High-speed high-layer thick copper mixed-pressing plate and preparation method thereof

Abstract

The present application relates to the technical field of circuit board, and particularly relates to a high-speed high-layer thick copper mixed pressing plate and a preparation method thereof, and the preparation method of the high-speed high-layer thick copper mixed pressing plate comprises the following steps: obtaining a base material, wherein the base material is 10-layer 5-piece core plates; the core plates of L1 layer-L2 layer and L9 layer-L10 layer in the 10-layer 5-piece core plates are first positive and negative copper plates made of Megtron4 material, the core plate of L5 layer-L6 layer is a second positive and negative copper plate, and the copper thickness of the core plates of L3 layer-L4 layer and L7 layer-L8 layer is 10 oz; the 5-piece core plates are processed in sequence according to a preset film combination sequence to form circuit patterns on the core plates; the 5-piece core plates after the circuit patterns are formed are pressed to form a semi-finished product plate; and the surface of the semi-finished product plate is processed to prepare the high-speed high-layer thick copper mixed pressing plate. By using the first positive and negative copper plates made of Megtron4 material for the core plates of L1 layer-L2 layer and L9 layer-L10 layer, the heat resistance and peeling strength of the prepared high-speed high-layer thick copper mixed pressing plate can be improved.

Description

[0001] The present application relates to the technical field of circuit board, in particular to a high-speed high-layer thick copper mixed press plate and a preparation method thereof.

[0002] With the development of electronic technology, multi-layer circuit boards are increasingly widely used in communication, base station, aviation, military and other fields, thereby higher requirements are put forward for multi-layer circuit boards.

[0003] Compared with traditional circuit boards, the existing high-layer circuit board has higher quality reliability. However, the existing high-layer circuit board has insufficient heat resistance and peel strength.

[0004] To solve the problems of insufficient heat resistance and peel strength and difficult processing of the high-layer circuit board made of the existing high-TG material, the present application provides a high-speed high-layer thick copper mixed press plate and a preparation method thereof.

[0005] The technical problem of the present application is solved by providing a preparation method of a high-speed high-layer thick copper mixed press plate, comprising the following steps:

[0006] Obtain a base material, which is 10 layers of 5 core plates; the core plates of L1 layer-L2 layer and L9 layer-L10 layer in the 10 layers of 5 core plates are first positive and negative copper plates using Megtron 4 material, the core plates of L5 layer-L6 layer are second positive and negative copper plates, and the copper thickness of the core plates of L3 layer-L4 layer and L7 layer-L8 layer is 10 OZ;

[0007] According to a preset film combination order, sequentially process the 5 core plates to form circuit patterns on the core plates;

[0008] After the 5 core plates form circuit patterns, press the 5 core plates to form a semi-finished product plate;

[0009] Process the surface of the semi-finished product plate to prepare a high-speed high-layer thick copper mixed press plate.

[0010] Preferably, the thickness of the first positive and negative copper plate without H / 10 OZ copper foil is 0.076 mm; and the thickness of the second positive and negative copper plate without 1 / 20 OZ copper foil is 0.38 mm.

[0011] Preferably, before the 5 core plates are processed according to the preset film combination order to form circuit patterns on the core plates, the method further comprises:

[0012] Identify the core plates of L1 layer-L2 layer, L5 layer-L6 layer and L9 layer-L10 layer, so that the 10 OZ surface of L1 layer-L2 layer and L9 layer-L10 layer faces upward, and the 20 OZ surface of L5 layer-L6 layer faces upward; ​​​

[0013] baking the identified core plate.

[0014] Preferably, the five core plates are processed in sequence according to the preset film combination sequence to form a circuit pattern on the core plate, specifically including the following steps:

[0015] micro-etching the core plate; the micro-etching amount is 0.5um-0.625um;

[0016] exposing the L1 layer-2 layer, L3 layer-4 layer, L5 layer-6 layer, L7 layer-8 layer, and L9 layer-10 layer of the five micro-etched core plates in sequence according to the preset film combination sequence;

[0017] etching the five exposed core plates to form a circuit pattern on the core plate.

[0018] Preferably, the etching speed of the L1 layer-L2 layer and L9 layer L10 layer is 10Z, and the etching speed of the L5 layer-L6 layer is 20Z.

[0019] Preferably, before exposing the L1 layer-L2 layer, L3 layer-L4 layer, L5 layer-L6 layer, L7 layer-L8 layer, and L9 layer-L10 layer of the five micro-etched core plates in sequence according to the preset film combination sequence, the method further includes:

[0020] confirming the range and shrinkage of the film by two-dimensional measurement, so that the shrinkage of the film is-2mil-2mil, and the range of the film is less than or equal to 1mil.

[0021] Preferably, the five core plates after forming a circuit pattern are pressed to form a semi-finished plate, specifically including the following steps:

[0022] browning the core plate;

[0023] pre-arranging the five browning core plates and prepreg to fix the five core plates and prepreg to form a to-be-pressed plate;

[0024] arranging the to-be-pressed plate so that a layer of copper foil is covered on the opposite sides of the to-be-pressed plate;

[0025] pressing the arranged to-be-pressed plate to form a semi-finished plate.

[0026] Preferably, after pre-arranging the five browning core plates and prepreg to fix the five core plates and prepreg to form a to-be-pressed plate, the method further includes:

[0027] judging whether the core plate has layer deviation;

[0028] If there is a layer deviation, re-draw the film or adjust the alignment accuracy value.

