Semiconductor wafer inspection apparatus and method of inspection

Abstract

The application discloses a kind of semiconductor wafer detection devices, including base, driver, displacement sensor, stylus, product fixing device and display, driver is set on base, stylus is set on displacement sensor, product fixing device is set on base, further include: trigger detection device, it includes connecting pipe, slide bar, conductive block, two metal blocks, three air pipes and light emitting element, slide bar one end can slide in connecting pipe and it is set with two sliding blocks on it, light emitting element is set on base, displacement sensor is set on slide bar;Drive device, set on driver for driving trigger detection device up and down movement;Light sensor;Pressure sensor;Controller.In the application, stylus can be self-adapting with wafer contact, effectively avoid stylus scratch wafer or stylus excessive force damage, while it can be judged whether stylus can continue to use by watching whether light emitting element emits light, and different size wafer can also be detected.

Description

Technical Field

[0001] This invention relates to the field of semiconductor inspection technology, and in particular to a semiconductor wafer inspection device and its inspection method. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. The semiconductor industry generally requires high efficiency and accuracy in wafer surface defect detection, capable of capturing effective defects and achieving real-time detection. Existing detection devices require manual contact between the probe and the wafer during wafer inspection, a method that can easily damage both the probe and the wafer, presenting shortcomings. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned technical problems by providing a semiconductor wafer inspection device and its inspection method.

[0004] The technical solution of the present invention: A semiconductor wafer inspection device, comprising a base, a driver, a displacement sensor, a stylus, a product fixing device, and a display, wherein the driver is disposed on the base, the stylus is disposed on the displacement sensor, and the product fixing device is disposed on the base, and further comprising:

[0005] A trigger detection device includes a connecting tube, a sliding rod, a conductive block, two metal blocks, three air pipes, and a light-emitting element. One end of the sliding rod can slide inside the connecting tube and is provided with two sliders. The connecting tube is provided with a sliding groove adapted to the sliders. The conductive block is provided on the sliding rod. The two metal blocks are provided on the inner wall of the connecting tube. One of the air pipes communicates with the inside of the connecting tube, and the other two air pipes communicate with the sliding grooves respectively. The light-emitting element is provided on the base, and the displacement sensor is provided on the sliding rod.

[0006] A driving device, mounted on the driver, is used to drive the trigger detection device to move up and down.

[0007] A light sensor is mounted on the base.

[0008] A pressure sensor is used to sense the drive device;

[0009] Controller.

[0010] Preferably, the thickness of the conductive block is equal to the length of the usable portion of the stylus.

[0011] Preferably, the product fixing device includes a support base, two baffles, a plurality of elastic elements and two locking plates, wherein the two baffles are respectively disposed on both sides of the support base, and the plurality of elastic elements are disposed between the baffles and the locking plates.

[0012] Preferably, the support base and the card plate are provided with protective pads.

[0013] Preferably, the position of the product fixing device on the base is adjustable; it also includes a locking device for fixing the moved product fixing device on the base.

[0014] Preferably, the base is provided with an elongated groove and a through groove; the locking device includes two bolts and two wing nuts, the bolts passing through the product fixing device and connected to the nuts.

[0015] Preferably, lubricating oil is provided between the connecting pipe and the slide rod.

[0016] Preferably, the stylus consists of an upper needle and a lower needle, the upper needle is provided with a threaded groove, the lower needle is threadedly connected to the threaded groove, and the lower needle is provided with a scale.

[0017] The present invention also provides a semiconductor wafer inspection method, comprising the following steps:

[0018] a. First, place the wafer on the product fixing device to secure it;

[0019] b. Adjust the position of the product fixing device on the base so that the probe is above one side of the wafer;

[0020] c. Turn on the power. The controller first controls the drive device to move the probe downward. After the light-emitting element lights up, the wafer can be inspected.

[0021] d. If the light-emitting component does not light up, simply replace the contact pin.

[0022] The beneficial effects of this invention are: In this invention, the stylus can adaptively contact the wafer, effectively avoiding scratching the wafer or damage to the stylus due to excessive force. When the light-emitting element emits light, the stylus moves to the left to detect the wafer. At the same time, it can be determined whether the stylus can still be used by observing whether the light-emitting element emits light. It can also detect wafers of different sizes. Attached Figure Description

[0023] Figure 1 This is a front view of the overall structure of a preferred embodiment of the present invention;

[0024] Figure 2 This is a top view of the connection between the base and the product fixing device in a preferred embodiment of the present invention;

[0025] Figure 3This is a partial structural cross-sectional view of the trigger detection device in a preferred embodiment of the present invention;

[0026] Figure 4 This is a cross-sectional view of the stylus in a preferred embodiment of the present invention.

