Waterproof device semi-finished product and method for manufacturing the same

Abstract

The application discloses a manufacturing method of a waterproof device semi-finished product, which comprises the following steps: forming a first wire strip by using an insulating material to coat a wire through injection molding, sticking, braiding and winding and other methods; cutting the wire in the first wire strip according to a preset length to form a second wire strip which is connected by the insulating material in the first wire strip only; welding a chip on the second wire strip respectively to form a second wire strip with a chip, namely a semi-finished wire strip; and pouring plastic on the outer surface of the semi-finished wire strip through injection molding to form the waterproof device semi-finished product, wherein the plastic layer completely covers the outer surface of each semi-finished structure unit. According to the manufacturing method, the semi-finished wire strip connected by the insulating material in the first wire strip is sent into a wire injection molding device, so that the insulating material at the break position of the connected first wire strip is melted or pulled and broken at high temperature in the wire injection molding device, and meanwhile, the insulating material in the first wire strip, the wire and the outer surface of the chip are completely poured and covered with a plastic layer again, so that the cutting surface of a single waterproof device semi-finished product does not have a sandwich structure.

Description

Technical Field

[0001] This invention relates to the field of waterproof device technology, and in particular to a waterproof device semi-finished product and its manufacturing method. Background Technology

[0002] With the continuous advancement of technology, the application of waterproof devices is becoming increasingly widespread, and the market demands stricter requirements for waterproof and moisture-proof properties. As a preliminary step in the manufacturing process of waterproof devices, semi-finished waterproof devices typically involve cutting the wires, soldering on the chips, and then applying a potting process to prevent moisture from entering the chips. Obviously, since the composition of the potting compound and the plastic material of the wires are very different, it is impossible for the two to be completely integrated. Moreover, there are dozens of different types of plastics for wires based on their temperature resistance, making it even more difficult to integrate the potting compound and the plastic of the wires.

[0003] In some cases (such as the plastic of high-temperature wires), the potting compound and the plastic may not bond tightly enough, allowing moisture in the air to gradually seep into the chip through the gaps in the interlayer, thus causing the waterproof device to fail. Furthermore, the plastic of high-temperature wires does not adhere well to any type of adhesive. Therefore, there are significant obstacles to further improving the waterproof and moisture-proof capabilities using current manufacturing technology for waterproof devices. Summary of the Invention

[0004] According to a first aspect of the present invention, a method for manufacturing a semi-finished waterproof device is provided, comprising: providing a semi-finished wire strip, wherein the semi-finished wire strip is welded with a chip and has breaks at predetermined lengths, such that the semi-finished wire strip is divided into a plurality of semi-finished structural units, adjacent semi-finished structural units being connected by an insulating material in the first wire strip; and feeding the semi-finished wire strip into a wire injection molding machine for plastic injection molding, wherein, when the semi-finished wire strip is fed into the wire injection molding machine for plastic injection molding, the insulating material at the breaks in the semi-finished wire strip must be broken, so that the molten plastic layer completely covers the outer surface of each semi-finished structural unit, thereby forming an injection-molded strip composed of a plurality of end-to-end connected semi-finished waterproof devices.

[0005] For example, the semi-finished wire strip includes multiple semi-finished structural units, each of which includes multiple sets of wires, chips, and an insulating structure attached to and fixing the multiple sets of wires and the chips apart.

[0006] For example, the semi-finished structural unit can be formed by the following steps: forming a first wire strip with insulating material and multiple sets of wires, the first wire strip including multiple sets of wires and an insulating structure attached to and spaced apart from the multiple sets of wires and fixed, each set of wires including at least two wires and extending in the length direction; welding chips onto the wires of the first wire strip at predetermined lengths; and stamping and cutting the wires in the first wire strip with the welded chips to produce multiple breaks, forming a second wire strip with chips, wherein the second wire strip with chips between two breaks constitutes a semi-finished structural unit.

[0007] For example, the semi-finished structural unit can be formed by the following steps: forming a first wire strip with insulating material and multiple sets of wires, the first wire strip including multiple sets of wires and an insulating structure attached to and spaced apart and fixed to the multiple sets of wires, each set of wires including at least two wires and extending in the length direction; stamping the wires of the first wire strip to a predetermined length to create a break, forming a second wire strip; and welding a chip at the break position of the wire to connect one end of the wire to form a second wire strip with a chip, wherein the second wire strip with a chip between the two breaks constitutes a semi-finished structural unit.

[0008] For example, two adjacent semi-finished structural units are connected by insulating material in the first wire strip, and the two adjacent semi-finished structural units are separated by a break, and each semi-finished structural unit has a chip.

[0009] For example, the plastic layer material is a plastic material used for injection molding, and its temperature resistance range is between -60°C and 350°C.

[0010] For example, the melting temperature at which the insulating material in the first wire strip needs to melt is less than or equal to the melting temperature of the plastic layer, and the melting temperature at which the insulating material in the first wire strip needs to melt is less than or equal to the operating temperature of the wire injection molding equipment, so that when injecting plastic in the wire injection molding equipment, the insulating material at the break point of the semi-finished wire strip can be melted or torn off.

[0011] For example, the width of the break must cut off all the wires in the first wire strip; and the length of the break is designed such that, after being injected with plastic in the wire injection molding equipment, it is greater than the length of the chip after the wires are welded at the break location.

[0012] For example, a first wire strip is formed on a conductor by injection molding, bonding, or braiding, wherein the insulating material includes a film, braided wire strip, bakelite, or a first plastic.

[0013] For example, the chip includes at least one of NTC, PTC, phototube, magnetotube, conductive wire, and circuit board with components; and / or, each independent semi-finished structural unit contains at least one chip, and the number of effective pins on the chip is the same as the number of wires in the conductor group.

