A high-integration frequency voltage converter using thin-film hybrid integrated circuit technology

Abstract

The present invention relates to the technical field of high-integration frequency voltage converters, and specifically to a high-integration frequency voltage converter using a thin-film hybrid integrated circuit process, comprising: a packaging shell, a fixing groove is provided on the top of the packaging shell; a fixing frame, a first through groove is provided on the surface of the fixing frame, a connecting plate is provided at the bottom of the first through groove, a lifting plate is provided at the bottom of the connecting plate, a groove is provided on the surface of the lifting plate, a plug-in rod is provided at the bottom of the lifting plate, and a spring is provided on the surface of the plug-in rod; and a second extension plate is provided at the bottom of the packaging shell; the beneficial effect is: the packaging shell proposed by the present invention has a fixing groove provided inside, a thin film resistor is fixed on the top of the fixing frame, the lifting plate is moved so that the lifting plate is located at the bottom of the packaging shell, the fixing frame is fixed in the fixing groove, the lifting plate is rotated around a rotating shaft, the end of the plug-in rod is plugged into the plug-in hole, and the second extension plate is plugged into the groove, and the sliding groove is moved so that the fixing rod is plugged into the fixing hole.

Description

Technical Field

[0001] The present invention relates to the technical field of high-integration frequency voltage converters, and in particular to a high-integration frequency voltage converter using a thin-film hybrid integrated circuit process. Background Art

[0002] In recent years, microelectronics technology has been developing rapidly, and its importance in electronic equipment and daily industrial production has become increasingly important, and its scope of application has become increasingly wide. The function of frequency / voltage converter is to convert frequency signals into voltage signals. In daily life and work, frequency / voltage conversion is needed in more and more places, such as measuring motor speed, frequency monitoring, data acquisition, etc.

[0003] Most of the existing frequency / voltage converters are made of printed circuit board technology, which has low integration and large size. Thin-film hybrid integrated circuit technology is used to integrate the waveform conversion circuit, frequency / voltage conversion circuit, and filter circuit on a small piece of microcrystalline glass substrate to achieve frequency / voltage conversion;

[0004] However, when the thin film resistor is fixed inside the package shell by the adhesive film, since the thin film resistor needs to be fixed inside the package shell, it is easy to cause the thin film resistor to wrinkle when fixed in a narrow space, which affects the operation of the thin film resistor. Summary of the invention

[0005] The object of the present invention is to provide a high-integration frequency voltage converter using a thin film hybrid integrated circuit process to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a highly integrated frequency voltage converter using a thin film hybrid integrated circuit process, comprising:

[0007] A packaging shell, wherein a fixing groove is provided on the top of the packaging shell;

[0008] A fixing frame, a first through slot is formed on the surface of the fixing frame, a connecting plate is provided at the bottom of the first through slot, a lifting plate is provided at the bottom of the connecting plate, a slot is formed on the surface of the lifting plate, a plug rod is provided at the bottom of the lifting plate, and a spring is provided on the surface of the plug rod; and

[0009] The second extension plate is arranged at the bottom of the packaging shell.

[0010] Preferably, a glue film and microcrystalline glass are provided on the top of the packaging shell, a shell lead is inserted into the inside of the packaging shell, the top of the shell lead is connected to a gold wire, the other end of the gold wire is connected to an integrated circuit chip, a thin film resistor is provided on the top of the microcrystalline glass and the glue film, and a chip-mounted resistor and capacitor, a conductive glue and an insulating protective layer are provided on the top of the thin film resistor.

[0011] Preferably, a second through slot is provided inside the fixing slot, a lifting plate is inserted into the fixing slot, the lifting plate can move up and down in the fixing slot, a connecting plate is hinged to the top of the lifting plate through a rotating shaft, and the connecting plate can rotate around the rotating shaft at the top of the lifting plate.

