Light emitting panel and light emitting device

Abstract

The embodiment of the present application discloses a light-emitting panel and a light-emitting device. The light-emitting panel comprises a substrate, a light-emitting layer arranged on one side of the substrate, and an encapsulation layer arranged on the side of the light-emitting layer away from the substrate. The encapsulation layer comprises a heat dissipation layer, and the surface area of the heat dissipation layer is greater than that of the light-emitting layer. The light-emitting panel comprises a middle region and an edge region surrounding the middle region. The unit heat dissipation area of the heat dissipation layer in the middle region is greater than that in the edge region. The technical scheme provided by the embodiment of the present application improves the heat dissipation effect of the light-emitting panel, and further improves the service life of the light-emitting panel.

Description

Technical Field

[0001] The present invention relates to the field of light-emitting technology, and in particular to a light-emitting panel and a light-emitting device. Background Technology

[0002] With the development of light-emitting technology, people have increasingly higher requirements for light-emitting panels. Due to the characteristics of its planar light source, the temperature change of the light-emitting device itself in existing OLED light-emitting panels is not significant. However, when high brightness is required, the power consumption of the light-emitting device increases, causing a significant rise in temperature and making heat dissipation difficult.

[0003] Furthermore, organic materials generally have low temperature resistance, and the lifespan of OLED light-emitting devices decreases exponentially with increasing temperature. Existing light-emitting panels do not have special heat dissipation designs for OLEDs, and when the area of ​​the OLED screen increases, the temperature on the screen surface is not uniform, which will cause regional brightness decay and uneven brightness. Moreover, excessively high temperatures will affect the lifespan of the light-emitting panel. Summary of the Invention

[0004] This invention provides a light-emitting panel and a light-emitting device to solve the problem of poor heat dissipation of the light-emitting panel, which affects the service life of the light-emitting panel.

[0005] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0006] According to one aspect of the present invention, an embodiment of the present invention provides a light-emitting panel, comprising:

[0007] substrate;

[0008] A light-emitting layer disposed on one side of the substrate;

[0009] An encapsulation layer disposed on the side of the light-emitting layer away from the substrate;

[0010] The encapsulation layer includes a heat dissipation layer, the surface area of ​​which is larger than the surface area of ​​the light-emitting layer;

[0011] The light-emitting panel includes a central area and an edge area surrounding the central area;

[0012] The heat dissipation area per unit in the heat dissipation layer located in the middle region is greater than that per unit in the heat dissipation area located in the edge region.

[0013] Optionally, the unit heat dissipation area of ​​the heat dissipation layer gradually decreases from the middle region to the edge region.

[0014] Optionally, the encapsulation layer may also include:

[0015] At least one first encapsulation layer is disposed on the side of the light-emitting layer away from the substrate;

[0016] At least one second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate;

[0017] A heat dissipation layer is disposed on the side of the second encapsulation layer away from the substrate, and the heat dissipation layer includes at least one first protrusion;

[0018] Along the direction perpendicular to the light-emitting panel, the second encapsulation layer located on the outermost side of the light-emitting panel is doped with thermally conductive material.

[0019] Optionally, along the direction perpendicular to the light-emitting panel, the second encapsulation layer located on the outermost side of the light-emitting panel includes at least one second protrusion, and the first protrusion and the second protrusion are respectively provided in a one-to-one correspondence.

[0020] The orthographic projection of the first protrusion onto the substrate and the orthographic projection of the second protrusion onto the substrate at least partially overlap.

[0021] Optionally, the material of the first encapsulation layer may include inorganic materials;

[0022] The material of the second encapsulation layer includes organic materials;

[0023] The heat dissipation layer material includes at least one of aluminum foil, copper foil, graphite, graphene, diamond film, or sapphire film.

[0024] Optionally, the height of the first protrusion located in the middle region is greater than the height of the first protrusion located in the edge region;

[0025] Preferably, the height of the first protrusion gradually decreases in the direction from the middle region to the edge region.

[0026] Optionally, the density of the first protrusion located in the middle region is greater than the density of the first protrusion located in the edge region;

[0027] Preferably, the density of the first protrusion gradually decreases in the direction from the middle region to the edge region.

[0028] Optionally, the first protrusion includes a side edge and a bottom edge;

[0029] The angle between the side and bottom of the first protrusion located in the middle region is smaller than the angle between the side and bottom of the first protrusion located in the edge region.

[0030] Optionally, the angle between the side and bottom edge of the first protrusion gradually increases in the direction from the middle region to the edge region.

