A laminating device for processing a circuit board and a method of use

Abstract

The application discloses a kind of attaching device and use method for circuit board processing, including workbench, pressing plate, the workbench is connected with the drive mechanism for driving pressing plate lifting, the drive mechanism includes hydraulic cylinder, connecting column, the connecting column is connected with pressing mechanism, the pressing mechanism includes vertical plate, drive plate, spring two, the vertical plate is used for drive plate orientation, both ends of the spring two are connected with vertical plate, drive plate, the workbench is connected with shielding mechanism, jacking mechanism, monitoring mechanism, shielding mechanism includes two drive bases, two springs one, two stop blocks, the monitoring mechanism is used to monitor circuit board.The application can improve the bonding efficiency of substrate and adhesive plate, realize the strength detection of circuit board, is very intuitive, shorten the production time of circuit board, high efficiency, unload circuit board conveniently, flexible and convenient operation, replace the traditional circuit board placed in processing groove, it is inconvenient to take out the predicament, and practicality is strong.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to a bonding device for circuit board processing. Background Technology

[0002] Circuit boards (PCBs) miniaturize and visualize circuits, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout. The main raw materials required for PCB production include copper-clad laminates, copper foil, prepreg, chemicals, anodized copper / tin / nickel, dry film, and ink. During PCB production, the substrate and adhesive layer need to be bonded together to facilitate subsequent processing.

[0003] The traditional bonding method involves manually placing the substrate into the processing slot on the workbench, then inserting the adhesive plate and pressing it in. This is not only cumbersome to operate, but also inconvenient to remove the circuit board from the processing slot, requiring the use of other tools. After removal, it must be manually moved to the testing facility for strength testing, which is time-consuming, labor-intensive, prolongs the circuit board production cycle, and has low efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a bonding device for circuit board processing, which has the advantages of improving the bonding efficiency between the substrate and the adhesive board, realizing the strength test of the circuit board in a very intuitive way, shortening the circuit board manufacturing time, high efficiency, convenient unloading of the circuit board, and flexible and convenient operation, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a bonding device for circuit board processing, comprising a worktable and a pressure plate, wherein the worktable is connected to a drive mechanism for driving the pressure plate to rise and fall, the drive mechanism comprising a hydraulic cylinder and a connecting column, the hydraulic cylinder for driving the connecting column to rise and fall, the pressure plate being fixed to the bottom of the connecting column, the connecting column being connected to a pressing mechanism, the pressing mechanism comprising a vertical plate, a drive plate, and a second spring, the vertical plate for guiding the drive plate, the two ends of the second spring being connected to the vertical plate and the drive plate, the worktable being connected to a shielding mechanism, a lifting mechanism, and a monitoring mechanism, the shielding mechanism comprising two drive seats, two first springs, and two stops, the stops being connected to one side of the drive seats, the first springs for driving the drive seats to move away from the stops, the drive plate for driving the two stops to move closer to each other, and the drive plate for driving the lifting mechanism to rise and fall, and the monitoring mechanism for monitoring the circuit board; After the circuit board is bonded, the lifting mechanism presses against the circuit board, the stop block is connected to the circuit board, and the monitoring mechanism is activated. When the circuit board needs to be unloaded, the lifting mechanism supports the circuit board, the stop block separates from the circuit board, and the monitoring mechanism is turned off.

[0006] Preferably, the drive mechanism further includes a hydraulic rod and a cross plate. The power output end of the hydraulic cylinder is connected to the hydraulic rod, the bottom of the hydraulic rod is connected to the connecting column, the cross plate is fixedly connected to the connecting column, the top of the workbench is connected to a frame, and the hydraulic cylinder is connected to the frame.

[0007] Preferably, the pressing mechanism further includes a sliding block and an inner cavity, the inner cavity being disposed within the vertical plate, the sliding block being slidably connected to the inner cavity and fixed to the end of the drive plate, and the vertical plate being fixedly connected to the horizontal plate.

[0008] Preferably, the second spring is located inside the inner cavity, and both ends of the second spring are connected to the sliding block and the vertical plate.

[0009] Preferably, the blocking mechanism further includes two spring seats, two connecting slots, two drive columns, two inclined slots, and two guide seats. The guide seats are used to guide the drive seats. The spring seats are fixed to the top of the guide seats. The two ends of the first spring are connected to the drive seats and the spring seats. The inclined slots and connecting slots are both provided on the drive seats, and the inclined slots are connected to the connecting slots. The drive columns are slidably connected to the inclined slots. The drive plate is fixedly connected to the drive columns and slidably connected to the connecting slots.

