Buffers, bales and bundles

Abstract

The present invention relates to a cushioning member, a packing member, and a packaged article. The cushioning member is characterized in that it is accommodated in a packing box capable of accommodating an electronic device and cushions an external force applied to the electronic device accommodated in the packing box. The cushioning member comprises: a first retaining member including a first plate and a second plate, the first plate being opposed to the electronic device when the cushioning member and the electronic device are accommodated in the packing box, and the second plate being opposed to an inner wall surface of the packing box when the cushioning member and the electronic device are accommodated in the packing box; and a first buffer block provided between the first plate and the second plate.

Description

Technical Field

[0001] The present disclosure relates to a cushioning member, a bundle and a bundled article. Background Art

[0002] There is known a cushioning member that is housed in a packaging box capable of housing an electronic device and cushions external forces applied to the electronic device. For example, Patent Document 1 discloses a technique for cushioning external forces applied to an electronic device by using a cushioning member including two plate-like members.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2018-131268

[0004] However, in the prior art, there is a hollow structure between the two plate-like components. Therefore, in the prior art, when an external force is applied to the buffer, the two plate-like components may sometimes contact each other and fail to buffer the external force. Summary of the invention

[0005] In order to solve the above technical problems, the buffer member involved in the present disclosure is characterized in that it is housed in a packing box that can accommodate an electronic device, and buffers external force applied to the electronic device accommodated in the packing box, and the buffer member includes: a first retaining member including a first plate and a second plate, the first plate being opposite to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the second plate being opposite to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; and a first buffer block arranged between the first plate and the second plate.

[0006] In addition, the packing material involved in the present disclosure is characterized in that it includes: a packing box capable of accommodating an electronic device; and a buffer member accommodated in the packing box and buffering an external force applied to the electronic device accommodated in the packing box, the buffer member including: a first retaining member including a first plate and a second plate, the first plate being opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the second plate being opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; and a first buffer block provided between the first plate and the second plate.

[0007] Furthermore, the packaged article according to the present disclosure is characterized in that it comprises: an electronic device; a packing box capable of housing the electronic device; and a buffer member housed in the packing box for buffering an external force applied to the electronic device housed in the packing box, the buffer member comprising: a first retaining member including a first plate and a second plate, the first plate being opposed to the electronic device when the buffer member and the electronic device are housed in the packing box, the second plate being opposed to an inner wall surface of the packing box when the buffer member and the electronic device are housed in the packing box; and a first buffer block provided between the first plate and the second plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is an exploded perspective view showing an example of the configuration of the packing material 1 according to the embodiment of the present disclosure.

[0009] Figure 2 It is a perspective view showing an example of the structure of the shock absorbing material S.

[0010] Figure 3 It is a plan view showing an example of the shape of the plate member HH.

[0011] Figure 4 1 is a cross-sectional view showing an example of the structure of the shock absorbing material S.

[0012] Figure 5 It is a cross-sectional view showing an example of the structure of the shock absorbing material SW according to the reference example.

[0013] Figure 6 It is an exploded perspective view showing an example of the structure of the shock absorbing material SA according to the modification 1 of the present disclosure.

[0014] Figure 7 It is a perspective view showing an example of the structure of the shock absorbing material SA.

[0015] Figure 8 It is an exploded perspective view showing an example of the structure of shock absorbing material SB according to Modification 2 of the present disclosure.

[0016] Fig. 9 It is a perspective view showing an example of the structure of shock absorbing material SB.

[0017] Fig.10 It is an exploded perspective view showing an example of the configuration of a packing material 1C according to Modification 3 of the present disclosure.

[0018] Fig.11 It is a plan view showing an example of the shape of the plate member HHC.

[0019] Fig.12 It is an exploded perspective view showing an example of the configuration of a packing material 1D according to Modification 4 of the present disclosure.

[0020] Fig.13 It is a plan view showing an example of the shape of the plate member HHD. DETAILED DESCRIPTION

[0021] The following is an explanation of the method for implementing the present disclosure with reference to the accompanying drawings. In each figure, the size and proportion of each part are appropriately different from the actual one. In addition, since the implementation method described below is an ideal specific example of the present disclosure, various technically preferred limitations are added, but unless there is a special intention to limit the present disclosure in the following description, the scope of the present disclosure is not limited to these methods.

[0022] A. Implementation Method

[0023] Below, refer to Figures 1 to 4 , an example of the structure of the packing material 1 according to the present embodiment will be described.

[0024] 1. About packaging items

[0025] Figure 1 It is an exploded perspective view showing an example of the structure of the packing material 1.

[0026] like Figure 1 In the illustrated example, the packing material 1 houses the electronic device 100. Specifically, the packing material 1 includes: a packing box 2 capable of housing the electronic device 100; and a plurality of buffer members S for buffering external force applied to the electronic device 100 housed in the packing box 2.

[0027] Here, the electronic device 100 is, for example, a printing device such as an inkjet printer, etc. However, in the present embodiment, the electronic device 100 may be a device other than a printing device such as a television, a refrigerator, a washing machine, a microwave oven, or a personal computer.

[0028] In addition, in the following, the packaging material 1 and the electronic device 100 accommodated in the packaging material 1 may be referred to as a “packaged article”.

[0029] like Figure 1 As an example, in this embodiment, it is assumed that the package 1 has eight cushioning members S-1 to S-8. In this embodiment, the electronic device 100 and the eight cushioning members S-1 to S-8 are inserted into the package box 2 through the opening 20 of the package box 2 and are accommodated in the package box 2.

[0030] In the following, for convenience of explanation, the parcel box coordinate system ΣW fixed to the parcel box 2 is introduced. The parcel box coordinate system ΣW is a three-axis coordinate system having a Zw axis, an Xw axis, and a Yw axis, wherein the Zw axis extends in the direction from the bottom surface of the parcel box 2 toward the opening 20, that is, in the +Zw direction, the Xw axis extends in the +Xw direction orthogonal to the +Zw direction, and the Yw axis extends in the +Yw direction orthogonal to the +Zw direction and the +Xw direction. In the following, the opposite direction of the +Xw direction is referred to as the -Xw direction, the opposite direction of the +Yw direction is referred to as the -Yw direction, and the opposite direction of the +Zw direction is referred to as the -Zw direction.

[0031] In addition, in the following, a buffer member coordinate system ΣS fixed to the buffer member S is introduced. The buffer member coordinate system ΣS is a three-axis coordinate system having a Zs axis, an Xs axis, and a Ys axis, wherein the Zs axis extends along the +Zs direction, the Xs axis extends along the +Xs direction orthogonal to the +Zs direction, and the Ys axis extends along the +Ys direction orthogonal to the +Zs direction and the +Xs direction. In the following, the direction opposite to the +Xs direction is referred to as the -Xs direction, the direction opposite to the +Ys direction is referred to as the -Ys direction, and the direction opposite to the +Zs direction is referred to as the -Zs direction.

[0032] like Figure 1 In the example shown, the cushioning member S-1 is a cushioning member S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, the -Xw direction of the electronic device 100, and the -Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are accommodated in the packing box 2. Here, the cushioning member coordinate system ΣS-1 fixed to the cushioning member S-1 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the -Xw direction.

[0033] The cushioning member S-2 is a cushioning member S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, the -Xw direction of the electronic device 100, and the +Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are accommodated in the packing box 2. Here, the cushioning member coordinate system ΣS-2 fixed to the cushioning member S-2 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Xw direction, and the +Ys direction coincides with the +Yw direction.

[0034] The cushioning member S-3 is a cushioning member S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, the +Xw direction of the electronic device 100, and the +Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are accommodated in the packing box 2. Here, the cushioning member coordinate system ΣS-3 fixed to the cushioning member S-3 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the +Xw direction.

[0035] The cushioning member S-4 is a cushioning member S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, the +Xw direction of the electronic device 100, and the -Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are housed in the packing box 2. Here, the cushioning member coordinate system ΣS-4 fixed to the cushioning member S-4 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Xw direction, and the +Ys direction coincides with the -Yw direction.

