High frequency module and communication device

Abstract

The high-frequency module (1) comprises: a module substrate (91) having a main surface (91a); circuit components (31, 41) disposed on the main surface (91a); a resin component (92) covering at least a portion of the main surface (91a) and the circuit components (31, 41); a metal shielding layer (95) covering at least the upper surface (92a) of the resin component (92); and a metal shielding plate (70) disposed on the main surface (91a) and disposed between the circuit components (31) and (41) when viewed from above the main surface (91a). The metal shielding plate (70) is in contact with the metal shielding layer (95). An etched portion (80) showing given information is provided on the upper surface (92a) of the resin component (92). At least a portion of the etched portion (80) is provided at the overlapping portion of the resin component (92) and the metal shielding plate (70) when viewed from above the main surface (91a).

Description

Technical Field

[0001] This invention relates to high-frequency modules and communication devices. Background Technology

[0002] In mobile communication devices such as portable phones, especially with the development of multi-band technology, the configuration structure of circuit elements constituting the high-frequency front-end circuit has become increasingly complex.

[0003] Patent Document 1 discloses a transceiver circuit comprising multiple transmitters (transmit paths), multiple receivers (receive paths), and a switchplexer (antenna switch) configured between the multiple transmitters, multiple receivers, and an antenna. Each of the multiple transmitters includes a transmit circuit, a power amplifier (PA), and an output circuit. Each of the multiple receivers includes a receive circuit, a low-noise amplifier (LNA), and an input circuit. The output circuit includes a transmit filter, an impedance matching circuit, and a duplexer. The input circuit includes a receive filter, an impedance matching circuit, and a duplexer. Based on this structure, simultaneous transmission, simultaneous reception, or simultaneous transmit and receive can be performed by switching the switchplexer.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Publication No. 2014-522216 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] However, when the transceiver (transceiver circuit) disclosed in Patent Document 1 is constructed using a high-frequency module mounted in a mobile communication device, it is conceivable that multiple circuit components configured in the transmitting path, receiving path, and the transmitting / receiving path including the antenna switch will undergo electromagnetic field coupling. In this case, harmonic components of the high-output transmitting signal amplified by the PA (transmit power amplifier) ​​may sometimes be superimposed on the transmitting signal, resulting in a deterioration in the quality of the transmitting signal. Furthermore, due to the aforementioned electromagnetic field coupling, the isolation between the transmitting and receiving signals decreases, and unwanted waves such as the aforementioned harmonics or intermodulation distortion between the transmitting signal and other high-frequency signals flow into the receiving path, thereby degrading the receiving sensitivity.

[0009] Furthermore, to facilitate the identification of high-frequency modules, markings indicating information such as the model number are made on the surface of the high-frequency modules. As high-frequency modules become smaller, the markings themselves also become smaller, requiring high visual recognizability.

[0010] Therefore, the object of the present invention is to provide a high-frequency module and communication device that can suppress the degradation of the quality of transmitted or received signals and has high visual recognition.

[0011] Technical solutions for solving the problem

[0012] One aspect of the present invention relates to a high-frequency module comprising: a module substrate having a main surface; a first circuit component and a second circuit component disposed on the main surface; a resin component covering at least a portion of the main surface, the first circuit component, and the second circuit component; a metal layer covering at least the upper surface of the resin component and set to a ground potential; and a metal plate disposed on the main surface and disposed between the first circuit component and the second circuit component when viewed from above, and set to a ground potential, the metal plate being in contact with the metal layer; and an etched portion showing given information being provided on the upper surface of the resin component, at least a portion of which is provided at the overlapping portion of the resin component and the metal plate when viewed from above.

[0013] One aspect of the present invention relates to a communication device comprising: an RF signal processing circuit for processing high-frequency signals transmitted and received by an antenna; and a high-frequency module according to the above-mentioned aspect for transmitting high-frequency signals between the antenna and the RF signal processing circuit.

[0014] Invention Effects

[0015] According to the present invention, a high-frequency module and a communication device that can suppress the degradation of the quality of transmitted or received signals and have high visual recognizability can be provided. Attached Figure Description

[0016] Figure 1 This is a circuit diagram of the high-frequency module and communication device involved in the implementation method.

[0017] Figure 2 This is a top view showing the component configuration of the high-frequency module according to the embodiment.

[0018] Figure 3 This is a cross-sectional view of the high-frequency module involved in the implementation method.

[0019] Figure 4 This is a top view showing the engraving section of the high-frequency module according to the embodiment.

[0020] Figure 5 These are top views and cross-sectional views showing the first example of a recessed portion of a metal shielding plate.

[0021] Figure 6 These are top and cross-sectional views of a second example showing the recess of a metal shielding plate.

[0022] Figure 7This is a top view showing the third example of a recessed portion of a metal shielding plate.

[0023] Figure 8 This is a top view showing the engraving portion of a high-frequency module according to a modified embodiment.

[0024] Figure 9A This is a perspective view showing the appearance of the first example of a metal shielding plate.

[0025] Figure 9B This is a perspective view showing the appearance of the second example of a metal shielding plate.

[0026] Figure 9C This is a perspective view showing the appearance of the third example of a metal shielding plate.

[0027] Figure 9D This is a perspective view showing the appearance of the fourth example of a metal shielding plate. Detailed Implementation

[0028] Hereinafter, the high-frequency module and communication device according to embodiments of the present invention will be described in detail with the aid of accompanying drawings. Furthermore, the embodiments described below are all specific examples of the present invention. Therefore, the values, shapes, materials, constituent elements, arrangements of constituent elements, and connection methods shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, constituent elements not described in the independent claims in the following embodiments will be described as arbitrary constituent elements.

[0029] Furthermore, these figures are schematic diagrams and may not be strictly illustrative. Therefore, for example, the scales may not be consistent across figures. Additionally, substantially identical structures are labeled with the same reference numerals across figures, and repetitive descriptions are omitted or simplified.

[0030] Furthermore, in this specification, terms such as parallel or perpendicular indicating the relationship between elements, and terms such as rectangle or straight line indicating the shape of elements, and numerical ranges, are not merely expressions with a strict meaning, but rather expressions of substantially equivalent ranges, for example, also including differences of a few percent.

[0031] Furthermore, in this specification, the terms "above" and "below" do not refer to absolute spatial orientations of upward (vertical above) and downward (vertical below), but are used as terms defined based on the stacking order in a layered structure and according to relative positional relationships. Therefore, for example, the "upper surface" of a component or member may, in actual use, be not only a surface on the vertically upward side, but also a surface on the vertically downward side, or a surface orthogonal to the horizontal direction, and so on.

[0032] Furthermore, in this specification and accompanying drawings, the x-axis, y-axis, and z-axis represent the three axes of a three-dimensional orthogonal coordinate system. When the top view of the module substrate is rectangular, the x-axis and y-axis are parallel to the first side of the rectangle and the second side, which is orthogonal to the first side, respectively. The z-axis represents the thickness direction of the module substrate. Additionally, in this specification, the term "thickness direction" of the module substrate refers to the direction perpendicular to the main surface of the module substrate.

