Coolant flow control device

Abstract

The application discloses a cooling liquid flow control device. The device comprises a heat dissipation base plate, a fixing seat, a cooling module and a temperature control element. The heat dissipation base plate has a bottom surface configured to contact a heating element on a substrate. The fixing seat is connected with the heat dissipation base plate and configured to be fixed with the substrate. The cooling module is connected with a top surface of the heat dissipation base plate to form a chamber. The chamber is configured to circulate cooling liquid. The temperature control element is connected with the cooling module and comprises a valve body. The valve body is configured to reciprocate based on the temperature of the heating element, thereby adjusting the flow of the cooling liquid in and out of the chamber.

Description

TECHNICAL FIELD

[0001] The present application relates to a cooling liquid flow control device. BACKGROUND

[0002] The existing water cooling module of electronic components (such as CPU) takes the heat-conducting substrate of the electronic component as the base, cooperates with the water inlet side and the water outlet side to form an internal circulation loop for heat exchange, and then achieves the heat dissipation effect of the electronic component. The electronic component platform corresponds to the hole position to perform fixation on the PCB.

[0003] However, the existing water cooling module does not have the function of flow (such as the flow of cooling water) control. Since the water cooling module cannot control the flow size, it cannot optimize the heat dissipation of the electronic component in the idle or full load state, so as to adjust the power load of the cooling distribution unit (CDU) to the system.

[0004] Therefore, how to propose a cooling liquid flow control device to control the flow of cooling liquid and achieve the energy-saving effect is one of the problems that the industry urgently wants to invest in research and development resources to solve. SUMMARY

[0005] Therefore, the purpose of the present application is to propose a cooling liquid flow control device that can solve the above problems.

[0006] In order to achieve the above purpose, according to an embodiment of the present application, a cooling liquid flow control device includes a heat dissipation bottom plate, a fixing seat, a cooling module and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to contact the heat generating element on the substrate. The fixing seat is connected with the heat dissipation bottom plate and is configured to be fixed with the substrate. The cooling module is connected with the top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate cooling liquid. The temperature control element is connected with the cooling module and includes a valve body. The valve body is configured to reciprocate based on the temperature of the heat generating element, thereby adjusting the flow of cooling liquid into and out of the cavity.

[0007] In one or more embodiments of the present application, the cooling module includes an inlet pipe and an outlet pipe, and the cavity further includes a first sub-cavity and a second sub-cavity. The first sub-cavity is configured to accept cooling liquid from the inlet pipe. The second sub-cavity is configured to deliver the cooling liquid from the first sub-cavity to the outlet pipe.

[0008] In one or more embodiments of the present application, the cooling module further comprises a top plate, a sidewall, and a partition wall. The top plate has an inlet hole and an outlet hole, wherein the inlet hole is connected between the first sub-chamber and the temperature control element, and the outlet hole is connected between the temperature control element and the second sub-chamber. The sidewall extends perpendicularly from the edge of the top plate and surrounds the edge of the top plate, wherein the sidewall is connected to the heat dissipation base plate. The partition wall extends perpendicularly from the top plate and separates the first sub-chamber from the second sub-chamber, wherein the partition wall is connected to the heat dissipation base plate.

[0009] In one or more embodiments of the present application, the temperature control element further comprises a cavity and a coil. The cavity is configured to accommodate the cooling liquid from the first sub-chamber. The coil is connected to the cavity and surrounds the valve body.

[0010] In one or more embodiments of the present application, the cavity comprises an inlet region, an outlet region, and a spacer. The inlet region is configured to receive the cooling liquid from the first sub-chamber. The outlet region is configured to deliver the cooling liquid from the inlet region to the second sub-chamber. The spacer separates the inlet region from the outlet region and has an opening to allow the cooling liquid to flow between the inlet region and the outlet region.

[0011] In one or more embodiments of the present application, the valve body is configured to block and unblock the opening.

[0012] In one or more embodiments of the present application, the cooling liquid flow control device further comprises a processing unit. The processing unit is configured to: receive a signal of the temperature from the heat generating element; and convert the signal into an electric current output to the coil, wherein the electric current causes the valve body to generate displacement.

[0013] In one or more embodiments of the present application, the flow of the cooling liquid varies based on the displacement generated by the valve body, and the flow and the electric current are in a linear relationship.

[0014] In one or more embodiments of the present application, the valve body is configured to: block the opening to shut off the inlet region and the outlet region when the heat generating element is in an idle state.

