The signal filtering shield 820 and the shield 800 are located on both sides of the control signal connector 2610 in the height direction X, and are used to shield the influence of different devices on the control signal connector 2610: the signal filtering shield 820 is mainly used to shield the electrical interference generated by other devices on the upper PCB board 200, and the shield 800 is mainly used to shield the electrical interference generated by the LVDC filter 6400 on the lower PCB board 300.

[0292] Please see Figure 56 , Figure 56 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of the present application. In one embodiment, the orthographic projection of the AC filter shield 830 on the upper PCB board 200 at least partially overlaps with the orthographic projection of the AC filter 6100 on the upper PCB board 200.

[0293] In this embodiment, the vehicle power supply device 10 further includes a power connector 2600, which is used to connect to the power interface 1310. The power connector 2600 is fixed to the upper front side 210 of the upper PCB board 200 and is arranged sequentially with the AC filter 6100 along the front-rear direction Y of the vehicle power supply device 10. The power connector 2600 is electrically connected to the input end of the AC filter 6100. The AC filter shield 830 covers at least a portion of the power connector 2600 in the height direction X. This solution sets the AC filter shield 830 to shield the AC filter 6100 and the power connector 2600, increasing the shielding range that the AC filter shield 830 can cover, which is beneficial to improving the electromagnetic compatibility of the power conversion circuit 600 in the vehicle power supply device 10.

[0294] Among them, AC filter 6100 is the AC filter circuit of the power conversion circuit.

[0295] Please see Figure 57 , Figure 57 This is a partial structural diagram of the vehicle power supply device 10 provided in one embodiment of this application. In this embodiment, the AC filter shield 830 is disposed near the upper front side 210 of the upper PCB board 200, and the AC filter shield 830 covers at least a portion of the AC filter 6100 in the height direction X. This improves the shielding effect of the AC filter shield 830 on the AC filter 6100, thereby improving the electromagnetic compatibility of the power conversion circuit 600 in the vehicle power supply device 10.

[0296] Please see Figure 58 , Figure 58 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of the present application. In one embodiment, the orthographic projection of the HVDC filter shield 840 on the upper PCB board 200 at least partially overlaps with the orthographic projection of the HVDC filter 6210 on the upper PCB board 200.

[0297] In this embodiment, the vehicle power supply device 10 further includes a second DC connector 2620, which is used to connect to the second DC interface 1330 connector. The second DC connector 2620 is fixed to the upper front side 210 of the upper PCB board 200 and is arranged sequentially with the HVDC filter 6210 along the front-rear direction Y of the vehicle power supply device 10. The second DC connector 2620 is electrically connected to the input terminal of the HVDC filter 6210. The HVDC filter shield 840 covers at least part of the second DC connector 2620 in the height direction X. This solution sets the HVDC filter shield 840 to shield the HVDC filter 6210 and the second DC connector 2620, increasing the shielding range that the HVDC filter shield 840 can cover, which is beneficial to improving the electromagnetic compatibility of the power conversion circuit 600 in the vehicle power supply device 10.

[0298] Among them, the HVDC filter 6210 is the high-voltage filter circuit of the power conversion circuit.

[0299] Please see Figure 59 , Figure 59 This is a partial structural diagram of the vehicle power supply device 10 provided in one embodiment of this application. In this embodiment, the HVDC filter shield 840 is disposed near the upper front side 210 of the upper PCB board 200, and the HVDC filter shield 840 covers at least a portion of the HVDC filter 6210 in the height direction X. This improves the shielding effect of the HVDC filter shield 840 on the HVDC filter 6210, thereby improving the electromagnetic compatibility of the power conversion circuit 600 in the vehicle power supply device 10.

[0300] Please see Figure 60 , Figure 60 This is a partial structural schematic diagram of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the AC filter shield 830, the signal filter shield 820, and the HVDC filter shield 840 are arranged along the left-right direction Z of the on-board power supply device 10. The orthographic projections of the AC filter shield 830 and the HVDC filter shield 840 onto the upper PCB board 200 do not at least partially overlap with the orthographic projections of the lower PCB board 300 onto the upper PCB board 200.

[0301] In this embodiment, the arrangement of the AC filter shield 830, the signal filter shield 820, and the HVDC filter shield 840 on the upper surface 250 of the upper PCB board 200 corresponds to the arrangement of the AC filter 6100, the control signal connector 2610, and the HVDC filter 6210 on the lower surface 260 of the upper PCB board 200, so as to give full play to the shielding function of the AC filter shield 830, the signal filter shield 820, and the HVDC filter shield 840.

[0302] In one embodiment, the orthographic projections of the AC filter shield 830 and the HVDC filter shield 840 onto the upper PCB board 200 do not overlap with the orthographic projections of the lower PCB board 300 onto the upper PCB board 200. This improves the shielding effect of the AC filter shield 830 and the HVDC filter shield 840 on the AC filter 6100 and the HVDC filter, thereby improving the electromagnetic compatibility of the power conversion circuit 600 in the vehicle power supply device 10.

[0303] Please see Figure 61 , Figure 61 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one implementation, the AC filter shield 830 is closer to the upper left side 230 in the left-right direction Z and closer to the upper front side 210 in the front-rear direction Y. The length of the end of the AC filter shield 830 close to the upper left side 230 in the front-rear direction Y is greater than the length of the end of the AC filter shield 830 away from the upper left side 230 in the front-rear direction Y.

[0304] In this embodiment, the length of the AC filter shield 830 along the front-back direction Y at the end near the upper left side 230 is D5, and the length of the AC filter shield 830 along the front-back direction Y at the end away from the upper left side 230 is D6. This design sets D5 > D6. On one hand, this ensures that the end of the AC filter shield 830 near the upper left side 230 can cover a larger portion of the AC filter 6100, and also helps reduce the cost of the AC filter shield 830. On the other hand, since the AC filter shield 830 needs to be fixedly connected to the bottom shell 100 via the upper PCB board 200, the settings of D5 and D6 must ensure that the fixed position of the AC filter shield 830 to the upper PCB board 200 is not blocked by other components or the lower PCB board 300. If D5 is set to be equal to D6, there will not be enough space on the upper PCB board 200 for fixing the end of the AC filter shield 830 away from the upper left side 230. Therefore, this design sets D5 > D6, which helps reduce the installation difficulty of the AC filter shield 830.

[0305] Please continue reading. Figure 61 In one implementation, the HVDC filter shield 840 is close to the upper right side 240 along the left-right direction Z of the vehicle power supply device 10, and close to the upper front side 210 along the front-rear direction Y. The length of the end of the HVDC filter shield 840 close to the upper right side 240 along the front-rear direction Y is less than the length of the end of the HVDC filter shield 840 away from the upper right side 240 along the front-rear direction Y.

[0306] In this embodiment, the length of one end of the HVDC filter shield 840 close to the upper right side 240 in the front-back direction Y is D7, and the length of the other end of the HVDC filter shield 840 far from the upper right side 240 in the front-back direction Y is D8. In this solution, D7 < D8 is set. On the one hand, it enables the end of the HVDC filter shield 840 far from the upper right side 240 to cover a larger part of the HVDC filter 6210, and is beneficial to reducing the cost of the HVDC filter shield 840. On the other hand, since the HVDC filter shield 840 needs to be fixedly connected to the bottom case 100 through the upper-layer PCB board 200, the settings of D7 and D8 need to ensure that the position where the HVDC filter shield 840 is fixed to the upper-layer PCB board 200 is not blocked by other components and the lower-layer PCB board 300. If D3 is set to be equal to D4, there will not be enough space on the upper-layer PCB board 200 for fixing the end of the HVDC filter shield 840 close to the upper right side 240. Therefore, in this solution, D7 > D8 is set, which is beneficial to reducing the installation difficulty of the HVDC filter shield 840.

[0307] Please continue to refer to Figure 61 , in one implementation, the length of the signal filter shield 820 in the front-back direction Y of the vehicle-mounted power supply device 10 is less than the length of the end of the AC filter shield 830 far from the upper left side 230 in the front-back direction Y; or the length of the signal filter shield 820 in the front-back direction Y is less than the length of the end of the HVDC filter shield 840 close to the upper right side 240 in the front-back direction Y.

[0308] In this embodiment, the length of the signal filter shield 820 in the front-back direction Y is D9. By setting D6 < D9 or D7 < D9, on the premise of ensuring that the signal filter shield 820 can shield the control signal connector 2610, the manufacturing cost of the signal filter shield 820 and the installation area occupying the upper-layer PCB board 200 are reduced, which is beneficial to the miniaturization design of the vehicle-mounted power supply device 10.

[0309] Please refer to Figure 62 , Figure 62 is a schematic diagram of a partial structure of the vehicle-mounted power supply device 10 provided in an embodiment of the present application. In one embodiment, the AC filter shield 830, the signal filter shield 820, and the HVDC filter shield 840 are arranged in alignment with the side wall of the bottom case 100 provided with the electrical interface 1300. The radiator 400 is communicated with the cooling channel interface 1400 of the bottom case 100. The side wall where the electrical interface 1300 is located is disposed opposite to the side wall where the cooling channel interface 1400 is located.

[0310] In this embodiment, the electrical interface 1300 is located on the front sidewall 130 of the vehicle power supply device 10. The AC filter shield 830, signal filter shield 820, and HVDC filter shield 840 are all located close to the front sidewall 130 along the front-rear direction Y, which is beneficial for providing electrical shielding for the power conversion circuit 600 that is electrically connected to the electrical interface 1300. The cooling channel interface 1400 is located on the rear sidewall 140 of the vehicle power supply device 10, and the radiator 400 is located close to the rear sidewall 140 along the front-rear direction Y, which helps to shorten the distance that the coolant needs to travel from the external cooling system to the radiator 400, thereby improving the cooling effect of the coolant in the vehicle power supply device 10. The electrical interface 1300 and the cooling channel interface 1400 are arranged opposite each other. Since the electrical interface 1300 and the cooling channel interface 1400 are physically isolated, it is possible to prevent coolant from leaking from the cooling channel interface 1400 and affecting the electrical performance of the electrical interface 1300, and it is also beneficial to improve the safety performance of the vehicle power supply device 10.

[0311] In some other embodiments, the electrical interface 1300 may be located on other side walls of the bottom shell 100, as long as the electrical interface 1300 and the cooling channel interface 1400 are located on different side walls.

[0312] Please refer to the following: Figure 13 and Figure 63 , Figure 63 This is a cross-sectional view of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the base shell 100 includes a base plate 170 and four side walls. A lower PCB board 300 and a plurality of transformers 650 are fixed to the base plate 170. A heat sink 400 and an upper PCB board 200 are sequentially stacked on top of the lower PCB board 300 and the plurality of transformers 650 (e.g., Figure 13 (As shown). The radiator 400 includes an upper cooling channel 410 (as shown). Figure 63 As shown, the bottom shell 100 includes a lower cooling channel 180, and the upper cooling channel 410 and the lower cooling channel 180 of the bottom shell 100 are connected through a side wall.

