Electronic devices including patch antennas and coil antennas

Abstract

According to various embodiments of the present disclosure, an electronic device may include: a first layer including a first antenna having a patch shape and a second antenna surrounding the first antenna and having a coil shape; a second layer including a first pattern and a second pattern, the first pattern being disposed at a position corresponding to the first antenna and acting as a ground for the first antenna, the second pattern being electrically connected to the second antenna; a dielectric material disposed between the first layer and the second layer; and a magnetic material disposed below the dielectric material at a position corresponding to the second antenna.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to electronic devices including patch antennas and coil antennas. Background Technology

[0002] Recently released electronic devices support technologies that use coils to transmit power or data via magnetic induction, enabling the provision of various services to users. For example, electronic devices can wirelessly send or receive power according to wireless charging standards defined by organizations such as the Wireless Power Association (WPC) and the Wireless Power Alliance (A4WP), and can transmit data using technologies such as Magnetic Secure Transfer (MST) and Near Field Communication (NFC).

[0003] Specifically, in order to transmit power and / or data, electronic devices typically include multiple coils mounted on a flexible printed circuit board (FPCB) and optimized for wireless charging, MST, and NFC technologies.

[0004] Furthermore, recent electronic devices may include ultra-wideband (UWB) antennas for positioning and / or broadband communication. UWB antennas typically perform communication in the 6 to 9 GHz high-frequency band, and therefore employ patch antennas. Summary of the Invention

[0005] Technical issues

[0006] Recently released mobile terminals are equipped with various technologies such as UWB, WPC, MST, and NFC, and to support these technologies, it is necessary to implement patches and corresponding coil patterns in the electronic device. However, due to the limited installation space in mobile terminals, all or some of the patches or coils used for wireless communication may overlap each other. Since all these coils are made of conductors, interference can occur between them, and despite this interference, the radiators used to achieve the desired efficiency, or the magnetic or dielectric materials used with the radiators, are relatively expensive.

[0007] In addition, the size of each pattern can be reduced to prevent overlap between patterns, and some performance degradation may occur due to the use of magnetic materials that meet all the characteristics of the coil patterns set.

[0008] Specifically, for UWB to effectively perform its positioning function, at least three patches arranged horizontally and vertically are required. For positioning, the spacing between the patches must correspond to half the target wavelength. Therefore, since the UWB antenna module and coil antenna module require a very wide installation space from the mobile terminal's perspective, a mounting method is needed to minimize overlap between them.

[0009] Solution to the problem

[0010] An electronic device according to various embodiments of the present disclosure may include: a first layer including a first antenna having a patch shape and a second antenna surrounding the first antenna and having a coil shape; a second layer including a first pattern and a second pattern, the first pattern being disposed at a position corresponding to the first antenna and configured to act as a ground for the first antenna, the second pattern being electrically connected to the second antenna; a dielectric material disposed between the first layer and the second layer; and a magnetic material disposed below the dielectric at a position corresponding to the second antenna.

[0011] Electronic devices according to various embodiments of the present disclosure may include a housing providing a receiving space in which electronic components are disposed, wherein the housing includes a first receiving space, a first coil antenna in a region inside the housing other than the first receiving space, and an antenna module disposed in the first receiving space. The antenna module may include: a first layer including a first antenna having a patch shape and a second antenna surrounding the first antenna and having a coil shape; a second layer including a first pattern and a second pattern, the first pattern being disposed at a position corresponding to the first antenna and configured to act as a ground for the first antenna, the second pattern being electrically connected to the second antenna; a dielectric material disposed between the first layer and the second layer; and a magnetic material disposed below the dielectric at a position corresponding to the second antenna.

[0012] Beneficial effects of the present invention

[0013] According to various embodiments of this disclosure, a wireless charging coil can be implemented in an electronic device including wireless charging functionality by using a linear coil. Furthermore, for various patterned antennas, antenna performance can be improved by using magnetic materials suitable for each characteristic.

[0014] According to various embodiments of this disclosure, freedom in designing antenna patterns can be ensured.

[0015] The effects that can be obtained through the various embodiments disclosed herein are not limited to those described above, and other effects not described above will be clearly understood by those skilled in the art to which this disclosure pertains. Attached Figure Description

[0016] Figure 1a This is a front perspective view of a mobile electronic device according to an embodiment.

[0017] Figure 1b This is a perspective view of the rear surface of an electronic device according to an embodiment.

[0018] Figure 2 This is an exploded perspective view showing the state in which a coil supporting wireless communication technology is installed in an electronic device according to an embodiment.

[0019] Figure 3 This is an exploded plan view of an electronic device including an antenna module and a coil antenna according to an embodiment.

[0020] Figure 4 This is a perspective view of an antenna module including a first antenna and a second antenna according to an embodiment.

[0021] Figure 5 This is a cross-sectional view of the antenna module according to an embodiment.

[0022] Figure 6 This is a view showing the first layer of the antenna module according to an embodiment.

[0023] Figure 7 This is a view showing the second layer and magnet of the antenna module according to an embodiment.

[0024] Figure 8 This is a view showing the coupling relationship between the first antenna and the second pattern according to an embodiment.

