Automatic method and device for the production of a tin ring

Abstract

The application discloses an automatic preparation method and device of a tin ring, which divides a tin wire into N times of feeding, tin wire of S length in each time of feeding to a wire pressing rod and a guide needle, and the wire pressing rod and the guide needle cooperate to bend the tin wire by an angle of 360 DEG / N in each time of feeding; before the Nth time of feeding, the tin ring to be formed is separated from the tin wire based on a wire cutting blade, and then the wire pressing rod and the guide needle cooperate to form the cut tin wire into the tin ring. The application can effectively avoid the case that a crack or a break of the tin ring is caused by too large bending force in the tin wire forming process, so as to guarantee the quality of the formed tin ring.

Description

Technical Field

[0001] This invention discloses a method and apparatus for preparing tin rings, which belongs to the field of tin ring preparation technology, specifically disclosing an automatic method and apparatus for preparing tin rings. Background Technology

[0002] With the development of science and technology and society, the consumption of electronic components in the consumer electronics and automotive industries has increased significantly, as have products with pin-type component soldering, such as barometric pressure sensors, hydraulic pressure sensors, and earphones. Along with advancements in component manufacturing processes, the requirements for heat dissipation in the assembly and soldering process have become increasingly stringent. Reducing the void rate during soldering is a core challenge that must be addressed in the assembly and soldering of power electronic components. Lead-free solder rings offer advantages such as fewer voids and faster soldering speeds. Laser soldering with lead-free high-temperature solder rings has become a new soldering process for solving voids during the soldering process. Solder ring soldering reduces solvent evaporation voids that occur with solder paste. Pre-formed solder rings are made of solder wire composed of solder alloy and a pre-coated flux layer. Using these pre-formed solder rings offers advantages such as accurate solder joint positioning, stable and consistent solder alloy and flux content, reduced voids during soldering, and minimal residue after soldering. This makes them suitable for high-precision solder joints and applications requiring high void ratios. Currently, there are also soldering processes where solder wire is first wound around the workpiece to be soldered, and then melted onto the workpiece using a soldering gun. While this process ensures soldering quality and efficiency, it involves manually winding the solder ring onto the workpiece and then manually or using a vacuum nozzle to place the wound ring onto the component to be soldered. This process suffers from high reliance on manual labor, long processing cycles, and a large workload. Currently, some equipment has emerged that automatically forms solder rings and automatically feeds them onto the components to be soldered.

[0003] Chinese invention patent CN112091479B discloses a clamping and winding assembly, an automatic solder ring preparation device, and a method for preparing solder rings. It includes a guide pin arranged along the Z-axis, a rotating shaft coaxially mounted with the guide pin and rotatable about its own axis, and a pressure rod connected to the rotating shaft via a hinge that can move closer to or further away from the guide pin. The axis of the hinge is perpendicular to the axis of the guide pin. A top rod movable along the Y-axis is arranged beside the guide pin. The pressure rod, in cooperation with the top rod and the guide pin, winds solder wire into a solder ring through the rotation of the rotating shaft. The manufacturing process involves cutting the wire and then winding it into a ring, meaning the entire process is a single wire feeding and integral forming. This leads to a drawback: excessive bending force during the integral forming process can cause cracks or breakage of the solder ring, compromising the quality of the formed solder ring.

[0004] Chinese invention patent CN111097863A discloses a solder ring forming device, including a solder wire feeding mechanism, a solder wire moving mechanism, a clamping mechanism for clamping and fixing one end of the solder wire fed by the solder wire feeding mechanism, a solder wire cutting mechanism for cutting the solder wire fixed by the clamping mechanism from the solder wire feeding mechanism, and a solder ring forming mechanism for turning the cut solder wire into a solder ring, as well as a control mold that coordinates and controls the operation of the solder wire feeding mechanism, the solder wire moving mechanism, the clamping mechanism, the solder wire cutting mechanism, and the solder ring forming mechanism. In use, the solder wire moving mechanism moves the solder wire feeding mechanism to the vicinity of the clamping mechanism, then the solder wire feeding mechanism feeds the solder wire to the clamping mechanism and clamps and fixes the end. The solder wire moving mechanism drives the solder wire feeding mechanism to retract to the required length of the solder ring, and the solder wire cutting mechanism cuts the solder wire. In the solder ring forming mechanism, the solder wire winding mechanism drives the clamping mechanism to rotate and cooperates with the top extension rod to form a solder ring. Because it can automatically produce solder rings of the required specifications, the consistency of the solder rings is guaranteed. The manufacturing process of the solder ring in this technical solution involves cutting the wire first and then winding it into a ring. The entire process is a single wire feeding and integral forming. The defect caused by this is that the excessive bending force during the integral forming process of the solder wire may cause cracks or breakage of the solder ring, and the quality of the formed solder ring cannot be guaranteed.

