Electronic component forming process

Abstract

The present invention relates to the field of non-standard automation technology, and particularly relates to an electronic component forming process, which includes a turntable device, a feeding device, a calibration device, a forming device, a shaping device, a pin casing device, a ring clamping device, and a discharging device. A plurality of clamping components are arranged around the turntable device, and the clamping components are used to clamp and fix the electronic components. The turntable device is used to drive the clamping components and the clamped electronic components to rotate and transmit; the feeding device is used to grab and place the electronic components into the clamping components; the calibration device is used to center and calibrate the electronic components clamped by the clamping components; the forming device is used to bend the pins of the electronic components clamped by the clamping components into shape; the shaping device shapes the bent pins. The present utility model solves the problems of high difficulty in manual bending and casing, etc. It realizes full automation, has high structural precision, saves manpower, and has high production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of non-standard automation technology, and particularly to a forming process for electronic components. Background Art

[0002] Automation technology is widely used in industries such as industry, agriculture, military, scientific research, transportation, commerce, medical treatment, services, and households. The adoption of automation technology can not only liberate people from heavy physical labor, partial mental labor, and harsh and dangerous working environments, but also expand the functions of human organs, greatly improve labor productivity, and enhance the ability of humans to understand and transform the world. Large-scale complete sets of equipment in an automation system are also called automation devices. It refers to the process in which a machine or device automatically operates or controls according to a specified program or instruction without human intervention.

[0003] During the production process of an electronic component diode, it is necessary to sleave a sleeve outside and bend the pins into a specified shape. Currently, most of this process is completed through manual operation. The pin bending is completed through a jig. During the bending process, the efficiency is low, the manual operation cost is high, and it is also difficult to master the forming accuracy. Summary of the Invention

[0004] To solve the above problems, the present invention provides a forming process for electronic components that solves the problems of high difficulty in manual bending and sleeving, etc., realizes full automation, has high structural accuracy, saves manpower, and has high production efficiency.

[0005] The technical solution adopted by the present invention is: a forming process for electronic components, including a turntable device, a feeding device, a correction device, a forming device, a shaping device, a pin sleeving device, a ring clamping device, and a discharging device. A plurality of clamping components are arranged around the turntable device. The clamping components are used to clamp and fix the electronic components. The turntable device is used to drive the clamping components and the clamped electronic components to rotate and transmit; the feeding device is used to grab and place the electronic components into the clamping components; the correction device is used to center and correct the electronic components clamped by the clamping components; the forming device is used to bend the pins of the electronic components clamped by the clamping components into shape; the shaping device shapes the bent pins; the pin sleeving device is used to sleave a sleeve on the shaped pins; the ring clamping device is used to clamp the sleeve on the pins and sleave the sleeve in place; the discharging device is used to grab and discharge the formed electronic components with sleeves from the clamping components;

[0006] The forming device includes a forming support frame, a forming lifting assembly, a forming clamping assembly, a first roll forming assembly, and a second roll forming assembly. The forming lifting assembly includes a forming lifting drive module installed on the forming support frame and a forming lifting bracket installed at the drive end of the forming lifting drive module. The forming clamping assembly includes positioning modules installed on the forming lifting bracket on both sides of the forming clamping assembly and used for pin positioning of electronic components, and clamping claws connected to the forming clamping assembly and used for clamping and fixing both ends of the electronic components. The positioning module is used for one-side positioning of the pins of the electronic components. The first roll forming assembly is installed on the forming lifting bracket and on one side of the forming clamping assembly. The first roll forming assembly is provided with a first pressure roller, and the first pressure roller is used for roll forming one pin positioned by the clamping claws and the positioning module. The second roll forming assembly is installed on the forming lifting bracket and on the side far from the first roll forming assembly. The second roll forming assembly is provided with a second pressure roller, and the second pressure roller is used for roll forming the other pin positioned by the clamping claws and the positioning module.

[0007] Two groups of sizing devices are symmetrically provided and are respectively used for sizing the two pins of the electronic component. The sizing device includes a sizing support frame, a sizing pushing cylinder installed on the sizing support frame, a sizing sliding plate connected to the sizing pushing cylinder, and a sizing module installed on the sizing sliding plate. The sizing module includes a first sizing cylinder, a sizing connecting rod connected to the first sizing cylinder, and a sizing block connected to the sizing connecting rod. The sizing block is provided with a sizing groove. One side of the sizing groove is provided with a forming groove. One side of the forming groove is provided with a bending connecting rod, and the bending connecting rod is connected with a second sizing cylinder. The sizing groove is used for sizing the pins of the electronic component, and the second sizing cylinder is used for driving the bending connecting rod to bend the pins and form them on the forming groove.

[0008] The bent pin forming process includes the following steps:

[0009] S1. The feeding device grabs the electronic component and horizontally places the grabbed electronic component remotely onto the clamping assembly, and the clamping assembly clamps and fixes the electronic component.

[0010] S2. The turntable device rotates and drives the clamping assembly and the electronic component to rotate and convey to the calibration device, and the calibration device centers and calibrates the electronic component on the clamping assembly.

[0011] S3. The turntable device continues to rotate and drives the calibrated electronic component to be conveyed to the forming device. The forming device drives the forming clamping assembly to clamp both ends of the electronic component through the forming lifting assembly and position the pins. After positioning, the two end pins are roll formed by the first roll forming assembly and the second roll forming assembly.

[0012] S4, The turntable device continues to rotate and drives the electronic components after pin forming to be conveyed to the shaping device. The shaping device positions the formed pins through the shaping grooves. After positioning, under the action of the second shaping cylinder, the bending link is driven to press the pins into the shaping grooves, realizing secondary bending and shaping.

[0013] S5, The turntable device continues to rotate and drives the electronic components with pins after secondary bending and shaping to be conveyed to the pin sleeving device. The pin sleeving device sleevs sleeves on the pins after secondary bending and shaping.

[0014] S6, The turntable device continues to rotate and drives the electronic components with sleeves on the pins to be conveyed to the ring clamping device. The ring clamping device clamps and presses the sleeves tightly onto the pins.

[0015] S7, The turntable device continues to rotate and drives the electronic components with sleeves tightly pressed onto the pins to be conveyed to the blanking device. The blanking device grabs and blanks the electronic components.

[0016] A further improvement to the above solution is that the turntable device includes a turntable drive module, a disc connected to the turntable drive module, and an open-clamping drive component located below the disc and used to drive the clamping component to open the clamp.

