Light emitting module

Abstract

A light emitting module is provided. The light emitting module includes a carrier, a light emitting chip, and a light wavelength conversion structure. The light emitting chip is located between the carrier and the light wavelength conversion structure. The light emitting module generates an operating beam. A wavelength range of the operating beam sequentially has a first peak, a second peak, a third peak, a fourth peak, a fifth peak, and a sixth peak from low to high. A peak value of the first peak is between 400 nm and 420 nm, a peak value of the second peak is between 421 nm and 480 nm, a peak value of the third peak is between 481 nm and 580 nm, a peak value of the fourth peak is between 581 nm and 730 nm, a peak value of the fifth peak is between 740 nm and 910 nm, and a peak value of the sixth peak is between 910 nm and 950 nm.

Description

TECHNICAL FIELD

[0001] The present application relates to a light emitting module, in particular to a light emitting module for water quality detection. BACKGROUND

[0002] Water is the highest proportion of the human body, in order to ensure the quality and safety of drinking water, many countries will be water quality testing to define specific detection standards to avoid the bacteria, heavy metals, chemical contaminants or pesticides and other harmful substances into the body.

[0003] In the water quality detection instrument, a light source with a wide spectrum (400 nm to 1000 nm) is used to achieve the effect of detecting various harmful substances at the same time. When detecting different harmful substances, the required light source wavelength values are different. For example, nitrate nitrogen can be detected by a light source with a wavelength of 410 nm, arsenic sulfide ions can be detected by a light source with a wavelength of 530 nm, and cobalt phosphate can be detected by a light source with a wavelength of 880 nm.

[0004] However, the wavelength range of the light beam emitted by a single light emitting chip is limited, and it cannot detect all harmful substances at the same time, so it cannot be directly used as a light source in a water quality detection system. Therefore, the light emitting module in the current water quality detection system contains multiple light emitting chips to achieve the effect of detecting harmful substances at one time.

[0005] As can be seen from the above, in order to meet various application requirements, the existing light emitting module is mostly composed of multiple light emitting chips to overcome the problem of narrow wavelength range of the light beam generated by a single light emitting chip. However, once multiple light emitting chips are used, it will cause the problem of cost increase and volume increase of the light emitting module, and cannot achieve the effect of lightweight. Therefore, the light emitting module in the prior art still needs to be improved. SUMMARY

[0006] The technical problem to be solved by the present application is to provide a light emitting module to overcome the shortcomings of the prior art.

[0007] To solve the above technical problems, one of the technical solutions adopted by the present application is to provide a light emitting module. The light emitting module generates a working light beam. The wavelength range of the working light beam sequentially has a first wave peak, a second wave peak, a third wave peak, a fourth wave peak, a fifth wave peak and a sixth wave peak from low to high. The peak value of the first wave peak is between 400nm and 420nm, the peak value of the second wave peak is between 421nm and 480nm, the peak value of the third wave peak is between 481nm and 580nm, the peak value of the fourth wave peak is between 581nm and 730nm, the peak value of the fifth wave peak is between 740nm and 910nm, and the peak value of the sixth wave peak is between 910nm and 950nm. The light emitting module comprises a carrier, a light emitting chip and a light wavelength conversion structure, and the light emitting chip is located between the carrier and the light wavelength conversion structure.

[0008] For a further understanding of the features and technical contents of the present application, please refer to the following detailed description of the present application and the accompanying drawings. However, the accompanying drawings provided are only for reference and illustration, and are not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is a side view schematic diagram of the light emitting module of the first embodiment of the present application.

[0010] Figure 2 It is a spectrum diagram of the working light generated by the light emitting module of the first embodiment of the present application.

[0011] Figure 3 It is a side view schematic diagram of the light emitting module of the second embodiment of the present application.

[0012] Figure 4 It is a side view schematic diagram of the light emitting module of the third embodiment of the present application.

[0013] Figure 5 It is a side view schematic diagram of the light emitting module of the fourth embodiment of the present application.

[0014] Figure 6 It is a side view schematic diagram of the light emitting module of the fifth embodiment of the present application.

[0015] Figure 7 It is a side view schematic diagram of the light emitting module of the sixth embodiment of the present application.