[0005] Chinese invention patent CN112756849A discloses an automatic solder ring winding device and a control method for the automatic solder ring winding device. The control method includes the following steps: First, control the bottom mechanism to drive the wire feeding mechanism to move so that the solder wire is delivered to the side of the guide pin on the solder ring guiding mechanism; then control the horizontal cylinder to drive the limiting claw to move towards the guide pin and clamp the solder wire on the guide pin; then control the cutting mechanism to cut the solder wire; then control the bottom mechanism to drive the wire feeding mechanism back to its original position; then control the forming claw cylinder to control the left and right claws to clamp the solder wire, and the solder wire is clamped into a solder ring under the action of the left and right claws, and the solder ring will be placed on the guide pin; then control the forming claw cylinder to control the left and right claws to release the solder ring, the pushing mechanism drives the solder ring forming mechanism away from the solder ring, the horizontal cylinder drives the limiting claw to release the solder ring, and then control the vertical cylinder to move the ring dropping block downward to knock the solder ring off the guide pin, and the solder ring slides out along the guide pin. The manufacturing process of the solder ring in this technical solution involves cutting the wire first and then winding it into a ring. The entire process is a single wire feeding and integral forming. The defect caused by this is that the excessive bending force during the integral forming process of the solder wire may cause cracks or breakage of the solder ring, and the quality of the formed solder ring cannot be guaranteed.

[0006] Chinese utility model patent CN206464480U discloses a solder wire winding machine, comprising: a feeding mechanism, a winding mechanism, a cutting mechanism, and a pushing mechanism; wherein: the feeding mechanism is used to straighten the coiled solder wire and convey it to the winding mechanism; the winding mechanism is located on one side of the feeding mechanism and includes a winding shaft, a first motor, and a holding device; the winding shaft is connected to the first motor and is used to wind the solder wire into a coil; the holding device is located on the winding shaft and is used to hold the solder wire fed from the feeding mechanism; the cutting mechanism is located below the winding shaft and includes a cutter for cutting the solder wire and a first cylinder for driving the cutter; the pushing mechanism is located on one side of the winding shaft and is used to push the formed solder wire coil out of the winding shaft. This technical solution manufactures the solder ring by first cutting the wire and then winding it into a ring, meaning the entire process is a single wire feeding and integral forming. The drawback of this is that excessive bending force during the integral forming process may cause the solder ring to crack or break, resulting in inconsistent quality of the formed solder ring.

[0007] In summary, although there are many tin ring forming devices and methods in the existing technology, they all adopt the steps of first cutting the wire and then winding it into shape. The defect caused by this is that the excessive bending force during the overall forming process of the tin wire may cause cracks or breakage of the tin ring, and the quality of the formed tin ring cannot be guaranteed. Summary of the Invention

[0008] To address the technical problems existing in the prior art, the present invention provides an automatic method and apparatus for preparing tin rings, which can effectively avoid the situation where excessive bending force during the tin wire forming process may cause cracks or breakage of the tin rings, thereby ensuring the quality of the formed tin rings.

[0009] This invention discloses an automatic method for preparing tin rings. The method involves feeding a coiled tin wire into N feeds, each feeding a tin wire of length S between a pressure rod and a guide pin. During each feed, the pressure rod and the guide pin work together to bend the tin wire by an angle of 360° / N. Before the Nth feed, the tin ring to be formed is separated from the coiled tin wire by a wire cutter. Then, the pressure rod and the guide pin work together to form the cut tin wire into a tin ring.

[0010] In a preferred embodiment of the present invention, the diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the pressure rod and the central axis of the guide pin is L, N=L / ∣(D / 2-A / 2)∣, N is rounded to the nearest integer, and D≠A.

[0011] In a preferred embodiment of the present invention, when D = A, N = L / 0.1, and N is rounded to the nearest integer.