[0033] Furthermore, in this specification, the term "connection" includes not only direct connections via connection terminals and / or wiring conductors, but also electrical connections via other circuit elements. Additionally, the term "connection between A and B" means a connection between A and B, and between A and B.

[0034] Furthermore, in the component configuration of the present invention, the term "top view of the module substrate" means observing an object by projecting it orthographically from the positive z-axis onto the xy-plane. Furthermore, the term "component disposed on the substrate" includes, in addition to the case where the component is disposed on the substrate in contact with the substrate, the case where it is disposed above the substrate without contact with the substrate (e.g., the component is stacked on top of other components disposed on the substrate), and the case where part or all of the component is embedded within the substrate. Furthermore, the term "component disposed on the main surface of the substrate" includes, in addition to the case where the component is disposed on the main surface of the substrate in contact with the main surface, the case where the component is disposed above the main surface without contact with the main surface, and the case where part of the component is embedded within the substrate from the main surface side. Furthermore, the term "A disposed between B and C" means that at least one of a plurality of line segments connecting any point in B and any point in C passes through A.

[0035] Furthermore, unless otherwise stated, in this specification, ordinal numbers such as "first" and "second" do not imply the quantity or order of constituent elements, but are used for the purpose of avoiding confusion between constituent elements of the same kind and for differentiation.

[0036] Furthermore, the term "transmitting path" hereafter refers to a transmission line that includes wiring for transmitting high-frequency transmitted signals, electrodes directly connected to the wiring, and terminals directly connected to the wiring or electrodes. Similarly, the term "receiving path" refers to a transmission line that includes wiring for transmitting high-frequency received signals, electrodes directly connected to the wiring, and terminals directly connected to the wiring or electrodes. Finally, the term "transmit-receive path" refers to a transmission line that includes wiring for transmitting both high-frequency transmitted and high-frequency received signals, electrodes directly connected to the wiring, and terminals directly connected to the wiring or electrodes.

[0037] (Implementation Method)

[0038] [1. Circuit structure of high-frequency module and communication device]

[0039] use Figure 1 The circuit structure of the high-frequency module and communication device involved in the implementation method is described. Figure 1 This is a circuit structure diagram of the high-frequency module 1 and the communication device 5 involved in the implementation method.

[0040] [1-1. Circuit Structure of Communication Devices]

[0041] Communication device 5 is a device used in a communication system, such as a smartphone or a portable terminal like a tablet computer. Figure 1 As shown, the communication device 5 includes a high-frequency module 1, an antenna 2, an RF signal processing circuit (RFIC) 3, and a baseband signal processing circuit (BBIC) 4.

[0042] High-frequency module 1 transmits high-frequency signals between antenna 2 and RFIC 3. The internal structure of high-frequency module 1 will be described later.

[0043] Antenna 2 is connected to the antenna connection terminal 100 of the high-frequency module 1, and transmits high-frequency signals (transmit signals) output from the high-frequency module 1. In addition, it receives high-frequency signals from the outside (receive signals) and outputs them to the high-frequency module 1.

[0044] RFIC3 is an example of a signal processing circuit that processes high-frequency signals transmitted and received by antenna 2. Specifically, RFIC3 processes the high-frequency received signal input via the receiving path of high-frequency module 1 using down-conversion or the like, and outputs the received signal generated by this signal processing to BBIC4. Furthermore, RFIC3 processes the transmitted signal input from BBIC4 using up-conversion or the like, and outputs the high-frequency transmitted signal generated by this signal processing to the transmitting path of high-frequency module 1. In addition, RFIC3 has a control unit that controls the switches and amplifiers in high-frequency module 1. Furthermore, the functions of the control unit in RFIC3 can be part or all of the functions of RFIC3 can be installed externally, for example, in BBIC4 or high-frequency module 1.

[0045] BBIC4 is a baseband signal processing circuit that performs signal processing on an intermediate frequency band that is lower in frequency than the high-frequency signal transmitted by high-frequency module 1. The signals processed in BBIC4 can be, for example, image signals for image display and / or audio signals for communication via a speaker.

[0046] Furthermore, in the communication device 5 according to this embodiment, the antenna 2 and BBIC4 are not essential components.

[0047] [1-2. Circuit Structure of High-Frequency Module]

[0048] Next, the circuit structure of high-frequency module 1 will be described.

[0049] like Figure 1 As shown, the high-frequency module 1 includes a power amplifier 10, a low-noise amplifier 20, and functional circuits 30 and 40. Furthermore, the high-frequency module 1 includes an antenna connection terminal 100, a transmit input terminal 110, and a receive output terminal 120 as external connection terminals.

[0050] Antenna connection terminal 100 is connected to antenna 2.

[0051] The transmit input terminal 110 is a terminal used to receive transmit signals from the outside of the high-frequency module 1 (specifically, RFIC 3).

[0052] The receive output terminal 120 is a terminal used to supply the received signal to the outside of the high-frequency module 1 (specifically, RFIC 3).

[0053] The high-frequency module 1 is provided with a transmit path AT for transmitting transmitted signals and a receive path AR for transmitting received signals. The transmit path AT connects the transmit input terminal 110 and the antenna connection terminal 100. The receive path AR connects the receive output terminal 120 and the antenna connection terminal 100. Furthermore, a portion of both the transmit path AT and the receive path AR is shared. That is, the shared portion is the transmit / receive path for both transmitting and receiving signals.

[0054] Power amplifier 10 is an example of an amplifier that amplifies high-frequency signals. Power amplifier 10 is a transmitting amplifier configured in the transmitting path AT to amplify transmitting signals in one or more communication frequency bands.

[0055] The low-noise amplifier 20 is an example of an amplifier that amplifies high-frequency signals. The low-noise amplifier 20 is a receiver amplifier that is configured in the receiver path AR to amplify received signals in more than one communication frequency band.

[0056] Furthermore, the term "communication frequency band" refers to a frequency band predefined for a communication system by standardization organizations such as 3GPP (3rd Generation Partnership Project) and IEEE (Institute of Electrical and Electronics Engineers). Communication frequency bands can be used in either Frequency Division Duplex (FDD) or Time Division Duplex (TDD) modes.

[0057] Here, the term "communication system" refers to a communication system built using Radio Access Technology (RAT). Examples of communication systems include 5G NR (5th Generation New Radio), LTE (Long Term Evolution), and WLAN (Wireless Local Area Network), but are not limited to these.

[0058] Functional circuit 30 is a circuit configured in the transmission path AT and performing a given function. Specifically, functional circuit 30 includes a transmission filter having a passband of the communication frequency band containing the transmitted signal. Alternatively, functional circuit 30 may also include impedance matching circuitry and / or switching circuitry. For example, functional circuit 30 includes inductors and / or capacitors.

[0059] exist Figure 1 In the example shown, functional circuit 30 is connected between power amplifier 10 and antenna connection terminal 100, but it is not limited to this. Functional circuit 30 can also be connected between power amplifier 10 and transmit input terminal 110. High-frequency module 1 may also have multiple functional circuits 30. Multiple functional circuits 30 can also be connected between power amplifier 10 and antenna connection terminal 100 and between power amplifier 10 and transmit input terminal 110, respectively.

