Multi-channel seed slice pose adjustment device

Abstract

The application provides a multi-channel seed slice pose adjusting device, and belongs to the technical field of seed slicing. The bottom of the pose adjusting device is linearly moved on a linear motion device through a conversion piece, and a profiled flexible clamping device is fixed at the front end of the pose adjusting device through a thread. A laser generator emits laser to a light path controller, the light path controller controls the direction of the laser to be irradiated to a laser cutting head, the laser cutting head is linearly moved on a laser cutting head linear motion device through a conversion piece, and the laser cutting head outputs laser vertically downward to slice seeds clamped in the profiled flexible clamping device. The application has high laser linear cutting precision, fast cutting speed, strong stability, narrow cutting seam, and high-quality cutting surface. The laser cutting head module is connected with a high-speed motion mechanism, high freedom and wide range of space are realized, batch cutting is realized, and contour seeds with large differences are uniformly sliced and specifically cut.

Description

Technical Field

[0001] This invention relates to a multi-channel seed slice pose adjustment device, belonging to the field of seed cutting technology. Background Technology

[0002] Existing seed slicing technologies employ mechanical cutting methods, typically using blades. This cutting speed is slow, and the impact of the blades results in chipped or cracked cut surfaces, leading to poor surface quality and inconsistent slice thickness and stability. Limited by the blade's impact force, rigid seed clamping devices offer poor adaptability to seed contours, making them unsuitable for slices with significantly different contours. Furthermore, the clamping process can easily cause seed compression damage and splattering. Current seed slicing devices typically use single-channel cutting, allowing only single-seed cutting at a time, severely limiting slicing efficiency and compromising the uniformity of adjacent slices. Summary of the Invention

[0003] The purpose of this invention is to solve the problems existing in the prior art and to provide a multi-channel seed slice pose adjustment device.

[0004] The objective of this invention is achieved through the following technical solution:

[0005] A multi-channel seed slicing pose adjustment device includes a seed pose adjustment device, a laser cutting head, a laser generator, an optical path controller, and a laser cutting head motion device. The seed pose adjustment device includes a sculpting flexible clamping device, a pose control device, and a linear motion device. The linear motion device is fixed to the frame by bolts. The bottom of the pose control device moves linearly on the linear motion device via a conversion component. The sculpting flexible clamping device is fixed to the front end of the pose control device by threads. The laser generator, optical path controller, and laser cutting head are fixed to the laser cutting head motion device. The laser cutting head linear motion device is fixed to the frame by threads. The laser generator emits laser light to the optical path controller, which controls the direction of the laser light to irradiate the laser cutting head. The laser cutting head moves linearly on the laser cutting head linear motion device via the conversion component. The laser cutting head outputs a vertically downward laser light to slice the seeds held in the sculpting flexible clamping device.

[0006] The present invention provides a multi-channel seed slicing pose adjustment device, wherein the linear motion device of the laser cutting head and the linear motion device move in perpendicular directions.

[0007] This invention discloses a multi-channel seed slice pose adjustment device, which further includes an image recognition acquisition device and a sensor. The image recognition acquisition device and the sensor are mounted on the front side of the linear motion device on the frame. The sensor measures the distance from the foremost point of the seed and transmits the data to the controller. The image recognition acquisition device acquires the exposed contour of the seed within the skewing flexible clamping device on the seed pose adjustment device. The image recognition acquisition device transmits the acquired information to the controller. The controller outputs signals to the pose adjustment device and the linear motion device based on the received signals from the sensor and the image recognition acquisition device to control the pose of the seed.

[0008] The present invention provides a multi-channel seed slicing pose adjustment device, which further includes a laser beam splitter and a laser cutting head pose adjustment device. The laser generator emits laser light to the optical path controller, which controls the direction of the laser light to irradiate the laser beam splitter. The laser beam splitter splits one laser beam into n laser beams. The n laser beams irradiate the optical path controller, change the direction of the laser light, and then irradiate the laser cutting head. The laser cutting head is mounted on the laser cutting head pose adjustment device, which is fixed on the laser cutting head linear motion device. The controller receives signals from the sensor and the image recognition acquisition device, and outputs signals to the laser cutting head pose adjustment device (9) to control the pose of the laser cutting head.

[0009] The present invention provides a multi-channel seed slice pose adjustment device, wherein one seed pose adjustment device corresponds to one image recognition acquisition device and one sensor.

[0010] This invention provides a multi-channel seed slicing pose adjustment device. When the device does not have a laser beam splitter, one laser cutting head is equipped with n seed pose adjustment devices. When the device has a laser beam splitter, n laser cutting heads are equipped with n seed pose adjustment devices.