[0016] Figure 8 It is a side view schematic diagram of the light emitting module of the seventh embodiment of the present application.

[0017] Figure 9 It is a side view schematic diagram of the light emitting module of the eighth embodiment of the present application.

[0018] Figure 10 It is a side view schematic diagram of the light emitting module of the ninth embodiment of the present application.

[0019] Figure 11 A side cross-sectional view of a light emitting module according to an eleventh embodiment of the present application. DETAILED DESCRIPTION

[0020] The present application is described in detail by specific embodiments of the light emitting module. Those skilled in the art can understand the advantages and effects of the present application from the disclosure. The present application can be implemented or applied by other different embodiments, and the details in the present specification can be modified and changed based on different views and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations, and are not drawn according to the actual size. The following embodiments will further illustrate the related technical content of the present application, but the disclosed content is not intended to limit the protection scope of the present application. In addition, the term "or" used herein can include any one or a combination of a plurality of associated listed items as appropriate.

[0021] The light emitting module of the present application generates a working light beam with a wide wavelength range. Therefore, the light emitting module of the present application can be directly applied to various instruments, such as a water quality detection system, with a small volume, and can overcome the problems derived from the use of multiple light emitting chips in the past. The light emitting module applied to the water quality detection system will be described below.

[0022] Light emitting module for water quality detection

[0023] The present application provides a light emitting module that can be applied to a water quality detection system. The light emitting module of the present application can generate a working light beam with a wide wavelength range, such as light with a wavelength range of 400 nm to 1050 nm, to detect various harmful substances in water at one time. In addition, the light emitting module of the present application can be additionally combined with a photoelectric chip to form a light sensing module.

[0024] Referring to Figure 1 As shown in the figure, the light emitting module 1 of the present application includes a carrier 10, a light emitting chip 20, and a light wavelength conversion structure 30. The light emitting chip 20 and the light wavelength conversion structure 30 are disposed on the carrier 10, and the light emitting chip 20 is located between the carrier 10 and the light wavelength conversion structure 30.

[0025] The light emitting chip 20 is configured to generate a first light beam, and the light spectrum of the first light beam can cover a part or all of the visible light wavelength range. For example, the light emitting chip 20 can be a white light emitting diode, that is, the first light beam has a spectrum between 400 nm and 700 nm. In other embodiments, the first light beam can have a spectrum between 320 nm and 600 nm. In an exemplary embodiment, the light emitting chip 20 is a violet-to-blue light emitting diode, so the first light beam has a spectrum between 360 nm and 460 nm. However, the present application is not limited thereto.

[0026] The light wavelength conversion structure 30 can receive the first light beam generated by the light emitting chip 20 and convert a part of the first light beam into a second light beam. The unconverted first light beam and the converted second light beam are superimposed to form the working light beam of the light emitting module 1, and the wavelength range of the working light beam is wider than that of the first light beam. For example, the working light beam has a spectrum between 400 nm and 1050 nm, as shown in Figure 2 The detailed description of the spectrum of the working light beam will be described later.

[0027] The material of the light wavelength conversion structure 30 includes a light-transmitting resin and a fluorescent material, and the fluorescent material is uniformly dispersed in the light-transmitting resin. The light-transmitting resin must have the characteristics of high temperature resistance, moisture resistance, corrosion resistance, and ultraviolet radiation resistance, for example, the light-transmitting resin can be a silicon-based resin, an epoxy-based resin, or other high-transmittance resin. The fluorescent material can convert a part of the first light beam into the second light beam to achieve the effect of making the working light beam have a wider spectrum (400 nm to 1050 nm).

[0028] The light wavelength conversion structure 30 can be formed by a gel containing the light-transmitting resin and the fluorescent material, and the light-transmitting resin and the fluorescent material are mixed and then filled on the light emitting chip 20 by dispensing. The content of the fluorescent material in the light wavelength conversion structure 30 is 30 parts by weight to 300 parts by weight based on 100 parts by weight of the total weight of the light-transmitting resin.