[0036] The cushioning member S-5 is a cushioning member S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, the -Xw direction of the electronic device 100, and the +Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are housed in the packing box 2. Here, the cushioning member coordinate system ΣS-5 fixed to the cushioning member S-5 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0037] The cushioning member S-6 is a cushioning member S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, the -Xw direction of the electronic device 100, and the -Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are housed in the packing box 2. Here, the cushioning member coordinate system ΣS-6 fixed to the cushioning member S-6 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Xw direction, and the +Ys direction coincides with the -Yw direction.

[0038] The cushioning member S-7 is a cushioning member S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, the +Xw direction of the electronic device 100, and the -Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are housed in the packing box 2. Here, the cushioning member coordinate system ΣS-7 fixed to the cushioning member S-7 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the +Xw direction.

[0039] The cushioning member S-8 is a cushioning member S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, the +Xw direction of the electronic device 100, and the +Yw direction of the electronic device 100 when the electronic device 100 and the eight cushioning members S-1 to S-8 are accommodated in the packing box 2. Here, the cushioning member coordinate system ΣS-8 fixed to the cushioning member S-8 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Xw direction, and the +Ys direction coincides with the +Yw direction.

[0040] 2. About buffer parts

[0041] Figure 2 It is a perspective view showing an example of the structure of the shock absorbing material S.

[0042] like Figure 2 In the example shown, the cushioning member S includes a plurality of cushioning blocks R for cushioning external force applied to the electronic device 100 and a plurality of retaining members H for retaining the cushioning blocks R. In the present embodiment, the cushioning member S includes three retaining members H1 to H3 as an example.

[0043] The retaining member H1 comprises: a retaining plate P1, which is configured with the +Zs direction as the normal direction; a retaining plate P2, which constitutes a part of the side surface on the +Zs side of the buffer member S and is configured on the +Zs side of the retaining plate P1 with the +Zs direction as the normal direction; and a connecting plate Ps1, which connects the retaining plate P1 and the retaining plate P2.

[0044] The retaining member H2 comprises: a retaining plate P3, which is configured with the +Xs direction as the normal direction; a retaining plate P4, which constitutes a part of the side surface on the +Xs side of the buffer member S and is configured on the +Xs side of the retaining plate P3 with the +Xs direction as the normal direction; and a connecting plate Ps2, which connects the retaining plate P3 and the retaining plate P4.

[0045] The retaining member H3 comprises: a retaining plate P5, which is configured with the +Ys direction as the normal direction; a retaining plate P6, which constitutes a part of the side surface on the +Ys side of the buffer member S and is configured on the +Ys side of the retaining plate P5 with the +Ys direction as the normal direction; and a connecting plate Ps3, which connects the retaining plate P5 and the retaining plate P6.

[0046] In the following, the holding plates P1 to P6 and the connecting plates Ps1 to Ps3 may be collectively referred to as holding plates P. In the present embodiment, a case where the plurality of holding plates P constituting the holder H are each made of corrugated cardboard is assumed as an example.

[0047] like Figure 2 As shown in the example, in the present embodiment, it is assumed that the cushioning member S includes three cushioning members R1 to R3 , namely, a cushioning member R1 held by a holder H1 , a cushioning member R2 held by a holder H2 , and a cushioning member R3 held by a holder H3 .

[0048] The buffer block R1 is held by the holder H1 between the holding plate P1 and the holding plate P2. In the present embodiment, as an example, it is assumed that the end of the buffer block R1 on the -Zs side is bonded to the holding plate P1 by an adhesive, and the end of the buffer block R1 on the +Zs side is bonded to the holding plate P2 by an adhesive, so that the buffer block R1 is held by the holder H1.

[0049] The buffer block R2 is held by the holder H2 between the holding plate P3 and the holding plate P4. In the present embodiment, as an example, it is assumed that the end of the buffer block R2 on the -Xs side is bonded to the holding plate P3 by an adhesive, and the end of the buffer block R2 on the +Xs side is bonded to the holding plate P4 by an adhesive, so that the buffer block R2 is held by the holder H2.

[0050] The buffer block R3 is held by the holder H3 between the holding plate P5 and the holding plate P6. In the present embodiment, as an example, it is assumed that the end of the buffer block R3 on the -Ys side is bonded to the holding plate P5 by an adhesive, and the end of the buffer block R3 on the +Ys side is bonded to the holding plate P2 by an adhesive, so that the buffer block R3 is held by the holder H3.

[0051] In addition, in this embodiment, it is assumed that the cushion pad R is formed of a material having lower elasticity than foamed polystyrene.

[0052] In addition, in the present embodiment, it is assumed that an object such as paper or clothing including various fibers such as animal fibers, plant fibers, or chemical fibers is decomposed to obtain fibers included in the object, and the obtained fibers are processed to form the buffer block R. More specifically, in the present embodiment, it is assumed that the buffer block R is formed by decomposing paper to obtain fibers included in the paper, and the obtained fibers are solidified.

[0053] Thus, in the present embodiment, the buffer block R is formed by obtaining fibers from an object including fibers such as paper or clothing. That is, in the present embodiment, the buffer block R can be formed by reusing an object including fibers such as paper or clothing when the object is discarded. Therefore, according to the present embodiment, the environmental load involved in the manufacture and disposal of the buffer block R can be suppressed to a small level.

[0054] In the present embodiment, the retaining plates P1, P3, and P5 are opposed to the electronic device 100 when the cushion member S and the electronic device 100 are accommodated in the packing box 2. Furthermore, the retaining plates P1, P3, and P5 are formed with holes AN at positions corresponding to the corners of the electronic device 100 when the cushion member S and the electronic device 100 are accommodated in the packing box 2. Furthermore, the retaining plates P2, P4, and P6 are opposed to the inner wall surface of the packing box 2 when the cushion member S and the electronic device 100 are accommodated in the packing box 2.

[0055] In addition, in the present embodiment, the holder H1 is an example of a "first holder", and the holder H2 is an example of a "second holder". In addition, in the present embodiment, the holding plate P1 is an example of a "first plate", the holding plate P2 is an example of a "second plate", the holding plate P3 is an example of a "third plate", and the holding plate P4 is an example of a "fourth plate". In addition, in the present embodiment, the buffer block R1 is an example of a "first buffer block", and the buffer block R2 is an example of a "second buffer block". In addition, in the present embodiment, the +Zs direction is an example of a "first direction", and the +Xs direction is an example of a "second direction".

[0056] Figure 3 It is a plan view showing an example of the shape of the plate member HH.

[0057] In addition, in this embodiment, it is assumed that Figure 3 The illustrated flat plate member HH is arranged along Figure 3 The illustrated folding lines θ11 to θ32 are bent to form the holders H1 to H3 provided with the cushioning member S as an example. In addition, as described above, in the present embodiment, as an example, it is assumed that the flat plate member HH is made of corrugated cardboard.

[0058] like Figure 3 In the example, the plate component HH has Figure 2 The retaining plates P1 to P6 and the connecting plates Ps1 to Ps3 described above further include a connecting plate Pc12. Figure 3 In FIG. 1 , it is assumed that the cushioning material coordinate system ΣS is a coordinate system fixed to the holding plate P2 , and a case where the plate member HH is obtained by developing the holders H1 to H3 in a state where the cushioning material coordinate system ΣS is fixed to the holders is taken as an example.

[0059] As described above, the holder H1 includes the holder plate P1, the holder plate P2, and the connection plate Ps1. In addition, the holder H1 includes the connection plate Pc12. Figure 3 In the example shown, the holding plate P2 and the connecting plate Ps1 are connected via a fold line θ11 , the connecting plate Ps1 and the holding plate P1 are connected via a fold line θ12 , and the holding plate P1 and the connecting plate Pc12 are connected via a fold line θ13 .

[0060] As described above, the retaining member H2 includes the retaining plate P3, the retaining plate P4, and the connecting plate Ps2. Figure 3 In the illustrated example, the holding plate P3 and the connecting plate Ps2 are connected via a folding line θ21 , and the connecting plate Ps2 and the holding plate P4 are connected via a folding line θ22 .

[0061] As described above, the retaining member H3 includes the retaining plate P5, the retaining plate P6, and the connecting plate Ps3. Figure 3 In the illustrated example, the holding plate P5 and the connecting plate Ps3 are connected via a folding line θ32 , and the connecting plate Ps3 and the holding plate P6 are connected via a folding line θ31 .

