A diode electrical parameter test capability verification device and its preparation method

Abstract

The present application is applicable to the field of semiconductor performance parameter testing technology, and provides a diode electrical parameter test capability verification device and preparation method, the device comprising: a diode to be tested, a shell and a heat dissipation structure; the diode to be tested is fixed to the heat dissipation structure by fastening screws; the shell is welded to the heat dissipation structure by parallel sealing welding, and the shell and the heat dissipation structure cover the main part of the diode to be tested; a first through hole is provided on the lower cover of the shell; two test pins of the diode to be tested are placed outside the shell through the first through hole; the first through hole limits the rotation of the diode to be tested in the direction around the fastening screw; a sealant is provided at the first through hole between the diode to be tested and the lower cover, and a sealant is provided at the connection between the fastening screw and the heat dissipation structure; the sealant is used to seal the interior of the shell. The present application enables laboratories participating in the test capability verification to refer to the same test methods and procedures as usual for test parameters, while taking into account confidentiality and security.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor performance parameter testing, and in particular relates to a diode electrical parameter testing capability verification device and a preparation method thereof. Background Art

[0002] Diode parameter testing proficiency testing requires applying a specified electrical signal to a diode and measuring the specified electrical parameters. Traditional proficiency testing in the electrical field often involves placing the DUT in a box and testing it via test ports. However, when testing semiconductors like diodes, factors such as the tester, test fixture, temperature and humidity conditions, instrument accuracy, and reference test methods all significantly impact the performance parameters of the semiconductor device being tested. Mounting the semiconductor DUT in a box with test ports effectively prescribes a test fixture and electrical connection method, making it impossible to assess the comprehensive testing capabilities of the participating laboratories. Furthermore, mounting the DUT in a box can lead to insufficient heat dissipation during testing, which can easily cause parameter deviations for temperature-sensitive devices. Using specific product models as proficiency testing items raises confidentiality and sample security concerns. Laboratories participating in proficiency testing may report false results based on the product model, and the proficiency testing items are also susceptible to damage.

[0003] There is an urgent need for a capability verification method in the field of semiconductor testing to ensure the confidentiality and security of items and that the environmental parameters during testing remain consistent with normal conditions. Summary of the Invention

[0004] In order to overcome the problems existing in the related art, the embodiment of the present application provides a diode electrical parameter test capability verification device and a preparation method thereof, which enables the party participating in the semiconductor parameter test capability verification to refer to the same test methods and procedures as usual for test parameters, while taking into account confidentiality and security.

[0005] This application is achieved through the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a diode electrical parameter test capability verification device, comprising: a diode to be tested, a housing, and a heat dissipation structure;

[0007] The diode under test is fixed to the heat dissipation structure by fastening screws;

[0008] The shell is welded to the heat dissipation structure by parallel sealing welding, and the shell and the heat dissipation structure cover the main body of the diode to be tested; a first through hole is provided on the lower cover of the shell;

[0009] Two test pins of the diode under test are placed outside the housing through the first through hole; the first through hole limits the rotation of the diode under test in the direction around the fastening screw;

[0010] Sealant is provided at the first through hole of the diode under test and the lower cover, and sealant is provided at the connection between the fastening screw and the heat dissipation structure; the sealant is used to seal the interior of the housing.

[0011] In a possible implementation of the first aspect, the heat dissipation structure includes a central support plate, a first support plate, a second support plate, and a plurality of ribs;

[0012] The first support plate is disposed on a first side of the central support plate;

[0013] The second support plate is arranged on a second side of the central support plate opposite to the first side; the central support plate, the first support plate and the second support plate form a first receiving portion and a second receiving portion;

[0014] A plurality of ribs are provided in the second receiving portion and are parallel to the first support plate and the second support plate.

[0015] In a possible implementation of the first aspect, a second through hole is provided on the central support plate; a third through hole is provided on the diode under test; and a fastening screw passes through the second through hole and the third through hole to fix the diode under test on the central support plate.

[0016] In a possible implementation of the first aspect, the housing includes: an upper cover sheet, a front cover sheet, and a lower cover sheet;

[0017] The upper cover plate, the front cover plate and the lower cover plate are respectively vertically welded to the first support plate and the second support plate to enclose the first receiving portion into a closed space;

[0018] The upper cover piece and the lower cover piece are located on both sides of the first accommodating portion; and the front cover piece is parallel to the central supporting plate.

