Subboard pressing method and PCB

Abstract

The application relates to the technical field of PCBs, and discloses a sub-board pressing method and a PCB. The method comprises the following steps: providing a sub-board positioning device, wherein the sub-board positioning device comprises four positioning components arranged in a rectangular shape; each positioning component comprises a ring-shaped insulating column body provided with an arc-shaped opening; arranging the sub-boards to obtain a mother board provided with mounting grooves, wherein the mounting grooves comprise rectangular grooves and four ear groove arranged at the four corner positions of the rectangular grooves; placing the four positioning components into the ear grooves respectively, and ensuring that the center lines of the arc-shaped openings pass through the center points of the rectangular grooves, and the circumferential two ends of each arc-shaped opening are located in the rectangular grooves; loading the sub-boards into the rectangular grooves; taking out the sub-board positioning device after positioning the sub-boards and the mother board; and high-temperature pressing the sub-boards and the mother board. According to the embodiment of the application, the sub-boards can be placed in the center of the rectangular grooves with the aid of the sub-board positioning device, the delamination or short circuit phenomenon between the sub-boards and the mother board can be avoided, and the product quality is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB (Printed Circuit Board) technology, and in particular to a sub-board pressing method and a PCB. BACKGROUND

[0002] With the development of communication technology, high-frequency, high-speed signal transmission and low-loss or lossless high-efficiency transmission have become new requirements. In order to ensure that the signal loss is small and the signal distortion degree is low, low DK (low dielectric constant) and low Df (low dielectric loss tangent) materials need to be used for high-frequency and high-speed signal transmission. Although high-frequency and high-speed materials have very excellent electrical performance, they are expensive and difficult to process. In view of the fact that in most designs, only part of the layers or local areas carry high-frequency and high-speed signals, ordinary FR-4 materials and high-frequency and high-speed materials can be mixed and pressed into one whole, that is, a PCB mainly made of FR-4 materials and several sub-boards made of high-frequency and high-speed materials are pressed together. On the one hand, high-frequency and high-speed signal transmission can be realized in local areas and local layers, and on the other hand, the processing performance of the PCB can be improved.

[0003] In the processing process, the size of the mounting groove for embedding the sub-board needs to be larger than the size of the sub-board, so as to ensure that a certain gap is reserved between each side of the sub-board and the corresponding mounting groove side wall when the sub-board is centered and placed in the mounting groove, as shown in Figure 1 for the subsequent pressing process of the sub-board and the mother board. Through the flow glue, the adhesion between the sub-board and the mother board is realized.

[0004] However, in the process of placing the sub-board in the mounting groove, the sub-board is often difficult to be centered and placed, that is, a certain offset of the sub-board relative to the mother board occurs. This not only causes the gap between the side of the sub-board and the corresponding mounting groove side wall to be too small or even disappear, so that the flow glue at this position is too little or even none, thereby causing the delamination between the sub-board and the mother board, but also may cause the short circuit of the circuit board, as shown in Figure 2 delamination occurs at position A, and short circuit occurs at position B. SUMMARY

[0005] The present application aims to provide a sub-board pressing method and a PCB to solve the problem that the sub-board is easy to be offset when placed in the mounting groove provided by the mother board in the prior art.

[0006] To achieve this purpose, the present application adopts the following technical solutions:

[0007] A sub-board pressing method, comprising:

[0008] The sub-board positioning device comprises four positioning components arranged in a rectangle; each positioning component comprises a ring-shaped insulating column provided with an arc-shaped opening for a sub-board corner to be clamped, and the arc-shaped opening penetrates the top end face and the bottom end face of the ring-shaped insulating column in the axial direction and penetrates the outer side wall and the inner side wall on the same side of the ring-shaped insulating column in the radial direction;

[0009] The rowing results in a mother board provided with mounting slots, the mounting slots comprise a rectangular slot and four ear slots opened at the four corner positions of the rectangular slot and intersecting with the rectangular slot, the inner dimension of the rectangular slot is larger than the outer dimension of the sub-board, and the inner dimension of the ear slot matches the outer dimension of the ring-shaped insulating column;