[0029] Preferably, after the 5 core plates after forming the circuit pattern are laminated to form a semi-finished plate, the method further comprises:

[0030] Drilling the laminated semi-finished plate;

[0031] Plasma degreasing the drilled semi-finished plate, the etching rate of the degreasing is 0.2-0.25 mg / cm 2 .

[0032] The application also provides a high-speed high-layer thick copper mixed laminated plate prepared by the preparation method of the high-speed high-layer thick copper mixed laminated plate.

[0033] Compared with the prior art, the high-speed high-layer thick copper mixed laminated plate and the preparation method thereof have the following advantages:

[0034] 1. The preparation method of the high-speed high-layer thick copper mixed laminated plate comprises the following steps: obtaining a base material, wherein the base material is 10 layers of 5 core plates; the core plates of L1 layer-L2 layer and L9 layer-L10 layer in the 10 layers of 5 core plates are first positive and negative copper plates made of Megtron4 material, the core plates of L5 layer-L6 layer are second positive and negative copper plates, and the copper thickness of the core plates of L3 layer-L4 layer and L7 layer-L8 layer is 10 OZ; the 5 core plates are processed in turn according to a preset film combination order to form a circuit pattern on the core plates; the 5 core plates after forming the circuit pattern are laminated to form a semi-finished plate; and the surface of the semi-finished plate is processed to prepare a high-speed high-layer thick copper mixed laminated plate. Since Megtron4 material has lower thermal expansion and higher reliability than ordinary high-TG material, that is, the heat resistance and peel strength are relatively higher. Therefore, the heat resistance and peel strength of the high-speed high-layer thick copper mixed laminated plate prepared by laminating the first positive and negative copper plates of L1 layer-L2 layer and L9 layer-L10 layer made of Megtron4 material with the remaining layers are higher. Moreover, the lamination processing difficulty of Megtron4 material is relatively smaller. In addition, the first positive and negative copper plates of L1 layer-L2 layer and L9 layer-L10 layer made of Megtron4 material can better improve the efficiency, save the cost, and balance the residual copper rate.

[0035] 2. The first positive and negative copper plate of the application does not contain H / 1OZ copper foil with a thickness of 0.076 mm; the second positive and negative copper plate does not contain 1 / 2OZ copper foil with a thickness of 0.38 mm. By using the first positive and negative copper plate without H / 1OZ copper foil with a thickness of 0.076 mm, the copper thickness of L1 layer and L10 layer is lower, which prevents L1 layer and L10 layer from absorbing too much heat and avoids board explosion.

[0036] 3. According to the preset film combination sequence, the five core boards are sequentially processed to form the circuit pattern on the core board, and the method further comprises: marking the core boards of L1 layer-L2 layer, L5 layer-L6 layer and L9 layer-L10 layer, so that the 1OZ surface of L1 layer-L2 layer and L9 layer-L10 layer faces upward, and the 2OZ surface of L5 layer-L6 layer faces upward; wherein the copper thickness of L2 layer and L9 layer is 1OZ, and the copper thickness of L5 layer is 2OZ; and the marked core board is baked. By marking the core boards of L1 layer-L2 layer, L5 layer-L6 layer and L9 layer-L10 layer, the copper thickness is distinguished, the layer error during exposure is avoided, and the moisture of the core board is removed by baking to avoid board explosion.

[0037] 4. According to the preset film combination sequence, the five core boards are sequentially processed to form the circuit pattern on the core board, and the method further comprises: micro-etching the core board; the micro-etching amount is 0.5um-0.625um; exposing L1 layer-2 layer, L3 layer-4 layer, L5 layer-6 layer, L7 layer-8 layer and L9 layer-10 layer of the five core boards after micro-etching according to the preset film combination sequence; and etching the five core boards after exposure to form the circuit pattern on the core board. The micro-etching amount is controlled to be 0.5um-0.625um to avoid the case that the copper plating layer is insufficient in bonding force due to too shallow micro-etching depth, and is separated or falls off. The five core boards after micro-etching need to be exposed according to the preset film combination sequence to avoid the error of etched pattern, thereby affecting processing.

[0038] 5. The etching speed of L1 layer-2 layer and L9 layer-10 layer is 1OZ, and the etching speed of L5 layer-6 layer is 2OZ. By setting different etching speeds for different layers, incomplete etching is avoided, thereby improving the etching effect.

[0039] 6. Before exposing L1-L2 layer, L3-L4 layer, L5-L6 layer, L7-L8 layer and L9-L10 layer of the five core boards after micro-etching according to the preset film combination sequence, the method further comprises: confirming the range and shrinkage of the film by two-dimensional measurement, so that the shrinkage of the film is-2mil-2mil, and the range of the film is less than or equal to 1mil. By controlling the shrinkage of the film to be-2mil-2mil and controlling the range of the film to be less than or equal to 1mil, the shrinkage of the pressed board is controlled to be 1:1, and the layer deviation caused by large range is avoided.

[0040] 7. The present invention involves laminating five core boards after the circuit pattern has been formed to prepare a high-speed, high-layer, thick copper mixed-plate, specifically including the following steps: browning the core boards; pre-arranging the five browned core boards and prepreg to fix them into a plate to be laminated; arranging the plate to be laminated so that both opposite sides of the plate are covered with a layer of copper foil; and laminating the arranged plate to be laminated to form a semi-finished plate. By sequentially pre-arranging, arranging, and laminating the core boards, the five core boards can be neatly stacked together, avoiding layer misalignment in the laminated semi-finished plate.