[0313] In this embodiment, the power switching transistor 660 and the transformer 650 are heat-generating devices in the power conversion circuit 600. The power switching transistor 660 is distributed on the upper surface 250 of the upper PCB board 200 and the upper surface 350 of the lower PCB board 300. Multiple transformers 650 are fixed between the lower surface 260 of the upper PCB board 200 and the bottom shell 100. The upper cooling channel 410 in the heat sink 400 is located near the upper surface 250 of the upper PCB board 200, and the lower cooling channel 180 of the bottom shell 100 is located near the lower PCB board 300 and the multiple transformers 650. When the vehicle power supply device 10 is connected to the external cooling system, coolant flows into the upper cooling channel 410 and the lower cooling channel 180. The heat generated by the devices in different positions in the vehicle power supply device 10 can be carried away by the coolant. The upper cooling channel 410 and the lower cooling channel 180 cooperate with each other to improve the cooling effect.

[0314] In this embodiment, the bottom shell 100 includes four side walls: a front side wall 130, a rear side wall 140, a left side wall 150, and a right side wall 160. The rear side wall 140 is located along the height X direction of the vehicle power supply device 10 between the upper cooling channel 410 and the lower cooling channel 180, and both the upper cooling channel 410 and the lower cooling channel 180 are positioned close to the rear side wall 140 of the bottom shell 100. The absence of obstruction between the upper cooling channel 410 and the lower cooling channel 180 reduces resistance to the coolant flow within the vehicle power supply device 10, resulting in a faster flow rate and a larger flow volume. This accelerates the heat dissipation of heat-generating components, thereby improving the cooling effect of the coolant on the vehicle power supply device 10. In other embodiments, the upper cooling channel 410 and the lower cooling channel 180 may also be connected through other side walls of the bottom shell 100.

[0315] Please see Figure 64 and Figure 65 , Figure 64 This is a schematic diagram of the structure of the upper PCB board 200 and the heat sink 400 provided in one embodiment of this application. Figure 65 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the projected area of ​​the heat sink 400 on the upper PCB board 200 is smaller than the area of ​​the upper PCB board 200 (e.g., Figure 64 As shown), the orthographic projection of the heat sink 400 covers multiple transformers 650 and multiple power switching transistors 660 carried by the upper PCB board 200 (e.g., Figure 65 (As shown).

[0316] In this embodiment, the cross-section of the heat sink 400 and the surface of the upper PCB board 200 are both perpendicular to the height direction X of the vehicle power supply device 10. The heat sink 400 does not occupy a large area on the upper PCB board 200. On the one hand, this allows more space on the upper surface 250 of the upper PCB board 200 to install other components, improving the space utilization rate inside the vehicle power supply device 10. On the other hand, the heat sink 400 can be flexibly arranged on the upper PCB board 200 according to the location of the heat-generating components, achieving effective heat dissipation for the heat-generating components, improving the local heat dissipation effect, and helping to save on the manufacturing cost of the heat sink 400.

[0317] In this embodiment, the power switch 660 is one of the main heat sources of the power conversion circuit 600. The heat sink 400 is installed on the outside of the power switch 660 along the height direction X of the vehicle power supply device 10. When coolant is introduced into the heat sink 400, the coolant can carry away the heat generated by the power switch 660, thereby reducing the temperature of the power switch 660 under steady-state operation and realizing temperature control of the vehicle power supply device 10.

[0318] Please see Figure 66 , Figure 66 This is a schematic diagram of the upper cooling channel 410 and power switching transistors 660 provided in one embodiment of this application. In one embodiment, the upper cooling channel 410 in the heat sink 400 covers multiple power switching transistors 660 in its orthographic projection onto the upper PCB board 200.

[0319] In this embodiment, the heat sink 400 mainly achieves the cooling effect through the internal upper cooling channel 410. The upper cooling channel 410 and the power switching transistor 660 are both located on the upper surface 250 of the upper PCB board 200, and the orthographic projection of the upper cooling channel 410 on the upper PCB board 200 covers all the power switching transistors 660. This allows the coolant to cool and dissipate heat from all the power switching transistors 660 when flowing through the upper cooling channel 410, thereby improving the cooling efficiency of the heat sink 400.

[0320] Please refer to the following: Figure 3 and Figure 67 As shown, Figure 67 This is a schematic diagram of the structure of the cover plate 500 and the upper PCB board 200 provided in one embodiment of this application. In one embodiment, the vehicle power supply device 10 includes a cover plate 500 (e.g., Figure 3 As shown), the area of ​​the cover plate 500 is larger than the area of ​​the upper PCB board 200 (e.g. Figure 67 As shown), the gap between the cover plate 500 and the upper PCB board 200 is used to accommodate the heat sink 400 (as shown). Figure 3 (As shown).

[0321] The area of ​​cover plate 500 refers to the surface area of ​​cover plate 500 facing upper PCB board 200. The area of ​​upper PCB board 200 refers to the area of ​​its surface, specifically the area of ​​one of its surfaces, such as the upper or lower surface of upper PCB board 200. Similarly, the area of ​​lower PCB board 300 mentioned earlier refers to the area of ​​its upper or lower surface, which are generally the same.

[0322] In this embodiment, the cover plate 500 is located on the side of the upper PCB board 200 away from the bottom shell 100 along the height direction X of the vehicle power supply device 10. The cover plate 500 can completely cover the upper PCB board 200, facilitating a fixed connection between the cover plate 500 and the bottom shell 100 on the outside of the upper PCB board 200 to form a receiving cavity, protecting the power conversion circuit 600 from the influence of the external environment. The radiator 400 is located in the gap between the cover plate 500 and the upper PCB board 200. Even if coolant leaks from the radiator 400, the cover plate 500 prevents the leaked coolant from flowing out of the vehicle power supply device 10, reducing the impact of coolant leakage on the entire vehicle.

[0323] Please see Figure 68 , Figure 68 This is a schematic diagram of the structure of an upper cooling channel 410 provided in one embodiment of this application. In one embodiment, the upper cooling channel 410 includes an upper cooling channel body 4100 and an upper baffle 4110. The upper baffle 4110 is fixed inside the upper cooling channel body 4100 and is used to agitate the cooling medium inside the upper cooling channel body 4100.

[0324] In this embodiment, the upper baffle 4110 turbulents the coolant flowing into the upper cooling channel body 4100, enhancing convective heat transfer. Simultaneously, the upper baffle 4110 buffers the impact force of the coolant in a specific direction, improving heat dissipation. In this embodiment, the maximum surface of the upper baffle 4110 is perpendicular to the surface of the upper cooling channel body 4100. In other embodiments, the angle between the maximum surface of the upper baffle 4110 and the surface of the upper cooling channel body 4100 may be less than 90°.

[0325] In one embodiment, the upper baffle 4110 and the upper cooling channel body 4100 are integrally formed. In this embodiment, the upper cooling channel 410 is die-cast from sheet metal, wherein the protruding part is the upper baffle 4110 and the recessed part is the upper cooling channel body 4100.

[0326] Please see Figure 69 , Figure 69This is a schematic diagram of the upper cooling channel 410 provided in one embodiment of the present application. In one embodiment, the upper baffle 4110 includes a plurality of baffle sections 4111, and at least some of the baffle sections 4111 are arranged side by side and spaced apart.

[0327] In this embodiment, the turbulence sections 4111 are spaced apart, and the gap between every two parallel turbulence sections 4111 forms independent flow channels. After the coolant enters the upper cooling channel 410, it is divided into multiple branches by the turbulence sections 4111. These multiple branches flow in independent flow channels and exchange heat with the multiple power switching transistors 660. This design provides turbulence sections 4111 in the upper turbulence component 4110, thereby increasing the contact area between the coolant and the upper cooling channel 410.

[0328] Please see Figure 70 , Figure 70 This is a schematic diagram of the upper cooling channel 410 provided in one embodiment of the present application. In one embodiment, the upper baffle 4110 includes a plurality of baffle sections 4111, and some of the baffle sections 4111 are spaced apart along the extension direction of the baffle sections 4111.

[0329] In this embodiment, some of the turbulence sections 4111 are spaced apart along the extension direction of the turbulence sections 4111, while also being arranged side-by-side and spaced apart from other turbulence sections 4111. The gaps between the turbulence sections 4111 along the extension direction divide the upper cooling channel 410 into interconnected flow channels, while the gaps between the side-by-side turbulence sections 4111 divide the upper cooling channel 410 into independent flow channels. After the coolant enters the independent flow channels, it is divided into multiple branches. When the multiple branches flow through the gaps between the turbulence sections 4111, they converge into coolant and then re-enter the independent flow channels. At this time, when the coolant flows through the gaps between the turbulence sections 4111, it can flow into the gap between any two adjacent turbulence sections 4111, so that the flow channels of the coolant in the upper cooling channel 410 are interconnected, which helps to reduce the flow resistance of the coolant and improve the heat dissipation efficiency.

[0330] Please see Figure 71 , Figure 71 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the upper PCB board 200 is fixedly connected to the heat sink 400, and the heat sink 400 is fixedly connected to the bottom shell 100 through the upper PCB board 200.

[0331] In this embodiment, the heat sink 400, the upper PCB board 200 and the bottom shell 100 are arranged sequentially along the height direction X of the vehicle power supply device 10, and the heat sink 400, the upper PCB board 200 and the bottom shell 100 are fixedly connected by screws, so that the heat sink 400 is not easily disturbed by external forces when cooling the power switching tube 660, thereby improving the overall stability of the vehicle power supply device 10.

[0332] Please see Figure 72 , Figure 72 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the base plate 170 includes a base plate body 1700 and a sealing plate 1710 located outside the base plate body 1700. A lower cooling channel body 1800 is provided outside the base plate body 1700. The sealing plate 1710 is sealed to the lower cooling channel body 1800 and together they form the lower cooling channel 180.

[0333] In this embodiment, the lower cooling channel body 1800 is disposed opposite to the base plate body 1700. The outer side of the base plate body 1700 refers to the side away from the lower PCB board 300 and the upper PCB board 200 along the height direction X of the vehicle power supply device 10. In this solution, a sealing plate 1710 is provided in the base plate 170. On the one hand, the sealing plate 1710 is used to form the lower cooling channel 180 with the lower cooling channel body 1800. On the other hand, the sealing plate 1710 can prevent coolant leakage, so that after the coolant enters the lower cooling channel body 1800, it can cool and dissipate heat on the heat-generating devices located near the base plate body 1700 without affecting the normal operation of the heat-generating devices.

[0334] In one embodiment, the lower cooling channel body 1800 includes a sealing plate mounting portion 1801. The sealing plate 1710 is provided with a sealing plate mounting hole 1711 that penetrates through both end faces along the height direction X of the vehicle power supply device 10. The edge shape of the sealing plate 1710 matches the edge shape of the lower cooling channel body 1800. When the sealing plate mounting portion 1801 passes through the sealing plate mounting hole 1711, the sealing plate 1710 and the lower cooling channel body 1800 achieve a sealed connection.

[0335] Please see Figure 73 , Figure 73 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the lower cooling channel body 1800 is provided with at least one set of baffles 1802 and at least one set of baffles 1803. Each set of baffles 1802 has a plurality of baffles 1802 spaced apart, and each set of baffles 1803 has a plurality of baffles 1803 arranged side by side and spaced apart.

[0336] In this embodiment, when the coolant enters the lower cooling channel body 1800, the outer surfaces of the baffles 1802 and 1803 come into contact with the coolant. This design increases the contact area between the coolant and the lower cooling channel body 1800, enhancing the turbulence of the coolant. The gaps between the multiple baffles 1803 and the multiple baffles 1802 form flow channels. Furthermore, when the coolant flows through the gaps between the multiple baffles 1802, it can flow into the gap between any two adjacent baffles 1802, which helps reduce the flow resistance of the coolant and improve heat dissipation efficiency.