[0012] In a preferred embodiment of the present invention, the diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the wire pressing rod and the central axis of the guide pin is L, and the length of each wire feed is S = (D / 2 + A / 2) * 2 π / N.

[0013] The present invention also discloses an automatic tin ring preparation device, including a feeding unit, a guide needle unit, a wire pressing unit and a wire cutting unit, wherein the feeding unit controls the feeding of tin wire through an automatic tin ring preparation method.

[0014] In a preferred embodiment of the present invention, the feeding unit includes a PLC and a stepper motor. The PLC is connected to the stepper motor, and the motor shaft of the stepper motor is connected to the wire feeding wheel through a transmission gear set.

[0015] In a preferred embodiment of the present invention, the wire pressing unit includes a wire pressing rod, a wire winding motor, a rotating block, and a wire pressing connecting block. The rotating block is connected to the motor shaft end of the wire winding motor. The rotation angle of the rotating block is α, -90°≤α≤+90°. The wire pressing connecting block is connected to the rotating block, and the wire pressing rod is connected to the wire pressing connecting block.

[0016] In a preferred embodiment of the present invention, the rotating block is semi-circular, the wire pressing connecting block is cuboid, and the wire pressing connecting block is fixed to the end face of the semi-circular plate.

[0017] In a preferred embodiment of the present invention, a wire support unit is provided downstream of the feeding unit. The wire support unit includes a wire support cylinder and a wire support fixing block. The wire support fixing block is U-shaped and is fixed to the telescopic end of the wire support cylinder. The telescopic direction of the wire support cylinder is perpendicular to the axial direction of the solder wire.

[0018] In a preferred embodiment of the present invention, the slicing unit includes a slicing cylinder, a slicing blade fixing block, and a slicing blade. The slicing cylinder has a telescopic end, and a slicing blade is fixedly connected to the slicing cylinder. There is an angle between the telescopic direction of the slicing cylinder and the axial direction of the solder wire, and the arrangement direction of the slicing blade is consistent with the telescopic direction of the slicing cylinder.

[0019] In a preferred embodiment of the present invention, the guide pin unit of the vertical shaft can be replaced with trapezoidal step-shaped guide pins of different sizes as needed. The trapezoidal guide pin is installed at the center of the shaft and is fixed in place, with the bottom locked in place by a fastener.

[0020] In a preferred embodiment of the present invention, the shaping unit is assembled from a gripper cylinder and two telescopic cylinders. The head of the gripper cylinder is respectively equipped with a semi-circular shaped tin ring shaping block, which is closed into a complete ring. The front end of the telescopic piston cylinder is equipped with a fork-shaped tin ring fixing block.

[0021] In a preferred embodiment of the present invention, the specific steps include: Step 1, installing solder wire, resetting the program, and rotating the wire pressing module of the wire pressing mechanism to a -90 degree angle to wait; Step 2, feeding the solder wire along the wire feeding wheel forward to a length of three-quarters of the solder ring; Step 3, the motor drives the wire pressing module of the wire pressing mechanism to rotate from a -90 degree angle to a 90 degree angle to press the solder wire, and then retracts to a -90 degree angle to wait; Step 4: feeding the remaining one-quarter length of the solder ring forward along the wire feeding wheel; Step 5: the motor drives the wire pressing module of the wire pressing mechanism to rotate from a -90 degree angle to a 90 degree angle to press the solder wire, and then retracts to a 0 degree angle to wait; Step 6: the shaping unit's solder ring support cylinder extends; Step 7: the cutting unit's cutting cylinder drives the cutter to cut the solder wire upwards along the leading direction, and the solder ring falls onto the fork of the shaping unit's solder ring support along the guide needle; Step 8: the shaping unit's gripper cylinder closes, clamping the solder ring, closing the solder ring and the rounded solder ring. Step 9: The gripper cylinder of the shaping unit opens, the solder ring cylinder of the shaping unit retracts, and the solder ring falls along the guide pin.