[0015] In one or more embodiments of the present application, the valve body is configured to: unblock the opening to open the inlet region and the outlet region when the heat generating element is in a load state.

[0016] In summary, in the cooling liquid flow control device of the present application, the temperature control element utilizes the reciprocating motion characteristic of the valve body based on the temperature of the heat generating element, so that the valve body can block, partially block, or unblock the opening to achieve the purpose of controlling the flow of the cooling liquid. In the cooling liquid flow control device of the present application, the flow of the cooling liquid varies based on the displacement generated by the valve body, and the flow and the electric current are in a linear relationship, so that the valve body can proportionally block the opening based on the temperature of the heat generating element, thereby achieving the energy-saving effect of the cooling liquid flow control device.

[0017] The above merely describes the problems to be solved by the present application, technical means for solving the problems, and effects thereof, and specific details of the present application will be described in the following embodiments and related drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to make the above and other purposes, features, advantages and embodiments of the present application more apparent, the following will describe the accompanying drawings in detail.

[0019] Figure 1 A schematic view of a coolant flow control device according to an embodiment of the present application.

[0020] Figure 2 Another schematic view of a coolant flow control device according to an embodiment of the present application.

[0021] Figure 3 A sectional view of a coolant flow control device according to an embodiment of the present application.

[0022] Figure 4A A partial schematic view of a cooling module according to an embodiment of the present application.

[0023] Figure 4B Another partial schematic view of a cooling module according to an embodiment of the present application.

[0024] Figure 5 A partial sectional view of a temperature control element according to an embodiment of the present application.

[0025] Figure 6 A schematic view of a valve body stop opening according to an embodiment of the present application.

[0026] Figure 7 A schematic view of a valve body disconnect opening according to an embodiment of the present application.

[0027] Figure 8 A graph of the relationship between the flow of coolant and the current signal according to an embodiment of the present application.

[0028] SYMBOL DESCRIPTION

[0029] 100: coolant flow control device

[0030] 110: heat dissipation base plate

[0031] 110a: top surface

[0032] 110b: bottom surface

[0033] 120: fixing seat

[0034] 130: cooling module

[0035] 132: top plate

[0036] 132A: inlet hole

[0037] 132B: outlet hole

[0038] 134: side wall

[0039] 136: partition wall

[0040] 140: temperature control element

[0041] 142: cavity

[0042] 143: spacer

[0043] 144: coil

[0044] 146: valve body

[0045] 147: fixed core

[0046] 148: elastic member

[0047] 149: moving core

[0048] A1: inlet area

[0049] A2: outlet area

[0050] C1: first sub-cavity

[0051] C2: second sub-cavity

[0052] F: stop portion

[0053] H: housing

[0054] IT: inlet tube

[0055] O: opening

[0056] OT: outlet tube

[0057] P: gasket

[0058] S1, S2: fixing member

[0059] W: wire DETAILED DESCRIPTION

[0060] Embodiments of the present application will be described below with reference to the drawings. Many specific details of the present application are described below in order to provide a thorough understanding of the present application. However, it will be understood by those skilled in the art that the present application can be practiced without these specific details. In other instances, well-known structures and functions are not described in detail in order to avoid obscuring the present application. Like numbers refer to like elements throughout the description.

[0061] The structure, function, and connection relationship between the components included in the coolant flow control device 100 of this embodiment will be described in detail below.

[0062] Please refer to Figure 1 as well as Figure 2 . Figure 1 as well as Figure 2 This is a schematic diagram from different perspectives of a coolant flow control device 100 according to an embodiment of this application. In this embodiment, the coolant flow control device 100 includes a heat sink base 110, a mounting base 120, a cooling module 130, and a temperature control element 140. The heat sink base 110 has a top surface 110a and a bottom surface 110b. The bottom surface 110b is configured to contact a heat-generating element (not shown; e.g., CPU) on a substrate (not shown; e.g., PCB). The mounting base 120 is connected to the heat sink base 110 and configured to fix it to the substrate. Specifically, as Figure 1 as well as Figure 2 As shown, the heat dissipation base plate 110 is connected to the mounting base 120 via a fixing member S1. The heating element contacts the bottom surface 110b of the heat dissipation base plate 110, and the heating element is located between the heat dissipation base plate 110 and the substrate. When the mounting base 120 is fixed towards the substrate via the fixing member S2, the heat dissipation base plate 110 presses against the heating element. The cooling module 130 is connected to the top surface 110a of the heat dissipation base plate 110 to form a chamber. The cooling module 130 also includes an inlet pipe IT and an outlet pipe OT. The chamber is configured to allow coolant to flow through it. The temperature control element 140 is connected to the cooling module 130 and configured to adjust the flow rate of coolant entering and exiting the chamber based on the temperature of the heating element.