[0337] In one embodiment, the lower cooling channel body 1800 includes a lower channel inlet 1804 and a lower channel outlet 1805, which are arranged along the left-right direction Z of the vehicle power supply device 10. The lower cooling channel body 1800 includes three sets of baffles 1802 and one set of baffles 1803. The three sets of baffles 1802 are respectively referred to as baffles 1802a, baffles 1802b, and baffles 1802a. 802c, wherein the deflector teeth 1802a and 1802b are respectively located near the lower channel inlet 1804 and the lower channel outlet 1805 and are arranged along the left-right direction Z of the vehicle power supply device 10. The deflector tooth 1802c is located inside the lower cooling channel body 1800 on the side away from the lower channel inlet 1804. The deflector tooth 1802c, a set of deflector plates 1803, and the deflector tooth 1802a are arranged along the front-rear direction Y of the vehicle power supply device 10. In this embodiment, the coolant enters the lower cooling channel body 1800 from the lower channel inlet 1804 and flows out from the lower channel outlet 1805. During the process of entering and exiting the lower cooling channel body 1800, the coolant comes into contact with multiple deflector teeth 1802 and multiple deflector plates 1803. When heat is transferred from the heating device to the lower cooling channel body 1800, the cooling medium between the multiple baffles 1802 and the cooling medium between the multiple baffles 1803 exchange heat with the heating device, so that the power conversion circuit 600 can operate within a suitable temperature range.

[0338] In one embodiment, both the baffle tooth 1802 and the baffle plate 1803 are integrally formed with the base plate 170. When the baffle tooth 1802 and the baffle plate 1803 are subjected to external forces (such as the force of coolant), their positions will not move. This design helps to enhance the structural strength of the baffle tooth 1802 and the baffle plate 1803.

[0339] In one embodiment, the lower cooling channel body 1800 further includes a flow-blocking section 1806, which is used to block a portion of the lower cooling channel 180 near the lower channel inlet 1804 and a portion of the lower cooling channel 180 near the lower channel outlet 1805. One end of the flow-blocking section 1806 is located between the lower channel inlet 1804 and the lower channel outlet 1805, and the other end of the flow-blocking section 1806 is integrally formed with the sealing plate mounting portion 1801. The turbulence teeth 1802a, the turbulence section 4111, and the turbulence teeth 1802b are respectively located on both sides of the flow-blocking section 1806 in the left-right direction Z along the vehicle power supply device 10. It is understandable that the temperature of the coolant flowing out of the lower cooling channel body 1800 is higher than the temperature of the coolant entering the lower cooling channel body 1800 from the lower channel inlet 1804. This solution sets up a flow-blocking section 1806 in the lower cooling channel body 1800, which is beneficial to improving the heat dissipation efficiency of the coolant in the lower cooling channel 180.

[0340] In one embodiment, the lower cooling channel body 1800 and the base plate body 1700 are integrally formed.

[0341] In this embodiment, the lower cooling channel body 1800 is fixed to the base plate body 1700, so that the lower cooling channel body 1800 and the device fixed to the bottom shell 100 are also relatively fixed. When the lower cooling channel 180 is subjected to external force (such as the force of the coolant), it can maintain its position without moving. This solution helps to enhance the structural strength of the lower cooling channel body 1800, and at the same time enables the lower cooling channel body 1800 to stably cool and dissipate heat from the heat-generating device, freeing it from the influence of the external environment.

[0342] Please refer to the following: Figure 63 and Figure 72 In one embodiment, the cross-sectional area of ​​the lower cooling channel 180 is smaller than the area of ​​the base plate 170 (e.g., ...). Figure 72 As shown), the cross-section of the lower cooling channel 180 and the surface of the bottom plate 170 are both perpendicular to the height direction X of the on-board power supply device 10 (e.g., Figure 63 (As shown).

[0343] In this embodiment, the surface of the base plate 170 and the cross-sections of the upper cooling channel 410 and the lower cooling channel 180 are all perpendicular to the height direction X of the vehicle power supply device 10. The lower cooling channel 180 does not occupy a large area on the base plate 170. The lower cooling channel 180 can be flexibly arranged on the lower PCB board 300 according to the location of the heat-generating components, so as to effectively dissipate heat from the heat-generating components, improve the local heat dissipation effect, and help save the manufacturing cost of the lower cooling channel 180.

[0344] Please see Figure 74 and Figure 75 , Figure 74 This is a partial structural schematic diagram of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 75 This is a partial structural schematic diagram of an on-board power supply device 10 provided according to one embodiment of this application. In one embodiment, the base 100 further includes a side frame 190 surrounding the base plate 170 (e.g., Figure 74 As shown), a side cooling channel 1900 is provided in the side frame 190 (as shown). Figure 74 (As shown).

[0345] In this embodiment, the side frame 190 is generally annular and has two openings along the height direction X of the vehicle power supply device 10. The edge of one of the openings is fixed to the upper surface of the base plate 170, and the side frame 190 and the base plate 170 are recessed. The left side wall 150, right side wall 160, front side wall 130, and rear side wall 140 of the vehicle power supply device 10 constitute the side frame 190. The side cooling channel 1900 is formed in the side frame 190, wherein the side cooling channel 1900 is located in any one, two, three, or four of the left side wall 150, right side wall 160, front side wall 130, and rear side wall 140 (e.g., ...). Figure 75 (As shown). The side cooling channel 1900 surrounds part or all of the power conversion circuit 600. After the coolant flows into the side cooling channel 1900, it can cool and dissipate heat from the heat-generating components in the power conversion circuit 600 along the front-rear direction Y and the left-right direction Z of the vehicle power supply device 10.

[0346] In one embodiment, the side frame 190 and the base plate 170 are integrally formed. The side frame 190 and the base plate 170 are fixed, so that the side cooling channel 1900 in the side frame 190 and the power conversion circuit 600 are also relatively fixed. When the lower cooling channel 180 is subjected to external force (such as the force of the coolant), it can maintain its position without moving. The side cooling channel 1900 can stably dissipate heat from the heat-generating devices, so that the side cooling channel 1900 is protected from the influence of the external environment.

[0347] In one embodiment, the side cooling channel 1900 includes at least one of side baffles and side baffle teeth. This design, by incorporating side baffles and side baffle teeth, increases the contact area between the coolant and the side cooling channel 1900, thereby improving cooling efficiency.

[0348] In one embodiment, a portion of the side frame 190 is sealed to the base plate 170, and the side cooling channel 1900 in the side frame 190 is connected to the lower cooling channel 180. This design facilitates the formation of a three-dimensional water channel in the vehicle power supply device 10, allowing different parts of the heat-generating components to be cooled by the coolant.

[0349] Please refer to the following: Figure 27 and Figure 63 In one embodiment, the power conversion circuit 600 includes a PFC inductor 6120, a PFC capacitor 6110, and two transformers (e.g., PFC inductor 6120, PFC capacitor 6110, and two transformers). Figure 27 As shown), the lower cooling channel 180 and the bottom shell 100 are integrally formed. The PFC inductor 6120, PFC capacitor 6110, and two transformers are in contact with the bottom of the bottom shell 100 through thermally conductive material and are arranged flat above the lower cooling channel 180 and below the upper PCB board 200 (in combination with...). Figure 27 and Figure 63 (As shown).

[0350] The two transformers are an LLC transformer 6200 and a low-voltage transformer 6310. The capacitors, inductors, and transformers in the power conversion circuit 600 generate heat when in operation, requiring cooling channels for these heat-generating components.

[0351] In this embodiment, one end of the PFC inductor 6120, PFC capacitor 6110, LLC transformer 6200, and low-voltage transformer 6310 is positioned opposite to the upper cooling channel 410. The upper cooling channel 410, while cooling the power switching transistors, also provides some heat dissipation for the aforementioned heat-generating devices. The other ends of the PFC inductor 6120, PFC capacitor 6110, LLC transformer 6200, and low-voltage transformer 6310 contact the lower cooling channel 180 via a thermally conductive material. A portion of the heat generated by the heat-generating devices is transferred to the coolant in the lower cooling channel 180 via the thermally conductive material. The upper cooling channel 410 and lower cooling channel 180 cool the heat-generating devices from both sides along the height direction X of the vehicle power supply device 10, which enhances the heat dissipation effect. The thermally conductive materials include, but are not limited to, thermally conductive grease, thermally conductive silicone pads, and thermally conductive gel.

[0352] Please continue reading. Figure 63 The radiator 400 includes an upper cooling channel 410, the bottom shell 100 includes a lower cooling channel 180, and the rear sidewall 140 includes a cooling channel interface 1400. The cooling channel interface 1400 is used to connect the external cooling system with the lower cooling channel 180 and the upper cooling channel 410. The external cooling system is used to exchange cooling medium with the lower cooling channel 180 and the upper cooling channel 410 through the cooling channel interface 1400.

[0353] In this embodiment, the upper cooling channel 410 can be used to cool and dissipate heat from the power switching transistor 660 of the upper PCB board 200, and the lower cooling channel 180 can cool and dissipate heat from multiple transformers, inductors, capacitors and other components fixed to the bottom shell 100. Furthermore, the two cooling channels are connected through the cooling channel interface 1400, allowing the coolant to circulate between them, thereby improving the cooling effect uniformity of the vehicle power supply device 10 and enhancing the temperature uniformity of the vehicle power supply device 10.

[0354] Please continue reading. Figure 27 In one embodiment, the front sidewall 130 includes a power interface 1310, a second DC power interface 1330 and two first DC power interfaces 1340. The power interface 1310 and the second DC power interface 1330 are electrically connected to the upper PCB board 200, and the two first DC power interfaces 1340 are electrically connected to the lower PCB board 300.

[0355] In this embodiment, the power interface 1310, the second DC interface 1330, and the two first DC interfaces 1340 are electrical interfaces, all used for electrical transmission of the vehicle power supply device 10. The electrical interfaces are located on the front side wall 130, and the cooling channel interfaces are located on the rear side wall 140 opposite to the front side wall 130. This arrangement ensures a greater distance between the electrical interfaces and the cooling channel interfaces, preventing interference between electrical transmission and coolant transmission. This improves the working efficiency and safety performance of the vehicle power supply device 10.

[0356] In this embodiment, the power interface 1310 and the second DC interface 1330 are electrically connected to part of the power conversion circuit 600 of the upper PCB board 200, and the first DC interface 1340 is electrically connected to part of the power conversion circuit 600 of the lower PCB board 300, so that the upper PCB board 200 and the lower PCB board 300 undertake different electrical transmission tasks.

[0357] Please continue reading. Figure 63 In one embodiment, the cooling channel interface 1400 includes two radiator interfaces 1410, which are disposed on the upper surface of the rear sidewall 140. The two radiator interfaces 1410 are respectively used to connect the inlet and outlet of the upper cooling water channel. In this embodiment, the radiator interfaces 1410 connect the external cooling system and the upper cooling channel 410, and have a guiding effect on the coolant.