[0062] In this embodiment, the fold line θ13 is a mountain fold (outer fold) fold line, and the fold lines other than the fold line θ13 are valley fold (inner fold) fold lines. Here, the valley fold line refers to the plate members at both ends of the fold line, which are centered along the fold line when the holders H1 to H3 are formed by the flat plate member HH. Figure 3 The mountain fold line is a fold line that is bent in the +Zs direction near the front side. In addition, when the retaining members H1 to H3 are formed by the flat plate member HH, the plate members at both ends of the fold line are folded along the fold line as the center. Figure 3 The fold line on the inner side, i.e., the fold line in the -Zs direction.

[0063] like Figure 3 In the example shown, an arc-shaped recess OB1 is formed on the retaining plate P1, a protrusion TK1 is formed on the retaining plate P2, a recess OB3 is formed on the connecting plate Pc12, and an opening KK2 is formed on the fold line θ12 which is the boundary between the retaining plate P1 and the connecting plate Ps1. In addition, an arc-shaped recess OB2 is formed on the retaining plate P3, a protrusion TK2 is formed on the retaining plate P4, and an opening KK3 is formed on the fold line θ21 which is the boundary between the retaining plate P3 and the connecting plate Ps2. In addition, an arc-shaped recess OB3 is formed on the retaining plate P5, a protrusion TK3 is formed on the retaining plate P6, and an opening KK1 is formed on the fold line θ32 which is the boundary between the retaining plate P5 and the connecting plate Ps3.

[0064] Then, the flat plate member HH is folded into a mountain fold along the fold line θ13, and the flat plate member HH is folded into a valley fold along the fold lines θ11, θ12, θ14, θ21 to θ23, θ31, and θ32 other than the fold line θ13, so that the convex portion TK1 is embedded in the opening KK1, the convex portion TK2 is embedded in the opening KK2, and the convex portion TK3 is embedded in the opening KK3 and the concave portion OB3. In addition, the flat plate member HH is folded along the fold lines θ11 to θ32, so that the hole portion AN is formed by the concave portions OB1 to OB3.

[0065] Furthermore, when the flat plate member HH is folded along the folding lines θ11 to θ32, the buffer block R1 is held by the holder H1 by bonding one end of the buffer block R1 to the region Ar1 of the holding plate P1 and bonding the other end of the buffer block R1 to the region Ar2 of the holding plate P2. Furthermore, when the flat plate member HH is folded along the folding lines θ11 to θ32, the buffer block R2 is held by the holder H2 by bonding one end of the buffer block R2 to the region Ar3 of the holding plate P3 and bonding the other end of the buffer block R2 to the region Ar4 of the holding plate P4. Furthermore, when the flat plate member HH is folded along the folding lines θ11 to θ32, the buffer block R3 is held by the holder H3 by bonding one end of the buffer block R3 to the region Ar5 of the holding plate P5 and bonding the other end of the buffer block R3 to the region Ar6 of the holding plate P6.

[0066] Figure 4 It means in Figure 2 , it is a cross-sectional view of an example of a cross section of the buffer material S when the buffer material S is cut along a plane perpendicular to the +Ys direction and passing through the buffer block R1 and the buffer block R2.

[0067] like Figure 4 As shown, in the buffer S involved in this embodiment, the end of the buffer block R1 on the -Zs side is bonded to the retaining plate P1, and the end of the buffer block R1 on the +Zs side is bonded to the retaining plate P2, and the retaining plates P1 and P2 are connected by the connecting plate Ps1.

[0068] Hereinafter, in order to explain one of the effects of the present embodiment, the cushioning material SW included in the packing material 1W according to the reference example will be discussed.

[0069] Figure 5 1W is a cross-sectional view showing an example of a cross section of the cushioning material SW included in the packing material 1W according to the reference example. The packing material 1W is different from the packing material 1 according to the embodiment in that a plurality of cushioning materials SW are included instead of the plurality of cushioning materials S.

[0070] like Figure 5 As shown, the difference between the buffer member SW according to the reference example and the buffer member S according to the embodiment is that the holder H1 does not include the holder plate P2 and the connection plate Ps1, and the holder H2 does not include the holder plate P4 and the connection plate Ps2. That is, in the packing material 1W according to the reference example, the end of the buffer block R1 on the -Zs side is bonded to the holder plate P1, and the end of the buffer block R1 on the +Zs side is in contact with the inner wall surface of the packing box 2.

[0071] For example, when an external force is applied to the buffer block R1 of the buffer material SW according to the reference example via the packing box 2 or the electronic device 100 , one end of the buffer block R1 may be displaced.

[0072] Then, for example, when an external force is applied to the buffer block R1 provided in the buffer member SW according to the reference example via the packing box 2 or the electronic device 100 to displace one end of the buffer block R1, the other end of the buffer block R1 may not be able to follow the displacement of the one end of the buffer block R1. Then, when the other end of the buffer block R1 cannot follow the displacement of the one end of the buffer block R1, the one end of the buffer block R1 is located closer to the +Xs side or the -Xs side than the other end. Therefore, when an external force is applied to the buffer block R1 provided in the buffer member SW according to the reference example via the packing box 2 or the electronic device 100, there is a possibility that the buffer block R1 is peeled off from the holding plate P1 or the packing box 2. Similarly, in the buffer member SW according to the reference example, there is a possibility that the buffer block R is peeled off from the packing box 2 or the holding member H due to the external force applied to the buffer block R other than the buffer block R1 via the packing box 2 or the electronic device 100.

[0073] In contrast, in the shock absorber S according to the present embodiment, as described above, one end of the shock absorber block R1 is bonded to the holding plate P1 , the other end of the shock absorber block R1 is bonded to the holding plate P2 , and the holding plates P1 and P2 are connected by the connecting plate Ps1 .

[0074] Therefore, according to the present embodiment, even when an external force is applied to the buffer block R1 via the packing box 2 or the electronic device 100 and one end of the buffer block R1 is displaced, the other end of the buffer block R1 is displaced following the displacement of the one end of the buffer block R1 via the retaining plate P1, the connecting plate Ps1, and the retaining plate P2. Therefore, according to the present embodiment, the possibility of the buffer block R1 being peeled off from the retaining plate P1 or the retaining plate P2 to which the buffer block R1 is connected due to the external force applied to the packing box 2 or the electronic device 100 can be reduced compared to the reference example. Similarly, according to the present embodiment, the possibility of the buffer block R other than the buffer block R1 being peeled off from the retaining member H to which the buffer block R is connected due to the external force applied to the packing box 2 or the electronic device 100 can be reduced compared to the reference example.

[0075] Furthermore, according to the present embodiment, a buffer block R1 is provided between the holding plate P1 and the holding plate P2. Therefore, according to the present embodiment, compared with a method in which the buffer block R1 is not provided between the holding plate P1 and the holding plate P2, the external force applied to the electronic device 100 can be more reliably buffered. That is, according to the present embodiment, a buffer block R is provided between the plurality of holding plates P of the holder H. Therefore, according to the present embodiment, compared with a method in which the buffer block R is not provided between the plurality of holding plates P of the holder H, the external force applied to the electronic device 100 can be more reliably buffered.

[0076] Furthermore, according to the present embodiment, when the packing material 1 is viewed in the -Zs direction, the connection plate Ps1 is provided in a region different from the region overlapping the electronic device 100 and the packing box 2. More specifically, according to the present embodiment, when the packing material 1 is viewed in the -Zs direction, the connection plate Ps1 is provided on the +Xs side of the electronic device 100. Therefore, according to the present embodiment, the external force applied to the electronic device 100 can be buffered by the buffer block R1, and the influence of the connection plate Ps1 can be suppressed in the buffering of the external force applied to the electronic device 100. Therefore, according to the present embodiment, in order to realize effective buffering of the external force by the buffer member S, it is only necessary to consider the buffering of the external force applied to the electronic device 100 by the buffer block R1, and the design of the buffer member S is easier than a method of buffering the external force applied to the electronic device 100 by both the connection plate Ps1 and the buffer block R1. Similarly, according to the present embodiment, since the connecting plate Ps2 is disposed on the +Ys side compared to the electronic device 100, and the connecting plate Ps3 is disposed on the +Zs side compared to the electronic device 100, the design of the buffer S is easier than a method of buffering the external force applied to the electronic device 100 by both the connecting plate Ps and the buffer block R.