[0027] Reference numerals: base 10, long groove 101, through groove 102, driver 2, first lead screw motor 201, moving block 202, displacement sensor 3, contact pin 4, upper pin 41, threaded groove 411, lower pin 42, connecting pipe 5, slide bar 6, conductive block 7, metal block 8, air pipe 9, light-emitting element 11, light sensor 12, pressure sensor 13, controller 14, support base 15, baffle 16, elastic element 17, clamping plate 18, bolt 19, wing nut 20, second lead screw motor 21, support plate 22. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Reference Figures 1 to 4 A semiconductor wafer inspection device includes a base 10, a driver 2, a displacement sensor 3, a stylus 4, a product fixing device, and a display. The driver 2 is mounted on the base 10, the stylus 4 is mounted on the displacement sensor 3, and the product fixing device is mounted on the base 10. The device also includes:

[0030] The trigger detection device includes a connecting pipe 5, a sliding rod 6, a conductive block 7, two metal blocks 8, three air pipes 9, and a light-emitting element 11. One end of the sliding rod 6 can slide inside the connecting pipe 5 and is provided with two sliders 61. The connecting pipe 5 is provided with a sliding groove 51 that matches the sliders 61. The conductive block 7 is provided on the sliding rod 6. The two metal blocks 8 are provided on the inner wall of the connecting pipe 5. One of the air pipes 9 communicates with the inside of the connecting pipe 5, and the other two air pipes 9 communicate with the sliding groove 51 respectively. The light-emitting element 11 is provided on the base 10, and the displacement sensor 3 is provided on the sliding rod 6.

[0031] A drive unit, mounted on driver 2, is used to drive the trigger detection device to move up and down.

[0032] A light sensor 12 is mounted on the base 10;

[0033] Pressure sensor 13 is used to sense the drive device;

[0034] Controller 14. In this invention, the air pipe 9 is connected to an external air supply device and is equipped with a solenoid valve. The wafer to be tested is placed on the fixing device. The controller 14 first controls the drive device to drive the stylus 4 to move downward. When the stylus 4 contacts the wafer, the stylus 4 is forced to drive the slide bar 6 to move upward, so that the conductive block 7 contacts the two metal blocks 8. The circuit of the light-emitting element 11 is turned on and emits light. After the light sensor 12 senses the light, it sends a signal to the controller 14. The controller 14 controls the drive device to stop working. The controller 14 controls the three solenoid valves to open, and the gas enters the space formed by the conductive block 7 and the connecting pipe 5 and the space formed by the slide bar 6 and the slide groove 51, respectively, thereby fixing the slide bar 6. On the connecting tube 5, the control driver 2 drives the drive device to move to the left, causing the stylus 4 to move to the left to detect the wafer surface. The displacement sensor 3 converts the displacement into an electrical signal, which is then amplified and processed before being displayed on the screen. When the pressure sensor 13 senses the drive device, it sends a signal to the controller 14. The controller 14 controls the driver 2 and the drive device to work, causing the trigger detection device to return to its original position. The controller 14 controls the three solenoid valves to close. The slide bar 6 returns to its original position under the action of its own weight, the displacement sensor 3, and the weight of the stylus 4. This design allows the stylus 4 to adaptively contact the wafer, effectively preventing the stylus 4 from scratching the wafer or being damaged by excessive force. Specifically, the driver 2 consists of a first lead screw motor 201 and a moving block 202; the driving device includes a second lead screw motor 21 and a support plate 22, the second lead screw motor 21 is mounted on the moving block 202, the connecting pipe 5 is mounted on the support plate 22, and one of the air pipes 9 passes through the support plate 22 and is connected to the inside of the connecting pipe 5; the pressure sensor 13 is mounted on the first lead screw motor 201 to sense the moving block 202.

[0035] As a preferred embodiment of the present invention, it may also have the following additional technical features:

[0036] In this embodiment, the thickness of the conductive block 7 is equal to the length of the usable part of the stylus 4. When the usable part of the stylus 4 is worn out, the sliding rod 6 moves upward and the conductive block 7 will not contact the metal block 8. The light-emitting element 11 will not emit light, which can serve as a reminder to the staff to replace the stylus 4.

[0037] In this embodiment, the product fixing device includes a support base 15, two baffles 16, several elastic elements 17, and two clamping plates 18. The two baffles 16 are respectively disposed on both sides of the support base 15, and the several elastic elements 17 are disposed between the baffles 16 and the clamping plates 18. Specifically, the elastic element 17 is a spring. The wafer is placed on the support base 15, and the two clamping plates 18 clamp the wafer, so that the wafer will not move when the stylus 4 moves on the wafer. At the same time, it can detect wafers of different widths. Moving the wafer forward or backward allows the stylus 4 to detect different positions on the wafer.

[0038] In this embodiment, protective pads are provided on the support base 15 and the card plate 18 to prevent scratching the wafer.

[0039] In this embodiment, the position of the product fixing device on the base 10 is adjustable; it also includes a locking device for fixing the moved product fixing device on the base 10. By moving the product fixing device, the stylus 4 is positioned above one side of the wafer, facilitating lateral inspection of the entire wafer.

[0040] In this embodiment, the base 10 is provided with an elongated groove 101 and a through groove 102; the locking device includes two bolts 19 and two wing nuts 20, with the bolts 19 passing through the product fixing device and connected to the nuts 20.