[0010] First, the four positioning components are respectively placed in the ear slots, and the center line of the arc-shaped opening on the ring-shaped insulating column of each positioning component passes through the center point of the rectangular slot, and the circumferential two ends of each arc-shaped opening are located inside the rectangular slot;

[0011] Then, the sub-board is loaded into the rectangular slot;

[0012] Then, the sub-board and the mother board are positioned, and the sub-board positioning device is taken out after positioning;

[0013] Finally, the sub-board and the mother board are high-temperature pressed.

[0014] Optionally, the rectangular slot is larger than the single side of the sub-board by a first interval value in the length direction, and the rectangular slot is larger than the single side of the sub-board by a second interval value in the width direction;

[0015] The circumferential two ends of each arc-shaped opening, wherein the vertical distance from one end closest to the long side of the rectangular slot to the long side of the rectangular slot is the second interval value, and the vertical distance from one end closest to the short side of the rectangular slot to the short side of the rectangular slot is the first interval value.

[0016] Optionally, the sub-board positioning device further comprises two first fixed support rods and two second fixed support rods;

[0017] The first fixed support rod has a length smaller than the length of the rectangular slot and larger than the length of the sub-board, and the two ends are respectively fixedly connected to the two positioning components in the length direction;

[0018] The second fixed support rod has a length smaller than the width of the rectangular slot and larger than the width of the sub-board, and the two ends are respectively fixedly connected to the two positioning components in the width direction.

[0019] Optionally, the sub-board positioning device further comprises four length-adjustable support rods, and the two ends of each length-adjustable support rod are respectively fixedly connected to the two adjacent positioning components in the length / width direction.

[0020] Optionally, the end surface of each end portion is parallel to the most adjacent rectangular slot side portion.

[0021] Optionally, the height of the annular insulating column is not less than the height of the mounting slot.

[0022] Optionally, each positioning assembly further comprises a hollow conductive column abutting the inner wall of the annular insulating column, an indicator light and a power supply.

[0023] The hollow conductive column is provided with a first detection point and a second detection point distributed on the circumferential two sides of the arc-shaped opening, and a longitudinal fracture joint in the region between the first detection point and the second detection point.

[0024] The positive pole of the power supply is electrically connected to the first detection point on the hollow conductive column, the second detection point on the hollow conductive column is electrically connected to the first pin of the indicator light, and the second pin of the indicator light is electrically connected to the negative pole of the power supply.

[0025] Optionally, the sub-board pressing method further comprises: after the sub-board is loaded into the rectangular slot, identifying the on-off state of the indicator light of each positioning assembly, if at least one of the indicator lights is not extinguished, it is determined that the sub-board is not placed in the center, and the loading position of the sub-board in the rectangular slot is adjusted.

[0026] Optionally, the sub-board and the mother board are positioned by vacuum adsorption or adhesive tape.

[0027] A PCB is prepared according to the sub-board pressing method of any one of the above.

[0028] Compared with the prior art, the beneficial effects of the present application are:

[0029] The sub-board positioning device is used to assist the placement of the sub-board in the rectangular slot, so that the four side edges of the sub-board can form appropriate gaps with the side walls of the rectangular slot for the flow of glue, thereby avoiding the delamination or short circuit between the sub-board and the mother board, and effectively improving the product quality. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0031] Figure 1 A schematic view of a normal sub-board position;

[0032] Figure 2 is a schematic view of the offset of the sub-plate;

[0033] Figure 3 is a flow chart of the sub-plate pressing method provided by the embodiment one of the present application;

[0034] Figure 4 is a flow chart of the sub-plate pressing process provided by the embodiment one of the present application.

[0035] Figure 5 is a top view of the sub-plate positioning device provided by the embodiment one of the present application;

[0036] Figure 6 is a top view of the single positioning component provided by the embodiment one of the present application;

[0037] Figure 7 is a top view of the sub-plate positioning device provided by the embodiment two of the present application;

[0038] Figure 8 is a top view of the single positioning component provided by the embodiment two of the present application before and after being punctured.

