Carrying device and method for maintaining the same

Abstract

This disclosure provides a support device and its maintenance method. The support device includes a support base and multiple support platforms, all located on the support base. The surfaces of the multiple support platforms facing away from the support base together form a support surface. Because multiple support platforms are used to place the component to be supported, and each support platform is an independent structure, only the support platform with poor surface flatness needs to be replaced individually, rather than replacing all support platforms. Support platforms with better surface flatness can continue to be used, avoiding waste and reducing the replacement cost of the support platforms, thereby reducing the maintenance cost of the support platforms and the support device. Therefore, the support device and its maintenance method provided by this disclosure can reduce the replacement cost of the support platforms, thereby reducing the maintenance cost of the support platforms and the support device.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a carrier device and its maintenance method. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot becomes a silicon wafer. Wafer processing techniques can include surface cleaning, thin-film processing, patterning, doping, and thermal processing.

[0003] In related technologies, during wafer processing, the wafer needs to be placed on a support device to provide support. The support device may include a chuck and a support stage fixed on the chuck, and the support stage can fix the wafer by vacuum adsorption.

[0004] However, the maintenance cost of the aforementioned support platform is relatively high. Summary of the Invention

[0005] This disclosure provides a support device and its maintenance method, which can reduce the replacement cost of the support platform, thereby reducing the maintenance cost of the support platform and the support device.

[0006] The embodiments disclosed herein provide the following technical solutions:

[0007] A first aspect of this disclosure provides a support device, including: a support base and a plurality of support platforms, wherein the plurality of support platforms are all located on the support base, and the surfaces of the plurality of support platforms opposite to the support base together form a support surface.

[0008] The carrier device provided in this embodiment includes a carrier base and multiple carrier stages. Each carrier stage is located on the carrier base, and the surfaces of the multiple carrier stages facing away from the carrier base together form a carrier surface, which can be used to place a component to be supported (e.g., a wafer). Because multiple carrier stages are used to place the component, each stage is an independent structure. Only the carrier stage with poor surface flatness needs to be replaced individually, without replacing all carrier stages. Carrier stages with better surface flatness can continue to be used, avoiding waste and reducing replacement costs and maintenance costs for both the carrier stages and the carrier device.

[0009] In one possible implementation, multiple support platforms are distributed circumferentially along the support surface.

[0010] In one possible implementation, the cross-sectional shape of each support platform along the cross-section perpendicular to the thickness direction of the support platform is fan-shaped, and the cross-sectional shape of the multiple support platforms spliced ​​together is circular.

[0011] When the area of ​​poor flatness extends from the center to the edge of the bearing surface, the area of ​​poor flatness is more likely to be concentrated on the fan-shaped bearing platform, so that the fan-shaped bearing platform can be replaced.

[0012] In one possible implementation, multiple support platforms are arranged sequentially along the direction from the center to the edge of the support surface.

[0013] In one possible implementation, the plurality of support platforms includes a plurality of first support platforms;

[0014] Along the cross section perpendicular to the thickness direction of the bearing platform, the cross section shape of each first bearing platform is annular, and multiple first bearing platforms are sequentially nested along the direction from the center to the edge of the bearing surface;

[0015] Alternatively, along a section perpendicular to the thickness of the bearing platform, the cross-sectional shape of each first bearing platform is an annular segment. Multiple first bearing platforms are distributed circumferentially along the bearing surface and are spliced ​​together to form a first bearing platform group with an annular cross-sectional shape. There are multiple first bearing platform groups, and multiple first bearing platform groups are nested sequentially along the direction from the center to the edge of the bearing surface.

[0016] When the area of ​​poor flatness extends circumferentially along the bearing surface and forms a ring or segment, the bearing platform can be replaced.

[0017] In one possible implementation, the plurality of support platforms include a second support platform, and the plurality of first support platforms are located on the outer periphery of the second support platform.

[0018] In one possible implementation, the second support platform is located at the center of the support surface.

[0019] When the area with poor flatness is located in the center of the bearing surface, the second bearing platform can be replaced.

[0020] In one possible implementation, the support device also includes multiple pressure sensors, with at least one pressure sensor corresponding to each support platform.

[0021] Pressure sensors can be used to measure the pressure applied to the platform in real time and output a sensing signal.

[0022] In one possible implementation, the detection end of each pressure sensor is located between the support base and the support platform, and abuts against the surface of the support platform facing the support base.

[0023] This facilitates the detection of the pressure applied to the pressure sensor by the testing end.

[0024] In one possible implementation, the pressure sensor has a sensing radius, and the distance between the centers of the detection ends of any two adjacent pressure sensors is less than or equal to the sensing radius. times.

[0025] There is no gap between the sensing ranges of any two adjacent pressure sensors, ensuring that there are no blind spots in the pressure detection of the platform by multiple pressure sensors, and that all areas of the platform can be detected.

[0026] In one possible implementation, multiple support platforms are evenly distributed circumferentially along the support surface, and multiple pressure sensors are distributed circumferentially along the support surface to form a pressure sensor group. There are multiple pressure sensor groups, and the multiple pressure sensor groups are sequentially nested along the direction from the center to the edge of the support surface.

[0027] In the same pressure sensor group, the orthographic projection of the detection ends of multiple pressure sensors onto the plane of the bearing surface is equidistant from the center of the bearing surface.

[0028] Each pressure sensor in the same pressure sensor group corresponds to a point equidistant from the center of the support platform and the support surface. The pressure values ​​measured by each pressure sensor in the same pressure sensor group are consistent. The presence of abnormal sensing signals can be confirmed by comparing the sensing signals of each pressure sensor in the same pressure sensor group.

[0029] In one possible implementation, the support device further includes a fixing member that is arranged around the outer periphery of all the support platforms and abuts against the outer peripheral wall of the center side of all the support platforms away from the support surface.

[0030] In one possible implementation, a receiving groove is provided on the side of the support base facing the support platform, and the support platform is located in the receiving groove.