[0358] In one embodiment, the cooling channel interface 1400 further includes two external cooling system interfaces 1420. The external cooling system interfaces 1420 are disposed on the side surface of the rear side wall 140 opposite to the upper PCB board 200. The two external cooling system interfaces 1420 are respectively used to connect the outlet and inlet of the external cooling system. The coolant enters the cooling channel inside the vehicle power supply device 10 through the external cooling system interfaces 1420.

[0359] In one embodiment, the cooling channel interface 1400 further includes two bottom shell connection ports 1430, which are respectively used to connect the inlet and outlet of the lower cooling water channel. The bottom shell connection ports 1430 connect the external cooling system and the lower cooling channel 180, and have a guiding effect on the coolant. The external cooling system interface 1420 is connected to the radiator interface 1410 and the bottom shell connection ports 1430 respectively. The coolant enters the upper cooling channel 410 and the lower cooling channel 180 through the external cooling system interface 1420, flows through the upper cooling channel 410 and the lower cooling channel 180, and then flows out from the external cooling system interface 1420. In one embodiment, the radiator interface 1410 and the bottom shell connection ports 1430 are connected, so that the upper cooling channel 410 and the lower cooling channel 180 are connected, which helps to increase the contact area between the coolant and the vehicle power supply device 10.

[0360] Please see Figure 76 , Figure 76 This is a partial structural schematic diagram of the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the radiator interface 1410 is provided on the side frame 190, and the radiator interface 1410 is connected to both the upper cooling channel 410 and the lower cooling channel 180. The radiator interface 1410 is used to connect to an external cooling system. Coolant enters the upper cooling channel 410 and the lower cooling channel 180 through the radiator interface 1410, flows through the upper cooling channel 410 and the lower cooling channel 180, and then flows out from the radiator interface 1410.

[0361] In this embodiment, the side frame 190 and the radiator interface 1410 are located between the upper cooling channel 410 and the lower cooling channel 180 along the height direction X of the vehicle power supply device 10. The orthographic projections of the upper cooling channel 410 and the lower cooling channel 180 in the height direction X cover at least a portion of the orthographic projection of the radiator interface 1410 in the height direction X. This solution, by setting the radiator interface 1410, connects the upper cooling channel 410 and the lower cooling channel 180, which helps to increase the contact area between the coolant and the vehicle power supply device 10.

[0362] Please see Figure 77 , Figure 77This is a partial enlarged view of the vehicle power supply device 10 provided in one embodiment of the present application. In one embodiment, the radiator interface 1410 includes a first transfer channel 1411a and a second transfer channel 1411b arranged at Z intervals along the left and right direction of the vehicle power supply device 10. Both the first transfer channel 1411a and the second transfer channel 1411b are racetrack-shaped. Two external cooling system interfaces 1420a and 1420b are provided on the outer side of the bottom shell 100. One end of the external cooling system interface 1420a is connected to one end of the external cooling system interface 1420b through the first transfer channel 1411a, the upper cooling channel 410, the second transfer channel 1411b and the lower cooling channel 180. The other end of the external cooling system interface 1420a and the other end of the external cooling system interface 1420b are used to connect to the cooling device. This solution specifically describes the composition of the radiator interface 1410 and the path of the coolant inside the vehicle power supply device 10. The first adapter channel 1411a and the second adapter channel 1411b are set at intervals, which helps to avoid mutual interference between coolants of different temperatures, so that the heat dissipation effect of the coolant is not adversely affected.

[0363] Please refer to the following: Figure 77 and Figure 78 , Figure 78 This is a partial enlarged view of an on-board power supply device 10 provided in one embodiment of the present application. In one embodiment, the on-board power supply device 10 further includes a sealing ring 860. The sealing ring 860 is used to seal the first transition channel 1411a and the second transition channel 1411b in the height direction X of the on-board power supply device 10. The outer periphery of the first transition channel 1411a and the second transition channel 1411b is provided with a sealing groove 1412, and the sealing ring 860 is located in the sealing groove 1412. The sealing ring 860 in this solution can prevent coolant from leaking from the first transition channel 1411a and the second transition channel 1411b or even directly contacting the power conversion circuit 600, so as to effectively dissipate heat from the heat-generating components without affecting the normal operation of the on-board power supply device 10.

[0364] In one embodiment, the radiator interface 1410, the bottom shell connection port 1430, and the bottom shell 100 are integrally formed.

[0365] In this embodiment, the radiator interface 1410 and the bottom shell connection port 1430 are fixed to the bottom shell 100. When the radiator interface 1410 and the bottom shell connection port 1430 are subjected to external forces (such as the force of the coolant), they can maintain their position without moving. The radiator interface 1410 and the bottom shell connection port 1430 can stably transmit the coolant to the upper cooling channel 410 and the lower cooling channel 180, so that the coolant is protected from the influence of the external environment.

[0366] Please see Figure 79 , Figure 79 This is a partial structural schematic diagram of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the projections of the radiator 400 and the lower cooling channel 180 on the base plate 170 along the height direction X of the on-board power supply device 10 at least partially overlap.

[0367] In this embodiment, since the upper cooling channel 410 and the lower cooling channel 180 in the radiator 400 need to be connected through the radiator interface 1410, the projections of the upper cooling channel 410 and the lower cooling channel 180 along the height direction X on the base plate 170 are at least partially overlapping. This allows the coolant to travel a shorter path and experience less flow resistance when flowing between the upper cooling channel 410 and the lower cooling channel 180. Furthermore, the projection of a portion of the power conversion circuit 600 along the height direction X on the base plate 170 is located at the overlapping portion of the projections of the upper cooling channel 410 and the lower cooling channel 180, allowing the upper cooling channel 410 and the lower cooling channel 180 to cool the heat-generating components in this portion of the power conversion circuit 600 in different directions.

[0368] Please see Figure 80 and Figure 81 , Figure 80 A partial exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 81 A partial exploded view of the vehicle-mounted power supply device 10 provided in one embodiment of this application.

[0369] In one embodiment, the lower surface of the radiator 400 has a radiator communication portion 420 protruding toward the base shell 100 (e.g., Figure 80 As shown), the radiator interface 1410 has a connecting groove 1413 (as shown). Figure 81 As shown, the radiator connecting part 420 is located in the connecting groove 1413 and is connected to the radiator interface 1410.

[0370] In this embodiment, the connecting groove 1413 is recessed along the side away from the radiator 400 in the height direction X of the vehicle power supply device 10. The first adapter channel 1411a and the second adapter channel 1411b are located at the bottom of the connecting groove 1413. The radiator connecting part 420 is inserted and fixed in the connecting groove 1413, so that the first adapter channel 1411a and the second adapter channel 1411b are connected to the radiator connecting part 420.

[0371] To facilitate the operation of the mechanical connection, the two external cooling system interfaces 1420a and 1420b are typically located in the central area of ​​one side of the vehicle power supply unit 10. In this case, the heat dissipation structure also needs to be positioned close to the two external cooling system interfaces 1420a and 1420b in the height direction X of the vehicle power supply unit 10 to ensure proper connection and communication between the heat dissipation structure and the interfaces 1420a and 1420b. Therefore, the heat dissipation structure has a certain distance from the upper cooling channel 410 in the height direction X. This solution provides a radiator connecting part 420 in the radiator 400, which can compensate for the distance between the first transition channel 1411a, the second transition channel 1411b, and the upper cooling channel 410 in the height direction X, and guide the coolant entering the radiator interface 1410. The radiator interface 1410 is integrally formed with the bottom shell 100. The radiator interface 1410 is directly connected to the lower cooling channel 180. When the coolant enters the lower cooling channel 180 through the radiator interface 1410, it does not need to overcome the effect of gravity. Therefore, the lower cooling channel 180 does not have an additional connecting part.

[0372] In one embodiment, the radiator connection portion 420 includes a first connection hole 4200 and a second connection hole 4210 (e.g., spaced apart in the left-right direction Z along the vehicle power supply device 10) Figure 80 As shown, the first connecting hole 4200 is set in the height direction X of the vehicle power supply device 10 and corresponds to the first transfer channel 1411a. The second connecting hole 4210 is set in the height direction X of the vehicle power supply device 10 and corresponds to the second transfer channel 1411b. The first transfer channel 1411a is connected to the upper cooling channel 410 through the first connecting hole 4200, and the second transfer channel 1411b is connected to the upper cooling channel 410 through the second connecting hole 4210.

[0373] Please see Figure 82 , Figure 82 This is a partial exploded view of an on-board power supply device 10 provided in one embodiment of this application. In one embodiment, the radiator 400 includes two sheet metal parts stacked one on top of the other and two sealing interfaces 440 located at the same end of the sheet metal parts. The edges of the two sheet metal parts are sealed by brazing and form an upper cooling channel 410. The upper cooling channel 410 is connected to two radiator interfaces 1410 through the two sealing interfaces 440. The thickness of the sheet metal parts is less than the thickness of the bottom shell.

[0374] In this embodiment, the radiator 400 is made of sheet metal. The two sheet metal parts in the radiator 400 are the channel cover 430 of the upper cooling channel 410 and the upper cooling channel body 4100. The channel cover 430 is located on the side of the upper cooling channel 410 away from the upper PCB board 200 along the height direction X of the vehicle power supply device 10, and covers the outside of the upper cooling channel 410. The orthographic projection of the channel cover 430 on the upper PCB board 200 covers the orthographic projection of the upper cooling channel 410 on the upper PCB board 200, and the channel cover 430 is used to prevent coolant leakage from the upper cooling channel 410. The channel cover 430 is fixedly connected to the bottom shell 100 via the upper PCB board 200. For example, the fixing method is screw connection. The upper cooling channel 410 is fixed to the bottom shell 100, so that the upper cooling channel 410 is protected from external forces (such as the force of the coolant) and its position remains unchanged.

[0375] In this embodiment, the sealing interface 440 is disposed opposite to the heat sink communication portion 420 in the height direction X, and the sealing interface 440 is connected to the heat sink interface 1410 through the heat sink communication portion 420.

[0376] The sheet metal part is thinner than the bottom shell 100, which makes the radiator 400 lighter and conducts heat faster. It can transfer and absorb the heat of the power switching tube below the radiator 400, and improve the heat dissipation effect of the vehicle power supply device.

[0377] Please continue reading. Figure 15 In one embodiment, the bottom shell 100 includes a plurality of protrusions 110, which are respectively used to support at least one of the upper PCB board 200, the lower PCB board 300, or the heat sink 400.

[0378] In this embodiment, the upper PCB board 200, the lower PCB board 300, and the heat sink 400 are all spaced apart from the base plate 170 of the bottom shell 100. Therefore, if at least one of the upper PCB board 200, the lower PCB board 300, and the heat sink 400 is to be fixedly connected to the bottom shell 100, multiple protrusions 110 need to be provided on the base plate 170 to compensate for the spacing in the height direction X. The multiple protrusions 110 provide support for at least one of the upper PCB board 200, the lower PCB board 300, and the heat sink 400. The upper PCB board 200 and the lower PCB board 300 are fixed to the bottom shell 100, so that the power conversion circuit 600 installed on the upper PCB board 200 and the lower PCB board 300 is also relatively fixed to the bottom shell 100, which helps to enhance the anti-interference performance of the vehicle power supply device against external forces.

[0379] In one embodiment, a plurality of protrusions 110 are used to support each of the upper PCB board 200, the lower PCB board 300, or the heat sink 400.