[0039] Explanation of reference signs:

[0040] the mother plate 1, the rectangular slot 11, the ear slot 12, the sub-plate 2, the positioning component 3, the annular insulating column 31, the arc-shaped opening 32, the hollow conductive column 33, the indicator lamp 34, the power supply 35, the longitudinal fracture joint 36, the puncture 37, the glue flow 4, the first fixed support rod 5, the second fixed support rod 6. DETAILED DESCRIPTION

[0041] In order to make the inventive purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the following described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0042] In order to solve the problem that the sub-plate 2 is easy to be offset when being put into the installation slot of the mother plate 1, the embodiment of the present application uses a special sub-plate positioning device to control the sub-plate 2 to be in the center position in the installation slot by first installing the sub-plate positioning device in the installation slot and then installing the sub-plate 2.

[0043] Embodiment one

[0044] Please refer to Figure 3 and Figure 4 , the embodiment of the present application provides a sub-plate pressing method, which specifically comprises:

[0045] Step 101, providing a sub-board positioning device, such as Figures 5 to 6 As shown, the sub-board positioning device comprises four positioning assemblies 3 arranged in a rectangular manner; each positioning assembly 3 comprises an annular insulating column 31, and the annular insulating column 31 is provided with an arc-shaped opening 32 for angularly clamping the sub-board 2, and the arc-shaped opening 32 penetrates the top end face and the bottom end face of the annular insulating column 31 in the axial direction and penetrates the outer side wall and the inner side wall on the same side of the annular insulating column 31 in the radial direction.

[0046] It should be noted that the sub-board positioning device is used to realize the auxiliary centering positioning function of the sub-board 2 in the rectangular groove 11. The thickness of the annular insulating body is not specifically limited in this embodiment, and of course, a certain thickness value can be designed to ensure stability and reliability during use.

[0047] Step 102, arranging the boards to obtain a mother board 1 with mounting grooves, the mounting grooves comprising the rectangular groove 11 and four ear grooves 12 provided at the four corner positions of the rectangular groove 11 and communicating with the rectangular groove 11, the inner dimension of the rectangular groove 11 being greater than the outer dimension of the sub-board 2, and the inner dimension of the ear groove 12 matching the outer dimension of the annular insulating column 31.

[0048] Unlike the conventional mounting groove in a rectangular structure, the mounting groove of this embodiment is additionally provided with the ear groove 12 arranged at the four corner positions of the rectangular groove 11 for loading the annular insulating column 31, and the horizontal cross section of the ear groove 12 is a circular structure matched with the annular insulating column 31, and the ear groove 12 intersects with the rectangular groove 11.

[0049] For example, the center position of the horizontal cross section of the ear groove 12 coincides with the corresponding corner vertex of the rectangular groove 11, at this time, one quarter of the ear groove 12 falls into the rectangular groove 11. Alternatively, the center position of the horizontal cross section of the ear groove 12 does not coincide with the corresponding corner vertex of the rectangular groove 11 and is located outside the rectangular groove 11, at this time, less than one quarter of the ear groove 12 falls into the rectangular groove 11.

[0050] It should be noted that the specific relative position between the ear groove 12 and the rectangular groove 11 is not specifically limited in the embodiment of the present application, as long as the arc-shaped opening 32 part of the annular insulating column 31 is located in the rectangular groove 11 when the annular insulating column 31 is loaded into the ear groove 12.

[0051] In addition, the ear groove 12 can be made by drilling or milling and other conventional methods.

[0052] Step 103, placing the four positioning assemblies 3 into the respective ear grooves 12, and ensuring that the center line of the arc-shaped opening 32 on the annular insulating column 31 of each positioning assembly 3 passes through the center point of the rectangular groove 11, and the circumferential two ends of each arc-shaped opening 32 are located inside the rectangular groove 11.