[0014] According to a second aspect of the present invention, a method for manufacturing a finished waterproof device is provided, comprising a method for manufacturing a semi-finished waterproof device, the method further comprising: cutting an injection-molded strip composed of multiple semi-finished waterproof devices connected end-to-end at a break point according to the position of the chip, thereby forming a plurality of individual semi-finished waterproof devices, and through tail processing, forming a finished waterproof device; of course, some finished waterproof devices require the addition of a metal shell, metal tube or metal sticker at the position of the chip in the semi-finished waterproof device.

[0015] For example, the outer surface of each of the aforementioned waterproof device semi-finished products is completely covered by a plastic layer.

[0016] According to a third aspect of the present invention, a waterproof device semi-finished product is provided, which is manufactured using the aforementioned manufacturing method. For example, the waterproof device semi-finished product includes: a semi-finished wire strip, the semi-finished wire strip being arranged sequentially at intervals in the length direction; and a plastic layer, the plastic layer covering the outer surface of the semi-finished structural unit to completely enclose the outer surface of each semi-finished structural unit, wherein two adjacent semi-finished structural units are connected through the plastic layer.

[0017] According to a fourth aspect of the present invention, a finished waterproof device is provided, comprising: the aforementioned semi-finished waterproof device; and a housing disposed on the outer surface of a chip within the semi-finished waterproof device. For example, the housing is constructed as a metal layer, a metal tube, or a metal sticker. Depending on the position of the chip, the semi-finished waterproof device is cut at the wire breakage point, and its tail is then stripped, tinned, or fitted with terminals and sockets to form a plurality of individual finished waterproof devices.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.

[0020] Figure 1 This is a flowchart of a method for manufacturing a semi-finished waterproof device according to some embodiments of the present invention;

[0021] Figure 2AThis is a schematic diagram of a first wire strip arranged as a single-layer conductor according to some embodiments of the present invention;

[0022] Figure 2B This is a schematic diagram of stamping and cutting a second wire strip on a first wire strip according to some embodiments of the present invention;

[0023] Figure 2C This is a schematic diagram of a second wire strip (i.e., a semi-finished wire strip) with a chip according to some embodiments of the present invention;

[0024] Figure 3A This is a schematic diagram of a first wire strip with a chip according to some embodiments of the present invention;

[0025] Figure 3B yes Figure 3A A schematic diagram of a second wire strip (i.e., a semi-finished wire strip) with a chip;

[0026] Figure 4 This is a schematic diagram of a first wire strip arranged as a single-layer conductor according to some embodiments of the present invention;

[0027] Figure 5 This is a schematic diagram of a first wire strip arranged as a multilayer conductor according to some embodiments of the present invention;

[0028] Figure 6 This is a schematic diagram of a first wire strip arranged as a multilayer conductor according to other embodiments of the present invention;

[0029] Figure 7 This is a schematic diagram of a wire injection molding apparatus according to some embodiments of the present invention;

[0030] Figure 8 This is a schematic diagram of an injection-molded tape consisting of multiple semi-finished waterproof devices connected end to end, produced according to some embodiments of the present invention.

[0031] Figure 9 yes Figure 8 Cross-sectional view of the injection molding strip in the middle;

[0032] It should be noted that, for clarity, the dimensions of structures or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale.

[0033] Figure label:

[0034] 100 semi-finished structural units

[0035] The first wire strip is 200.

[0036] The second wire strip is 300mm.

[0037] Wire injection molding machine 400, guide roller 401, die head 402.

[0038] Break 10,

[0039] Insulating material 20 in the first wire strip

[0040] Conductor group 30, conductor 31,

[0041] The head 40 of the semi-finished structural unit

[0042] The tail 50 of the semi-finished structural unit

[0043] Chip 60, 61 active pins.

[0044] Plastic layer 500. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0046] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0047] In this document, unless otherwise specified, directional terms such as "up," "down," "left," "right," "inner," and "outer" are used to indicate orientation or positional relationships based on the accompanying drawings, and are used only for the convenience of describing this disclosure, and are not intended to indicate or imply that the device, element, or component referred to must have a specific orientation, or be constructed or operated in a specific orientation. It should be understood that when the absolute position of the described object changes, the relative positional relationships they represent may also change accordingly. Therefore, these directional terms should not be construed as limitations on this disclosure.

[0048] With the continuous advancement of technology, the application of waterproof devices is becoming increasingly widespread, and the market demands stricter requirements for their waterproof and moisture-proof properties. Waterproof device semi-finished products, as the initial basic process in manufacturing finished waterproof devices, typically involve cutting the wires, soldering on the chip, and then applying a potting compound to prevent moisture from entering the chip. Clearly, because the composition of the potting compound and the plastic composition of the wires are very different, it is difficult to achieve complete fusion between the two. Furthermore, there are dozens of different types of plastic used for wires, based on their temperature resistance, making it even more difficult to achieve complete fusion between the potting compound and the wire plastic. Even if a shell is placed at the chip location and its length is increased, it is still difficult to completely prevent moisture from entering the chip.

[0049] When using plastic for wires with varying temperature resistance, the bonding between the potting compound and the plastic can be insufficient. This allows moisture from the air to gradually seep into the chip through the gaps in the interlayer, leading to the failure of the waterproof device. Furthermore, for high-temperature wire materials that do not adhere to any adhesive, traditional potting processes are ineffective for waterproofing, necessitating the use of longer casings. Therefore, current manufacturing technology for waterproof devices faces significant obstacles in further improving their waterproof and moisture-proof capabilities.

[0050] The waterproof device semi-finished product provided in this embodiment of the invention is completely wrapped by the second injection of plastic. That is, after cutting, the cut surface is also covered by the second injection of plastic. This solves the problem of waterproof failure caused by insufficient bonding between the plastic material and the potting compound in most wires in the prior art, and also solves the problem of some high-temperature wires not being waterproof.

[0051] The embodiments of the present invention also provide a method for manufacturing the above-mentioned waterproof device semi-finished product. Using the manufacturing method provided by the embodiments of the present invention, a waterproof device semi-finished product with the above-mentioned structural features and advantages can be directly obtained.