[0017] A further improvement to the above solution is that the clamping component includes a clamping base, a clamping link installed on the clamping base, and a fixed clamping jaw connected to the clamping link. The open-clamping drive component includes an open-clamping drive cylinder, and the open-clamping drive cylinder is used to drive the clamping link to drive the fixed clamping jaw to open the clamp.

[0018] A further improvement to the above solution is that the loading device includes a linear cylinder, a first transfer component and a second transfer component connected to the linear cylinder, and a rotary positioning component for positioning the electronic components.

[0019] A further improvement to the above solution is that the first transfer component includes a first lifting cylinder, a first rotary cylinder connected to the first lifting cylinder, and a first air gripper connected to the first rotary cylinder. The linear cylinder is used to drive the first transfer component to drive the electronic components to transfer. The first rotary cylinder is used to drive the electronic components clamped by the first air gripper to be flipped and placed into the rotary positioning component.

[0020] A further improvement to the above solution is that the second transfer component includes a second lifting cylinder and a second air gripper connected to the second lifting cylinder. The second air gripper is used to grab the electronic components on the rotary positioning component and place them into the clamping component.

[0021] A further improvement to the above solution is that the rotation positioning assembly includes a second rotation cylinder and a third air gripper connected to the second rotation cylinder. The third air gripper is used to hold the electronic component, and the second rotation cylinder is used to drive the third air gripper to rotate and drive the electronic component to rotate.

[0022] A further improvement to the above solution is that the calibration device includes a calibration bracket, a calibration lifting cylinder installed on the calibration bracket, and two sets of calibration clamping cylinders symmetrically connected to both sides of the calibration lifting cylinder. The calibration clamping cylinders are connected with calibration jaws, and the two sets of symmetric calibration clamping cylinders are used to drive the calibration jaws to center and calibrate the electronic component.

[0023] A further improvement to the above solution is that the forming lifting bracket includes a substrate connected to the forming lifting drive module and a T-shaped plate adjustably installed on the substrate. The forming clamping assembly and the first roll forming assembly are both installed on the substrate, and the second roll forming assembly is installed on one side of the T-shaped plate;

[0024] A further improvement to the above solution is that the T-shaped plate is provided with a main shaft hole for connecting the substrate and an adjustment slot. The adjustment slot is arc-shaped, and the T-shaped plate can be adjustably installed on the substrate with the main shaft hole as the center through the adjustment slot;

[0025] A further improvement to the above solution is that the positioning module is a positioning plate installed on both sides of the forming clamping assembly. The positioning plate extends towards the forming clamping assembly with a positioning block, and the positioning block is installed with a positioning shaft pin, and the positioning shaft pin is provided with a positioning needle;

[0026] A further improvement to the above solution is that the clamping jaw is an L-shaped clamping jaw. The L-shaped clamping jaw includes a clamping surface and a positioning surface. The clamping surface is used for clamping and fixing the end face of the electronic component, the positioning needle is used for positioning the pins on one side of the electronic component, and the positioning surface is used for positioning the pins on the other side of the electronic component.

[0027] A further improvement to the above solution is that the first roll forming assembly is provided with a first roll forming drive cylinder and a first roll forming block connected to the first roll forming drive cylinder. The first pressure roll is installed on the first roll forming block. The outer diameter of the first pressure roll is provided with a first roll forming groove, and the first pressure roll is provided with a first adjustment shaft. The first pressure roll can be adjustably installed on the first roll forming block through the first adjustment shaft;

[0028] A further improvement to the above solution is that the second roll forming assembly is provided with a second roll forming drive cylinder and a second roll forming block connected to the second roll forming drive cylinder. The second pressure roll is installed on the second roll forming block, and the second roll forming drive cylinder is obliquely installed on the forming lifting bracket;

[0029] A further improvement to the above solution is that the outer diameter of the second pressure roller is provided with a second roller pressing groove, the second pressure roller is provided with a second adjusting shaft, and the second pressure roller is adjustably installed on the second roller pressing block through the second adjusting shaft.

[0030] A further improvement to the above solution is that the pin sleeve device includes a sleeve feeding component, a sleeve guiding component for positioning and guiding the sleeve, a sleeve driving component for driving and feeding the sleeve, a sleeve positioning component for clamping and positioning the sleeve, a sleeving component for clamping the sleeve and sleeving it onto the pin, and a cutting component for cutting the sleeve;

[0031] A further improvement to the above solution is that the sleeve feeding component is located above the sleeve guiding component and is used to feed the sleeve into the sleeve guiding component. The sleeve driving component includes a driving wheel and a driven wheel, there is a gap between the driving wheel and the driven wheel, the driving wheel is connected to a driving motor, and the driving motor is used to drive the driving wheel and synchronously drive the driven wheel for conveying the sleeve on the gap;

[0032] A further improvement to the above solution is that the sleeve positioning component includes a positioning bushing located below the gap and a sleeve clamp. The sleeve clamp is used to clamp and position the sleeve led out by the positioning bushing. The cutting component is located above the sleeve positioning component and has a cutting knife, and the cutting knife is used to cut the sleeve led out by the positioning bushing;

[0033] A further improvement to the above solution is that the sleeving component includes a sleeving lifting cylinder and a sleeving clamp connected to the sleeving lifting cylinder. The sleeving clamp is used to clamp the cut sleeve and sleeve it onto the pin.

[0034] A further improvement to the above solution is that the ring clamp device includes a ring clamp bracket, a first ring clamp lifting cylinder installed on the ring clamp bracket, a second ring clamp lifting cylinder connected to the first ring clamp lifting cylinder, and a ring clamp gripper connected to the second ring clamp lifting cylinder. The ring clamp gripper is connected to a pipe pressing gripper, and the pipe pressing gripper is provided with a first pipe pressing groove and a second pipe pressing groove. A first pipe pressing fixing ring is installed in the first pipe pressing groove, and a second pipe pressing fixing ring is installed in the second pipe pressing groove;

[0035] A further improvement to the above solution is that the ring clamp gripper is used to drive the pipe pressing gripper to drive the first and second pipe pressing grooves to clamp the two pins of the electronic component, and press the sleeve under the action of the first and second pipe pressing fixing rings;

[0036] A further improvement to the above solution is that the blanking device includes a blanking support, a blanking linear module installed on the blanking support, a blanking lifting module installed on the blanking linear module, and a blanking gripping component installed on the blanking lifting module. The blanking gripping component is used to grip and blank electronic components on the clamping component.