[0063] In some implementations, such as Figure 1 as well as Figure 2 As shown, the coolant flow control device 100 also includes a housing H. The housing H is configured to provide protection for the temperature control element 140.

[0064] In some embodiments, the coolant flow control device 100 further includes a processing unit (not shown). The processing unit is configured to receive a temperature signal from the heating element. The processing unit is also configured to convert the signal into a current output to the temperature control element 140.

[0065] In some implementations, such as Figure 1 as well as Figure 2 As shown, the coolant flow control device 100 also includes a wire W. The wire W is configured to deliver current from the processing unit to the temperature control element 140.

[0066] Please refer to Figure 3 , Figure 4A as well as Figure 4BIn this embodiment, the cooling module 130 comprises a top plate 132, a sidewall 134, and a partition wall 136. The top plate 132 has an inlet hole 132A and an outlet hole 132B. The sidewall 134 extends vertically from the edge of the top plate 132 and surrounds the edge of the top plate 132, wherein the sidewall 134 is connected to the heat dissipation base plate 110. The partition wall 136 extends vertically from the top plate 132 and is configured to divide the chamber into a first sub-chamber CI and a second sub-chamber C2. That is, the partition wall 136 separates the first sub-chamber CI from the second sub-chamber C2, wherein the partition wall 136 is connected to the heat dissipation base plate 110. The first sub-chamber CI is configured to receive the cooling liquid from the inlet tube IT. The second sub-chamber C2 is configured to deliver the cooling liquid from the first sub-chamber CI to the outlet tube OT. In some embodiments, as shown in FIG. 1, the inlet hole 132A is connected between the first sub-chamber CI and the temperature control element 140, and the outlet hole 132B is connected between the temperature control element 140 and the second sub-chamber C2. Figure 3

[0067] Please refer to Figure 3 and Figure 5 In this embodiment, the temperature control element 140 comprises a cavity 142, a coil 144, and a valve body 146. The cavity 142 is configured to accommodate the cooling liquid from the first sub-chamber CI. The coil 144 is connected to the cavity 142. The valve body 146 is disposed in the coil 144, specifically, the coil 144 comprising a plurality of wires surrounds the valve body 146. In some embodiments, the valve body 146 is disposed on the inner surface of the temperature control element 140. The valve body 146 is configured to reciprocate based on the temperature of the heat generating element, thereby adjusting the flow rate of the cooling liquid in and out of the chamber.

[0068] Please refer to Figure 5 ​In this embodiment, the cavity 142 further comprises an inlet area A1, an outlet area A2 and a partition 143. The inlet area A1 is configured to receive the coolant from the first sub-chamber C1. The outlet area A2 is configured to deliver the coolant from the inlet area A1 to the second sub-chamber C2. The partition 143 separates the inlet area A1 from the outlet area A2 and has an opening O. The opening O allows the coolant to flow between the inlet area A1 and the outlet area A2. In this embodiment, the valve body 146 comprises a fixed core 147, a spring 148 and a moving core 149. The fixed core 147 is fixed to the inner surface of the temperature control element 140. The spring 148 is connected between the fixed core 147 and the moving core 149. In some embodiments, the moving core 149 is configured to block and unblock the opening O. In some embodiments, the end of the moving core 149 can comprise a blocking portion F, and the blocking portion F is configured to block and unblock the opening O. In some embodiments, the temperature control element 140 further comprises a gasket P disposed between the coil 144 and the cavity 142, and the gasket P is configured to separate the coil 144 and the cavity 142 to prevent the coolant in the cavity 142 from contacting the coil 144 and causing damage.

[0069] With the foregoing structure, when the coolant flows from the inlet tube IT into the first sub-chamber C1, the coolant enters the inlet area A1 through the inlet hole 132A. Then, the coolant flows into the outlet area A2 through the opening O on the partition 143. Then, the coolant enters the second sub-chamber C2 through the outlet hole 132B and then flows into the outlet tube OT.

[0070] Next, the method of how the coolant flow control device 100 controls the flow rate of the coolant will be described.