[0022] The beneficial effects of this invention are as follows: This invention discloses a novel solder ring forming scheme. Its workflow is: wire feeding-bending-wire feeding-bending, repeatedly winding the solder wire into a semi-circular or full-circular shape before cutting. That is, bending first and then cutting, feeding and bending segment by segment until a full-circular or semi-circular solder ring is formed. This effectively avoids excessive bending force caused by single-feeding and overall forming, which could lead to cracks or breakage of the solder ring, thus ensuring the quality of the formed solder ring. Furthermore, it should be noted that the N times and the feed length S per cycle in this invention are not conventional in the relevant technical field. The method, different feed times and feed lengths will directly affect the final forming quality of the solder ring. The diameter of the guide pin disclosed in this invention is D, the diameter of the solder wire is A, the distance between the central axis of the pressure rod and the central axis of the guide pin is L, N = L / |(D / 2-A / 2)|, where N is rounded to the nearest integer. D ≠ A. When D = A, N = L / 0.1, where N is rounded to the nearest integer. The diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the pressure rod and the central axis of the guide pin is L, and the length of each wire feed is S = (D / 2+A / 2)*2. π The / N calculation formula, as the core of this invention and its novelty, is to effectively avoid the situation where excessive bending force during the solder wire forming process may cause cracks or breakage of the solder ring. At the same time, the formula of this invention is the best formula after verification through a large number of experiments, so it is not a conventional technical means in the relevant technical field. Attached Figure Description

[0023] Figure 1 This is a front view schematic diagram of the overall structure of the automatic tin ring preparation device of the present invention;

[0024] Figure 2 This is a left view of a partial wire feeding mechanism of the automatic tin ring preparation device of the present invention;

[0025] Figure 3 This is a partial cross-sectional view of the winding structure of the automatic tin ring preparation device of the present invention;

[0026] Figure 4 This is a bottom view schematic diagram of the shaping mechanism of the automatic tin ring preparation device of the present invention;

[0027] Figure 5 This is a schematic diagram of the winding process of the automatic tin ring preparation device of the present invention;

[0028] Figure 6 This is a schematic diagram of the (N-1)th winding process of the automatic tin ring preparation device of the present invention;

[0029] Figure 7 This is a schematic diagram of the (N-1)th winding process of the automatic tin ring preparation device of the present invention;

[0030] Figure 8 This is a schematic diagram of the tin ring forming process in the automatic tin ring preparation device of the present invention;

[0031] In the diagram: 101-Mounting base plate; 102-Solder wire coil; 103-Fixed shaft; 104-Solder wire; 105-Upper solder wire guide block; 106-Wire feeding wheel; 107-Lower solder wire guide block; 108-Middle solder wire guide block; 110-Solder wire guide cylinder; 111-Guide cylinder mounting base; 112-Wire exit needle; 113-Wire cutting cylinder; 114-Wire cutting blade fixing block; 115-Wire cutting blade; 116-Stepped shaft guide pin; 117-Wire support fixing block; 118-Shaping cylinder; 119-Shaping cylinder fixing block; 120 - Wire support cylinder; 121-Wire pressing rod; 122-Wire pressing connecting block; 123-Guide pin fixing seat; 124-Photoelectric sensor; 125-Wire winding fixing seat; 126-Rotating block; 127-Wire winding motor fixing seat; 128-Wire winding motor; 129-Wire winding fixing base plate; 202-Wire feeding motor; 203-Wire feeding motor fixing seat; 204-Wire feeding motor drive gear; 205-Wire feeding motor driven gear; 401-Wire support cylinder fixing block; 402-Shaping gripper block; 403-Solder ring; 403-1-Round solder ring. Detailed Implementation

[0032] The technical solutions (including preferred technical solutions) of the present invention will be further described in detail below with reference to the accompanying drawings and by way of listing some optional embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0033] This invention discloses an automatic method for preparing tin rings. The method involves feeding a coiled tin wire in N separate feeds, with each feed consisting of a length of S tin wire, between a pressure rod and a guide pin. During each feed, the pressure rod and guide pin work together to bend the tin wire by an angle of 360° / N. Before the Nth feed, the tin ring to be formed is separated from the coiled tin wire by a wire cutter. Then, the pressure rod and guide pin work together to form the cut tin wire into a tin ring.

[0034] Preferably, the diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the pressure rod and the central axis of the guide pin is L, N=L / ∣(D / 2-A / 2)∣, N is rounded to the nearest integer, and D≠A.

[0035] Preferably, when D = A, N = L / 0.1, and N is rounded to the nearest integer.

[0036] Preferably, the diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the wire pressing rod and the central axis of the guide pin is L, and the length of each wire feed is S = (D / 2 + A / 2) * 2 π / N.

[0037] The present invention also discloses an automatic tin ring preparation device, including a feeding unit, a guide needle unit, a wire pressing unit and a wire cutting unit, wherein the feeding unit controls the feeding of tin wire through an automatic tin ring preparation method.