[0052] It should be noted that the waterproof device finished products provided in the embodiments of the present invention are not limited to a specific type. That is to say, the manufacturing method of the waterproof device semi-finished products provided in the embodiments of the present invention is applicable to the manufacturing of all types of waterproof device semi-finished products and waterproof device finished products.

[0053] Figure 1 A flowchart illustrating a method for manufacturing a semi-finished waterproof device according to an embodiment of the present invention is shown.

[0054] like Figure 1 As shown, this embodiment includes operations S110-S140, which will be referred to below. Figures 2A-6 The described embodiments, through Figure 1 The manufacturing method of the present invention will be described in detail below.

[0055] In operation S110, an insulating material is used to form a first wire strip 200 on the conductors through methods such as injection molding, bonding, and braiding. The first wire strip 200 includes at least two conductors 31 and insulating material 20 connecting the at least two conductors 31. The at least two conductors 31 extend in the length direction and are arranged in the horizontal direction and / or the stacking direction. The insulating material 20 in the first wire strip 200 can be a film material, braided wire strip, bakelite, or a first plastic, etc. It should be noted that when the insulating material 20 in the first wire strip 200 is plastic, for ease of description, the plastic of the insulating material 20 in the first wire strip 200 can be referred to as the first plastic, and the plastic formed by re-injection molding using the wire injection molding equipment described below can be referred to as the plastic layer 500.

[0056] The number of wires 31 can be set according to the required number of effective pins 61 of chip 60, and then they extend in the length direction. The length direction refers to the extension direction of wire 31, the horizontal direction refers to the horizontal arrangement direction of wire 31, and the stacking direction refers to the vertical arrangement direction of wire 31. Of course, for aesthetic purposes and subsequent operation, as an optional embodiment, multiple wires 31 can be arranged in parallel.

[0057] Depending on the requirements, multiple conductors 31 can be arranged in close proximity or in a dispersed manner.

[0058] In one embodiment, such as Figure 2A As shown, three conductors 31 extend in the length direction and are arranged in the horizontal direction, presenting three conductors 31 on the same horizontal plane, two of which are closely arranged, and the third is a certain distance away from the other two.

[0059] In another embodiment, such as Figure 3A As shown, two conductors 31 extend in the length direction, are arranged in the horizontal direction, and are arranged closely together.

[0060] Figure 4 yes Figure 2A and Figure 3A The arrangement of the central conductor 31 will not be elaborated here.

[0061] In yet another embodiment, such as Figure 5 As shown, four conductors 31 extend in the length direction and are arranged in the horizontal and stacking directions. Two of the four are arranged closely in the stacking direction, presenting a conductor assembly 30 with a two-layer structure. Of course, it can also be arranged as follows... Figure 6 As shown, five conductors 31 are tightly connected, with two forming the first layer and the remaining three forming the second layer.

[0062] If the insulation material in the first wire strip is a first type of plastic, after the wire 31 is placed, it is injected through the wire injection molding equipment 400 (refer to...). Figure 7 The first plastic is poured onto the conductor 31 to form the first wire strip 200, which can be used as follows: Figure 2A , 3A As shown in Figures 4, 5, and 6, the first plastic is in a molten state at high temperature. It is poured into and covers the outer surface of the conductor using a wire injection molding machine, connecting the wires 31. After the first injection of plastic cools, it forms the first plastic 20 in the first wire strip 200. This can be understood as the insulating material 20 in the first wire strip 200 fixing the position of each wire 31.

[0063] In operation S120, the conductors 31 within the first wire strip 200 are stamped and cut according to a preset length to form a second wire strip 300 with multiple breaks 10. In the second wire strip 300, the breaks 10 are connected only by the insulating material 20 within the first wire strip 200. It should be noted that the second wire strip 300 with a chip 60 between two breaks 10 constitutes the semi-finished structural unit 100.

[0064] It is understood that the first wire strip 200 serves as the basis for manufacturing multiple semi-finished waterproof devices. It is cut to the required length by the customer, forming a break 10. In this embodiment of the invention, after the initial pouring, the first wire strip 200 is first stamped and cut, with the cut length predetermined according to the customer's requirements. That is, the final length of the finished waterproof device is based on the length cut at this point.

[0065] In this invention, only the conductor 31 is cut off. After processing the first wire strip 200, all the conductors 31 have been cut to the required length, forming a break 10. However, because the insulating material 20 in the first wire strip 200 that initially connects the conductors 31 through injection molding is not completely broken, the second wire strip 300 is connected by the insulating material 20 in the first wire strip 200, and is an uninterrupted wire strip.

[0066] According to one embodiment of the present invention, a plurality of cuts 10 are formed at the cut-off point of the conductor 31. The width of the cuts 10 in the horizontal direction is at least greater than the diameter of the conductor 31 and the conductor group 30, so that the diameter of the conductor 31 and the conductor group 30 can be cut off. That is to say, the width of the cuts must cut off all the conductors in the first wire strip 200.

[0067] In embodiments of the present invention, the width of the break 10 in the horizontal direction is defined to ensure that all conductors 31 are broken while still allowing the broken conductors 31 to be connected by the insulating material 20 in the first wire strip 200. Only one operation is required on multiple semi-finished structural units 100 (i.e., semi-finished wire strips) of a certain length; that is, after feeding the semi-finished wire strips into the wire injection molding equipment 400, subsequent operations for the production of waterproof device semi-finished products can be completed automatically, offering advantages of saving time and labor.

[0068] It should be noted that when the conductors 31 are closely arranged, the spacing between the conductors 31 is very small, so the implementation of cutting a single conductor may not be practical. The closely arranged conductors 31 can be punched and cut as a whole. The width of the cut 10 is greater than the sum of the diameters of the closely arranged conductors 31, that is, greater than the diameter of the conductor group 30. In other words, the cut width must cut off all the conductors in the first wire strip.