[0380] Please see Figure 83 , Figure 83 This is a schematic diagram of the structure of the bottom shell 100 in the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the plurality of protrusions 110 of the bottom shell 100 include a first protrusion 1100 and a second protrusion 1110. The first protrusion 1100 is used to fix the lower PCB board 300, and the second protrusion 1110 is used to fix the upper PCB board 200 and the heat sink 400. The height of the second protrusion 1110 along the height direction X of the vehicle power supply device 10 is greater than the height of the first protrusion 1100.

[0381] In this embodiment, a portion of the power conversion circuit 600 is provided on both the upper PCB board 200 and the lower PCB board 300. The upper PCB board 200 and the lower PCB board 300 are fixed to the bottom shell 100 by the second protrusion 1110 and the first protrusion 1100, respectively, so that the power conversion circuit 600 on the upper PCB board 200 and the lower PCB board 300 are also relatively fixed to the bottom shell 100. When the vehicle power supply device 10 is affected by the external environment, the position of the power conversion circuit 600 can be kept unchanged, so that it can stably perform the power conversion function.

[0382] In this embodiment, the power conversion circuit 600 installed on the upper PCB board 200 needs to occupy a certain volume in the height direction X of the vehicle power supply device 10. The upper PCB board 200 is fixed to the base plate 170 by the second protrusion 1110. Therefore, the height of the second protrusion 1110 is set to be greater than the height of the first protrusion 1100. This means that in the height direction X, the distance between the upper PCB board 200 and the base plate 170 is greater than the distance between the lower PCB board 300 and the base plate 170, providing installation space for larger components in the power conversion circuit 600.

[0383] In this embodiment, the height relationship between the first protrusion 1100 and the second protrusion 1110 also causes the upper PCB board 200 to be positioned close to the upper cooling channel 410 of the heat sink 400, and the lower PCB board 300 to be positioned close to the lower cooling channel 180 of the bottom shell 100. The upper cooling channel 410 and the lower cooling channel 180 form a three-dimensional channel, which can dissipate heat for the components in different parts of the vehicle power supply device 10 and improve the cooling efficiency of the coolant.

[0384] Please continue reading. Figure 5In this embodiment, along the height direction X of the vehicle-mounted power supply device 10, the upper PCB board 200, the lower PCB board 300, and the bottom shell 100 are arranged sequentially. Therefore, the distance between the inner surfaces of the upper PCB board 200 and the bottom shell 100 is greater than the distance between the inner surfaces of the lower PCB board 300 and the bottom shell 100. The second protrusion 1110 and the first protrusion 1100 are used to connect with the upper PCB board 200 and the lower PCB board 300, respectively. Therefore, the height of the second protrusion 1110 needs to be greater than the height of the first protrusion 1100 to reduce the difficulty of fixing the upper PCB board 200 to the bottom shell 100. The difference in height between the second protrusion 1110 and the first protrusion 1100 also helps to distinguish the second protrusion 1110 and the first protrusion 1100 from their shapes, allowing for quick fixing of the upper PCB board 200 and the lower PCB board 300 to the bottom shell 100 during actual operation.

[0385] Please continue reading. Figure 83 In one embodiment, the plurality of protrusions 110 include a plurality of shielding protrusions 1120, and the upper PCB board 200 and the heat sink 400 are sequentially stacked and fixed on the plurality of shielding protrusions 1120. Wherein, two shielding protrusions 1120 combined to form a shielding area, or a shielding protrusion combined with a sidewall to form another shielding area, and the orthographic projection of the upper PCB board 200 covers one shielding area and the other shielding area.

[0386] In this embodiment, the upper PCB board 200 and the heat sink 400 are fixed to the bottom shell by the shielding protrusion 1120. When the vehicle power supply device 10 is subjected to the force applied by the external environment, the heat sink 400 and the bottom shell 100 are not prone to relative displacement, which is beneficial to improving the overall structural stability of the vehicle power supply device 10.

[0387] In this embodiment, the upper PCB board 200 covers multiple shielding areas by its orthogonal projection along the height direction X of the vehicle power supply device 10, so that some of the power conversion circuits 600 fixed to the upper PCB board 200 can extend into the shielding areas, thereby improving the electrical shielding effect.

[0388] Please continue reading. Figure 83 In one embodiment, at least one shielding protrusion 1120 among the plurality of protrusions 110 includes a fixed post 1122 and a shielding wall 1121 connected to each other. The fixed post 1122 is used to fix at least one of the upper PCB board 200 and the heat sink 400. The shielding wall 1121 is arranged along the left-right direction Z or the front-back direction Y of the vehicle power supply device 10.

[0389] In this embodiment, the shielding protrusion 1120 is a second protrusion 1110. Therefore, in the height direction X of the vehicle power supply device 10, on the one hand, the height of the fixing post 1122 of the shielding protrusion 1120 is greater than the height of the first protrusion 1100, so that the upper PCB board 200 and the heat sink 400 fixed to the fixing post 1122 are also higher than the lower PCB fixed to the first protrusion 1100, providing sufficient installation space for the power conversion circuit 600. On the other hand, the height of the shielding wall 1121 of the shielding protrusion 1120 is greater than the height of the first protrusion 1100, so that the devices located on different sides of the shielding wall 1121 are shielded and isolated by the shielding wall 1121. The shielding wall 1121 extends in the vehicle power supply device 10 along the left-right direction Z or the front-back direction Y, so that in addition to providing a shielding effect, the shielding wall 1121 also divides the bottom shell 100 into multiple shielding areas.

[0390] Please continue reading. Figure 13 In one embodiment, at least one shielding protrusion 1120 is used to fix the upper PCB board 200 and the heat sink 400 in sequence. The heat sink 400 and the upper PCB board 200 are stacked on the at least one shielding protrusion 1120 in sequence, and the gap between the at least one shielding protrusion 1120 and the upper PCB board 200 is filled with conductive adhesive.

[0391] In this embodiment, the shielding protrusion 1120 serves both as electrical shielding and as a support and fixation mechanism. The heat sink 400, the upper PCB board, and the bottom shell 100 are fixed together by screws, which pass through the fixing posts 1122 of the heat sink 400, the upper PCB board 200, and the shielding protrusion 1120 in sequence along the height direction X.

[0392] Please see Figure 84 , Figure 84 This is a schematic diagram of the structure of the shielding protrusion 1120 provided in one embodiment of this application. In this embodiment, when the fixed post 1122 and the shielding wall 1121 are at the same height in the height direction X of the vehicle power supply device 10, the upper PCB board 200 is in direct contact with the shielding wall 1121. At this time, the contact area between the upper PCB board 200 and the second protrusion 1110 is large, making the upper PCB board 200 more tightly fixed to the bottom shell 100 through the second protrusion 1110.

[0393] It should be noted that, due to factors such as assembly tolerances, design tolerances, and structural flatness, in this embodiment, the heights of the fixing column 1122 and the shielding wall 1121 in the height direction X of the vehicle-mounted power supply device 10 are highly likely to be unequal. Those skilled in the art should understand that such deviations are unavoidable and acceptable. Please refer to... Figure 85 , Figure 85This is a schematic diagram of the shielding protrusion 1120 provided in one embodiment of this application. In this embodiment, when the height of the fixing post 1122 in the height direction X of the vehicle power supply device 10 is greater than the height of the shielding wall 1121 in the height direction X of the vehicle power supply device 10, the upper PCB board 200 only contacts the fixing post 1122, and there is a gap between the shielding wall 1121 and the upper PCB board 200. At this time, conductive adhesive can be filled at the gap. On the one hand, it can make up for the height difference between the fixing post 1122 and the shielding wall 1121, making the connection between the upper PCB board 200 and the second protrusion 1110 more stable. On the other hand, since the conductive adhesive is conductive, a conductive path is formed between the upper PCB board 200 and the shielding wall 1121, which can improve the shielding effect of the shielding wall 1121 on the power conversion circuit 600.

[0394] Please refer to the following: Figure 83 and Figure 86 , Figure 86 This is a schematic diagram of the structure of the bottom shell 100 and the upper PCB board 200 provided in one embodiment of the present application. In one embodiment, the bottom shell 100 includes a plurality of first protrusions 1100 and two shielding protrusions 1120 (e.g., Figure 83 As shown), multiple first protrusions 1100 are distributed in the area of ​​the bottom shell 100 between two shielding protrusions 1120 (e.g., Figure 83 As shown), the height of the plurality of first protrusions 1100 along the height direction X of the vehicle power supply device 10 is less than the height of the two shielding protrusions 1120 (in conjunction with...). Figure 83 and Figure 86 (As shown). Multiple first protrusions 1100 are used to fix the lower PCB board 300, and two shielding protrusions 1120 are used to fix the upper PCB board 200. The two shielding protrusions 1120 and the upper PCB board 200 constitute the lower PCB board shielding area 1140. The lower PCB board shielding area 1140 is used to reduce electrical interference received by the lower PCB board 300 (such as...). Figure 83 (As shown).

[0395] In this embodiment, the lower PCB board 300 is located in the lower PCB board shielding area 1140 between the two shielding protrusions 1120. The lower PCB board 300, with its lower height, is fixed to the bottom shell 100 by the lower first protrusion 1100, while the upper PCB board 200, with its higher angle, is fixed by the higher shielding protrusion 1120. This allows the upper and lower PCB boards 300 to be stacked and fixed to the bottom shell 100 in sequence, thereby improving the overall structural strength of the vehicle power supply device 10 and reducing its size. Furthermore, the shielding protrusions 1120 can reuse the upper PCB board to form the lower PCB board shielding area 1140, which helps to ensure the shielding effect of the shielding protrusions 1120 on the lower PCB board 300, resulting in less electrical interference between the lower PCB board 300 and the devices located on the other side of the shielding protrusions 1120. In this embodiment, the shielding protrusions 1120 can simultaneously serve as support, fixation, and shielding.

[0396] Please see Figure 87 , Figure 87 This is a schematic diagram of the structure of the bottom shell 100 and the power conversion circuit 600 provided in one embodiment of the present application. In one embodiment, the power conversion circuit 600 includes an AC filter 6100 and an HVDC filter 6210. One of the two shielding protrusions 1120 is used to reduce the electrical interference of the AC filter 6100 of the power conversion circuit 600 to the lower PCB board 300, and the other shielding protrusion 1120 is used to reduce the electrical interference of the HVDC filter 6210 of the power conversion circuit 600 to the lower PCB board 300.

[0397] In this embodiment, the two shielding protrusions 1120 are respectively referred to as the first shielding protrusion 1120a and the second shielding protrusion 1120b. The first shielding protrusion 1120a, the lower PCB board 300 and the second shielding protrusion 1120b are arranged in the left-right direction Z along the vehicle power supply device 10. The lower PCB board 300 is located between the first shielding protrusion 1120a and the second shielding protrusion 1120b. The AC filter 6100 is located between the left side wall 150 and the first shielding protrusion 1120a, and the HVDC filter is located between the right side wall 160 and the second shielding protrusion 1120b. Part of the power conversion circuit 600 is mounted on the lower PCB board 300 and electrically connected to the lower PCB board 300. Therefore, along the left-right direction Z of the vehicle power supply device 10, the first shielding protrusion 1120a can provide electrical shielding for the AC filters 6100 on both sides and the lower PCB board 300, and the second shielding protrusion 1120b can provide electrical shielding for the HVDC filters 6210 on both sides and the lower PCB board 300. The lower PCB board 300 is simultaneously shielded by the first shielding protrusion 1120a and the second shielding protrusion 1120b.