[0031] A second aspect of this disclosure provides a method for maintaining a support device, comprising:

[0032] A bearing device is provided, which includes a bearing base and multiple bearing platforms. The multiple bearing platforms are all located on the bearing base, and the surfaces of the multiple bearing platforms facing away from the bearing base together form a bearing surface.

[0033] Measure the warpage of the bearing surface;

[0034] Determine if the warpage is less than or equal to the preset value. If yes, determine that the bearing surface is flat. If no, replace the bearing platform with one whose warpage is greater than the preset value.

[0035] The maintenance method for a support device provided in this disclosure is used to maintain the support device, which may include a support base and multiple support platforms. Each support platform can be located on the support base, and the surfaces of the multiple support platforms facing away from the support base together form a support surface. This support surface can be used to place a component to be supported (e.g., a wafer). Because multiple support platforms are used to place the component, each support platform is an independent structure. Only the support platform with poor surface flatness needs to be replaced individually, without replacing all support platforms. Support platforms with better surface flatness can continue to be used, avoiding waste and reducing the replacement cost of the support platforms, thus reducing the maintenance cost of the support platforms and the support device.

[0036] In one possible implementation, multiple bearing platforms are evenly distributed circumferentially along the bearing surface, and before measuring the warpage, the following steps are included:

[0037] The sensing signals of multiple pressure sensors of the bearing device are acquired; the multiple pressure sensors are distributed circumferentially along the bearing surface and form a pressure sensor group. There are multiple pressure sensor groups, and the multiple pressure sensor groups are nested sequentially along the direction from the center to the edge of the bearing surface. In the same pressure sensor group, the orthographic projection of the detection end of multiple pressure sensors on the plane of the bearing surface is equal to the distance from the center of the bearing surface.

[0038] In the same pressure sensor group, it is determined whether the sensing signals of multiple pressure sensors include abnormal sensing signals. If the abnormal sensing signals are different from the other sensing signals, the warpage is measured; otherwise, the bearing surface is determined to be flat, and the sensing signals of multiple pressure sensors are acquired.

[0039] Each pressure sensor in the same pressure sensor group corresponds to a point equidistant from the center of the support platform and the support surface. The pressure values ​​measured by each pressure sensor in the same pressure sensor group are consistent. The presence of abnormal sensing signals can be confirmed by comparing the sensing signals of each pressure sensor in the same pressure sensor group.

[0040] The structure of this disclosure, as well as its other inventive objectives and beneficial effects, will become more apparent from the description of the preferred embodiments taken in conjunction with the accompanying drawings. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1A schematic diagram showing the wafer, support stage, and support base provided in an embodiment of this disclosure;

[0043] Figure 2 This is a schematic diagram of the structure of the support base provided in the embodiments of this disclosure;

[0044] Figure 3 This is a schematic diagram of the structure of multiple support platforms provided in the embodiments of this disclosure;

[0045] Figure 4 This is another structural schematic diagram of the plurality of support platforms provided in the embodiments of this disclosure;

[0046] Figure 5 This is another structural schematic diagram of the plurality of support platforms provided in the embodiments of this disclosure;

[0047] Figure 6 This is another structural schematic diagram of the plurality of support platforms provided in the embodiments of this disclosure;

[0048] Figure 7 A cross-sectional view of the support device provided in an embodiment of this disclosure;

[0049] Figure 8 A top view of the support device provided in an embodiment of this disclosure;

[0050] Figure 9 Another cross-sectional view of the support device provided in the embodiments of this disclosure;

[0051] Figure 10 A schematic diagram of a bearing device with residue remaining on it, provided in an embodiment of this disclosure;

[0052] Figure 11 A schematic diagram of the structure of the bearing platform of the bearing device provided in the embodiments of this disclosure, showing wear;

[0053] Figure 12a A schematic diagram showing the sensing range of the three pressure sensors provided in the embodiments of this disclosure;

[0054] Figure 12b Another schematic diagram showing the sensing range of the three pressure sensors provided in the embodiments of this disclosure;

[0055] Figure 13 A schematic diagram showing the distribution of pressure sensors on a support platform according to an embodiment of this disclosure;

[0056] Figure 14 A pressure curve of pressure sensors S1-S12 provided in this embodiment of the disclosure;

[0057] Figure 15 A schematic flowchart illustrating the maintenance method for the bearing device provided in this embodiment of the disclosure;

[0058] Figure 16 Another schematic flowchart of a maintenance method for a bearing device provided in an embodiment of this disclosure.

[0059] Explanation of reference numerals in the attached figures:

[0060]

[0061] 140a: Pressure sensor array; 210: Wafer;

[0062] 220: Residue. Detailed Implementation

[0063] In related technologies, the carrier device may include a chuck and a carrier stage fixed on the chuck, the carrier stage being used to carry the wafer. For example, operations such as alignment and exposure can be performed on the carrier stage. Due to prolonged contact between the wafer and the carrier stage, wear and aging occur, resulting in poor surface flatness of the carrier stage. Furthermore, impurities or residual photoresist carried on the wafer may remain on the carrier stage, further reducing its surface flatness. Poor surface flatness of the carrier stage can easily affect subsequent wafer processing (e.g., causing overlay errors in photolithography), thereby reducing wafer production yield. Therefore, it is necessary to replace the carrier stage to avoid the aforementioned problems caused by poor surface flatness.

[0064] However, because the support platform is a single-piece structure and expensive to manufacture, if the flatness of some parts of the support platform surface is poor, the entire support platform needs to be replaced, resulting in the waste of the other parts of the support platform with better surface flatness. This leads to high replacement costs and high maintenance costs for the support platform.

[0065] This disclosure provides a support device and its maintenance method. The support device may include a support base and multiple support platforms, each of which can be located on the support base. The surfaces of the multiple support platforms facing away from the support base together form a support surface, which can be used to place the component to be supported (e.g., a wafer). Because multiple support platforms are used to place the component, each support platform is an independent structure. Only the support platform with poor surface flatness needs to be replaced individually, without replacing all support platforms. Support platforms with better surface flatness can continue to be used, avoiding waste and reducing the replacement cost of the support platforms, as well as the maintenance cost of the support platforms and the support device.