[0069] like Figure 2B As shown, two of the three parallel conductors 31 are closely arranged. Therefore, each semi-finished structural unit is provided with two breaks 10. One break 10 has a width in the horizontal direction that is greater than the diameter of the conductor 31, and the other break 10 has a width in the horizontal direction that is greater than the sum of the diameters of the two closely arranged conductors 31. That is, the width of the break must cut off all the conductors in the first wire strip.

[0070] At least one chip 60 is provided in each finished waterproof device, and the same applies to semi-finished waterproof devices. In the embodiments of the present invention, two methods for soldering the chip 60 are provided to solder the chip 60 on the second wire strip 300.

[0071] In one embodiment, the conductors 31 within the first wire strip 200 are first stamped and cut to a preset length, and then the chip 60 is soldered onto the conductors 31 to form a second wire strip 300 with multiple breaks 10. In the second wire strip 300, the breaks are connected only by the insulating material 20 in the first wire strip 200. The length of the breaks 10 is designed such that after being re-injected using a wire injection molding machine, it must be greater than the length of the chip 60 after the conductors are soldered at the breaks.

[0072] In this embodiment, a pre-punching and post-soldering method is adopted. In this method, because the punching process is performed first, the head position of each waterproof device semi-finished product can be accurately located, and the chip 60 is soldered to the head position. When soldering the chip 60, the effective pins 61 of the chip can be directly soldered to the wire 31, and the chip 60 is made to conform to the second wire strip 300, so that the second wire strip 300, the chip 60, and the connection between the chip 60 and the wire 31 can be completely wrapped by the plastic layer 500 during the re-injection molding process. The chip 60 conforming to the second wire strip 300 helps to reduce space in the stacking direction. Due to the pre-punching process, the second wire strip 300 is only connected by the insulating material 20 in the first wire strip 200 between the breaks, allowing it to move on the assembly line.

[0073] The method of punching before welding is as follows Figure 2B and Figure 2C As shown, in Figure 2B First, cut the conductor 31 in the first wire strip 200. Figure 2C Chips 60 are welded at each break 10 to serve as the head of the semi-finished waterproof device, forming a second wire strip 300 with chips 60, i.e., multiple semi-finished structural units 100, i.e., semi-finished wire strips.

[0074] The method of welding first and then punching is as follows Figure 3A and Figure 3B As shown, the chip 60 is first soldered onto the wire 31. Then, the wire 31 within the first wire strip 200 is stamped and cut according to a preset length, forming a second wire strip 300 with multiple breaks 10. In the second wire strip 300, the breaks are connected only by the insulating material 20 in the first wire strip 200. The length of the breaks 10 is designed such that, after being re-injected using a wire injection molding machine, it must be greater than the length of the chip 60 after the wires are soldered at the break locations.

[0075] In this embodiment, a pre-soldering followed by stamping method is adopted. In this method, since the first wire strip 200 is not stamped, the wire 31 can move on the production line as a "skeleton" and the chip 60 is soldered on the first wire strip 200.

[0076] The method of welding first and then punching is as follows Figure 3A , 3B As shown, in Figure 3A First, the chip 60 is soldered onto the first wire strip 200. Then, multiple breaks 10 are punched out at the chip 60 at the head, as shown in 3B, to form a second wire strip 300 with the chip 60, that is, multiple semi-finished structural units 100, that is, semi-finished wire strips.

[0077] It should be noted that the number of effective pins 61 of chip 60 is the same as the number of wires 31. For example, in Figure 2CThe chip 60 has three active pins 61, therefore the second wire strip 300 has three wires 31, and the three active pins 61 are soldered to each wire 31 respectively; for example, in Figure 3B The chip 60 has two active pins 61, so the second wire strip 300 has two wires 31, and the two active pins 61 are soldered to each wire 31 respectively. It should be noted that one chip 60 or multiple chips 60 can be set in a semi-finished structural unit 100.

[0078] It is important to note that, to prevent the chip 60 at the head of one semi-finished structural unit 100 from bonding together with the wire 31 at the tail of another semi-finished structural unit 100 during re-injection molding, which could lead to the chip 60 being easily cut off later, the length of the break 10 is designed such that, after re-injection molding using wire injection molding equipment, it must be longer than the length of the chip 60 after the wire is welded at the break position; the specific amount of this extra length depends on the actual equipment debugging results. This avoids the problem of adjacent semi-finished structural units 100 easily cutting off the chip 60 at the break position after re-injection molding, thus preventing them from being separated.

[0079] It should be pointed out that, Figure 2B , Figure 2C and Figure 3B The width of the break 10 shown is only a schematic diagram of cutting the wire 31 and a schematic diagram of leaving a certain distance in both the length and horizontal directions. The shape of the break 10 is not limited here. Any shape that meets the above requirements is within the protection scope of this invention.

[0080] In operation S130, multiple connected second wire strips 300 (i.e. semi-finished wire strips) with chips 60 are fed into the wire injection molding equipment 400.

[0081] To prevent delamination from occurring during subsequent cutting of the injection-molded tape, the insulating material 20 in the first wire tape 200, which serves to connect adjacent semi-finished structural units 100 in the second wire tape 300, must be disconnected. In other words, the insulating material 20 in the first wire tape 200, which serves to connect in the horizontal direction at the break point 10, needs to be disconnected.

[0082] After multiple semi-finished structural units 100 (i.e. semi-finished wire strips) are fed into a wire injection molding machine 400 with a certain temperature, they are made to run at a certain speed. Then, the temperature inside the wire injection molding machine 400 is increased. Considering factors such as the shape and thickness of the break 10, the insulating material 20 in the first wire strip 200 will gradually melt or be torn off, so that the plastic layer 500 completely covers the outer surface of the insulating material 20 in the first wire strip 200, the outer surface of the conductor group 30, and the outer surface of the chip 60.