[0025] Figure 9 This is a cross-sectional view of an antenna module according to another embodiment, wherein the magnetic material is located on the side surface of the second layer.

[0026] Figure 10 This is a view showing a first pattern including a slit according to an embodiment.

[0027] Figure 11 This is a block diagram of an electronic device according to an embodiment in a network environment. Detailed Implementation

[0028] Figure 1a This is a front perspective view of a mobile electronic device according to an embodiment. Figure 1b This is a perspective view of the rear surface of an electronic device according to an embodiment.

[0029] refer to Figure 1a and Figure 1b The electronic device 100 according to an embodiment may include a housing 110, the housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding the space between the first surface 110A and the second surface 110B. In another embodiment (not shown), the term "housing" may refer to defining Figure 1aThe structure comprises some of the first surface 110A, the second surface 110B, and the side surface 110C. According to an embodiment, at least a portion of the first surface 110A may be configured with a substantially transparent front surface panel 102 (e.g., a glass or polymer plate including various coatings). The second surface 110B may be configured with a substantially opaque rear surface panel 111. The rear surface panel 111 may be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of two or more of these materials. The side surface 110C may be configured with a side surface frame structure (or “side surface member”) 118 coupled to the front surface panel 102 and the rear surface panel 111 and comprising metal and / or polymer. In some embodiments, the rear surface panel 111 and the side surface frame structure 118 may be integrally configured and may comprise the same material (e.g., a metallic material such as aluminum).

[0030] In the illustrated embodiment, the front surface panel 102 may include two first regions 110D at its long, opposite side edges, which curve and extend seamlessly from the first surface 110A toward the rear surface panel 111. In the illustrated embodiment (see...) Figure 1b The rear surface panel 111 may include two second regions 110E at its long, opposite side edges, which curve and extend seamlessly from the second surface 110B toward the front surface panel 102. In some embodiments, the front surface panel 102 (or the rear surface panel 111) may include only one of the first region 110D (or the second region 110E). In another embodiment, some of the first region 110D or the second region 110E may not be included. In the above embodiments, in the side surface of the electronic device 100, the side surface bezel structure 118 may have a first thickness (or width) on the side excluding the first region 110D or the second region 110E, and may have a second thickness thinner than the first thickness on the side including the first region 110D or the second region 110E.

[0031] According to an embodiment, the electronic device 100 may include one or more of a display 101, audio modules 103, 107 and 114, camera modules 105, 112 and 113, a key input device 117, and connector holes 108 and 109. In some embodiments, at least one component (e.g., the key input device 117) may be omitted from the electronic device 100, or other components may be included.

[0032] Display 101 may be exposed through, for example, a large portion of front surface panel 102. In some embodiments, at least a portion of display 101 may be exposed through a first region 110D of the front surface panel 102 providing a first surface 110A and a side surface 110C. In some embodiments, the edges of display 101 may be configured to have substantially the same peripheral shape as the adjacent front surface panel 102. In another embodiment (not shown), the distance between the periphery of display 101 and the periphery of front surface panel 102 may be substantially constant in order to increase the exposed area of ​​display 101.

[0033] In another embodiment (not shown), a recess or opening may be provided in a portion of the screen display area of ​​display 101, and at least one of a sensor module 104 and a camera module 105 aligned with the recess or opening may be included. In another embodiment (not shown), the rear surface of the screen display area of ​​display 101 may include at least one of an audio module 114, a camera module 105, and a fingerprint sensor 116. In another embodiment (not shown), display 101 may be coupled to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus, or configured to be adjacent to the touch-sensitive circuit, the pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus.

[0034] Audio modules 103, 107, and 114 may include a microphone hole 103 and speaker holes 107 and 114. Microphone hole 103 may include a microphone disposed therein for receiving external sound, and in some embodiments, multiple microphones may be disposed therein to detect the direction of sound. Speaker holes 107 and 114 may include an external speaker hole 107 and a call receiver hole 114. In some embodiments, when speaker holes 107 and 114 and microphone hole 103 are implemented as a single hole or without speaker holes 107 and 114, a speaker (e.g., a piezoelectric speaker) may be included.

[0035] Camera modules 105, 112, and 113 may include a first camera device 105 disposed on a first surface 110A of the electronic device 100, and a second camera device 112 and / or a flash 113 disposed on a second surface 110B of the electronic device 100. Camera devices 105 and 112 may include one or more lenses, image sensors, and / or image signal processors. The flash 113 may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., infrared camera lenses, wide-angle lenses, and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 100.

[0036] Key input device 117 may be disposed on side surface 110C of housing 110. In another embodiment, electronic device 100 may not include some or all of the above-described key input devices 117, and the un-included key input devices 117 may be implemented on display 101 in another form (e.g., soft keys). In some embodiments, key input device may include sensor module 116 disposed on second surface 110B of housing 110.

[0037] Connector holes 108 and 109 may include a first connector hole 108 and / or a second connector hole 109, the first connector hole 108 being capable of accommodating a connector (e.g., a USB connector) for sending / receiving power and / or data to / from an external electronic device, and the second connector hole 109 being capable of accommodating a connector for sending / receiving audio signals to / from an external electronic device.