[0037] The beneficial effects of the present invention are as follows:

[0038] Compared with the existing pin bending and forming of electronic components, the present invention adopts full automation. The feeding device feeds the electronic components onto the clamping element, the clamping components on the turntable clamp the electronic components and rotate and transmit them under the action of the turntable device. The correction device first centers and corrects the position of the electronic components. After correction, the forming device bends the pins of the electronic components into a specified shape. Then, the shaping device bends and shapes the pins a second time. After positioning, the pin sleeve device sleeves the sleeve onto the pins. Then, the ring clamp device clamps the sleeve onto the pins and sleeves the sleeve in place. Finally, the blanking device grabs and blanks the formed electronic components with sleeves from the clamping component. The above entire process is completed fully automatically, without manual operation, solving the problems of high difficulty in manual bending and forming and high difficulty in sleeving existing ones, achieving full automation, high structural accuracy, labor saving, and high production efficiency. Specifically, a turntable device, a feeding device, a correction device, a forming device, a shaping device, a pin sleeve device, a ring clamp device, and a blanking device are provided. A plurality of clamping components are arranged around the turntable device. The clamping components are used to clamp and fix the electronic components. The turntable device is used to drive the clamping components and the clamped electronic components to rotate and transmit; the feeding device is used to grab and place the electronic components into the clamping components; the correction device is used to center and correct the electronic components clamped by the clamping components; the forming device is used to bend and form the pins of the electronic components clamped by the clamping components; the shaping device shapes the bent pins; the pin sleeve device is used to sleeve the sleeve onto the shaped pins; the ring clamp device is used to clamp the sleeve onto the pins and sleeve the sleeve in place; the blanking device is used to grab and blank the formed electronic components with sleeves from the clamping components. The entire process is completed fully automatically, saving labor, without manual interference, and having a high degree of automation.

[0039] The forming device includes a forming support frame, a forming lifting assembly, a forming clamping assembly, a first roll forming assembly, and a second roll forming assembly. The forming lifting assembly includes a forming lifting drive module installed on the forming support frame and a forming lifting bracket installed at the drive end of the forming lifting drive module. The forming clamping assembly includes a positioning module installed on the forming lifting bracket on both sides of the forming clamping assembly and used for pin positioning of the electronic component, and a clamping claw connected to the forming clamping assembly and used for clamping and fixing both ends of the electronic component. The positioning module is used for one-side positioning of the pins of the electronic component. The first roll forming assembly is installed on the forming lifting bracket and on one side of the forming clamping assembly. The first roll forming assembly is provided with a first pressure roller, and the first pressure roller is used for roll forming one pin positioned by the clamping claw and the positioning module. The second roll forming assembly is installed on the forming lifting bracket and on the side away from the first roll forming assembly. The second roll forming assembly is provided with a second pressure roller, and the second pressure roller is used for roll forming the other pin positioned by the clamping claw and the positioning module. During the forming process, both ends and pins of the diode are fixed and positioned by the forming clamping assembly. After positioning, the pins at both ends of the diode are roll formed by two groups of roll forming assemblies. During this process, the forming and fixing assembly clamps and fixes the electronic component, ensuring the stability of the structure forming, solving the problem of high difficulty in forming the pins of electronic components, especially for forming special-shaped pins, realizing automatic pin forming, with good forming effect and high structural accuracy. The entire forming process is as follows: the forming and fixing assembly rotates to the lower part of the forming clamping assembly under the action of the turntable, drives the forming lifting bracket to descend under the action of the forming lifting drive module. When it descends to the specified position, the positioning module positions the pins at both ends of the electronic component. The forming clamping assembly drives the clamping claw to simultaneously position both ends and the pins of the electronic component. Then, the positioning module and the clamping claw cooperate to position both sides of the pins. After positioning, the pins at both ends are roll formed under the action of two groups of roll forming assemblies, realizing fully automatic pin forming.

[0040] The bent pin forming process includes the following steps: S1, the feeding device grabs the electronic components and horizontally places the grabbed electronics remotely onto the clamping assembly, and the clamping assembly clamps and fixes the electronic components; S2, the turntable device rotates and drives the clamping assembly and the electronic components to rotate and convey them to the calibration device, and the calibration device centers and calibrates the electronic components on the clamping assembly; S3, the turntable device continues to rotate and drives the calibrated electronic components to be conveyed to the forming device, and the forming device drives the forming clamping assembly through the forming lifting assembly to clamp both ends of the electronic component and position the pins. After positioning, the two ends of the pins are roll-formed by the first roll-forming assembly and the second roll-forming assembly; S4, the turntable device continues to rotate and drives the electronic components with formed pins to be conveyed to the shaping device. The shaping device positions the formed pins through the shaping groove. After positioning, under the action of the second shaping cylinder, the pressing and bending connecting rod is driven to press the pins into the shaping groove to achieve secondary bending and shaping; S5, the turntable device continues to rotate and drives the electronic components with pins shaped by secondary bending to be conveyed to the pin sleeving device, and the pin sleeving device sleevs sleeves on the pins shaped by secondary bending; S6, the turntable device continues to rotate and drives the electronic components with sleeves on the pins to be conveyed to the ring clamping device, and the ring clamping device clamps and presses the sleeves onto the pins; S7, the turntable device continues to rotate and drives the electronic components with sleeves pressed in place on the pins to be conveyed to the unloading device, and the unloading device grabs and unloads the electronic components. The above steps realize the full automation of the pin forming, shaping and sleeving of electronic components. The whole process has a high degree of automation, does not require manual intervention, and has high production efficiency. Brief Description of the Drawings

[0041] Figure 1 is a three-dimensional schematic diagram of the forming equipment of the present invention;

[0042] Figure 2 is Figure 1 a three-dimensional schematic diagram of another perspective of the forming equipment in

[0043] Figure 3 is Figure 1 a three-dimensional schematic diagram of the turntable device of the forming equipment in

[0044] Figure 4 is Figure 1 a three-dimensional schematic diagram of the feeding device of the forming equipment in

[0045] Figure 5 is Figure 1 a three-dimensional schematic diagram of the calibration device of the forming equipment in

[0046] Figure 6 is Figure 1 a three-dimensional schematic diagram of the forming device of the forming equipment in

[0047] Figure 7 is Figure 6Partial structural schematic diagram of the middle forming device;

[0048] Figure 8 is Figure 6 Partial structural schematic diagram of the middle forming device from another perspective;

[0049] Figure 9 is Figure 6 Structural schematic diagram of the first roll forming assembly of the middle forming device;

[0050] Figure 10 is Figure 6 Structural schematic diagram of the second roll forming assembly of the middle forming device;

[0051] Figure 11 is Figure 1 Three-dimensional schematic diagram of the shaping device of the middle forming equipment;

[0052] Figure 12 is Figure 11 Partial structural schematic diagram of the shaping device;

[0053] Figure 13 is Figure 1 Three-dimensional schematic diagram of the pin sleeve device of the middle forming equipment;

[0054] Figure 14 is Figure 13 Enlarged schematic diagram at position A in the middle;

[0055] Figure 15 is Figure 1 Three-dimensional schematic diagram of the ring clamp device of the middle forming equipment;

[0056] Figure 16 is Figure 1 Three-dimensional schematic diagram of the blanking device of the middle forming equipment;

[0057] Figure 17 Process schematic diagram of the forming process of the present invention.