[0077] 3. Summary of the First Implementation

[0078] As described above, the cushioning member S according to the present embodiment is characterized in that it is housed in the packing box 2 capable of housing the electronic device 100 and cushions the external force applied to the electronic device 200 housed in the packing box 2. The cushioning member S includes: a holding member H1 including a holding plate P1 and a holding plate P2, wherein the holding plate P1 is opposed to the electronic device 100 when the cushioning member S and the electronic device 100 are housed in the packing box 2, and the holding plate P2 is opposed to the inner wall surface of the packing box 3 when the cushioning member S and the electronic device 100 are housed in the packing box 2; and a buffer block R1 provided between the holding plate P1 and the holding plate P2.

[0079] Therefore, according to the present embodiment, compared with a configuration in which the buffer block R1 is not provided between the holding plate P1 and the holding plate P2 , it is possible to more reliably buffer the external force applied to the electronic device 100 .

[0080] In addition, the cushioning member S according to the present embodiment is characterized in that it includes: a holding member H2 including a holding plate P3 and a holding plate P4, wherein the holding plate P3 is opposed to the electronic device 100 when the cushioning member S and the electronic device 100 are accommodated in the packing box 2, and the holding plate P4 is opposed to the inner wall surface of the packing box 2 when the cushioning member S and the electronic device 100 are accommodated in the packing box 2; and a buffer block R2 is provided between the holding plate P3 and the holding plate P4, the buffer block R1 extends along the +Zs direction from the holding plate P1 toward the holding plate P2, and the buffer block R2 extends along the +Xs direction from the holding plate P3 toward the holding plate P4, and the holding member H1 and the holding member H2 are composed of a single flat plate member HH.

[0081] Therefore, according to this embodiment, compared with the case where the shock absorber S is composed of multiple parts, it is possible to simplify the management of parts required for manufacturing the shock absorber S. In addition, according to this embodiment, compared with the case where the shock absorber S is composed of multiple parts, it is possible to simplify the management of waste generated when the shock absorber S is discarded.

[0082] Furthermore, in the cushioning member S according to the present embodiment, it is characterized in that the holding plate P1 and the holding plate P3 form a hole portion AN at a position corresponding to one of the multiple corners of the electronic device 100 when the cushioning member S and the electronic device 100 are accommodated in the packing box 2. More specifically, in the cushioning member S according to the present embodiment, the holding plate P1 is provided with a recessed portion OB1, and the holding plate P3 is provided with a recessed portion OB2 so that the hole portion AN is formed at a position corresponding to one of the multiple corners of the electronic device 100 when the cushioning member S and the electronic device 100 are accommodated in the packing box 2.

[0083] Therefore, according to the present embodiment, compared with a configuration in which the hole portion AN is not provided in the cushioning member S, the possibility of damage to the cushioning member S due to pressure applied to the cushioning member S from the corner portion of the electronic device 100 can be reduced.

[0084] Furthermore, according to the present embodiment, compared with a method in which the hole portion AN is not provided in the buffer member S, the possibility of damage to the retaining plate P1 or the retaining plate P3 at the contact portion between the retaining plate P1 and the retaining plate P3 caused by the displacement of the retaining plate R1 in the +Zs direction or the -Zs direction caused by the pressure applied to the retaining plate P1 by the electronic device 100 or the buffer block R1 can be reduced. Furthermore, according to the present embodiment, compared with a method in which the hole portion AN is not provided in the buffer member S, the possibility of damage to the retaining plate P1 or the retaining plate P3 at the contact portion between the retaining plate P1 and the retaining plate P3 caused by the displacement of the retaining plate R3 in the +Xs direction or the -Xs direction caused by the pressure applied to the retaining plate P3 by the electronic device 100 or the buffer block R2 can be reduced.

[0085] B. Modification

[0086] The above forms can be modified in various ways. Specific modification methods are as shown below. Two or more methods arbitrarily selected from the following examples can be appropriately combined within the scope of non-contradiction. In addition, in the modification examples shown below, for elements with the same effects and functions as the implementation methods, the reference numbers in the above description are used, and the detailed descriptions of each are appropriately omitted.

[0087] Modification 1

[0088] In the above embodiment, the case where the cushion block R is fixed to the holder H using an adhesive is exemplified, but the present disclosure is not limited to such a form. The cushion block R may be fixed to the holder H without using an adhesive.

[0089] Figure 6 It is an exploded perspective view showing an example of the structure of the shock absorbing material SA according to the present modification.

[0090] The difference between the buffer member SA and the buffer member S involved in the embodiment is that the buffer member SA includes a plurality of retainers HA instead of the plurality of retainers H, and includes a plurality of buffer blocks RA instead of the buffer block R. More specifically, the difference between the buffer member SA and the buffer member S involved in the embodiment is that the buffer member SA includes three retainers HA1 to HA3 instead of the three retainers H1 to H3, and includes three buffer blocks RA1 to RA3 instead of the three buffer blocks R1 to R3.

[0091] The holder HA is different from the holder H according to the embodiment in that two placement plates BB are provided between the two holding plates P of the holder HA. The placement plates BB are provided with openings HK for inserting the ends of the buffer blocks RA.

[0092] Furthermore, in the two configuration plates BB disposed between the two holding plates P of the holder HA, one end of the buffer block RA is inserted into the opening HK provided in one configuration plate BB, and the other end of the buffer block RA is inserted into the opening HK provided in the other configuration plate BB. Thus, in the two configuration plates BB disposed between the two holding plates P of the holder HA, the friction force generated between the opening HK provided in one configuration plate BB and one end of the buffer block RA, and the friction force generated between the opening HK provided in the other configuration plate BB and the other end of the buffer block RA, the buffer block RA is fixed between the two holding plates P of the holder HA.

[0093] For example, Figure 6In the example shown, the retaining member HA1 includes: a configuration plate BB1, one end of which is connected to the retaining plate P1 and is disposed between the retaining plate P1 and the retaining plate P2; a configuration plate BB2, one end of which is connected to the retaining plate P2 and is disposed between the retaining plate P1 and the retaining plate P2, and is disposed between the configuration plate BB1 ​​and the retaining plate P2. Furthermore, an opening HK1 for inserting one end of the buffer block RA1 is provided on the configuration plate BB1. Furthermore, an opening HK2 for inserting the other end of the buffer block RA1 is provided on the configuration plate BB2. Furthermore, one end of the buffer block RA1 is inserted into the opening HK1, and the other end of the buffer block RA1 is inserted into the opening HK2. Thus, the buffer block RA1 is fixed between the retaining plate P1 and the retaining plate P2 by the configuration plate BB1 ​​and the configuration plate BB2.

[0094] The buffer block RA is composed of a plurality of buffer sheets SS stacked in a direction from one end of the buffer block RA toward the other end. Therefore, by arranging the buffer block RA between the two retaining plates P of the retaining member HA, the external force applied to the retaining member HA between the two retaining plates P of the retaining member HA can be effectively absorbed.

[0095] For example, Figure 7 As shown in the example, the buffer block RA1 is composed of a plurality of buffer sheets SS stacked along the +Zs direction from the holding plate P1 toward the holding plate P2. Therefore, the holder HA1 can effectively buffer the external force applied to the holder HA1 in the +Zs direction and the external force applied to the holder HA1 in the -Zs direction by the buffer block RA1.

[0096] As described above, according to this modification, the buffer block RA is mounted on the holder HA without using an adhesive. Therefore, according to this modification, compared with a method in which the buffer block RA is mounted on the holder HA by an adhesive, when the buffer SA is disassembled, the labor of removing the buffer block RA from the holder HA can be reduced. In addition, according to this modification, compared with a method in which the buffer block RA is mounted on the holder HA by an adhesive, when the buffer SA is disassembled, it is easy to completely remove the buffer block RA from the holder HA, so the recyclability of the buffer SA can be improved.

[0097] Furthermore, in the shock absorbing member SA according to the present modification, the shock absorbing block RA1 includes a plurality of shock absorbing sheets SS stacked along the +Zs direction from the holding plate P1 toward the holding plate P2 .

