LED packaging structure and light-emitting device

Abstract

The present application relates to an LED packaging structure, which includes a circuit board, a light-emitting chip, and a translucent cover; the circuit board is provided with a circuit, and the circuit board has a first mounting surface and a second mounting surface relative to each other, the first mounting surface is provided with a mounting groove, the bottom wall of the mounting groove is provided with a plurality of through-holes, and the second mounting surface is provided with a connection point corresponding to the through-holes and electrically connected to the circuit; a heat-conducting portion is fixed on the side of the light-emitting chip facing away from the light-emitting surface, the heat-conducting portion is installed in the mounting groove, the circuit board is provided with a gap between the inner side wall of the mounting groove and the heat-conducting portion to form an annular plug-in seam, a plurality of pins are provided on the side of the light-emitting chip facing away from the light-emitting surface, the plurality of pins pass through the heat-conducting portion and out of the through-holes, and are electrically connected to the connection point; the translucent cover is provided with an opening at one end, and the open end of the light-translucent cover is an annular plug-in portion, the plug-in portion is wrapped with expansion glue, the plug-in portion is inserted into the plug-in seam, and the expansion glue expands to seal the plug-in seam. The present application has the effect of improving the sealing performance of the LED light-emitting chip.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to an LED packaging structure and a light-emitting device. Background Art

[0002] Light-emitting diodes, or LEDs, are made from compounds containing gallium (Ga), arsenic (As), phosphorus (P), and nitrogen (N). Due to their long lifespan and low energy consumption, LEDs are widely used in indication and display applications. Reliability, stability, and high light output are essential considerations for LEDs to replace existing lighting sources.

[0003] Most of the existing LED packaging structures are relatively simple, and most of them are packaged using a simple die-bonding glue combined with a lens structure, resulting in insufficient sealing performance of the LED light-emitting chip. During use, external water vapor can easily invade the LED light-emitting chip, resulting in a reduced service life of the LED light-emitting chip and easy damage. Summary of the Invention

[0004] In order to improve the sealing performance of LED light-emitting chips, the present application provides an LED packaging structure and a light-emitting device.

[0005] The present application provides an LED packaging structure and a light-emitting device that adopts the following technical solutions:

[0006] In a first aspect, the present application provides an LED packaging structure, comprising:

[0007] A circuit board, the circuit board having circuits, the circuit board having a first mounting surface and a second mounting surface opposite each other, the first mounting surface having a mounting groove with a notch facing away from the second mounting surface, the bottom wall of the mounting groove having a plurality of through-holes extending therethrough, and the second mounting surface having connection points corresponding to the through-holes and electrically connected to the circuits;

[0008] A light-emitting chip, wherein a heat-conducting portion is fixed on a side of the light-emitting chip facing away from the light-emitting surface, the heat-conducting portion is installed in the mounting groove, a gap is provided between the inner sidewall of the mounting groove provided on the circuit board and the heat-conducting portion to form an annular plug-in seam, a plurality of pins are provided on a side of the light-emitting chip facing away from the light-emitting surface, and ends of the plurality of pins away from the light-emitting chip all penetrate the heat-conducting portion, pass through the through-hole, and are electrically connected to the connection point; and

[0009] The light-transmitting cover is open at one end. The open end of the light-transmitting cover is a ring-shaped plug-in portion. The plug-in portion is wrapped with expansion glue. The plug-in portion is inserted into the plug-in seam. The expansion glue expands to seal the plug-in seam.

[0010] By adopting the above technical solution, the plug-in portion of the light-transmitting cover is inserted into the plug-in gap, and the heat generated by the light-emitting chip causes the expansion adhesive to expand and fill the plug-in gap. On the one hand, when the expansion adhesive is not expanded, the plug-in portion can be easily inserted into the plug-in gap. On the other hand, the expansion adhesive can improve the sealing performance between the light-transmitting cover and the circuit board, preventing external water and oxygen from entering the light-transmitting cover and corroding the LED light-emitting chip, thereby extending the service life of the LED lamp and improving the waterproof performance of the LED packaging structure. Secondly, the expansion adhesive filling the plug-in gap can improve the stability of the light-transmitting cover when installed on the circuit board and enhance the protection of the light-emitting chip. The pins of the light-emitting chip are connected to the connection points on the second mounting surface of the circuit board, which can improve the strength of fixing the light-emitting chip and the heat-conducting portion to the circuit board and ensure the stability of the light-emitting chip. Furthermore, when the light-emitting chip is installed on the heat-conducting portion, the heat generated by the light-emitting chip can be transferred to the circuit board through the heat-conducting portion, thereby achieving a heat dissipation effect. The connection of the pins of the light-emitting chip to the connection points can increase the contact strength between the heat-conducting portion and the circuit board, reduce the gap between the heat-conducting portion and the circuit board, thereby improving the heat conduction efficiency between the heat-conducting portion and the circuit board and improving the heat dissipation capacity of the light-emitting chip.