[0029] The light wavelength conversion structure 30 can be formed by a fluorescent powder sheet or a fluorescent powder adhesive film containing the light-transmitting resin and the fluorescent material, and the fluorescent powder sheet or the fluorescent powder adhesive film is prepared after mixing the light-transmitting resin and the fluorescent material, and then arranged on the light emitting chip 20.

[0030] The light wavelength conversion structure 30 can also be a fluorescent substrate containing a light-transmitting ceramic substrate and a fluorescent material, for example, a phosphor in glass (PIG). However, the present application is not limited thereto.

[0031] In one example embodiment, the total content of the fluorescent substance is 40 parts by weight to 75 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin. The fluorescent substance can be selected from the group consisting of phosphate compounds, nitride compounds, oxynitride compounds, aluminate compounds (particularly, rare earth element-containing aluminate compounds), and silicate compounds (particularly, rare earth element-containing silicate compounds). However, the present application is not limited thereto.

[0032] A plurality of fluorescent substances can be included in the material of the light wavelength conversion structure 30. In one example embodiment, five fluorescent substances are included in the material of the light wavelength conversion structure 30, and the materials, properties, and amounts of addition of the fluorescent substances used are listed in Table 1 below. In Table 1, the amounts of addition of the fluorescent substances are expressed as weight ratios of the fluorescent substances with respect to the light-transmissive resin.

[0033] Table 1

[0034]

[0035]

[0036] As shown in Table 1, the total content of the fluorescent substance is 30 parts by weight to 300 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin. Specifically, the content of the fluorescent substance A is 5 parts by weight to 50 parts by weight, the content of the fluorescent substance B is 5 parts by weight to 30 parts by weight, the content of the fluorescent substance C is 5 parts by weight to 30 parts by weight, the content of the fluorescent substance D is 1 part by weight to 15 parts by weight, and the content of the fluorescent substance E is 10 parts by weight to 200 parts by weight.

[0037] In another example embodiment, seven fluorescent substances are included in the material of the light wavelength conversion structure 30, and the materials, properties, and amounts of addition of the fluorescent substances used are listed in Table 2 below. In Table 2, the amounts of addition of the fluorescent substances are expressed as weight ratios of the fluorescent substances with respect to the light-transmissive resin.

[0038] Table 2

[0039]

[0040] As shown in Table 2, the total content of the fluorescent substance is 30 parts by weight to 300 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin. Specifically, the content of the fluorescent substance A is 5 parts by weight to 50 parts by weight, the content of the fluorescent substance B is 5 parts by weight to 30 parts by weight, the content of the fluorescent substance C is 5 parts by weight to 30 parts by weight, the content of the fluorescent substance D is 1 part by weight to 15 parts by weight, the content of the fluorescent substance F is 10 parts by weight to 50 parts by weight, the content of the fluorescent substance G is 10 parts by weight to 100 parts by weight, and the content of the fluorescent substance H is 10 parts by weight to 100 parts by weight.

[0041] In a preferred embodiment, the first light beam generated by the light emitting chip 20 has a peak value of 415 nm. The material of the light wavelength conversion structure 30 comprises a light-transmissive resin and fluorescent substances, and the content of the fluorescent substance A is 28 parts by weight, the content of the fluorescent substance B is 7 parts by weight, the content of the fluorescent substance C is 5 parts by weight, the content of the fluorescent substance D is 3 parts by weight, the content of the fluorescent substance F is 10 parts by weight, the content of the fluorescent substance G is 20 parts by weight, and the content of the fluorescent substance H is 50 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin.

[0042] Referring to Figure 2 Fig. 1, Figure 2 Fig. 2 shows the spectral diagram of the working light beam of the light emitting module 1 in the preferred embodiment using seven fluorescent substances described above. The working light beam has six relatively obvious peaks, and the wavelength range from low to high is in order of the first peak, the second peak, the third peak, the fourth peak, the fifth peak and the sixth peak. Specifically, the peak value of the first peak is between 400 nm and 420 nm, the peak value of the second peak is between 421 nm and 480 nm, the peak value of the third peak is between 481 nm and 580 nm, the peak value of the fourth peak is between 581 nm and 730 nm, the peak value of the fifth peak is between 740 nm and 910 nm, and the peak value of the sixth peak is between 910 nm and 950 nm.