[0066] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0067] The following will combine Figures 1-16 The carrier device 100 provided in the embodiments of this disclosure will be described.

[0068] See Figure 1 This disclosure provides a carrier device 100, which can be used to place a component to be carried. For example, the component to be carried can be a wafer 210 or other semiconductor structures. This disclosure describes the component to be carried as a wafer 210.

[0069] The carrier device 100 can be applied to a semiconductor processing apparatus, which may include, but is not limited to, a doping apparatus, a deposition apparatus, a heating apparatus, or an etching apparatus. For example, the carrier device 100 can be applied to a lithography machine. In some examples, the semiconductor processing apparatus may include a processing chamber, and the carrier device 100 may be located in the receiving cavity of the processing chamber. Processing the wafer 210 in the processing chamber can protect the carrier device 100 and reduce or avoid the influence of the external environment on the wafer 210. In other examples, the carrier device 100 may not be disposed in a processing chamber, and at least a portion of the carrier device 100 may be exposed to the external environment.

[0070] See Figure 1 and Figure 2The carrier device 100 may include a carrier base 110 and multiple carrier stages 130. The multiple carrier stages 130 are all located on the carrier base 110. The surface of the carrier base 110 facing the carrier stages 130 forms a first support surface 111, and the multiple carrier stages 130 can be distributed along the first support surface 111. The surfaces of the multiple carrier stages 130 facing away from the first support surface 111 can collectively form a carrier surface 134. The carrier surface 134 can be located on the same plane, thus achieving good flatness. Since multiple carrier stages 130 are used to place the wafer 210, and each carrier stage 130 is an independent structure, only the carrier stage 130 with poor surface flatness needs to be replaced, without replacing all carrier stages 130. The carrier stages 130 with better surface flatness can continue to be used, avoiding waste of the carrier stages 130 with better surface flatness, thereby reducing the replacement cost of the carrier stages 130 and the maintenance cost of the carrier stages 130 and the carrier device 100. In addition, since only part of the carrier platform 130 was replaced, the difference between the carrier surface 134 formed after the carrier platform 130 was replaced and the carrier surface 134 formed before the carrier platform 130 was replaced is small, which can reduce the overlay error caused by the excessive difference between the carrier surface 134 formed before and after the carrier platform 130 was replaced.

[0071] For example, the number of support platforms 130 can be 2, 3, 4, or 5 or more. The support platforms 130 can be fixed to the support base 110 by vacuum adsorption. The cross-section of the support platform 130 is a section parallel to the support surface 134 (i.e., a section perpendicular to the thickness direction of the support platform 130). The shape of the cross-section of the support platform 130 can be, but is not limited to, polygons (triangles, quadrilaterals, pentagons, etc.), ellipses, circles, sectors (…). Figure 3 and Figure 4 ), ring ( Figure 5 ), ring segment ( Figure 6 For example, one of two adjacent support platforms 130 includes a first sidewall, and the other of two adjacent support platforms 130 includes a second sidewall. The first sidewall and the second sidewall are arranged facing each other, and the shapes of the first sidewall and the second sidewall can be adapted to each other, thereby improving the assemblability of the two adjacent support platforms 130. In addition, the distance between the adjacent first sidewall and the second sidewall can be reduced, so that the distance between the two adjacent support platforms 130 is smaller, so that the support surface 134 can provide better support for the wafer 210.

[0072] For example, adjacent support platforms 130 can be spaced apart, which can reduce mutual interference between adjacent support platforms 130 when they are assembled on the support base 110. Alternatively, adjacent support platforms 130 can abut each other, so that the corresponding bearing surfaces 134 of the adjacent support platforms 130 are relatively complete, and the adjacent support platforms 130 provide better support for the wafer 210. This can be achieved by all adjacent support platforms 130 being spaced apart. Alternatively, some adjacent support platforms 130 can be spaced apart, while others abut each other. Alternatively, all adjacent support platforms 130 can abut each other.

[0073] See Figure 7 In an embodiment where two adjacent support platforms 130 are spaced apart, an assembly 121 may be provided between the two adjacent support platforms 130, and the assembly 121 may be connected to the support base 110. At least one of the two adjacent support platforms 130 may be spaced apart from the assembly 121, or may abut against the assembly 121. When the support platform 130 abuts against the assembly 121, the assembly 121 can position the support platform 130, thereby preventing the support platform 130 from being misplaced. For example, the thickness of the assembly 121 may be less than or equal to the thickness of the support platform 130, thereby preventing the assembly 121 from affecting the support of the support platform 130 for the wafer 210. When the thickness of the assembly 121 is equal to the thickness of the support platform 130, the assembly 121 and the support platform 130 together provide support for the wafer 210.

[0074] The following describes the arrangement of the plurality of support platforms 130 provided in the embodiments of this disclosure.

[0075] In some embodiments, see Figure 3 and Figure 4 Multiple support platforms 130 can be distributed circumferentially along the support surface 134. The circumferential direction of the support surface 134 can refer to the direction of extension of the outer edge of the support surface 134. For example, each support platform 130 has a fan-shaped cross-section, and the cross-sectional shape of the multiple support platforms 130 spliced ​​together is circular. See also... Figure 3 There are four support platforms 130. The cross-sectional shape of the four support platforms 130 spliced ​​together is circular, and the included angle between the two straight sides of the sector-shaped support platform 130 is 90°. When the area of ​​poor flatness extends along the direction from the center to the edge of the support surface 134 and is relatively concentrated, the area of ​​poor flatness is more likely to be concentrated in one of the sector-shaped support platforms 130, thus allowing that sector-shaped support platform 130 to be replaced. See also Figure 4There are eight support platforms 130, and the cross-sectional shape of the eight support platforms 130 after splicing is circular. When the area with poor flatness extends from the center to the edge of the support surface 134 and is distributed circumferentially along the support surface 134, the area with poor flatness is more easily dispersed on different fan-shaped support platforms 130 that are spaced apart, so that the fan-shaped support platforms 130 with poor flatness can be replaced.