[0058] Explanation of reference numerals: Turntable device 1, clamping assembly 11, clamping base 111, clamping link 112, fixed jaw 113, turntable drive module 12, disc 13, clamp opening drive assembly 14, clamp opening drive cylinder 141;

[0059] Feeding device 2, linear cylinder 21, first transfer assembly 22, first lifting cylinder 221, first rotating cylinder 222, first gripper 223, second transfer assembly 23, second lifting cylinder 231, second gripper 232, rotation positioning assembly 24, second rotating cylinder 241, third gripper 242,

[0060] Calibration device 3, calibration bracket 31, calibration lifting cylinder 32, calibration clamping cylinder 33, calibration jaws 34;

[0061] Forming device 4, forming support frame 41, forming lifting assembly 42, lifting drive module 421, forming lifting bracket 422, substrate 4221, T-shaped plate 4222, forming clamping assembly 43, positioning module 431, positioning plate 4311, positioning block 4312, positioning shaft pin 4313, positioning needle 4314, clamping claw 432, clamping surface 4321, positioning surface 4322, first roll forming assembly 44, first pressure roller 441, first roll forming drive cylinder 442, first roll forming block 443, first roll forming groove 444, first adjusting shaft 445, second roll forming assembly 45, second pressure roller 451, second roll forming drive cylinder 452, second roll forming block 453, second roll forming groove 454, second adjusting shaft 455;

[0062] Sizing device 5, sizing support 51, sizing push cylinder 52, sizing sliding plate 53, sizing module 54, first sizing cylinder 541, sizing connecting rod 542, sizing block 543, sizing groove 544, forming groove 545, bending connecting rod 546, second sizing cylinder 547;

[0063] Pin sleeve device 6, sleeve feeding assembly 61, sleeve guiding assembly 62, sleeve driving assembly 63, driving wheel 631, driven wheel 632, driving motor 633, sleeve positioning assembly 64, positioning bushing 641, sleeve clamping claw 642, sleeving assembly 65, sleeving lifting cylinder 651, sleeving clamping claw 652, cutting assembly 66;

[0064] Ring clamping device 7, ring clamping support 71, first ring clamping lifting cylinder 72, second ring clamping lifting cylinder 73, ring clamping jaw 74, pipe pressing claw 75, first pipe pressing groove 751, second pipe pressing groove 752;

[0065] Blank discharging device 8, blank discharging support 81, blank discharging linear module 82, blank discharging lifting module 83, blank discharging grasping assembly 84. Detailed implementation mode

[0066] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0067] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention.

[0069] As Figures 1 to 17 shown, in one embodiment of the present invention, the bent pin forming process includes the following steps: S1, the feeding device grabs the electronic component and horizontally places the grabbed electronic component remotely onto the clamping component, and the clamping component clamps and fixes the electronic component; S2, the turntable device rotates and drives the clamping component and the electronic component to rotate and convey to the calibration device, and the calibration device centers and calibrates the electronic component on the clamping component; S3, the turntable device continues to rotate and drives the calibrated electronic component to convey to the forming device, and the forming device drives the forming clamping component to clamp both ends of the electronic component through the forming lifting component and position the pins. After positioning, the first roll forming component and the second roll forming component roll form both ends of the pins; S4, the turntable device continues to rotate and drives the electronic component with formed pins to convey to the shaping device, and the shaping device positions the formed pins through the shaping groove. After positioning, under the action of the second shaping cylinder, the bending connecting rod is driven to press the pins into the shaping groove to achieve secondary bending and shaping; S5, the turntable device continues to rotate and drives the electronic component with secondary bent and shaped pins to convey to the pin sleeving device, and the pin sleeving device sleevs sleeves on the pins with secondary bent and shaped pins; S6, the turntable device continues to rotate and drives the electronic component with sleeves sleeved on the pins to convey to the ring clamping device, and the ring clamping device clamps and presses the sleeves onto the pins; S7, the turntable device continues to rotate and drives the electronic component with sleeves pressed in place on the pins to convey to the discharging device, and the discharging device grabs and discharges the electronic component. The above steps realize the full automation of the forming, shaping and sleeving of the electronic component pins. The whole process has a high degree of automation, does not require manual intervention, and has high production efficiency.

[0070] As Figures 1 to 16As shown in the figure, a molding device for implementing the above embodiments is provided with a turntable device 1, a feeding device 2, a calibration device 3, a molding device 4, a shaping device 5, a pin sleeve device 6, a ring clamping device 7, and a discharging device 8. A plurality of clamping components 11 are arranged around the turntable device 1. The clamping components 11 are used to clamp and fix electronic components. The turntable device 1 is used to drive the clamping components 11 and the clamped electronic components to rotate and transmit. The feeding device 2 is used to grab and place electronic components into the clamping components 11. The calibration device 3 is used to center and calibrate the electronic components clamped by the clamping components 11. The molding device 4 is used to bend the pins of the electronic components clamped by the clamping components 11 into a certain shape. The shaping device 5 shapes the bent pins. The pin sleeve device 6 is used to sleeved a sleeve on the shaped pins. The ring clamping device 7 is used to clamp the sleeve on the pins and put the sleeve in place. The discharging device 8 is used to grab and discharge the electronic components with shaped pins and sleeves from the clamping components 11.

[0071] Referring to Figure 3 As shown in the figure, a further improvement to the above embodiments is that the turntable device 1 includes a turntable driving module 12, a disk 13 connected to the turntable driving module 12, and an opening clamping driving component 14 located below the disk 13 and used to drive the clamping components 11 to open the clamp. The disk 13 is driven to rotate by the turntable driving module 12, and the clamping components 11 are driven to rotate during rotation to realize the conveying of electronic components.