[0019] In a possible implementation of the first aspect, the housing is made of antistatic hard anodized material or is sprayed with antistatic material;

[0020] The heat dissipation structure adopts anti-static hard anodized material or is sprayed with anti-static material.

[0021] In a possible implementation manner of the first aspect, the housing, the heat dissipation structure, and the fastening screws are made of the same material and have the same thermal expansion coefficient.

[0022] In a possible implementation of the first aspect, the front cover is marked with the polarity of the diode under test, the code of the proficiency verification item, and the serial number of the proficiency verification device.

[0023] In a second aspect, an embodiment of the present application provides a method for preparing a diode electrical parameter test capability verification device, characterized by comprising:

[0024] Use fastening screws to fix the diode under test on the heat dissipation structure;

[0025] The housing and the heat dissipation structure are welded together by parallel sealing welding to hide the main body of the diode under test, and a first through hole is provided on the lower cover of the housing;

[0026] The two test pins of the diode under test are placed outside the housing through the first through hole; the first through hole limits the rotation of the diode under test in the direction around the fastening screw;

[0027] Sealant is provided at the first through hole of the diode under test and the lower cover, and sealant is provided at the connection between the fastening screw and the heat dissipation structure; the sealant is used to seal the interior of the housing.

[0028] In a possible implementation of the second aspect, a heat dissipation structure is provided including a central support plate, a first support plate, a second support plate, and a plurality of ribs;

[0029] Disposing a first support plate on a first side of the central support plate;

[0030] The second support plate is arranged on a second side of the central support plate opposite to the first side; the central support plate, the first support plate and the second support plate form a first receiving portion and a second receiving portion;

[0031] A plurality of ribs are disposed in the second receiving portion and are parallel to the first support plate and the second support plate.

[0032] In a possible implementation of the second aspect, fixing the diode under test on the heat dissipation structure by using a fastening screw includes:

[0033] A second through hole is provided on the central support plate;

[0034] providing a third through hole on the diode under test;

[0035] The diode under test is fixed on the central supporting plate by passing a fastening screw through the second through hole and the third through hole.

[0036] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0037] In an embodiment of the present application, a shell and a sealant are used to hide and protect the main body of the diode under test, thereby ensuring that information such as the model and structure of the diode under test is kept confidential from laboratories participating in the proficiency testing project, thereby guaranteeing the confidentiality of the proficiency testing work and the authenticity and validity of the data returned by the participating laboratories. By placing the two test pins of the diode under test outside, the laboratories participating in the proficiency testing project can use various conventional test fixtures to apply electrical conditions to the diode and test electrical parameters. By adding a heat dissipation structure to the diode under test, good heat dissipation of the diode under test is achieved.

[0038] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0039] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 This is a schematic diagram of the structure of a diode electrical parameter test capability verification device provided by an embodiment of the present application;

[0042] Figure 2 This is an exploded diagram of a diode electrical parameter test capability verification device provided by an embodiment of the present application;

[0043] Figure 3 This is a flow chart of a method for verifying the diode electrical parameter testing capability provided in one embodiment of the present application. DETAILED DESCRIPTION

[0044] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0045] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0046] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0047] It should also be understood that the term "relative" as used in this specification and the appended claims refers to relative positions in mechanical movement.

[0048] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0049] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0050] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0051] Proficiency testing is an activity that uses inter-laboratory comparisons to determine a laboratory's calibration or testing capabilities, or an inspection body's testing capabilities. Proficiency testing activities refer to any inter-laboratory comparisons and measurement audits used to assess laboratory performance. These activities may be conducted, for example, by national or regional accreditation bodies and their partner organizations, government departments or industry organizations, or other providers of formal proficiency testing programs.

[0052] Carrying out proficiency testing activities has a positive impact on all aspects of testing or calibration. For laboratories, it is necessary for them to meet the ISO / IEC 17025 standard, conduct internal quality control, and demonstrate their capabilities to the outside world. For accreditation bodies, it is an important technical approach to evaluate the testing or calibration capabilities of accredited laboratories. For laboratory clients, it is an important basis for proving that the laboratory has the ability to perform a certain test. For government departments, it is an effective measure to supervise the capabilities and standards of laboratories. Therefore, proficiency testing activities are currently receiving widespread attention both internationally and domestically.

