A composition for a transparent resin material with high in-spectral transmittance and the transparent resin material

Abstract

The present invention belongs to the field of polymer materials, and particularly relates to a composition for a transparent resin material with high in-spectral transmittance and a transparent resin material. By weight, it includes 0.001 to 30 parts of component A and 50 to 95 parts of component B; component A includes two or more asymmetric compounds, and the asymmetric compounds contain two or more active groups among mercapto groups, hydroxyl groups, and episulfide groups. Component B is a di-functional episulfide compound. The transparent resin material prepared from the above composition has a high refractive index, a high Abbe number, and a high in-spectral transmittance. This resin material can be widely used in high-performance components of displays, microlens elements of semiconductor image sensors, and plastic optical materials such as cameras, mobile phones, security, and vehicle-mounted lenses.

Description

Technical Field

[0001] The present invention belongs to the field of polymer materials, and particularly relates to a composition for a transparent resin material with high spectral transmittance and a transparent resin material. Background Art

[0002] The spectral transmittance is the internal transmittance without including the surface reflection loss, that is, the ratio of the luminous flux between the internal end point and the starting point of the light source passing through the material. The larger the value, the lower the light absorption of the material itself, the less the light loss, and the higher the internal transmittance value, the better the performance.

[0003] The spectral transmittance is a key optical index for measuring transparent materials and is particularly crucial in optical design. It has a very wide range of applications, such as high-performance components of displays, microlens elements of semiconductor image sensors, and plastic optical materials for cameras, mobile phones, security, vehicle-mounted lenses, etc. Because they have high requirements for optical performance and have properties such as light weight, impact resistance, processability, and dyeability, which are superior to inorganic glass. Experts predict that optical resin materials will replace inorganic optical glass in the future and even be applied in fields such as Shenguang III and lithography machines.

[0004] Most of the optical lens materials used in the current market are PMMA. Since its polymer itself contains double bonds and is easy to absorb visible light to generate energy level transfer, the proportion of light absorption and scattering is 3.1%, and the spectral transmittance is about 93.7%. As is well known, the higher the refractive index, the more severe the dispersion, and the clarity of imaging will decrease. With the progress of technology, low refractive index can no longer meet the requirements of the optical material field. How to obtain a transparent resin material with high refractive index, low dispersion degree, low light absorption degree, and high imaging clarity, that is, a material with high refractive index, high Abbe number, and high internal transmittance, is crucial. The trend of miniaturization in the optical and optoelectronic technology markets has led to the increasing miniaturization of individual components and assemblies of end products. To improve quality requirements, it is necessary to increase the spectral transmittance of the material.

[0005] Therefore, there is an urgent need for a transparent resin material with high spectral transmittance. Summary of the Invention

[0006] In order to solve the existing technical problems, the present invention provides a composition for a transparent resin material with high spectral transmittance and a transparent resin material. The resin material provided by the present invention has high refractive index, high Abbe number, and high internal transmittance. This resin material can be widely used in high-performance components of displays, microlens elements of semiconductor image sensors, and plastic optical materials for cameras, mobile phones, security, vehicle-mounted lenses, etc. Because they have high requirements for optical performance and have properties such as light weight, impact resistance, processability, and dyeability, which are superior to inorganic glass.

[0007] The technical solution of the present invention is as follows:

[0008] A composition for a transparent resin material with high in - spectrum transmittance, by weight parts, includes 0.001 - 30 parts of component A and 50 - 95 parts of component B; Component A includes two or more asymmetric compounds, where the asymmetric compounds contain two or more active groups among mercapto group, hydroxyl group, and episulfide group, and component B is a di - functional episulfide compound.

[0009] Preferably, component A includes the following two or more asymmetric compounds;

[0010]

[0011] 6 - Hydroxy - 7 - mercapto - 1,2 - episulfide - 4 - thioheptane

[0012]

[0013] 6 - Hydroxy - 7 - methoxy - 1,2 - episulfide - 4 - thioheptane

[0014]

[0015] 1 - Epithiopropyl - 5 - glycidyl - 1,5 - dithio - 3 - pentanol

[0016]

[0017] 1 - Epithiopropyl - 5 - glycidyl - 1,5 - dithio - 3 - pentanethiol.