[0038] Preferably, the feeding unit includes a PLC and a stepper motor. The PLC is connected to the stepper motor, and the motor shaft of the stepper motor is connected to the wire feeding wheel through a transmission gear set.

[0039] Preferably, the wire pressing unit includes a wire pressing rod, a wire winding motor, a rotating block, and a wire pressing connecting block. The motor shaft end of the wire winding motor is connected to the rotating block, and the rotation angle of the rotating block is α, -90°≤α≤+90°. The rotating block is connected to the wire pressing connecting block, and the wire pressing rod is connected to the wire pressing connecting block.

[0040] Preferably, the rotating block is semi-circular, the wire-pressing connecting block is cuboid, and the wire-pressing connecting block is fixed to the end face of the semi-circular block.

[0041] Preferably, a wire support unit is provided downstream of the feeding unit. The wire support unit includes a wire support cylinder and a wire support fixing block. The wire support fixing block is U-shaped and is fixed to the telescopic end of the wire support cylinder. The telescopic direction of the wire support cylinder is perpendicular to the axis of the solder wire.

[0042] Preferably, the slicing unit includes a slicing cylinder, a slicing blade fixing block, and a slicing blade. The slicing cylinder has a telescopic end, and a slicing blade is fixedly connected to it. The telescopic direction of the slicing cylinder is at an angle to the axial direction of the solder wire, and the arrangement direction of the slicing blade is consistent with the telescopic direction of the slicing cylinder.

[0043] Preferably, the feeding unit controls the wire feeding stepper motor 202 via PLC. The wire feeding stepper motor 202 is mounted on the wire feeding motor mounting base 203, which is mounted on the mounting base plate 101. The shaft end of the wire feeding stepper motor 202 is connected to the wire feeding motor drive gear 204, which drives the four wire feeding motor driven gears 205 mounted on the mounting base plate 101 to move forward. The other end of the shaft of the wire feeding motor driven gear 205 is equipped with a wire feeding wheel 106. Different models of wire feeding wheels 106 can be installed. The wire feeding diameter of the wire feeding wheel 106 can be selected according to the requirements. The wire is fed by clamping the wire in the middle diameter of the wire feeding wheel 106 and moving axially. The wire feeding length is controlled by setting the rotation angle of the wire feeding wheel 106, and the wire feeding accuracy is 0.01 mm.

[0044] Preferably, the rotating block 126 is driven by the wire winding motor 128, and the rotating block 126 can rotate from -90 degrees to +90 degrees. The wire pressing connecting block 122 is installed on the rotating block 126. The wire winding motor 128 drives the rotating block 126 to drive the wire pressing connecting block 122 to move circumferentially, thereby driving the wire pressing rod 121 to rotate.

[0045] Preferably, the slicing unit controls the slicing blade 115 fixed on the slicing blade fixing block 114 of the slicing cylinder 113 to cut the tin wire. The slicing blade 115 is connected to the slicing cylinder 113 through the slicing blade fixing block 114.

[0046] Preferably, the guide pin unit of the vertical shaft can be replaced with a stepped shaft guide pin 116 of different sizes as needed. The stepped shaft guide pin 116 is installed on the guide pin fixing seat 123. The stepped shaft guide pin 116 is mounted on the guide pin fixing seat 123 by side fastening and locking. The guide pin fixing seat 123 is installed on the wire winding fixing seat 125. A semi-circular hole is milled in the middle of the wire winding fixing seat 125. The wire pressing connecting block 122 can move axially in the semi-circular hole milled in the middle of the wire winding fixing seat 125.

[0047] Preferably, the shaping unit is assembled from a shaping cylinder 118 and a wire-supporting cylinder 120. The head of the shaping cylinder 118 is respectively equipped with a semi-circular tin ring shaping claw block 402. The shaping claw 402 closes into a complete ring as the shaping cylinder 118 closes. The front end of the telescopic wire-supporting cylinder 120 is equipped with a fork-shaped wire-supporting fixing block 117.