[0038] A pen input device 120 (e.g., a stylus) can be guided through a hole 121 provided in the side surface of the housing 110 to be inserted into or detached from the housing 110, and may include a button for facilitating detachment. The pen input device 120 may include a separate resonant circuit for linkage with an electromagnetic induction panel 390 (e.g., a digitizer) included in the electronic device 100. The pen input device 120 may include an electromagnetic resonant (EMR) scheme, an active stylus (AES) scheme, and an electrocoupled resonant (ECR) scheme.

[0039] Figure 2 This is an exploded perspective view showing the state in which a coil supporting wireless communication technology is installed in an electronic device according to an embodiment.

[0040] Reference Figure 2 According to various embodiments, the electronic device 100 may include a housing 400 defining the side surfaces of the electronic device 100, a front surface plate (not shown) defining the front surface of the electronic device 100 and at least a portion of which is substantially transparent, and a rear surface plate 111 defining the rear surface of the electronic device 100.

[0041] According to an embodiment, the front panel and the rear panel 111 can provide internal space inside the housing 400, and a coil supporting wireless communication technology can be installed in the internal space adjacent to the rear panel 111.

[0042] In the example, electronic device 100 may include an FPCB 210, a first coil 220, and a second coil 230 disposed in an internal space.

[0043] According to an embodiment, the first coil 220 may be electrically connected to the FPCB 210. According to an embodiment, the first coil 220 and the second coil 230 may be spaced apart from each other, but this disclosure is not limited thereto. For example, the first coil 220 and the second coil 230 may be configured to overlap each other in some areas. According to an embodiment, the first coil 220 and the second coil 230 may be configured to be offset from each other so that their centers do not coincide.

[0044] According to an embodiment, when the electronic device 100 is viewed from the rear surface, an antenna module 300 may be provided in a region different from the coil supporting wireless communication technology.

[0045] Figure 3 This is an exploded plan view of an electronic device including an antenna module and a coil antenna according to an embodiment.

[0046] Reference Figure 3 The electronic device 100 according to an embodiment may include an antenna module 300, a first coil 220, and a second coil 230. According to an embodiment, the first coil 220 and the second coil 230 may be mounted on a flexible printed circuit board (FPCB) (e.g., Figure 2 It is implemented on 210). However, in another embodiment, one of the first coil 220 and the second coil 230 may be omitted. Figure 3 The number and arrangement of coils shown are exemplary, and in various embodiments, coils are provided in a suitable form for performing one of the MST, NFC, or WPC functions in an area that does not overlap with the antenna module 300.

[0047] According to embodiments, the first coil 220 can be used as a coil for Magnetic Secure Transmission (MST). In this disclosure, MST technology can refer to a technology that generates a magnetic field that causes a card reader to recognize it as a magnetic card swipe. In MST communication technology, communication performance may be proportional to the magnetic field strength that the MST coil can generate. According to various embodiments of this disclosure, the first coil 220 can be made of multiple strands of wire and can be positioned in a different region from the wireless charging coil (e.g., the second coil 230) such that the center of the first coil does not coincide with the center of the wireless charging coil. As described above, since the first coil 220 is positioned in a different region from the wireless charging coil, the first coil 220 according to embodiments can be coupled to a magnetic material with high permeability.

[0048] According to an embodiment, the second coil 230 can be used as a wireless charging coil (e.g., a wireless power coil (WPC)) for wireless charging. The second coil 230 may have a helical shape. The electronic device 100 according to the embodiment can wirelessly receive power from an external electronic device (not shown) via the second coil 230. Furthermore, in the embodiment, the electronic device 100 can wirelessly power other electronic devices (e.g., smartphones, smartwatches, headphones, etc.) via the second coil 230. The electronic device 100 can utilize the second coil 230 to support one or more of various wireless charging schemes (including, for example, electromagnetic resonance schemes or electromagnetic induction schemes). The second coil 230 according to the embodiment can be implemented as a wire.

[0049] The antenna module 300 according to an embodiment may include a first antenna 310 and a second antenna 320. According to an embodiment, the second antenna 320 may include at least one patch antenna 321, 322 or 323.

[0050] According to an embodiment, the first antenna 310 may be an NFC antenna for short-range wireless communication. For example, the first antenna 310 may include a coil wound into a loop shape.

[0051] According to an embodiment, the first antenna 310 and the second antenna 320 may be configured not to overlap. For example, the first antenna 310 may be configured to surround the second antenna 320, but this disclosure is not limited thereto. For example, some of the second antennas 320 (e.g., 321 and 322) may be located within the area surrounded by the first antenna 310, while the remainder (e.g., 323) may be located outside the area surrounded by the first antenna 310.

[0052] Furthermore, despite Figure 3 The antenna module 300 ratio is shown. Figure 3 The first coil 220 or the second coil 230 are relatively small, but this should not be interpreted as limiting the relative size of the antenna module 300. Depending on the transmission frequency of the target UWB or coil antenna, the antenna module 300 can have an appropriate size. According to the embodiment, the antenna module 300 can be positioned in the area to the right of the camera.