[0041] 8. The present invention pre-layouts five core boards and prepreg sheets after browning, and fixes the five core boards and prepreg sheets to form a board to be pressed. The method further includes: determining whether layer misalignment occurs in the core boards; if layer misalignment occurs, re-photoplotting the film or adjusting the alignment accuracy value. By re-photoplotting the film or adjusting the alignment accuracy value, layer misalignment is avoided, thus preventing it from affecting the preparation of high-speed, high-layer, thick copper mixed-plate presses.

[0042] 9. After laminating five core boards with the circuit pattern formed, the method further includes: drilling holes in the laminated semi-finished board; and performing plasma degumming on the drilled semi-finished board, with a degumming erosion rate of 0.2-0.25 mg / cm². 2 By controlling the adhesive removal rate of plasma degumming to 0.2-0.25 mg / cm², residual adhesive on the borehole wall after drilling can be removed, improving the activity inside the borehole and enhancing the conductivity of the manufactured high-speed, high-layer, thick copper composite plate.

[0043] 10. Another high-speed, high-rise, thick copper mixed-plate of the present invention is prepared by the preparation method of the high-speed, high-rise, thick copper mixed-plate described in any one of the above claims. It has the same beneficial effects as the preparation method of the high-speed, high-rise, thick copper mixed-plate described above, and will not be repeated here. [Attached Image Description]

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a flowchart of the preparation method of the high-speed high-layer thick copper mixed pressure plate provided in the first embodiment of the present invention.

[0046] Figure 2 This is a schematic diagram of the high-speed, high-rise, thick copper mixed pressure plate structure provided in the first embodiment of the present invention.

[0047] Figure 3 is a specific step flow chart of step S2 of the preparation method of the high-speed high-layer thick copper mixed laminated board provided by the first embodiment of the present application.

[0048] Figure 4 is a specific step flow chart of step S3 of the preparation method of the high-speed high-layer thick copper mixed laminated board provided by the first embodiment of the present application.

[0049] The drawing mark explanation is as follows:

[0050] 1. High-speed high-layer thick copper mixed laminated board

[0051] 10. L1 layer; 11. L2 layer; 12. L3 layer; 13. L4 layer; 14. L5 layer; 15. L6 layer; 16. L7 layer; 17. L8 layer; 18. L9 layer; 19. L10 layer; 20. Base plate; 30. Solder resist ink layer; 40. Through hole; 50. Prepreg.

DETAILED DESCRIPTION

[0052] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0053] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0054] Referring to Figures 1-2 , the first embodiment of the present application provides a preparation method of a high-speed high-layer thick copper mixed laminated board 1, comprising the following steps:

[0055] S1: obtaining a base material; wherein the base material is 10 layers of 5 core plates; the core plates of L1 layer 10-L2 layer 11 and L9 layer 18-L10 layer 19 in the 10 layers of 5 core plates are first positive and negative copper plates using Megtron 4 material, the core plates of L5 layer 14-L6 layer 15 are second positive and negative copper plates, and the copper thickness of the core plates of L3 layer 12-L4 layer 13 and L7 layer 16-L8 layer 17 is 10 oz.

[0056] S2: sequentially processing the 5 core plates according to a predetermined film combination sequence to form circuit patterns on the core plates;

[0057] S3: laminating the 5 core plates after forming the circuit patterns to prepare the high-speed high-layer thick copper mixed laminated board 1.

[0058] It can be understood that in the 10 layers of 5 core boards, the L1 layer 10 and the L2 layer 11 are two opposite layers of the same core board, the L3 layer 12 and the L4 layer 13 are two opposite layers of the same core board, the L5 layer 14 and the L6 layer 15 are two opposite layers of the same core board, the L7 layer 16 and the L8 layer 17 are two opposite layers of the same core board, and the L9 layer 18 and the L10 layer 19 are two opposite layers of the same core board, thereby forming a base material including 10 layers of 5 core boards.

[0059] Specifically, the structure of the core board is that both sides of the same substrate have copper foils, so the structure of the core board is copper foil / substrate 20 / copper foil in turn. The positive and negative copper plates refer to two copper foils with different thicknesses on opposite sides of the same substrate 20. That is, in this embodiment, the copper thicknesses of the opposite sides of the first positive and negative copper plate and the second positive and negative copper plate are different. And since the conventional copper thickness is 10Z, 20Z, and above 20Z is called thick copper, in this embodiment, the copper thickness of the core board of the L3 layer 12-L4 layer 13 and the L7 layer 16-L8 layer 17 is 10Z, which is the conventional copper thickness.

[0060] It can be understood that compared with ordinary high-TG materials, Megtron4 material has low thermal expansion, high reliability, and good processability, that is, its heat resistance and peel strength are relatively higher. Therefore, the heat resistance and peel strength of the high-speed high-layer-thick copper mixed-pressing plate 1 formed by mixing pressing the first positive and negative copper plate of Megtron4 material and the remaining layers of the core board of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 are higher. And the Megtron4 material has relatively small pressing processing difficulty. In addition, the first positive and negative copper plate made of Megtron4 material in the core board of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 can better improve the efficiency, save the cost, and balance the residual copper rate.

[0061] It should be noted that the dielectric constant of Megtron4 material is 4.0, and the loss factor is 0.009, so the high-speed high-layer-thick copper mixed-pressing plate 1 formed by mixing pressing the first positive and negative copper plate of Megtron4 material and the remaining layers of the core board of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 has high transmission performance and is suitable for high-frequency applications.

[0062] Further, the thickness of the first positive and negative copper plate without H / 10Z copper foil is 0.076mm; the thickness of the second positive and negative copper plate without 1 / 20Z copper foil is 0.38mm.