[0076] The cross-sectional shape of each sector-shaped support platform 130 can be the same, so that multiple support platforms 130 do not need to be distinguished by shape during assembly, which can simplify the assembly process and reduce maintenance costs.

[0077] See Figure 5 and Figure 6 In some embodiments, multiple support platforms 130 may be arranged sequentially along the direction from the center to the edge of the support surface 134. See also some examples. Figure 5 The plurality of support platforms 130 may include a plurality of first support platforms 131, each of which has an annular cross-sectional shape. The plurality of annular first support platforms 131 are sequentially nested along the direction from the center to the edge of the support surface 134. When the region of poor flatness extends circumferentially along the support surface 134 and forms an annular shape, for example, when the region of poor flatness is located at almost the entire edge of the support surface 134, the outermost annular first support platform 131 can be replaced. See also other examples. Figure 6 Each first support platform 131 has a ring-shaped cross-section. Multiple first support platforms 131 are distributed circumferentially along the support surface 134 and are spliced ​​together to form a first support platform group 131a with a ring-shaped cross-section. There are multiple first support platform groups 131a, which are sequentially nested along the direction from the center to the edge of the support surface 134. When the area with poor flatness extends circumferentially along the support surface 134 and forms a ring, for example, when the area with poor flatness is located at part of the edge of the support surface 134, the first support platform 131 of the outermost ring with poor flatness can be replaced, while the outermost ring with better flatness can continue to be used. Therefore, it is not necessary to replace the entire outermost first support platform group 131a, which can refine the maintenance of the support device 100 and reduce maintenance costs.

[0078] For example, the plurality of support stages 130 may further include a second support stage 132, with the plurality of first support stages 131 located on the outer periphery of the second support stage 132, and the second support stage 132 located on the inner side of the plurality of first support stages 131. The cross-sectional shape of the second support stage 132 and the plurality of first support stages 131 spliced ​​together can be approximately circular, thereby providing better support for the wafer 210. For example, the second support stage 132 can be located at the center of the support surface 134, and when the area with deteriorated flatness is located at the center of the support surface 134, the second support stage 132 can be replaced.

[0079] See Figure 5 In an embodiment where the first support platform 131 is annular, a groove 133 may be provided on the annular support platform 130. The groove 133 extends from the center to the edge of the support surface 134. The bottom wall of the groove 133 is located in the middle section of the thickness direction of the support platform 130. The opening of the groove 133 is located on the support surface 134 of the first support platform 131. The sidewalls of the groove 133 include a first sidewall and a second sidewall arranged opposite to each other along the circumference of the support surface 134. The opposite sides of the groove 133 along the center to the edge direction of the support surface 134 are not provided with sidewalls and are open, so that the groove 133 connects the two sides of the first support platform 131 along the center to the edge direction of the support surface 134. For example, the grooves 133 of the multiple first support platforms 131 are interconnected, thereby balancing the air pressure on both sides of the multiple first support platforms 131 along the center to edge direction of the support surface 134. This allows airflow from the outside of the multiple first support platforms 131 to enter between the wafer 210 and the first support platforms 131 during the unloading process, thus preventing the wafer 210 from failing to be unloaded due to the air pressure between the wafer 210 and the first support platforms 131 being lower than the outside pressure. In other examples, the grooves 133 can be replaced by notches, which can penetrate the first support platform 131 along its thickness direction, connecting the two sides of the first support platform 131 along the center to edge direction of the support surface 134.

[0080] See Figure 7 and Figure 8In some embodiments, the supporting device 100 may further include a fixing member 123, which is arranged around the outer periphery of all the supporting platforms 130 and abuts against the outer peripheral wall of all the supporting platforms 130 on the side away from the center of the supporting surface 134. For example, when the cross-section of the supporting platform 130 is fan-shaped, the outer peripheral wall is the arc-shaped wall of the fan-shaped supporting platform 130. During the installation of the supporting platforms 130 on the supporting base 110, the user can use a handheld suction tool to place multiple supporting platforms 130 in the corresponding positions on the supporting base 110 in sequence. Then, the fixing member 123 is sleeved on the outer periphery of the multiple supporting platforms 130 to clamp the multiple supporting platforms 130 to prevent relative displacement between the supporting platforms 130 during movement. Afterward, a vacuum suction force is applied to the bottom of the multiple supporting platforms 130 to fix the multiple supporting platforms 130 to the supporting base 110. The magnitude of the vacuum adsorption force can be referenced to the frictional force between the support base 110 and the support platform 130 to prevent relative displacement of the support platform 130 relative to the support base 110 during movement. During the disassembly of the support platform 130, the vacuum adsorption force at the bottom of the support platform 130 is first cut off. Then, the fixing component 123 is removed. Afterward, the user can pick up the support platform 130 using a handheld adsorption tool.

[0081] In some embodiments, see Figure 7 and Figure 9 A receiving groove 112 may be provided on the side of the support base 110 facing the support platform 130, and the support platform 130 is located in the receiving groove 112. The receiving groove 112 has a limiting function for the support platform 130. In some examples, there may be only one receiving groove 112, and all the support platforms 130 are located in the same receiving groove 112. This arrangement reduces the number of receiving grooves 112, which simplifies the structure of the support base 110. In embodiments where fasteners 123 are provided on the outer periphery of all the support platforms 130, the fasteners 123 can isolate multiple support platforms 130 from the sidewalls of the receiving grooves 112, which can reduce the impact damage between the support platforms 130 and the support base 110 during movement, thereby protecting the support platforms 130 and the support base 110. In other examples, there may be multiple receiving grooves 112, and one receiving groove 112 can correspond to at least one support platform 130. For example, the receiving slot 112 can be set one-to-one with the support platform 130, thereby avoiding mutual interference between different support platforms 130 during the assembly process and reducing the difficulty of installing the support platform 130 on the support base 110.