[0053] The antenna module 300 according to an embodiment can be configured not to overlap with the first coil 220 and the second coil 230. The antenna module 300, the first coil 220, and the second coil 230 according to an embodiment can be electrically connected via a printed circuit board (PCB) (not shown). Because the antenna module 300 is configured not to overlap with other coils, interference between each antenna can be reduced, and performance can be improved. The first antenna 310, the second antenna 320, the first coil 220, and the second coil 230 according to an embodiment can be housed on a flexible printed circuit board (FPCB) (e.g., Figure 2The antenna 310 is implemented on the first antenna 310. According to another embodiment, a first flexible printed circuit board (FPCB) having a first antenna 310 and a second antenna 320 implemented thereon can be electrically connected to a connector via a first pin. A second flexible printed circuit board (FPCB) having a first coil 220 and a second coil 230 implemented thereon can be electrically connected to the connector via a second pin. The first FPCB and the second FPCB can be electrically connected to a communication circuit in a printed circuit board (PCB) via the connector. As another example, the first FPCB can be electrically connected to the PCB via a first connector, and the second FPCB can be electrically connected to the PCB via a second connector.

[0054] Figure 4 This is a perspective view of an antenna module including a first antenna and a second antenna according to an embodiment.

[0055] refer to Figure 4 According to the embodiment, the antenna module 300 may have a stacked structure including multiple layers. The antenna module 300 may include a first layer 410, a second layer 430, a dielectric 420, a magnetic material 440, and a heat sink 450. Figure 4 The stacked structure is exemplary and can be modified as appropriate. For example, heat sink 450 can be omitted or replaced with another structure.

[0056] According to an embodiment, the first antenna 310 and the second antenna 320 may include a plurality of terminals 470 connected to a printed circuit board (PCB) (not shown). The plurality of terminals 470 may be arranged together in one area of ​​the stacked structure to provide a receptacle for connector coupling. The receptacle disposed on the antenna module 300 and the receptacle disposed on the PCB may be connected to each other via a connector (e.g., an FPCB connector).

[0057] According to an embodiment, the first antenna 310 may include a first point 481 and a second point 482 as connection points for forming a coil shape. A detailed description of the connection via the first point 481 and the second point 482 will be described later.

[0058] According to an embodiment, the first antenna 310 and the second antenna 320 may be included in the first layer 410. For example, the first antenna 310 and the second antenna 320 may be included in the first layer 410 and disposed on the dielectric 420. According to an embodiment, the electronic device 100 may include a second layer 430, which includes a ground for the second antenna 320. According to an embodiment, a dielectric material 420 having a predetermined dielectric constant may be disposed between the first layer 410 and the second layer 430.

[0059] The magnetic material 440 according to an embodiment may include a ferrite sheet capable of improving the performance of the first antenna 310, which may be an NFC antenna. The magnetic material 440 according to an embodiment may be disposed beneath the second layer 430. According to another embodiment, the magnetic material 440 may surround the second layer 430 and may be disposed in a region corresponding to the first antenna 310. This will be described in detail later.

[0060] A heat sink 450 (e.g., a graphite sheet) according to an embodiment can be disposed on the bottom surface of the magnetic material 440. According to another embodiment, a heat sink 450 can be disposed between the second layer 430 and the magnet 440. The heat sink 450 uniformly distributes the heat generated by the antenna module 300 across the entire surface to prevent heat concentration. The heat sink 450 according to an embodiment may include a thin metal strip with high thermal conductivity.

[0061] Figure 5 This is a cross-sectional view of the antenna module according to an embodiment.

[0062] Let's refer to each other. Figure 4 and Figure 5 , Figure 5 It corresponds to Figure 4 A cross-sectional view of portion A-A'. The antenna module 300 according to an embodiment may include a first layer 410 comprising a first antenna patch 321 and a first antenna 310, a dielectric material 420, a second layer 430, a magnetic material 440, and a heat sink 450. The same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions will be omitted.

[0063] According to an embodiment, a first layer 410 may be disposed on a dielectric material 420. According to an embodiment, a second layer 430 may be disposed at a position corresponding to the first antenna patch 321, with the dielectric material 420 situated between the first antenna patch 321 and the second layer 430. According to an embodiment, the area in the second layer 430 corresponding to the first antenna 310 of the first layer 410 may be fill-cut. For example, the area corresponding to the first antenna 310 may not include grounding. According to an embodiment, the second layer 430 may include a first pattern that can serve as grounding for the first antenna patch 321. Furthermore, the second layer 430 may include a second pattern that can be part of the pattern of the first antenna 310. This will be described in detail later.

[0064] The dielectric material 420 according to the embodiment may include a material having a low dielectric constant (Dk). The dielectric material 420 according to the embodiment may include a material having a low dielectric loss factor (DF).

[0065] Figure 6The first layer of the antenna module according to an embodiment is shown.

[0066] refer to Figure 6 The first layer 410 includes a first antenna 310 containing a first point 481 and a second point 482, a second antenna 320, a conductive path 610, and a plurality of terminals 470.

[0067] According to an embodiment, the second antenna 320 may include at least one patch antenna 321, 322, or 323. At least one patch antenna 321, 322, or 323 according to an embodiment may be used to transmit / receive ultra-wideband (e.g., UWB) signals. For example, ultra-wideband may be a frequency band from approximately 3.1 GHz to approximately 10.6 GHz, but is not limited thereto. Furthermore, the individual patch antennas may be arranged at approximately half a wavelength intervals from each other and may be arranged in a right-angled triangle or near-right-angled triangle shape. However, this disclosure is not limited thereto.