[0063] It can be understood that the two core boards on which the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 are located are the first positive and negative copper plates with a thickness of 0.076mm+HOZ+1OZ. That is, the copper thickness of the L1 layer 10 and the L10 layer 19 is HOZ, the copper thickness of the L2 layer 11 and the L9 layer 18 is 1OZ, and the thickness of the copper-free part in the core board, that is, the thickness of the insulating medium layer, is 0.076mm. The core board on which the L5 layer 14 and the L6 layer 15 are located is the second positive and negative copper plate with a thickness of 0.38mm+1OZ+2OZ. That is, the copper thickness of the L5 layer 14 is 2OZ, the copper thickness of the L6 layer 15 is 1OZ, and the thickness of the copper-free part in the core board, that is, the thickness of the insulating medium layer, is 0.38mm. The core board of the L3 layer 12-L4 layer 13 and the L7 layer 16-L8 layer 17 is a copper plate with a thickness of 1 / 1OZ. That is, the copper thickness of the L3 layer 12-L4 layer 13 and the L7 layer 16-L8 layer 17 is 1OZ, and the thickness of the insulating medium layer is 0.1mm. Thus, the 0.076mm copper-free H / 1OZ first positive and negative copper plate is used, so that the copper thickness of the L1 layer 10 and the L10 layer 19 is lower, preventing the L1 layer 10 and the L10 layer 19 from absorbing too much heat and avoiding board explosion.

[0064] Further, before step S2, the method further comprises:

[0065] S18: marking the core boards of the L1 layer 10-L2 layer 11, the L5 layer 14-L6 layer 15 and the L9 layer 18-L10 layer 19, so that the 1OZ faces of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 face upward, and the 2OZ faces of the L5 layer 14-L6 layer 15 face upward;

[0066] S19: baking the marked core boards.

[0067] It can be understood that before step 18, the original 5 core boards also need to be cut into 5 core boards with a size consistent with the preset size. Through step S18, the 5 core boards cut are marked, so that the 1OZ faces of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 face upward, and the 2OZ faces of the L5 layer 14-L6 layer 15 face upward, that is, the faces on which the L2 layer 11, the L9 layer 18 and the L5 layer 14 are located face upward, so as to distinguish the copper thickness and avoid layering errors during exposure. And through step S19, the marked core boards are baked, and the baking condition is 180℃ / 3h, so as to remove the moisture of the core boards and avoid board explosion.

[0068] Please refer to Figure 3 Further, step S2 specifically comprises the following steps:

[0069] S21: micro-etching the core boards; the micro-etching amount is 0.5um-0.625um;

[0070] S22: sequentially expose the L1 layer 10-2 layer, the L3 layer 12-4 layer 13, the L5 layer 14-6 layer, the L7 layer 16-8 layer, and the L9 layer 18-10 layer of the five core boards after micro-etching according to the preset film combination sequence;

[0071] S23: etch the five core boards after exposure to form a circuit pattern on the core board.

[0072] Understandably, the core board can be micro-etched by step S21, so that the surface of the core board becomes more smooth and the metal activity is stronger, so as to facilitate the subsequent electroplating, printing and welding processes. And the micro-etching amount can be controlled at 0.425um-0.625um. Avoiding the case that the copper plating layer is not enough to combine, so as to delaminate or fall off due to too shallow micro-etching depth.

[0073] Understandably, since the core board where the L1 layer 10-2 layer and the L9 layer 18-10 layer are located is a first positive and negative copper plate of 0.076mm without copper H / 1OZ, the HOZ surface line compensation needs to be compensated according to the 1OZ surface, so attention needs to be paid to the exposure of the L1 layer 10 and the L10 layer 19 film corresponding to the HOZ copper surface production. Therefore, the L1 layer 10-L2 layer 11, the L3 layer 12-L4 layer 13, the L5 layer 14-L6 layer 15, the L7 layer 16-L8 layer 17, and the L9 layer 18-L10 layer 19 need to be exposed according to the preset film combination sequence, so as to avoid etching pattern errors and affect processing.

[0074] Understandably, the operation can be carried out on a fully automatic exposure machine, and the film and glass table need to be cleaned once every 20PNL plate. The film and glass table can be cleaned once by sticking dust paper, and the replacement frequency of the dust paper is once every 20PNL.

[0075] Understandably, after exposure, the five core boards need to be etched, that is, the two layers of copper foil on each core board are etched at the same time, so as to remove unnecessary circuit patterns and metal impurities and other substances on the copper foil, so as to form clear and reliable internal circuit structure, and ensure the performance and reliability of the whole high-speed high-layer thick copper mixed press plate 1.

[0076] Understandably, after etching is completed, the core board after etching needs to be subjected to AOI (Automated Optical Inspection, automatic optical inspection technology), so as to quickly and accurately detect the defects and problems of the core board after etching, thereby improving the quality and efficiency of the manufacture of the high-speed high-layer thick copper mixed press plate 1.

[0077] Further, the etching speed of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 is 1OZ, and the etching speed of the L5 layer 14-L6 layer 15 is 2OZ.

[0078] It can be understood that different copper thicknesses have different etching parameters. The etching speed of L1 layer 10-L2 layer 11 and L9 layer 18-L10 layer 19 is 10OZ, and the etching speed of L5 layer 14-L6 layer 15 is 20OZ. Avoiding incomplete etching, affecting the formation of internal circuit structure.