[0031] Optionally, along the direction perpendicular to the substrate, the shape of the cross-section of the first protrusion includes at least one of trapezoidal, rectangular, triangular, or semi-circular.

[0032] The thickness range of the heat dissipation layer includes: 1um-100um;

[0033] The height range of the first protrusion is 1µm-1mm;

[0034] The distance between two adjacent first protrusions ranges from 1µm to 10mm;

[0035] The heat dissipation area of ​​point P(a,b) on the light-emitting panel is inversely proportional to the position parameter; wherein, the position parameter is calculated by the following formula:

[0036] D=(a*b*2) / (a+b) (1)

[0037] Wherein, D is the position parameter, a is the distance from point P on the light-emitting panel to the first side of the light-emitting panel, and b is the distance from point P on the light-emitting panel to the second side of the light-emitting panel, with the first side and the second side being arranged opposite to each other.

[0038] According to another aspect of the present invention, an embodiment of the present invention provides a light-emitting device, comprising: a light-emitting panel as described in any of the first aspects.

[0039] The light-emitting panel provided in this embodiment of the invention has an encapsulation layer disposed on the side of the light-emitting layer away from the substrate. The surface area of ​​the heat dissipation layer included in the encapsulation layer is larger than the surface area of ​​the light-emitting layer, and the unit heat dissipation area of ​​the heat dissipation layer located in the middle region of the light-emitting panel is larger than the unit heat dissipation area located in the edge region of the light-emitting panel. This arrangement effectively increases the unit heat dissipation area of ​​the heat dissipation layer located in the middle region of the light-emitting panel, thereby improving the heat dissipation capacity of the middle region of the light-emitting panel, meeting the heat dissipation requirements of both the middle and edge regions of the light-emitting panel, and extending the service life of the light-emitting panel. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the structure of a light-emitting panel provided in an embodiment of the present invention;

[0042] Figure 2 This is a schematic diagram of another light-emitting panel provided in an embodiment of the present invention;

[0043] Figure 3 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention;

[0044] Figure 4 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention;

[0045] Figure 5 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention;

[0046] Figure 6 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention;

[0047] Figure 7 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention;

[0048] Figure 8 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention;

[0049] Figure 9 This is a schematic diagram of the structure of a light-emitting device provided in an embodiment of the present invention. Detailed Implementation

[0050] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0051] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0052] Figure 1 This is a schematic diagram of the structure of a light-emitting panel provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of another light-emitting panel provided in an embodiment of the present invention. (Combined with...) Figure 1 and Figure 2 The light-emitting panel 100 provided in this embodiment of the invention includes: a substrate 1; a light-emitting layer 2 disposed on one side of the substrate 1; an encapsulation layer 3 disposed on the side of the light-emitting layer 2 away from the substrate 1; the encapsulation layer 3 includes a heat dissipation layer 31, the surface area of ​​the heat dissipation layer 31 being larger than the surface area of ​​the light-emitting layer 2; the light-emitting panel 100 includes a central region 10 and an edge region 20 surrounding the central region 10; the unit heat dissipation area of ​​the heat dissipation layer 31 located in the central region 10 is larger than the unit heat dissipation area located in the edge region 20.

[0053] Figure 3 This is a schematic diagram of another light-emitting panel provided in an embodiment of the present invention. Specifically, the light-emitting layer 2 is used for emitting light. See also... Figure 3The light-emitting layer 2 may include a first electrode layer 21, a light-emitting device layer 22, and a second electrode layer 23. When a driving signal is applied between the first electrode 21 and the second electrode 23, the light-emitting device located in the light-emitting device layer 22 emits light, causing the light-emitting layer 2 to emit light. The encapsulation layer 3 is disposed on the side of the light-emitting layer 2 away from the substrate 1, so that the encapsulation layer 3 can block water and oxygen, improve the water and oxygen barrier capability of the light-emitting panel 100, and thus improve the lifespan of the light-emitting panel 100.

[0054] The encapsulation layer 3 includes a heat dissipation layer 31, the surface area of ​​which is larger than that of the light-emitting layer 2. The larger area of ​​the heat dissipation layer 31 is beneficial for the heat dissipation layer 31 to effectively dissipate heat from the light-emitting panel 100, reducing the risk of the light-emitting layer 2 becoming too hot and improving the service life of the light-emitting panel 100.