[0018] Preferably, component B is one or more of bis(β - epithiopropyl) sulfide, bis(β - epithiopropyl) disulfide, bis(β - epithiopropyl) trisulfide, bis(β - epithiopropylthio) methane, 1,2 - bis(β - epithiopropylthio) ethane, 1,3 - bis(β - epithiopropylthio) propane, 1,4 - bis(β - epithiopropylthio) butane, bis(β - epithiopropylthioethyl) sulfide;

[0019] Preferably, by weight parts, it further includes component C: 1 - 30 parts of a di - functional isocyanate compound. More preferably, component C is one or more of 4,4 - dicyclohexylmethane diisocyanate, norbornane diisocyanate, isophorone diisocyanate (IPDI), hexamethylene diisocyanate, methylene bis - cyclohexyl diisocyanate, and cyclohexane dimethylene diisocyanate (HXDI).

[0020] Preferably, by weight parts, it further comprises component D: 1 to 20 parts of a polythiol compound. More preferably, component D is one or more of 2,2'-thiobis(ethanethiol), 2,3-bis(2-mercaptoethylthio)-3-propyl-1-thiol, 2,3-dithio(2-mercapto)-1-propanethiol, pentaerythritol tetra(3-mercaptopropionate), bis(2-mercaptoethyl) sulfide, 2-(2-mercaptoethylthio)propyl-1,3-dithiol, and 1,2-bis(2-mercaptoethylthio)-3-mercaptopropane.

[0021] In view of the current situation, the inventors have conducted extensive and in-depth research. After a large number of studies and experiments, a composition for a transparent resin material with high spectral transmittance has been determined. Among them, the sulfur content in the episulfide compound is high, thereby improving the refractive index and Abbe number of the material. In addition, an asymmetric compound containing at least two active groups among mercapto, hydroxyl, and episulfide groups is added to reduce the regularity of the polymer structure, reduce the light scattering loss caused by crystallization, and reduce the light absorption of the material itself, thereby improving the internal transmittance and meeting the market requirements for high refractive index, high Abbe number, and high internal transmittance.

[0022] A transparent resin material is prepared by using the above composition and additives. The spectral transmittance of this material is ≥98%, the refractive index is 1.60 - 1.75, the Abbe number is ≥35, and the additives are conventional components for preparing resins in the art.

[0023] Preferably, the additives are several of initiators, ultraviolet absorbers, release agents, blue agents, red agents, etc. Among them, the initiator is selected from one or more of tetrabutylphosphonium bromide, triphenylphosphine, and tetrabutylammonium bromide, more preferably tetrabutylphosphonium bromide, and the addition amount is 0.01 - 0.1% of the addition amount of the composition; the ultraviolet absorber is selected from one or more of UV-326, UV-329, and UV-541, more preferably UV-329, and the addition amount is 0.1 - 1% of the addition amount of the composition; the release agent is selected from one or more of dibutyl phosphate, polyoxyethylene ether phosphate, and nonylphenol polyoxyethylene ether phosphate, and the addition amount is 0.01 - 0.15% of the addition amount of the composition; the concentration of the blue agent is 3 ppm - 3.5 ppm; the concentration of the red agent is 1 ppm - 2 ppm. The above components can be added appropriately according to the performance requirements of the optical material, and the inventors will not elaborate.

[0024] Preferably, a method for preparing a transparent resin comprises the following steps:

[0025] a) Mix the composition except component B and the additives for the first time to obtain prepolymer 1;

[0026] The main reason for adopting the above - mentioned mixing method is that the auxiliary agent dissolves better in isocyanate than in cyclic sulfur compounds, reducing the time required for dissolution and further reducing the time of the entire reaction.

[0027] b) Mix the prepolymer 1 obtained in step a) with component B for the second time to obtain reaction mixture 2; the temperature of the mixing is 0°C - 20°C, the time is 30 min - 60 min, and vacuum degassing is carried out for 20 min - 40 min.

[0028] The above - mentioned means can remove air, moisture, etc. in the prepolymer, and no bubbles will be generated in the cured material. If the temperature is not well - controlled, the curing agent will increase the viscosity of the prepolymer, which is not conducive to subsequent sample casting. Therefore, temperature and time need to be controlled.