[0098] Therefore, according to the present modification, compared with a configuration in which the shock absorbing member SA does not include the shock absorbing block RA1, the external force in the +Zs direction or the -Zs direction applied to the holding plate P1 or the holding plate P2 can be more effectively buffered.

[0099] In addition, in the buffer part SA involved in the present variant, it is characterized in that the retaining part HA1 comprises: a configuration plate BB1, one end of which is connected to the retaining plate P1 and is configured between the retaining plate P1 and the retaining plate P2; and a configuration plate BB2, one end of which is connected to the retaining plate P2 and is configured between the retaining plate P1 and the retaining plate P2, and one end of the buffer block RA1 is inserted into the opening HK1 provided in the configuration plate BB1, and the other end is inserted into the opening HK2 provided in the configuration plate BB2.

[0100] Therefore, according to this modification, the buffer block RA1 can be fixed between the holding plates P1 and P2 of the holder HA1 by the friction force generated between one end of the buffer block RA1 and the opening HK1 and the friction force generated between the other end of the buffer block RA1 and the opening HK2.

[0101] In addition, in this modified example, the buffer block RA is composed of a plurality of buffer sheets SS stacked along a direction from one of the two holding plates P held by the buffer block RA toward the other, but the present disclosure is not limited to such a method. The buffer block RA may also be composed of a plurality of buffer sheets SS stacked along a direction intersecting the direction from one of the two holding plates P held by the buffer block RA toward the other.

[0102] In addition, in this modification, the buffer block RA is illustrated as being mounted on the holder HA by friction without using an adhesive, but the present disclosure is not limited to such a method. For example, in addition to friction, the buffer block RA can also be more firmly mounted on the holder HA by using an adhesive.

[0103] Modification 2

[0104] In the above-described embodiment and Modification 1, the case where the plurality of holders H included in the shock absorbing material S is formed of a single flat member HH is exemplified, but the present disclosure is not limited to such an embodiment. The shock absorbing material S may be formed of a plurality of members.

[0105] Figure 8 It is an exploded perspective view showing an example of the structure of the cushioning material SB included in the packing material according to the present modification. Fig. 9 It is a perspective view showing an example of the structure of the cushioning material SB included in the packing material according to the present modification.

[0106] like Figure 8 As shown in the example, in this modification, the buffer SB is composed of three retaining members HB1 to HB3. In this modification, retaining member HB1 is connected to retaining member HB2 and retaining member HB3, retaining member HB2 is connected to retaining member HB1 and retaining member HB3, and retaining member HB3 is connected to retaining member HB1 and retaining member HB2. In the following, retaining members HB1 to HB3 are sometimes collectively referred to as retaining member HB.

[0107] The holder HB1 includes a holder plate P1, a holder plate P2, a connection protrusion part ST1 and a connection opening part SK1, and holds the buffer block R1. In the following, the structure of the holder HB1 for holding the buffer block R1 is referred to as a holding portion BH1, and the structure for connecting the holder HB1 with the holder HB2 and the holder HB3 is referred to as a connection portion BS1.

[0108] The holding portion BH1 is a portion of the holding plate P1 and the holding plate P2 extending along the +Xs direction. In this modification, one end of the buffer block R1 is bonded to the portion of the holding plate P1 corresponding to the holding portion BH1 by an adhesive, and the other end is bonded to the portion of the holding plate P2 corresponding to the holding portion BH1 by an adhesive.

[0109] The connection part BS1 includes: a portion of the holding plate P1 and the holding plate P2 extending in the +Ys direction; a connection protrusion part ST1; and a connection opening part SK1. The connection protrusion part ST1 is a flat plate-shaped part that is connected to the holding plate P2 at one end of the portion of the holding plate P2 included in the connection part BS1, that is, the end of the holding plate P2 in the +Ys direction, and extends in the -Zs direction. The connection opening part SK1 is a flat plate-shaped part provided with an opening, and is a flat plate-shaped part that is connected to the holding plate P2 at one end of the portion of the holding plate P2 included in the connection part BS1, that is, the end of the holding plate P2 in the +Xs direction, and extends in the -Zs direction.

[0110] In addition, in this variation, the retaining portion BH1 is an example of a “first retaining portion”, the connecting portion BS1 is an example of a “first connecting portion”, the +Zs direction is an example of a “first direction”, the +Xs direction is an example of a “second direction”, and the +Ys direction is an example of a “third direction”.

[0111] The holder HB2 includes a holder plate P3, a holder plate P4, a connection protrusion part ST2 and a connection opening part SK2, and holds the buffer block R2. In the following, the structure of the holder HB2 for holding the buffer block R2 is referred to as a holding portion BH2, and the structure for connecting the holder HB2 with the holder HB1 and the holder HB3 is referred to as a connection portion BS2.

[0112] The holding portion BH2 is a portion of the holding plate P3 and the holding plate P4 extending along the +Ys direction. In this modified example, one end of the buffer block R2 is bonded to the portion of the holding plate P3 corresponding to the holding portion BH2 by an adhesive, and the other end is bonded to the portion of the holding plate P4 corresponding to the holding portion BH2 by an adhesive.

[0113] The connection part BS2 includes: a portion of the holding plate P3 and the holding plate P4 extending in the +Zs direction; a connection protrusion part ST2; and a connection opening part SK2. The connection protrusion part ST2 is a flat plate-shaped part that is connected to the holding plate P4 at one end of the portion of the holding plate P4 included in the connection part BS2, that is, the end of the holding plate P4 in the +Zs direction, and extends in the -Xs direction. The connection opening part SK2 is a flat plate-shaped part provided with an opening, and is a flat plate-shaped part that is connected to the holding plate P4 at one end of the portion of the holding plate P4 included in the connection part BS2, that is, the end of the holding plate P4 in the +Ys direction, and extends in the -Xs direction.

[0114] In addition, in this modification, the holding portion BH2 is an example of a “second holding portion”, and the connecting portion BS2 is an example of a “second connecting portion”.

[0115] The holder HB3 includes a holder plate P5, a holder plate P6, a connection protrusion part ST3 and a connection opening part SK3, and holds the buffer block R3. In the following, the structure of the holder HB3 for holding the buffer block R3 is referred to as the holding part BH3, and the structure for connecting the holder HB3 with the holder HB1 and the holder part BH2 is referred to as the connection part BS3.

[0116] The holding portion BH3 is a portion of the holding plate P5 and the holding plate P6 extending along the +Zs direction. In this modification, one end of the buffer block R3 is bonded to the portion of the holding plate P5 corresponding to the holding portion BH3 by an adhesive, and the other end is bonded to the portion of the holding plate P6 corresponding to the holding portion BH3 by an adhesive.

[0117] The connection portion BS3 includes: a portion of the holding plate P5 and the holding plate P6 extending in the +Xs direction; a connection protrusion component ST3; and a connection opening component SK3. The connection protrusion component ST3 is a flat plate-shaped component that is connected to the holding plate P6 at one end of the portion of the holding plate P6 included in the connection portion BS3, that is, the end of the holding plate P6 in the +Xs direction, and extends in the -Ys direction. The connection opening component SK3 is a flat plate-shaped component with an opening formed therein, and is a flat plate-shaped component that is connected to the holding plate P6 at one end of the portion of the holding plate P6 included in the connection portion BS3, that is, the end of the holding plate P6 in the +Zs direction, and extends in the -Ys direction.

[0118] In addition, in this modification, the holding portion BH3 is an example of the “third holding portion”, and the connecting portion BS3 is an example of the “third connecting portion”.

[0119] In this modification, the connecting protrusion part ST1 is inserted into the opening provided in the connecting opening part SK3, the connecting protrusion part ST2 is inserted into the opening provided in the connecting opening part SK1, and the connecting protrusion part ST3 is inserted into the opening provided in the connecting opening part SK2, thereby connecting the holders HB1, HB2 and HB3 to each other to form Fig. 9 The buffer member SB shown.

[0120] In addition, in this modification, as an example, the buffer block R is connected to the holding portion BH by an adhesive, but the present disclosure is not limited to such a method. Figure 6 and Figure 7 As shown, the holding portion BH may include two arrangement plates BB having openings HK, and the buffer block R may be held by the holding portion BH by inserting both ends into two openings HK corresponding to the two arrangement plates BB. In this case, the buffer block R may be fixed to the holding portion BH without using an adhesive.