[0011] Optionally, each of the connection points is arranged in a ring shape and is located outside each of the through holes, and the pins are welded to the connection points to seal the through holes.

[0012] By adopting the above technical solution, the pins and connection points of the light-emitting chip are connected by welding, and at the same time, the perforations can be sealed, thereby ensuring the sealing performance of the light-emitting chip and improving the packaging efficiency.

[0013] Optionally, the plug-in portion is made of flexible material.

[0014] By adopting the above technical solution, when the plug-in part is inserted into the plug-in seam, the stress of the plug-in part on the heat conducting part and the circuit board is reduced, and damage to the heat conducting part or the circuit board can be avoided as much as possible.

[0015] Optionally, the heat conducting portion is arranged in a columnar shape, and the insertion seam is perpendicular to the circuit board.

[0016] By adopting the above technical solution, the friction between the plug-in part, the heat-conducting part, and the circuit board can be reduced during the process of inserting the plug-in part into the plug-in seam, thereby minimizing the movement of the expansion glue on the plug-in part, so that the expansion glue is evenly distributed around the plug-in part, thereby improving the uniformity of the expansion glue filling the plug-in seam.

[0017] Optionally, the orthographic projection of the light-emitting chip on the heat-conducting portion is located within the surface of the heat-conducting portion.

[0018] By adopting the above technical solution, a certain distance is maintained between the plug-in part and the light-emitting chip during the process of inserting the plug-in part into the plug-in seam, thereby preventing the plug-in part from damaging the light-emitting chip and preventing the expansion glue from adhering to the light-emitting chip and affecting the light emission and heat dissipation of the light-emitting chip.

[0019] Optionally, an annular resisting portion is provided on the first mounting surface and is located on the periphery of the light-transmitting cover. The end of the annular resisting portion away from the circuit board is bent inward to form an annular limiting portion. The plug-in portion extends to be opposite to the annular resisting portion, and the expansion glue expands to fill the annular resisting portion and the inner side of the annular limiting portion.

[0020] By adopting the above technical solution, the annular limiting portion is fixed on the circuit board, and the expansion glue expands into the annular limiting portion, which can increase the strength of the transparent cover fixed on the circuit board and minimize the transparent cover from falling off.

[0021] Optionally, an annular notch is provided on the peripheral surface of the heat conducting portion, the notch surrounds the heat conducting portion, and the expansion glue expands to fill the notch.

[0022] By adopting the above technical solution, the heat conducting part is fixed on the circuit board, and the expansion glue fills the gap, so that the expansion glue and the light-transmitting cover are buckled on the heat conducting part, further increasing the strength of the light-transmitting cover fixed on the circuit board and minimizing the light-transmitting cover from falling off.

[0023] Optionally, the end of the heat-conducting portion close to the light-emitting chip is a positioning end, the positioning end is bowl-shaped, the end of the positioning end close to the circuit board is adapted to the light-emitting chip, the inner wall of the positioning end is provided with a reflective layer, and the outer wall of the positioning end is in contact with the inner wall of the light-transmitting cover.

[0024] By adopting the above technical solution and setting up the heat-conducting part, on the one hand, after the heat of the light-emitting chip is transferred to the heat-conducting part, the heat-conducting part can transfer the heat to the circuit board and the light-transmitting cover, and the heat is dissipated through the circuit board and the light-transmitting cover, which can improve the heat dissipation efficiency of the light-emitting chip; on the other hand, it is convenient to position the light-emitting chip, avoid the situation where the installation position of the light-emitting chip is not uniform, and ensure that the light-emitting angle of the light-emitting chip is consistent; on the other hand, the light emitted by the light-emitting core is reflected on the reflective layer, which can improve the concentration of the light, thereby improving the brightness of the light-emitting chip.

[0025] Optionally, the portion of the light-transmitting cover corresponding to the positioning end is made of a heat-conducting material.