[0029] c) Cure the mixture.

[0030] Filter and pour the above - mentioned mixture 2 with a polytetrafluoroethylene filter membrane. The cast sample is cured for the first and second times. The heating - up program for the first curing: the initial temperature is 15°C - 25°C, keep warm for 2.5 h - 3.5 h, then increase the temperature to 40°C - 60°C in 10 h - 13 h, increase the temperature to 80°C - 110°C in 3 h - 4 h, and finally decrease the temperature to 65°C - 75°C in 1.5 h - 2.5 h. After opening the mold, carry out the heating - up program for the second curing, keep warm at 100 - 120°C for 2 h - 4 h, and finally decrease the temperature to 60°C - 70°C in 1.5 h - 2.5 h.

[0031] The above - mentioned curing program can also be adjusted adaptively as needed, and the inventor will not elaborate here.

[0032] A composition and a transparent resin material for a transparent resin material with high in - spectrum transmittance provided by the present invention. This transparent resin material has a high refractive index, a high Abbe number, and a high in - spectrum transmittance. The in - spectrum transmittance ≥ 98%, the refractive index is 1.60 - 1.75, and the Abbe number ≥ 35, meeting the market requirements for a high refractive index, a high Abbe number, and a high in - spectrum transmittance. This resin material can be widely used in high - performance components of displays, microlens elements of semiconductor image sensors, and plastic optical materials such as cameras, mobile phones, security, and vehicle - mounted lenses, because they have higher requirements for optical performance and have properties such as light weight, impact resistance, processability, and dyeability, which are superior to inorganic glass. Detailed implementation mode

[0033] The following is a further detailed description of the above - mentioned content of the present invention through specific implementation modes in the form of examples, but this should not be understood as limiting the scope of the above - mentioned subject matter of the present invention to the following examples. All technologies implemented based on the above - mentioned content of the present invention belong to the scope of the present invention. Unless otherwise specified, conventional existing technologies are used in the following examples.

[0034] In the following examples and comparative examples: BEPS: bis(β - mercaptopropyl)sulfide, BEPDS: bis(β - mercaptopropyl)disulfide, BES: 2,3 - dithio(2 - mercapto)-1 - propane thiol, IPDI: isophorone diisocyanate, HMDI: 4,4 - dicyclohexylmethane diisocyanate, NBDI: norbornane diisocyanate, and HXDI: cyclohexane dimethylene diisocyanate.

[0035] The temperature - rising program of the temperature - programmed curing furnace: The initial temperature for the first curing is 15°C - 20°C, keep warm for 2.5 h - 3.5 h, then successively heat up to 45°C - 55°C in 10 h - 15 h, heat up to 75°C - 105°C in 2.5 h - 3.5 h, and finally cool down to 65°C - 75°C in 1.5 h - 2.5 h. After demolding, carry out the temperature - programmed second curing. Keep warm at 100 - 120°C for 2 h - 4 h, and finally cool down to 65°C - 75°C in 1.5 h - 2.5 h.

[0036] The asymmetric compounds in the following examples and comparative examples:

[0037]

[0038] 6 - hydroxy - 7 - mercapto - 1,2 - episulfide - 4 - thioheptane

[0039]

[0040] 6 - hydroxy - 7 - methoxy - 1,2 - episulfide - 4 - thioheptane

[0041]

[0042] 1 - episulfopropyl - 5 - glycidyl - 1,5 - dithio - 3 - pentanol

[0043]

[0044] 1 - episulfopropyl - 5 - glycidyl - 1,5 - dithio - 3 - pentanethiol

[0045] Example 1

[0046] A transparent resin material:

[0047] At 15°C, 0.1 g of dibutyl phosphate and 0.1 g of tetrabutylphosphonium bromide were added to 9 g of isophorone diisocyanate (IPDI), 1 g of 6-hydroxy-7-mercapto-1,2-epithio-4-thioheptane, and 2 g of 6-hydroxy-7-methoxy-1,2-epithio-4-thioheptane. After stirring until completely dissolved, 85 g of BEPS was added, and the mixture was stirred at 20°C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmable temperature curing furnace for curing to obtain a transparent resin material with a high spectral transmittance. Its Tg was 98°C, Nd was 1.6915, Vd was 37, and the spectral transmittance was 98.4%;

[0048] The temperature programming of the programmable temperature curing furnace: The initial temperature of the first curing was 20°C, and it was held for 2.5 h. Then, it was heated to 50°C in 10 h, then to 85°C in 3.5 h, and finally cooled to 70°C in 1.5 h. After demolding, the temperature was programmed for the second curing. It was held at 120°C for 2 h and finally cooled to 70°C in 1.5 h.

