PCB board, control device, PCB board manufacturing method and control device installation method

Abstract

The present application belongs to the field of PCB board design, and specifically relates to a PCB board, a control device, a PCB board manufacturing method, and a control device installation method. The PCB board is used in an electronic device equipped with a motor, and the PCB board includes a substrate; at least two component vias are provided on the surface of the substrate, and the at least two component vias are used to install target components; the mid-perpendicular lines of the at least two component vias pass through the target position of the PCB board; the target position is the position where the central axis of the motor is mapped to the PCB board along the axial direction. This can solve the problem that the rotation of the motor causes the PCB board to vibrate, thereby causing the pins of some components on the PCB board to break. Since the mid-perpendicular lines of the at least two component vias on the surface of the substrate pass through the target position of the PCB board, at least two pins of the target component are fixed on the PCB board. When the motor rotates and vibrates, the forces acting on the at least two components are basically balanced, thus reducing the probability of the pins of the target component breaking.

Description

Technical Field

[0001] The present invention relates to the field of PCB board design, and in particular to a PCB board, a control device, a method for manufacturing the PCB board, and a method for installing the control device. Background Art

[0002] Currently, electronic devices equipped with motors are widely used, such as vacuum cleaners and sweepers. The motors in these electronic devices operate under the control of a control circuit. Typically, this control circuit is implemented on a printed circuit board (PCB).

[0003] There are many components on the PCB board, such as electrolytic capacitors, film capacitors, chips, etc. These components usually do not have a fixed placement standard when fixed on the motor PCB board.

[0004] However, the PCB is often installed near a motor in an electronic device. The motor's rotation causes the PCB to vibrate, which can break pins on some components on the PCB, potentially damaging the electronic device. Summary of the Invention

[0005] This application provides a PCB board, a method for manufacturing a PCB board, a control device, and a method for installing the control device, which can solve the problem that the rotation of a motor causes the PCB board to vibrate, and the vibration of the PCB board may cause the pins of some components on the PCB board to break, causing damage to the electronic device. This application provides the following technical solutions:

[0006] In a first aspect, a PCB board is provided for use in an electronic device equipped with a motor, the PCB board comprising a substrate;

[0007] At least two component vias are provided on the surface of the substrate, and the at least two component vias are used to install target components; the perpendicular midlines of the at least two component vias pass through the target position of the PCB board;

[0008] The target position is the position where the central axis of the motor is mapped to the PCB board along the axial direction.

[0009] Optionally, the substrate surface is circular as a whole, and the target position is the center of the substrate surface.

[0010] Optionally, the size of the component via matches the size of the pin of the target component.

[0011] Optionally, the intervals between the vias of different components match the intervals between different pins of the target component.

[0012] In a second aspect, a control device is provided for use in an electronic device equipped with a motor. The control device includes a PCB board and a target component mounted on the PCB board.

[0013] The substrate surface of the PCB is provided with at least two component vias, and the at least two component vias are used to install the target component; the perpendicular midlines of the at least two component vias pass through the target position of the PCB; the target position is the position where the central axis of the motor is mapped to the PCB along the axial direction;

[0014] The target component includes at least two pins matching the at least two component vias, and each pin is fixed on the PCB board after passing through the corresponding component via, so that the target component is fixed on the PCB board.

[0015] Optionally, the target element further includes: an element housing, and a core group located inside the element housing; and a gap is provided between the element housing and the core group.

[0016] Optionally, the target element includes an electrolytic capacitor.

[0017] In a third aspect, a method for manufacturing a PCB board is provided, the method comprising:

[0018] When designing a PCB layout of the PCB board, determining a target position of the PCB board in the PCB layout, the target position being a position where a central axis of the motor is mapped to the PCB board along an axial direction;

[0019] Determining via positions of at least two component vias based on the target position in the PCB layout, wherein perpendicular midlines of the at least two component vias pass through the target position of the PCB board;

[0020] Punching is performed according to the via hole positions in the PCB layout to prepare the PCB board.

[0021] Optionally, the substrate surface is circular as a whole, the target position is the center of the substrate surface, and determining the target position of the PCB board in the PCB layout includes:

[0022] Determine the center of the PCB board in the PCB layout.

[0023] In a fourth aspect, a method for installing a control device is provided, the method comprising:

[0024] A PCB is prepared, wherein a substrate surface of the PCB is provided with at least two component vias; a perpendicular midline of the at least two component vias passes through a target position of the PCB; the target position is a position where a central axis of the motor is mapped axially to the PCB;

[0025] Providing a target component, wherein the target component includes at least two pins matching the at least two component vias;

[0026] Each pin of the target component is arranged in a corresponding component via.