[0041] In this embodiment, lubricating oil is provided between the connecting pipe 5 and the slide rod 6 to facilitate the movement of the slide rod 6.

[0042] In this embodiment, the probe 4 consists of an upper probe 41 and a lower probe 42. The upper probe 41 is provided with a threaded groove 411, and the lower probe 42 is threadedly connected to the threaded groove 411. The lower probe 42 is provided with a scale. Specifically, the bottom of the lower probe 42 is provided with a usable part. When the usable part of the lower probe 42 is worn, the lower probe 42 can be unscrewed and replaced with a new one. When inspecting wafers of different heights, the length of the lower probe 42 relative to the upper probe 41 can be adjusted by measuring the height of the wafer, thus enabling the inspection of wafers of different heights.

[0043] The present invention also provides a semiconductor wafer inspection method, comprising the following steps:

[0044] a. First, place the wafer on the product fixing device to secure it;

[0045] b. Adjust the position of the product fixing device on the base 10 so that the contact pin 4 is above one side of the wafer;

[0046] c. Turn on the power. The controller 14 first controls the drive device to work and drive the contact pin 4 to move downward. After the light-emitting element 11 emits light, the wafer can be inspected.

[0047] d. If the light-emitting element 11 does not light up, replace the contact pin 4.

[0048] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0049] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer inspection apparatus comprising a base (10), a driver (2), a displacement sensor (3), a stylus (4), a product fixing device, and a display, the driver (2) being provided on the base (10), the stylus (4) being provided on the displacement sensor (3), and the product fixing device being provided on the base (10), characterized in that, The product fixing device includes a support base (15), two baffles (16), several elastic elements (17), and two locking plates (18). The two baffles (16) are respectively disposed on both sides of the support base (15), and the several elastic elements (17) are disposed between the baffles (16) and the locking plates (18). It also includes: The trigger detection device includes a connecting pipe (5), a slide rod (6), a conductive block (7), two metal blocks (8), three air pipes (9), and a light-emitting element (11). One end of the slide rod (6) can slide inside the connecting pipe (5), and two sliders (61) are provided on it. The connecting pipe (5) has a groove (51) adapted to the sliders (61). The conductive block (7) is provided on the slide rod (6), and the two metal blocks (8) are provided on the inner wall of the connecting pipe (5). One of the air pipes (9) is a light-emitting element (11). The tube (9) is connected to the inside of the connecting tube (5), and the other two air tubes (9) are connected to the slide groove (51) respectively. The light-emitting element (11) is set on the base (10), the displacement sensor (3) is set on the slide rod (6), the thickness of the conductive block (7) is equal to the length of the usable part of the stylus (4), when the usable part of the stylus (4) is worn out, after the slide rod (6) moves upward, the conductive block (7) will not contact the metal block (8), and the light-emitting element (11) will not emit light; A driving device is provided on the driver (2) for driving the trigger detection device to move up and down; A light sensor (12) is mounted on a base (10); Pressure sensor (13) is used to sense the drive device; Controller (14); The position of the product fixing device on the base (10) is adjustable; it also includes a locking device for fixing the moved product fixing device on the base (10), the base (10) is provided with a long groove (101) and a through groove (102); the locking device includes two bolts (19) and two wing nuts (20), the bolts (19) pass through the product fixing device and are connected to the nuts (20); The air pipe (9) is connected to an external air supply device and is equipped with an electromagnetic valve. The wafer to be tested is placed on the fixing device. The controller (14) first controls the drive device to work and drive the stylus (4) to move downward. When the stylus (4) contacts the wafer, the stylus (4) is forced to drive the slide rod (6) to move upward, so that the conductive block (7) contacts the two metal blocks (8). The circuit of the light-emitting element (11) is turned on and emits light. After the light sensor (12) senses the light, it sends a signal to the controller (14). The controller (14) controls the drive device to stop working. The controller (14) controls the three electromagnetic valves to open their valves. The gas enters the space formed by the conductive block (7) and the connecting pipe (5) and the space formed by the slide rod (6) and the slide groove (51), thereby fixing the slide rod (6) on the connecting pipe (5).

2. The semiconductor wafer inspection apparatus of claim 1, wherein: Protective pads are provided on the support base (15) and the card plate (18).

3. The semiconductor wafer inspection apparatus of claim 1, wherein: Lubricating oil is provided between the connecting pipe (5) and the slide rod (6).

4. An inspection method employing the semiconductor wafer inspection apparatus according to any one of claims 1 to 3, characterized by, Includes the following steps: a. First, place the wafer on the product fixing device to secure it; b. Adjust the position of the product fixing device on the base (10) so that the stylus (4) is above one side of the wafer; c. Turn on the power. The controller (14) first controls the drive device to work and drive the stylus (4) to move downward. After the light-emitting element (11) emits light, the wafer can be inspected. d. If the light-emitting component (11) does not light up, replace the contact pin (4).

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