[0043] As Figure 2 shown in Fig. 3, the intensity curve of the working light beam is relatively flat in the section of the wavelength range of 630 nm to 870 nm, which is more conducive to detecting suspended matters and phosphates in water. In Figure 2 particular, the intensity difference between the first peak, the second peak, the third peak, the fourth peak, the fifth peak and the sixth peak is less than or equal to 30%. The maximum peak intensity in the first peak to the sixth peak is referred to as the maximum intensity value, and each two adjacent peaks have a valley therebetween, and the ratio of the intensity value of the valley to the maximum intensity value is less than or equal to 50%.

[0044] First embodiment

[0045] Referring to Figure 1 Fig. 1, the light emitting module 1 of the first embodiment comprises a carrier 10, a light emitting chip 20 and a light wavelength conversion structure 30.

[0046] The carrier 10 has a bearing surface and an inner ring side surface, and the bearing surface and the inner ring side surface are connected to each other and form a bearing space. The light emitting chip 20 is located in the bearing space and is arranged on the bearing surface of the carrier 10. The light emitting chip 20 is located between the carrier 10 and the light wavelength conversion structure 30 and is completely covered by the light wavelength conversion structure 30. The light wavelength conversion structure 30 is located in the bearing space and is arranged on the bearing surface and the inner ring side surface of the carrier 10.

[0047] In the first embodiment, the light-emitting chip 20 generates a first light beam, a portion of which is converted into a second light beam by the light wavelength conversion structure 30, and the unconverted first light beam and the converted second light beam are superimposed to form a working light beam.

[0048] Second Embodiment

[0049] Please see Figure 3 As shown, the light-emitting module 1a of the second embodiment and the light-emitting module 1a of the first embodiment ( Figure 1 Similar to the previous one, the difference lies in that the optical wavelength conversion structure 30 includes a first optical wavelength conversion structure 31 and a second optical wavelength conversion structure 32. The first optical wavelength conversion structure 31 is disposed between the light-emitting chip 20 and the second optical wavelength conversion structure 32.

[0050] In the second embodiment, after the light-emitting chip 20 generates the first light beam, a portion of the first light beam is converted into a second light beam by the first wavelength conversion structure 31. It is worth noting that when different light-emitting chips 20 are used or different fluorescent materials are selected, the first light beam may be further converted by the second wavelength conversion structure 32 to generate a third light beam, and the second light beam may also be further converted by the second wavelength conversion structure 32 to generate a fourth light beam. Therefore, in addition to the first and second light beams, the working light beam generated by the light-emitting module 1a may further include a third and / or a fourth light beam.

[0051] In some cases, another portion of the first beam may be converted by the second wavelength conversion structure 32 to generate a third beam. That is, the working beam of the light-emitting module 1a may be formed by superimposing the unconverted first beam, second beam, and third beam.

[0052] In some cases, a portion of the second beam may also be converted into a fourth beam by the second wavelength conversion structure 32. That is, the working beam of the light-emitting module 1a may also be formed by superimposing the unconverted first beam, second beam, and fourth beam.

[0053] In some cases, another portion of the first beam can be converted by the second wavelength conversion structure 32 to generate a third beam, and a portion of the second beam can also be converted by the second wavelength conversion structure 32 into a fourth beam. That is to say, the working beam of the light-emitting module 1a can also be formed by superimposing the unconverted first beam, second beam, third beam, and fourth beam.

[0054] The materials of the first wavelength conversion structure 31 include a light-transmitting resin and a fluorescent substance. The specific types of light-transmitting resin and fluorescent substance have been described previously and will not be repeated here. The materials of the second wavelength conversion structure 32 include a light-transmitting resin and a fluorescent substance. The specific types of light-transmitting resin and fluorescent substance have been described previously and will not be repeated here.

[0055] In one exemplary embodiment, the fluorescent substance in the first light wavelength conversion structure 31 includes the aforementioned fluorescent substance A, fluorescent substance B, fluorescent substance C, and fluorescent substance D. The content of the fluorescent substance A is 5 to 50 parts by weight, the content of the fluorescent substance B is 5 to 30 parts by weight, the content of the fluorescent substance C is 5 to 30 parts by weight, and the content of the fluorescent substance D is 1 to 15 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin in the first light wavelength conversion structure 31. The fluorescent substance in the second light wavelength conversion structure 32 includes the aforementioned fluorescent substance E. The content of the fluorescent substance E is 50 to 200 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin in the second light wavelength conversion structure 32.