[0027] The beneficial effects of the present application are as follows: when designing a PCB layout of a PCB board, a target position of the PCB board is determined in the PCB layout, the target position being the position where the central axis of the motor is mapped axially to the PCB board; the via positions of at least two component vias are determined in the PCB layout based on the target position; the midpoint perpendicular to the at least two component vias passes through the target position of the PCB board; and holes are punched according to the via positions in the PCB layout to prepare the PCB board. This solves the problem that the rotation of the motor causes the PCB board to vibrate, and that the vibration of the PCB board may cause the pins of some components on the PCB board to break, thereby damaging the electronic device. Because the midpoint perpendicular to the at least two component vias on the substrate surface passes through the target position of the PCB board, and the at least two pins of the target component are passed through the corresponding component vias and then fixed to the PCB board, when the motor rotates and drives the control device to vibrate, the force radiated outward from the target position by the control device on the at least two components is substantially balanced, thus reducing the probability of the pins of the target component breaking, thereby increasing the service life of the target component. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 This is a schematic structural diagram of a control device provided by an embodiment of the present application;

[0030] Figure 2 This is a schematic structural diagram of a PCB board provided in one embodiment of the present application;

[0031] Figure 3 This is a flow chart of a PCB board manufacturing method provided by one embodiment of the present application;

[0032] Figure 4 This is a flowchart of a control device installation method provided by an embodiment of the present application. DETAILED DESCRIPTION

[0033] The technical solutions of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present application, not all embodiments. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other unless there is a conflict.

[0034] It should be noted that the terms "first", "second", etc. in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0035] In the application, unless otherwise specified, directional words such as "up, down, top, bottom" are usually used with reference to the directions shown in the drawings, or with reference to the components themselves in the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit this application.

[0036] like Figure 1 The figure shows a schematic diagram of a control device provided in one embodiment of the present application. The control device can be used in an electronic device equipped with a motor to control the motor. The electronic device can be a vacuum cleaner, a sweeper, a hair dryer, etc. This embodiment does not limit the type of electronic device.

[0037] according to Figure 1 It can be seen that the control device at least includes: a PCB board 110 and a target component 120 mounted on the PCB board.

[0038] refer to Figure 2 The PCB board 110 includes a substrate, and at least two component vias 111 are provided on the surface of the substrate. The at least two component vias 111 are used to install the target component 120.

[0039] Correspondingly, the target component 120 includes at least two pins matching the at least two component vias 111 . Each pin passes through the corresponding component via and is fixed on the PCB board 110 , so that the target component 120 is fixed on the PCB board 110 .

[0040] Generally, the installation position of the control device in the electronic device is close to the installation position of the motor. In this case, when the motor in the electronic device rotates, it will drive the control device to vibrate. When the force applied by the motor to the control device acts on the control device, the direction of the force is usually the force radiated outward from the position on the PCB board 110 mapped from the axial direction of the motor to the position of the PCB board 110. Taking the position of the axial direction of the motor mapped to the PCB board 110 as the center of the circle of the PCB board 110 as an example, if the target component 120 has two pins, and one of the pins is close to the center of the circle and the other pin is far away from the center of the circle, the forces exerted on the two pins are unbalanced. Then, the force radiated outward along the center of the circle by the control device may cause the other pin of the target component 120 to break.

[0041] Based on the above technical issues, in this embodiment, the perpendicular midlines of at least two component vias 111 on the substrate surface pass through the target position 112 of the PCB board 110 . Figure 2 In order to indicate that the perpendicular midline of at least two component vias 111 passes through the target position 112 of the PCB board 110, a dotted line is used to represent the perpendicular midline and the connecting line between the at least two components. In actual implementation, the perpendicular midline and the connecting line may not be on the PCB board 110.

[0042] The target position is the position where the central axis of the motor is mapped to the PCB board 110 along the axial direction.

[0043] In this embodiment, the perpendicular midlines of at least two component vias 111 on the substrate surface pass through the target position of the PCB board 110. In this way, when the motor rotates and drives the control device to vibrate, the force emitted outward from the target position by the control device acts on the at least two components in a substantially balanced manner. In this way, the probability of breakage of the pins of the target component can be reduced, thereby increasing the service life of the target component.