[0053] In the diode parameter test proficiency verification project, as described in the above background technology, it is very easy for temperature-sensitive devices to cause the measured parameters to be out of tolerance. Directly using specific models of products as proficiency verification items raises confidentiality and sample safety issues. Participating laboratories may report false results based on the model, and the proficiency verification items are also easily damaged.

[0054] Based on the above problems, this application proposes a device and method for verifying the ability of diode electrical parameter testing. Figure 1-2 The present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

[0055] Reference Figure 1-2 , the diode electrical parameter test capability verification device is described in detail as follows:

[0056] A diode electrical parameter test capability verification device includes: a diode to be tested 100, a housing 200 and a heat dissipation structure 300.

[0057] The diode under test 100 is fixed to the heat dissipation structure 300 by fastening screws 101. The housing 200 is welded to the heat dissipation structure 300 using parallel sealing welding. The housing 200 and the heat dissipation structure 300 cover the main body of the diode under test 100; a first through hole is provided on the lower cover 201 of the housing 200. The two test pins 102 of the diode under test 100 are placed outside the housing 200 through the first through hole; the first through hole restricts the rotation of the diode under test 100 in the direction around the fastening screws 101. Sealant is provided at the first through hole between the diode under test 100 and the lower cover 201, and at the connection between the fastening screws 101 and the heat dissipation structure 300; the sealant is used to seal the interior of the housing.

[0058] Illustratively, the main body of the diode under test 100 is the portion excluding the two test pins 102 of the diode under test 100 .

[0059] For example, the diode under test 100 is fixed to the heat dissipation structure 300 by a fastening screw 101, and then the rotation of the diode under test 100 is restricted by a first through hole, and sealant is provided at both the first through hole and the fastening screw 101, which can reduce the shaking of the diode under test 100 during use, thereby preventing the shaking from affecting the accuracy of the test process, and reducing the damage caused by the shaking to the diode under test 100.

[0060] For example, the main body of the diode under test 100 is concealed by the housing 200, the heat dissipation structure 300, and the sealant, thereby achieving protection and confidentiality for the diode under test 100. The two test pins 102 of the diode under test 100 are placed outside, allowing laboratories participating in the proficiency testing project to use the same fixtures and methods as in normal testing to test the diode's parameters, thereby maximizing the comprehensive testing level of the laboratories participating in the proficiency testing project in terms of personnel, equipment, materials, methods, and environment. By adding a post-heat dissipation structure 300 to the diode under test 100, the natural working state of the diode under test 100 is simulated as much as possible, reducing the problem of the diode under test 100 being difficult to dissipate heat due to the housing 200 covering it.

[0061] Among them, laboratories participating in the proficiency testing project can use various conventional test fixtures such as plug-in fixtures and powered clamps to apply electrical conditions to diodes and test electrical parameters.

[0062] Exemplarily, thermal grease is applied between the back surface of the diode under test 100 and the heat dissipation structure 300 to enhance heat dissipation so that the temperature of the diode under test 100 can be kept consistent with that during normal testing.

[0063] Specifically, the housing 200 is made of an antistatic hard anodized material or is sprayed with an antistatic material; the heat dissipation structure 300 is made of an antistatic hard anodized material or is sprayed with an antistatic material. The housing 200, the heat dissipation structure 300, and the like are all treated with an antistatic hard anodized material to ensure that the diode 100 under test is in an antistatic condition.

[0064] Specifically, the heat dissipation structure 300 includes a central support plate 301 , a first support plate 302 , a second support plate 303 and a plurality of ribs 304 .

[0065] The first support plate 302 is disposed on a first side of the central support plate 301; the second support plate 303 is disposed on a second side of the central support plate 301, opposite the first side. The central support plate 301, the first support plate 302, and the second support plate 303 form a first accommodating portion and a second accommodating portion. A plurality of ribs 304 are disposed in the second accommodating portion, parallel to the first support plate 302 and the second support plate 303.

[0066] For example, the central support plate 301, the first support plate 302 and the second support plate 303 form an I-shaped structure, such as Figure 2 As shown, the first receiving portion is the left portion of the I-shaped structure, and the second receiving portion is the right portion of the I-shaped structure. The multiple ribs 304 increase the heat dissipation area and improve heat dissipation efficiency. The heat dissipation efficiency can be affected by adjusting the size and area of ​​the ribs.

[0067] Specifically, a second through hole is provided on the central support plate 301 ; a third through hole is provided on the diode under test 100 ; and a fastening screw 101 passes through the second through hole and the third through hole to fix the diode under test 100 on the central support plate 301 .