[0010] Preferably, the guide seat is fixed to the top of the workbench, and the top of the guide seat is provided with multiple sliding grooves, and the drive seat is slidably connected to the sliding grooves.

[0011] Preferably, the lifting mechanism includes a top block, a top column, a pressure sensor, a lifting plate, and a fixed frame. The fixed frame is fixed to the bottom of the workbench and is used to support the lifting plate. The two ends of the lifting plate are connected to two drive plates, and the top midpoint of the lifting plate is connected to the top column. The top of the top column is connected to the top block. The pressure sensor is connected to the top column. The top block is used to lift the circuit board.

[0012] Preferably, the top of the workbench is provided with a limiting groove that matches the circuit board, and the workbench is provided with a fixing groove that matches the top block, and the fixing groove is connected to the limiting groove.

[0013] Preferably, the monitoring mechanism includes a base, a monitoring camera, and a control panel. The base is fixed to the top of the workbench, the monitoring camera is connected to the base, and the monitoring camera, pressure sensor, and control panel are electrically connected.

[0014] A method of using a bonding device for circuit board processing includes the following steps: Step 1: Place the substrate in the limiting groove, connect the adhesive plate and the pressure plate, and drive the pressure plate and vertical plate to descend synchronously with the hydraulic cylinder. The second spring is gradually compressed, while the positions of the drive plate and drive seat remain unchanged. The pressure plate is placed in the limiting groove, so that the substrate and adhesive plate are pressed together to achieve the bonding purpose. Step 2: The hydraulic cylinder drives the pressure plate and vertical plate to rise synchronously. Spring 2 applies an upward pulling force to the drive plate, which drives the drive column to move upward. The drive column slides in the inclined groove, driving the drive seat to move forward, that is, the two stops move closer to each other. Spring 1 is gradually stretched. At the same time, the upward movement of the drive plate synchronously drives the lifting plate to move upward, that is, the top column and top block move upward synchronously. The top block presses against the circuit board. The two stops are connected to the circuit board. The pressure plate continues to move upward, that is, the pressure applied by the top block to the circuit board increases. The deformation of the circuit board can be observed. The pressure sensor can feed back the pressure applied by the top block to the circuit board to the control panel. The monitoring camera transmits the circuit board pressure monitoring information to the control panel for easy observation. Step 3: After the circuit board is inspected, the hydraulic cylinder drives the pressure plate to move down a certain distance. The vertical plate and the drive plate move down synchronously. The stretched spring returns to its original position, causing the two stops to move away from each other, that is, the stops are separated from the circuit board. At the same time, the drive plate drives the lifting plate to move down, that is, the top block moves down synchronously, so that the circuit board is in a relaxed state, making it easy to remove the circuit board.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention is equipped with a pressing mechanism, a blocking mechanism, and a lifting mechanism. The pressing mechanism includes a vertical plate, a drive plate, a second spring, a sliding block, and an inner cavity. The blocking mechanism includes two drive seats, two first springs, two stops, two spring seats, two connecting grooves, two drive columns, two inclined grooves, and two guide seats. The lifting mechanism includes a top block, a top column, a pressure sensor, a lifting plate, and a fixing frame. The substrate is placed in the limiting groove to achieve initial limiting. The adhesive plate is connected to the bottom of the pressure plate. The hydraulic cylinder drives the pressure plate to move downward, causing the pressure plate to move closer to the limiting groove. The adhesive plate is pressed tightly against the substrate to form an integral part, improving the bonding efficiency between the substrate and the adhesive plate. The hydraulic cylinder drives the pressure plate and the vertical plate to rise synchronously. The second spring applies an upward pulling force to the drive plate, which drives the drive column to move upward. The drive column slides in the inclined groove, driving the drive seat forward. The first step involves moving the two stops closer together, gradually stretching the spring, and simultaneously moving the drive plate upwards, which in turn moves the lifting plate upwards, causing the top column and top block to move upwards simultaneously. The top block presses against the circuit board, and the two stops are connected to the circuit board. The pressure plate continues to move upwards, increasing the pressure applied to the circuit board by the top block, allowing for observation of the circuit board's deformation and enabling strength testing. This method is very intuitive, shortens the circuit board manufacturing time, and is highly efficient. When the circuit board needs to be unloaded, the hydraulic cylinder drives the pressure plate downwards a certain distance, and the vertical plate and drive plate move downwards simultaneously. The stretched spring returns to its original position, causing the two stops to move away from each other, separating the stops from the circuit board. At the same time, the drive plate moves the lifting plate downwards, causing the top block to move downwards simultaneously, allowing the circuit board to relax and be easily removed. This flexible and convenient operation replaces the traditional method where the circuit board is placed in the processing slot and difficult to remove, making it highly practical. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present invention; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is a bottom-view perspective view of the present invention; Figure 4 This is a perspective view of the rear side of the present invention; Figure 5 This is a front view of the present invention; Figure 6 This is a schematic diagram of the circuit board of the present invention in a compressed state; Figure 7 This is a front view of the present invention (the circuit board is in a relaxed state). Figure 8 This is a schematic diagram of the pressing mechanism of the present invention.