[0082] See Figure 9The support device 100 may include a driving member and a lifting member 122. The two opposite ends of the lifting member 122 along the thickness direction of the support platform 130 may be a first end and a second end. The first end of the lifting member 122 extends into the support base 110, and under the action of the driving member, drives the second end of the lifting member 122 to move closer to or further away from the support base 110 along the thickness direction of the support platform 130. The driving member may be connected to the first end of the lifting member 122, and the driving member provides driving force for the lifting of the lifting member 122. The end face of the second end of the lifting member 122 facing away from the first end may form a second support surface, which may be used to support the wafer 210. There may be multiple lifting members 122, and the second support surfaces of multiple lifting members 122 may provide reliable support for the wafer 210. For example, there may be three support members, which may be evenly distributed along the circumference of the support surface 134.

[0083] During the placement of wafer 210 onto the support stage 130, a drive unit moves lifting member 122 upwards, with the second end of lifting member 122 moving away from the support base 110, making the second end of lifting member 122 higher than the support stage 130. Then, wafer 210 is placed on lifting member 122. Next, the drive unit moves lifting member 122 downwards, with the second end of lifting member 122 moving closer to the support base 110. When the second end of lifting member 122 is lower than the support stage 130, wafer 210 is transferred from lifting member 122 to the support stage 130. For example, the support stage 130 may have adsorption holes that penetrate the support stage 130 along its thickness direction. These adsorption holes are connected to a vacuum pump, which creates a vacuum in the adsorption holes to adsorb wafer 210. During the unloading process of wafer 210, the driving component drives the lifting component 122 to rise. The second end of the lifting component 122 moves away from the support base 110. When the second end of the lifting component 122 is higher than the support platform 130, the wafer 210 is transferred from the support platform 130 to the lifting component 122. Then, the wafer 210 is removed from the lifting component 122. The support device 100 may include a control component, which can cooperate with the driving component and can be used to control the working state of the driving component.

[0084] In an embodiment where the supporting device 100 is equipped with a lifting member 122 and two adjacent supporting platforms 130 are spaced apart, there is a gap between the two adjacent supporting platforms 130. The lifting member 122 can pass through this gap and move up and down within it. For example, a mounting device 121 can be provided in the gap between the two adjacent supporting platforms 130, and the lifting member 122 can pass through the mounting device 121, which can protect the lifting member 122.

[0085] In some related technologies, a warpage detection device can be used to periodically detect the warpage of the bearing stage 130 to determine whether the bearing stage 130 needs to be replaced. To extend the service life of the bearing stage 130 and reduce costs, the warpage detection interval can be one month. However, if the surface flatness of the bearing stage 130 deteriorates during this interval, it may not be detected in time, potentially affecting subsequent processing of the wafer 210 and reducing its production yield. Warpage refers to the distance between the two furthest points on the bearing surface 134 along the thickness direction of the bearing stage 130, and the unit of warpage can be nm, μm, mm, etc. An upwardly warped bearing surface 134 is convex, while a downwardly warped bearing surface 134 is concave. For example, if the warpage exceeds a preset value, the flatness of the bearing surface 134 can be determined to be poor (i.e., non-flat). If the warpage is less than or equal to the preset value, the flatness of the bearing surface 134 can be determined to be good (i.e., flat).

[0086] The pressure sensor 140 provided in the embodiments of this disclosure will be described below.

[0087] See Figure 10 and Figure 11 The support device 100 may further include multiple pressure sensors 140, with at least one pressure sensor 140 corresponding to each support platform 130. The pressure sensors 140 can be used to measure the pressure applied to them by the support platform 130 in real time and output a sensing signal. A control unit can be electrically connected to each pressure sensor 140 and can acquire the sensing signals from the pressure sensors 140. When the pressure measured by a pressure sensor 140 is abnormal, its output sensing signal is an abnormal sensing signal. When the control unit acquires an abnormal sensing signal, it can issue a warning to the user, prompting the user to take further action to confirm whether the surface of the support platform 130 corresponding to the abnormal sensing signal is flat. Alternatively, the control unit can automatically take further action to confirm whether the surface of the support platform 130 corresponding to the abnormal sensing signal is flat. For example, this further action could be: using a warpage detection device to detect the warpage of the support platform 130. Since the warpage of the carrier stage 130 is detected only when an abnormal sensing signal is acquired, there is no need to periodically detect the warpage of the carrier stage 130, thereby simplifying the maintenance procedure of the carrier stage 130. In addition, since the pressure sensor 140 can detect pressure in real time, it can promptly detect deterioration in the flatness of the surface (i.e., the carrier surface 134) of the carrier stage 130, so as to avoid affecting the production yield of the wafer 210.

[0088] For example, multiple pressure sensors 140 can be array-type flexible thin-film pressure sensors, which have advantages such as ultra-thinness, large effective detection area, high pressure point distribution density, fast response speed, and customizability.

[0089] When the flatness of the bearing surface 134 deteriorates, the change in the pressure value measured by the pressure sensor 140 can be described as follows: (See...) Figure 10 When the stage 130 undergoes a bulging deformation, for example, due to residue 220 formed by the curing of photoresist residue, the wafer 210 located at the residue 220 becomes bulged, while the wafers 210 at other locations remain in normal contact with the stage 130 due to vacuum adsorption. The pressure value measured by the pressure sensor 140 corresponding to the stage 130 at the residue 220 will increase. See also... Figure 11 When the support stage 130 undergoes concave deformation, for example, due to severe wear at the edge of the support stage 130 caused by the wafer 210, the pressure value measured by the pressure sensor 140 corresponding to the worn support stage 130 will decrease. In embodiments where there is a gap between two adjacent support stages 130, if the residue 220 falls into the gap between two adjacent support stages 130, it will not cause a change in the warpage of the support stage 130, and the pressure sensor 140 will not detect a change in pressure value. When the residue 220 is large and stuck at the top of the gap, the residue 220 contacts the wafer 210 and lifts the wafer 210, which will cause the pressure value measured by the pressure sensor 140 around the gap to decrease.