[0068] The second through hole is a preset distance from the center support plate 301, and when the diode 100 is fixed, the test pin of the diode 100 is just extended out of the first through hole.

[0069] Specifically, the housing 200 includes an upper cover 202 , a front cover 203 and a lower cover 201 .

[0070] The upper cover 202, front cover 203, and lower cover 201 are welded vertically to the first support plate 302 and the second support plate 303, respectively, enclosing the first accommodating portion into a sealed space. The upper cover 202 and lower cover 201 are located on either side of the first accommodating portion; the front cover 203 is parallel to the center support plate 301.

[0071] For example, after all the welding is completed, sealant is used to seal the perforations between the diode under test and the lower cover 201 and the connections between the fastening screws 101 and the heat dissipation structure 300 to improve the moisture resistance and corrosion resistance of the test capability verification device.

[0072] For example, the housing 200, the heat dissipation structure 300 and the fastening screws 101 are made of the same material and have the same thermal expansion coefficient. All mechanical structures are made of the same material and have the same thermal expansion coefficient, which can ensure the stability of the housing 200 after parallel sealing.

[0073] Illustratively, the polarity of the diode 100 under test, the code of the proficiency verification item, and the number of the proficiency verification device are marked on the front cover 203, so as to facilitate recording and distinguishing in the test proficiency verification items.

[0074] It can be seen that the diode electrical parameter test capability verification device provided by the present invention utilizes a housing and sealant to conceal the main body of the diode under test, ensuring that the model, structure and other information of the diode under test are kept confidential from the laboratories participating in the capability verification project, thereby ensuring the confidentiality of the capability verification work and the authenticity and validity of the data returned by the participating laboratories. By placing the two test pins of the diode under test outside, the laboratories participating in the capability verification project can use various conventional test fixtures to apply electrical conditions to the diode and test the electrical parameters. By adding a heat dissipation structure to the diode under test and using thermal grease and fastening screws to tightly connect the diode under test to the heat dissipation device, good heat dissipation of the diode under test can be achieved.

[0075] An embodiment of the present application provides a method for preparing a diode electrical parameter test capability verification device, see Figure 3, the preparation method comprises:

[0076] Step 401: Fix the diode under test on the heat dissipation structure using fastening screws.

[0077] Step 402: weld the housing and the heat dissipation structure together by parallel sealing welding to cover the main body of the diode under test, and set a first through hole on the lower cover of the housing.

[0078] In step 403, two test pins of the diode under test are placed outside the housing through a first through hole; the first through hole limits the rotation of the diode under test in a direction around the fastening screw.

[0079] Step 404 : Apply sealant to the first through hole of the diode under test and the lower cover, and apply sealant to the connection between the fastening screw and the heat dissipation structure; the sealant is used to seal the interior of the housing.

[0080] Specifically, the heat dissipation structure 300 includes a central support plate 301, a first support plate 302, a second support plate 303, and a plurality of ribs 304. The first support plate 302 is disposed on a first side of the central support plate 301; the second support plate 303 is disposed on a second side of the central support plate 301 opposite the first side; the central support plate 301, the first support plate 302, and the second support plate 303 form a first accommodating portion and a second accommodating portion; the plurality of ribs 304 are disposed in the second accommodating portion and are parallel to the first support plate 302 and the second support plate 303.

[0081] Specifically, the diode under test 100 is fixed to the heat dissipation structure 300 using fastening screws, including: setting a second through hole on the central support plate 301; setting a third through hole on the diode under test 100; and fixing the diode under test 100 on the central support plate 301 by passing the fastening screws through the second through hole and the third through hole.

[0082] For example, the housing 200 is made of an antistatic hard anodized material or the housing 200 is sprayed with an antistatic material. The heat dissipation structure 300 is made of an antistatic hard anodized material or the heat dissipation structure 300 is sprayed with an antistatic material.

[0083] Illustratively, in step 404, thermal grease is applied to the contact surface between the diode under test 100 and the heat dissipation structure 300 to enhance heat exchange between the diode under test 100 and the heat dissipation structure 300. Illustratively, the heat dissipation structure 300 is welded to the upper cover 202, the front cover 203, and the lower cover 201 of the housing 200, thereby enclosing the diode under test 100. Therefore, the heat dissipation structure 300 also serves to protect the diode under test 100.