[0083] According to some exemplary embodiments of the present invention, the specific process includes: feeding a plurality of semi-finished structural units 100 (i.e., semi-finished wire strips) into a wire injection molding machine 400; and melting or tearing the insulating material 20 at the break 10 of the first wire strip 200 to form an injection-molded strip composed of a plurality of waterproof device semi-finished products connected end to end.

[0084] 400 wire injection molding equipment Figure 7 As shown, by controlling the temperature and pressure of the head 402 of the wire injection molding equipment 400 and the speed of the guide wheel 401 transmission, as well as adjusting factors such as the shape and thickness of the break 10, the insulating material 20 at the break 10 position of the first wire strip 200 is melted or torn off at the high temperature of the head 402 during the injection molding process of multiple semi-finished structural units 100 (i.e., semi-finished wire strips).

[0085] In operation S140, specifically, after plastic is poured onto the outer surface of multiple semi-finished structural units 100 (i.e., semi-finished wire strips) by wire injection molding equipment 400, an injection-molded strip composed of multiple waterproof device semi-finished products connected end to end is formed; wherein, the plastic formed by pouring plastic through wire injection molding equipment 400 is called plastic layer 500 (refer to...). Figure 9 The plastic layer 500 completely covers the outer surface of each semi-finished structural unit 100, and two adjacent semi-finished structural units 100 are connected through the plastic layer 500, which is formed by plastic injection molding and cooling.

[0086] During the injection molding process of multiple semi-finished structural units 100 (i.e., semi-finished wire strips), the insulating material 20 at the break 10 position in the first wire strip 200 is melted or torn, leaving a space at the melted point so that the plastic layer 500 after injection molding can completely fill the space at the melted point and connect two adjacent semi-finished structural units 100; at the same time, the plastic layer 500 completely covers the outer surface of each semi-finished structural unit 100, that is, the outer surface of the chip 60 inside the semi-finished structural unit 100, the welding point of the effective pin 61 and the wire 31, the insulating material 20 in the first wire strip 200, and the outer surface of the wire 31 are completely covered by the plastic layer 500, and then immediately immersed in water for cooling, forming an injection-molded strip composed of multiple waterproof device semi-finished products connected end to end, such as Figure 8 , Figure 9 As shown.

[0087] If the insulating material in the first wire strip is the first plastic, that is, the first plastic used in the initial injection molding, then the plastic layer is the plastic used in the subsequent injection molding. The first plastic and the plastic layer are only used to distinguish the effects produced after the initial injection and the subsequent injection, not to limit the plastic material. In other words, the first plastic and the plastic layer can be the same type of plastic material.

[0088] To ensure that the insulating material in the first wire strip 200 is melted or torn at the break 10 after injection molding, the melting temperature of the insulating material in the first wire strip 200 is less than or equal to the melting temperature of the plastic layer 500, and also less than or equal to the operating temperature of the wire injection molding equipment 400.

[0089] It should be noted that the insulating material in the first wire strip 200 may include a film, braided wire strip, bakelite or first plastic, etc., and may also contain metal wires in the insulating material layer. However, as long as the insulating material in the first wire strip 200 at the break point is torn or melted during the secondary injection molding, the plastic layer 500 of the re-injected plastic layer can completely cover the outer surface of the insulating material 20, the wire 31 and the chip 60.

[0090] It should be noted that the metal wires in the insulation material of the first wire strip 200 are only used to strengthen the insulation material 20 in the first wire strip 200 and are not connected to the effective pins of the chip. They are different from the conductors in the first wire strip 200.

[0091] According to the manufacturing method provided in the embodiments of the present invention, after feeding multiple semi-finished structural units 100 (i.e. semi-finished wire strips) connected only by the first plastic 20 in the first wire strip 200 into a wire injection molding equipment 400 with a temperature, and making it run at a certain speed, the temperature inside the wire injection molding equipment 400 is increased, so that the first plastic 20 connected to the break position of the first wire strip 200 is melted or pulled off by the high temperature inside the wire injection molding equipment 400. At the same time, a plastic layer 500 is again covered on the outer surface of the first plastic 20, the wire 31 and the chip 60 in the first wire strip 200. The plastic layer 500 injected again completely covers the outer surface of the first plastic 20, the wire 31 and the chip 60 in the first wire strip 200. In this way, the cross-section of the waterproof device semi-finished product after cutting will not have a sandwich structure.

[0092] In embodiments of the present invention, when the insulating material and the plastic layer in the first wire strip are both plastic materials, they may include plastic materials for high-temperature wires, such as polytetrafluoroethylene (PTFE), perfluoro(ethylene propylene) copolymer (FEP), polyperfluoroalkoxy (PFA) resin, polychlorotrifluoroethylene (PCTFF), ethylene-chlorotrifluoroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), silicone, rubber, etc.; and plastic materials for low-temperature wires, such as polyvinyl chloride (PVC), radiation-cured polyvinyl chloride (XLPVC), polyethylene (PE), radiation-cured polyethylene (XLPE), polyurethane (PU), thermoplastic elastomer (TPE), polypropylene (PP), polymers of ethylene, propylene, or other higher olefins (PO), etc.

[0093] According to some exemplary embodiments of the present invention, the material of the plastic layer is an injection-moldable plastic material with a temperature resistance range between -60°C and 350°C.

[0094] Controlling the temperature resistance range of the insulating material 20 and the plastic layer in the first wire strip 200 can improve the heat and cold resistance of the finished waterproof device. In other words, the temperature resistance range of the finished waterproof device can be determined from the temperature resistance range of the insulating material 20 and the plastic layer 500 in the first wire strip 200. Through this advantage, the application range of the finished waterproof device can be greatly expanded, and the problem of waterproofing and moisture protection of the finished waterproof device in different temperature ranges between -60℃ and 350℃ can be solved.