[0056] In this exemplary embodiment, the peak value of the first light beam generated by the light emitting chip 20 is 415 nm. The first light beam is not converted by the second light wavelength conversion structure 32, but the second light beam can be converted by the second light wavelength conversion structure 32 into the fourth light beam. Therefore, the working light beam of the light emitting module la in this exemplary embodiment is formed by superposition of the unconverted first light beam, the second light beam, and the fourth light beam.

[0057] According to the content of Table 1, it can be known that the emission wavelength ranges of the fluorescent substance A, the fluorescent substance B, the fluorescent substance C, and the fluorescent substance D overlap with the excitation wavelength range of the fluorescent substance E. Therefore, the second light beam converted by the first light wavelength conversion structure 31 can be converted by the second light wavelength conversion structure 32 into the fourth light beam. That is, the working light beam of the light emitting module la can be formed by superposition of the unconverted first light beam, and the converted second light beam, third light beam, and fourth light beam.

[0058] In another exemplary embodiment, the fluorescent substance in the first light wavelength conversion structure 31 includes the aforementioned fluorescent substance A, fluorescent substance B, fluorescent substance C, and fluorescent substance D. The content of the fluorescent substance A is 5 to 50 parts by weight, the content of the fluorescent substance B is 5 to 30 parts by weight, the content of the fluorescent substance C is 5 to 30 parts by weight, and the content of the fluorescent substance D is 1 to 15 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin in the first light wavelength conversion structure 31. The fluorescent substance in the second light wavelength conversion structure 32 includes the aforementioned fluorescent substance F, fluorescent substance G, and fluorescent substance H. The content of the fluorescent substance F is 5 to 50 parts by weight, the content of the fluorescent substance G is 10 to 100 parts by weight, and the content of the fluorescent substance H is 10 to 100 parts by weight, based on 100 parts by weight of the total weight of the light-transmissive resin in the second light wavelength conversion structure 32.

[0059] According to Table 2, the emission wavelength ranges of fluorescent substances A, B, C, and D overlap with the excitation wavelength ranges of fluorescent substances F, G, and H. Therefore, similarly, the second beam converted by the first wavelength conversion structure 31 can be further converted into a fourth beam by the second wavelength conversion structure 32. In other words, the working beam of the light-emitting module 1a may be formed by the superposition of the unconverted first beam, the converted second beam, and the fourth beam.

[0060] Third Embodiment

[0061] Please see Figure 4 As shown, the light-emitting module 1b of the third embodiment and the light-emitting module 1a of the second embodiment ( Figure 3 Similar to the first optical wavelength conversion structure 31, the difference lies in that the optical wavelength conversion structure 30 further includes a third optical wavelength conversion structure 33. The third optical wavelength conversion structure 33 is disposed between the first optical wavelength conversion structure 31 and the second optical wavelength conversion structure 32.

[0062] In the third embodiment, after the light-emitting chip 20 generates the first light beam, a portion of the first light beam is converted into a second light beam by the first wavelength conversion structure 31. It is worth noting that when different light-emitting chips 20 are used or different fluorescent materials are selected, another portion of the first light beam may be further converted by the second wavelength conversion structure 32 to generate a third light beam, and a portion of the second light beam may also be further converted by the second wavelength conversion structure 32 to generate a fourth light beam. Furthermore, another portion of the first light beam may be converted into a fifth light beam by the third wavelength conversion structure 33, and another portion of the second light beam may be converted into a sixth light beam by the third wavelength conversion structure 33. Similarly, a portion of the third light beam may be converted into a seventh light beam by the third wavelength conversion structure 33.

[0063] Whether or not the aforementioned light beam is generated will vary depending on the type of light-emitting chip 20 used or the type of fluorescent material selected. Therefore, in addition to the first and second light beams, the working light beams generated by the light-emitting module 1b may further include a third, fourth, fifth, sixth, and seventh light beam, or a superposition thereof.