[0068] According to an embodiment, the first antenna 310 may be configured to be spaced apart from the second antenna 320. According to an embodiment, the first antenna 310 may be configured to surround the second antenna 320, but this disclosure is not limited thereto. According to an embodiment, each patch antenna 321, 322, or 323 may be oriented perpendicularly to each other. According to an embodiment, the first antenna 310 may include at least one conductive pattern surrounding the second antenna 320. According to an embodiment, the first antenna 310 may be a coil antenna for near field communication (NFC), but this disclosure is not limited thereto. For example, the first antenna 310 may transmit / receive signals using a frequency band of approximately 13.56 MHz.

[0069] The second antenna 320 according to an embodiment may include at least one conductive path 610 for connection to the ground of the second layer 430. The first antenna 310 according to an embodiment may include a first point 481 and a second point 482 connected via the second layer 430 to form a coil shape. The connection of the first point 481 and the second point 482 via the second layer 430 will be described in detail later.

[0070] According to an embodiment, the first antenna 310 and the second antenna 320 can be connected to a plurality of terminals 470 to be connected to a printed circuit board (not shown). The second antenna 320, according to an embodiment, can be connected to at least some of the plurality of terminals 470 via at least one conductor. For example, the at least one conductor can be a microstrip, but this disclosure is not limited thereto.

[0071] Figure 7 The second layer and magnetic material of the antenna module according to an embodiment are shown.

[0072] Let's refer to each other. Figure 4 and Figure 7The second layer 430 may include a first pattern 720 and a second pattern 730. According to an embodiment, the first pattern 720 and the second pattern 730 may be spaced apart from each other. According to an embodiment, the first pattern 720 may serve as a ground for the second antenna 320 included in the first layer 410. According to an embodiment, the second pattern 730 may be connected via a path to a first point 481 and a second point 482 of the first antenna 310 located on the first layer 410.

[0073] According to an embodiment, the first pattern 720 can be connected to the second antenna 320 of the first layer 410 via at least one conductive path 740. For example, the first pattern 720 can be connected to the second antenna 320 of the first layer 410 via at least one conductive path 740 and can serve as a ground for the second antenna 320. According to an embodiment, the first pattern 720 can be connected to a terminal 770 to be connected to a printed circuit board (not shown). For example, the first pattern 720 can be connected to the terminal 770 via a microstrip, but this disclosure is not limited thereto. In an embodiment, the terminal 770 can be arranged together with a plurality of terminals 470 of the first layer and can be connected to the ground of the PCB via a connector.

[0074] According to an embodiment, the second pattern 730 can be connected to the first antenna 310 to complete the coil shape. The second pattern 730 according to an embodiment may include a conductive path connected to the first antenna 310. The first point 481 and the second point 482 of the first antenna 310 may be connected via the second pattern 730.

[0075] According to an embodiment, the magnetic material 440 may be disposed below the second layer 430. The magnetic material 440 according to an embodiment may include a ferrite sheet capable of improving the performance of the first antenna 310.

[0076] According to an embodiment, the size of the second layer 430 may be equal to or smaller than the size of the magnet 440.

[0077] Figure 8 The coupling relationship between the first antenna and the second pattern according to an embodiment is shown.

[0078] refer to Figure 8 The antenna module 300 according to the embodiment may include a first antenna 310 and a second pattern 730. The same reference numerals are used for components that are the same or substantially the same as those described above, and for ease of description, some components (e.g., the second antenna 320) may be omitted.

[0079] Let's refer to each other. Figure 7 and Figure 8According to an embodiment, a first antenna 310 included in a first layer 410 can be electrically connected to a second pattern 730 located on a second layer 430. According to an embodiment, the second pattern 730 can be electrically connected to a first point 481 and a second point 482 of the first antenna 310. According to an embodiment, the first antenna 310 can be connected to the second pattern 730 to form a coil shape. According to an embodiment, the first antenna 310 can be connected to the second pattern 730 to provide a coil having at least one number of turns. For example, the coil provided by connecting the first antenna 310 and the second pattern 730 can be configured to surround the center of the antenna module 300 twice. In various embodiments, a coil pattern having three or more windings can be implemented via multiple conductive patterns and multiple pathways disposed on the second layer 430.

[0080] According to an embodiment, the first antenna 310 may be connected to at least one terminal 470 to be connected to a printed circuit board (not shown).

[0081] Let's refer to each other. Figure 4 and Figure 8 The first antenna 310 and the second pattern 730 can be connected to each other through the dielectric material 420 disposed between the first layer 410 and the second layer 430.

[0082] Figure 9 This is a cross-sectional view of an antenna module according to another embodiment, wherein the magnetic material is located on the side surface of the second layer.

[0083] The antenna module 900 according to an embodiment may include a first layer 910 in which a first antenna patch 970 and a second antenna 960 are disposed, a dielectric material 920, a second layer 930, a magnetic material 940, and a heat sink 950. According to another embodiment (not shown), at least one of the above-described components of the antenna module 900 (e.g., heat sink 950) may be omitted, or another component may be added. The same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions will be omitted.