[0060] Functional circuit 40 is a circuit configured in the receiving path AR and performing a given function. Specifically, functional circuit 40 includes a receive filter having a passband of the communication frequency band containing the received signal. Alternatively, functional circuit 40 may also include impedance matching circuitry and / or switching circuitry. For example, functional circuit 40 includes inductors and / or capacitors.

[0061] exist Figure 1In the example shown, functional circuit 40 is connected between low-noise amplifier 20 and antenna connection terminal 100, but it is not limited to this. Functional circuit 40 can also be connected between low-noise amplifier 20 and receive output terminal 120. High-frequency module 1 may also have multiple functional circuits 40. Multiple functional circuits 40 can also be connected between low-noise amplifier 20 and antenna connection terminal 100 and between low-noise amplifier 20 and receive output terminal 120, respectively.

[0062] Furthermore, functional circuits 30 or 40 can also be configured in the transmit / receive path. Functional circuits 30 and 40 can also be duplexers or multiplexers that include transmit and receive filters.

[0063] The high-frequency module 1 configured as described above can also transmit and receive high-frequency signals in multiple communication bands. For example, the high-frequency module 1 can also perform at least one of the following: (1) transmitting and receiving high-frequency signals in communication band A, (2) transmitting and receiving high-frequency signals in communication band B, and (3) simultaneously transmitting, simultaneously receiving, or simultaneously transmitting and receiving high-frequency signals in communication band A and communication band B.

[0064] In the high-frequency module 1, the transmit path AT and the receive path AR can also be separated. For example, the transmit path AT and the receive path AR can be connected to the antenna 2 via different terminals. Alternatively, the high-frequency module 1 may have only either the transmit path AT or the receive path AR.

[0065] [2. Component Configuration of High-Frequency Module]

[0066] Next, use Figure 2 as well as Figure 3 An example of the component configuration for high-frequency module 1 is provided.

[0067] Figure 2 This is a top view showing the component configuration of the high-frequency module 1 according to this embodiment. Figure 3 This is a cross-sectional view of the high-frequency module 1 involved in this embodiment. Figure 3 It indicates Figure 2 The cross-section at line III-III. Additionally, in Figure 3 In order to facilitate easy observation of the figures, a grid representing the cross-section is not attached to the module substrate 91. Furthermore, in Figure 3 The diagram schematically shows a circuit symbol indicating that the metal shielding layer 95 is set to ground.

[0068] like Figure 2 as well as Figure 3 As shown, in addition to having Figure 1In addition to the circuit structure shown, it also includes a metal shielding plate 70, an engraving section 80, a module substrate 91, a resin component 92, a metal shielding layer 95, and an external connection terminal 150.

[0069] The module substrate 91 has a main surface 91a and a main surface 91b opposite to the main surface 91a. The module substrate 91 has a rectangular shape when viewed from above, but the shape of the module substrate 91 is not limited to this. As the module substrate 91, for example, a low temperature co-fired ceramic (LTCC) substrate with a multilayer dielectric structure, a high temperature co-fired ceramic (HTCC) substrate, a component-embedded substrate, a substrate with a redistribution layer (RDL), or a printed substrate can be used, but it is not limited to these.

[0070] Main surface 91a is sometimes referred to as the upper surface or surface. For example... Figure 2 As shown, a configuration is arranged on the main surface 91a. Figure 1 All components of the circuit shown (excluding terminals) are included. Specifically, a power amplifier 10, a semiconductor integrated circuit 50 including a low-noise amplifier 20, and circuit components 31 and 41 are arranged on the main surface 91a.

[0071] Circuit component 31 is an example of a first circuit component configured in the transmission path AT, containing Figure 1 The circuit elements included in the functional circuit 30 shown. Circuit component 41 is an example of a second circuit component configured in the receiving path AR, including... Figure 1 The functional circuit 40 shown includes circuit elements. For example, circuit components 31 and 41 include inductors. Specifically, circuit components 31 and 41 are chip inductors. Chip inductors are, for example, part of an impedance matching circuit or a filter. Furthermore, although in Figure 2 The diagram schematically illustrates an example where a duplexer (filter) and switching circuits are configured on the main surface 91a, but these may not be configured.

[0072] Furthermore, the semiconductor integrated circuit 50 is an electronic component having electronic circuitry formed on the surface and inside a semiconductor chip (also known as a die). Figure 2In the example shown, the semiconductor integrated circuit 50 includes a low-noise amplifier 20 and a switching circuit. The semiconductor integrated circuit 50 may include, for example, CMOS, and specifically, may also be constructed using SOI technology. This makes it possible to manufacture the semiconductor integrated circuit 50 inexpensively. Furthermore, the semiconductor integrated circuit 50 may also include at least one of GaAs, SiGe, and GaN. This enables the realization of a high-quality semiconductor integrated circuit 50.

[0073] The main surface 91b is sometimes referred to as the lower surface or the back surface. Multiple external connection terminals 150 are configured on the main surface 91b.

[0074] Multiple external connection terminals 150, in addition to including Figure 1 In addition to the antenna connection terminal 100, transmit input terminal 110, and receive output terminal 120 shown, a ground terminal 150g is also included. Each of the plurality of external connection terminals 150 is connected to an input / output terminal and / or a ground terminal, etc., disposed on the mother substrate on the negative z-axis side of the high-frequency module 1. The plurality of external connection terminals 150 may be, for example, planar electrodes formed on the main surface 91b, but may also be bump electrodes. Alternatively, the plurality of external connection terminals 150 may also be columnar electrodes through which a resin member covering the main surface 91b is passed.

[0075] A resin component 92 is disposed on the main surface 91a of the module substrate 91, covering the main surface 91a. Specifically, the resin component 92 is configured to cover the side surfaces and top surfaces of each component disposed on the main surface 91a. For example, the resin component 92 covers the top surfaces and side surfaces of the power amplifier 10, circuit components 31 and 41, semiconductor integrated circuit 50, and other circuit components. In addition, the resin component 92 covers the side surfaces of the metal shielding plate 70.

[0076] A metal shielding layer 95 covers at least the upper surface 92a of the resin member 92. Specifically, the metal shielding layer 95 contacts and covers both the upper surface 92a and the side surfaces of the resin member 92. Furthermore, the metal shielding layer 95 contacts and covers the upper end surface 70a of the metal shielding plate 70 (see reference). Figure 5 or Figure 6 (b)). The metal shielding layer 95 is, for example, a thin metal film formed by sputtering. The metal shielding layer 95 is set to ground potential to suppress external noise from intruding into the circuit components constituting the high-frequency module 1.

[0077] The metal shielding plate 70 is a metal wall that is erected from the main surface 91a toward the upper surface 92a of the resin member 92. The metal shielding plate 70 is, for example, a flat plate with a given thickness. The metal shielding plate 70 is connected to the grounding electrode of the main surface 91a and the metal shielding layer 95. That is, the metal shielding plate 70 is connected to the ground at at least two points on its upper end surface 70a and lower end surface 70b, thus enhancing the electromagnetic field shielding function. Additionally, the metal shielding plate 70 can also be... Figure 2 At least one of the two side faces in the y-axis direction shown is in contact with the metal shielding layer 95.