[0095] According to some exemplary embodiments of the present invention, the working temperature in the wire injection molding equipment 400 needs to be higher than the melting temperature of the insulating material 20 in the first wire strip 200 in order for the insulating material in the first wire strip 200 to be completely melted after being re-injected at the break 10. At the same time, it is necessary to ensure that the plastic layer 500 is in a molten state at this temperature so as to wrap the insulating material in the first wire strip 200 and the semi-finished structural unit 100 that have melted at the break 10.

[0096] The insulation material and plastic layer in the first wire strip can both be made of high-temperature resistant plastic material. Since many high-temperature resistant plastic materials are immiscible, by manufacturing the waterproof device semi-finished product according to the method of this invention and controlling the relationship between atmospheric pressure and the thickness of the high-temperature resistant plastic material, a finished waterproof device with high temperature resistance and high waterproof properties can be obtained. This can even meet the stringent requirements of long-term operation under high pressure, such as underwater temperature measurement.

[0097] According to some exemplary embodiments of the present invention, the material of the conductor 31 is copper, silver, aluminum, iron or other alloy materials.

[0098] According to some exemplary embodiments of the present invention, chip 60 includes at least one of NTC, PTC, phototube, magnetotube, conductive wire, and circuit board with components.

[0099] The manufacturing method of the waterproof device finished product according to the present invention is a further processing based on the above-mentioned manufacturing method of the waterproof device semi-finished product. The manufacturing method further includes: cutting an injection molding strip composed of multiple waterproof device semi-finished products connected end to end according to the position of the chip to form a number of individual waterproof device semi-finished products; wherein the outer surface of each waterproof device semi-finished product is completely covered by a plastic layer.

[0100] The stamping cut-off area is completely covered by the plastic layer. The cutting position can be determined by the position of the chip at the head or by the position of the disconnected wire.

[0101] In some exemplary embodiments, an injection-molded strip consisting of multiple semi-finished waterproof devices connected end to end is cut at the cut end of the wire, and then its tail is stripped and tinned or terminal holes are drilled to form many individual waterproof device finished products; its chip-containing head is completely wrapped in plastic layer, which can achieve the effect of waterproof and moisture-proof.

[0102] To more clearly present the structural features of the semi-finished waterproof device, the structure of the semi-finished waterproof device will be further explained below.

[0103] According to an embodiment of the present invention, a waterproof device semi-finished product can be manufactured using the above-described method for manufacturing waterproof device semi-finished products. This method can produce an injection-molded tape composed of waterproof and moisture-proof waterproof device semi-finished products connected end to end. Its structural features include: multiple semi-finished product structural units and a plastic layer.

[0104] Specifically, the semi-finished wire strips are arranged at intervals along the length direction, and a plastic layer covers the outer surface of the semi-finished structural unit to completely wrap the outer surface of each semi-finished structural unit. Adjacent semi-finished structural units are connected by the plastic layer.

[0105] On the production line, the direction of the semi-finished wire strip after being connected end to end is consistent with the direction of the production line, such as... Figures 2A-2C As shown, the wires 31 of two adjacent semi-finished structural units 100 are cut at the break 10, and are connected only by the insulation material 20 in the first wire strip 200. It can be understood that the break 10 of the insulation material 20 in the first wire strip 200 can separate the two adjacent semi-finished structural units 100, and at the same time connect the two adjacent semi-finished structural units 100, so that they can move as a whole on the production line.

[0106] To achieve waterproofing and moisture-proofing, this invention covers the outer surface of each semi-finished structural unit with a plastic layer, completely encasing the outer surface of each unit. It is understood that even when a strip of injection-molded material, composed of multiple interconnected semi-finished structural units, is separated at the connecting plastic layer, each unit remains completely encased in the plastic layer, thus preventing moisture from entering the interior of the semi-finished structural unit.

[0107] According to the present invention, the waterproof device semi-finished product is obtained by covering the outer surface of each semi-finished product structural unit with a plastic layer and filling the break position where two adjacent semi-finished product structural units are connected with a plastic layer. After separating each semi-finished product structural unit and filling the break position with a plastic layer, each waterproof device semi-finished product is completely wrapped by the plastic layer. This solves the problem of water ingress failure of the finished waterproof device due to the loose bonding of the two plastic layers or the lack of adhesion due to material reasons.

[0108] According to some exemplary embodiments of the present invention, the semi-finished structural unit 100 includes: an insulating material 20, a conductor group 30, and a chip 60 in the first wire strip 200; the insulating material 20 in the first wire strip 200 may be a thin film material, a braided wire strip, bakelite, or a first plastic, etc.

[0109] Specifically, the conductor group 30 includes at least two conductors 31. The conductor group 30 is attached to the insulating material 20 in the first wire strip 200 and extends in the length direction. The chip 60 is disposed on the conductor group 30 and is soldered to the conductor group 30 through effective pins 61. The outer surface of the insulating material 20 in the first wire strip 200, the outer surface of the conductor group 30, and the outer surface of the chip 60 are all completely covered by the plastic layer 500.

[0110] The length direction is the extension direction of the conductor 31, which is consistent with the extension direction of the semi-finished structural unit 100 connected end to end. The horizontal direction is the arrangement direction of the conductor 31 in the horizontal direction, and the stacking direction is the arrangement direction of the conductor 31 in the vertical direction.

[0111] Within the semi-finished product structural unit 100, different numbers of wires 31 can be arranged according to the required number of effective pins 61 of the chip. Here, the number of effective pins and the number of wires are the same; then they are arranged in the length direction, horizontal direction, and / or stacking direction. For ease of description, the combination of all wires 31 is referred to as wire group 30. Preferably, the wires 31 within the wire group 30 can be arranged in parallel.