[0017] In the diagram: 1. Workbench; 2. Frame; 3. Hydraulic cylinder; 4. Hydraulic rod; 5. Connecting column; 6. Horizontal plate; 7. Vertical plate; 8. Drive plate; 9. Stop block; 10. Drive seat; 11. Guide seat; 12. Pressure plate; 13. Limit groove; 14. Top block; 15. Fixing frame; 16. Control panel; 17. Suction cup; 18. Connecting groove; 19. Spring 1; 20. Spring seat; 21. Slide groove; 22. Drive column; 23. Inclined groove; 24. Fixing groove; 25. Top column; 26. Pressure sensor; 27. Lifting plate; 28. Machine base; 29. ​​Monitoring camera; 30. Inner cavity; 31. Spring 2; 32. Sliding block. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1 to 8This invention provides a bonding device for circuit board processing, including a worktable 1 and a pressure plate 12. The worktable 1 is connected to a drive mechanism for driving the pressure plate 12 to rise and fall. The drive mechanism includes a hydraulic cylinder 3 and a connecting column 5. The hydraulic cylinder 3 drives the connecting column 5 to rise and fall, and the pressure plate 12 is fixed to the bottom of the connecting column 5. The connecting column 5 is connected to a pressing mechanism, which includes a vertical plate 7, a drive plate 8, and a second spring 31. The vertical plate 7 guides the drive plate 8, and the drive plate 8 has high stability when moving relative to the vertical plate 7. The two ends of the second spring 31 are connected to the vertical plate 7 and the drive plate 8. The worktable 1 is connected to a shielding mechanism, a lifting mechanism, and a monitoring mechanism. The shielding mechanism includes two drive seats 10, two first springs 19, and two stops 9. The stops 9 are connected to one side of the drive seats 10. The first spring 19 drives the drive seats 10 to move away from the stops 9. The drive plate 8 drives the two stops 9 to move closer to each other and drives the lifting mechanism to rise and fall. The monitoring mechanism monitors the circuit board.

[0020] During the bonding process, the substrate is placed in the limiting groove 13 to achieve initial positioning. The four corners of the bottom of the pressure plate 12 are connected to suction cups 17, which can hold the adhesive sheet. The hydraulic cylinder 3 drives the pressure plate 12 to move downward, so that the pressure plate 12 moves closer to the limiting groove 13. The adhesive sheet is pressed tightly against the substrate to form an integral whole, thereby improving the bonding efficiency between the substrate and the adhesive sheet.

[0021] After the circuit board is bonded, the hydraulic cylinder 3 drives the pressure plate 12 and the vertical plate 7 to rise synchronously. The second spring 31 applies an upward pulling force to the drive plate 8. The drive plate 8 drives the drive column 22 to move upward. The drive column 22 slides in the inclined groove 23, driving the drive seat 10 to move forward, that is, the two stops 9 move closer to each other, and the first spring 19 is gradually stretched. At the same time, the upward movement of the drive plate 8 synchronously drives the lifting plate 27 to move upward, that is, the top column 25 and the top block 14 move upward synchronously. The top block 14 presses against the circuit board, and the two stops 9 are connected to the circuit board. The pressure plate 12 continues to move upward, that is, the pressure applied by the top block 14 to the circuit board increases. The deformation of the circuit board can be observed, and the strength test of the circuit board can be realized. It is very intuitive, shortens the production time of the circuit board, and is highly efficient.

[0022] When the circuit board needs to be unloaded, the hydraulic cylinder 3 drives the pressure plate 12 to move down a certain distance, the vertical plate 7 and the drive plate 8 move down synchronously, the stretched spring 19 returns to its original position, so that the two stops 9 move away from each other, that is, the stops 9 are separated from the circuit board. At the same time, the drive plate 8 drives the lifting plate 27 to move down, that is, the top block 14 moves down synchronously, so that the circuit board is in a relaxed state, making it easy to remove the circuit board. The operation is flexible and convenient, replacing the traditional dilemma of the circuit board being placed in the processing tank and inconvenient to remove.