[0078] In this embodiment, a gap is provided between the metal shielding plate 70 and the metal shielding layer 95. Specifically, as shown... Figure 3 As shown, the metal shielding plate 70 has a recess 72 that is cut out from the upper end face 70a toward the lower end face 70b. A portion of the resin member 92 is filled in the recess 72. An embossed portion 80 is formed on the upper surface of the resin member 92 that fills the recess 72. The detailed structure of the metal shielding plate 70 and the embossed portion 80 will be described later.

[0079] When viewed from above, the metal shielding plate 70 divides the main surface 91a into region P and region Q. For example... Figure 2 As shown, power amplifier 10 and circuit components 31 are disposed in region P of main surface 91a. In region P, circuit components are mainly configured in the transmission path AT. Furthermore, low-noise amplifier 20 and circuit components 41 are disposed in region Q of main surface 91a. In region Q, circuit components are mainly configured in the reception path AR.

[0080] In addition, although Figure 2 Not shown, but constitutes Figure 1 The wiring of the transmission path AT and the reception path AR shown is formed inside the module substrate 91, on the main surfaces 91a and 91b. In addition, the above wiring can be a bonding line whose two ends are connected to any of the circuit components included in the main surfaces 91a and 91b and the high-frequency module 1. Alternatively, it can be a terminal, electrode or wiring formed on the surface of the circuit components constituting the high-frequency module 1.

[0081] A metal shielding plate 70 is disposed between circuit component 31 and circuit component 41. Thus, circuit component 31 disposed in the transmit path AT and circuit component 41 disposed in the receive path AR are sandwiched by the metal shielding plate 70, which is set to ground potential, thereby suppressing electromagnetic field coupling between circuit component 31 and circuit component 41. Assuming electromagnetic field coupling occurs between circuit component 31 disposed in the transmit path AT and circuit component 41 disposed in the receive path AR, in this case, the high-output transmit signal amplified by the power amplifier 10 and its harmonic components may sometimes flow into the receive path AR, thus degrading the receiving sensitivity. By using the metal shielding plate 70 to suppress electromagnetic field coupling, the isolation between transmit and receive can be improved, and the degradation of receiving sensitivity can be suppressed.

[0082] Furthermore, the circuit components 31 and 41, separated by the metal shielding plate 70, can be components configured in the transmit path AT and the transmit / receive path, respectively. Assuming that the circuit component 31 configured in the transmit path AT and the circuit component 41 configured in the transmit / receive path are electromagnetically coupled, in this case, harmonic components amplified by the power amplifier 10 may sometimes be transmitted from the antenna 2 without being removed by filters, resulting in a degraded transmit signal quality. By using the metal shielding plate 70 to suppress electromagnetic coupling, the degradation of transmit signal quality can be suppressed.

[0083] Furthermore, the circuit components 31 and 41, separated by the metal shielding plate 70, can be components configured in the receiving path AR and the transceiver path, respectively. Assuming that the circuit component 31 configured in the receiving path AR and the circuit component 41 configured in the transceiver path are electromagnetically coupled, in this case, the high-output transmit signal amplified by the power amplifier 10 and its harmonic components may sometimes flow into the receiving path AR, thus degrading the receiving sensitivity. By utilizing the metal shielding plate 70 to suppress electromagnetic coupling, the isolation between the transmitting and receiving paths can be improved, and the degradation of receiving sensitivity can be suppressed.

[0084] For example, after the circuit components and the metal shielding plate 70 are arranged on the main surface 91a of the module substrate 91, the circuit components, the metal shielding plate 70, and the main surface 91a are injection molded together using liquid resin. Alternatively, the upper surface 70a of the metal shielding plate 70 may also be covered with liquid resin. After the liquid resin cures, the cured resin is ground. Alternatively, the metal shielding plate 70 may also be ground simultaneously. This allows the upper surface 70a of the metal shielding plate 70 and the upper surface 92a of the resin component 92 to become flush.

[0085] Then, after forming the etched portion 80 on the upper surface 92a of the resin component 92, a metal film is formed by sputtering, covering the upper surface 92a and the side surfaces of the resin component 92. This forms a metal shielding layer 95. Because the upper end face 70a of the metal shielding plate 70 is exposed from the resin component 92, the metal shielding layer 95 can contact the upper end face 70a. Therefore, the potential of the metal shielding layer 95 and the potential of the metal shielding plate 70 can be made the same.

[0086] [3. Engraved portion and recessed portion of metal shielding plate]

[0087] Next, use Figure 4 as well as Figure 5 The engraving portion 80 and the recess 72 of the metal shielding plate 70 of the high-frequency module 1 will be described.

[0088] Figure 4 This is a top view showing the marking portion of the high-frequency module according to this embodiment. Specifically, Figure 4 The upper surface 92a of the resin component 92 and a cross-section of the metal shielding layer 95 at the same position as the upper surface 92a in the z-axis direction are shown. Furthermore, in Figure 4 In the middle, dashed lines represent Figure 3 The circuit components shown.

[0089] The engraving section 80 displays given information about the high-frequency module 1. This given information includes the model number of the high-frequency module 1, the batch number at the time of manufacture, and / or the manufacturer's name, etc. The engraving section 80 contains text, graphics, or symbols. The text can be letters or numbers, but can also be hiragana, katakana, or kanji, etc. Figure 4 In the example shown, the engraving part 80 contains the six characters “ABCDEF”.

[0090] The engraved portion 80 is formed by grooves and / or recesses provided on the upper surface 92a of the resin member 92. For example, the engraved portion 80 is a plurality of grooves formed along the lines of the text. The engraved portion 80 is formed, for example, by irradiating the upper surface 92a of the resin member 92 with a laser to remove a portion of the resin member 92. Alternatively, the engraved portion 80 may also be text (raised portion) that emerges by removing the portion of the text other than the lines of the text.

[0091] In this embodiment, a metal shielding layer 95 is provided to cover the etched portion 80. The depth of the grooves and / or recesses forming the etched portion 80 is greater than the thickness of the metal shielding layer 95. The metal shielding layer 95 is formed with a uniform film thickness to follow the uneven shape of the etched portion 80. Therefore, the same unevenness as the etched portion 80 is formed on the surface (upper surface) of the metal shielding layer 95. As a result, the etched portion 80 becomes visually identifiable from the outside even when covered by the metal shielding layer 95.

[0092] At least a portion of the engraved portion 80 is disposed at the overlap of the resin member 92 and the metal shielding plate 70 when viewed from above the main surface 91a. That is, the engraved portion 80 overlaps with the metal shielding plate 70 when viewed from above. Figure 4 As shown, the engraving portion 80 is provided in both regions P and Q, thus spanning the metal shielding plate 70.

[0093] Figure 5 These are top views and cross-sectional views showing the recess 72 of the metal shielding plate 70. Specifically, Figure 5 (a) is to Figure 4 A top view showing the enlarged version of the character "B" and its surrounding area in the engraved section 80. Figure 5 (b) represents the cross-section at the VV line of (a).

[0094] like Figure 5 As shown, the letter "B," which is part of the engraving portion 80, is located on the upper surface 92a of the resin member 92 that fills the recess 72 of the metal shielding plate 70. The letter "B" overlaps with the metal shielding plate 70 at three points (specifically, three locations 81-83) when viewed from above. These three locations 81-83 are portions of the three horizontal lines of the letter "B." Figure 5 As shown, the recess 72 is a recess containing three parts 81 to 83 when viewed from above. That is, the length of the recess 72 in the y-axis direction becomes longer than the distance from end (part 81) to end (part 83) in the y-axis direction of the letter "B".