[0112] like Figure 2B and Figure 3BAs shown, the conductor group 30 is fixed by the insulating material 20 in the first wire strip 200. The insulating material 20 in the first wire strip 200 can be disposed between the conductors 31 within the conductor group 30, or it can be disposed on the periphery of the conductor group 30. The chip 60 is soldered to the conductor group 30 through effective pins 61. Figure 2C and Figure 3B The multiple semi-finished structural units 100 shown are fed into Figure 7 The wire injection molding equipment 400 shown in the diagram completely covers the outer surface of the insulating material 20, the outer surface of the conductor group 30, the outer surface of the chip 60, and the welding point between the chip 60 and the conductor group 30 in the first wire strip 200 with the plastic layer 500, so as to achieve the purpose of waterproofing and moisture-proofing.

[0113] It should be noted that a semi-finished structural unit 100 may contain one chip 60 or multiple chips 60.

[0114] According to some exemplary embodiments of the present invention, the conductor group 30 includes one end and another end, one end being provided with the head 40 of the semi-finished structural unit 100, and the other end being provided with the tail 50 of the semi-finished structural unit 100. In two adjacent semi-finished structural units 100, one end of the conductor group 30 on one semi-finished structural unit 100 is separated from the other end of the conductor group 30 on the other semi-finished structural unit 100 by a break, and both ends are connected by the insulating material 20 in the first wire strip 200.

[0115] In practical use, those skilled in the art typically refer to the end with the soldered chip 60 as the head 40 of the semi-finished structural unit, and the other end as the tail 50 of the semi-finished structural unit, separated by a break 10. When manufacturing the finished waterproof device, the semi-finished structural unit 100, which is connected head to tail, needs to be cut apart.

[0116] To prevent the chip 60 or the insulation material 20 and wire 31 in the first wire strip 200 from being exposed at the joint after cutting, the wire 31 with the chip 60 must be cut first to form multiple semi-finished structural units 100 (i.e., semi-finished wire strips). During the injection molding process, the heads and tails of the multiple semi-finished structural units 100 (i.e., semi-finished wire strips) connected by the insulation material 20 in the first wire strip 200 must be melted or torn off at the break point 10. In this way, the plastic layer 500 will completely cover the outer surface of the insulation material 20 in the first wire strip 200, the outer surface of the wire group, and the outer surface of the chip, achieving the purpose of waterproofing and moisture protection.

[0117] Understandably, the plastic layer covers not only the outer surface of the chip, the insulating material in the first wire strip, and the conductor, but also the cut surface after the wire is cut.

[0118] According to some exemplary embodiments of the present invention, the chip 60 is disposed on one end of the wire group, wherein, in two adjacent semi-finished structural units 100, the chip 60 on one semi-finished structural unit 100 and the other end of the wire group 30 on the other semi-finished structural unit are separated by a break, and the chip 60 and the other end are connected after being completely covered by the plastic layer 500.

[0119] It is important to note that, before cutting, since the chip 60 is located at the head 40 of the semi-finished structural unit 100, all chips 60 are situated between the head 40 of one semi-finished structural unit 100 and the tail 50 of another semi-finished structural unit 100. This is to prevent damage to the chip 60 when cutting the two connected semi-finished structural units 100, and also to ensure that the chip 60 is completely encased in the plastic layer 500 after cutting. Therefore, the soldered chip 60 must maintain a certain distance from the tail 50 of the other semi-finished structural unit 100. In other words, the length of the break 10 formed after the first wire strip 200 is cut is designed to be greater than the length of the chip 60 after the wire is soldered at the break point, after re-injection molding by the wire injection molding equipment. The exact length depends on the equipment's debugging results.

[0120] According to one embodiment of the present invention, the conductor group 30 is configured as a single layer, and the multiple conductors 31 within the conductor group 30 are arranged in the horizontal direction.

[0121] For reference, see single-layer conductor group 30. Figure 2A , Figure 3A and Figure 4 The number of conductors 31 in conductor group 30 can be set differently according to requirements, and multiple conductors 31 can be arranged on the same horizontal plane.

[0122] According to one embodiment of the present invention, the conductor group 30 is configured as multiple layers, each layer of conductor group 30 includes at least one conductor 31, and the conductor group 30 is arranged in the stacking direction.

[0123] For reference, see multi-layer conductor group 30. Figure 5 and Figure 6 In both figures, the conductor group 30 is arranged in a double layer.

[0124] According to some exemplary embodiments of the present invention, reference is made to Figure 8 The waterproof device semi-finished product obtained according to the above manufacturing method includes: an injection-molded strip composed of multiple waterproof device semi-finished products connected end to end, including a plastic layer 500 covering the semi-finished product wire strip, and the position of the break 10 inside.

[0125] Specifically, the semi-finished wire strip includes a plurality of semi-finished structural units 100 arranged sequentially at intervals along its length. For example, two adjacent semi-finished structural units 100 are connected by a plastic layer 500. Each semi-finished structural unit 100 includes a chip 60, a plurality of wire groups 30, and an insulating structure 20 attached to and spaced apart from the wire groups, thus fixing them in place. The plastic layer 500 covers the outer surface of each semi-finished structural unit 100 to completely enclose the outer surface of each semi-finished structural unit; the plastic layer 500 is formed by cooling plastic.

[0126] On the production line, the extension direction of multiple semi-finished structural units 100 (forming semi-finished wire strips) after being connected end to end is consistent with the direction of the production line. The wires 31 of two adjacent semi-finished structural units are cut at the break 10 and connected by the insulation material 20 in the first wire strip 200. It can be understood that the break 10 can separate two adjacent semi-finished structural units 100 and simultaneously connect two adjacent semi-finished structural units 100, allowing them to move as a whole on the production line.

[0127] To achieve waterproofing and moisture-proofing, in this embodiment of the invention, a plastic layer 500 is applied to the outer surface of each semi-finished structural unit 100, completely encasing the outer surface of each semi-finished structural unit 100. It is understood that after the multiple semi-finished structural units 100 connected end-to-end (forming a semi-finished wire strip) are broken from the insulating material 20 in the first wire strip 200 that serves as the connector, each semi-finished structural unit 100 must be completely encased by the plastic layer 500 to prevent moisture from entering the interior of the semi-finished structural unit 100.