[0079] Further, before step S22, the method further comprises:

[0080] S2119: Confirm the extreme difference and shrinkage of the film through two-dimensional measurement, so that the shrinkage of the film is-2mil-2mil, and the extreme difference of the film is less than or equal to 1mil.

[0081] It can be understood that the extreme difference and shrinkage of the film can be obtained through two-dimensional measurement, so that the subsequent exposure operation is performed when the shrinkage of the film is within the range of-2mil-2mil and the extreme difference of the film is within the range of less than or equal to 1mil. Thus, the shrinkage of the pressed plate is controlled to be 1:1, i.e., the size of the film is proportional to the size of the core plate, i.e., the size of the pattern on the film is the same as the size of the pattern on the core plate, thereby avoiding layer deviation caused by large extreme difference.

[0082] Please refer to Figure 4 Further, step S3 specifically comprises the following steps:

[0083] S31: Brown the core plate;

[0084] S32: Pre-arrange the five core plates and the prepreg 50 after brown, so that the five core plates and the prepreg 50 are fixed to form a to-be-pressed plate;

[0085] S33: Arrange the to-be-pressed plate, so that the to-be-pressed plate is covered with a layer of copper foil on both opposite sides;

[0086] S34: Press the arranged to-be-pressed plate to form a semi-finished product plate.

[0087] It can be understood that by step S31, the core plate is browned, i.e., the copper surface of the circuit on the core plate after etching is oxidized. The oil stains, impurities and other pollutants on the surface of the core plate are effectively removed; the specific surface of the copper foil is increased, thereby increasing the contact area with the prepreg 50, which is beneficial to the full diffusion of the prepreg 50 and the formation of a larger bonding force; the non-polar copper surface is changed into a surface with polar Cu2O and CuO, increasing the polar bond between the copper foil and the prepreg 50; the oxidized surface of the core plate is not affected by moisture at high temperature, reducing the probability of delamination between the copper foil and the prepreg 50. In order to control the water content in the plate, the plate needs to be baked, and the baking condition is 110℃ / 1 hour.

[0088] It can be understood that in the embodiment, the pre-arrangement needs to clean the workbench first, and then use the rivet machine to rivet and fix 5 core boards and prepreg 50 to form a to-be-pressed plate. Specifically, according to the preset order, the 5 core boards and prepreg 50 are fixed by hot melting + 4 rivets.

[0089] It should be noted that the preset order is L1 layer 10-L2 layer core board, prepreg, L3 layer 12-4 layer 13 core board, prepreg, L5 layer 14-L6 layer 15 core board, prepreg, L7 layer 16-L8 layer 17 core board, prepreg, L9 layer 18-L10 layer 19 core board. That is, the opposite sides of the to-be-pressed plate formed after pre-arrangement are L1 layer 10 and L10 layer 19.

[0090] It can be understood that the arrangement is to cover a layer of copper foil on the opposite sides of the to-be-pressed plate formed after pre-arrangement, that is, a layer of copper foil is covered on the surfaces of L1 layer 10 and L10 layer 19. When arranging, normal copper foil is used, and the copper foil is inverted, that is, the smooth surface is close to the core board, and the copper foil is covered manually. 20 new cowhides are placed above and below to ensure better plate thickness uniformity.

[0091] It can be understood that after the arrangement is completed, the arranged to-be-pressed plate is pressed into a semi-finished plate through step S34. The surfaces of the opposite sides of the to-be-pressed plate are L1 layer 10 and L10 layer 19, L1 layer 10 and L10 layer 19 are high-speed materials, and the TG value is 210°C. L2 layer-L3 layer, L4 layer-L5 layer, L6 layer-L7 layer, and L8 layer-L9 layer are conventional high-TG materials, and the TG value is 170°C. The pressing program is selected according to the TG value of the prepreg. In the embodiment, the conventional high-TG program can be selected. Thus, when 4 core boards are used for pressing and manufacturing, the pressing program needs to be selected as the TG 210°C program, which is easy to cause problems such as plate bending, cracking, or board explosion. Under the action of high temperature and pressure, the prepreg 50 will become a molten state and act as an adhesive for the core board and the copper foil, and also act as an insulator for the core board and the copper foil. After cooling, the prepreg 50 will solidify and firmly combine the copper foil and the core board together to form a 10-layer semi-finished plate.

[0092] Optionally, at least 4 to-be-pressed plates can be made on the operation table, and the 4 to-be-pressed plates are covered with copper foil to simultaneously press the at least 4 to-be-pressed plates.

[0093] It can be understood that after the pressing is completed, it is necessary to check whether there is residual glue on the surface of the semi-finished plate after the pressing is completed. If there is residual glue, the residual glue on the surface of the plate needs to be polished to avoid the influence of the residual glue on the subsequent operation. After polishing is completed, the semi-finished plate after pressing can be tested. If the test Tg is greater than or equal to 185 DEG C; the thermal shock test, immersion 288 DEG C tin furnace, 10 seconds / time, 6 times without white spot without explosion plate; the tensile force or equal to 3.5Lb / in; no layer deviation. The plate after pressing meets the requirements.

[0094] Further, after step S32, the method further comprises:

[0095] S321: judging whether the to-be-pressed plate has layer deviation or not;

[0096] S322: if the layer deviation occurs, re-drawing the film or adjusting the alignment accuracy value.