[0095] The recess 72 has a shape that is cut out from the upper end face 70a of the metal shielding plate 70 toward the lower end face 70b. Figure 5 In (b), the cross-sectional shape of the recess 72 is U-shaped, but there is no particular limitation. The bottom and side surfaces of the recess 72 may also intersect perpendicularly, and the cross-sectional shape of the recess 72 may also be V-shaped or semi-circular. The depth of the recess 72 is only required to be at least deeper than the depth of the engraved portion 80.

[0096] In this manner, the engraved portion 80 is positioned to overlap with the recess 72 when viewed from above, and is located on the upper surface 92a of the portion of the resin member 92 that fills the recess 72. That is, the engraved portion 80 is not directly formed on the upper end surface 70a of the metal shielding plate 70. If the engraved portion 80 were directly formed on the upper end surface 70a of the metal shielding plate 70, the visual legibility of the engraved portion 80 would be reduced. This is primarily due to the different materials used in the metal shielding plate 70 and the resin member 92. Due to the difference in materials, the depth of the grooves and / or recesses formed by the laser differs between the metal shielding plate 70 and the resin member 92. Specifically, the grooves and / or recesses formed on the metal shielding plate 70 become shallower than those formed on the resin member 92. Therefore, the visual legibility of the grooves and / or recesses formed on the upper end surface 70a of the metal shielding plate 70 is reduced, potentially leading to situations where the correct text cannot be read.

[0097] In contrast, in the high-frequency module 1 of this embodiment, the etched portion 80 is not directly formed on the upper end surface 70a of the metal shielding plate 70. That is, the etched portion 80 is entirely disposed on the resin member 92, thus suppressing deviations in the depth of the grooves and / or recesses and improving the visual recognizability of the etched portion 80. Furthermore, even if the area where the metal shielding plate 70 is not disposed (specifically, areas P and Q) becomes narrower, such as in cases where miniaturization of the high-frequency module 1 has been achieved or where multiple metal shielding plates 70 are disposed, the etched portion 80 can still be disposed at a position overlapping with the metal shielding plate 70 when viewed from above. In other words, the etched portion 80 can be disposed with greater freedom.

[0098] exist Figure 5 The image shows an example where a relatively large recess 72 is provided in the metal shielding plate 70, extending from one end of the letter "B" to the other, but this is not the only example. Hereinafter, using... Figure 6 as well as Figure 7 A modified example of the recess 72 will be described.

[0099] Figure 6 These are top views and cross-sectional views showing the recesses 72a to 72c of the metal shielding plate 70A. Specifically, Figure 6 (a) is to Figure 4 A top view showing the enlarged version of the character "B" and its surrounding area in the engraved section 80. Figure 6 (b) represents the cross section at line VI-VI of (a).

[0100] exist Figure 6The metal shielding plate 70A shown has a recess at each point where the letter "B," which is part of the engraving portion 80, overlaps with the metal shielding plate 70A. That is, the number of recesses is the same as the number of times the lines constituting the letter "B" overlap with the metal shielding plate 70A. Specifically, the letter "B" overlaps with the metal shielding plate 70A at three points 81 to 83, therefore three recesses 72a to 72c are provided on the metal shielding plate 70A.

[0101] This reduces the area of ​​the multiple recesses 72a to 72c when viewed from the front of the metal shielding plate 70A. In other words, it reduces the gaps (recesses) in the metal shielding plate 70A, thus improving shielding performance while ensuring the visual recognizability of the engraving portion 80.

[0102] Figure 7 This is a top view showing the recess 72B of the metal shielding plate 70B. Figure 7 In the high-frequency module 1B shown, an engraving section 80B is provided instead of an engraving section 80. The engraving section 80B has the six characters "ABCDEF" and the six characters "123456" arranged in two sections. The characters "B" and "2" overlap with the metal shielding plate 70B when viewed from above.

[0103] The recess 72B provided in the metal shielding plate 70B includes all the multiple parts of the multiple lines that overlap with the metal shielding plate 70B in the multiple lines that constitute the two letters "B" and "2". That is, the length of the recess 72B in the y-axis direction becomes longer than the distance from the positive end of the letter "B" in the y-axis direction to the negative end of the letter "2" in the y-axis direction.

[0104] In this way, by providing a relatively large recess 72B, even if the position of the etched portion 80B shifts during manufacturing, it can still be accommodated within the recess 72B. Therefore, a high-frequency module 1B with high visual recognizability of the etched portion 80B can be manufactured with a high yield.

[0105] In addition, such as Figure 8 As shown, the engraving section can also include a QR code.

[0106] Figure 8 This is a top view showing the engraving portion 80C of the high-frequency module 1C according to a modified embodiment. The engraving portion 80C is a QR code (registered trademark), which is an example of a two-dimensional barcode. A QR code, for example, represents a URL (Uniform Resource Locator), which displays a webpage that provides information related to the high-frequency module 1C.

[0107] A QR code, as at least a part of the engraving section 80C, is provided in the portion where the resin member 92 and the metal shielding plate 70 overlap when viewed from above the main surface 91a. That is, the QR code overlaps with the metal shielding plate 70 when viewed from above. Figure 8 As shown, the engraving part 80C is provided in both regions P and Q, thus spanning the metal shielding plate 70.

[0108] QR codes and other similar QR codes cannot be divided into two segments like the engraving section 80B. In other words, because a QR code cannot be configured with only a portion separated, it is easy to cause a situation where it has to overlap with the metal shielding plate 70. Even in this case, by providing the recess 72, a QR code with high visual recognizability can be set in the area overlapping with the metal shielding plate 70.

[0109] [4. Construction of Metal Shielding Plate]

[0110] Next, use Figures 9A to 9D The structure of the metal shielding plate 70 of the high-frequency module 1 according to this embodiment will be described.

[0111] Figure 9A This is a perspective view of the metal shielding plate 70C. The metal shielding plate 70C is an example of the metal shielding plates 70, 70A, or 70B involved in the embodiment. The metal shielding plate 70C is vertically erected from the main surface 91a (not shown) toward the upper surface 92a of the resin member 92 (not shown).

[0112] The metal shielding plate 70C has a main body portion 71C that is vertically erected from the main surface 91a toward the upper surface 92a of the resin member 92, and an extension portion 73C that extends parallel to the main surface 91a from the lower end of the main body portion 71C. The extension portion 73C is engaged with a grounding electrode (not shown) on the main surface 91a.

[0113] A recess 72 is provided in the main body 71C. Figure 9A The embossed portion 80 has multiple recesses 72. Alternatively, in a top view, the embossed portion 80 may overlap with only one of the multiple recesses 72. That is, a recess 72 may also be provided in a location where, in a top view, no embossed portion 80 is provided.