[0072] A further improvement to the above embodiments is that the clamping component 11 includes a clamping base 111, a clamping connecting rod 112 installed on the clamping base 111, and a fixed clamping jaw 113 connected to the clamping connecting rod 112. The opening clamping driving component 14 includes an opening clamping driving cylinder 141. The opening clamping driving cylinder 141 is used to drive the clamping connecting rod 112 to drive the fixed clamping jaw 113 to open the clamp. By driving the clamping connecting rod 112 by the opening clamping driving cylinder 141 to drive the fixed clamping jaw 113 to open the clamp, the electronic components clamped by the clamping component 11 can be released.

[0073] Referring to Figure 4 As shown in the figure, a further improvement to the above embodiments is that the feeding device 2 includes a linear cylinder 21, a first transfer component 22 and a second transfer component 23 connected to the linear cylinder 21, and a rotary positioning component 24 for positioning electronic components. During the feeding process, the linear cylinder 21 drives the first transfer component 22 and the second transfer component 23 to work alternately to realize automatic feeding.

[0074] A further improvement to the above embodiments is that the first transfer assembly 22 includes a first lifting cylinder 221, a first rotary cylinder 222 connected to the first lifting cylinder 221, and a first air gripper 223 connected to the first rotary cylinder 222. The linear cylinder 21 is used to drive the first transfer assembly 22 to drive the transfer of the electronic component. The first rotary cylinder 222 is used to drive the electronic component held by the first air gripper 223 to be flipped and placed into the rotary positioning assembly 24. The second transfer assembly 23 includes a second lifting cylinder 231 and a second air gripper 232 connected to the second lifting cylinder 231. The second air gripper 232 is used to grab the electronic component on the rotary positioning assembly 24 and place it into the clamping assembly 11. The rotary positioning assembly 24 includes a second rotary cylinder 241 and a third air gripper 242 connected to the second rotary cylinder 241. The third air gripper 242 is used to clamp the electronic component, and the second rotary cylinder 241 is used to drive the third air gripper 242 to rotate and drive the electronic component to rotate.

[0075] Referring to Figure 5 As shown, a further improvement to the above embodiments is that the calibration device 3 includes a calibration bracket 31, a calibration lifting cylinder 32 installed on the calibration bracket 31, and two groups of calibration clamping cylinders 33 symmetrically connected to both sides of the calibration lifting cylinder 32. The calibration clamping cylinders 33 are connected with calibration jaws 34. The two groups of symmetric calibration clamping cylinders 33 are used to drive the calibration jaws 34 to center and calibrate the electronic component. Using two groups of symmetric calibration clamping cylinders 33 to drive the calibration jaws 34 to clamp and center the electronic component is convenient for subsequent molding.

[0076] Referring to Figures 6 to 10As shown in the figure, a further improvement to the above embodiment is that the forming device 4 includes a forming support frame 41, a forming lifting assembly 42, a forming clamping assembly 43, a first roll forming assembly 44, and a second roll forming assembly 45. The forming lifting assembly 42 includes a forming lifting drive module 421 installed on the forming support frame 41 and a forming lifting bracket 422 installed at the drive end of the forming lifting drive module 421. The forming clamping assembly 43 includes a positioning module 431 installed on the forming lifting bracket 422, located on both sides of the forming clamping assembly 43 and used for pin positioning of electronic components, and a clamping claw 432 connected to the forming clamping assembly 43 and used for clamping and fixing both ends of the electronic components. The positioning module 431 is used for one-side positioning of the pins of the electronic components. The first roll forming assembly 44 is installed on the forming lifting bracket 422 and located on one side of the forming clamping assembly 43. The first roll forming assembly 44 is provided with a first pressure roller 441, and the first pressure roller 441 is used for roll forming one pin positioned by the clamping claw 432 and the positioning module 431. The second roll forming assembly 45 is installed on the forming lifting bracket 422 and on the side far from the first roll forming assembly 44. The second roll forming assembly 45 is provided with a second pressure roller 451, and the second pressure roller 451 is used for roll forming the other pin positioned by the clamping claw 432 and the positioning module 431. During the forming process, the two ends and pins of the diode are fixed and positioned by the forming clamping assembly 43. After positioning, the pins at both ends of the diode are roll formed by two groups of roll forming assemblies. During this process, the forming fixing assembly clamps and fixes the electronic components, ensuring the stability of the structure forming, solving the problem of high difficulty in forming the pins of electronic components in the prior art, especially for forming special-shaped pins, realizing automatic pin forming, with good forming effect and high structural accuracy. The whole forming process is as follows: the forming fixing assembly rotates to the lower part of the forming clamping assembly 43 under the action of the turntable, drives the forming lifting bracket 422 to descend under the action of the forming lifting drive module 421. When it descends to the specified position, the positioning module 431 positions the pins at both ends of the electronic component, and the forming clamping assembly 43 drives the clamping claw 432 to position both ends and pins of the electronic component simultaneously. Then, the positioning module 431 and the clamping claw 432 cooperate to position both sides of the pin. After positioning, the pins at both ends are roll formed under the action of two groups of roll forming assemblies, realizing fully automatic pin forming.

[0077] A further improvement to the above embodiment is that the forming lifting bracket 422 includes a base plate 4221 connected to the forming lifting drive module 421 and a T-shaped plate 4222 adjustably mounted on the base plate 4221. The forming clamping assembly 43 and the first roll forming assembly 44 are both mounted on the base plate 4221, and the second roll forming assembly 45 is mounted on one side of the T-shaped plate 4222. The forming lifting drive module 421 designed with a slide table cylinder can be used to drive the forming lifting bracket 422 to rise and fall. In addition, the forming lifting bracket 422 has a base plate 4221 for structural installation, and the T-shaped plate 4222 is for the installation of the second roll forming assembly 45.

[0078] A further improvement to the above embodiment is that the T-shaped plate 4222 is provided with a main shaft hole for connecting the base plate 4221 and an adjustment slot. The adjustment slot is arc-shaped, and the T-shaped plate 4222 can be adjustably mounted on the base plate 4221 with the main shaft hole as the center through the adjustment slot. The opening of the main shaft hole allows the T-shaped plate 4222 to be rotated and adjusted, and thus the angle of the pins to be formed can be adjusted.