[0011] This invention provides a multi-channel seed slicing pose adjustment device, which features high precision, fast cutting speed, strong stability, narrow kerf, and high-quality cutting surface in laser linear cutting. The modular laser cutting head is connected to a high-speed motion mechanism to achieve high spatial freedom and wide range, enabling batch cutting. It also enables uniform slicing and specific cutting of seeds with large differences in contour. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the seed pose adjustment device in the multi-channel seed slice pose adjustment device of the present invention.

[0013] Figure 2 This is a schematic diagram of the working condition 1 in Embodiment 2 of the present invention.

[0014] Figure 3This is a schematic diagram of the working condition 12 in Embodiment 2 of the present invention.

[0015] In the figure, the reference numerals are as follows: 1 is the image recognition and acquisition device; 2 is the seed pose adjustment device; 3 is the laser cutting head; 4 is the laser generator; 5 is the optical path controller; 6 is the laser cutting head motion device; 7 is the sensor; 8 is the laser beam splitter; 9 is the laser cutting head pose adjustment device; 2-1 is the mimicry flexible clamping device; 2-2 is the pose control device; and 2-3 is the linear motion device. Detailed Implementation

[0016] The present invention will be further described in detail below with reference to the accompanying drawings: This embodiment is implemented under the premise of the technical solution of the present invention, and detailed implementation methods are given, but the protection scope of the present invention is not limited to the following embodiments.

[0017] Example 1: As Figure 1-3 As shown, this embodiment involves a multi-channel seed slicing pose adjustment device, comprising: a seed pose adjustment device, a laser cutting head, a laser generator, an optical path controller, and a laser cutting head motion device. The seed pose adjustment device includes a sculpting flexible clamping device, a pose control device, and a linear motion device. The linear motion device is fixed to the frame by bolts. The bottom of the pose control device moves linearly on the linear motion device via a conversion component. The sculpting flexible clamping device is fixed to the front end of the pose control device by threads. The laser generator, optical path controller, and laser cutting head are fixed to the laser cutting head motion device. The laser cutting head linear motion device is fixed to the frame by threads. The laser generator emits laser light to the optical path controller, which controls the direction of the laser light to irradiate the laser cutting head. The laser cutting head moves linearly on the laser cutting head linear motion device via the conversion component. The laser cutting head outputs a vertically downward laser light to slice the seeds held in the sculpting flexible clamping device.

[0018] The present invention provides a multi-channel seed slicing pose adjustment device, wherein the linear motion device of the laser cutting head and the linear motion device move in perpendicular directions.

[0019] This invention discloses a multi-channel seed slice pose adjustment device, which further includes an image recognition acquisition device and a sensor. The image recognition acquisition device and the sensor are mounted on the front side of the linear motion device on the frame. The sensor measures the distance from the foremost point of the seed and transmits the data to the controller. The image recognition acquisition device acquires the exposed contour of the seed within the skewing flexible clamping device on the seed pose adjustment device. The image recognition acquisition device transmits the acquired information to the controller. The controller outputs signals to the pose adjustment device and the linear motion device based on the received signals from the sensor and the image recognition acquisition device to control the pose of the seed.

[0020] This invention discloses a multi-channel seed slicing pose adjustment device, which further includes a laser beam splitter and a laser cutting head pose adjustment device. A laser generator emits laser light to an optical path controller, which controls the laser direction to illuminate the laser beam splitter. The laser beam splitter divides the laser beam into n beams. These n beams illuminate the optical path controller, changing their direction before illuminating the laser cutting head. The laser cutting head is mounted on the laser cutting head pose adjustment device, which is fixed to the laser cutting head linear motion device. The controller receives signals from sensors and an image recognition acquisition device, and outputs signals to the laser cutting head pose adjustment device to control the pose of the laser cutting head.

[0021] The present invention provides a multi-channel seed slice pose adjustment device, wherein one seed pose adjustment device corresponds to one image recognition acquisition device and one sensor.

[0022] This invention provides a multi-channel seed slicing pose adjustment device. When the device does not have a laser beam splitter, one laser cutting head is equipped with n seed pose adjustment devices. When the device has a laser beam splitter, n laser cutting heads are equipped with n seed pose adjustment devices.

[0023] Example 2: Figure 1-3 As shown, this embodiment involves a multi-channel seed slice pose adjustment device. The device of this application has two modes, and the specific working process of the two working modes is as follows:

[0024] Working Mode 1: When the device does not have a laser beam splitter, the seed pose adjustment device holds the seed, the image recognition device captures the seed shape, the sensor measures the distance from the front end of the seed, and the signals collected by the sensor and the image recognition device are transmitted to the controller. The controller outputs a signal to control the seed pose adjustment device to adjust the angle of the seed and the linear motion device to control the distance of the seed. The image recognition device and the sensor ensure that the seed cutting part reaches the designated spatial cutting position.