[0084] According to the embodiment, the magnetic material 940 can be disposed in the region corresponding to the location where the second antenna 960 is disposed in the first layer 910.

[0085] According to an embodiment, the magnetic material 940 can be configured to surround the second layer 930 and overlap with the dielectric material 920. Alternatively, the magnetic material 940 can be configured to surround the second layer 930 without contacting the dielectric material 920. For example, the magnetic material 940 can be configured to surround the second layer 930, and a heat sink 950 can be disposed below the second layer 930 and the magnetic material 940.

[0086] According to another embodiment, the magnetic material 940 may be configured to surround the second layer 930 and the heat sink 950 while contacting the dielectric material 920. Alternatively, the magnetic material 940 may be configured to surround the second layer 930 and the heat sink 950 without contacting the dielectric material 920. For example, the heat sink 950 may be configured to contact the second layer 930 on its top surface and be surrounded by the magnetic material 940 on its side surfaces.

[0087] Figure 10 A first pattern, including a slit, is shown according to an embodiment.

[0088] Reference Figure 10 The second layer 430 according to the embodiment may include a first pattern 720, a second pattern 730, and a slit 1010 disposed within the first pattern 720. The same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions will be omitted.

[0089] The first pattern 720 according to an embodiment may include a non-conductive slit 1010. One end of the slit 1010 according to an embodiment may be connected to a portion of the periphery of the first pattern 720. The other end may be located at the center of the first pattern 720. For example, the slit 1010 may be T-shaped, and one end of the slit 1010 may be connected to a portion of the periphery of the first pattern 720. However, the shape of the slit 1010 is not limited to this.

[0090] According to an embodiment, by providing a slit 1010 included in the first pattern 720, performance degradation of the first antenna 320 can be prevented by suppressing eddy currents.

[0091] Figure 11 This is a block diagram of an electronic device according to an embodiment in a network environment.

[0092] Figure 11 This is a block diagram illustrating an electronic device 1101 in a network environment 1100 according to various embodiments. Reference Figure 11In network environment 1100, electronic device 1101 can communicate with electronic device 1102 via a first network 1198 (e.g., a short-range wireless communication network), or with at least one of electronic device 1104 or server 1108 via a second network 1199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 1101 can communicate with electronic device 1104 via server 1108. According to an embodiment, electronic device 1101 may include a processor 1120, a memory 1130, an input module 1150, a sound output module 1155, a display module 1160, an audio module 1170, a sensor module 1176, an interface 1177, a connection terminal 1178, a haptic module 1179, a camera module 1180, a power management module 1188, a battery 1189, a communication module 1190, a Subscriber Identity Module (SIM) 1196, or an antenna module 1197. In some embodiments, at least one component (e.g., connection terminal 1178) may be omitted from electronic device 1101, or one or more other components may be added to electronic device 1101. In some embodiments, some components (e.g., sensor module 1176, camera module 1180, or antenna module 1197) may be implemented as a single component (e.g., display module 1160).

[0093] Processor 1120 can execute, for example, software (e.g., program 1140) to control at least one other component (e.g., hardware or software component) of electronic device 1101 coupled to processor 1120, and can perform various data processing or calculations. According to embodiments, as at least part of such data processing or calculation, processor 1120 can store commands or data received from another component (e.g., sensor module 1176 or communication module 1190) in volatile memory 1132, process the commands or data stored in volatile memory 1132, and store the result data in non-volatile memory 1134. According to embodiments, processor 1120 may include a main processor 1121 (e.g., central processing unit (CPU) or application processor (AP)) and auxiliary processors 1123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that are operationally independent of or combined with the main processor 1121. For example, when electronic device 1101 includes a main processor 1121 and an auxiliary processor 1123, the auxiliary processor 1123 may be adapted to consume less power than the main processor 1121, or adapted to perform a specific function. The auxiliary processor 1123 may be implemented separately from the main processor 1121, or may be implemented as part of the main processor 1121.

[0094] When the main processor 1121 is inactive (e.g., in sleep) state, the auxiliary processor 1123 may control at least some of the functions or states associated with at least one component of the electronic device 1101 (other than the main processor 1121) (e.g., display module 1160, sensor module 1176, or communication module 1190), or when the main processor 1121 is active (e.g., running an application), the auxiliary processor 1123 may work with the main processor 1121 to control at least some of the functions or states associated with at least one component of the electronic device 1101 (e.g., display module 1160, sensor module 1176, or communication module 1190). According to embodiments, the auxiliary processor 1123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 1180 or communication module 1190) functionally associated with the auxiliary processor 1123. According to embodiments, the auxiliary processor 1123 (e.g., a neural processing unit) may include hardware structures specified for processing artificial intelligence models. Artificial intelligence models can be generated through machine learning. This learning can be performed, for example, by an electronic device 1101 performing artificial intelligence or via a separate server (e.g., server 1108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural networks can be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations of two or more of these. In addition to hardware architecture, the artificial intelligence model can also include software architecture.