[0114] Based on the structure of the metal shielding plate 70C, a recess 72 is provided between the main body 71C and the metal shielding layer 95. Therefore, during the process of forming the resin component 92 on the main surface 91a, good flowability of the liquid resin near the upper end of the metal shielding plate 70C can be ensured. Consequently, the resin can be distributed to all corners near the upper end of the metal shielding plate 70C, thus suppressing the generation of voids where the resin component 92 is not formed.

[0115] Figure 9B This is a perspective view of the metal shielding plate 70D. The metal shielding plate 70D is an example of the metal shielding plates 70, 70A, or 70B according to the embodiments. The metal shielding plate 70D is vertically erected from the main surface 91a (not shown) toward the upper surface 92a of the resin member 92 (not shown). A through hole 74D is provided in the metal shielding plate 70D, extending in a direction parallel to the main surface 91a.

[0116] The through-hole 74D has a shape that is cut out from the lower end face 70b of the metal shielding plate 70D toward the upper end face 70a. Multiple through-holes 74D are provided in the metal shielding plate 70D. The multiple through-holes 74D are arranged at equal intervals along the y-axis direction, but the interval can be arbitrary. The shapes and sizes of the multiple through-holes 74D can be the same or different from each other. Alternatively, only one through-hole 74D may be provided in the metal shielding plate 70D.

[0117] Furthermore, the metal shielding plate 70D has a main body portion 71D vertically erected from the main surface 91a toward the upper surface 92a of the resin member 92, and an extension portion 73D extending parallel to the main surface 91a from the lower end of the main body portion 71D. The extension portion 73D is engaged with a grounding electrode (not shown) on the main surface 91a. The extension portion 73D is separated into multiple parts discretely arranged along the y-axis direction. Additionally, the extension portion 73D can also be... Figure 9A The extended section 73C shown is a long, flat plate that runs continuously along the y-axis.

[0118] A recess 72 is provided in the main body 71D. Figure 9B The embossed portion 80 has multiple recesses 72. Alternatively, when viewed from above, the embossed portion 80 may overlap with only one of the multiple recesses 72.

[0119] According to the structure of the metal shielding plate 70D, a through hole 74D is provided between the main body 71D and the main surface 91a. Therefore, during the process of forming the resin member 92 on the main surface 91a, good flowability of the liquid resin near the lower end of the metal shielding plate 70D can be ensured. Furthermore, a recess 72 is provided between the main body 71D and the metal shielding layer 95, thus ensuring good flowability of the liquid resin near the upper end of the metal shielding plate 70D. Therefore, resin can be distributed to all corners near both the upper and lower ends of the metal shielding plate 70D, thereby suppressing the formation of voids where the resin member 92 is not formed.

[0120] Figure 9CThis is a perspective view of the metal shielding plate 70E. The metal shielding plate 70E shown in this figure is an example of the metal shielding plates 70, 70A, or 70B involved in the embodiment. The metal shielding plate 70E is erected from the main surface 91a (not shown) toward the upper surface 92a (in the z-axis direction) of the resin member 92 (not shown).

[0121] Furthermore, the metal shielding plate 70E has: a flat body portion 71E, which is erected from the main surface 91a toward the upper surface 92a of the resin member 92 (in the z-axis direction) and is engaged with a grounding electrode (not shown) on the main surface 91a; and a flat body end portion 77E, which is disposed at the end of the body portion 71E in a direction parallel to the main surface 91a and is erected from the main surface 91a toward the upper surface 92a of the resin member 92 (in the z-axis direction). Here, the body portion 71E and the body end portion 77E are not parallel.

[0122] A recess 72, shaped as if cut away from the upper end face 70a toward the lower end face 70b, is provided in the main body 71E. Figure 9C The embossed portion 80 has multiple recesses 72. Alternatively, in a top view, the embossed portion 80 may overlap with only one of the multiple recesses 72. That is, a recess 72 may also be provided in a location where, in a top view, no embossed portion 80 is provided.

[0123] According to the structure of the metal shielding plate 70E, a recess 72 is formed in the main body 71E, thus ensuring good flowability of the liquid resin near the metal shielding plate 70E during the process of forming the resin member 92 on the main surface 91a. Therefore, the generation of voids where the resin member 92 is not formed can be suppressed near the metal shielding plate 70E. Furthermore, since no through holes are formed in the area contacting the main surface 91a (the area below the main body 71E), the isolation between circuit components disposed on the main surface 91a with the metal shielding plate 70E in between is improved. In addition, because the main body 71E and the main body end 77E are not parallel, the self-supporting nature of the metal shielding plate 70E on the main surface 91a can be ensured. Furthermore, since the extended mounting portions 73C or 73D present in the metal shielding plates 70C or 70D are absent, the placement space of the metal shielding plate 70E can be reduced.

[0124] Figure 9D This is a perspective view of the metal shielding plate 70F. The metal shielding plate 70F shown in this figure is an example of the metal shielding plates 70, 70A, or 70B according to the embodiments. The metal shielding plate 70F is erected from the main surface 91a (not shown) toward the upper surface 92a (in the z-axis direction) of the resin member 92 (not shown). A through hole 74F is formed between the metal shielding plate 70F and the main surface 91a, extending through the metal shielding plate 70F in the normal direction (x-axis direction).

[0125] Furthermore, the metal shielding plate 70F has: a flat body portion 71F, which is erected from the main surface 91a toward the upper surface 92a of the resin member 92 (in the z-axis direction) and is engaged with a grounding electrode (not shown) on the main surface 91a; and a flat body end portion 77F, which is disposed at the end of the body portion 71F in a direction parallel to the main surface 91a and is erected from the main surface 91a toward the upper surface 92a of the resin member 92 (in the z-axis direction). Here, the body portion 71F and the body end portion 77F are not parallel.

[0126] A recess 72, shaped as if cut away from the upper end face 70a toward the lower end face 70b, is provided in the main body 71F. Figure 9D The embossed portion 80 has multiple recesses 72. Alternatively, in a top view, the embossed portion 80 may overlap with only one of the multiple recesses 72. That is, a recess 72 may also be provided in a location where, in a top view, no embossed portion 80 is provided.

[0127] According to the structure of the metal shielding plate 70F, a through hole 74F and a recess 72 are formed in the main body portion 71F. Therefore, during the process of forming the resin member 92 on the main surface 91a, good flowability of the liquid resin near the metal shielding plate 70F can be ensured. Consequently, the generation of voids where the resin member 92 is not formed can be suppressed near the metal shielding plate 70F. Furthermore, since the main body portion 71F and the main body end portion 77F are not parallel, the self-supporting stability of the metal shielding plate 70F on the main surface 91a can be ensured. In addition, since the extended provision portion 73C or 73D of the metal shielding plates 70C or 70D are not present, the placement space of the metal shielding plate 70F can be reduced.

[0128] Furthermore, the construction examples of the metal shielding plate 70 are not limited to the metal shielding plates 70C and 70D described above. For example, the through hole may penetrate through the center of the main body without reaching either the upper end face 70a or the lower end face 70b. Moreover, multiple such through holes may be arranged from the upper end face 70a to the lower end face 70b. Furthermore, the direction in which the extended portion extends is not limited to... Figure 9A as well as Figure 9B The negative x-axis direction shown can also be the positive x-axis direction. The metal shielding plate 70 may also have extension portions extending to both sides in the negative and positive x-axis directions. Furthermore, the direction in which the main body ends 77E or 77F extend is not limited to... Figure 9C or Figure 9D The negative x-axis direction shown can also be the positive x-axis direction. Furthermore, the metal shielding plate 70 can have both a main body end extending in the negative x-axis direction and a main body end extending in the positive x-axis direction.