[0071] Reference is made to Figure 6 , Figure 7 and Figure 8 . Figure 6 and Figure 7 for how the valve body 146 of the temperature control element 140 operates to control the flow rate of the coolant in the coolant flow control device 100. Figure 8 is a graph showing the relationship between the flow rate of the coolant and the current signal according to an embodiment of the present application. In this embodiment, for example, the temperature of the heat generating element is known by the baseboard management chip (BMC) connected thereto through a signal. The processing unit knows the temperature of the heat generating element through the signal conversion of the baseboard management chip, and then converts it into a PWM signal output through an internal software function, and linearly converts the PWM signal with a duty cycle of 0% to 100% into a current output of 4 to 20 mA. Thus, the current input received by the wire W can control the reciprocating motion of the valve body 146 to control the flow rate or flow of the coolant. As shown in Figure 8As shown, the flow rate of the coolant is linearly related to the signal of the current. In some embodiments, the aforementioned current is substantially to displace the moving iron core 149 to stop against and disengage from the opening O, so as to control the flow rate of the coolant. When the heat generating element is in a normal operation state, the processing unit will output an appropriate current to the coil 144, so that the moving iron core 149 generates a displacement corresponding to the current to proportionally partially stop the opening O. Since the stopper F stops part of the opening O, the coolant from the inlet tube IT can enter the outlet area A2 and the second sub-chamber C2 via the opening O at an appropriate flow rate.

[0072] In a use scenario, when the heat generating element located below the heat dissipation base plate 110 and in contact with the bottom surface 110b is in an idle state and does not generate waste heat, the processing unit does not output a current to the coil 144, and the moving iron core 149 does not generate an upward displacement (as shown in Figure 6 Therefore, the stopper F stops the opening O. Since the stopper F stops the entire opening O, the coolant from the inlet tube IT cannot enter the outlet area A2 via the opening O.

[0073] In a use scenario, when the heat generating element located below the heat dissipation base plate 110 generates relatively more waste heat due to being in a full load state, the processing unit outputs a corresponding maximum current to the coil 144, so that the moving iron core 149 generates an upward displacement (as shown in Figure 7 Therefore, the stopper F disengages from the opening O. Since the stopper F disengages from the opening O, the coolant from the inlet tube IT can enter the outlet area A2 via the opening O.

[0074] Through the above operation, the coolant flow rate control device 100 can appropriately control the moving iron core 149 to stop, partially stop, and disengage from the opening O based on the temperature of the heat generating element by outputting a corresponding current, so as to control the flow rate of the coolant and save energy.

[0075] In some embodiments, the stopper F is provided on the moving iron core 149, but the present application is not limited thereto. In some embodiments, the moving iron core 149 can not include the stopper F, but has one end with a shape, for example, a pointed shape, which matches the shape of the opening O.

[0076] In some embodiments, the valve body 146 includes the fixed iron core 147 and the moving iron core 149, but the present application is not limited thereto. In some embodiments, the valve body 146 can not include the fixed iron core 147 and the moving iron core 149, but be formed as a single body. For example, when the coil 144 receives a current from the processing unit, the valve body 146 as a whole generates a downward and upward displacement.

[0077] In some embodiments, as shown in Figure 1 ,Figure 2 , Figure 6 ,as well as Figure 7 As shown, the fastener S2 includes components such as springs and screws, but this application is not limited thereto. In some embodiments, the fastener S2 may not include a spring. Although this application discloses a locking method for connecting the fixing seat 120 to the substrate, this application is not intended to limit the structure, method, or means of connecting the fixing seat 120 to the substrate.

[0078] In some implementations, such as Figure 1 , Figure 2 , Figure 5 ,as well as Figure 7 As shown, the fastener S1 is essentially a screw. Although this application discloses a locking mechanism for connecting the heat sink base 110 and the mounting base 120 (e.g., locking the heat sink base 110 and the mounting base 120 together via the fastener S1), this application is not intended to limit the structure, method, or means of connecting the heat sink base 110 and the mounting base 120 together.

[0079] In some embodiments, the coolant may be liquid water (H2O), but this application is not limited thereto. In some embodiments, the coolant may be ethylene glycol (C2H6O2) or propylene glycol (C3H8O2). The above are merely illustrative examples and are not intended to limit the composition of the coolant.

[0080] In some embodiments, the heat dissipation base plate 110 and the cooling module 130 are substantially separate, but this application is not limited thereto. In some embodiments, the heat dissipation base plate 110 and the cooling module 130 may be integrally formed rather than separately formed. For example, the heat dissipation base plate 110 and the cooling module 130 may be integrally formed into a water-cooled housing with a chamber C.

