Multi-arc and magnetron composite sputtering cathode

Abstract

The present invention discloses a multi-arc and magnetron composite sputtering cathode in a preferred embodiment of the present invention, comprising a mounting frame, a lifting device, a cathode magnetic plate, and a target panel; the lifting device comprises a mounting plate, a coupling, a lifting shaft, and a lifting head; the mounting plate is arranged at the bottom of the mounting frame; the coupling is arranged at the bottom of the mounting plate; the lifting shaft is transmission-connected to the coupling; the lifting head is threadedly arranged at the top of the lifting shaft; the cathode magnetic plate is movably arranged at the top of the mounting frame, and the cathode magnetic plate is mounted on the top of the lifting head; the target panel is mounted on the top of the mounting frame, and the target panel is located above the cathode magnetic plate. The present invention can realize multi-arc sputtering and magnetron sputtering processes on a cathode target by adjusting the distance between the cathode magnet and the target surface.

Description

Technical Field

[0001] The invention belongs to the field of cathode sputtering film formation, and in particular relates to a multi-arc and magnetron composite sputtering cathode. Background Art

[0002] Multi-arc sputtering and magnetron sputtering are two common physical vapor deposition technologies with extensive production applications. Multi-arc sputtering offers high ionization rates, excellent adhesion, and rapid deposition rates, but the film surface is relatively rough, while magnetron sputtering produces finer films. In actual production, composite coatings often utilize both multi-arc sputtering and magnetron sputtering to create different functional layers (for example, utilizing the strong adhesion of multi-arc sputtering to create a transition layer).

[0003] Currently, multi-arc sputtering films and magnetron sputtering films need to be formed separately through two sets of sputtering cathodes, resulting in high equipment costs. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a multi-arc and magnetron composite sputtering cathode based on the principle that the main difference between a multi-arc cathode and a magnetron sputtering cathode lies in the magnetic field design and the strength of the target surface magnetic field.

[0005] The solution adopted by the present invention to achieve its technical effects is:

[0006] A multi-arc and magnetron composite sputtering cathode comprises a mounting frame, a lifting device, a cathode magnetic plate and a target panel; the lifting device comprises a mounting plate, a coupling, a lifting shaft and a lifting head; the mounting plate is arranged at the bottom of the mounting frame; the coupling is arranged at the bottom of the mounting plate; the lifting shaft is transmission-connected to the coupling; the lifting head thread transmission is arranged at the top of the lifting shaft; the cathode magnetic plate is movably arranged at the top of the mounting frame, and the cathode magnetic plate is installed at the top of the lifting head; the target panel is mounted on the top of the mounting frame, and the target panel is located above the cathode magnetic plate.

[0007] Preferably, the lifting head includes a sleeve and a lifting block; the sleeve is rotatably arranged on the top of the lifting shaft; the lifting block is threadedly arranged in the sleeve, and the top of the lifting block is arranged on the bottom of the cathode magnetic plate.

[0008] Preferably, the multi-arc and magnetron composite sputtering cathode also includes a sputtering device; the sputtering device includes a sputtering connector, a multi-arc sputtering power supply and a magnetron sputtering power supply; the sputtering connector is arranged on the cathode magnetic plate; the output end of the multi-arc sputtering power supply and the output end of the magnetron sputtering power supply are respectively electrically connected to the input end of the sputtering connector.

[0009] Preferably, the sputtering device also includes a switching switch; the input end of the switching switch is electrically connected to the output end of the multi-arc sputtering power supply and the output end of the magnetron sputtering power supply respectively; the output end of the switching switch is electrically connected to the input end of the sputtering connector.

[0010] Preferably, a mounting hole is provided on the top of the mounting frame; a support frame is provided on the outside of the target panel; a positioning column is provided on the bottom of the support frame; and the positioning column is slidably inserted into the mounting hole.

[0011] The beneficial effects of the present invention are as follows: a lifting device is provided, by which the distance from the cathode magnet to the target surface can be adjusted, thereby adjusting the strength of the magnetic field on the target surface. The multi-arc sputtering film forming process and the magnetron sputtering film forming process can be successively realized on one cathode target, saving the number of equipment used, thereby reducing production costs, and the production of diaphragms is more flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 Schematic diagram of a device for controlling the distance between a cathode magnet and a target surface according to an embodiment of the present invention;

[0013] Figure 2 A schematic diagram of a cathode magnetic plate and a target panel disclosed in an embodiment of the present invention;

[0014] Figure 3 A schematic diagram of a cathode magnetic plate disclosed in an embodiment of the present invention;

[0015] Figure 4 A schematic diagram of a lifting device disclosed in an embodiment of the present invention;

[0016] Figure 5 This is a schematic diagram of a lifting block disclosed in an embodiment of the present invention.

[0017] Label description: 1-mounting frame, 2-cathode magnetic plate, 3-target panel, 4-mounting plate, 5-coupling, 6-lifting shaft, 7-sleeve, 8-lifting block, 9-sputtering joint, 10-multi-arc sputtering power supply, 11-magnetron sputtering power supply, 12-support frame, 13-positioning column, 14-switch. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the present invention and are not intended to limit the present invention. It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it may be directly on the other element or there may be a centering element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be a centering element at the same time. When an element is referred to as being "fixedly connected to" another element, it may be a common fixed connection method such as welding, bolting or gluing.