[0044] Schematically, the substrate surface is generally circular, and the position where the central axis of the motor is mapped axially to the PCB 110 can be the center of the PCB 110. In other words, the target position is the center of the PCB 110. In actual implementation, the target position can also be a position other than the center of the circle, and this embodiment does not limit the implementation method of the target position.

[0045] Among them, the overall circular surface of the substrate means that the substrate surface is roughly circular, wherein the edge portion of the substrate surface may have protrusions and / or defects of different shapes; or, the overall circular surface of the substrate means that the substrate surface is a complete circle. This embodiment does not limit the implementation method of the circular substrate surface.

[0046] In other embodiments, the shape of the substrate surface may also be other shapes, such as a rectangle, or an irregular shape, etc. Accordingly, the target position may be the centroid position of the substrate surface. This embodiment does not limit the shape of the PCB board 110 and the implementation method of the target position.

[0047] Optionally, the size of the component via 111 on the PCB board 110 matches the size of the pin of the target component 120. Specifically, the size of the component via 111 is larger than the size of the pin, and the difference between the size of the component via 111 and the size of the pin is less than a preset difference, which enables the pin to pass through the corresponding component via 111.

[0048] Optionally, the shape of the component via 111 on the PCB board 110 is the same as the cross-sectional shape of the pin of the target component 120. Schematically, the cross-sectional shape of the pin is circular, and accordingly, the component via 111 on the PCB board 110 is circular.

[0049] Schematically, the component vias 111 are all copper-clad vias, that is, the annular copper layer in the component vias 111 can electrically connect the pins inserted in the component vias 111 to the circuits provided in the substrate.

[0050] Since the target component 120 in the component via 111 cannot move arbitrarily, the component via 111 not only serves to electrically connect the pins of the target component 120 with the circuit in the substrate, but also serves to position the pins of the target component 120 .

[0051] Optionally, the substrate is a composite structure formed by overlapping multiple layers of plate materials; or the specific material of the substrate is set according to actual conditions, such as fiberglass cloth base, aluminum base, iron base, etc. This embodiment does not limit the material of the substrate.

[0052] Optionally, the pins are soldered to the corresponding component vias by electric welding; or, a snap fit is provided on the component vias, and the pins are snap fit to the component vias through the snap fit. This embodiment does not limit the way in which the target component is fixed to the PCB board.

[0053] In actual implementation, the substrate may also be provided with corresponding circuits and other electronic components besides the target element, such as a controller, a resistor, etc. This embodiment does not limit the types of components provided on the substrate.

[0054] The target element 120 further includes: an element housing and a core group located inside the element housing. Accordingly, there is a gap between the element housing and the core group.

[0055] Schematically, the target component 120 is an electrolytic capacitor. Accordingly, the number of pins of the target component 120 is 2. Figure 1It can be seen that the perpendicular midline of the two pins of the target component 120 passes through the center of the PCB board (ie, the target position).

[0056] In actual implementation, the target component 120 may also be other components with a gap between the component housing and the core group and at least two pins. This embodiment does not limit the type of the target component 120.

[0057] In this embodiment, by setting the perpendicular midlines of at least two component vias 111 on the substrate surface to pass through a target position on the PCB board, the target position is the position where the central axis of the motor is axially mapped to the PCB board 110. When the motor rotates and drives the control device to vibrate, the force radiated outward from the target position by the control device exerts a substantially balanced force on the at least two components. In this way, the probability of breakage of the pins of the target component can be reduced, thereby increasing the service life of the target component.

[0058] This embodiment also provides a PCB board, which is used in an electronic device equipped with a motor. The PCB board includes Figure 1 PCB board 110 in the control device shown in FIG. Figure 2 As shown, the PCB board includes a substrate, and at least two component vias 111 are provided on the surface of the substrate. The at least two component vias 111 are used to install target components.

[0059] The relevant description of this embodiment is detailed in the embodiment of the control device mentioned above, and this embodiment will not be repeated here.

[0060] In this embodiment, the target component is fixed to the PCB board by adopting a scheme in which at least two component vias on the PCB are passed through a target position on the PCB, i.e., the central axis of the motor is mapped axially to the position on the PCB board. When the motor rotates and drives the control device to vibrate, the force radiated outward from the target position by the control device exerts a substantially balanced force on the at least two components. In this way, the probability of the pins of the target component breaking can be reduced, thereby increasing the service life of the target component.

[0061] The present application also provides a method for manufacturing a PCB board, which is described in detail below.