[0023] The drive mechanism also includes a hydraulic rod 4 and a cross plate 6. The power output end of the hydraulic cylinder 3 is connected to the hydraulic rod 4. The hydraulic cylinder 3 can drive the hydraulic rod 4 to extend and retract, thereby raising and lowering the connecting column 5, and thus driving the pressure plate 12 and the cross plate 6 to move. The bottom of the hydraulic rod 4 is connected to the connecting column 5, and the cross plate 6 is fixedly connected to the connecting column 5. The top of the workbench 1 is connected to the frame 2, and the hydraulic cylinder 3 is connected to the frame 2. The frame 2 provides good support for the hydraulic cylinder 3.

[0024] The pressing mechanism also includes a sliding block 32 and an inner cavity 30. The inner cavity 30 is located inside the vertical plate 7. The sliding block 32 is slidably connected to the inner cavity 30 and is fixed to the end of the drive plate 8. The vertical plate 7 is fixedly connected to the horizontal plate 6. During the lifting and lowering of the vertical plate 7, the sliding block 32 slides inside the inner cavity 30, which plays a good guiding role for the drive plate 8.

[0025] Spring 2 31 is located inside the inner cavity 30, and both ends of spring 2 31 are connected to the sliding block 32 and the vertical plate 7.

[0026] The shielding mechanism also includes two spring seats 20, two connecting slots 18, two drive columns 22, two inclined slots 23, and two guide seats 11. The guide seats 11 are used to guide the drive seat 10. The spring seats 20 are fixed to the top of the guide seats 11. The two ends of the spring 19 are connected to the drive seat 10 and the spring seats 20. The extension and retraction of the spring 19 can make the drive seat 10 move smoothly. The inclined slots 23 and the connecting slots 18 are both set on the drive seat 10, and the inclined slots 23 are connected to the connecting slots 18. The drive columns 22 are slidably connected to the inclined slots 23. The drive plate 8 is fixedly connected to the drive columns 22 and slidably connected to the connecting slots 18. The high point of the inclined groove 23 is f, and the low point is e. When the drive plate 8 rises, it applies an upward pulling force to the drive column 22, that is, the drive column 22 moves closer to point f, which can drive the drive seat 10 to move forward, that is, the two stops 9 move closer to each other. At this time, the spring 19 is gradually stretched. When the drive plate 8 moves down, it applies a downward pushing force to the drive column 22, and the drive column 22 moves closer to point e, which can drive the drive seat 10 to return to its original position, that is, the two stops 9 move further apart, and the spring 19 gradually returns to its original position.

[0027] The guide seat 11 is fixed to the top of the workbench 1, and the top of the guide seat 11 is provided with multiple slide grooves 21. The drive seat 10 is slidably connected to the slide grooves 21 to improve the stability of the reciprocating movement of the drive seat 10.

[0028] The lifting mechanism includes a top block 14, a top column 25, a pressure sensor 26, a lifting plate 27, and a fixing frame 15. The fixing frame 15 is fixed to the bottom of the workbench 1 and supports the lifting plate 27. The two ends of the lifting plate 27 are connected to two drive plates 8, and the midpoint of the top of the lifting plate 27 is connected to the top column 25. The top of the top column 25 is connected to the top block 14. The pressure sensor 26 is connected to the top column 25. The top block 14 is used to lift the circuit board. During the bonding process, the fixing frame 15 limits the lifting plate 27, meaning that the positions of the top column 25, the top block 14, and the drive plate 8 remain unchanged, while the pressure plate 12 and the vertical plate 7 move downwards synchronously. At this time, the second spring 31 is in a gradually compressed state.

[0029] The top of the workbench 1 is provided with a limiting groove 13 that matches the circuit board, and the workbench 1 is provided with a fixing groove 24 that matches the top block 14. The fixing groove 24 is connected to the limiting groove 13. During the bonding process, the top of the top block 14 is aligned with the bottom of the limiting groove 13.