[0129] [5. Effects, etc.]

[0130] As described above, the high-frequency module 1 according to this embodiment includes: a module substrate 91 having a main surface 91a; circuit components 31 and 41 disposed on the main surface 91a; a resin member 92 covering at least a portion of the main surface 91a and the circuit components 31 and 41; a metal shielding layer 95 covering at least the upper surface 92a of the resin member 92; and a metal shielding plate 70 disposed on the main surface 91a and disposed between the circuit components 31 and 41 when viewed from above. The metal shielding plate 70 is in contact with the metal shielding layer 95. An etched portion 80 showing given information is provided on the upper surface 92a of the resin member 92. At least a portion of the etched portion 80 is provided at the overlapping portion of the resin member 92 and the metal shielding plate 70 when viewed from above.

[0131] Therefore, electromagnetic field coupling between circuit component 31 and circuit component 41 can be suppressed by the metal shielding plate 70. Thus, the winding of the transmitted signal and its harmonic components caused by electromagnetic field coupling can be suppressed, and the degradation of the quality of the transmitted or received signal can be suppressed.

[0132] Furthermore, assuming the etched portion 80 is formed directly on the upper end surface 70a of the metal shielding plate 70, the depth of the groove and / or recess in the portion formed on the upper end surface 70a becomes shallower, thus reducing the visual recognizability of the etched portion 80. In contrast, in the high-frequency module 1, the etched portion 80 is not formed directly on the metal shielding plate 70, thus improving the visual recognizability of the etched portion 80.

[0133] In this way, the degradation of the quality of the transmitted or received signal can be suppressed, and a high-frequency module 1 with high visual recognition of the engraving can be achieved.

[0134] Furthermore, for example, in the metal shielding plate 70, at least one recess 72 is provided, which is cut out from the upper end toward the lower end. A portion of the resin member 92 fills the at least one recess 72. At least a portion of the embossed portion 80 is provided on the upper surface 92a of the resin member 92 that fills the at least one recess 72.

[0135] As the high-frequency module 1 becomes smaller, the area where the etched portion 80 can be installed also becomes smaller. According to the high-frequency module 1 of this embodiment, the etched portion 80 can be configured to span the metal shielding plate 70, thus enabling the necessary information to be recorded in the high-frequency module 1 while ensuring visual recognizability.

[0136] Furthermore, the liquid resin can flow through the recess 72, thus ensuring that the resin is distributed to all corners near the upper end of the metal shielding plate 70. Consequently, the generation of voids or other defects where the resin component 92 is not formed can be suppressed.

[0137] Furthermore, for example, the engraved portion 80 overlaps with the metal shielding plate 70 at multiple locations when viewed from above the main surface 91a. The metal shielding plate 70 is provided with a recess 72 that includes multiple locations when viewed from above the main surface 91a.

[0138] Therefore, by providing a relatively large recess 72, the engraving portion 80 can be accommodated within the recess 72 even if there is a positional shift of the engraving portion 80 during manufacturing. Consequently, a high-frequency module 1 with high visual recognizability of the engraving portion 80 can be manufactured with a high yield.

[0139] In addition, for example, such as Figure 6 As shown, the metal shielding plate 70A is provided with multiple recesses 72a to 72c that correspond to multiple parts when viewed from above the main surface 91a.

[0140] Therefore, when viewing the main surface of the metal shielding plate 70A from the front, the area of ​​the recesses 72a to 72c can be reduced, thereby improving the shielding function of the metal shielding plate 70A.

[0141] In addition, for example, the engraving section 80 contains text, graphics, symbols or QR codes.

[0142] Therefore, given information can be easily conveyed to people through text or other means. Furthermore, by utilizing QR codes, even more information can be conveyed to people.

[0143] Furthermore, for example, circuit component 31 may be disposed in any of the transmission path AT for transmitting a transmitted signal, the reception path AR for transmitting a received signal, and the transceiver path for transmitting and receiving signals, and circuit component 41 may be disposed in any of the transmission path AT, the reception path AR, and the transceiver path other than the path in which circuit component 31 is disposed.

[0144] Therefore, electromagnetic field coupling between circuit component 31 and circuit component 41 can be suppressed by the metal shielding plate 70. Thus, the intrusion of transmitted signals and their harmonic components caused by electromagnetic field coupling can be suppressed, and the degradation of the quality of the transmitted or received signals can be suppressed. For example, when circuit component 31 is disposed in the transmit path AT and circuit component 41 is disposed in the receive path AR, the isolation between the transmitter and receiver can be improved.

[0145] In addition, for example, the upper end face 70a of the metal shielding plate 70 is flush with the upper surface 92a of the resin component 92.

[0146] Therefore, the metal shielding layer 95 can smoothly cover the upper end surface 70a of the metal shielding plate 70 and the upper surface 92a of the resin component 92 without any steps. A metal shielding layer 95 with high shielding effect can be formed with a film thickness that reduces unevenness and is uniform.

[0147] In addition, for example, it could also be, such as Figure 9B or Figure 9D As shown, the metal shielding plate 70 is provided with a through hole 74D or 74F that extends in a direction parallel to the main surface 91a.

[0148] Therefore, liquid resin can flow through the through holes 74D or 74F, so that the resin can be distributed to all corners near the metal shielding plate 70, thus suppressing the generation of voids such as those where resin components 92 are not formed.

[0149] In addition, for example, the through hole 74D or 74F may also have a shape that is cut off from the lower end of the metal shielding plate 70 toward the upper end.

[0150] Therefore, near the lower end of the metal shielding plate 70, the resin can be distributed to every corner, thus suppressing the generation of voids such as those where the resin component 92 is not formed.

[0151] Furthermore, for example, the metal shielding plate 70 may also have a main body portion 71C or 71D erected on the main surface 91a, and an extension portion 73C or 73D extending parallel to the main surface 91a from the lower end of the main body portion 71C or 71D. The extension portion 73C or 73D is engaged with a grounding electrode provided on the main surface 91a.

[0152] This ensures a stable connection between the metal shielding plate 70 and the main surface 91a of the module substrate 91. For example, when using liquid resin for injection molding, the metal shielding plate 70 is less likely to tip over. Furthermore, the contact area with the grounding electrode provided on the main surface 91a can be increased, thus strengthening the grounding of the metal shielding plate 70. Consequently, the shielding function of the metal shielding plate 70 can be improved.

[0153] Furthermore, the metal shielding plate 70 may also have: a main body portion 71E or 71F, which is connected to a grounding electrode provided on the main surface 91a and is erected on the main surface 91a; and a flat main body end portion 77E or 77F, which is disposed at the end of the main body portion 71E or 71F in a direction parallel to the main surface 91a and is erected from the main surface 91a toward the upper surface 92a of the resin member 92. The main body portion 71E or 71F and the main body end portion 77E or 77F may also not be parallel.