[0090] For example, the detection end of each pressure sensor 140 is located between the support base 110 and the support platform 130, and abuts against the surface of the support platform 130 facing the support base 110, thereby facilitating the detection end to detect the pressure applied to the pressure sensor 140 by the support platform 130. The remaining portion of the pressure sensor 140, except for the detection end, can be inserted into the support base 110, thus providing better protection for the pressure sensor 140. Furthermore, the volume of the pressure sensor 140 between the support base 110 and the support platform 130 can be reduced, thereby preventing the pressure sensor 140 from causing the support platform 130 to warp and failing to fit well with the support base 110, and preventing the pressure sensor 140 from affecting the flatness of the support surface 134.

[0091] For example, see Figure 12a and Figure 12b The pressure sensor 140 has a sensing radius R. The range of pressure that the pressure sensor 140 can measure (i.e., the sensing range T) can be circular, with the center of the circle being the center of the detection end of the pressure sensor 140, and the radius of the circle being the sensing radius of the pressure sensor 140. The pressure sensor 140 can measure the pressure applied to it by the nearby support platform 130. For example, the pressure value measured by the pressure sensor 140 can be the pressure value applied to the pressure sensor 140 by the portion of the support platform 130 corresponding to the sensing range T. The sensing radii of any two pressure sensors 140 can be the same or different.

[0092] This embodiment is illustrated using the example where all pressure sensors 140 have the same sensing radius.

[0093] The area of ​​the bearing surface 134 can be Z, and the area of ​​the sensing range of the pressure sensor 140 is π*R. 2 The number of pressure sensors 140 can be greater than or equal to Z / (π*R). 2 This allows the total sensing range of all pressure sensors 140 to better cover multiple support platforms 130.

[0094] For example, see Figure 12a The edges of the sensing range T of any two adjacent pressure sensors 140 can be tangent, so that the total sensing range T of all pressure sensors 140 can cover most of the multiple support platforms 130.

[0095] For example, the distance between the centers of the detection ends of any two adjacent pressure sensors 140 is less than or equal to the sensing radius. times. Figure 12b Taking three adjacent pressure sensors 140 as an example, the centers of the sensing ranges T corresponding to the three pressure sensors 140 are A, B, and C respectively. △ABC is an equilateral triangle, and the sensing ranges T of the three pressure sensors 140 intersect each other pairwise, with all three sensing ranges T intersecting at point D. DE is perpendicular to AB, AD=BD=CD=R, and ∠DAE=30°. Therefore, At this point, the sensing range T of the three pressure sensors 140 is completely seamless between each other and covers a wide area. When the distance between the centers of the detection ends of any two adjacent pressure sensors 140 is less than or equal to the sensing radius... When the pressure is doubled, there is no gap between the sensing ranges of any two adjacent pressure sensors 140, so that there are no blind spots in the pressure detection of the multiple pressure sensors 140 on the multiple support platforms 130, and all areas of the multiple support platforms 130 can be detected.

[0096] For example, the presence of residues 220 on wafer 210 can cause a change in the horizontal height of the substrate 134. When this change exceeds 100 nm, it may affect the product's exposure and imaging, necessitating the replacement of the substrate 130. In this case, the change will cause approximately π*3.5 nm of surrounding material to be affected. 2 mm 2 Within the range, pressure changes can be detected, and the sensing radius R can be 3.5 mm. This allows for effective detection of pressure changes caused by a horizontal height of the bearing surface 134 exceeding 100 nm.

[0097] The following describes how the abnormal sensing signal is determined according to the embodiments of this disclosure.

[0098] In some examples, the magnitude of the sensing signals of all pressure sensors 140 can be determined. For instance, the sensing signal of any one pressure sensor 140 is designated as the first sensing signal. When the sensing signal of this pressure sensor 140 changes and the difference between it and the first sensing signal exceeds a set value, it is considered an abnormal sensing signal, indicating that the surface flatness of the support platform 130 corresponding to this pressure sensor 140 may have deteriorated. The sensing signal magnitude of the pressure sensor 140 at the same location may differ for support platforms 130 of different shapes. When using support platforms 130 of different shapes, the magnitude of the sensing signals of all pressure sensors 140 needs to be re-determined. Since the magnitude of the sensing signals of all pressure sensors 140 is determined, this example does not require specific distribution of the support platforms 130. The support platforms 130 can be uniformly or non-uniformly distributed, making it applicable to a wide range of scenarios.

[0099] See other examples. Figure 13Multiple support platforms 130 are evenly distributed circumferentially along the support surface 134. Pressure sensors 140 at points equidistant from the center of the support platform 130 and the support surface 134 measure consistent pressure values. Multiple pressure sensors 140 are distributed circumferentially along the support surface 134 to form pressure sensor groups 140a. Multiple pressure sensor groups 140a are sequentially nested along the direction from the center to the edge of the support surface 134. For example, there can be 2, 3, 4, 5, or 6 or more pressure sensor groups 140a. Within the same pressure sensor group 140a, the orthographic projection of the detection end of multiple pressure sensors 140 onto the plane of the support surface 134 is equidistant from the center of the support surface 134. In this case, each pressure sensor 140 in the same pressure sensor group 140a corresponds to a point equidistant from the center of the support platform 130 and the support surface 134. The pressure values ​​measured by each pressure sensor 140 in the same pressure sensor group 140a are consistent. The presence of abnormal sensing signals can be confirmed by comparing the sensing signals of each pressure sensor 140 in the same pressure sensor group 140a. When the sensing signals of each pressure sensor 140 are the same (or approximately the same), the surface flatness of the support platform 130 corresponding to the same pressure sensor group 140a is good. In the same pressure sensor group 140a, when any one (or more) sensing signals differ from the others, the sensing signal that differs from the others is an abnormal sensing signal, and the surface flatness of the support platform 130 corresponding to the abnormal sensing signal may be poor. Since the comparison is made to see if the sensing signals in the same pressure sensor group 140a are the same, for example, it can be confirmed whether the sensing signals in the same pressure sensor group 140a are approximately at the same baseline, without needing to confirm the magnitude of the sensing signals, making the maintenance method simpler and easier to operate. Specifically, in the same pressure sensor group 140a, when the ratio (or magnitude) of the difference between any one (or more) sensing signals and the others exceeds a set value, the control unit can determine that it is an abnormal sensing signal. Of course, in addition to the magnitude of the sensing signal, the quantity of sensing signals can also be used to determine whether it is an abnormal sensing signal.