[0012] Preferably, a fixing hole is provided inside the connecting plate, a fixing frame is installed on the top of the connecting plate, a first through groove is provided on the surface of the fixing frame, the size of the fixing frame is consistent with the groove size in the fixing groove, and the fixing frame can be fixed in the fixing groove.

[0013] Preferably, a plug hole is provided at the bottom of the packaging shell, a plug board is installed at the bottom of the lifting plate, a plug rod is plugged into the plug board, and the plug rod can move in the plug board, one end of the spring is connected to the end of the plug rod, and the other end is connected to the surface of the plug board.

[0014] Preferably, a hole is formed on the surface of the second extension plate, the diameter of the hole on the surface of the second extension plate is consistent with the diameter of the end of the plug-in rod, and the end of the plug-in rod can be plugged into the hole on the surface of the second extension plate.

[0015] Preferably, the diameter of the plug hole is consistent with the diameter of the end of the plug rod, the end of the plug rod can be plugged into the plug hole, and a rubber pad is provided on the end surface of the plug rod.

[0016] Preferably, a first extension plate is provided at the bottom of the packaging shell, and a sliding groove is provided inside the first extension plate.

[0017] Preferably, a sliding block is provided in the slide groove, the sliding block can move in the slide groove, and the sliding block will not fall off from the slide groove.

[0018] Preferably, a fixing rod is inserted into the surface of the sliding block, a spring is arranged at the end of the fixing rod, and the spring is located inside the sliding block.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The packaging shell proposed by the present invention is provided with a fixing groove inside, the thin film resistor is fixed on the top of the fixing frame, the lifting plate is moved so that the lifting plate is located at the bottom of the packaging shell, the fixing frame is fixed in the fixing groove, the lifting plate is rotated around the rotating shaft, the end of the plug-in rod is plugged into the plug-in hole, and the second extension plate is plugged into the slot, the slide groove is moved so that the fixing rod is plugged into the fixing hole, the lifting plate is fixed, the fixing frame is fixed in the fixing groove, the thin film resistor is fixed in the fixing groove, so that the thin film resistor is conveniently fixed on the top of the fixing frame when the fixing frame extends out of the fixing groove, and the fixing frame is retracted into the fixing groove after fixing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the side structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the three-dimensional structure of the packaging shell of the present invention;

[0023] Figure 3 It is a schematic diagram of the cross-sectional three-dimensional structure of the packaging shell of the present invention;

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the packaging shell of the present invention when viewed from above;

[0025] Figure 5 for Figure 3 A magnified three-dimensional schematic diagram of the structure at center A;

[0026] Figure 6 for Figure 4 The enlarged three-dimensional schematic diagram of the structure at B in the middle;

[0027] Figure 7 It is a schematic diagram of the process flow of the present invention.

[0028] In the figure: packaging shell 1, thin film resistor 2, shell lead 3, adhesive film 4, gold wire 5, microcrystalline glass 6, integrated circuit chip 7, chip-mounted resistor and capacitor 8, insulating protection layer 9, conductive adhesive 10, fixing frame 11, first through groove 12, fixing groove 13, lifting plate 14, slot 15, second through groove 16, plug hole 17, first extension plate 18, connecting plate 19, fixing hole 20, second extension plate 21, plug board 22, spring 23, plug rod 24, fixing rod 25, slider 26, slide groove 27. DETAILED DESCRIPTION

[0029] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] For the purpose of simplicity and illustration, the principles of the embodiments are mainly described by reference to examples. In the following description, many specific details are proposed to provide a thorough understanding of the embodiments. However, it is obvious that for those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and structures are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments can be used in combination with each other.