[0055] The light-emitting panel 100 includes a central region 10 and an edge region 20 surrounding the central region 10. Since heat tends to accumulate in the central region 10, and the heat generated by the light-emitting layer 2 of the light-emitting panel 100 is difficult to dissipate, the central region 10 is more prone to poor heat dissipation compared to the edge region 20. By setting the heat dissipation layer 31 located in the central region 10 to have a larger unit heat dissipation area, the heat dissipation capacity of the central region 10 of the light-emitting panel 100 is significantly improved. On the other hand, since the heat in the edge region 20 is smaller, setting the unit heat dissipation area in the edge region 20 can both meet the heat dissipation requirements of the edge region 20 of the light-emitting panel 100, improving the service life of the light-emitting panel 100, and reduce the material of the heat dissipation layer 31 of the light-emitting panel 100, thus improving the thinness and lightness of the light-emitting panel 100.

[0056] The light-emitting panel 100 provided in this embodiment has an encapsulation layer 3 disposed on the side of the light-emitting layer 2 away from the substrate 1. The surface area of ​​the heat dissipation layer 31 included in the encapsulation layer 3 is larger than the surface area of ​​the light-emitting layer 2, so that the unit heat dissipation area of ​​the heat dissipation layer 31 located in the middle region 10 of the light-emitting panel 100 is larger than the unit heat dissipation area located in the edge region 20 of the light-emitting panel 100. This arrangement effectively increases the unit heat dissipation area of ​​the heat dissipation layer 31 located in the middle region 10 of the light-emitting panel 100, and effectively improves the heat dissipation capacity of the middle region 10 of the light-emitting panel 100, thereby meeting the heat dissipation requirements of the light-emitting panel 100 for both the middle region 10 and the edge region 20, and improving the service life of the light-emitting panel 100.

[0057] Optional, Figure 4 This is a schematic diagram of another light-emitting panel provided in an embodiment of the present invention. Based on the above embodiments, see... Figure 4 From the middle region 10 to the edge region 20, the unit heat dissipation area of ​​the heat dissipation layer 31 gradually decreases.

[0058] Specifically, this design allows for more uniform heat dissipation from the light-emitting panel 100. Since heat tends to concentrate in the central region 10 of the light-emitting panel 100, making heat dissipation difficult, while the edge region 20 receives less heat, the heat dissipation area per unit area of ​​the heat dissipation layer 31 gradually decreases from the central region 10 to the edge region 20 by adjusting the direction from the central region 10 to the edge region 20. This allows the area of ​​the heat dissipation layer 31 to be adjusted according to heat dissipation needs. This design effectively ensures both the heat conduction and dissipation of the heat dissipation layer 31 while conserving its material. Furthermore, this design also results in a more uniform surface temperature of the light-emitting panel 100, further extending its lifespan.

[0059] Optionally, based on the above embodiments, see also... Figure 3 The encapsulation layer 3 of the light-emitting panel 100 provided in the embodiments of the present invention may further include: at least one first encapsulation layer 301, the first encapsulation layer 301 being disposed on the side of the light-emitting layer 2 away from the substrate 1; at least one second encapsulation layer 302, the second encapsulation layer 302 being disposed on the side of the first encapsulation layer 301 away from the substrate 1; a heat dissipation layer 31 being disposed on the side of the second encapsulation layer 302 away from the substrate 1, the heat dissipation layer 31 including at least one first protrusion 303; and the second encapsulation layer 302 located on the outermost side of the light-emitting panel 100 along the direction perpendicular to the light-emitting panel 100 being doped with a thermally conductive material.

[0060] Specifically, the first encapsulation layer 301 is disposed on the side of the light-emitting layer 2 away from the substrate 1, and the second encapsulation layer 302 is disposed on the side of the first encapsulation layer 301 away from the substrate 1, so that the encapsulation layer 3 includes at least the first encapsulation layer 301 and the second encapsulation layer 302, thereby improving the water and oxygen barrier capability of the encapsulation layer 3.

[0061] Optional, see below Figure 3 The encapsulation layer 3 can be configured to include at least two first encapsulation layers 301 and at least two second encapsulation layers 302, with the first encapsulation layers 301 and the second encapsulation layers 302 spaced apart. The presence of at least two first encapsulation layers 301 and at least two second encapsulation layers 302 further improves the encapsulation effect of the encapsulation layer 3. The heat dissipation layer 31 is disposed on the side of the second encapsulation layer 302 furthest from the substrate 1. When the encapsulation layer 3 includes at least two second encapsulation layers 302, the heat dissipation layer 31 can be disposed on the side of the outermost second encapsulation layer 302 furthest from the substrate 1 along the direction away from the substrate 1. This arrangement allows the heat dissipation layer 31 to be located outside the encapsulation layer 3 of the light-emitting panel 100, further improving the heat dissipation effect of the heat dissipation layer 31.