[0030] The monitoring mechanism includes a base 28, a monitoring camera 29, and a control panel 16. The base 28 is fixed to the top of the workbench 1. The monitoring camera 29 is connected to the base 28, and the monitoring camera 29, pressure sensor 26, and control panel 16 are electrically connected. When the top block 14 increases the pressure on the circuit board, the pressure sensor 26 can detect specific data and feed it back to the control panel 16 for easy observation. At the same time, the monitoring camera 29 records the entire pressure test process and also feeds it back to the control panel 16 for subsequent recording and observation. When the circuit board separates from the stop block 9, the monitoring camera 29 stops.

[0031] A method of using a bonding device for circuit board processing includes the following steps: Step 1: Place the substrate in the limiting groove 13, connect the adhesive plate and the pressure plate 12, and drive the pressure plate 12 and the vertical plate 7 to descend synchronously. The spring 31 is gradually compressed, the positions of the drive plate 8 and the drive seat 10 remain unchanged, and the pressure plate 12 is placed in the limiting groove 13, so that the substrate and the adhesive plate are pressed together to achieve the bonding purpose. Step 2: The hydraulic cylinder 3 drives the pressure plate 12 and the vertical plate 7 to rise synchronously. The second spring 31 applies an upward pulling force to the drive plate 8. The drive plate 8 drives the drive column 22 to move upward. The drive column 22 slides in the inclined groove 23, driving the drive seat 10 to move forward, that is, the two stops 9 move closer to each other. The first spring 19 is gradually stretched. At the same time, the upward movement of the drive plate 8 synchronously drives the lifting plate 27 to move upward, that is, the top column 25 and the top block 14 move upward synchronously. The top block 14 presses against the circuit board. The two stops 9 are connected to the circuit board. The pressure plate 12 continues to move upward, that is, the pressure applied by the top block 14 to the circuit board increases. The deformation of the circuit board can be observed. The pressure sensor 26 can feed back the pressure applied by the top block 14 to the control panel 16. The monitoring camera 29 transmits the circuit board pressure monitoring information to the control panel 16 for easy observation. Step 3: After the circuit board is inspected, the hydraulic cylinder 3 drives the pressure plate 12 to move down a certain distance, the vertical plate 7 and the drive plate 8 move down synchronously, the stretched spring 19 returns to its original position, so that the two stops 9 move away from each other, that is, the stops 9 are separated from the circuit board. At the same time, the drive plate 8 drives the lifting plate 27 to move down, that is, the top block 14 moves down synchronously, so that the circuit board is in a relaxed state, making it easy to remove the circuit board.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A bonding device for circuit board processing, comprising a worktable (1) and a pressure plate (12), characterized in that: The workbench (1) is connected to a drive mechanism for driving the pressure plate (12) to rise and fall. The drive mechanism includes a hydraulic cylinder (3) and a connecting column (5). The hydraulic cylinder (3) is used to drive the connecting column (5) to rise and fall. The pressure plate (12) is fixed to the bottom of the connecting column (5). The connecting column (5) is connected to a pressing mechanism. The pressing mechanism includes a vertical plate (7), a drive plate (8), and a second spring (31). The vertical plate (7) is used to guide the drive plate (8). The two ends of the second spring (31) are connected to the vertical plate (7) and the drive plate (8). The workbench (1) is connected to the plate (8), and is equipped with a shielding mechanism, a lifting mechanism, and a monitoring mechanism. The shielding mechanism includes two drive seats (10), two springs (19), and two stops (9). The stops (9) are connected to one side of the drive seats (10). The springs (19) are used to drive the drive seats (10) to move away from the stops (9). The drive plate (8) is used to drive the two stops (9) to move closer to each other. The drive plate (8) is used to drive the lifting mechanism to rise and fall. The monitoring mechanism is used to monitor the circuit board. After the circuit board is bonded, the lifting mechanism presses against the circuit board, the stop (9) is connected to the circuit board, and the monitoring mechanism is activated; When the circuit board needs to be unloaded, the lifting mechanism supports the circuit board, the stop (9) separates from the circuit board, and the monitoring mechanism is turned off; The lifting mechanism includes a top block (14), a top column (25), a pressure sensor (26), a lifting plate (27), and a fixing frame (15). The fixing frame (15) is fixed to the bottom of the workbench (1) and is used to support the lifting plate (27). The two ends of the lifting plate (27) are connected to two drive plates (8), and the top midpoint of the lifting plate (27) is connected to the top column (25). The top of the top column (25) is connected to the top block (14). The pressure sensor (26) is connected to the top column (25). The top block (14) is used to lift the circuit board.