[0064] In one exemplary embodiment, the fluorescent material in the first wavelength conversion structure 31 includes the aforementioned fluorescent materials A, B, and C. With a total weight of 100 parts by weight of the transparent resin in the first wavelength conversion structure 31, the content of fluorescent material A is 5 to 50 parts by weight, the content of fluorescent material B is 5 to 30 parts by weight, and the content of fluorescent material C is 5 to 30 parts by weight. The third wavelength conversion structure 33 includes the aforementioned fluorescent material D. With a total weight of 100 parts by weight of the transparent resin in the third wavelength conversion structure 33, the content of fluorescent material D is 1 to 15 parts by weight. The fluorescent material in the second wavelength conversion structure 32 includes the aforementioned fluorescent materials F, G, and H. With a total weight of 100 parts by weight of the transparent resin in the second wavelength conversion structure 32, the content of fluorescent material F is 10 to 50 parts by weight, the content of fluorescent material G is 10 to 100 parts by weight, and the content of fluorescent material H is 10 to 100 parts by weight.

[0065] Fourth embodiment

[0066] Please see Figure 5 As shown, the light-emitting module 1c of the fourth embodiment and the light-emitting module 1 of the first embodiment ( Figure 1 Similar to, but differing in that: the light-emitting chip 20 includes a first light-emitting chip 21 and a second light-emitting chip 22, which are electrically connected by a wire 40.

[0067] In the fourth embodiment, the first light-emitting chip 21 generates a first light beam, a portion of which is converted into a second light beam by the light wavelength conversion structure 30. The second light-emitting chip 22 generates an eighth light beam, a portion of which is converted into a ninth light beam by the light wavelength conversion structure 30. The unconverted first and eighth light beams, and the converted second and ninth light beams, are superimposed to form the working light beam.

[0068] Fifth embodiment

[0069] Please see Figure 6 As shown, the light-emitting module 1d of the fifth embodiment and the light-emitting module 1 of the first embodiment ( Figure 1 Similar to the previous one, the difference is that the carrier 10 forms two independent and non-connected carrier spaces, each of which is provided with a light-emitting chip 20 and a light wavelength conversion structure 30, with the light-emitting chip 20 located between the carrier 10 and the light wavelength conversion structure 30.

[0070] In the fifth embodiment, the method of forming the working beam is similar to that in the first embodiment, and therefore will not be described again here.

[0071] Sixth Embodiment

[0072] Please seeFigure 7 As shown, the light-emitting module 1e of the sixth embodiment and the light-emitting module 1d of the fifth embodiment ( Figure 6 Similar to the previous one, the difference lies in that the optical wavelength conversion structure 30 includes a first optical wavelength conversion structure 31 and a second optical wavelength conversion structure 32. The first optical wavelength conversion structure 31 is disposed between the light-emitting chip 20 and the second optical wavelength conversion structure 32.

[0073] In the sixth embodiment, the method of forming the working beam is similar to that in the second embodiment, and therefore will not be described again here.

[0074] Seventh Embodiment

[0075] Please see Figure 8 As shown, the light-emitting module 1f of the seventh embodiment and the light-emitting module 1d of the sixth embodiment ( Figure 7 Similar to the first optical wavelength conversion structure 31, the difference lies in that the optical wavelength conversion structure 30 further includes a third optical wavelength conversion structure 33. The third optical wavelength conversion structure 33 is disposed between the first optical wavelength conversion structure 31 and the second optical wavelength conversion structure 32.

[0076] In the seventh embodiment, the method of forming the working beam is similar to that in the third embodiment, and therefore will not be described again here.

[0077] Eighth embodiment

[0078] Please see Figure 9 As shown, the light-emitting module 1g of the eighth embodiment and the light-emitting module 1d of the fifth embodiment ( Figure 6 Similar to the previous one, the difference is that the carrier 10 has three independent and non-connected carrier spaces, and each carrier space is provided with a light-emitting chip 20 and a light wavelength conversion structure 30.

[0079] In the eighth embodiment, the method of forming the working beam is similar to that in the first embodiment, and therefore will not be described again here.