[0033] See also Figures 1 to 7 The present invention provides a technical solution: a high-integration frequency voltage converter using a thin-film hybrid integrated circuit process, comprising: a package shell 1, a fixing groove 13 is opened on the top of the package shell 1, a glue film 4 and a microcrystalline glass 6 are arranged on the top of the package shell 1, a shell lead 3 is inserted into the inside of the package shell 1, a gold wire 5 is connected to the top of the shell lead 3, and the other end of the gold wire 5 is connected to the integrated circuit chip 7, a thin film resistor 2 is arranged on the top of the microcrystalline glass 6 and the glue film 4, and a chip mounted resistor and capacitor 8, a conductive glue 10 and an insulating protective layer are arranged on the top of the thin film resistor 2 9, a second through slot 16 is provided inside the fixing slot 13, a lifting plate 14 is inserted into the fixing slot 13, the lifting plate 14 can move up and down in the fixing slot 13, a connecting plate 19 is hinged on the top of the lifting plate 14 through a rotating shaft, the connecting plate 19 can rotate around the rotating shaft on the top of the lifting plate 14, a fixing hole 20 is provided inside the connecting plate 19, a fixing frame 11 is installed on the top of the connecting plate 19, a first through slot 12 is provided on the surface of the fixing frame 11, the size of the fixing frame 11 is consistent with the slot size in the fixing slot 13, and the fixing frame 11 can be fixed in the fixing slot 13;

[0034] A fixing frame 11, a first through slot 12 is provided on the surface of the fixing frame 11, a connecting plate 19 is provided at the bottom of the first through slot 12, a lifting plate 14 is provided at the bottom of the connecting plate 19, a slot 15 is provided on the surface of the lifting plate 14, a plug rod 24 is provided at the bottom of the lifting plate 14, and a spring 23 is provided on the surface of the plug rod 24;

[0035] The second extension plate 21 is arranged at the bottom of the encapsulation shell 1, and the bottom of the encapsulation shell 1 is provided with a plug hole 17. The bottom of the lifting plate 14 is provided with a plug board 22, and the plug rod 24 is plugged into the plug board 22, and the plug rod 24 can move in the plug board 22. One end of the spring 23 is connected to the end of the plug rod 24, and the other end is connected to the surface of the plug board 22. A hole is provided on the surface of the second extension plate 21, and the diameter of the hole on the surface of the second extension plate 21 is consistent with that of the end of the plug rod 24. The end of the plug rod 24 can be plugged into the hole on the surface of the second extension plate 21. In the embodiment, the diameter of the plug hole 17 is consistent with the diameter of the end of the plug rod 24, and the end of the plug rod 24 can be plugged into the plug hole 17. A rubber pad is provided on the end surface of the plug rod 24. A first extension plate 18 is provided at the bottom of the packaging shell 1. A slide groove 27 is provided inside the first extension plate 18. A slider 26 is provided in the slide groove 27. The slider 26 can move in the slide groove 27, and the slider 26 will not fall off from the slide groove 27. A fixing rod 25 is plugged into the surface of the slider 26. A spring is provided at the end of the fixing rod 25, and the spring is located inside the slider 26.

[0036] The present invention proposes to integrate an operational amplifier chip, a frequency / voltage conversion chip, a chip-mounted resistor, and a chip-mounted capacitor onto a small piece of microcrystalline glass through thin-film hybrid integrated circuit technology, and then integrate the microcrystalline glass into a housing. The function of the frequency / voltage converter assembled using a printed circuit board assembly process is exactly the same, but the device volume is much smaller than the frequency / voltage converter assembled using a printed circuit board. The circuit design adopts a waveform shaping circuit, a frequency / voltage conversion circuit, and a filtering circuit. The accuracy is much higher than similar products on the market, and the device is fully metal sealed, and the applicable temperature range is also much higher than ordinary products.

[0037] A fixing groove 13 is provided inside the packaging shell 1, and the thin film resistor 2 is fixed on the top of the fixing frame 11. The lifting plate 14 is moved so that the lifting plate 14 is located at the bottom of the packaging shell 1, and the fixing frame 11 is fixed in the fixing groove 13. The lifting plate 14 is rotated around the rotating shaft, and the end of the plug-in rod 24 is inserted into the plug-in hole 17, and the second extension plate 21 is inserted into the slot 15. The slide groove 27 is moved so that the fixing rod 25 is inserted into the fixing hole 20, and the lifting plate 14 is fixed, so that the fixing frame 11 is fixed in the fixing groove 13, and the thin film resistor 2 is fixed in the fixing groove 13, so that when the fixing frame 11 extends out of the fixing groove 13, it is convenient to fix the thin film resistor 2 on the top of the fixing frame 11, and the fixing frame 11 is retracted into the fixing groove 13 after fixing.