[0025] The laser generator produces a laser beam, which enters the laser cutting head via the optical path controller and is emitted vertically. The laser cutting head moves linearly from one side to the other, slicing multiple seeds. The seed pose adjustment device resets, clamps a new seed at the designated cutting position, and the laser cutting head returns, completing the slicing process.

[0026] Working mode 1: The laser can only cut slices vertically, which makes it impossible to complete some irregular cuts. In addition, the laser cutting head moves back and forth, so it can only cut sequentially from one side.

[0027] Operating Mode 2: When the device is equipped with a laser beam splitter, the laser generator produces laser light, which enters each laser cutting head via the optical path controller and beam splitter, and exits from the laser head. An independent laser cutting head pose adjustment device, in conjunction with a seed pose adjustment device, enables specialized and independent seed cutting.

[0028] The image acquisition device collects the contour features and surface quality features (color differentiation) of the seeds in each channel. The control system determines the position and uniform thickness of the slice based on the uploaded data. The system performs trajectory planning for the laser cutting head pose adjustment device and the seed clamping pose adjustment device in each channel. The pose change of the clamped seed in each channel is coordinated with the laser pose change. The seed is cut into slices of a predetermined shape and thickness, realizing the specialized independent cutting of the seeds in each channel.

[0029] The above description is merely a preferred embodiment of the present invention. These specific embodiments are different implementations based on the overall concept of the present invention, and the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A multi-channel seed slice pose adjustment device, characterized in that, The multi-channel seed slicing pose adjustment device includes a seed pose adjustment device (2), a laser cutting head (3), a laser generator (4), an optical path controller (5), and a laser cutting head linear motion device (6). The seed pose adjustment device (2) includes a morphological flexible clamping device (2-1), a pose control device (2-2), and a linear motion device (2-3). The linear motion device (2-3) is fixed to the frame by bolts. The bottom of the pose control device (2-2) moves linearly on the linear motion device (2-3) via a conversion component. The morphological flexible clamping device (2-1) is fixed to the pose control device by threads. The front end of the device (2-2) is fixed with a laser generator (4), an optical path controller (5), and a laser cutting head (3). The laser cutting head linear motion device (6) is fixed to the frame by threads. The laser generator (4) emits laser light to the optical path controller (5). The optical path controller (5) controls the direction of the laser light to irradiate the laser cutting head (3). The laser cutting head (3) moves linearly on the laser cutting head linear motion device (6) through a conversion component. The laser cutting head (3) outputs a vertically downward laser light to slice the seeds held in the simulated flexible clamping device (2-1). The multi-channel seed slice pose adjustment device also includes a laser beam splitter (8) and a laser cutting head pose adjustment device (9). The laser generator (4) emits laser light to the optical path controller (5). The optical path controller (5) controls the direction of the laser light to irradiate the laser beam splitter (8). The laser beam splitter (8) splits a laser beam into n laser beams. The n laser beams irradiate the optical path controller (5), change the direction of the laser light, and then irradiate the laser cutting head (3). The laser cutting head (3) is set on the laser cutting head pose adjustment device (9). The laser cutting head pose adjustment device (9) is fixed on the laser cutting head linear motion device (6). The controller receives signals from the sensor (7) and the image recognition acquisition device (1) and outputs signals to the laser cutting head pose adjustment device (9) to control the pose of the laser cutting head (3). A seed pose adjustment device (2) corresponds to an image recognition acquisition device (1) and a sensor (7) to realize the specific independent cutting of seeds in each channel.

2. The multi-channel seed slice pose adjustment device according to claim 1, characterized in that, The linear motion device (6) and the linear motion device (2-3) of the laser cutting head move in perpendicular directions.

3. The multi-channel seed slice pose adjustment device according to claim 1, characterized in that, The multi-channel seed slice pose adjustment device also includes an image recognition acquisition device (1) and a sensor (7). The image recognition acquisition device (1) and the sensor (7) are set on the front side of the linear motion device (2-3) on the frame. The sensor (7) measures the distance from the front end of the seed and transmits it to the controller. The image recognition acquisition device (1) collects the exposed outline of the seed in the simulated flexible clamping device (2-1) on the seed pose adjustment device (2). The image recognition acquisition device (1) transmits the collected information to the controller. The controller outputs signals to the pose adjustment device (2-2) and the linear motion device (2-3) based on the received signals from the sensor and the image recognition acquisition device (1) to control the pose of the seed.

4. The multi-channel seed slice pose adjustment device according to claim 1, characterized in that, When the device does not have a laser beam splitter (8), one laser cutting head (3) is equipped with n seed pose adjustment devices (2). When the device has a laser beam splitter (8), n laser cutting heads (3) are equipped with n seed pose adjustment devices (2).

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