[0053] In this step, after the positioning assembly 3 is placed into the ear slot 12 in the above manner, since the center lines of the four arc-shaped openings 32 all pass through the center point of the rectangular slot 11, the four arc-shaped openings 32 are arranged in central symmetry around the center point of the rectangular slot 11; based on this, the four arc-shaped openings 32 can cooperate to form a clamping slot that is slightly smaller than a single side of the rectangular slot 11, and is equal to or slightly larger than a single side of the sub-board 2.

[0054] Step 104, place the sub-board 2 into the rectangular slot 11.

[0055] In the case where the clamping slot formed by the four arc-shaped openings 32 is equal to the sub-board 2, when the sub-board 2 is placed into the rectangular slot 11 in the vertical direction, the four corners of the sub-board 2 will be respectively clamped into the corresponding arc-shaped openings 32, and the four corners will be tightly clamped with the corresponding arc-shaped openings 32, so that the sub-board 2 is in an absolutely centered position.

[0056] Suppose that the rectangular slot 11 is larger than a single side of the sub-board 2 by a first interval value in the length direction, and is larger than a single side of the sub-board 2 by a second interval value in the width direction; based on this, in order to control the clamping slot formed by the four arc-shaped openings 32 to be equal to the sub-board 2, the arc-shaped openings 32 can be designed as follows: at the circumferential two ends of each arc-shaped opening 32, the vertical distance from one end closest to the long side of the rectangular slot 11 to the long side of the rectangular slot 11 is the second interval value, and the vertical distance from one end closest to the short side of the rectangular slot 11 to the short side of the rectangular slot 11 is the first interval value.

[0057] In the case where the clamping slot formed by the four arc-shaped openings 32 is slightly larger than a single side of the sub-board 2, when the sub-board 2 is placed into the rectangular slot 11 in the vertical direction, the four corners of the sub-board 2 will be respectively clamped into the corresponding arc-shaped openings 32, but at least part of the corners will not be completely clamped with the corresponding arc-shaped openings 32.

[0058] Similarly, suppose that the rectangular slot 11 is larger than a single side of the sub-board 2 by a first interval value in the length direction, and is larger than a single side of the sub-board 2 by a second interval value in the width direction; based on this, in order to control the clamping slot formed by the four arc-shaped openings 32 to be slightly larger than a single side of the sub-board 2, the arc-shaped openings 32 can be designed as follows: at the circumferential two ends of each arc-shaped opening 32, the vertical distance from one end closest to the long side of the rectangular slot 11 to the long side of the rectangular slot 11 is slightly smaller than the second interval value, and the vertical distance from one end closest to the short side of the rectangular slot 11 to the short side of the rectangular slot 11 is slightly smaller than the first interval value.

[0059] It should be noted that, whether the four corners of the sub-board 2 are all clamped with the corresponding arc-shaped opening 32, due to the limiting effect of the arc-shaped opening 32, the safe space of the sub-board 2 in the rectangular groove 11 can be reduced to a certain extent, compared with the conventional way of directly putting the sub-board 2 into the rectangular groove 11, the probability and degree of the sub-board 2 being deviated can be effectively reduced, and it is ensured that the four side edges of the sub-board 2 and the side walls of the rectangular groove 11 can realize a gap filled with the flow glue 4, thereby avoiding the delamination or short circuit phenomenon between the sub-board 2 and the mother board 1.

[0060] Step 105, position the sub-board 2 and the mother board 1, and take out the sub-board positioning device after positioning.

[0061] Since the positioning assembly 3 may be clamped with the sub-board 2, directly taking out the positioning assembly 3 may take out the sub-board 2 or deviate the sub-board 2, therefore, the present application is implemented by first positioning the sub-board 2 and the mother board 1, and then separately taking out the sub-board positioning device.