[0062] The heat dissipation layer 31 is designed with a concave-convex shape, which increases the heat dissipation area of ​​the heat dissipation layer 31. The outermost heat dissipation layer 31 of the encapsulation layer 3 of the light-emitting panel 100 can be attached to the second encapsulation layer 302 with an adhesive layer, which plays a role in encapsulation, protection and heat dissipation. However, when the brightness of the screen is too high or the area is too large, there is still a risk of overheating, which will affect the life and stability of the device.

[0063] During normal operation, heat dissipation between the heat dissipation layer 31 and the air is primarily achieved through natural convection. The heat transfer follows the formula: Q = hA(Tw - Tair), where h is the convective heat transfer coefficient, A is the heat dissipation area, Tw is the surface temperature of the light-emitting panel 100, and Tair is the temperature of the air near the light-emitting panel 100. The surface temperature of the light-emitting panel 100 should be minimized; therefore, to improve heat transfer efficiency, the heat dissipation area A and the convective heat transfer coefficient h need to be increased.

[0064] Figure 5 This is a schematic diagram of another type of light-emitting panel provided in an embodiment of the present invention. Figure 6 This is a schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present invention. (Combined with...) Figure 5 and Figure 6 In one optional implementation, the heat dissipation area of ​​point P(a,b) on the light-emitting panel 100 can be set to be proportional to a position parameter; wherein the position parameter is calculated using the following formula:

[0065] D=(a*b*2) / (a+b) (1)

[0066] Where D is the position parameter, a is the distance from point P on the light-emitting panel 100 to the first side of the light-emitting panel 100, and b is the distance from point P on the light-emitting panel 100 to the second side of the light-emitting panel 100. The first side and the second side are set relative to each other.

[0067] It should be noted that the first and second sides can be the left and right borders of the light-emitting panel 100, or the first and second sides can be the top and bottom borders of the light-emitting panel 100, without any limitation.

[0068] Figure 5 As exemplarily shown, the first side is the left border of the light-emitting panel 100, the second side is the right border of the light-emitting panel 100, a is the distance from point P on the light-emitting panel 100 to the first side (e.g., the left border) of the light-emitting panel 100, and b is the distance from point P on the light-emitting panel 100 to the second side (e.g., the right border) of the light-emitting panel 100.

[0069] Figure 6As exemplarily shown, the first side is the upper border of the light-emitting panel 100, the second side is the lower border of the light-emitting panel 100, a is the distance from point P on the light-emitting panel 100 to the first side (e.g., the upper border) of the light-emitting panel 100, and b is the distance from point P on the light-emitting panel 100 to the second side (e.g., the lower border) of the light-emitting panel 100.

[0070] By including at least one first protrusion 303 in the heat dissipation layer 31, the heat dissipation layer 31 is made into a concave-convex shape, which increases the heat dissipation area of ​​the light-emitting panel 100 and improves the heat exchange on the surface of the light-emitting panel 100. By providing a thermally conductive material in the second encapsulation layer 302 located on the outermost side of the light-emitting panel 100 along a direction perpendicular to the light-emitting panel 100, the convective heat transfer coefficient h is increased, thereby improving the thermal conductivity of the encapsulation layer 3.

[0071] The heat dissipation layer 31 includes at least one first protrusion 303, such that the first protrusion 303 of the heat dissipation layer 31 protrudes in a direction away from the substrate 1, thereby further increasing the area of ​​the heat dissipation layer 31 and further improving the heat dissipation efficiency of the light-emitting panel 100.

[0072] Optionally, based on the above embodiments, see also... Figure 3 The light-emitting panel 100 provided in this embodiment of the invention includes a second encapsulation layer 302 located on the outermost side of the light-emitting panel 100 along a direction perpendicular to the light-emitting panel 100. The second encapsulation layer 302 includes at least one second protrusion 304. The first protrusion 303 and the second protrusion 304 are disposed in a one-to-one correspondence. The orthographic projection of the first protrusion 303 on the substrate 1 and the orthographic projection of the second protrusion 304 on the substrate 1 at least partially overlap.