[0097] It can be understood that after the pre-laying out, it can be confirmed whether the core plate has layer deviation. That is, by confirming the concentric circle condition of the four corners of the core plate, when the adjacent layers have an incircle or intersection, that is, layer deviation occurs. Therefore, it is necessary to confirm whether it is a film difference problem or a problem of setting the alignment accuracy. If it is a large film difference, the film can be re-drawn; if it is that the alignment accuracy is set too large, the alignment accuracy value can be adjusted; if the pressing fusion layer deviation is before the pressing plate, it can be reworked or scrapped. Thus, the circuit performance of the finally formed high-speed high-layer thick copper mixed pressing plate 1 is avoided.

[0098] Further, after step S3, the method further comprises:

[0099] S31: drilling the semi-finished plate after pressing;

[0100] S32: plasma degreasing the semi-finished plate after drilling, and the etching rate of the degreasing is 0.2-0.25mg / cm 2 .

[0101] It can be understood that after a semi-finished plate is formed by pressing, the semi-finished plate after pressing needs to be drilled to form a through hole 40. The drilling parameter is the thick copper plate parameter, 1 piece / stack, a new drill bit is used, the service life of the drill bit is 500 holes, after drilling, the semi-finished plate is cleaned first and then baked at 180 DEG C for 2 hours. The baking plate needs to be adjusted in temperature with the help of maintenance, the hole is less than or equal to 1000u", and the pin head is less than or equal to 2 times, so as to form a through hole 40 penetrating up and down on the semi-finished plate after pressing.

[0102] It can be understood that after the drilling is completed, the plasma degreasing can be performed, and the etching rate of the degreasing is controlled to be 0.2-0.25mg / cm 2At this time, the glue residue can be removed, the quality and adhesion can be improved, and the etching rate of the glue removal can be reduced, so that the excess glue is removed, and the manufacturing of the high-speed high-layer thick copper mixed press plate 1 is affected.

[0103] Understandably, after the glue removal is completed, the semi-finished plate needs to be processed through step S4. Step S4 specifically includes the following steps:

[0104] S41: whole plate electroplating;

[0105] S42: outer layer pattern;

[0106] S43: pattern electroplating;

[0107] S44: middle inspection AOI;

[0108] S45: solder mask printing;

[0109] S46: text printing;

[0110] S47: gold plating;

[0111] S48: forming to form the final high-speed high-layer thick copper mixed press plate 1.

[0112] Specifically, the whole plate electroplating forms a dense copper plating film on the surface of the copper foil to improve the conductivity and corrosion resistance of the prepared high-speed high-layer thick copper mixed press plate 1. The outer layer pattern is printed on the outer layer of the semi-finished plate after pressing, i.e. L1 layer 10 and L10 layer 19. The pattern electroplating is a local electroplating treatment to protect the specified area of the semi-finished plate after pressing, thereby forming a protective metal film to protect these areas from corrosion or damage. The middle inspection AOI is a process of manufacturing the high-speed high-layer thick copper mixed press plate 1, which detects the circuit connection, component installation and other standards on the semi-finished plate to ensure that the quality of the prepared high-speed high-layer thick copper mixed press plate 1 meets the requirements. The solder mask printing refers to printing a layer of solder mask ink on the surface of the semi-finished plate after pressing, and the ink covers the circuit connection lines and component mounting positions and other areas of the plate, forming a protective film to prevent circuit short circuit and corrosion. At the same time, the solder mask ink can also improve the mechanical strength and corrosion resistance of the prepared high-speed high-layer thick copper mixed press plate 1, and prevent the prepared high-speed high-layer thick copper mixed press plate 1 from being mechanically impacted and chemically corroded. The text printing is used to print identification, number, text and other information during the manufacturing of the high-speed high-layer thick copper mixed press plate 1, so as to facilitate the production and use of the high-speed high-layer thick copper mixed press plate 1. The gold plating refers to plating a metal protective layer on the surface of the semi-finished plate after text printing during the manufacturing of the high-speed high-layer thick copper mixed press plate 1, so as to protect the surface of the semi-finished plate from chemical corrosion and mechanical wear. The forming refers to the semi-finished plate after gold plating is processed to form the final high-speed high-layer thick copper mixed press plate 1, so as to meet the design requirements and improve the mechanical strength and stability of the prepared high-speed high-layer thick copper mixed press plate 1

[0113] It should be noted that the solder mask printing is usually performed by processes such as screen printing or inkjet printing, and before printing, the surface of the high-speed high-layer thick copper mixed press plate 1 needs to be cleaned and coated with a layer of solder resist ink 30. After printing, subsequent treatments such as curing and baking are needed to ensure the adhesion and solder resist effect of the solder resist ink layer 30.

[0114] The second embodiment of the present application provides a high-speed high-layer thick copper mixed press plate 1 prepared by the preparation method of the high-speed high-layer thick copper mixed press plate 1 according to any one of the above.

[0115] It can be understood that the core plates of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 in the high-speed high-layer thick copper mixed press plate 1 prepared by the preparation method of the high-speed high-layer thick copper mixed press plate 1 are mixed pressed with the first positive and negative copper plates made of Megtron4 material and the remaining layers, and have higher heat resistance and peel strength. Moreover, the processing difficulty of Megtron4 material is relatively small. In addition, the first positive and negative copper plates made of Megtron4 material in the core plates of the L1 layer 10-L2 layer 11 and the L9 layer 18-L10 layer 19 can better improve the efficiency, save the cost, and balance the residual copper rate.