[0154] Therefore, since the main body portion 71E or 71F and the main body end portion 77E or 77F are not parallel, the self-supporting ability of the metal shielding plate 70 on the main surface 91a can be ensured. In addition, since there is no extended mounting portion 73C or 73D, the placement space of the metal shielding plate 70 can be reduced.

[0155] Furthermore, the communication device 5 according to this embodiment includes: RFIC3, which processes high-frequency signals transmitted and received by antenna 2; and high-frequency module 1, which transmits high-frequency signals between antenna 2 and RFIC3.

[0156] Therefore, the same effect as the high-frequency module 1 can be obtained in the communication device 5.

[0157] (other)

[0158] The high-frequency module and communication device of the present invention have been described above based on the above embodiments, but the present invention is not limited to the above embodiments.

[0159] For example, in the high-frequency module according to the embodiment, each circuit component constituting the high-frequency module is disposed on a single main surface 91a of the module substrate 91. However, each circuit component may also be disposed separately on the opposing main surfaces 91a and 91b of the module substrate 91. That is, each circuit component constituting the high-frequency module 1 may be mounted on the module substrate on one side, or it may be mounted on both sides of the module substrate.

[0160] Furthermore, the upper end face 70a of the metal shielding plate 70 and the metal shielding layer 95 may not be in contact. For example, the metal shielding plate 70 may be in contact with the metal shielding layer 95 on its side end face, but not on its upper end face 70a. In this case, a visually recognizable engraving portion 80 can be provided at any position overlapping the metal shielding plate 70 when viewed from above.

[0161] Furthermore, the recess 72 may not extend through the metal shielding plate 70 in the thickness direction. For example, when the thickness of the metal shielding plate 70 is greater than the width of the embossed portion 80, the entire embossed portion 80 may fall inside the upper end surface 70a of the metal shielding plate 70 when viewed from above. In this case, the width of the recess 72 (in the x-axis direction, i.e., the length in the thickness direction of the metal shielding plate 70) may be smaller than the thickness of the metal shielding plate 70. As a result, the recess 72 becomes invisible when viewing the main surface of the metal shielding plate 70 from the front, thus improving shielding performance.

[0162] Furthermore, for example, in the high-frequency module and communication device involved in the embodiments, other circuit elements and wiring may be inserted between the paths connecting the various circuit elements and signal paths disclosed in the drawings.

[0163] In addition, the present invention also includes various modifications that can be conceived by those skilled in the art to the various embodiments, and the implementation by arbitrarily combining the constituent elements and functions of the various embodiments without departing from the spirit of the present invention.

[0164] Industrial availability

[0165] This invention can be widely used as a high-frequency module configured in the front end to handle multiple frequency bands in communication devices such as portable telephones.

[0166] Explanation of reference numerals in the attached figures

[0167] 1, 1B, 1C: High-frequency modules;

[0168] 2: Antenna;

[0169] 3: RFIC;

[0170] 4: BBIC;

[0171] 5: Communication device;

[0172] 10: Power amplifier;

[0173] 20: Low-noise amplifier;

[0174] 30, 40: Functional circuits;

[0175] 31, 41: Circuit components;

[0176] 50: Semiconductor integrated circuits;

[0177] 70, 70A, 70B, 70C, 70D, 70E, 70F: Metal shielding plates;

[0178] 70a: Top surface;

[0179] 70b: Lower end face;

[0180] 71C, 71D, 71E, 71F: Main body;

[0181] 72, 72a, 72b, 72c, 72B: concave parts;

[0182] 73C, 73D: Extended installation section;

[0183] 74D, 74F: Through holes;

[0184] 77E, 77F: Ends of the main body;

[0185] 80, 80B, 80C: Engraving section;

[0186] 81, 82, 83: Location;

[0187] 91: Module baseboard;

[0188] 91a, 91b: Main face;

[0189] 92: Resin components;

[0190] 92a: Upper surface;

[0191] 95: Metallic shielding layer;

[0192] 100: Antenna connection terminal;

[0193] 110: Transmit input terminal;

[0194] 120: Receive / output terminal;

[0195] 150: External connection terminal;

[0196] 150g: Grounding terminal;

[0197] P, Q: Regions.

Claims

1. A high-frequency module, comprising: The module substrate has a main surface; The first circuit component and the second circuit component are disposed on the main surface; A resin component covering at least a portion of the main surface, the first circuit component, and the second circuit component; A metal layer, covering at least the upper surface of the resin component, is set to a ground potential; as well as A metal plate, disposed on the main surface and positioned between the first circuit component and the second circuit component when viewed from above, is set to a ground potential. The metal plate is in contact with the metal layer. An engraving portion displaying given information is provided on the upper surface of the resin component. At least a portion of the engraving is disposed at the overlap of the resin component and the metal plate when viewed from above the main surface.

2. The high-frequency module according to claim 1, wherein, The metal plate has at least one recessed portion that is cut out from the top end toward the bottom end. A portion of the resin component fills at least one of the recesses. At least a portion of the engraved portion is disposed on the upper surface of the resin member that fills at least one of the recesses.

3. The high-frequency module according to claim 2, wherein, The engraved portion overlaps with the metal plate in multiple locations when viewed from above the main surface. The metal plate is provided with a recess that includes the plurality of portions when viewed from above the main surface.

4. The high-frequency module according to claim 2, wherein, The engraved portion overlaps with the metal plate in multiple locations when viewed from above the main surface. The metal plate is provided with a plurality of recesses that correspond one-to-one with the plurality of parts when viewed from above the main surface.

5. The high-frequency module according to any one of claims 1 to 4, wherein, The engraving may contain text, graphics, symbols, or QR codes.

6. The high-frequency module according to any one of claims 1 to 5, wherein, The first circuit component is configured in any one of the following: the transmission path for transmitting a signal, the reception path for transmitting a received signal, and the transmission and reception path for both transmitting and receiving signals. The second circuit component is configured in any of the following paths: the transmit path, the receive path, and the transceiver path, excluding the path in which the first circuit component is configured.

7. The high-frequency module according to any one of claims 1 to 6, wherein, The upper end face of the metal plate is flush with the upper surface of the resin component.

8. The high-frequency module according to any one of claims 1 to 7, wherein, The metal plate is provided with a through hole that extends in a direction parallel to the main surface.

9. The high-frequency module according to claim 8, wherein, The through hole has a shape that is cut out from the lower end of the metal plate toward the upper end.

10. The high-frequency module according to any one of claims 1 to 9, wherein, The metal plate has the following characteristics: The main body is erected on the main surface; and An extension portion extends parallel to the main surface from the lower end of the main body portion. The extended portion engages with the grounding electrode disposed on the main surface.

11. The high-frequency module according to any one of claims 1 to 9, wherein, The metal plate has the following characteristics: The main body is joined to the grounding electrode provided on the main surface and is erected on the main surface; as well as The flat, plate-shaped end portion of the main body is disposed at an end of the main body in a direction parallel to the main surface, and is erected from the main surface toward the upper surface of the resin component. The main body and the end of the main body are not parallel.

12. A communication device comprising: RF signal processing circuitry processes high-frequency signals transmitted and received by the antenna; and The high-frequency module according to any one of claims 1 to 11 transmits the high-frequency signal between the antenna and the RF signal processing circuit.

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