[0038] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. A high-integration frequency voltage converter using thin-film hybrid integrated circuit technology, characterized in that: The high-integrated frequency voltage converter using thin-film hybrid integrated circuit technology includes: A packaging shell (1), wherein a fixing groove (13) is provided on the top of the packaging shell (1); A fixing frame (11), a first through slot (12) is provided on the surface of the fixing frame (11), a connecting plate (19) is provided at the bottom of the first through slot (12), a lifting plate (14) is provided at the bottom of the connecting plate (19), a slot (15) is provided on the surface of the lifting plate (14), a plug-in rod (24) is provided at the bottom of the lifting plate (14), and a spring (23) is provided on the surface of the plug-in rod (24); and The second extension plate (21) is arranged at the bottom of the packaging shell (1), and a second through groove (16) is opened inside the fixing groove (13). The lifting plate (14) is inserted into the fixing groove (13), and the lifting plate (14) can move up and down in the fixing groove (13). The top of the lifting plate (14) is hinged with a connecting plate (19) through a rotating shaft, and the connecting plate (19) can rotate around the rotating shaft at the top of the lifting plate (14).

2. A high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 1, characterized in that: The top of the packaging shell (1) is provided with an adhesive film (4) and microcrystalline glass (6); a shell lead (3) is inserted into the interior of the packaging shell (1); the top of the shell lead (3) is connected to a gold wire (5); the other end of the gold wire (5) is connected to an integrated circuit chip (7); a thin film resistor (2) is provided on the top of the microcrystalline glass (6) and the adhesive film (4); and a chip mounted resistor and capacitor (8), a conductive adhesive (10) and an insulating protective layer (9) are provided on the top of the thin film resistor (2).

3. The high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 2, characterized in that: A fixing hole (20) is provided inside the connecting plate (19), a fixing frame (11) is installed on the top of the connecting plate (19), a first through groove (12) is provided on the surface of the fixing frame (11), the size of the fixing frame (11) is consistent with the size of the groove in the fixing groove (13), and the fixing frame (11) can be fixed in the fixing groove (13).

4. The high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 3, characterized in that: The bottom of the packaging shell (1) is provided with a plug hole (17), the bottom of the lifting plate (14) is provided with a plug board (22), a plug rod (24) is plugged into the plug board (22), and the plug rod (24) can move in the plug board (22), one end of the spring (23) is connected to the end of the plug rod (24), and the other end is connected to the surface of the plug board (22).

5. The high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 4, characterized in that: The surface of the second extension plate (21) is provided with a hole, the diameter of the hole on the surface of the second extension plate (21) is consistent with the end of the plug-in rod (24), and the end of the plug-in rod (24) can be plugged into the hole on the surface of the second extension plate (21).

6. The high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 5, characterized in that: The diameter of the plug hole (17) is consistent with the diameter of the end of the plug rod (24), the end of the plug rod (24) can be plugged into the plug hole (17), and a rubber pad is provided on the end surface of the plug rod (24).

7. A high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 6, characterized in that: A first extension plate (18) is provided at the bottom of the packaging shell (1), and a sliding groove (27) is provided inside the first extension plate (18).

8. The high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 7, characterized in that: A slider (26) is arranged in the slide groove (27). The slider (26) can move in the slide groove (27) and the slider (26) will not fall off from the slide groove (27).

9. The high-integration frequency voltage converter using thin-film hybrid integrated circuit technology according to claim 8, characterized in that: A fixing rod (25) is inserted into the surface of the sliding block (26), and a spring is arranged at the end of the fixing rod (25), and the spring is located inside the sliding block (26).

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