[0062] This embodiment provides a PCB board manufacturing method, such as Figure 3 The method includes at least the following steps:

[0063] Step 301 : When designing a PCB layout of a PCB board, a target position of the PCB board is determined in the PCB layout. The target position is a position where the central axis of the motor is mapped to the PCB board along the axial direction.

[0064] Optionally, when performing PCB layout design, relevant PCB layout design software is used for design, such as PADS, Altium, etc. This application does not limit the PCB layout design software.

[0065] When designing a PCB layout of the PCB board, a target position of the PCB board is determined in the PCB layout, including: finding a position in the PCB layout where a central axis of the motor is mapped to the PCB board along an axial direction, and marking the position as the target position.

[0066] Step 302: Determine via positions of at least two component vias based on the target position in the PCB layout, wherein perpendicular midlines of the at least two component vias pass through the target position of the PCB board.

[0067] Optionally, determining the via positions of at least two component vias based on the target position in the PCB layout includes: drawing a straight line outward from the target position in the PCB layout; drawing a line segment or a polygon based on the straight line, wherein the straight line is the perpendicular bisector of the line segment or the polygon; and determining the component vias based on the endpoints of the line segment or the vertices of the polygon.

[0068] Optionally, the endpoint of the line segment or the vertex of the polygon is the centroid of the component via, or the edge of the component via. This embodiment does not limit the method of determining the component via based on the endpoint of the line segment or the vertex of the polygon.

[0069] Schematically, when the target component has two pins, the two end positions of the above line segment are set as the centroids of the two component vias on the PCB board, and the component vias are drawn based on the size of the pins of the target component to obtain the via positions.

[0070] Step 303: punching holes according to the via positions in the PCB layout to prepare a PCB board.

[0071] In one example, punching holes according to via positions in the PCB layout includes: punching holes from the front side to the back side of the PCB board at the via positions, or punching holes from the back side to the front side of the PCB board at the via positions.

[0072] In another example, the front and back sides of a PCB are made of different materials. In this case, drilling is performed according to the via hole locations in the PCB layout, including: determining the thickness of the front and back sides of the PCB board; determining the front drill blade length based on the thickness of the front side of the PCB board; determining the back drill blade length based on the thickness of the back side of the PCB board; drilling holes at the via hole locations on the front side of the PCB board using a front drill with the front drill blade length; after inverting the PCB board, drilling holes at the via hole locations on the back side of the PCB board using a back drill with the back drill blade length, thereby connecting the front and back drill holes to form through holes.

[0073] In summary, the method for manufacturing a PCB board provided in this embodiment involves determining a target position for the PCB board in the PCB layout when designing the PCB board. The target position is the position where the motor's central axis is mapped axially onto the PCB board. The via hole positions of at least two component vias are determined in the PCB layout based on the target position. The perpendicular midline of the at least two component via holes passes through the target position of the PCB board, and holes are punched according to the via hole positions in the PCB layout to prepare the PCB board. This method can solve the problem that motor rotation causes the PCB board to vibrate, and that the vibration of the PCB board may cause the pins of some components on the PCB board to break, thereby damaging the electronic device. Because the perpendicular midline of at least two component via holes on the substrate surface passes through the target position of the PCB board, and the at least two pins of the target component are passed through the corresponding component via holes and then fixed to the PCB board, when the motor rotates and drives the control device to vibrate, the force radiated outward from the target position by the control device acts substantially evenly on the at least two components. This reduces the probability of the target component pins breaking, thereby increasing the service life of the target component.

[0074] The following is a detailed introduction to the installation method of the control device provided in this application.

[0075] This embodiment provides a method for installing a control device, such as Figure 4 The method includes at least the following steps:

[0076] Step 401: prepare a PCB board. The substrate surface of the PCB board is provided with at least two component vias. The perpendicular midlines of the at least two component vias pass through a target position of the PCB board. The target position is the position where the central axis of the motor is mapped to the PCB board along the axial direction.

[0077] PCB board preparation process reference Figure 3 The embodiment shown is not described in detail here.

[0078] Step 402: prepare a target component, where the target component includes at least two pins matching at least two component vias.

[0079] Specifically, the target component also includes a component housing and a core assembly located within the component housing, with a gap between the component housing and the core assembly. The spacing between different component vias matches the spacing between different pins of the target component. Furthermore, the diameter of the target component pins needs to be slightly smaller than the diameter of the component vias.

[0080] Schematically, the target component is an electrolytic capacitor.