[0026] By adopting the above technical solution, after the heat of the heat conducting part is transferred to the light-transmitting cover, heat exchange occurs between the light-transmitting cover and the external environment, which is beneficial to improving the heat dissipation performance of the light-emitting chip.

[0027] In a second aspect, the present application provides a light-emitting device comprising the LED packaging structure as described above.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. Insert the plug-in part of the light-transmitting cover into the plug-in seam to facilitate the installation of the light-transmitting cover. The heat generated by the light-emitting chip causes the expansion glue to expand and fill the plug-in seam, which can improve the sealing performance between the light-transmitting cover and the circuit board, prevent external water and oxygen from entering the light-transmitting cover and corroding the LED light-emitting chip, extend the service life of the LED lamp, and improve the waterproof performance of the LED packaging structure;

[0030] 2. It can provide the strength for fixing the light-transmitting cover, light-emitting chip and heat-conducting part on the circuit board to ensure the stability of the light-emitting chip; the heat generated by the light-emitting chip can be transferred to the circuit board through the heat-conducting part, thereby achieving a heat dissipation effect;

[0031] 3. The circuit board is provided with an annular stopper and an annular limiter, which can increase the strength of the light-transmitting cover fixed on the circuit board and avoid the light-transmitting cover from falling off easily. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic diagram of the LED packaging structure in Example 1 of the present application;

[0033] Figure 2 yes Figure 1 A magnified schematic diagram of point A in the middle;

[0034] Figure 3 Schematic diagram of the LED packaging structure in Example 2 of the present application;

[0035] Figure 4 yes Figure 3 Enlarged schematic diagram of point B in the middle.

[0036] Explanation of the accompanying drawings: 1. Circuit board; 11. First mounting surface; 12. Second mounting surface; 13. Mounting groove; 14. Through hole; 15. Connection point; 16. Annular stopper; 17. Annular limiting portion; 2. Light-emitting chip; 21. Pin; 3. Heat-conducting portion; 31. Clearance hole; 32. Insertion seam; 33. Notch; 34. Positioning end; 35. Reflective layer; 4. Translucent cover; 41. Insertion portion; 42. Translucent end; 42a. Annular protrusion; 43. Flexible insertion end; 43a. Annular groove; 5. Expansion glue; 6. Sealant. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-4 This application is described in further detail.

[0038] Example 1

[0039] The embodiment of the present application discloses an LED packaging structure. Figure 1 The LED packaging structure includes a circuit board 1, a light-emitting chip 2, a heat-conducting part 3 and a light-transmitting cover 4.

[0040] Circuit board 1 is provided with circuitry, which can be located on its surface or within its interior. Circuit board 1 has a first mounting surface 11 and a second mounting surface 12 facing each other. First mounting surface 11 is provided with a mounting slot 13, with its notch facing away from second mounting surface 12. The bottom wall of mounting slot 13 is provided with multiple through-holes 14. Second mounting surface 12 is provided with connection points 15 corresponding to through-holes 14 and electrically connected to the circuitry. In this embodiment, there are two through-holes 14 and two connection points 15.

[0041] Combine Figure 1 and Figure 2 A plurality of pins 21 are provided on the side of the light-emitting chip 2 facing away from the light-emitting surface. A heat-conducting part 3 is fixed on the side of the light-emitting chip 2 facing away from the light-emitting surface. The heat-conducting part 3 is penetrated by a clearance hole 31 for the pins 21 to pass through. The plurality of pins 21 correspond to the plurality of clearance holes 31 one by one to avoid interference between the plurality of pins 21.

[0042] The heat conducting portion 3 is mounted within the mounting groove 13. The heat conducting portion 3 and the mounting groove 13 can be connected using thermally conductive adhesive, which secures the heat conducting portion 3 while maintaining heat conduction between the heat conducting portion 3 and the circuit board 1. The clearance holes 31 of the heat conducting portion 3 are aligned with the through-holes 14 of the circuit board 1. The ends of the multiple pins 21, facing away from the light-emitting chip 2, extend through the clearance holes 31 and through-holes 14 and are electrically connected to the connection points 15, thereby achieving electrical connection between the circuit board 1 and the light-emitting chip 2 and controlling the light emission of the light-emitting chip 2.