[0049] For the following Examples 3-8 and Comparative Examples 1-4, the temperature programming as in Example 1 can be selected, and the curing program can also be adjusted adaptively as needed. The inventor will not elaborate here.

[0050] Example 2

[0051] A transparent resin material:

[0052] At 15°C, 0.1 g of dibutyl phosphate, 0.05 g of tetrabutylphosphonium bromide, and 0.05 g of dibutyltin dichloride were added to 6 g of 4,4'-dicyclohexylmethane diisocyanate (HMDI), 2.5 g of 6-hydroxy-7-mercapto-1,2-epithio-4-thioheptane, 0.5 g of 6-hydroxy-7-methoxy-1,2-epithio-4-thioheptane, and 6 g of 1-epithiopropyl-5-glycidyl-1,5-dithio-3-pentanol. After stirring until completely dissolved, 85 g of BEPS was added, and the mixture was stirred at 20°C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmable temperature curing furnace for curing to obtain a transparent resin material with a high spectral transmittance. Its Tg was 102°C, Nd was 1.7105, Vd was 36, and the spectral transmittance was 98%;

[0053] The temperature programming of the programmable temperature curing furnace: The initial temperature of the first curing was 15°C, and it was held for 3 h. Then, it was heated to 55°C in 15 h, then to 100°C in 2.5 h, and finally cooled to 75°C in 2.5 h. After demolding, the temperature was programmed for the second curing. It was held at 100°C for 3 h and finally cooled to 65°C.

[0054] Example 3

[0055] A transparent resin material:

[0056] At 15 °C, 0.1 g of dibutyl phosphate and 0.07 g of tetrabutylphosphonium bromide were added to 6 g of norbornane diisocyanate (NBDI), 7 g of 6-hydroxy-7-mercapto-1,2-cyclothio-4-thioheptane, and 8 g of 1-cyclothiopropyl-5-glycidyl-1,5-dithio-3-pentanol. After stirring until completely dissolved, 79 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance. Its Tg was 94 °C, Nd was 1.6612, Vd was 40, and the in-spectrum transmittance was 98.6%.

[0057] Example 4

[0058] A transparent resin material:

[0059] At 15 °C, 0.1 g of dibutyl phosphate and 0.08 g of tetrabutylphosphonium bromide were added to 9 g of NBDI, 5 g of 6-hydroxy-7-mercapto-1,2-cyclothio-4-thioheptane, and 11 g of 1-cyclothiopropyl-5-glycidyl-1,5-dithio-3-pentanethiol. After stirring until completely dissolved, 75 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance. Its Tg was 92 °C, Nd was 1.6762, Vd was 38.5, and the in-spectrum transmittance was 98.5%.

[0060] Example 5

[0061] A transparent resin material:

[0062] At 15 °C, 0.1 g of dibutyl phosphate and 0.1 g of tetrabutylphosphonium bromide were added to 7 g of HXDI, 1 g of 6-hydroxy-7-methoxy-1,2-cyclothio-4-thioheptane, 12 g of 1-cyclothiopropyl-5-glycidyl-1,5-dithio-3-pentanol, and 3 g of BES. After stirring until completely dissolved, 77 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance. Its Tg was 95 °C, Nd was 1.6889, Vd was 38, and the in-spectrum transmittance was 98.3%.

[0063] Example 6

[0064] A transparent resin material:

[0065] At 15 °C, 0.1 g of dibutyl phosphate and 0.1 g of tetrabutylphosphonium bromide were added to 5 g of NBDI, 1 g of 6-hydroxy-7-methoxy-1,2-epithio-4-thioheptane, and 15 g of 1-(epithiopropyl)-5-(glycidoxy)-1,5-dithia-3-pentanethiol. After stirring until completely dissolved, 79 g of BEPDS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance, having a Tg of 96 °C, an Nd of 1.7289, a Vd of 35.5, and an in-spectrum transmittance of 98.1%.