[0116] Compared with the prior art, the high-speed high-layer thick copper mixed press plate and the preparation method thereof provided by the present application have the following advantages:

[0117] 1. The preparation method of the high-speed high-layer thick copper mixed press plate, comprising the following steps: obtaining a base material, wherein the base material is 10 layers of 5 core plates; the core plates of the L1 layer-L2 layer and the L9 layer-L10 layer are first positive and negative copper plates made of Megtron4 material, the core plates of the L5 layer-L6 layer are second positive and negative copper plates, and the copper thickness of the core plates of the L3 layer-L4 layer and the L7 layer-L8 layer is 10OZ; sequentially processing the 5 core plates according to a predetermined film combination order to form circuit patterns on the core plates; pressing the 5 core plates after forming the circuit patterns to form a semi-finished product plate; and processing the surface of the semi-finished product plate to prepare a high-speed high-layer thick copper mixed press plate. Since Megtron4 material has lower thermal expansion, higher reliability, i.e., higher heat resistance and peel strength, compared with ordinary high-TG material, the core plates of the L1 layer-L2 layer and the L9 layer-L10 layer are mixed pressed with the first positive and negative copper plates made of Megtron4 material and the remaining layers to prepare a high-speed high-layer thick copper mixed press plate with higher heat resistance and peel strength. Moreover, the processing difficulty of Megtron4 material is relatively small. In addition, the first positive and negative copper plates made of Megtron4 material in the L1 layer-L2 layer and the L9 layer-L10 layer can better improve the efficiency, save the cost, and balance the residual copper rate.

[0118] 2. The thickness of the first copper plate without H / 1OZ copper foil in this invention is 0.076mm; the thickness of the second copper plate without 1 / 2OZ copper foil is 0.38mm. By using the first copper plate with a thickness of 0.076mm without H / 1OZ copper foil, the copper thickness of layers L1 and L10 is reduced, preventing layers L1 and L10 from absorbing too much heat and avoiding plate bursting.

[0119] 3. The present invention processes five core boards sequentially according to a preset film combination order before forming circuit patterns on the core boards. The method further includes: marking the core boards of layers L1-L2, L5-L6, and L9-L10, ensuring that the 1oz side of layers L1-L2 and L9-L10 faces upwards, and the 2oz side of layers L5-L6 faces upwards; wherein the copper thickness of layers L2 and L9 is 1oz, and the copper thickness of layer L5 is 2oz; and baking the marked core boards. By marking the core boards of layers L1-L2, L5-L6, and L9-L10, the copper thickness is distinguished, avoiding layer errors during exposure, and baking removes moisture from the core boards, preventing board breakage.

[0120] 4. The present invention processes five core boards sequentially according to a preset film combination sequence to form circuit patterns on the core boards. Specifically, this includes the following steps: micro-etching the core boards; the micro-etching amount is 0.5µm-0.625µm; exposing layers L1-2, L3-4, L5-6, L7-8, and L9-10 of the five micro-etched core boards sequentially according to the preset film combination sequence; and etching the five exposed core boards to form circuit patterns. Controlling the micro-etching amount to 0.5µm-0.625µm avoids insufficient adhesion of the copper plating layer due to shallow micro-etching depth, resulting in delamination or peeling. Furthermore, the five micro-etched core boards must be exposed sequentially according to the preset film combination sequence to avoid etched pattern errors that could affect processing.

[0121] 5. The etching rate for layers L1-2 and L9-10 of this invention is 1 oz, and the etching rate for layers L5-6 is 2 oz. By setting different etching rates for different layers, incomplete etching is avoided, thereby improving the etching effect.

[0122] 6. Before exposing layers L1-L2, L3-L4, L5-L6, L7-L8, and L9-L10 of the five micro-etched core boards sequentially according to a preset film combination order, the method of the present invention further includes: confirming the range and expansion / contraction of the film through two-dimensional measurement, ensuring that the expansion / contraction of the film is -2mil to 2mil, and the range of the film is less than or equal to 1mil. By controlling the expansion / contraction of the film to -2mil to 2mil and controlling the range of the film to be less than or equal to 1mil, it is ensured that the expansion / contraction of the laminated board is controlled at 1:1, while avoiding layer misalignment caused by a large range.

[0123] 7. The present invention involves laminating five core boards after the circuit pattern has been formed to prepare a high-speed, high-layer, thick copper mixed-plate, specifically including the following steps: browning the core boards; pre-arranging the five browned core boards and prepreg to fix them into a plate to be laminated; arranging the plate to be laminated so that both opposite sides of the plate are covered with a layer of copper foil; and laminating the arranged plate to be laminated to form a semi-finished plate. By sequentially pre-arranging, arranging, and laminating the core boards, the five core boards can be neatly stacked together, avoiding layer misalignment in the laminated semi-finished plate.

[0124] 8. The present invention pre-layouts five core boards and prepreg sheets after browning, and fixes the five core boards and prepreg sheets to form a board to be pressed. The method further includes: determining whether layer misalignment occurs in the core boards; if layer misalignment occurs, re-photoplotting the film or adjusting the alignment accuracy value. By re-photoplotting the film or adjusting the alignment accuracy value, layer misalignment is avoided, thus preventing it from affecting the preparation of high-speed, high-layer, thick copper mixed-plate presses.

[0125] 9. After laminating five core boards with the circuit pattern formed, the method further includes: drilling holes in the laminated semi-finished board; and performing plasma degumming on the drilled semi-finished board, with a degumming erosion rate of 0.2-0.25 mg / cm². 2 By controlling the adhesive removal rate of plasma degumming to 0.2-0.25 mg / cm², residual adhesive on the borehole wall after drilling can be removed, improving the activity inside the borehole and enhancing the conductivity of the manufactured high-speed, high-layer, thick copper composite plate.