[0095] Memory 1130 may store various data used by at least one component of electronic device 1101 (e.g., processor 1120 or sensor module 1176). This various data may include, for example, software (e.g., program 1140) and input or output data for commands associated with it. Memory 1130 may include volatile memory 1132 or non-volatile memory 1134.

[0096] The program 1140 may be stored as software in the memory 1130, and the program 1140 may include, for example, an operating system (OS) 1142, middleware 1144, or application 1146.

[0097] Input module 1150 can receive commands or data from outside electronic device 1101 (e.g., from a user) that will be used by another component of electronic device 1101 (e.g., processor 1120). Input module 1150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0098] The sound output module 1155 can output sound signals to the outside of the electronic device 1101. The sound output module 1155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker or as part of the speaker.

[0099] Display module 1160 can visually provide information to the outside of electronic device 1101 (e.g., to a user). Display module 1160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling one of these devices. According to an embodiment, display module 1160 may include a touch sensor adapted to detect touch, or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0100] The audio module 1170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 1170 can obtain sound via the input module 1150, or output sound via the sound output module 1155 or headphones of an external electronic device (e.g., electronic device 1102) directly (e.g., wired) or wirelessly coupled to the electronic device 1101.

[0101] Sensor module 1176 can detect the operating state of electronic device 1101 (e.g., power or temperature) or the environmental state outside electronic device 1101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 1176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0102] Interface 1177 may support one or more specific protocols used to enable electronic device 1101 to be directly (e.g., wired) or wirelessly coupled to external electronic device (e.g., electronic device 1102). According to embodiments, interface 1177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0103] Connection 1178 may include a connector through which electronic device 1101 can be physically connected to an external electronic device (e.g., electronic device 1102). According to embodiments, connection 1178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0104] The haptic module 1179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 1179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0105] Camera module 1180 can capture still or moving images. According to embodiments, camera module 1180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0106] The power management module 1188 can manage the power supply to the electronic device 1101. According to an embodiment, the power management module 1188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0107] Battery 1189 can supply power to at least one component of electronic device 1101. According to embodiments, battery 1189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0108] Communication module 1190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 1101 and external electronic devices (e.g., electronic device 1102, electronic device 1104, or server 1108), and perform communication via the established communication channel. Communication module 1190 may include one or more communication processors capable of operating independently of processor 1120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 1190 may include wireless communication module 1192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 1194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 1198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 1199 (e.g., a traditional cellular network, 5G network, next-generation communication network, Internet, or computer network (e.g., a long-range communication network such as a LAN or wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 1192 can use user information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1196 to identify and verify the electronic device 1101 in the communication network (such as the first network 1198 or the second network 1199).

[0109] Wireless communication module 1192 can support 5G networks and next-generation communication technologies, such as New Radio (NR) access technologies, following 4G networks. NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 1192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 1192 can support various technologies used to ensure performance in high-frequency bands, such as beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 1192 can support various requirements specified in electronic device 1101, external electronic devices (e.g., electronic device 1104), or network systems (e.g., second network 1199). According to an embodiment, the wireless communication module 1192 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, lost coverage (e.g., 164 dB or lower) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or lower for each of the downlink (DL) and uplink (UL), or 1 ms or lower round trip) for implementing URLLC.

[0110] Antenna module 1197 can transmit or receive signals or power to or from the outside of electronic device 1101 (e.g., external electronic device). According to an embodiment, antenna module 1197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 1197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 1198 or a second network 1199) can be selected from the multiple antennas by, for example, communication module 1190 (e.g., wireless communication module 1192). Signals or power can then be transmitted or received between communication module 1190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 1197.

[0111] According to various embodiments, antenna module 1197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band.

[0112] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0113] According to an embodiment, commands or data can be sent or received between electronic device 1101 and external electronic device 1104 via server 1108 connected to the second network 1199. Each of electronic device 1102 or electronic device 1104 can be a device of the same type as electronic device 1101, or a device of a different type. According to an embodiment, all or some operations to be performed on electronic device 1101 can be performed on one or more of external electronic device 1102, external electronic device 1104, or server 1108. For example, if electronic device 1101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 1101 may request one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 1101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the performance to electronic device 1101. Electronic device 1101 may provide the result as at least a partial response to the request, with or without further processing. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. Electronic device 1101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 1104 may include an Internet of Things (IoT) device. Server 1108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 1104 or server 1108 may be included in a second network 1199. Electronic device 1101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0114] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0115] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, the same reference numerals may be used to refer to the same or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “coupled to another element (e.g., a second element),” “coupled to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) coupled to the other element, wirelessly coupled to the other element, or coupled to the other element via a third element.

[0116] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0117] The various embodiments set forth herein can be implemented as software (e.g., program 1140) containing one or more instructions readable by a machine (e.g., electronic device 1101) stored in a storage medium (e.g., internal memory 1136 or external memory 1138). For example, under the control of a processor, the processor (e.g., processor 1120) of the machine (e.g., electronic device 1101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0118] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0119] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or identical manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.

[0120] According to an embodiment, the electronic device may include: a first layer comprising a first antenna having a patch shape and a second antenna having a coil shape surrounding the first antenna; a second layer comprising a first pattern disposed at a position corresponding to the first antenna and configured to act as ground for the first antenna and a second pattern electrically connected to the second antenna; a dielectric material disposed between the first layer and the second layer; and a magnetic material disposed below the dielectric at a position corresponding to the second antenna.