[0079] A further improvement to the above embodiment is that the positioning module 431 is a positioning plate 4311 mounted on both sides of the forming clamping assembly 43. The positioning plate 4311 extends towards the forming clamping assembly 43 with a positioning block 4312. The positioning block 4312 is mounted with a positioning shaft pin 4313, and the positioning shaft pin 4313 is provided with a positioning needle head 4314. The clamping claw 432 is an L-shaped claw, which includes a clamping surface 4321 and a positioning surface 4322. The clamping surface 4321 is used for clamping and fixing the end face of the electronic component, the positioning needle head 4314 is used for pin positioning on one side of the electronic component, and the positioning surface 4322 is used for pin positioning on the other side of the electronic component. In this embodiment, the pins are positioned by the clamping surface 4321 and the positioning surface 4322 of the L-shaped claw, and the other side of the pins is positioned under the cooperation of the positioning needle head 4314, forming two-sided positioning, which is more stable and has higher precision during roll forming and bending.

[0080] A further improvement to the above embodiment is that the first roll forming assembly 44 is provided with a first roll forming drive cylinder 442 and a first roll forming block 443 connected to the first roll forming drive cylinder 442. The first pressure roller 441 is mounted on the first roll forming block 443. The outer diameter of the first pressure roller 441 is provided with a first roll forming groove 444. The first pressure roller 441 is provided with a first adjustment shaft 445, and the first pressure roller 441 can be adjustably mounted on the first roll forming block 443 through the first adjustment shaft 445. In this embodiment, the first roll forming drive cylinder 442 drives the first roll forming block 443 to drive the first pressure roller 441 to roll form the pins, and the first roll forming groove 444 is used for cooperative roll forming. The roll forming is stable. In addition, there is also a first adjustment shaft 445 that can be adaptively adjusted, and the versatility is better.

[0081] A further improvement to the above embodiment is that the second roll forming assembly 45 is provided with a second roll forming driving cylinder 452 and a second roll forming block 453 connected to the second roll forming driving cylinder 452. The second pressing roller 451 is installed on the second roll forming block 453. The second roll forming driving cylinder 452 is obliquely installed on the forming lifting bracket 422. A second roll forming groove 454 is formed on the outer diameter of the second pressing roller 451. The second pressing roller 451 is provided with a second adjusting shaft 455, and the second pressing roller 451 is adjustably installed on the second roll forming block 453 through the second adjusting shaft 455. In this embodiment, an obliquely installed driving structure is adopted, which can be adjusted according to the forming directions of different angles. During the roll forming process, the second roll forming driving cylinder 452 drives the second roll forming block 453 to drive the second pressing roller 451 for pin roll forming.

[0082] Refer to Figures 11 to 12 As shown in the figure, a further improvement to the above embodiment is that two sets of sizing devices 5 are symmetrically provided and are respectively used for sizing the two pins of the electronic component. The sizing device 5 includes a sizing bracket 51, a sizing pushing cylinder 52 installed on the sizing bracket 51, a sizing sliding plate 53 connected to the sizing pushing cylinder 52, and a sizing module 54 installed on the sizing sliding plate 53. The sizing module 54 includes a first sizing cylinder 541, a sizing connecting rod 542 connected to the first sizing cylinder 541, and a sizing block 543 connected to the sizing connecting rod 542. A sizing groove 544 is formed on the sizing block 543. A forming groove 545 is provided on one side of the sizing groove 544. A bending connecting rod 546 is provided on one side of the forming groove 545. The bending connecting rod 546 is connected to a second sizing cylinder 547. The sizing groove 544 is used for sizing the pins of the electronic component, and the second sizing cylinder 547 is used to drive the bending connecting rod 546 to bend the pins and form them on the forming groove 545.

[0083] Refer to Figures 13 to 14 As shown in the figure, a further improvement to the above embodiment is that the pin sleeve device 6 includes a sleeve feeding assembly 61, a sleeve guiding assembly 62 for positioning and guiding the sleeve, a sleeve driving assembly 63 for driving and feeding the sleeve, a sleeve positioning assembly 64 for clamping and positioning the sleeve, a sleeving assembly 65 for clamping the sleeve and sleeving it onto the pin, and a cutting assembly 66 for cutting the sleeve. The sleeve feeding assembly 61 is used for feeding the sleeve. Then, the sleeve driving assembly 63 drives the sleeve to be guided and conveyed through the sleeve guiding assembly 62, and the sleeve is positioned by the sleeve positioning assembly 64 and cooperates with the sleeving assembly 65 to sleeve the sleeve onto the pin, and the cutting assembly 66 cuts the sleeve.

[0084] A further improvement to the above embodiment is that the sleeve feeding assembly 61 is located above the sleeve guiding assembly 62 and is used to feed the sleeve into the sleeve guiding assembly 62. The sleeve driving assembly 63 includes a driving wheel 631 and a driven wheel 632. There is a gap between the driving wheel 631 and the driven wheel 632. The driving wheel 631 is connected to a driving motor 633, and the driving motor 633 is used to drive the driving wheel 631 and synchronously drive the driven wheel 632 for conveying the sleeve across the gap. The sleeve positioning assembly 64 includes a positioning bushing 641 located below the gap and a sleeve gripper 642. The sleeve gripper 642 is used to clamp and position the sleeve led out by the positioning bushing 641. The cutting assembly 66 is located above the sleeve positioning assembly 64 and has a cutter. The cutter is used to cut the sleeve led out by the positioning bushing 641.

[0085] A further improvement to the above embodiment is that the sleeving assembly 65 includes a sleeving lifting cylinder 651 and a sleeving gripper 652 connected to the sleeving lifting cylinder 651. The sleeving gripper 652 is used to clamp the cut sleeve and sleave it onto the pins.

[0086] Refer to Figure 15 As shown, a further improvement to the above embodiment is that the ring clamping device 7 includes a ring clamping bracket 71, a first ring clamping lifting cylinder 72 installed on the ring clamping bracket 71, a second ring clamping lifting cylinder 73 connected to the first ring clamping lifting cylinder 72, and a ring clamping air gripper 74 connected to the second ring clamping lifting cylinder 73. The ring clamping air gripper 74 is connected to a pipe pressing gripper 75. The pipe pressing gripper 75 is provided with a first pipe pressing groove 751 and a second pipe pressing groove 752. A first pipe pressing fixing ring is installed in the first pipe pressing groove 751, and a second pipe pressing fixing ring is installed in the second pipe pressing groove 752.