[0121] As described above, the cushioning member SB involved in this modification is characterized in that it includes: a holding member HB1 including a holding plate P1 and a holding plate P2, wherein the holding plate P1 is opposed to the electronic device 100 when the cushioning member SB and the electronic device 100 are accommodated in the packing box 2, and the holding plate P2 is opposed to the inner wall surface of the packing box 2 when the cushioning member SB and the electronic device 100 are accommodated in the packing box 2; a buffer block R1 is provided between the holding plate P1 and the holding plate P2; and a holding member HB2 including a holding plate P3 and a holding plate P4, wherein the holding plate P3 is opposed to the electronic device 100 when the cushioning member SB and the electronic device 100 are accommodated in the packing box 2, and the holding plate P4 is opposed to the inner wall surface of the packing box 2 when the cushioning member SB and the electronic device 100 are accommodated in the packing box 2. 0 is placed in the packing box 2 so as to face the inner wall surface of the packing box 2; the buffer block R2 is arranged between the holding plate P3 and the holding plate P4, and the holding member HB1 includes: a holding portion BH1 that holds the buffer block R1 between the holding plate P1 and the holding plate P2, and the holding portion BH1 extends along the +Xs direction; and a connecting portion BS1 that extends along the +Ys direction, and the holding member HB2 includes: a holding portion BH2 that holds the buffer block R2 between the holding plate P3 and the holding plate P4; and a connecting portion BS2 connected to the holding portion BH1, the buffer block R2 extends along the +Xs direction, the holding portion BH2 extends along the +Ys direction, and the connecting portion BS2 extends along the +Zs direction.

[0122] Therefore, according to this modification, it is possible to buffer the external force applied from the +Zs direction and the external force applied from the +Xs direction.

[0123] In addition, the buffer member SB involved in the present modification example is characterized in that it includes: a holding member HB3 including a holding plate P5 and a holding plate P6, wherein the holding plate P5 is opposed to the electronic device 100 when the buffer member SB and the electronic device 100 are accommodated in the packing box 2, and the holding plate P6 is opposed to the inner wall surface of the packing box 2 when the buffer member SB and the electronic device 100 are accommodated in the packing box 2; and a buffer block R3 is provided between the holding plate P5 and the holding plate P6, and the holding member HB3 includes: a holding portion BH3 that holds the buffer block R3 between the holding plate P5 and the holding plate P6; and a connecting portion BS3 that is connected to the connecting portion BS1 and the connecting portion BS2, the buffer block R3 extends in the +Ys direction, the holding portion BH3 extends in the +Zs direction, and the connecting portion BS3 extends in the +Xs direction.

[0124] Therefore, according to the present modification, it is possible to buffer the external force applied from the +Zs direction, the external force applied from the +Xs direction, and the external force applied from the +Ys direction.

[0125] Modification 3

[0126] In the above-mentioned embodiment and Modifications 1 and 2, the case where the packing material includes eight cushioning members is exemplified, but the present disclosure is not limited to such an embodiment. For example, the packing material may include less than eight cushioning members.

[0127] Fig.10 It is an exploded perspective view showing an example of the structure of a packing material 1C according to the present modification.

[0128] like Fig.10 As shown, the packing material 1C according to the present modification is different from the packing material 1 according to the embodiment in that four cushioning members SC are provided instead of the eight cushioning members S. Specifically, the packing material 1C is different from the packing material 1 according to the embodiment in that four cushioning members SC-1 to SC-4 are provided instead of the eight cushioning members S-1 to S-8.

[0129] The buffer SC-1 includes: a buffer S-1; a buffer S-2; and a connector CN-1 connecting the buffer S-1 and the buffer S-2. The buffer SC-2 includes: a buffer S-3; a buffer S-4; and a connector CN-2 connecting the buffer S-3 and the buffer S-4. The buffer SC-3 includes: a buffer S-5; a buffer S-6; and a connector CN-3 connecting the buffer S-5 and the buffer S-6. The buffer SC-4 includes: a buffer S-7; a buffer S-8; and a connector CN-4 connecting the buffer S-7 and the buffer S-8.

[0130] In the following, the connector CN-1, the connector CN-2, the connector CN-3, and the connector CN-4 are sometimes collectively referred to as the connector CN. In addition, in the following, the buffer S-1, the buffer S-3, the buffer S-5, and the buffer S-7 are sometimes collectively referred to as the buffer SP, and the buffer S-2, the buffer S-4, the buffer S-6, and the buffer S-8 are sometimes collectively referred to as the buffer SQ. That is, in this modification, the buffer SC includes: the buffer SP; the buffer SQ; and the connector CN that connects the buffer SP and the buffer SQ. In addition, in this modification, as an example, it is assumed that the buffer SC is formed by a flat plate member HHC.

[0131] Fig.11 It is a plan view showing an example of the shape of the plate member HHC.

[0132] like Fig.11 In the example shown, the flat plate component HHC has: Figure 3 The flat plate component HH shown; the flat plate component HHy that is inverted so that the +Ys direction and the -Ys direction become opposite; and the connecting flat plate component CNT1 that connects the flat plate component HH and the flat plate component HHy. And, the buffer SC is formed by bending the flat plate component HHC along the dotted line and the single-dot chain line. Specifically, the buffer SP is formed by bending the flat plate component HH along the dotted line and the single-dot chain line. In addition, the buffer SQ is formed by bending the flat plate component HHy along the dotted line and the single-dot chain line. In addition, the connector CN is formed by bending the connecting flat plate component CNT1 along the dotted line. In addition, in Fig.11 In, with Figure 3 Likewise, the dashed line represents a valley fold line, and the dashed line represents a mountain fold line. Fig.11 In the figure, it is assumed that the buffer coordinate system ΣS is a coordinate system fixed to the retaining plate P2 possessed by the buffer SP, and the buffer SP, buffer SQ and connector CN are unfolded in a state where the buffer coordinate system ΣS is fixed to the retaining plate P2 possessed by the buffer SP, thereby obtaining the flat plate component HHC as an example.

[0133] In the following, the retaining member H1 of the buffer member SP is referred to as a retaining member H1-P, and the retaining member H2 of the buffer member SP is referred to as a retaining member H2-P. The retaining plate P1 of the retaining member H1-P is referred to as a retaining plate P1-P, the retaining plate P2 of the retaining member H1-P is referred to as a retaining plate P2-P, the retaining plate P3 of the retaining plate P2-P is referred to as a retaining plate P3-P, the retaining plate P4 of the retaining member H2-P is referred to as a retaining plate P4-P, the buffer block R1 provided between the retaining plate P1-P and the retaining plate P2-P is referred to as a buffer block R1-P, and the buffer block R2 provided between the retaining plate P3-P and the retaining plate P4-P is referred to as a buffer block R2-P. In addition, in the following, the retaining member H1 of the buffer member SQ is referred to as the retaining member H1-Q, the retaining member H2 of the buffer member SQ is referred to as the retaining member H2-Q, the retaining plate P1 of the retaining member H1-Q is referred to as the retaining plate P1-Q, the retaining plate P2 of the retaining member H1-Q is referred to as the retaining plate P2-Q, the retaining plate P3 of the retaining member H2-Q is referred to as the retaining plate P3-Q, the retaining plate P4 of the retaining member H2-Q is referred to as the retaining plate P4-Q, the buffer block R1 arranged between the retaining plate P1-Q and the retaining plate P2-Q is referred to as the buffer block R1-Q, and the buffer block R2 arranged between the retaining plate P3-Q and the retaining plate P4-Q is referred to as the buffer block R2-Q.