[0062] For example, the sub-board 2 and the mother board 1 can be positioned by vacuum adsorption. When vacuum adsorption is used, the mother board 1 with the sub-board positioning device and the sub-board 2 can be placed on a vacuum adsorption table, and the vacuum adsorption area covers at least the periphery of the mounting groove of the mother board 1; after the vacuum adsorption function is turned on, the sub-board 2 and the mother board 1 are fixed by vacuum adsorption and cannot be moved, and each positioning assembly 3 of the sub-board positioning device cannot be adsorbed by vacuum due to the hollow structure of the annular insulating column 31, and can be easily taken out under the action of external force.

[0063] Alternatively, the sub-board 2 and the mother board 1 can be positioned by adhesive tape. At this time, the sub-board 2 and the mother board 1 are fixed by adhesive tape, and the adhesive tape does not fix the sub-board positioning device, so the sub-board positioning device can be easily taken out under the action of external force.

[0064] Step 106, high-temperature pressing of the sub-board 2 and the mother board 1.

[0065] In this step, since the sub-board 2 is placed relatively centrally in the rectangular groove 11, there is a certain gap between the periphery of the sub-board 2 and the side wall of the rectangular groove 11, therefore, in the high-temperature pressing process, the semi-cured sheet on the periphery of the rectangular groove 11 will melt to form flow glue 4 flowing into the gap to bond the sub-board 2 and the mother board 1 at each position, thereby avoiding delamination; at the same time, since the sub-board 2 is placed relatively centrally in the rectangular groove 11, the inner and outer layers of the sub-board 2 will not be deviated relative to the mother board 1, therefore, short circuit phenomenon can be effectively avoided.

[0066] In summary, the embodiment of the present application can realize the center placement of the sub-plate 2 in the rectangular groove 11 with the aid of the sub-plate positioning device, ensure that the four side edges of the sub-plate 2 can be filled with the gap of the flowable glue 4 with a proper size between the side walls of the rectangular groove 11, and further avoid the delamination or short circuit phenomenon between the sub-plate 2 and the mother plate 1, thereby effectively improving the product quality.

[0067] In an alternative embodiment, the sub-plate positioning device further comprises two first fixed support rods 5 and two second fixed support rods 6; the first fixed support rod 5 has a length smaller than the length of the rectangular groove 11 and larger than the length of the sub-plate 2, and both ends are fixedly connected to two positioning components 3 in the length direction; the second fixed support rod 6 has a length smaller than the width of the rectangular groove 11 and larger than the width of the sub-plate 2, and both ends are fixedly connected to two positioning components 3 in the width direction. Based on this, the four positioning components 3 can be connected to form a frame structure matching the size of the mounting groove through the four fixed support rods, which is helpful to accurately place the entire sub-plate positioning device into the mounting groove in the disassembly and assembly process, without the need to individually adjust the installation direction of each positioning component 3 in the ear groove 12, and is also helpful to integrally take out the entire sub-plate positioning device from the mounting groove, without the need to individually take out each positioning component 3, thereby greatly improving the work efficiency.

[0068] In another alternative embodiment, in order to improve the versatility of the sub-plate positioning device for mounting grooves with different sizes, the sub-plate positioning device further comprises four length-adjustable support rods, and both ends of each length-adjustable support rod are fixedly connected to two adjacent positioning components 3 in the length / width direction. Based on this, the four positioning components 3 can be connected to form a frame structure matching the size of various mounting grooves through the four length-adjustable support rods, which is convenient for overall disassembly and assembly.

[0069] Meanwhile, the height of the annular insulating column 31 is not limited, which can be smaller than, equal to, or larger than the height of the mounting groove. When the height of the annular insulating column 31 is larger than the height of the mounting groove, the annular insulating column 31 can be directly pulled out without the aid of external tools, which is more convenient for disassembly and assembly.

[0070] Since the arc-shaped opening 32 is used for clamping the corner of the sub-plate 2, the corner of the sub-plate 2 may come into contact or collision with the circumferential two ends of the arc-shaped opening 32 during the assembly of the sub-plate 2. Therefore, in order to avoid damage to the corner of the sub-plate 2 caused by the arc-shaped opening 32 and improve the reliability and stability of the clamping of the corner of the sub-plate 2 with the arc-shaped opening 32, the end face of each end of the circumferential two ends of the arc-shaped opening 32 is parallel to the edge of the rectangular groove 11 closest to it. In this way, the axial two ends of the arc-shaped opening 32 can be in plane contact with the corner of the sub-plate 2.