[0019] Please refer to Figure 1-5 In a preferred embodiment of the present invention, a multi-arc and magnetron composite sputtering cathode is disclosed, including a mounting frame 1, a lifting device, a cathode magnetic plate 2 and a target panel 3; the lifting device includes a mounting plate 4, a coupling 5, a lifting shaft 6 and a lifting head; the mounting plate 4 is arranged at the bottom of the mounting frame 1; the coupling 5 is arranged at the bottom of the mounting plate 4; the lifting shaft 6 is transmission-connected to the coupling 5; the lifting head thread transmission is arranged at the top of the lifting shaft 6; the cathode magnetic plate 2 is movably arranged at the top of the mounting frame 1, and the cathode magnetic plate 2 is installed at the top of the lifting head; the target panel 3 is mounted on the top of the mounting frame 1, and the target panel 3 is located above the cathode magnetic plate 2.

[0020] Specifically, the lifting head includes a sleeve 7 and a lifting block 8; the sleeve 7 is rotatably mounted on the top of the lifting shaft 6; the lifting block 8 is threadedly mounted within the sleeve 7, and the top of the lifting block 8 is mounted on the bottom of the cathode magnetic plate 2. The lifting shaft 6 of the present invention is connected to a drive device such as a motor. The motor drives the lifting shaft 6 to rotate the sleeve 7, thereby controlling the lifting block 8 to move up and down within the sleeve 7, thereby controlling the distance between the cathode magnetic plate 2 and the target panel 3.

[0021] Specifically, the multi-arc and magnetron composite sputtering cathode also includes a sputtering device; the sputtering device includes a sputtering connector 9, a multi-arc sputtering power supply 10 and a magnetron sputtering power supply 11; the sputtering connector 9 is arranged on the cathode magnetic plate 2; the output end of the multi-arc sputtering power supply 10 and the output end of the magnetron sputtering power supply 11 are respectively electrically connected to the input end of the sputtering connector 9.

[0022] Specifically, the sputtering device also includes a switching switch 14; the input end of the switching switch 14 is electrically connected to the output end of the multi-arc sputtering power supply 10 and the output end of the magnetron sputtering power supply 11; the output end of the switching switch 14 is electrically connected to the input end of the sputtering connector 9.

[0023] Specifically, a mounting hole is provided on the top of the mounting frame 1; a support frame 12 is provided on the outside of the target panel 3; a positioning column 13 is provided at the bottom of the support frame 12; the positioning column 13 is slidably inserted into the mounting hole, so that the target panel 3 is mounted on the top of the mounting frame 1.

[0024] Working process: When it is necessary to produce a multi-arc sputtering film layer: start a driving device such as a servo motor, etc., so that it controls the coupling 5 and the lifting shaft 6 to rotate, so that the cathode magnetic plate 2 drops away from the target panel 3, thereby weakening the magnetic field strength between the two, and then start the multi-arc sputtering power supply 10 by switching the switch 14, so that the product to be plated set on the target panel 3 is subjected to multi-arc sputtering electroplating treatment; when it is necessary to produce a magnetron sputtering film layer: start a driving device such as a servo motor, etc., so that it controls the coupling 5 and the lifting shaft 6 to rotate, so that the cathode magnetic plate 2 rises close to the target panel 3, thereby strengthening the magnetic field strength between the two, and then start the magnetron sputtering power supply 11 by switching the switch 14, so that the product to be plated set on the target panel 3 is subjected to magnetron sputtering electroplating treatment.

[0025] As can be seen from the above description, the present invention can realize multi-arc sputtering and magnetron sputtering processes on one cathode target by adjusting the distance between the cathode magnet and the target surface.

[0026] The preferred embodiments of the present invention are described in detail above in conjunction with the drawings in the specification. It should be noted that the protection scope of the present invention includes but is not limited to the above embodiments; the specific structures disclosed in the drawings in the specification are only preferred embodiments of the present invention, and technicians in the field can also develop other embodiments on this basis. Any simple deformation or equivalent replacement that does not deviate from the innovative concept of the present invention is covered by the present invention and belongs to the protection scope of the present invention.

Claims

1. Multi-arc and magnetron composite sputtering cathode, characterized in that, include: Mounting rack; lifting device; The lifting device includes a mounting plate, a coupling, a lifting shaft and a lifting head; the mounting plate is arranged at the bottom of the mounting frame; the coupling is arranged at the bottom of the mounting plate; the lifting shaft is connected to the coupling by transmission; the lifting head is threadedly arranged at the top of the lifting shaft; Cathode magnetic plate; the cathode magnetic plate is movably arranged on the top of the mounting frame, and the cathode magnetic plate is installed on the top of the lifting head; target panel; The target panel is mounted on the top of the mounting frame, and the target panel is located above the cathode magnetic plate.

2. The multi-arc and magnetron composite sputtering cathode according to claim 1, characterized in that: The lifting head includes a shaft sleeve and a lifting block; the shaft sleeve is rotatably arranged on the top of the lifting shaft; the lifting block is threadedly arranged in the shaft sleeve, and the top of the lifting block is arranged on the bottom of the cathode magnetic plate.

3. The multi-arc and magnetron composite sputtering cathode according to claim 1, characterized in that: It also includes a sputtering device; the sputtering device includes a sputtering connector, a multi-arc sputtering power supply and a magnetron sputtering power supply; the sputtering connector is arranged on the cathode magnetic plate; the output end of the multi-arc sputtering power supply and the output end of the magnetron sputtering power supply are respectively electrically connected to the input end of the sputtering connector.

4. The multi-arc and magnetron composite sputtering cathode according to claim 3, characterized in that: The sputtering device also includes a switching switch; the input end of the switching switch is electrically connected to the output end of the multi-arc sputtering power supply and the output end of the magnetron sputtering power supply respectively; the output end of the switching switch is electrically connected to the input end of the sputtering connector.

5. The multi-arc and magnetron composite sputtering cathode according to claim 1, characterized in that: A mounting hole is provided on the top of the mounting frame; a support frame is provided on the outside of the target panel; a positioning column is provided on the bottom of the support frame; and the positioning column is slidably inserted into the mounting hole.

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