[0134] As described above, the cushioning member SC involved in this modification is characterized in that it is accommodated in the packing box 2 that can accommodate the electronic device 100, and cushions the external force applied to the electronic device 100 accommodated in the packing box 2, and the cushioning member SC includes: a holding member H1-P, including a holding plate P1-P and a holding plate P2-P, the holding plate P1-P is opposite to the electronic device 100 when the cushioning member SC and the electronic device 100 are accommodated in the packing box 2, and the holding plate P2-P is opposite to the inner wall surface of the packing box 2 when the cushioning member SC and the electronic device 100 are accommodated in the packing box 2; a buffer block R1-P, which is provided between the holding plate P1-P and the holding plate P2-P; the holding member H2-P includes a holding plate P3-P and a holding plate P4-P. P, the holding plate P3-P is opposite to the electronic device 100 when the buffer SC and the electronic device 100 are accommodated in the packing box 2, and the holding plate P4-P is opposite to the inner wall surface of the packing box 2 when the buffer SC and the electronic device 100 are accommodated in the packing box 2; the buffer block R2-P is arranged between the holding plate P3-P and the holding plate P4-P; the holding member H1-Q includes a holding plate P1-Q and a holding plate P2-Q, the holding plate P1-Q is opposite to the electronic device 100 when the buffer SC and the electronic device 100 are accommodated in the packing box 2, and the holding plate P2-Q is opposite to the inner wall surface of the packing box 2 when the buffer SC and the electronic device 100 are accommodated in the packing box 2; the buffer block R1-Q is arranged between the holding plate P1-Q and the holding plate P2-Q; the holding member H2-Q, including the holding plate P3-Q and the holding plate P4-Q, the holding plate P3-Q is opposite to the electronic device 100 when the buffer member SC and the electronic device 100 are accommodated in the packing box 2, and the holding plate P4-Q is opposite to the inner wall surface of the packing box 2 when the buffer member SC and the electronic device 100 are accommodated in the packing box 2; and a buffer block R2-Q, which is arranged between the holding plate P3-Q and the holding plate P4-Q, the buffer block R1-P extends along the +Zs direction from the holding plate P1-P toward the holding plate P2-P, the buffer block R2-P extends along the +Xs direction from the holding plate P3-P toward the holding plate P4-P, and the buffer block R1-Q extends along the +Xs direction from the holding plate P1-Q toward the holding plate The buffer block R2-Q extends in the +Zs direction of the holding plate P2-Q, and the buffer block R2-Q extends in the +Ys direction from the holding plate P3-Q toward the holding plate P4-Q. The holder H1-P, the holder H2-P, the holder H1-Q and the holder H2-Q are composed of a flat plate member HHC. The holder H1-P and the holder H2-P are arranged as the buffer SP at a position corresponding to one of the multiple corners of the electronic device 100 when the buffer SC and the electronic device 100 are accommodated in the packing box 2. The holder H1-Q and the holder H2-Q are arranged as the buffer SQ at a position corresponding to one of the multiple corners of the electronic device 100 when the buffer SC and the electronic device 100 are accommodated in the packing box 2.

[0135] Therefore, according to this modification, it is possible to buffer the external force applied from the +Zs direction, the external force applied from the +Xs direction, and the external force applied from the +Ys direction. Therefore, in this modification, in order to buffer the external forces from all directions, the packing material 1C only needs to have at least four buffers SC. In addition, in this modification, in order to buffer the external force from the -Zw direction, the packing material 1C only needs to have at least two buffers SC.

[0136] In addition, in this modification, the holder H1-P is an example of a "first holder", the holder H2-P is an example of a "second holder", the holder H1-Q is an example of a "third holder", the holder H2-Q is an example of a "fourth holder", the holding plate P1-P is an example of a "first plate", the holding plate P2-P is an example of a "second plate", the holding plate P3-P is an example of a "third plate", the holding plate P4-P is an example of a "fourth plate", the holding plate P1-Q is an example of a "fifth plate", the holding plate P2-Q is an example of a "sixth plate", the holding plate P3-Q is an example of a "seventh plate", and the holding plate P4-Q is an example of an "eighth plate". In addition, in this modification, the +Zs direction is an example of a "first direction", the +Xs direction is an example of a "second direction", the +Zs direction is an example of a "third direction", and the +Ys direction is an example of a "fourth direction".

[0137] Modification 4

[0138] In the above-mentioned modification 3, among the plurality of cushioning members SC provided in the packing material 1C, the cushioning member SC-1 is formed by a member different from a member used to form the cushioning member SC-2, but the present disclosure is not limited to such a mode. The cushioning member SC-1 and the cushioning member SC-2 among the plurality of cushioning members SC provided in the packing material 1C may also be formed by a single flat member. Similarly, the cushioning member SC-3 and the cushioning member SC-4 among the plurality of cushioning members SC provided in the packing material 1C may also be formed by a single flat member.

[0139] Fig.12 It is an exploded perspective view showing an example of the structure of a packing material 1D according to the present modification.

[0140] like Fig.12 As shown, the packing material 1D according to this modification is different from the packing material 1C according to the modification 3 in that two cushioning members SD are provided instead of the four cushioning members SC. Specifically, the packing material 1D is different from the packing material 1C according to the modification 3 in that two cushioning members SD-1 to SD-2 are provided instead of the four cushioning members SC-1 to SC-4.

[0141] Among them, the buffer SD-1 includes: buffer S-1; buffer S-2; buffer S-3; buffer S-4; connector CN-12 connecting buffer S-1 and buffer S-2; connector CN-23 connecting buffer S-2 and buffer S-3; connector CN-34 connecting buffer S-3 and buffer S-4; and connector CN-41 connecting buffer S-4 and buffer S-1. In addition, the buffer SD-2 includes: buffer S-5; buffer S-6; buffer S-7; buffer S-8; connector CN-56 connecting buffer S-5 and buffer S-6; connector CN-67 connecting buffer S-6 and buffer S-7; connector CN-78 connecting buffer S-7 and buffer S-8; and connector CN-85 connecting buffer S-8 and buffer S-5.

[0142] In the following, sometimes the buffer S-1 and the buffer S-5 are collectively referred to as the buffer S-F1, the buffer S-2 and the buffer S-6 are collectively referred to as the buffer material S-F2, the buffer S-3 and the buffer S-7 are collectively referred to as the buffer S-F3, and the buffer S-4 and the buffer S-8 are collectively referred to as the buffer S-F4. In addition, in the following, sometimes the connector CN-12 and the connector CN-56 are collectively referred to as the connector CN-F12, the connector CN-23 and the connector CN-67 are collectively referred to as the connector CN-F23, the connector CN-F34 and the connector CN-78 are collectively referred to as the connector CN-F34, and the connector CN-41 and the connector CN-85 are collectively referred to as the connector CN-F41.

[0143] That is, in this modification, the buffer SD includes: a buffer S-F1; a buffer S-F2; a buffer S-F3; a buffer S-F4; a connector CN-F12 connecting the buffer S-F1 and the buffer S-F2; a connector CN-F23 connecting the buffer S-F2 and the buffer S-F3; a connector CN-F34 connecting the buffer S-F3 and the buffer S-F4; and a connector CN-F41 connecting the buffer S-F4 and the buffer S-F1. In addition, in this modification, as an example, it is assumed that the buffer SD is formed by a single flat plate member HHD.

[0144] Fig.13 It is a plan view showing an example of the shape of the plate member HHD.

[0145] like Fig.13 In the example shown, the plate member HHD includes a plate member HH1, a plate member HH2, a plate member HH3, and a plate member HH4. Here, the plate member HH1 and the plate member HH3 have Figure 1The plate member HH2 and the plate member HH4 have the same shape as the plate member HH2. Figure 1 The illustrated plate members HHy have the same shape.

[0146] In addition, the flat plate component HHD includes: a connecting flat plate component CNT12 connecting the flat plate component HH1 and the flat plate component HH2; a connecting flat plate component CNT23 connecting the flat plate component HH2 and the flat plate component HH3; a connecting flat plate component CNT41 connecting the flat plate component HH4 and the flat plate component HH1; a connecting flat plate component CNT341 connected to the flat plate component HH3; and a connecting flat plate component CNT342 connecting the connecting flat plate component CNT341 and the flat plate component HH4.

[0147] Furthermore, the shock absorbing member SD is formed by bending the flat plate member HHD along the dotted line and the dashed line.