[0071] Embodiment two

[0072] Please refer toFigure 7 On the basis of the positioning assembly 3 provided in embodiment one, each positioning assembly 3 in embodiment two further comprises: a hollow conductive column 33 attached to the inner wall of the annular insulating column 31, an indicator light 34 and a power supply 35;

[0073] The hollow conductive column 33 is provided with: a first detection point and a second detection point distributed on the two sides of the arc-shaped opening 32, and a longitudinal fracture gap 36 located in the region between the first detection point and the second detection point;

[0074] The positive electrode of the power supply 35 is electrically connected to the first detection point on the hollow conductive column 33, the second detection point on the hollow conductive column 33 is electrically connected to the first pin of the indicator light 34, and the second pin of the indicator light 34 is electrically connected to the negative electrode of the power supply 35.

[0075] The hollow conductive column 33 is made of any material with conductive function, certain self-supporting ability and relatively thin thickness, such as copper foil or copper mesh. Since the hollow conductive column 33 is attached to the inner wall of the annular insulating column 31 and has relatively thin thickness, when the corner of the sub-board 2 is clamped into the arc-shaped opening 32, the part of the hollow conductive column 33 located at the corresponding position of the arc-shaped opening 32 can be pierced by the corner of the sub-board 2, resulting in the formation of a piercing hole 37 in the hollow conductive column 33 which is basically consistent with the shape and size of the arc-shaped opening 32, as shown in Figure 8 .

[0076] Unlike embodiment one, embodiment two of the present application constructs a detection loop unit composed of the power supply 35, the hollow conductive column 33 and the indicator light 34 in each positioning assembly 3, which can be used to identify whether the hollow conductive column 33 has been pierced by the corner of the sub-board 2 and display the identification result through the on-off state of the indicator light 34.

[0077] In the case that the corner of the sub-board 2 pierces the hollow conductive column 33 by passing through the arc-shaped opening 32, the piercing hole 37 and the longitudinal fracture gap 36 will divide the hollow conductive column 33 into two independent and disconnected parts, at this time the first detection point and the second detection point arranged on the two parts cannot be electrically connected, so that the detection loop unit of the present positioning assembly 3 is in a non-conductive state, and the indicator light 34 is off;

[0078] In the case that the corner of the sub-board 2 fails to pierce the hollow conductive column 33 by passing through the arc-shaped opening 32, there is no piercing hole 37 on the hollow conductive column 33, only the longitudinal fracture gap 36, and the hollow conductive column 33 remains in an integrated state, at this time the first detection point and the second detection point arranged at intervals are electrically connected through the conductive material of the hollow conductive column 33 itself, so that the detection loop unit of the present positioning assembly 3 is in a conductive state, and the indicator light 34 is on.

[0079] Based on this, after the sub-plate 2 is loaded into the rectangular slot 11, the on-off state of the indicator light 34 of each positioning assembly 3 is identified, if at least one indicator light 34 is not turned off, it is determined that the sub-plate 2 is not placed in the center, and the loading position of the sub-plate 2 in the rectangular slot 11 is adjusted.

[0080] In summary, the second embodiment realizes the function of identifying whether the sub-plate 2 is placed in the center, and the staff can immediately identify the sub-plate 2 which is not placed in the center after loading the sub-plate 2, and then fine-tune the position of the sub-plate 2 to ensure the final product quality.

[0081] Embodiment three

[0082] The third embodiment of the present application provides a PCB, which is prepared according to the sub-plate pressing method described in the first or second embodiment. Since the unconventional sub-plate pressing method is adopted, the sub-plate 2 can be placed in the center of the rectangular slot 11, and therefore the finally prepared PCB has high quality and does not have the delamination or short-circuit defect caused by the sub-plate 2 deviation.