[0121] According to an embodiment, the electronic device may include at least one wireless communication circuit electrically connected to a first antenna and a second antenna.

[0122] According to an embodiment, at least one wireless communication circuit can transmit or receive ultra-wideband (UWB) signals via a first antenna.

[0123] According to an embodiment, at least one wireless communication circuit can transmit or receive near field communication (NFC) signals via a second antenna.

[0124] According to an embodiment, the electronic device may also include a battery electrically connected to the second antenna, and the wireless communication circuitry may charge the battery by using the induced current generated by the second antenna.

[0125] According to an embodiment, in an electronic device, a first antenna of the first layer can be electrically connected to a first pattern of the second layer via a conductive path that penetrates a dielectric material.

[0126] According to an embodiment, the electronic device may include a printed circuit board, and the first antenna and the second antenna may be connected to the printed circuit board via connectors.

[0127] According to an embodiment, the second antenna of the first layer can be electrically connected to the second pattern of the second layer via a conductive path that penetrates the dielectric material.

[0128] According to an embodiment, the magnetic material can be disposed below the second layer.

[0129] According to an embodiment, the magnetic material can be configured to surround the second layer while in contact with the dielectric.

[0130] According to an embodiment, the magnetic material may include ferrite sheets.

[0131] According to an embodiment, the first antenna and the second antenna can be configured to be spaced apart from each other.

[0132] According to an embodiment, the electronic device may include a graphite sheet disposed beneath a magnetic material.

[0133] According to an embodiment, the electronic device may include a graphite sheet beneath a magnetic material and a second layer.

[0134] According to an embodiment, the first pattern may also include gaps.

[0135] The electronic device according to an embodiment may include a housing providing a receiving space in which electronic components are disposed, wherein the housing includes a first receiving space, a first coil antenna in a region inside the housing other than the first receiving space, and an antenna module disposed in the first receiving space. The antenna module may include: a first layer including a first antenna having a patch shape and a second antenna surrounding the first antenna and having a coil shape; a second layer including a first pattern disposed at a location corresponding to the first antenna and configured to act as ground for the first antenna and a second pattern electrically connected to the second antenna; a dielectric material disposed between the first layer and the second layer; and a magnetic material disposed below the dielectric material at the location of the second antenna.

[0136] According to an embodiment, the antenna module can be electrically connected to the first coil antenna.

[0137] According to an embodiment, the electronic device may further include a magnetic safety transfer (MST) control circuit, and the MST control circuit may be configured to transmit an MST signal for payment using a first coil antenna.

[0138] According to an embodiment, the electronic device may further include a power management circuit, and the power management circuit may be configured to wirelessly charge using a first coil antenna.

[0139] According to an embodiment, the electronic device may include at least one wireless communication circuit electrically connected to the first coil antenna and the antenna module.

Claims

1. An electronic device, the electronic device comprising: The first layer includes a first antenna having a patch shape and a second antenna surrounding the first antenna and having a coil shape; The second layer includes a first pattern and a second pattern, wherein the first pattern is disposed at a position corresponding to the first antenna and is configured to act as a ground for the first antenna, and the second pattern is electrically connected to the second antenna. A dielectric material disposed between the first layer and the second layer; A magnetic material is disposed below the dielectric material at a position corresponding to the second antenna. In the second layer, the second pattern is spaced apart from the first pattern.

2. The electronic device according to claim 1, further comprising at least one wireless communication circuit electrically connected to the first antenna and the second antenna. 3.The electronic device of claim 2, wherein, The at least one wireless communication circuit is configured to transmit / receive ultra-wideband (UWB) signals via the first antenna.

4. The electronic device according to claim 2, wherein, The at least one wireless communication circuit is configured to transmit / receive near-field communication (NFC) signals via the second antenna.

5. The electronic device of claim 2, further comprising a battery electrically connected to the second antenna. in, The at least one wireless communication circuit charges the battery using the induced current generated by the second antenna.

6. The electronic device according to claim 1, wherein, The first antenna of the first layer is electrically connected to the first pattern of the second layer via a conductive path that penetrates the dielectric material.

7. The electronic device of claim 1, further comprising a printed circuit board, in, The first antenna and the second antenna are connected to the printed circuit board via connectors.

8. The electronic device according to claim 1, wherein, The second antenna of the first layer is electrically connected to the second pattern of the second layer via a conductive path that penetrates the dielectric material.

9. The electronic device according to claim 1, wherein, The magnetic material is disposed beneath the second layer.

10. The electronic device according to claim 1, wherein, The magnetic material is configured to surround the second layer while in contact with the dielectric material.

11. The electronic device according to claim 1, wherein, The magnetic material includes ferrite sheets.

12. The electronic device according to claim 1, wherein, The first antenna and the second antenna are configured to be spaced apart from each other.

13. The electronic device according to claim 9, further comprising a graphite sheet disposed below the magnetic material.

14. The electronic device of claim 10, further comprising a graphite sheet beneath the magnetic material and the second layer.

15. The electronic device according to claim 1, wherein, The first pattern also includes gaps.

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