[0148] Specifically, the buffer S-F1 is formed by bending the flat plate part HH1 along the dotted line and the single-dot chain line. In addition, the buffer S-F2 is formed by bending the flat plate part HH2 along the dotted line and the single-dot chain line. In addition, the buffer S-F3 is formed by bending the flat plate part HH3 along the dotted line and the single-dot chain line. In addition, the buffer S-F4 is formed by bending the flat plate part HH4 along the dotted line and the single-dot chain line. In addition, the connector CN-F12 is formed by bending the connecting flat plate part CNT12 along the dotted line. In addition, the connector CN-F23 is formed by bending the connecting flat plate part CNT23 along the dotted line. In addition, the connector CN-F41 is formed by bending the connecting flat plate part CNT41 along the dotted line. In addition, the connector CN-F34 is formed by a part formed by bending the connecting flat plate part CNT341 along the dotted line and a part formed by bending the connecting flat plate part CNT342 along the dotted line. In addition, in Fig.13 In, with Figure 3 Likewise, the dashed line represents a valley fold line, and the dashed line represents a mountain fold line. Fig.13 In the figure, it is assumed that the buffer coordinate system ΣS is a coordinate system fixed to the retaining plate P2 possessed by the buffer S-F1. When the buffer coordinate system ΣS is fixed to the retaining plate P2 possessed by the buffer S-F1, the buffers S-F1 to S-F4, the connecting flat plate component CNT12, the connecting flat plate component CNT23, the connecting flat plate component CNT41, the connecting flat plate component CNT341 and the connecting flat plate component CNT342 are unfolded to obtain the flat plate component HHD as an example.

[0149] As described above, according to this modification, the external force applied from the +Zs direction, the external force applied from the +Xs direction, the external force applied from the -Xs direction, the external force applied from the +Ys direction, and the external force applied from the -Ys direction can be buffered by the buffer member SD. Therefore, in this modification, in order to buffer the external forces from all directions, the packing material 1D only needs to include at least two buffer members SD. In addition, in this modification, in order to buffer the external force from the -Zw direction, the packing material 1D only needs to include at least one buffer member SD.

[0150] Modification 5

[0151] In the above-mentioned embodiment and Modifications 1 to 4, the Xw axis, Yw axis, and Zw axis of the package box coordinate system ΣW are mutually orthogonal, but the present disclosure is not limited to such a form. The Xw axis, Yw axis, and Zw axis of the package box coordinate system ΣW may extend in mutually different directions.

[0152] In the above-mentioned embodiment and Modifications 1 to 4, the Xs axis, Ys axis, and Zs axis of the shock absorber coordinate system ΣS are orthogonal to each other, but the present disclosure is not limited to such a mode. The Xs axis, Ys axis, and Zs axis of the shock absorber coordinate system ΣS may extend in different directions.

[0153] Modification 6

[0154] In the above-mentioned embodiment and Modifications 1 to 5, the packing material has 24 buffer blocks, but the present disclosure is not limited to such a form. The packing material according to the present invention may have one or more and twenty-three or less buffer blocks, or may have twenty-five or more buffer blocks.

Claims

1. A buffer, characterized in that: The electronic device is stored in a packing box capable of storing the electronic device, and an external force applied to the electronic device stored in the packing box is buffered. The buffer member comprises: a first holding member including a first plate, a second plate, and a connecting plate, wherein the first plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, the second plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box, and the connecting plate connects the first plate and the second plate; as well as A first buffer block is disposed between the first plate and the second plate, The connecting plate is provided in a region different from a region where the electronic device and the packing box overlap when viewed in a direction from the first plate toward the second plate.

2. The buffer according to claim 1, characterized in that: The first buffer block includes: a plurality of buffer sheets stacked along a first direction from the first plate toward the second plate.

3. The buffer member according to claim 1, characterized in that: The first retaining member comprises: a first configuration plate, one end of which is connected to the first plate and is configured between the first plate and the second plate; and a second configuration plate, one end of which is connected to the second plate and is configured between the first plate and the second plate, One end of the first buffer block is inserted into a first opening provided on the first configuration plate, The other end of the first buffer block is inserted into a second opening provided on the second configuration plate.

4. The buffer according to any one of claims 1 to 3, characterized in that: The buffer member comprises: a second holding member including a third plate and a fourth plate, wherein the third plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the fourth plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; as well as A second buffer block is disposed between the third plate and the fourth plate, The first retaining member comprises: a first holding portion, holding the first buffer block between the first plate and the second plate, wherein the first holding portion extends along a second direction intersecting the first direction from the first plate toward the second plate; as well as The first connecting portion extends along a third direction intersecting the first direction and the second direction, The second retaining member comprises: a second holding portion, holding the second buffer block between the third plate and the fourth plate; as well as a second connecting portion connected to the first connecting portion, The second buffer block extends along the second direction from the third plate toward the fourth plate, The second holding portion extends along the third direction, The second connection portion extends along the first direction.

5. The buffer member according to claim 4, characterized in that: The buffer member comprises: a third retaining member including a fifth plate and a sixth plate, wherein the fifth plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the sixth plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; as well as a third buffer block, the third buffer block being arranged between the fifth plate and the sixth plate, The third retaining member comprises: a third holding portion, holding the third buffer block between the fifth plate and the sixth plate; as well as a third connecting portion, the third connecting portion being connected to the first connecting portion and the second connecting portion, The third buffer block extends along the third direction from the fifth plate toward the sixth plate, The third holding portion extends along the first direction, The third connection portion extends along the second direction.

6. The buffer according to any one of claims 1 to 3, characterized in that: The buffer member comprises: a second holding member including a third plate and a fourth plate, wherein the third plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the fourth plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; as well as A second buffer block is disposed between the third plate and the fourth plate, The first buffer block extends along a first direction from the first plate toward the second plate, The second buffer block extends along a second direction from the third plate toward the fourth plate and intersecting the first direction, The first holding member and the second holding member are formed of a single flat plate member.

7. The buffer member according to claim 6, characterized in that: When the cushioning member and the electronic device are housed in the packing box, the first plate and the third plate have holes formed at positions corresponding to one of a plurality of corners of the electronic device.

8. The buffer member according to claim 6, characterized in that: The buffer member comprises: a third retaining member including a fifth plate and a sixth plate, wherein the fifth plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the sixth plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; a third buffer block, disposed between the fifth plate and the sixth plate; a fourth retaining member including a seventh plate and an eighth plate, wherein the seventh plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, and the eighth plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box; as well as a fourth buffer block, disposed between the seventh plate and the eighth plate, The third buffer block extends along a third direction from the fifth plate toward the sixth plate, The fourth buffer block extends along a fourth direction from the seventh plate toward the eighth plate and intersecting the third direction, The first holding member, the second holding member, the third holding member and the fourth holding member are formed by the one flat plate member. When the cushioning member and the electronic device are housed in the packing box, the first retaining member and the second retaining member are arranged at a position corresponding to one of a plurality of corners of the electronic device. When the cushioning member and the electronic device are housed in the packing box, the third holding member and the fourth holding member are arranged at positions corresponding to other corners among the plurality of corners.

9. A package, characterized in that: The package comprises: A packing box capable of housing electronic equipment; and a buffer member, which is housed in the packing box and buffers external force applied to the electronic device housed in the packing box; The buffer member comprises: a first holding member including a first plate, a second plate, and a connecting plate, wherein the first plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, the second plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box, and the connecting plate connects the first plate and the second plate; as well as A first buffer block is disposed between the first plate and the second plate, The connecting plate is provided in a region different from a region where the electronic device and the packing box overlap when viewed in a direction from the first plate toward the second plate.

10. A packaged article, characterized in that: The packaged article comprises: Electronic equipment; a packing box capable of housing the electronic device; and a buffer member, which is housed in the packing box and buffers external force applied to the electronic device housed in the packing box; The buffer member comprises: a first holding member including a first plate, a second plate, and a connecting plate, wherein the first plate is opposed to the electronic device when the buffer member and the electronic device are accommodated in the packing box, the second plate is opposed to an inner wall surface of the packing box when the buffer member and the electronic device are accommodated in the packing box, and the connecting plate connects the first plate and the second plate; as well as A first buffer block is disposed between the first plate and the second plate, The connecting plate is provided in a region different from a region where the electronic device and the packing box overlap when viewed in a direction from the first plate toward the second plate.

Images