[0066] Example 7

[0067] A transparent resin material:

[0068] At 15 °C, 0.1 g of dibutyl phosphate and 0.1 g of tetrabutylphosphonium bromide were added to 7 g of NBDI, 1 g of 1-(epithiopropyl)-5-(glycidoxy)-1,5-dithia-3-pentanol, and 15 g of 1-(epithiopropyl)-5-(glycidoxy)-1,5-dithia-3-pentanethiol. After stirring until completely dissolved, 77 g of BEPDS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance, having a Tg of 95 °C, an Nd of 1.6889, a Vd of 38, and an in-spectrum transmittance of 98.3%.

[0069] Example 8

[0070] A transparent resin material:

[0071] At 15 °C, 0.1 g of dibutyl phosphate, 0.05 g of tetrabutylphosphonium bromide, and 0.05 g of dibutyltin dichloride were added to 6 g of IPDI, 2 g of 6-hydroxy-7-methoxy-1,2-epithio-4-thioheptane, 2 g of 1-epithiopropyl-5-glycidyl-1,5-dithio-3-pentanol, and 5 g of 1-epithiopropyl-5-glycidyl-1,5-dithio-3-pentanethiol. After stirring until completely dissolved, 85 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high spectral transmittance. Its Tg was 102 °C, Nd was 1.7055, Vd was 36.1, and the spectral transmittance was 98.3%.

[0072] Comparative Example 1

[0073] A transparent resin material:

[0074] At 15 °C, 0.1 g of dibutyl phosphate, 0.06 g of tetrabutylphosphonium bromide, and 0.04 g of dibutyltin dichloride were added to 9 g of IPDI and 6 g of ethanethiol. After stirring until completely dissolved, 85 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high spectral transmittance. Its Tg was 85 °C, Nd was 1.6320, Vd was 39.6, and the spectral transmittance was 89.7%.

[0075] Comparative Example 2

[0076] A transparent resin material:

[0077] At 15 °C, 0.1 g of dibutyl phosphate and 0.1 g of tetrabutylphosphonium bromide were added to 49 g of HMDI. After stirring until completely dissolved, 51 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high spectral transmittance. Its Tg was 80 °C, Nd was 1.6013, Vd was 42, and the spectral transmittance was 85.6%.

[0078] Comparative Example 3

[0079] A transparent resin material:

[0080] At 15 °C, 0.1 g of dibutyl phosphate and 0.07 g of tetrabutylphosphonium bromide were added to 9 g of IPDI and 6 g of 6-hydroxy-7-mercapto-1,2-epithio-4-thioheptane. After stirring until completely dissolved, 85 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance. Its Tg was 93 °C, Nd was 1.6862, Vd was 37.8, and the in-spectrum transmittance was 92.3%.

[0081] Comparative Example 4

[0082] A transparent resin material:

[0083] At 15 °C, 0.1 g of dibutyl phosphate and 0.07 g of tetrabutylphosphonium bromide were added to 9 g of IPDI and 6 g of 1-(epithiopropyl)-5-(glycidoxy)-1,5-dithio-3-pentanethiol. After stirring until completely dissolved, 85 g of BEPS was added, and the mixture was stirred at 20 °C for 30 min to obtain a prepolymer solution. After vacuum degassing for 30 min, it was filtered through a polytetrafluoroethylene filter membrane with a pore size of 3 μm and injected into a mold. Then, the mold was placed in a programmed temperature curing furnace for curing to obtain a transparent resin material with a high in-spectrum transmittance. Its Tg was 95 °C, Nd was 1.6853, Vd was 38, and the in-spectrum transmittance was 93.6%.

[0084] The glass transition temperature, refractive index, Abbe number, and in-spectrum transmittance of the transparent resin materials provided in Examples 1-8 and Comparative Examples 1-4 were detected respectively; among them, the refractive index (Nd) and Abbe number (Vd) were detected using an Abbe refractometer; the glass transition temperature (Tg) was detected using a DSC-3 differential scanning calorimeter at a heating rate of 10 K / min; the in-spectrum transmittance was measured using a double-beam spectrophotometer. The test results of each property are shown in the table.