2. The bonding device for circuit board processing according to claim 1, characterized in that, The drive mechanism also includes a hydraulic rod (4) and a horizontal plate (6). The power output end of the hydraulic cylinder (3) is connected to the hydraulic rod (4). The bottom of the hydraulic rod (4) is connected to the connecting column (5). The horizontal plate (6) is fixedly connected to the connecting column (5). The top of the workbench (1) is connected to the frame (2). The hydraulic cylinder (3) is connected to the frame (2).

3. The bonding device for circuit board processing according to claim 2, characterized in that, The pressing mechanism also includes a sliding block (32) and an inner cavity (30). The inner cavity (30) is located inside the vertical plate (7). The sliding block (32) is slidably connected to the inner cavity (30) and fixed to the end of the drive plate (8). The vertical plate (7) is fixedly connected to the horizontal plate (6).

4. The bonding device for circuit board processing according to claim 3, characterized in that, The second spring (31) is located inside the inner cavity (30), and both ends of the second spring (31) are connected to the sliding block (32) and the vertical plate (7).

5. The bonding device for circuit board processing according to claim 1, characterized in that, The shielding mechanism also includes two spring seats (20), two connecting grooves (18), two drive columns (22), two inclined grooves (23), and two guide seats (11). The guide seats (11) are used to guide the drive seat (10). The spring seats (20) are fixed to the top of the guide seats (11). The two ends of the spring (19) are connected to the drive seat (10) and the spring seats (20). The inclined grooves (23) and the connecting grooves (18) are both located on the drive seat (10), and the inclined grooves (23) are connected to the connecting grooves (18). The drive columns (22) are slidably connected to the inclined grooves (23). The drive plate (8) is fixedly connected to the drive columns (22) and slidably connected to the connecting grooves (18).

6. The bonding device for circuit board processing according to claim 5, characterized in that, The guide seat (11) is fixed to the top of the workbench (1), and the top of the guide seat (11) is provided with multiple slide grooves (21), and the drive seat (10) is slidably connected to the slide grooves (21).

7. The bonding device for circuit board processing according to claim 1, characterized in that, The top of the workbench (1) is provided with a limiting groove (13) that matches the circuit board, and the workbench (1) is provided with a fixing groove (24) that matches the top block (14), and the fixing groove (24) is connected to the limiting groove (13).

8. The bonding device for circuit board processing according to claim 1, characterized in that, The monitoring mechanism includes a base (28), a monitoring camera (29), and a control panel (16). The base (28) is fixed to the top of the workbench (1). The monitoring camera (29) is connected to the base (28), and the monitoring camera (29), pressure sensor (26), and control panel (16) are electrically connected.

9. A method of using a bonding device for circuit board processing, characterized in that: The operation includes the following steps: Step 1: Place the substrate in the limiting groove (13), connect the adhesive plate and the pressure plate (12), drive the pressure plate (12) and the vertical plate (7) to descend synchronously, the second spring (31) is gradually compressed, the positions of the drive plate (8) and the drive seat (10) remain unchanged, the pressure plate (12) is placed in the limiting groove (13), so that the substrate and the adhesive plate are pressed together to achieve the purpose of bonding; Step 2: The hydraulic cylinder (3) drives the pressure plate (12) and the vertical plate (7) to rise synchronously. The second spring (31) applies an upward pulling force to the drive plate (8). The drive plate (8) drives the drive column (22) to move upward. The drive column (22) slides in the inclined groove (23) and drives the drive seat (10) to move forward. That is, the two stops (9) approach each other. The first spring (19) is gradually stretched. At the same time, the upward movement of the drive plate (8) drives the lifting plate (27) to move upward. That is, the top column (25) and the top block (14) move upward synchronously. The top block (14) presses against the circuit board. The two stops (9) are connected to the circuit board. The pressure plate (12) continues to move upward. That is, the pressure applied by the top block (14) to the circuit board increases. The deformation of the circuit board can be observed. The pressure sensor (26) can feed back the pressure applied by the top block (14) to the control panel (16). The monitoring camera (29) transmits the circuit board pressure monitoring information to the control panel (16) for easy observation. Step 3: After the circuit board is inspected, the hydraulic cylinder (3) drives the pressure plate (12) to move down a certain distance, the vertical plate (7) and the drive plate (8) move down synchronously, the stretched spring (19) returns to its original position, so that the two stops (9) move away from each other, that is, the stops (9) are separated from the circuit board. At the same time, the drive plate (8) drives the lifting plate (27) to move down, that is, the top block (14) moves down synchronously, so that the circuit board is in a relaxed state, making it easy to remove the circuit board.

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