[0100] See Figure 14 The same pressure sensor group 140a may include 12 pressure sensors 140, namely S1-S12. The sensing signal of S2 is different from the sensing signals of the other pressure sensors 140. Therefore, the sensing signal of S2 is an abnormal sensing signal.

[0101] The maintenance method of the bearing device 100 provided in the embodiments of this disclosure will be described below.

[0102] The maintenance method for the bearing device 100 provided in this embodiment of the disclosure is described in [reference needed]. Figure 15 The maintenance method may include:

[0103] S100: Provides a bearing device, which includes a bearing base and multiple bearing platforms. The multiple bearing platforms are located on the bearing base, and the surfaces of the multiple bearing platforms facing away from the bearing base together form a bearing surface.

[0104] See Figure 1 Multiple support stages 130 can all be located on the support base 110, and the surfaces of the multiple support stages 130 facing away from the support base 110 can jointly form a support surface 134. The support surface 134 can be located on the same plane, thus making the surface of the support surface 134 relatively flat. Since multiple support stages 130 are used to place the wafer 210, and each support stage 130 is an independent structure, only the support stage 130 with poor surface flatness needs to be replaced, instead of replacing all support stages 130. Support stages 130 with better surface flatness can continue to be used, thus avoiding waste of the support stages 130 and reducing the replacement and maintenance costs of the support stages 130.

[0105] S200: Determines the warpage of the bearing surface.

[0106] The warpage of the bearing surface 134 formed by multiple bearing platforms 130 is measured to obtain the warpage at various points on the bearing surface 134. For example, a warpage detection device can be used to measure the warpage of the bearing surface 134. The warpage detection device can be electrically connected to a control component, which is used to obtain the warpage of the bearing surface 134.

[0107] S310: Determine whether the warpage is less than or equal to the preset value.

[0108] Whether the bearing surface 134 is flat can be determined based on the magnitude of the warpage. Taking the determination of whether the bearing surface 134 at the first position is flat as an example, the flatness of the bearing surface 134 at the first position can be determined by referring to factors such as the magnitude of the warpage and the area occupied by the first position. For example, when the bearing surface 134 at the first position is flat, the magnitude of the warpage at that first position can be approximately 0 μm.

[0109] S320: If so, the bearing surface is determined to be flat.

[0110] When the warpage value of the bearing surface 134 at the first position is less than or equal to the preset value, it is determined that the bearing surface 134 at the first position is flat, and there is no need to replace the bearing platform 130.

[0111] S320: If not, replace the support platform with a warpage greater than the preset value.

[0112] When the warpage value of the bearing surface 134 at the first position is greater than the preset value, it is determined that the flatness of the bearing surface 134 at the first position is poor, and the bearing platform 130 corresponding to the bearing surface 134 at the first position needs to be replaced.

[0113] In an embodiment where multiple support platforms 130 are uniformly distributed circumferentially along the support surface 134, the pressure values ​​measured by pressure sensors 140 at points where the support platform 130 is equidistant from the center of the support surface 134 are consistent. Figure 16 Before measuring warp, the following may be included:

[0114] S410: Acquire the sensing signals of multiple pressure sensors of the bearing device; the multiple pressure sensors are distributed circumferentially along the bearing surface and form a pressure sensor group. There are multiple pressure sensor groups, which are sequentially nested along the direction from the center to the edge of the bearing surface. In the same pressure sensor group, the orthographic projection of the detection end of multiple pressure sensors on the plane of the bearing surface is equal to the distance from the center of the bearing surface.

[0115] See Figure 13 Multiple pressure sensors 140 are distributed circumferentially along the bearing surface 134 (e.g., they can be evenly distributed circumferentially along the bearing surface 134) to form a pressure sensor group 140a. Multiple pressure sensor groups 140a are sequentially nested along the direction from the center to the edge of the bearing surface 134. In the same pressure sensor group 140a, the orthographic projection of the detection end of each pressure sensor 140 onto the plane of the bearing surface 134 is equidistant from the center of the bearing surface 134. Therefore, each pressure sensor 140 in the same pressure sensor group 140a corresponds to a point on the bearing platform 130 equidistant from the center of the bearing surface 134. The pressure values ​​measured by each pressure sensor 140 in the same pressure sensor group 140a can be the same (or approximately the same). The sensing signals of each pressure sensor group 140a are acquired, and the sensing signals in the same pressure sensor group 140a are compared.

[0116] S420: In the same pressure sensor group, determine whether the sensing signals of multiple pressure sensors include abnormal sensing signals that are different from the other sensing signals.

[0117] The presence of abnormal sensing signals can be confirmed by comparing the sensing signals of each pressure sensor 140 in the same pressure sensor group 140a. When the sensing signals of each pressure sensor 140 are the same (or approximately the same), the surface flatness of the support platform 130 corresponding to the same pressure sensor group 140a is relatively good. In the same pressure sensor group 140a, when any one (or more) sensing signals differ from the others, the sensing signal that differs from the others is an abnormal sensing signal, and the surface flatness of the support platform 130 corresponding to the abnormal sensing signal may be poor. "Approximately the same" can mean that the difference between the two is within a set range.

[0118] If so, then execute S200.

[0119] When an abnormal sensing signal is detected, the warpage of the bearing surface 134 is measured, and the warpage at various points on the bearing surface 134 is obtained to determine whether the bearing surface 134 is flat.