[0083] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method of pressing a daughter board, characterized by, include: A sub-board positioning device is provided, the sub-board positioning device comprising four positioning components arranged in a rectangle; each positioning component comprises an annular insulating column, the annular insulating column having an arc-shaped opening for the sub-board corner to be engaged, and the arc-shaped opening penetrating the top and bottom surfaces of the annular insulating column axially and penetrating the outer and inner sidewalls of the annular insulating column on the same side radially. The assembly yields a mother plate with mounting grooves, the mounting grooves including rectangular grooves and four ear grooves located at the four corners of the rectangular grooves and intersecting with the rectangular grooves. The inner dimension of the rectangular groove is larger than the outer dimension of the daughter plate, and the inner dimension of the ear grooves matches the outer dimension of the annular insulating column. First, place the four positioning components into the respective ear slots, ensuring that the center line of the arc-shaped opening on the annular insulating column of each positioning component passes through the center point of the rectangular slot, and that both ends of the circumferential direction of each arc-shaped opening are located inside the rectangular slot. Then, the sub-plate is inserted into the rectangular groove; Then the sub-board and the motherboard are positioned, and the sub-board positioning device is removed after positioning. Finally, the sub-board and the motherboard are pressed together at high temperature.

2. The sub-board pressing method according to claim 1, wherein The rectangular groove along the length direction is larger than one side of the sub-plate by a first spacing value, and the rectangular groove along the width direction is larger than one side of the sub-plate by a second spacing value; For each arc-shaped opening, the vertical distance from the end closest to the long side of the rectangular slot to the long side of the rectangular slot is the second spacing value, and the vertical distance from the end closest to the short side of the rectangular slot to the short side of the rectangular slot is the first spacing value.

3. The sub-panel pressing method according to claim 1, wherein The sub-plate positioning device further includes: two first fixed support rods and two second fixed support rods; The first fixed support rod has a length less than the length of the rectangular groove and greater than the length of the sub-plate, and its two ends are respectively fixedly connected to two positioning components in the length direction; The second fixed support rod has a length less than the width of the rectangular groove and greater than the width of the sub-plate, and its two ends are respectively fixedly connected to two positioning components in the width direction.

4. The sub-board pressing method according to claim 1, wherein The sub-plate positioning device also includes four length-adjustable support rods, with each length-adjustable support rod having two adjacent positioning components fixedly connected to its two ends in the length / width direction.

5. The sub-plate pressing method according to claim 1, characterized in that, At both ends of the arc-shaped opening, the end face of each end is parallel to the edge of its nearest rectangular groove.

6. The sub-plate pressing method according to claim 1, characterized in that, The height of the annular insulating column is not less than the height of the mounting groove.

7. The sub-plate pressing method according to claim 1, characterized in that, Each of the positioning components further includes: a hollow conductive column that is attached to the inner wall of the annular insulating column, an indicator light, and a power supply; The hollow conductive column is provided with: a first detection point and a second detection point distributed on both sides of the arc-shaped opening, and a longitudinal fracture crack located in the area between the first detection point and the second detection point. The positive terminal of the power supply is electrically connected to the first detection point on the hollow conductive cylinder, the second detection point on the hollow conductive cylinder is electrically connected to the first pin of the indicator light, and the second pin of the indicator light is electrically connected to the negative terminal of the power supply.

8. The sub-plate pressing method according to claim 7, characterized in that, The sub-board pressing method further includes: after the sub-board is installed in the rectangular groove, identifying the on / off state of the indicator lights of each positioning component; if at least one indicator light is not off, it is determined that the sub-board is not centered, and the placement position of the sub-board in the rectangular groove is adjusted.

9. The sub-plate pressing method according to claim 1, characterized in that, The sub-board and the motherboard are positioned using vacuum adsorption or adhesive tape.

10. A PCB, characterized in that, The PCB is manufactured according to the sub-board lamination method according to any one of claims 1 to 9.

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