[0084] For example, after the diode electrical parameter testing proficiency testing device is completed, the polarity of the diode 100 under test is marked on the front cover, and the proficiency testing plan code and the proficiency testing item number are clearly marked. At this point, the proficiency testing item is complete and can be used for uniformity and stability testing. After passing the uniformity and stability tests, it can be used in proficiency testing projects and distributed to participating laboratories.

[0085] For example, the diode electrical parameter test capability verification device can be stored in a customized packaging box, which contains foam or protective covers for protecting the external test pins of the diode to prevent the capability verification items from being damaged during transportation.

[0086] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A diode electrical parameter test capability verification device, characterized in that: include: The diode under test, the housing and the heat dissipation structure; The diode under test is fixed on the heat dissipation structure by fastening screws; The housing is welded to the heat dissipation structure by parallel sealing welding, and the housing and the heat dissipation structure cover the main body of the diode under test; a first through hole is provided on the lower cover of the housing; Two test pins of the diode under test are placed outside the housing through the first through hole; the first through hole limits the rotation of the diode under test in the direction around the fastening screw; Sealant is provided at the first through hole between the diode under test and the lower cover, and the sealant is provided at the connection between the fastening screw and the heat dissipation structure; the sealant is used to seal the interior of the housing.

2. The diode electrical parameter test capability verification device according to claim 1, characterized in that: The heat dissipation structure includes a central support plate, a first support plate, a second support plate and a plurality of ribs; The first support plate is arranged on a first side of the central support plate; The second support plate is arranged on a second side of the central support plate opposite to the first side; the central support plate, the first support plate and the second support plate form a first accommodating portion and a second accommodating portion; The plurality of ribs are disposed in the second receiving portion and are parallel to the first support plate and the second support plate.

3. The diode electrical parameter test capability verification device according to claim 2, characterized in that: The central support plate is provided with a second through hole; The diode under test is provided with a third through hole; a fastening screw passes through the second through hole and the third through hole to fix the diode under test on the central support plate.

4. The diode electrical parameter test capability verification device according to claim 2, characterized in that: The housing comprises: an upper cover, a front cover and the lower cover; The upper cover plate, the front cover plate, and the lower cover plate are respectively vertically welded to the first support plate and the second support plate to enclose the first receiving portion into a closed space; The upper cover plate and the lower cover plate are located on both sides of the first accommodating portion; and the front cover plate is parallel to the central support plate.

5. The diode electrical parameter test capability verification device according to claim 1, characterized in that: The shell is made of anti-static hard anodized material or sprayed with anti-static material; The heat dissipation structure is made of antistatic hard anodized material or is sprayed with antistatic material.

6. The diode electrical parameter test capability verification device according to claim 1, characterized in that: The shell, the heat dissipation structure and the fastening screw are made of the same material and have the same thermal expansion coefficient.

7. The diode electrical parameter test capability verification device according to claim 4, characterized in that: The front cover is marked with the polarity of the diode to be tested, the code of the capability verification item and the number of the capability verification device.

8. A method for preparing a diode electrical parameter test capability verification device, characterized in that: include: Use fastening screws to fix the diode under test on the heat dissipation structure; Welding the housing and the heat dissipation structure together by parallel sealing welding to hide the main body of the diode under test, and providing a first through hole on the lower cover of the housing; Passing two test pins of the diode under test through the first through hole and placing them outside the housing; the first through hole limits the rotation of the diode under test in the direction around the fastening screw; Sealant is provided at the first through hole of the diode under test and the lower cover, and the sealant is provided at the connection between the fastening screw and the heat dissipation structure; the sealant is used to seal the interior of the housing.

9. The method for preparing the diode electrical parameter test capability verification device according to claim 8, characterized in that: The heat dissipation structure includes a central support plate, a first support plate, a second support plate and a plurality of ribs; Disposing the first support plate on a first side of the central support plate; The second support plate is arranged on a second side of the central support plate opposite to the first side; the central support plate, the first support plate and the second support plate form a first receiving portion and a second receiving portion; The plurality of ribs are disposed in the second receiving portion and are parallel to the first support plate and the second support plate.

10. The method for preparing the diode electrical parameter test capability verification device according to claim 9, characterized in that: Use the fastening screws to fix the diode under test on the heat dissipation structure, including: A second through hole is provided on the central support plate; providing a third through hole on the diode under test; The diode under test is fixed on the central supporting plate by passing a fastening screw through the second through hole and the third through hole.

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