[0081] Step 403: Place each pin of the target component in a corresponding component via.

[0082] Optionally, the pins are soldered to the corresponding component vias by electric welding; or, a snap fit is provided on the component vias, and the pins are snap fit to the component vias through the snap fit. This embodiment does not limit the way in which the target component is fixed to the PCB board.

[0083] In summary, the control device installation method provided in this embodiment comprises providing a PCB board, the substrate surface of which is provided with at least two component vias, the midpoints of which pass through a target position on the PCB board, the target position being the position where the motor's central axis is axially mapped onto the PCB board, providing a target component, the target component including at least two pins that match the at least two component vias, and each pin of the target component being positioned within a corresponding component via. This method can address the problem that motor rotation causes the PCB board to vibrate, which can cause the pins of some components on the PCB board to break, thereby damaging the electronic device. Because the midpoints of the at least two component vias on the substrate surface pass through the target position on the PCB board, and the at least two pins of the target component are secured to the PCB board after being passed through the corresponding component vias, when the motor rotates and causes the control device to vibrate, the force radiated outward from the target position by the control device acts substantially evenly on the at least two components. This reduces the probability of pin breakage on the target component, thereby increasing the service life of the target component.

[0084] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A PCB board, characterized in that: Used in an electronic device equipped with a motor, the PCB board includes a substrate; At least two component vias are provided on the surface of the substrate, and the at least two component vias are used to install target components; the perpendicular midlines of the at least two component vias pass through the target position of the PCB board; The target position is the position where the central axis of the motor is mapped to the PCB board along the axial direction; When the motor rotates to drive the control device with the PCB board to vibrate, the force emitted outward from the target position by the control device on at least two components is basically balanced, thereby reducing the breakage of the pins of the target component.

2. The PCB board according to claim 1, characterized in that: The substrate surface is circular as a whole, and the target position is the center of the substrate surface.

3. The PCB board according to claim 1, characterized in that: The size of the component via matches the size of the pin of the target component.

4. The PCB board according to claim 1, characterized in that: The spacing between the vias of different components matches the spacing between the pins of the target component.

5. A control device, characterized in that: Used in an electronic device equipped with a motor, the control device comprises: a PCB board and a target component mounted on the PCB board; The substrate surface of the PCB is provided with at least two component vias, and the at least two component vias are used to install the target component; the perpendicular midlines of the at least two component vias pass through the target position of the PCB; the target position is the position where the central axis of the motor is mapped to the PCB along the axial direction; The target component includes at least two pins matching the at least two component vias, and each pin is fixed to the PCB board after passing through the corresponding component via, so that the target component is fixed to the PCB board; When the motor rotates to drive the control device to vibrate, the force emitted outward from the target position by the control device acts substantially evenly on at least two components, thereby reducing the breakage of the pins of the target component.

6. The control device according to claim 5, characterized in that The target element further includes: an element housing and a core group located inside the element housing; a gap is formed between the element housing and the core group.

7. The control device according to claim 6, characterized in that The target component includes an electrolytic capacitor.

8. A method for manufacturing a PCB board, characterized in that: The method comprises: When designing a PCB layout of the PCB board, determining a target position of the PCB board in the PCB layout, the target position being a position where a central axis of the motor is mapped to the PCB board along an axial direction; Determining via positions of at least two component vias based on the target position in the PCB layout, wherein perpendicular midlines of the at least two component vias pass through the target position of the PCB board; Punching holes according to the via positions in the PCB layout to prepare the PCB board; When the motor rotates to drive the control device with the PCB board to vibrate, the force emitted outward from the target position by the control device on at least two components is basically balanced, thereby reducing the breakage of the pins of the target component.

9. The method according to claim 8, characterized in that The substrate surface of the PCB board is circular as a whole, the target position is the center of the substrate surface, and determining the target position of the PCB board in the PCB layout includes: Determine the center of the PCB board in the PCB layout.

10. A method for installing a control device, characterized in that: The method comprises: A PCB is prepared, wherein a substrate surface of the PCB is provided with at least two component vias; a perpendicular midline of the at least two component vias passes through a target position of the PCB; the target position is a position where a central axis of the motor is mapped axially to the PCB; Providing a target component, wherein the target component includes at least two pins matching the at least two component vias; placing each pin of the target component in a corresponding component via; When the motor rotates to drive the control device to vibrate, the force emitted outward from the target position by the control device acts substantially evenly on at least two components, thereby reducing the breakage of the pins of the target component.

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