[0398] Please continue reading. Figure 87 In one embodiment, the base shell 100 includes at least one of a first shielding protrusion 1120a, a second shielding protrusion 1120b, a third shielding protrusion 1120c, and a fourth shielding protrusion 1120d. The first shielding protrusion 1120a is used to reduce electrical interference between the AC filter 6100 and the lower PCB board 300. The second shielding protrusion 1120b is used to reduce electrical interference between the HVDC filter 6210 and the lower PCB board 300. The third shielding protrusion 1120c is used to reduce electrical interference between the PFC capacitor 6110 and the PFC inductor 6120, and between the PFC capacitor 6110 and the low-voltage transformer 6310. The fourth shielding protrusion 1120d is used to reduce electrical interference between the PFC inductor 6120 and the low-voltage transformer 6310.

[0399] Please continue reading. Figure 87 In one embodiment, the power conversion circuit 600 includes an AC filter 6100, and the bottom shell 100 includes a first shielding protrusion 1120a. The first shielding protrusion 1120a includes a first fixing post 1122a and a first shielding wall 1121a connected together. The first fixing post 1122a is used to fix the upper PCB board 200 and the AC filter shielding cover 830. The first shielding wall 1121a is arranged along the Y-direction of the vehicle power supply device 10. The first shielding wall 1121a, the left side wall 150 of the bottom shell 100, and the AC filter shielding cover 830 constitute an AC filter shielding area 1141, which is used to accommodate the AC filter 6100 of the power conversion circuit 600.

[0400] In this embodiment, the AC filter 6100 is used to receive alternating current from an external power source and filter out harmonics in the alternating current. The AC filter shielding area 1141 is used to reduce electrical interference between the AC filter 6100 and electrical components outside the AC filter shielding area 1141. In one embodiment, considering factors such as design tolerances, assembly tolerances, and installation space requirements, the AC filter shielding area 1141 may not be a completely enclosed area.

[0401] In this embodiment, the first shielding wall 1121a is spaced apart from the left side wall 150, and a portion of the first shielding protrusion 1120a extends along the longitudinal direction Y of the vehicle power supply device 10, while a portion of the first shielding protrusion 1120a extends along the lateral direction Z of the vehicle power supply device 10. Specifically, the first shielding wall 1121a extending along the longitudinal direction Y electrically shields the AC filter 6100 from devices located on the other side of the first shielding wall 1121a along the lateral direction Z, and the first shielding wall 1121a extending along the lateral direction Z electrically shields the AC filter 6100 from devices located on the other side of the first shielding wall 1121a along the longitudinal direction Y.

[0402] In this embodiment, the AC filter 6100 is positioned opposite the shielding area of ​​the AC filter 6100 in the height direction X of the vehicle power supply device 10, facilitating the housing 100 to accommodate the AC filter 6100. The shielding area of ​​the AC filter 6100 consists of six sides. In other embodiments, the shielding area of ​​the AC filter 6100 may consist of five sides, as long as the electrical shielding effect is not affected.

[0403] Please continue reading. Figure 87 In one embodiment, the power conversion circuit 600 includes an HVDC filter 6210, and the bottom shell 100 includes a second shielding protrusion 1120b. The second shielding protrusion 1120b includes a second fixing post 1122b and a second shielding wall 1121b connected together. The second fixing post 1122b is used to fix the upper PCB board 200 and the HVDC filter shielding cover 840. The second shielding wall 1121b is arranged along the Y-direction of the vehicle power supply device 10. The second shielding wall 1121b, the right side wall 160 of the bottom shell 100, and the HVDC filter shielding cover 840 constitute an HVDC filter shielding area 1142, which is used to accommodate the HVDC filter 6210 of the power conversion circuit 600.

[0404] In this embodiment, the HVDC filter 6210 is used to filter out harmonics of the second AC current, and the HVDC filter shielding area 1142 is used to reduce electrical interference between the HVDC filter 6210 and electrical components outside the HVDC filter shielding area 1142. In one embodiment, considering factors such as design tolerances, assembly tolerances, and installation space requirements, the HVDC filter shielding area 1142 may not be a completely closed area.

[0405] In this embodiment, the second shielding wall 1121b is spaced apart from the right side wall 160, and a portion of the second shielding protrusion 1120b extends along the longitudinal direction Y of the vehicle power supply device 10, while a portion of the second shielding protrusion 1120b extends along the lateral direction Z of the vehicle power supply device 10. Specifically, the second shielding wall 1121b extending along the longitudinal direction Y electrically shields the HVDC filter 6210 from devices located on the other side of the second shielding wall 1121b along the lateral direction Z, and the second shielding wall 1121b extending along the lateral direction Z electrically shields the HVDC filter 6210 from devices located on the other side of the second shielding wall 1121b along the longitudinal direction Y.

[0406] In this embodiment, the HVDC filter 6210 is positioned opposite the HVDC filter shielding area 1142 in the height direction X of the vehicle power supply device 10, facilitating the housing 100's containment of the HVDC filter 6210. The HVDC filter shielding area 1142 consists of six sides. In other embodiments, the HVDC filter 6210 shielding area may consist of five sides, as long as the electrical shielding effect is not affected.

[0407] Please continue reading. Figure 87 In one embodiment, the power conversion circuit 600 includes an AC / DC conversion circuit 610, which includes a PFC capacitor 6110 and a PFC inductor 6120. The bottom housing 100 includes a third shielding protrusion 1120c, which includes a connected third fixing post 1122c and a third shielding wall 1121c. The third fixing post 1122c is used to fix the upper PCB board 200 and the heat sink 400. The third shielding wall 1121c is arranged along the Y-direction of the vehicle power supply device 10 and is arranged side-by-side with the left side wall 150 of the bottom housing 100. The third shielding wall 1121c, together with the left side wall 150, the rear side wall 140, and the upper PCB board 200, forms a PFC capacitor shielding area 1143, which accommodates the PFC capacitor 6110 of the AC / DC conversion circuit 610. The third shielding wall 1121c is used to reduce electrical interference between the PFC capacitor 6110 and the PFC inductor 6120 of the AC / DC conversion circuit 610.

[0408] In this embodiment, the AC / DC conversion circuit 610 is used to convert AC power to DC power. The PFC capacitor 6110 and PFC inductor 6120 are arranged along the Z-direction of the vehicle power supply device 10. The PFC capacitor shielding area 1143 is used to reduce electrical interference between the PFC capacitor 6110 and electrical components outside the PFC capacitor shielding area 1143. In one embodiment, considering factors such as design tolerances, assembly tolerances, and installation space requirements, the PFC capacitor shielding area 1143 may not be a completely enclosed area.

[0409] In this embodiment, the third shielding protrusion 1120c is spaced apart from the left side wall 150, and the PFC capacitor 6110 is located between the left side wall 150 and the third shielding wall 1121c. The third shielding protrusion 1120c electrically isolates the PFC capacitor 6110 and PFC inductor 6120 located on both sides of the third shielding wall 1121c in the left-right direction Z.

[0410] In one embodiment, the third shielding protrusion 1120c includes a fixing post and a support wall adjacent to the fixing post, wherein the support wall is used to improve the manufacturability of the fixing post. The shape of the support wall is not limited. In this embodiment, the shielding wall in the third shielding protrusion 1120c serves as a support wall for functioning as a fixing post.

[0411] In one embodiment, the third shielding protrusion 1120c shielding wall can be used to shield electrical interference and also to improve the machinability of the fixed column.

[0412] Please continue reading. Figure 87 In one embodiment, the power conversion circuit 600 includes a low-voltage transformer 6310, and the base 100 includes a fourth shielding protrusion 1120d, which includes a fourth fixing post 1122d and a fourth shielding wall 1121d connected together. The fourth fixing post 1122d is used to fix the upper PCB board 200 and the heat sink 400. The fourth shielding wall 1121d is arranged along the left-right direction Z of the vehicle power supply device 10 and is arranged parallel to the side wall of the base 100 where the cooling channel interface 1400 is located. The fourth shielding wall 1121d is used to reduce electrical interference between the low-voltage transformer 6310 and the PFC inductor 6120 of the low-voltage DC-DC conversion circuit 630.

[0413] In this embodiment, the low-voltage DC-DC converter circuit 630 is used to convert the second DC power into the first DC power. In the front-rear direction Y of the vehicle power supply device 10, the low-voltage transformer 6310 is located between the lower PCB board 300 and the PFC inductor 6120.

[0414] In this embodiment, the low-voltage transformer 6310, the fourth shielding protrusion 1120d, and the PFC inductor 6120 are arranged along the front-rear direction Y of the vehicle power supply device 10. The fourth shielding protrusion 1120d can provide electrical shielding for the low-voltage transformer 6310 and the PFC inductor 6120 on both sides of the fourth shielding wall 1121d along the front-rear direction Y.

[0415] In one embodiment, the fourth shielding protrusion 1120d includes a fixing post and a supporting wall adjacent to the fixing post, wherein the supporting wall is used to improve the manufacturability of the fixing post. The shape of the supporting wall is not limited. In this embodiment, the shielding wall in the third shielding protrusion 1120c serves as a supporting wall for the fixing post.

[0416] In one embodiment, the shielding wall of the fourth shielding protrusion 1120d can be used to shield electrical interference and also to improve the machinability of the fixed column.

[0417] Please refer to the following: Figure 87 and Figure 88 In one embodiment, the bottom shell 100 includes a first shielding protrusion 1120a, a second shielding protrusion 1120b, a third shielding protrusion 1120c, and a fourth shielding protrusion 1120d (e.g., Figure 88 As shown), the power conversion circuit 600 includes an AC filter 6100, an HVDC filter 6210, a low-voltage transformer 6310, a PFC capacitor 6110, and a PFC inductor 6120 (as shown). Figure 87 (As shown). Wherein: the first shielding protrusion 1120a and the second shielding protrusion 1120b are used to fix the upper PCB board 200 and form the lower PCB board shielding area 1140 with the upper PCB board 200 (e.g., ...). Figure 24 and Figure 87 As shown), the lower PCB shielding area 1140 is used to accommodate the lower PCB 300 and reduce electrical interference between the AC filter 6100 and the lower PCB 300, and between the HVDC filter 6210 and the lower PCB 300 (in conjunction with...). Figure 87 and Figure 88 (As shown).

[0418] In this embodiment, the AC filter 6100, HVDC filter 6210, low-voltage transformer 6310, PFC capacitor 6110, and PFC inductor 6120 are arranged around the periphery of the lower PCB board. When the vehicle power supply device 10 is in operation, some power conversion circuits 600 mounted on the lower PCB board will interfere with the surrounding components. Therefore, the lower PCB board shielding area 1140 can reduce the electrical interference between the lower PCB board 300 and the electrical components outside the lower PCB board shielding area 1140. The first shielding protrusion 1120a is used to shield the lower PCB board 300 and the AC filter 6100, and the second shielding protrusion 1120b is used to shield the lower PCB board 300 and the HVDC filter 6210. In one embodiment, considering factors such as design tolerances, assembly tolerances, and installation space requirements, the lower PCB board shielding area 1140 may not be a completely closed area.