[0087] A further improvement to the above embodiment is that the ring clamping air gripper 74 is used to drive the pipe pressing gripper 75 to drive the first and second pipe pressing grooves to clamp the two pins of the electronic component, and press the sleeve under the action of the first and second pipe pressing fixing rings.

[0088] Refer to Figure 16 As shown, a further improvement to the above embodiment is that the blanking device 8 includes a blanking bracket 81, a blanking linear module 82 installed on the blanking bracket 81, a blanking lifting module 83 installed on the blanking linear module 82, and a blanking grasping component 84 installed on the blanking lifting module 83. The blanking grasping component 84 is used to grasp and blank the electronic component on the clamping component 11.

[0089] The present invention adopts full automation. The feeding device 2 feeds electronic components onto the clamping components. The clamping components 11 on the turntable clamp the electronic components and rotate and transfer them under the action of the turntable device 1. The calibration device 3 first centers and calibrates the position of the electronic components. After calibration, the forming device 4 bends the pins of the electronic components into a specified shape. Then, the shaping device 5 bends and shapes the pins for the second time. After positioning, the pin casing device 6 sleeves a casing onto the pins. Then, the ring clamping device 7 clamps the casing and sleeves the casing in place. Finally, the electronic components are unloaded. The above entire process is completed by full automation without manual operation, solving the problems of high difficulty in manual bending and shaping and high difficulty in casing in the prior art, achieving full automation, high structural accuracy, labor saving, and high production efficiency. Specifically, a turntable device 1, a feeding device 2, a calibration device 3, a forming device 4, a shaping device 5, a pin casing device 6, a ring clamping device 7, and a unloading device 8 are provided. A plurality of clamping components 11 are arranged around the turntable device 1. The clamping components 11 are used to clamp and fix the electronic components. The turntable device 1 is used to drive the clamping components 11 and the clamped electronic components to rotate and transmit; the feeding device 2 is used to grab and place the electronic components into the clamping components 11; the calibration device 3 is used to center and calibrate the electronic components clamped by the clamping components 11; the forming device 4 is used to bend and shape the pins of the electronic components clamped by the clamping components 11; the shaping device 5 bends and shapes the bent pins; the pin casing device 6 is used to sleeve a casing onto the shaped pins; the ring clamping device 7 is used to clamp the casing on the pins and sleeve the casing in place; the unloading device 8 is used to grab and unload the formed electronic components with casings from the clamping components 11. The entire process is completed by full automation, saving labor and not requiring manual interference, with a high degree of automation.

[0090] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. An electronic component forming process, characterized in that: Including a forming device, the forming device includes a turntable device, a feeding device, a calibration device, a forming device, a shaping device, a pin sleeve device, a ring clamping device, and a discharging device. A plurality of clamping components are arranged around the turntable device. The clamping components are used to clamp and fix electronic components. The turntable device is used to drive the clamping components and the clamped electronic components to rotate and transmit; the feeding device is used to grab and place the electronic components into the clamping components; the calibration device is used to center and calibrate the electronic components clamped by the clamping components; the forming device is used to bend and form the pins of the electronic components clamped by the clamping components; the shaping device shapes the bent pins; the pin sleeve device is used to put sleeves on the shaped pins; the ring clamping device is used to clamp the sleeves on the pins and put the sleeves in place; the discharging device is used to grab and discharge the formed electronic components with sleeves from the clamping components; The forming device includes a forming support frame, a forming lifting component, a forming clamping component, a first roll forming component, and a second roll forming component. The forming lifting component includes a forming lifting drive module installed on the forming support frame and a forming lifting bracket installed at the drive end of the forming lifting drive module; the forming clamping component includes positioning modules installed on the forming lifting bracket on both sides of the forming clamping component and used for positioning the pins of the electronic components, and clamping claws connected to the forming clamping component and used for clamping and fixing both ends of the electronic components. The positioning modules are used for positioning one side of the pins of the electronic components; the first roll forming component is installed on the forming lifting bracket and on one side of the forming clamping component. The first roll forming component is provided with a first pressure roller, and the first pressure roller is used to roll and form one pin positioned by the clamping claws and the positioning modules; the second roll forming component is installed on the forming lifting bracket and on the side away from the first roll forming component. The second roll forming component is provided with a second pressure roller, and the second pressure roller is used to roll and form the other pin positioned by the clamping claws and the positioning modules; Two groups of the shaping devices are symmetrically arranged and are respectively used for shaping the two pins of the electronic components. The shaping device includes a shaping support frame, a shaping pushing cylinder installed on the shaping support frame, a shaping sliding plate connected to the shaping pushing cylinder, and a shaping module installed on the shaping sliding plate. The shaping module includes a first shaping cylinder, a shaping connecting rod connected to the first shaping cylinder, and a shaping block connected to the shaping connecting rod. The shaping block is provided with a shaping groove. One side of the shaping groove is provided with a forming groove. One side of the forming groove is provided with a bending connecting rod, and the bending connecting rod is connected with a second shaping cylinder. The shaping groove is used for shaping the pins of the electronic components, and the second shaping cylinder is used to drive the bending connecting rod to bend and form the pins on the forming groove; The process of bending and forming the pins includes the following steps: S1, the feeding device grabs the electronic components and horizontally places the grabbed electronics remotely onto the clamping components, and the clamping components clamp and fix the electronic components; S2. The turntable device rotates and drives the clamping assembly and the electronic component to rotate and be conveyed to the calibration device, and the calibration device centers and calibrates the electronic component on the clamping assembly. S3. The turntable device continues to rotate and drives the calibrated electronic component to be conveyed to the forming device. The forming device drives the forming clamping assembly through the forming lifting assembly to clamp both ends of the electronic component and position the pins. After positioning, the two ends of the pins are roll-formed by the first roll-forming assembly and the second roll-forming assembly. S4. The turntable device continues to rotate and drives the electronic component with formed pins to be conveyed to the shaping device. The shaping device positions the formed pins through the shaping groove. After positioning, under the action of the second shaping cylinder, it drives the bending link to press the pins into the shaping groove to achieve secondary bending and shaping. S5. The turntable device continues to rotate and drives the electronic component with pins shaped by secondary bending to be conveyed to the pin sleeving device, and the pin sleeving device sleeves the pins shaped by secondary bending with sleeves. S6. The turntable device continues to rotate and drives the electronic component with pins sleeved with sleeves to be conveyed to the ring clamping device, and the ring clamping device clamps and presses the sleeves onto the pins. S7. The turntable device continues to rotate and drives the electronic component with sleeves pressed onto the pins in place to be conveyed to the blanking device, and the blanking device grabs and unloads the electronic component.