[0081] In some embodiments, the heat dissipation base plate 110 and the cooling module 130 are substantially connected in close proximity. Alternatively, in some embodiments, the heat dissipation base plate 110 and the cooling module 130 may be bonded together. Alternatively, in some embodiments, the heat dissipation base plate 110 and the cooling module 130 may be snap-fitted together. The above are merely illustrative examples and are not intended to limit the structure, method, or means of connecting the heat dissipation base plate 110 and the cooling module 130.

[0082] In some embodiments, the stop portion F can be a flexible material such as plastic, rubber, or cork to more tightly stop the liquid inlet hole 132A. The above is merely an example for illustrative purposes, and this application is not intended to limit the material of the stop portion F.

[0083] In some embodiments, the temperature control element 140 is disposed on the cooling module 130, but the present application is not limited thereto. In some embodiments, for example, the temperature control element 140 can be disposed between the first sub-chamber C1 and the second sub-chamber C2. The present application is not intended to be limited to the position of the temperature control element 140.

[0084] From the above detailed description of the specific embodiments of the present application, it can be clearly seen that, in the cooling liquid flow control device of the present application, due to the characteristic that the temperature control element can reciprocate based on the temperature of the heat generating element using the valve body, the valve body can stop, partially stop or disengage the opening to achieve the purpose of controlling the flow of the cooling liquid. In the cooling liquid flow control device of the present application, since the flow of the cooling liquid varies based on the displacement of the valve body and the current has a linear relationship, the valve body can proportionally stop the opening based on the temperature of the heat generating element, thereby achieving the energy saving effect of the cooling liquid flow control device.

[0085] In an embodiment of the present application, the cooling liquid flow control device of the present application can be applied to a server that can be used for artificial intelligence (AI) operation, edge computing, and can also be used as a 5G server, a cloud server or a vehicle networking server.

[0086] Although the present application has been described with reference to the embodiments above, it is not intended to limit the present application, and any person skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present application, and therefore the scope of protection of the present application shall be subject to the appended claims.

Claims

1. A coolant flow control device, characterized in that, Include: A heat dissipation base plate having a bottom surface configured to contact a heat-generating element on a substrate; A mounting base is connected to the heat dissipation base plate and configured to fix it to the substrate; A cooling module includes an inlet pipe and an outlet pipe. The cooling module is connected to a top surface of a heat dissipation base plate to form a chamber. The chamber includes a first sub-chamber and a second sub-chamber. The first sub-chamber is configured to receive coolant from the inlet pipe, and the second sub-chamber is configured to deliver the coolant from the first sub-chamber to the outlet pipe. The cooling module further includes: A top plate has a liquid inlet and a liquid outlet; A sidewall extends vertically from and around the edge of the top plate, wherein the sidewall connects to the heat dissipation base plate; and A partition wall extends vertically from the top plate and separates the first sub-chamber from the second sub-chamber, wherein the partition wall is connected to the heat dissipation base plate; A temperature control element, connected to the cooling module, includes a cavity, a coil, a valve body, and a gasket. The cavity includes an inlet area, an outlet area, and a spacer. The inlet area is configured to receive coolant from a first sub-chamber. The spacer separates the inlet area from the outlet area and has an opening allowing coolant to flow between the inlet and outlet areas. The outlet area is configured to deliver coolant from the inlet area to a second sub-chamber. The valve body is configured to regulate the flow rate of coolant into and out of the cavity based on the temperature reciprocating motion of the heating element. When the heating element is idle, the valve body blocks the opening to prevent the inlet and outlet areas from being connected. The gasket is disposed between the coil and the cavity to separate the coil from the cavity. A processing unit configured to: receive a temperature signal from the heating element; and convert the signal into a current output to the coil, wherein the current causes the valve body to displace.

2. The coolant flow control device as described in claim 1, characterized in that, The liquid inlet is connected between the first sub-chamber and the temperature control element, and the liquid outlet is connected between the temperature control element and the second sub-chamber.

3. The coolant flow control device as described in claim 2, characterized in that, The coil is connected to the cavity and surrounds the valve body.

4. The coolant flow control device as described in claim 3, characterized in that, The valve body is configured to stop and disengage from the opening.

5. The coolant flow control device as described in claim 1, characterized in that, The flow rate of the coolant varies based on the displacement generated by the valve body, and the flow rate is linearly related to the current.

6. The coolant flow control device as described in claim 1, characterized in that, The valve body is configured to: When the heating element is under load, it disengages from the opening to connect the liquid inlet area and the liquid outlet area.

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