[0128] Reference Figure 8 and Figure 9 In some exemplary embodiments of the present invention, the semi-finished wire strip includes multiple break points (i.e., the positions where the ports 10 are located). One break point is provided between two adjacent semi-finished structural units 100, and the two adjacent semi-finished structural units 100 are connected only by a plastic layer 500 located at the break point. That is, by covering the outer surface of each semi-finished structural unit 100 with a plastic layer 500 and filling the break point 10 connecting two adjacent semi-finished structural units with a plastic layer 500, after separating each semi-finished structural unit 100 and cutting the plastic layer filling the break point, each waterproof device semi-finished product is completely wrapped by the plastic layer 500, thereby solving the problem of water ingress failure of the finished waterproof device caused by the loose fusion of the two plastic layers or the lack of adhesion due to material reasons.

[0129] The finished waterproof device according to embodiments of the present invention may include: the aforementioned waterproof device semi-finished product and a housing. The housing is disposed on the outer surface of the chip 60 within the waterproof device semi-finished product, and the housing structure is a metal layer, a metal tube, or a metal sticker.

[0130] To standardize the process, the surface of the waterproof device semi-finished product obtained through the above manufacturing method is processed to obtain a finished waterproof device that is exactly the same as the one on the market.

[0131] The waterproof device semi-finished product provided in this embodiment of the invention has stronger waterproof and moisture-proof capabilities and is more competitive in the market because its internal chip, the solder joint between the chip and the wire, the wire and the insulating material in the first wire strip are completely wrapped by the re-injected plastic layer.

[0132] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "some exemplary embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0133] While some embodiments based on the overall technical concept of this disclosure have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the overall technical concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A method of manufacturing a waterproof device semi-finished product, characterized by, The application relates to a method for manufacturing a waterproof device, and comprises the following steps: providing a half-finished wire strip, the half-finished wire strip being welded with chips and having a break at a predetermined length, so that the half-finished wire strip is divided into a plurality of half-finished structural units, adjacent half-finished structural units being connected through insulation material in the first wire strip, and the shape and thickness of the break being adjusted; feeding the half-finished wire strip into a wire injection molding device, controlling the temperature and pressure of a wire injection molding device head and the speed of a guide wheel transmission, so that the insulation material at the break position of the half-finished wire strip is melted and broken, and a plastic layer in a molten state completely covers the outer surface of each half-finished structural unit, connects adjacent half-finished structural units, is cooled in water, and forms an injection molding strip composed of a plurality of waterproof device half-finished products.

2. The production method according to claim 1, characterized by The half-finished wire strip comprises a plurality of half-finished structural units, and each half-finished structural unit comprises a plurality of groups of wires, a chip and an insulation structure attached to the plurality of groups of wires and spacing and fixing the chip.

3. The production method according to claim 2, characterized by, The half-finished structural unit is formed by the following steps: a first wire strip is formed by using insulation material and a plurality of groups of wires, the first wire strip comprising a plurality of groups of wires and an insulation structure attached to the plurality of groups of wires and spacing and fixing the plurality of groups of wires, each group of wires comprising at least two wires and extending in a length direction; a chip is welded on the wires of the first wire strip at a predetermined length; and the wires of the first wire strip with the welded chip are punched and cut off to produce a plurality of breaks, and a second wire strip with the chip is formed; wherein the second wire strip with the chip between two breaks constitutes a half-finished structural unit.

4. The production method according to claim 2, characterized by The half-finished structural unit is formed by the following steps: a first wire strip is formed by using insulation material and a plurality of groups of wires, the first wire strip comprising a plurality of groups of wires and an insulation structure attached to the plurality of groups of wires and spacing and fixing the plurality of groups of wires, each group of wires comprising at least two wires and extending in a length direction; the wires of the first wire strip are punched and cut off with a predetermined length to produce a break, and a second wire strip is formed; and a chip is welded on the break position of the wire to connect one end of the wire, and a second wire strip with the chip is formed; wherein the second wire strip with the chip between two breaks constitutes a half-finished structural unit.

5. The production method according to claim 3 or 4, characterized by, Two adjacent half-finished structural units are connected through insulation material in the first wire strip, and two adjacent half-finished structural units take the break as a mark for dividing the half-finished structural units, and each half-finished structural unit has a chip.

6. The production method according to any one of claims 1 to 4, characterized by, The plastic layer material is a plastic material for injection molding, and the temperature resistance range is between-60 DEG C and 350 DEG C.

7. The production method according to any one of claims 1 to 4, characterized by, The melting temperature of the insulation material in the first wire strip which needs to be melted is less than or equal to the melting temperature of the plastic layer, and the melting temperature of the insulation material in the first wire strip which needs to be melted is less than or equal to the working temperature of the wire injection molding device, so that when the plastic is injected in the wire injection molding device, the insulation material at the break position of the half-finished wire strip can be melted and broken.

8. The production method according to claim 3 or 4, characterized by, The width of the break must cut off all the conductive wires in the first wire belt; and the length of the break is designed so that after the plastic injection in the wire injection molding device, the length of the chip is greater than that after the conductive wires are welded at the break position.

9. The production method according to claim 3 or 4, characterized by, The first wire belt is formed on the conductive wires by injection, sticking or weaving, and the insulating material includes a film, a woven wire belt, bakelite or a first plastic.

10. The production method according to claim 3 or 4, characterized by, The chip includes at least one of an NTC, a PTC, a light-sensitive tube, a magnetic-sensitive tube, a conductive wire and a circuit board with an element; and / or, Each independent semi-finished structural unit contains at least one chip, and the number of effective pins on the chip is the same as the number of conductive wires in the conductive wire group.

11. A waterproof device semi-finished product, characterized by The waterproof device semi-finished product is obtained by the manufacturing method according to any one of claims 1-10.

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