[0120] When the warpage value of the bearing surface 134 at the first position is greater than a preset value, it is determined that the flatness of the bearing surface 134 at the first position is poor, and the bearing platform 130 corresponding to the bearing surface 134 at the first position needs to be replaced. After replacing the bearing platform 130, the sensing signals of multiple pressure sensors 140 can continue to be acquired, thereby continuously monitoring the pressure of the bearing platform 130 in real time, and timely detecting changes in the surface flatness of the bearing platform 130.

[0121] When the warpage value of the bearing surface 134 at the first position is less than or equal to a preset value, the bearing surface 134 at the first position is determined to be flat, and there is no need to replace the bearing platform 130 corresponding to the bearing surface 134 at the first position. After determining that the bearing surface 134 at the first position is flat, the sensing signals of multiple pressure sensors 140 can continue to be acquired, thereby continuously monitoring the pressure of the bearing platform 130 in real time, and timely detecting changes in the surface flatness of the bearing platform 130.

[0122] If not, then execute S410.

[0123] If no abnormal sensing signal is detected, the bearing surface 134 is determined to be flat, and there is no need to measure the warpage of the bearing surface 134. After determining that the bearing surface 134 is flat, the sensing signals of multiple pressure sensors 140 can be continuously acquired to continuously monitor the pressure of the bearing platform 130 in real time, and changes in the surface flatness of the bearing platform 130 can be detected in a timely manner.

[0124] It is understandable that if abnormal pressure values ​​and warpage occur immediately after replacing a single support platform 130, it may be due to improper installation of the support platform 130, which can be improved by reinstallation. If abnormal pressure values ​​and warpage occur only in a localized area after replacing a single support platform 130, it may be due to surface impurities introduced during installation, which can be improved by cleaning.

[0125] It should be noted that the numerical values ​​and ranges involved in the embodiments of this disclosure are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors, which can be considered negligible by those skilled in the art.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A supporting device, characterized in that, include: The system includes a support base and multiple support platforms, all of which are located on the support base. The surfaces of the multiple support platforms facing away from the support base together form a support surface, and each support platform is an independent structure. Multiple pressure sensors are provided, with at least one pressure sensor corresponding to each support platform. The detection end of each pressure sensor is located between the support base and the support platform, and abuts against the surface of the support platform facing the support base.

2. The bearing device according to claim 1, characterized in that, The plurality of the bearing platforms are distributed circumferentially along the bearing surface.

3. The bearing device according to claim 2, characterized in that, Along the cross-section perpendicular to the thickness direction of the support platform, the cross-sectional shape of each support platform is fan-shaped, and the cross-sectional shape of the multiple support platforms spliced ​​together is circular.

4. The bearing device according to claim 1, characterized in that, Multiple support platforms are arranged sequentially along the direction from the center to the edge of the support surface.

5. The bearing device according to claim 4, characterized in that, The plurality of said support platforms include a plurality of first support platforms; Along a cross section perpendicular to the thickness direction of the support platform, the cross-sectional shape of each of the first support platforms is annular, and multiple first support platforms are sequentially nested along the direction from the center to the edge of the support surface; Alternatively, along a cross section perpendicular to the thickness direction of the bearing platform, the cross-sectional shape of each of the first bearing platforms is an annular segment. Multiple first bearing platforms are distributed circumferentially along the bearing surface and spliced ​​together to form a first bearing platform group with an annular cross-sectional shape. There are multiple first bearing platform groups, and multiple first bearing platform groups are sequentially nested along the direction from the center to the edge of the bearing surface.

6. The bearing device according to claim 5, characterized in that, The plurality of support platforms include a second support platform, and the plurality of first support platforms are located on the outer periphery of the second support platform.

7. The bearing device according to claim 6, characterized in that, The second support platform is located at the center of the support surface.

8. The bearing device according to claim 1, characterized in that, The pressure sensor has a sensing radius, and the distance between the centers of the detection ends of any two adjacent pressure sensors is less than or equal to the sensing radius. times.

9. The bearing device according to claim 1, characterized in that, Multiple support platforms are evenly distributed around the circumference of the support surface, and multiple pressure sensors are distributed around the circumference of the support surface to form a pressure sensor group. There are multiple pressure sensor groups, and the multiple pressure sensor groups are sequentially nested along the direction from the center to the edge of the support surface. In the same pressure sensor group, the orthographic projection of the detection ends of multiple pressure sensors onto the plane of the bearing surface is equidistant from the center of the bearing surface.

10. The bearing device according to any one of claims 1-7, characterized in that, It also includes a fastener, which is arranged around the outer periphery of all the bearing platforms and abuts against the outer peripheral wall of the side of all the bearing platforms away from the center of the bearing surface.

11. The bearing device according to any one of claims 1-7, characterized in that, The support base has a receiving groove on the side facing the support platform, and the support platform is located in the receiving groove.

12. A method for maintaining a load-bearing device, characterized in that, include: A support device is provided, the support device including a support base and a plurality of support platforms, the plurality of support platforms are all located on the support base, the surfaces of the plurality of support platforms opposite to the support base together form a support surface, and the plurality of support platforms are each independent structures; Measure the warpage of the bearing surface; Determine whether the warpage is less than or equal to a preset value. If yes, determine that the bearing surface is flat. If no, replace the bearing platform with a warpage greater than the preset value.

13. The maintenance method for the bearing device according to claim 12, characterized in that, The plurality of said bearing platforms are evenly distributed circumferentially along the bearing surface. Before measuring the warpage, the process includes: The sensing signals of multiple pressure sensors of the bearing device are acquired; the multiple pressure sensors are distributed circumferentially along the bearing surface and form a pressure sensor group, and there are multiple pressure sensor groups. The multiple pressure sensor groups are sequentially nested along the direction from the center to the edge of the bearing surface. In the same pressure sensor group, the orthographic projection of the detection end of the multiple pressure sensors on the plane where the bearing surface is located is equal to the distance from the center of the bearing surface. In the same pressure sensor group, it is determined whether the sensing signals of the multiple pressure sensors include abnormal sensing signals that are different from the other sensing signals. If so, the warpage is measured; if not, the bearing surface is determined to be flat, and the sensing signals of the multiple pressure sensors are acquired.

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