[0419] Please see Figure 89 , Figure 89 This is a schematic diagram of the structure of the third shielding protrusion 1120c and the fourth shielding protrusion 1120d according to one embodiment of this application. In one embodiment, the third shielding protrusion 1120c and the fourth shielding protrusion 1120d constitute a T-shaped shielding structure. The T-shaped shielding structure is used to reduce electrical interference between the low-voltage transformer 6310, the PFC capacitor 6110, and the PFC inductor 6120. In this embodiment, in addition to providing electrical shielding for the PFC capacitor 6110 and the PFC inductor 6120, the third shielding protrusion 1120c can also reduce electrical interference between the PFC inductor 6120 and the low-voltage transformer 6310, further improving the electromagnetic compatibility of the vehicle power supply device 10.

[0420] In one embodiment, the front end of the third shielding protrusion 1120c is connected to the first shielding protrusion 1120a. The rear end of the third shielding protrusion 1120c can be connected to the rear sidewall 140. This enhances the overall structural strength and improves the shielding effect.

[0421] In one embodiment, the front end of the first shielding protrusion 1120a is connected to the front sidewall. This enhances the overall structural strength and improves the shielding effect.

[0422] In one embodiment, the left end of the fourth shielding protrusion 1120d is connected to the third shielding protrusion 1120c. This enhances the overall structural strength and improves the shielding effect.

[0423] Please refer to the following: Figure 12 and Figure 88In one embodiment, the bottom shell 100 includes a first shielding protrusion 1120a, a second shielding protrusion 1120b, and a fifth shielding protrusion 1120e, and the power conversion circuit 600 includes a first DC interface 1340 (e.g., Figure 12 As shown), the first DC interface 1340 is used to transmit the first DC power output from the power conversion circuit 600. The first shielding protrusion 1120a and the second shielding protrusion 1120b are arranged along the front-rear direction Y of the vehicle power supply device 10 (as shown). Figure 88 As shown), the fifth shielding protrusion 1120e is arranged in the Z-direction along the left and right sides of the vehicle power supply device 10 (as shown). Figure 88 As shown), the first shielding protrusion 1120a, the second shielding protrusion 1120b, and the fifth shielding protrusion 1120e combine to form the first DC interface shielding area 1144 (as shown). Figure 88 As shown), the first DC interface shielding area 1144 is used to accommodate part of the first DC interface 1340 (in conjunction with...). Figure 12 and Figure 88 (As shown).

[0424] In this embodiment, the low-voltage DC-DC converter circuit 630 supplies power to the first type of load 15 through the first DC interface 1340. The first DC interface shielding area 1144 is used to reduce electrical interference between the first DC interface 1340 and electrical components outside the first DC interface shielding area 1144. In one embodiment, considering factors such as design tolerances, assembly tolerances, and installation space requirements, the first DC interface shielding area 1144 may be a partially enclosed area.

[0425] In this embodiment, one end of the first DC power interface 1340 extends into the bottom shell 100 and is electrically connected to the lower PCB board 300. Therefore, the shielding area 1144 of the first DC power interface partially overlaps with the shielding area 1140 of the lower PCB board. The fifth shielding protrusion 1120e is spaced apart from the front sidewall 130. The first DC power interface 1340 is located between the first shielding protrusion 1120a and the second shielding protrusion 1120b. The first shielding protrusion 1120a can shield the electrical interference between the first DC power interface 1340 and the AC filter 6100, the second shielding protrusion 1120b can shield the electrical interference between the first DC power interface 1340 and the HVDC filter 6210, and the fifth shielding protrusion 1120e can shield the electrical interference between the first DC power interface 1340 and the lower PCB board 300.

[0426] Please continue reading. Figure 87In one embodiment, the first shielding protrusion 1120a includes three first fixing posts 1122a and a first shielding wall 1121a. Along the front-rear direction Y of the vehicle power supply device 10, the three first fixing posts 1122a are sequentially connected to the first shielding wall 1121a and are used to fix the signal filtering shielding cover 820, the upper PCB board 200, the upper PCB board 200 and the heat sink 400, respectively.

[0427] In this embodiment, the arrangement direction of the three first fixing posts 1122a corresponds to the arrangement direction of the signal filtering shield 820 and the heat sink 400. Specifically, the first fixing post 1122a closest to the front sidewall 130 is used to fix the signal filtering shield 820, the first fixing post 1122a closest to the rear sidewall 140 is used to fix the upper PCB board 200 and the heat sink 400, and the first fixing post 1122a in the middle position is used to fix the upper PCB board 200. The three first fixing posts 1122a of the first shielding protrusion 1120a can shield three different devices, demonstrating the multifunctionality of the shielding protrusion in the vehicle power supply device 10.

[0428] Please continue reading. Figure 12 In one embodiment, the fifth shielding protrusion 1120e includes two fifth fixing posts 1122e and a fifth shielding wall 1121e. Along the left-right direction Z of the vehicle power supply device 10, the two fifth fixing posts 1122e are sequentially connected to the fifth shielding wall 1121e. The two fifth fixing posts 1122e are used to fix the lower PCB board 300 and the shielding cover 800. Along the height direction Y of the vehicle power supply device 10, the height of the two fifth fixing posts 1122e and the height of the fifth shielding wall 1121e are less than the height of the first fixing post 1122a and the height of the first shielding protrusion 1120a.

[0429] In this embodiment, the shielding cover 800 is used to shield the low-voltage filter circuit 6400, which is electrically connected to the first DC power interface 1340. The low-voltage filter circuit 6400 is used to filter out harmonics in the first DC power. The shielding cover 800 is fixedly connected to the bottom shell through the fifth fixing post 1122e, so that the shielding cover 800 can stably provide electrical isolation to the low-voltage filter circuit 6400 and enhance the shielding effect against electromagnetic interference.

[0430] In this embodiment, the low-voltage filter circuit 6400 and the first DC power interface 1340 are both electrically connected to the lower PCB board 300. The lower PCB board 300 is located on the side of the upper PCB board 200 away from the bottom shell 100 along the height direction X. The first shielding protrusion 1120a is fixed to the upper PCB board. Therefore, it is necessary to set the height of the fifth fixing post 1122e and the height of the fifth shielding wall 1121e to be smaller than the height of the first fixing post 1122a and the height of the first shielding protrusion 1120a, so as to adapt to the height relationship between the upper PCB board 200 and the lower PCB board 300 and optimize the overall layout of the vehicle power supply device 10.

[0431] Please refer to the following: Figure 19 , Figure 88 and Figure 90 , Figure 88 This is a schematic diagram of the structure of the bottom shell 100 in the vehicle-mounted power supply device 10 provided in one embodiment of this application. Figure 90 This is a schematic diagram of the structure of the base shell 100 in the vehicle power supply device 10 provided in one embodiment of this application. In one embodiment, the base plate 170 includes a first shielding protrusion 1120a, a second shielding protrusion 1120b, a third shielding protrusion 1120c, and a fourth shielding protrusion 1120d (e.g., Figure 90 (As shown). Wherein: the first shielding protrusion 1120a and the second shielding protrusion 1120b constitute the mounting area 1701 of the lower PCB board (as shown). Figure 90 As shown), the lower PCB mounting area 1701 is used to accommodate the lower PCB 300 (as shown). Figure 19 (As shown). The first shielding protrusion 1120a and the right side wall 160 constitute the AC filter mounting area 1702 (as shown). Figure 90 As shown), the AC filter mounting area 1702 is used to accommodate the AC filter 6100 (as shown). Figure 19 (As shown). The second shielding protrusion 1120b and the left side wall 150 constitute the HVDC filter mounting area 1720 (as shown). Figure 90 As shown), the HVDC filter mounting area 1720 is used to accommodate the HVDC filter 6210 (as shown). Figure 19 (As shown). The third shielding protrusion 1120c and the right side wall 160 constitute the PFC capacitor mounting area 1730 (as shown). Figure 90 As shown), the PFC capacitor mounting area 1730 is used to accommodate the PFC capacitor 6110 (as shown). Figure 19 (As shown). The fourth shielding protrusion 1120d and the rear sidewall 140 constitute the PFC inductor mounting area 1740 (as shown). Figure 90 As shown), the PFC inductor mounting area 1740 is used to accommodate the PFC inductor 6120 (as shown). Figure 19 (As shown).

[0432] In this embodiment, the first shielding protrusion 1120a, the second shielding protrusion 1120b, the third shielding protrusion 1120c, and the fourth shielding protrusion 1120d divide the base plate 170 into multiple mounting areas, including a lower PCB board mounting area 1701, an AC filter mounting area 1702, an HVDC filter mounting area 1720, a PFC capacitor mounting area 1730, and a PFC inductor mounting area 1740. Setting up mounting areas helps to improve the ease of installation of the power conversion circuit 600 and can also provide a certain degree of protection for the components inside the mounting areas.

[0433] In this embodiment, the first shielding protrusion 1120a is spaced apart from the left side wall 150, and is located between the AC filter 6100 and the lower PCB board 300 along the left-right direction Z of the vehicle power supply device 10. The second shielding protrusion 1120b is spaced apart from the right side wall 160, and is located between the HVDC filter 6210 and the lower PCB board 300 along the left-right direction Z of the vehicle power supply device 10. The third shielding protrusion 1120c is spaced apart from the left side wall 150, and is located between the PFC capacitor 6110 and the PFC inductor 6120 along the left-right direction Z of the vehicle power supply device 10. The fourth shielding protrusion 1120d is spaced apart from the rear side wall 140, and is located between the low-voltage transformer 6310 and the PFC inductor 6120 along the front-rear direction Y of the vehicle power supply device 10. The first shielding protrusion 1120a, the second shielding protrusion 1120b, the third shielding protrusion 1120c, and the fourth shielding protrusion 1120d provide electrical shielding between different devices in the power conversion circuit 600, thereby improving the electromagnetic compatibility (EMC) of the power conversion circuit 600.

[0434] In one embodiment, the first shielding protrusion 1120a, the second shielding protrusion 1120b, the third shielding protrusion 1120c, and the fourth shielding protrusion 1120d are integrally formed with the bottom shell 100, so that the first shielding protrusion 1120a, the second shielding protrusion 1120b, the third shielding protrusion 1120c, and the fourth shielding protrusion 1120d can stably provide electrical isolation to the devices on both sides, thereby enhancing the shielding effect against electromagnetic interference.

[0435] Please continue reading. Figure 88 In one embodiment, the bottom shell 100 includes an AC filter limiting groove 1200 for accommodating an AC filter 6100. The AC filter limiting groove 1200 is located between the lower PCB board 300 and the left side wall 150, and is positioned closer to the front side wall 130 than the rear side wall 140.

[0436] In this embodiment, the AC filter limiting groove 1200 is located within the AC filter shielding area 1141, making flexible use of the existing installation space of the bottom shell 100 without increasing the volume of the vehicle power supply device 10.

[0437] Please continue reading. Figure 88 In one embodiment, the bottom shell 100 includes a PFC capacitor limiting groove 1210 and a PFC inductor limiting groove 1220. The PFC capacitor limiting groove 1210 is used to accommodate a PFC capacitor 6110, and the PFC inductor limiting groove 1220 is used to accommodate a PFC inductor 6120.