2. The electronic component forming process according to claim 1, characterized in that: The turntable device includes a turntable drive module, a disc connected to the turntable drive module, and an open-clamping drive component located below the disc and used to drive the clamping assembly to open the clamp. The clamping assembly includes a clamping base, a clamping link installed on the clamping base, and a fixed clamping jaw connected to the clamping link. The open-clamping drive component includes an open-clamping drive cylinder, and the open-clamping drive cylinder is used to drive the clamping link to drive the fixed clamping jaw to open the clamp.

3. The electronic component forming process according to claim 1, characterized in that: The feeding device includes a linear cylinder, a first transfer component and a second transfer component connected to the linear cylinder, and a rotary positioning component for positioning the electronic component. The first transfer component includes a first lifting cylinder, a first rotary cylinder connected to the first lifting cylinder, and a first air gripper connected to the first rotary cylinder. The linear cylinder is used to drive the first transfer component to drive the electronic component to transfer, and the first rotary cylinder is used to drive the electronic component clamped by the first air gripper to be flipped and placed into the rotary positioning component. The second transfer component includes a second lifting cylinder and a second air gripper connected to the second lifting cylinder. The second air gripper is used to grab the electronic component on the rotary positioning component and place it into the clamping assembly. The rotary positioning component includes a second rotary cylinder and a third air gripper connected to the second rotary cylinder. The third air gripper is used to clamp the electronic component, and the second rotary cylinder is used to drive the third air gripper to rotate and can drive the electronic component to rotate.

4. The electronic component forming process according to claim 1, wherein: The calibration device includes a calibration bracket, a calibration lifting cylinder installed on the calibration bracket, and two groups of calibration clamping cylinders symmetrically connected to both sides of the calibration lifting cylinder. The calibration clamping cylinders are connected with calibration claws, and the two groups of symmetric calibration clamping cylinders are used to drive the calibration claws to center and calibrate the electronic component.

5. The electronic component forming process according to claim 1, characterized in that: The forming lifting bracket includes a base plate connected to the forming lifting drive module and a T-shaped plate adjustably mounted on the base plate. The forming clamping assembly and the first roll forming assembly are both mounted on the base plate, and the second roll forming assembly is mounted on one side of the T-shaped plate. The T-shaped plate is provided with a main shaft hole for connecting to the base plate and an adjustment slot. The adjustment slot is arc-shaped, and the T-shaped plate is adjustably mounted on the base plate with the main shaft hole as the center through the adjustment slot.

6. The electronic component forming process according to claim 5, characterized in that: The positioning module is a positioning plate mounted on both sides of the forming clamping assembly. The positioning plate extends towards the forming clamping assembly with a positioning block. The positioning block is equipped with a positioning pin, and the positioning pin is provided with a positioning needle tip. The clamping claw is an L-shaped claw. The L-shaped claw includes a clamping surface and a positioning surface. The clamping surface is used for clamping and fixing the end face of the electronic component, the positioning needle tip is used for positioning the lead on one side of the electronic component, and the positioning surface is used for positioning the lead on the other side of the electronic component.

7. The electronic component forming process according to claim 5, characterized in that: The first roll forming assembly is provided with a first roll forming drive cylinder and a first roll forming block connected to the first roll forming drive cylinder. The first pressure roll is mounted on the first roll forming block. The outer diameter of the first pressure roll is provided with a first roll forming groove, and the first pressure roll is provided with a first adjustment shaft. The first pressure roll is adjustably mounted on the first roll forming block through the first adjustment shaft.

8. The electronic component forming process according to claim 1, characterized in that: The second roll forming assembly is provided with a second roll forming drive cylinder and a second roll forming block connected to the second roll forming drive cylinder. The second pressure roll is mounted on the second roll forming block. The second roll forming drive cylinder is obliquely mounted on the forming lifting bracket. The outer diameter of the second pressure roll is provided with a second roll forming groove, and the second pressure roll is provided with a second adjustment shaft. The second pressure roll is adjustably mounted on the second roll forming block through the second adjustment shaft.

9. The electronic component forming process according to claim 1, characterized in that: The lead sleeve device includes a sleeve feeding assembly, a sleeve guiding assembly for positioning and guiding the sleeve, a sleeve driving assembly for driving and feeding the sleeve, a sleeve positioning assembly for clamping and positioning the sleeve, a sleeving assembly for clamping the sleeve and sleeving it onto the lead, and a cutting assembly for cutting the sleeve. The sleeve feeding assembly is located above the sleeve guiding assembly and is used for feeding the sleeve into the sleeve guiding assembly. The sleeve driving assembly includes a driving wheel and a driven wheel. There is a gap between the driving wheel and the driven wheel. The driving wheel is connected to a driving motor, and the driving motor is used to drive the driving wheel and synchronously drive the driven wheel for conveying the sleeve on the gap. The sleeve positioning assembly includes a positioning bushing located below the gap and a sleeve clamping claw. The sleeve clamping claw is used for clamping and positioning the sleeve led out by the positioning bushing. The cutting assembly is located above the sleeve positioning assembly and has a cutting knife, and the cutting knife is used for cutting the sleeve led out by the positioning bushing. The sleeving assembly includes a sleeving lifting cylinder and a sleeving claw connected to the sleeving lifting cylinder. The sleeving claw is used for clamping the cut sleeve and sleeving it onto the lead.

10. The electronic component forming process according to claim 1, characterized in that: The ring clamp device includes a ring clamp bracket, a first ring clamp lifting cylinder installed on the ring clamp bracket, a second ring clamp lifting cylinder connected to the first ring clamp lifting cylinder, and a ring clamp jaw connected to the second ring clamp lifting cylinder. The ring clamp jaw is connected with a pipe pressing jaw, and a first pipe pressing groove and a second pipe pressing groove are formed on the pipe pressing jaw. A first pipe pressing fixing ring is installed in the first pipe pressing groove, and a second pipe pressing fixing ring is installed in the second pipe pressing groove; The ring clamp jaw is used to drive the pipe pressing jaw to drive the first and second pipe pressing grooves to clamp two pins of an electronic component, and press the sleeve under the action of the first and second pipe pressing fixing rings; The blanking device includes a blanking bracket, a blanking linear module installed on the blanking bracket, a blanking lifting module installed on the blanking linear module, and a blanking grasping component installed on the blanking lifting module. The blanking grasping component is used to grasp and blank the electronic component on the clamping component.

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