[0048] Preferably, the specific steps include: Step 1, installing solder wire, resetting the program, and rotating the wire pressing module of the wire pressing mechanism to a -90 degree angle to wait; Step 2, feeding the solder wire along the wire feeding wheel forward to the length of three-quarters of the solder ring; Step 3, the motor drives the wire pressing module of the wire pressing mechanism to rotate from a -90 degree angle to a 90 degree angle to press the solder wire, and then retracts to a -90 degree angle to wait; Step 4: feeding the remaining one-quarter length of the solder ring forward along the wire feeding wheel; Step 5: the motor drives the wire pressing module of the wire pressing mechanism to rotate from a -90 degree angle to a 90 degree angle to press the solder wire, and then retracts to a 0 degree angle to wait; Step 6: the shaping unit's solder ring support cylinder extends; Step 7: the cutting unit's cutting cylinder drives the cutter to cut the solder wire upwards along the guide direction, and the solder ring falls onto the fork of the shaping unit's solder ring support along the guide needle; Step 8: the shaping unit's gripper cylinder closes, clamping the solder ring 403, closing the solder ring and the rounded solder ring 403-1. Step 9: The gripper cylinder of the shaping unit opens, the solder ring cylinder of the shaping unit retracts, and the solder ring falls along the guide pin.

[0049] This invention has a simple structure and is easy to use. Based on the principle of a bending machine, the wire feeding mechanism, the circular guide post, and the wire pressing mechanism work together to prepare tin wire into a semi-circular to a full-circular tin ring. It can automatically wind out a semi-circular to a full-circular tin ring of the corresponding shape and size by using the shape of the circular guide post and the shaping device.

[0050] Those skilled in the art will readily understand that the above are merely preferred embodiments of the present invention and are not intended to limit the invention. Any modifications, combinations, substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the protection scope of the present invention.

Claims

1. An automated method for preparing tin rings, characterized in that: The automatic tin ring preparation device uses a wire coil to feed N pieces of wire, each feeding a piece of wire of length S between the wire pressing rod and the guide pin. During each feed, the wire pressing rod and the guide pin work together to bend the wire by an angle of 360° / N. Before the Nth feed, the tin ring to be formed is separated from the wire coil by a wire cutting blade. Then, the wire pressing rod and the guide pin work together to form the cut wire into a tin ring. The automatic tin ring preparation device includes a feeding unit, a guide pin unit, a wire pressing unit, and a wire cutting unit. The wire pressing unit includes a wire pressing rod, a wire winding motor, a rotating block, and a wire pressing connecting block. The rotating block is connected to the motor shaft of the wire winding motor. The rotation angle of the rotating block is α, -90°≤α≤+90°. A wire pressing connecting block is connected to the rotating block, and a wire pressing rod is connected to the wire pressing connecting block. The rotating block is semi-circular, and the wire pressing connecting block is rectangular. The wire pressing connecting block is fixed to the end face of the semi-circular plate.

2. The automatic preparation method of tin rings according to claim 1, characterized in that: The diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the pressure rod and the central axis of the guide pin is L, N = L / |(D / 2-A / 2)|, N is rounded to the nearest integer, and D≠A.

3. The automatic preparation method of tin rings according to claim 2, characterized in that: When D=A, N=L / 0.1, and N is rounded to the nearest integer.

4. The automatic preparation method of tin rings according to claim 1, characterized in that: The diameter of the guide pin is D, the diameter of the solder wire is A, the distance between the central axis of the wire pressing rod and the central axis of the guide pin is L, and the length of each wire feed is S = (D / 2 + A / 2) * 2 π / N.

5. The automatic preparation method of tin rings according to claim 1, characterized in that: The feeding unit includes a PLC and a stepper motor. The PLC is connected to the stepper motor, and the motor shaft of the stepper motor is connected to the wire feeding wheel through a transmission gear set.

6. The automatic preparation method of tin rings according to claim 1, characterized in that: Downstream of the feeding unit is a wire support unit, which includes a wire support cylinder and a wire support fixing block. The wire support fixing block is U-shaped and is fixed to the telescopic end of the wire support cylinder. The telescopic direction of the wire support cylinder is perpendicular to the axis of the solder wire.

7. The automatic preparation method of tin rings according to claim 1, characterized in that: The slicing unit includes a slicing cylinder, a slicing blade fixing block, and a slicing blade. The slicing cylinder is provided at its telescopic end, and a slicing blade is fixedly connected to the slicing cylinder. There is an angle between the telescopic direction of the slicing cylinder and the axial direction of the solder wire. The arrangement direction of the slicing blade is consistent with the telescopic direction of the slicing cylinder.

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