[0043] In an optional embodiment, there may be a certain distance between the connection point 15 and the pin 21 on the circuit board 1. In this case, the pin 21 is bent and welded to the connection point 15, and the electrical connection between the circuit board 1 and the light-emitting chip 2 is also realized. At this time, the through-hole 14 needs to be sealed, for example, by filling the through-hole 14 with sealant to prevent external water and oxygen from passing through the through-hole 14 and the clearance hole 31 to damage the light-emitting chip 2.

[0044] In this embodiment, each connection point 15 is arranged in a ring shape and is located outside each through-hole 14. The pin 21 is welded to the connection point 15 to seal the through-hole 14. While the pin 21 and the connection point 15 of the light-emitting chip 2 are electrically connected by welding, the through-hole 14 can be sealed to ensure the sealing performance of the light-emitting chip 2. There is no need for additional sealing operation on the through-hole 14, which can improve the packaging efficiency.

[0045] After the heat conducting part 3 is installed in the mounting groove 13 of the circuit board 1 , a gap is provided between the inner side wall of the mounting groove 13 of the circuit board 1 and the heat conducting part 3 to form an annular insertion seam 32 .

[0046] The light-transmitting cover 4 is open at one end. The open end of the light-transmitting cover 4 is a ring-shaped plug-in portion 41 . The plug-in portion 41 is wrapped with expansion glue 5 . The plug-in portion 41 is inserted into the plug-in seam 32 . The heat generated by the light-emitting chip 2 causes the expansion glue 5 to expand to seal the plug-in seam 32 .

[0047] When the expansion glue 5 is not expanded, the plug-in portion 41 can be easily inserted into the plug-in seam 32, reducing the packaging difficulty and improving the packaging efficiency; after the expansion glue 5 is expanded, the sealing performance between the light-transmitting cover 4 and the circuit board 1 can be improved, preventing external water and oxygen from entering the light-transmitting cover 4 and corroding the LED light-emitting chip 2, thereby extending the service life of the LED lamp and improving the waterproof performance of the LED packaging structure.

[0048] In an alternative embodiment, the plug portion 41 is made of a hard material to facilitate insertion of the plug portion 41 into the insertion seam 32. In this embodiment, the plug portion 41 is made of a flexible material. When the plug portion 41 is inserted into the insertion seam 32, when the plug portion 41 collides with the heat conducting portion 3 and the circuit board 1, the stress exerted by the plug portion 41 on the heat conducting portion 3 and the circuit board 1 can be reduced, thereby minimizing damage to the heat conducting portion 3 or the circuit board 1.

[0049] The heat conducting portion 3 may be hemispherical, truncated cone-shaped, etc. It is understandable that if the angle between the insertion seam 32 and the circuit board 1 is acute or obtuse, the insertion portion 41 may deform during insertion into the insertion seam 32 , causing the heat conducting portion 3 or the circuit board 1 to rub against the expansion adhesive 5 on the insertion portion 41 , thereby making the expansion adhesive 5 on the insertion portion 41 uneven, thereby affecting the expansion sealing effect of the expansion adhesive 5 on the insertion seam 32 .

[0050] In this embodiment, the heat conducting portion 3 is cylindrical, and the insertion seam 32 is perpendicular to the circuit board 1. Inserting the insertion portion 41 into the insertion seam 32 reduces friction between the insertion portion 41, the heat conducting portion 3, and the circuit board 1, thereby minimizing movement of the expansion adhesive 5 on the insertion portion 41. This allows the expansion adhesive 5 to be evenly distributed around the insertion portion 41, improving the uniformity with which the expansion adhesive 5 fills the insertion seam 32.

[0051] The shape and size of the light emitting chip 2 in cross section can be exactly the same as those of the heat conducting part 3 in cross section. With such a configuration, when the plug-in part 41 is inserted into the plug-in seam 32 , there is friction between the plug-in part 41 and the light emitting chip 2 , which will affect the light emitting chip 2 .

[0052] In this embodiment, the orthographic projection of the light-emitting chip 2 on the heat-conducting portion 3 is located within the surface of the heat-conducting portion 3, so that when the plug-in portion 41 is inserted into the plug-in seam 32, there is a certain distance between the plug-in portion 41 and the light-emitting chip 2, thereby preventing the plug-in portion 41 from causing damage to the light-emitting chip 2, and at the same time preventing the expansion glue 5 from adhering to the light-emitting chip 2 and affecting the light emission and heat dissipation of the light-emitting chip 2.