[0085]

[0086]

[0087] The representative substance ethanethiol used in Comparative Example 1 is a monofunctional thiol. Component A, which is asymmetric, was not added in Comparative Example 2. Comparative Examples 3 and 4 contain only one asymmetric compound. From the comparison of the above performance test results, it can be seen that the internal transmittance ratios of the transparent resin materials provided in Examples 1-8 of the present invention are significantly higher than those of the transparent resin materials provided in Comparative Examples 1-4. Only by using two or more asymmetric compounds in Component A defined in the present invention and combining with additives such as Component B, Component C, and initiator can a transparent resin material with a high refractive index, a high Abbe number, and a high internal transmittance be prepared. Component A of the present invention includes two or more asymmetric compounds, wherein the asymmetric compounds contain two or more active groups among mercapto, hydroxyl, and episulfide groups, and by controlling Component B and C within a specific proportion range, excellent effects can be achieved. In the present invention, the episulfide compound has a high sulfur content, thereby increasing the refractive index and Abbe number of the material. Adding an asymmetric compound containing at least two active groups among mercapto, hydroxyl, and episulfide groups reduces the regularity of the polymer structure, reduces the light scattering loss caused by crystallization, and reduces the light absorption of the material itself, thereby increasing the internal transmittance ratio. Therefore, the requirements of the market for a high refractive index, a high Abbe number, and a high internal transmittance are met. The spectral internal transmittance ratio is a key optical index for measuring transparent materials and is particularly important in optical design. For specific test reports, please refer to the reference materials for substantive examination. The resin material prepared from the composition provided by the present invention has a spectral internal transmittance ratio ≥ 98%, a refractive index of 1.60 - 1.75, and an Abbe number ≥ 35.

[0088] The above-described disclosed embodiments enable those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A composition for a transparent resin material with high in-spectral transmittance, characterized in that, By weight, it includes 3 to 16 parts of component A and 75 to 88 parts of component B; component A includes two or more asymmetric compounds, and the asymmetric compounds contain two or more active groups among mercapto group, hydroxyl group, and episulfide group, and component B is a di-functional episulfide compound; The component A includes the following two or more asymmetric compounds: ………………Formula (1) 6-hydroxy-7-mercapto-1,2-epithio-4-thioheptane ………………Formula (2) 6-hydroxy-7-methoxy-1,2-epithio-4-thioheptane ………………Formula (3) 1-epithiopropyl-5-glycidyl-1,5-dithio-3-pentanol ………………Formula (4) 1-epithiopropyl-5-glycidyl-1,5-dithio-3-pentanethiol The component B is bis(β-epithiopropyl) sulfide or bis(β-epithiopropyl) disulfide; It further includes component C: 5 to 9 parts of polyisocyanate compound; The component C is one of 4,4'-dicyclohexylmethane diisocyanate, norbornane diisocyanate, isophorone diisocyanate, and cyclohexane dimethylene diisocyanate.

2. The composition of a transparent resin material with high in-spectral transmittance according to claim 1, characterized in that, By weight, it further includes component D: 1 to 20 parts of polythiol compound.

3. The composition of a transparent resin material with high in - spectrum transmittance according to claim 2, characterized in that, The polythiol of the component D is selected from one or more of 2,2'-thiobis(ethanethiol), 2,3-bis(2-mercaptoethylthio)-3-propyl-1-thiol, 2,3-dithio(2-mercapto)-1-propanethiol, pentaerythritol tetra(3-mercaptopropionate), bis(2-mercaptoethyl) sulfide, 2-(2-mercaptoethylthio)propyl-1,3-dithiol, and 1,2-bis(2-mercaptoethylthio)-3-mercaptopropane.

4. A transparent resin material, characterized in that, Using the composition and additives described in any one of the above claims 1-3 to prepare a transparent resin material, the light transmittance within the spectrum of this material is ≥98%, the refractive index is 1.60 - 1.75, and the Abbe number is ≥35.

Images