[0438] In this embodiment, the PFC capacitor limiting groove 1210 is located within the PFC capacitor shielding area 1143, making flexible use of the existing installation space of the bottom shell 100 without increasing the volume of the vehicle power supply device 10.

[0439] Please continue reading. Figure 88 In one embodiment, the bottom shell 100 includes an LLC transformer limiting groove 1230 for accommodating an LLC transformer 6200. The PFC capacitor limiting groove 1210, the PFC inductor limiting groove 1220 and the LLC transformer limiting groove 1230 are arranged in the left-right direction Z along the vehicle power supply device 10.

[0440] In this embodiment, the LLC transformer limiting groove 1230 is rectangular, and its shape matches the shape of the end face of the LLC transformer 6200 facing the LLC transformer limiting groove 1230.

[0441] Please continue reading. Figure 88 In one embodiment, the bottom shell 100 includes a low-voltage transformer limiting groove 1240 for accommodating a low-voltage transformer 6310.

[0442] In this embodiment, the low-voltage transformer limiting groove 1240 is located in the area between the PFC capacitor limiting groove 1210 and the LLC transformer limiting groove 1230, and in the area between the peripheral space of the lower PCB board 300 and the PFC inductor limiting groove 1220, making flexible use of the existing installation space of the bottom shell 100 without increasing the volume of the vehicle power supply device 10.

[0443] Please continue reading. Figure 88 In one embodiment, the bottom shell 100 includes an HVDC filter limiting groove 1260 for accommodating an HVDC filter 6210.

[0444] In this embodiment, the HVDC filter limiting groove 1260 is located within the PFC capacitor shielding area 1143, making flexible use of the existing installation space of the bottom shell 100 without increasing the volume of the vehicle power supply device 10.

[0445] Please continue reading. Figure 88 In one embodiment, AC filter limiting slot 1200, PFC capacitor limiting slot 1210, PFC inductor limiting slot 1220, LLC transformer limiting slot 1230, low voltage transformer limiting slot 1240, and HVDC filter limiting slot 1260 are arranged around the periphery of the lower PCB board 300.

[0446] In this embodiment, multiple limiting slots surround the periphery of the lower PCB board 300. Correspondingly, the AC filter 6100, PFC capacitor 6110, PFC inductor 6120, low-voltage transformer 6310, LLC transformer 6200, and HVDC filter 6210 surround the periphery of the lower PCB board 300. In this case, in the height direction X of the vehicle power supply device 10, the height of the aforementioned components is not limited by the distance between the upper PCB board 200 and the lower PCB board 300. Components with higher heights or larger volumes can be placed around the periphery of the lower PCB board 300, flexibly utilizing the internal mounting area of ​​the vehicle power supply device 10, improving space utilization, and facilitating the miniaturization design of the vehicle power supply device 10. The shape of the aforementioned limiting slots can be set according to the shape of the corresponding components.

[0447] The vehicle-mounted power supply device and vehicle provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and embodiments of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. Furthermore, for those skilled in the art, based on the ideas of this application, there will be changes in specific embodiments and application scope. Therefore, the content of this specification should not be construed as a limitation of this application. In this specification, the illustrative descriptions of various implementation methods do not necessarily refer to the same embodiments or examples, and the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples.

Claims

1. A power supply device for a vehicle, characterized by comprising: The vehicle-mounted power supply device comprises a power conversion circuit, an upper PCB board, a lower PCB board, a bottom shell and a radiator, the lower PCB board, the upper PCB board and the radiator are sequentially stacked and fixed on the bottom shell, wherein: The power conversion circuit comprises a plurality of power switching tubes and a plurality of transformers; The upper PCB board is used to carry a part of the plurality of power switching tubes, and the lower PCB board is used to carry another part of the plurality of power switching tubes, the area of the upper PCB board is greater than the area of the lower PCB board, and the lower PCB board and the plurality of transformers are arranged in a tiling manner below the upper PCB board; The bottom shell is used to support the upper PCB board, the lower PCB board, the radiator and the plurality of transformers, the area of the radiator is smaller than the area of the upper PCB board, and the radiator is arranged in a stacking manner above the part of the power switching tubes carried by the upper PCB board along the stacking direction of the upper PCB board and the lower PCB board.

2. The on-board power supply device according to claim 1, characterized in that The vehicle-mounted power supply device comprises a cover plate, the cover plate is used to combine with the bottom shell to form a receiving cavity, and the receiving cavity is used to accommodate the lower PCB board, the upper PCB board, the radiator and the plurality of transformers, wherein: The lower PCB board, the upper PCB board, the radiator and the cover plate are sequentially stacked along the height direction of the vehicle-mounted power supply device.

3. The on-board power supply device according to claim 1, characterized in that, The power conversion circuit comprises an AC / DC conversion circuit, a low-voltage DC conversion circuit and a high-voltage DC conversion circuit, wherein: The AC / DC conversion circuit is used to receive AC power and supply power for at least one of the high-voltage DC conversion circuit or the low-voltage DC conversion circuit; The low-voltage DC conversion circuit is used to receive power supply from at least one of the AC / DC conversion circuit or the high-voltage DC conversion circuit and output first DC power; The high-voltage DC conversion circuit is used to receive power supply from the AC / DC conversion circuit and output second DC power, and the voltage of the second DC power is higher than that of the first DC power.

4. The on-board power supply device according to claim 3, characterized in that The low-voltage DC conversion circuit comprises a low-voltage transformer, a primary side circuit and a secondary side circuit, the primary side circuit is used to receive power supply from at least one of the AC / DC conversion circuit or the high-voltage DC conversion circuit, and the secondary side circuit is used to output first DC power, wherein: The upper PCB board is used to carry a plurality of power switching tubes of the primary side circuit of the low-voltage DC conversion circuit; The lower PCB board is used to carry a plurality of power switching tubes of the secondary side circuit of the low-voltage DC conversion circuit; The bottom shell is used to fix the low-voltage transformer of the low-voltage DC conversion circuit.

5. The in-vehicle power supply device according to claim 1, characterized by The bottom shell comprises a plurality of first protrusions and two shielding protrusions, the plurality of first protrusions are distributed in the region of the bottom shell between the two shielding protrusions, and the height of the plurality of first protrusions is smaller than the height of the two shielding protrusions along the height direction of the vehicle-mounted power supply device, wherein: The plurality of first protrusions are used to fix the lower PCB board; The two shielding protrusions are used to fix the upper PCB board; The two shielding protrusions and the upper PCB board constitute a lower PCB board shielding area, and the lower PCB board shielding area is used to reduce electrical interference received by the lower PCB board.

6. The on-board power supply device according to claim 1, characterized in that The bottom shell comprises a bottom plate, a front sidewall, a rear sidewall, a left sidewall and a right sidewall, the front sidewall and the rear sidewall are oppositely arranged, the left sidewall and the right sidewall are oppositely arranged, and the bottom plate, the front sidewall, the rear sidewall, the left sidewall and the right sidewall constitute a groove structure, wherein: In the height direction of the vehicle-mounted power supply device, the height of any one of the front sidewall, the rear sidewall, the left sidewall and the right sidewall is greater than the height of the upper PCB board.

7. The on-board power supply device according to claim 6, characterized in that The lower PCB board and the plurality of transformers are arranged in a tiled manner above the bottom plate, and the orthographic projection of the lower PCB board on the bottom plate is dislocated from the orthographic projection of the heat sink on the bottom plate.

8. The on-board power supply device according to claim 6, characterized in that The front sidewall comprises a plurality of electrical interfaces, and the rear sidewall comprises a cooling channel interface. The lower PCB board is closer to the front sidewall than the heat sink, and the lower PCB board and the upper PCB board are used to electrically connect at least one of the plurality of electrical interfaces; The heat sink is closer to the rear sidewall than the lower PCB board, and the heat sink is used to connect the cooling channel interface.

9. The in-vehicle power supply device according to claim 6, characterized by, The front sidewall comprises a first direct current interface and a control signal interface, the power conversion circuit outputs first direct current through the first direct current interface and receives a control signal through the control signal interface, wherein: The lower surface of the upper PCB board comprises a control signal connector, and the control signal connector is used to electrically connect the control signal interface and the upper PCB board. The upper surface of the lower PCB board comprises at least part of a low-voltage filter circuit, and the low-voltage filter circuit is used to electrically connect the first direct current interface and the lower PCB board.

10. The in-vehicle power supply device according to claim 9, characterized by A shielding cover is arranged between the upper PCB board and the lower PCB board, and the shielding cover is used to: combine with the lower surface of the upper PCB board to form a control signal shielding cavity, the control signal shielding cavity is used to accommodate the control signal connector, combine with the upper surface of the lower PCB board to form a low-voltage filter shielding cavity, and the low-voltage filter shielding cavity is used to accommodate at least part of the low-voltage filter circuit.

11. The in-vehicle power supply device according to claim 6, characterized by The heat sink comprises an upper cooling channel, the bottom shell comprises a lower cooling channel, the rear sidewall comprises a cooling channel interface, the cooling channel interface is used to communicate an external cooling system with the lower cooling channel and the upper cooling channel, and the external cooling system is used to exchange cooling medium with the lower cooling channel and the upper cooling channel through the cooling channel interface.

12. The on-board power supply device according to claim 11, characterized in that The cooling channel interface comprises: two heat sink interfaces arranged on the upper surface of the rear sidewall, the two heat sink interfaces are respectively used to communicate the inlet and outlet of the upper cooling water channel; two external cooling system interfaces arranged on the side surface of the rear sidewall away from the upper PCB board, the two external cooling system interfaces are respectively used to communicate the outlet and inlet of the external cooling system; Two bottom shell connection ports for connecting the inlet and outlet of the lower cooling water channel, respectively.

13. The on-board power supply device according to claim 6, characterized in that, The power conversion circuit comprises an AC filter, a PFC capacitor, a PFC inductor, a low-voltage transformer, an LLC transformer and an HVDC filter, wherein: The PFC capacitor, the PFC inductor and the LLC transformer are arranged adjacent to the rear side wall of the on-board power supply device; The PFC capacitor and the AC filter are arranged adjacent to the right side wall of the on-board power supply device; The HVDC filter and the LLC transformer are arranged adjacent to the left side wall of the on-board power supply device.

14. The on-board power supply device according to claim 13, characterized in that The bottom plate comprises a first shielding protrusion, a second shielding protrusion, a third shielding protrusion and a fourth shielding protrusion, wherein: The first shielding protrusion and the second shielding protrusion constitute a lower PCB mounting area for accommodating the lower PCB; The first shielding protrusion and the right side wall constitute an AC filter mounting area for accommodating the AC filter; The second shielding protrusion and the left side wall constitute an HVDC filter mounting area for accommodating the HVDC filter; The third shielding protrusion and the right side wall constitute a PFC capacitor mounting area for accommodating the PFC capacitor; The fourth shielding protrusion and the rear side wall constitute a PFC inductor mounting area for accommodating the PFC inductor.

15. A vehicle characterized by comprising: The on-board power supply device as claimed in any one of the preceding claims, wherein the power conversion circuit is configured to output a first DC power and a second DC power, the first DC power being configured to be transmitted to the first type of load for powering, and the second DC power being configured to be transmitted to the battery for powering, the voltage of the second DC power being greater than the voltage of the first DC power.

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