[0053] Furthermore, an annular resisting portion 16 is provided on the first mounting surface 11 and is located on the periphery of the light-transmitting cover 4. The end of the annular resisting portion 16 away from the circuit board 1 is bent inward to form an annular limiting portion 17. The plug-in portion 41 extends to be opposite to the annular resisting portion 16, and the expansion glue 5 expands to fill the inner side of the annular resisting portion 16 and the annular limiting portion 17.

[0054] The annular resisting portion 16 and the annular limiting portion 17 are prefabricated on the circuit board 1 in advance. The annular resisting portion 16 and the annular limiting portion 17 will not affect the installation of the light-transmitting cover 4. The annular limiting portion 17 is fixed on the circuit board 1, and the expansion glue 5 expands into the annular limiting portion 17, which can increase the strength of the light-transmitting cover 4 fixed on the circuit board 1 and avoid the light-transmitting cover 4 from falling off easily.

[0055] The heat conducting portion 3 is provided with an annular notch 33 on its circumference. The number of notches 33 can be one or more, and they can be located in the middle and / or at the ends of the heat conducting portion 3. The notch 33 surrounds the heat conducting portion 3, and the expandable adhesive 5 expands to fill the notch 33. The presence of the notch 33 in the heat conducting portion 3 does not interfere with the installation of the light-transmitting cover 4. The heat conducting portion 3 is secured to the circuit board 1, and the expandable adhesive 5 fills the notch 33, securing the expandable adhesive 5 and the light-transmitting cover 4 to the heat conducting portion 3. This further strengthens the attachment of the light-transmitting cover 4 to the circuit board 1 and minimizes the risk of the light-transmitting cover 4 falling off.

[0056] The implementation principle of an LED packaging structure in an embodiment of the present application is: the heat conducting part 3 is fixed in the mounting groove 13, the pin 21 of the light-emitting chip 2 is welded to the connection point 15 of the circuit board 1, and while achieving electrical connection between the light-emitting chip 2 and the circuit board 1, the sealing of the through hole 14 on the circuit board is achieved.

[0057] The installation of the light transmissive cover 4 can be completed by inserting the plug-in portion 41 of the light transmissive cover 4 into the plug-in seam 32. The heat generated by the light-emitting chip 2 can be transferred to the circuit board 1 through the heat-conducting portion 3 for heat dissipation. The heat generated by the light-emitting chip 2 causes the expansion glue 5 to expand and fill the plug-in seam 32, and at the same time fill the inner side of the annular supporting portion 16 and the annular limiting portion 17, thereby enhancing the strength of the light transmissive cover 4 fixed on the circuit board 1. At the same time, it can improve the sealing performance between the light transmissive cover 4 and the circuit board 1, preventing external water and oxygen from entering the light transmissive cover 4 to corrode the LED light-emitting chip 2, thereby extending the service life of the LED lamp and improving the waterproof performance of the LED packaging structure.

[0058] Example 2

[0059] Combine Figure 3 and Figure 4 The difference between Example 2 and Example 1 is that the end of the heat conducting portion 3 close to the light emitting chip 2 is a positioning end 34, and the positioning end 34 is arranged in a bowl shape. The end of the positioning end 34 close to the circuit board 1 is adapted to the light emitting chip 2, which is convenient for positioning the light emitting chip 2, avoiding the situation where the installation position of the light emitting chip 2 is inconsistent, and ensuring that the light emitting angle of the light emitting chip 2 is consistent.

[0060] A reflective layer 35 is provided on the inner side wall of the positioning end 34 . The light emitted by the light emitting core is reflected on the reflective layer 35 , which can improve the concentration of the light and thus improve the brightness of the light emitting chip 2 .

[0061] The outer wall of the positioning end 34 abuts the inner wall of the light-transmitting cover 4. After the heat from the light-emitting chip 2 is transferred to the heat-conducting portion 3, the heat-conducting portion 3 transfers the heat to the circuit board 1 and the light-transmitting cover 4. Heat dissipation through the circuit board 1 and the light-transmitting cover 4 improves the heat dissipation efficiency of the light-emitting chip 2. The portion of the light-transmitting cover 4 corresponding to the positioning end 34 is made of a thermally conductive material. This facilitates heat transfer from the heat-conducting portion 3 to the light-transmitting cover 4, allowing heat exchange between the light-transmitting cover 4 and the external environment, thereby improving the heat dissipation performance of the light-emitting chip 2.