[0080] Ninth Embodiment

[0081] Please see Figure 10 As shown, the light-emitting module 1h of the ninth embodiment and the light-emitting module 1g of the eighth embodiment ( Figure 9 Similar to the previous one, the difference lies in that the optical wavelength conversion structure 30 includes a first optical wavelength conversion structure 31 and a second optical wavelength conversion structure 32. The first optical wavelength conversion structure 31 is disposed between the light-emitting chip 20 and the second optical wavelength conversion structure 32.

[0082] In the ninth embodiment, the method of forming the working beam is similar to that in the second embodiment, and therefore will not be described again here.

[0083] Tenth Embodiment

[0084] Please seeFigure 11 As shown, the light emitting module 1i of the tenth embodiment is similar to the light emitting module 1h of the ninth embodiment, except that the light wavelength conversion structure 30 further comprises a third light wavelength conversion structure 33. The third light wavelength conversion structure 33 is disposed between the first light wavelength conversion structure 31 and the second light wavelength conversion structure 32. Figure 10

[0085] In the tenth embodiment, the working light beam is formed in a similar way as in the third embodiment, and thus will not be described here again.

[0086] The above disclosed is only the preferred and feasible embodiments of the present application, and is not intended to limit the protection scope of the claims of the present application. Any equivalent technical changes made according to the contents of the present application and the drawings shall be included in the protection scope of the claims of the present application.​

Claims

1. A light-emitting module, characterized in that, The light-emitting module generates a working light beam, the working light beam having a first peak, a second peak, a third peak, a fourth peak, a fifth peak, and a sixth peak in sequence from low to high wavelength. The peak value of the first peak is between 400 nm and 420 nm, the peak value of the second peak is between 421 nm and 480 nm, the peak value of the third peak is between 481 nm and 580 nm, the peak value of the fourth peak is between 581 nm and 730 nm, the peak value of the fifth peak is between 740 nm and 910 nm, and the peak value of the sixth peak is between 910 nm and 950 nm. The light-emitting module includes: a carrier, a light-emitting chip, and a light wavelength conversion structure, the light-emitting chip being located between the carrier and the light wavelength conversion structure. The intensity difference between the first peak, the second peak, the third peak, the fourth peak, the fifth peak, and the sixth peak is less than or equal to 30%.

2. The light-emitting module according to claim 1, characterized in that, The material of the optical wavelength conversion structure includes a light-transmitting resin and a fluorescent substance, wherein the total weight of the light-transmitting resin is 100 parts by weight and the total content of the fluorescent substance is 40 to 75 parts by weight.

3. The light-emitting module according to claim 1, characterized in that, The working beam has a spectrum between 400 nanometers and 1050 nanometers.

4. The light-emitting module according to claim 1, characterized in that, The optical wavelength conversion structure includes a first optical wavelength conversion structure and a second optical wavelength conversion structure, wherein the first optical wavelength conversion structure is disposed between the light-emitting chip and the second optical wavelength conversion structure.

5. The light-emitting module according to claim 4, characterized in that, The optical wavelength conversion structure includes a third optical wavelength conversion structure, which is disposed between the first optical wavelength conversion structure and the second optical wavelength conversion structure.

6. The light-emitting module according to claim 1, characterized in that, The light-emitting chip includes a first light-emitting chip and a second light-emitting chip, which are electrically connected by a wire.

7. The light-emitting module according to claim 1, characterized in that, The carrier forms two or three independent, non-connected carrier spaces, and each carrier space is provided with the light-emitting chip and the light wavelength conversion structure.

8. The light-emitting module according to claim 7, characterized in that, The optical wavelength conversion structure includes a first optical wavelength conversion structure and a second optical wavelength conversion structure, wherein the first optical wavelength conversion structure is disposed between the light-emitting chip and the second optical wavelength conversion structure.

9. The light-emitting module according to claim 8, characterized in that, The optical wavelength conversion structure includes a third optical wavelength conversion structure, which is disposed between the first optical wavelength conversion structure and the second optical wavelength conversion structure.

10. The light-emitting module according to claim 1, characterized in that, The light-emitting module is used in a water quality detection system.

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