[0126] 10. Another high-speed, high-rise, thick copper mixed-plate of the present invention is prepared by the preparation method of the high-speed, high-rise, thick copper mixed-plate described in any one of the above claims. It has the same beneficial effects as the preparation method of the high-speed, high-rise, thick copper mixed-plate described above, and will not be repeated here.

[0127] The high-speed high-layer thick copper mixed-pressing plate and the preparation method thereof disclosed in the embodiments of the present application are described in detail, and the principles and implementation manners of the present application are described by using specific examples. The above embodiment description is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, the specific implementation manners and application ranges will be changed according to the idea of the present application. In summary, the content of the present description should not be understood as a limitation of the present application. Any modification, equivalent replacement, improvement, etc. within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for preparing a high-speed, high-layer, thick copper mixed-pressure plate, characterized in that: The method comprises the following steps: obtaining a substrate, which is a 10-layer 5-core board; the 10-layer 5-core board comprises L1 layer, L2 layer, L3 layer, L4 layer, L5 layer, L6 layer, L7 layer, L8 layer, L9 layer and L10 layer which are stacked in sequence; in the 10-layer 5-core board, L1 layer-L2 layer are two opposite layers of the same core board, L3 layer-L4 layer are two opposite layers of the same core board, L5 layer-L6 layer are two opposite layers of the same core board, L7 layer-L8 layer are two opposite layers of the same core board, and L9 layer-L10 layer are two opposite layers of the same core board; the core boards of L1 layer-L2 layer and L9 layer-L10 layer in the 10-layer 5-core board are first positive and negative copper boards made of Megtron 4 material, the core board of L5 layer-L6 layer is a second positive and negative copper board, and the copper thickness of the core boards of L3 layer-L4 layer and L7 layer-L8 layer is 10 oz; processing the five core boards in sequence according to a preset film combination sequence to form a circuit pattern on the core boards; pressing the five core boards after the circuit pattern is formed to form a semi-finished product board; processing the surface of the semi-finished product board to prepare a high-speed high-layer thick copper mixed pressing board.

2. The method of claim 1, wherein the high speed high layer thick copper co-pressed board is prepared by the steps of: In the first positive and negative copper board, the copper thickness of L1 layer and L10 layer is 10 oz, the copper thickness of L2 layer and L9 layer is 10 oz, and the thickness of the insulating medium layer in the first positive and negative copper board is 0.076 mm; in the second positive and negative copper board, the copper thickness of L5 layer is 20 oz, and the copper thickness of L6 layer is 10 oz, and the thickness of the insulating medium layer in the second positive and negative copper board is 0.38 mm. ​ 3. The method of claim 2, wherein the high speed high layer thick copper co-pressed board is prepared by the steps of: Before the five core boards are processed in sequence according to the preset film combination sequence to form a circuit pattern on the core boards, the method further comprises: ​ identifying the core boards of L1 layer-L2 layer, L5 layer-L6 layer and L9 layer-L10 layer, so that the 10 oz surface of L1 layer-L2 layer and L9 layer-L10 layer faces upward, and the 20 oz surface of L5 layer-L6 layer faces upward; baking the identified core boards.

4. The method for preparing a high-speed, high-layer, thick copper mixed-pressure plate as described in claim 1, characterized in that: Processing the five core boards in sequence according to a preset film combination sequence to form a circuit pattern on the core boards, specifically comprising the following steps: micro-etching the core boards; the micro-etching amount is 0.5-0.625 um; exposing L1 layer-2 layer, L3 layer-4 layer, L5 layer-6 layer, L7 layer-8 layer, L9 layer-10 layer of the five core boards after micro-etching according to the preset film combination sequence; etching the five core boards after exposure to form a circuit pattern on the core boards.

5. The method of claim 3, wherein the high speed high layer thick copper co-pressed board is prepared by the steps of: Before exposing L1 layer-L2 layer, L3 layer-L4 layer, L5 layer-L6 layer, L7 layer-L8 layer, L9 layer-L10 layer of the five core boards after micro-etching according to the preset film combination sequence, the method further comprises: ​ confirming the range and shrinkage of the film by two-dimensional measurement, so that the shrinkage of the film is-2 mil-2 mil, and the range of the film is less than or equal to 1 mil.

6. The method of making a high speed high layer thick copper co-pressed board as claimed in claim 1, wherein: Pressing the five core boards after the circuit pattern is formed to form a semi-finished product board, specifically comprising the following steps: browning the core boards; The 5 core boards and prepregs after browning are pre-arranged to fix the 5 core boards and prepregs to form a to-be-pressed board; The to-be-pressed board is arranged to cover a layer of copper foil on the opposite sides of the to-be-pressed board; The arranged to-be-pressed board is pressed to form a semi-finished product board.

7. The method of making a high speed high layer thick copper co-pressed board as claimed in claim 6, wherein: After the 5 core boards and prepregs after browning are pre-arranged to fix the 5 core boards and prepregs to form a to-be-pressed board, the method further comprises: Judging whether the core board has layer deviation; If the core board has layer deviation, the film is redrawn or the alignment accuracy value is adjusted.

8. The method of making a high speed high layer thick copper co-pressed board as claimed in claim 6, wherein: After the 5 core boards after forming the circuit pattern are pressed to form a semi-finished product board, the method further comprises: The semi-finished product board after pressing is drilled; The semi-finished product board after drilling is plasma degreased, and the etching rate of degreasing is 0.2-0.25 mg / cm².

9. A high speed high layer thick copper mixed press plate, characterized in that: The high-speed high-layer thick copper mixed pressing board is prepared by the preparation method of any one of claims 1-8.

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