[0062] It is understood that the portion of the light-transmitting cover 4 corresponding to the positioning end 34 can be non-translucent, while the remaining portion is translucent. In this embodiment, the light-transmitting cover 4 is a spliced ​​structure. The upper portion is the light-transmitting end 42, which can be made of a translucent material such as glass or transparent plastic. The lower portion, which corresponds to the positioning end 34 and the plug-in portion 41, is integrally formed and is a flexible plug-in end 43, which can be made of a thermally conductive material such as thermal grease or flexible graphene. The light-transmitting end 42 and the flexible plug-in end 43 are connected by a sealant 6 to achieve a sealed seal.

[0063] In order to further improve the sealing performance between the light-transmitting end 42 and the flexible plug-in end 43, an annular protrusion 42a is provided on the end surface of the light-transmitting end 42 facing the flexible plug-in end 43, and the flexible plug-in end 43 is provided with an annular groove 43a that matches the annular protrusion 42a. When the light-transmitting end 42 is installed on the flexible plug-in end 43, the annular protrusion 42a is inserted into the annular groove 43a.

[0064] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An LED packaging structure, characterized in that: include: A circuit board (1), the circuit board (1) being provided with a circuit, the circuit board (1) having a first mounting surface (11) and a second mounting surface (12) facing each other, the first mounting surface (11) being provided with a mounting groove (13) with a notch facing away from the second mounting surface (12), a plurality of through-holes (14) being provided through the bottom wall of the mounting groove (13), and the second mounting surface (12) being provided with connection points (15) corresponding to the through-holes (14) and electrically connected to the circuit; A light-emitting chip (2), a heat-conducting portion (3) is fixed on the side of the light-emitting chip (2) facing away from the light-emitting surface, the heat-conducting portion (3) is installed in the installation groove (13), the circuit board (1) is provided with a gap between the inner side wall of the installation groove (13) and the heat-conducting portion (3) to form an annular plug-in seam (32), a plurality of pins (21) are provided on the side of the light-emitting chip (2) facing away from the light-emitting surface, the ends of the plurality of pins (21) away from the light-emitting chip (2) all pass through the heat-conducting portion (3), pass out from the through hole (14), and are electrically connected to the connection point (15); and a light-transmitting cover (4), which is open at one end, the open end of the light-transmitting cover (4) is an annular plug-in portion (41), the plug-in portion (41) is wrapped with an expansion glue (5), the plug-in portion (41) is inserted into the plug-in seam (32), and the expansion glue (5) expands to seal the plug-in seam (32); An annular retaining portion (16) is provided on the first mounting surface (11) and is located on the periphery of the light-transmitting cover (4). An end of the annular retaining portion (16) away from the circuit board (1) is bent inward to form an annular limiting portion (17). The plug-in portion (41) extends to face the annular retaining portion (16). The expansion glue (5) expands to fill the inner sides of the annular retaining portion (16) and the annular limiting portion (17). An annular notch (33) is provided on the peripheral surface of the heat conducting portion (3), the notch (33) surrounds the heat conducting portion (3), and the expansion glue (5) expands to fill the notch (33).

2. The LED packaging structure according to claim 1, wherein: Each of the connection points (15) is arranged in a ring shape and is located outside each of the through holes (14). The pins (21) are welded to the connection points (15) to seal the through holes (14).

3. The LED packaging structure according to claim 1, wherein: The plug-in portion (41) is made of flexible material.

4. The LED packaging structure according to claim 1, wherein: The heat conducting portion (3) is arranged in a columnar shape, and the insertion seam (32) is perpendicular to the circuit board (1).

5. The LED packaging structure according to claim 4, characterized in that: The orthographic projection of the light-emitting chip (2) on the heat-conducting portion (3) is located within the surface of the heat-conducting portion (3).

6. The LED packaging structure according to claim 1, wherein: The end of the heat conducting portion (3) close to the light emitting chip (2) is a positioning end (34), the positioning end (34) is arranged in a bowl shape, the end of the positioning end (34) close to the circuit board (1) is adapted to the light emitting chip (2), the inner side wall of the positioning end (34) is provided with a reflective layer (35), and the outer side wall of the positioning end (34) is in contact with the inner side wall of the light-transmitting cover (4).

7. The LED packaging structure according to claim 6, characterized in that: The portion of the light-transmitting cover (4) corresponding to the positioning end (34) is made of heat-conducting material.

8. A light emitting device, characterized in that: The LED packaging structure comprises the LED packaging structure according to any one of claims 1 to 7.

Images