[0073] Specifically, this arrangement, where the second protrusion 304 corresponds to the first protrusion 303, allows the second protrusion 304 to provide better support for the first protrusion 303, enabling the protrusion to be made higher and further improving the heat dissipation effect of the heat dissipation layer 31. Furthermore, the second encapsulation layer 302 with the second protrusion 304 has a larger area, increasing the contact area between the second encapsulation layer 302 and the heat dissipation layer 31, making heat dissipation easier. On the other hand, since the orthographic projections of the first protrusion 303 and the second protrusion 304 on the substrate 1 at least partially overlap, the heat dissipation layer 31 containing the first protrusion 303 can be made thinner, further improving the heat dissipation effect of the heat dissipation layer 31.

[0074] Optionally, the second protrusion 304 of the second encapsulation layer 302 located on the outermost side of the light-emitting panel 100 is doped with a thermally conductive material to further improve the heat dissipation effect of the light-emitting panel 100.

[0075] Optionally, based on the above embodiments, see also... Figure 3The material of the first encapsulation layer 301 of the light-emitting panel 100 provided in this embodiment of the invention includes inorganic materials; the material of the second encapsulation layer 302 includes organic materials; and the material of the heat dissipation layer 31 includes at least one of aluminum foil, copper foil, graphite, graphene, diamond film or sapphire film.

[0076] Specifically, the first encapsulation layer 301 comprises inorganic materials, which enhances its water and oxygen barrier properties. The materials of the first encapsulation layer 301 may include silicon oxide, silicon nitride, etc. The first encapsulation layer 301 can be prepared by CVD or ALD. The second encapsulation layer 302 comprises organic materials, which allows it to form a denser protective film. This not only effectively improves the water and oxygen barrier properties of the encapsulation layer 302 but also provides a planarized substrate for the heat dissipation layer 31, facilitating its film formation. The second encapsulation layer 302 can be prepared by evaporation, printing, coating, or other methods.

[0077] The material of the heat dissipation layer 31 may include at least one of aluminum foil, copper foil, graphite, graphene, diamond film, or sapphire film. Optionally, the heat dissipation layer 31 may be a metal film layer. Since the heat dissipation layer 31 using a metal film layer has good water resistance and mechanical strength, and also has good thermal conductivity, this design allows the heat dissipation layer 31 to be made thinner while still achieving good heat dissipation, further improving the heat dissipation efficiency of the light-emitting panel 100. Optionally, the material of the heat dissipation layer 31 may include metal foil. The surface of the metal foil may be oxidized to form a dense protective film, effectively preventing scratches and corrosion, and also preventing surface fine lines of the metal foil from affecting the convective heat dissipation coefficient h. The thermally conductive material doped in the second encapsulation layer 302 may include at least one of aluminum foil, copper foil, graphite, graphene, diamond film, or sapphire film. The thermally conductive material doped in the second encapsulation layer 302 may be the same as or different from the material of the heat dissipation layer 31, and no limitation is made here.

[0078] Optionally, based on the above embodiments, see [link to relevant documentation]. Figure 4 In this embodiment of the invention, the height H of the first protrusion 303 located in the middle region 10 of the light-emitting panel 100 is greater than the height H of the first protrusion 303 located in the edge region 20. Preferably, the height H of the first protrusion 303 gradually decreases from the middle region 10 to the edge region 20.

[0079] Specifically, this arrangement results in a larger heat dissipation area for the first protrusion 303 located in the middle region 10, allowing the heat in the region of the light-emitting panel 100 to dissipate better, further improving the heat exchange capacity of the light-emitting panel 100, and thus improving the heat dissipation efficiency of the light-emitting panel 100.

[0080] Optional, Figure 7This is a schematic diagram of another light-emitting panel provided in an embodiment of the present invention. Based on the above embodiments, see... Figure 7 The density of the first protrusion 303 located in the middle region 10 is greater than the density of the first protrusion 303 located in the edge region 20. Preferably, the density of the first protrusion 303 gradually decreases from the middle region 10 to the edge region 20.

[0081] Specifically, this design, on the one hand, increases the heat dissipation area of ​​the first protrusion 303 in the middle region 10, allowing heat in the area of ​​the light-emitting panel 100 to dissipate better, further improving the heat exchange capacity of the light-emitting panel 100, and thus improving the heat dissipation efficiency of the light-emitting panel 100. On the other hand, it helps to reduce the thickness of the light-emitting panel 100, which is beneficial to the thinning and lightening of the light-emitting panel 100.

[0082] Optional, Figure 8 This is a schematic diagram of another light-emitting panel provided in an embodiment of the present invention. Based on the above embodiments, see... Figure 8 The first protrusion 303 includes a side and a bottom; the angle θ between the side and the bottom of the first protrusion 303 located in the middle region 10 is smaller than the angle θ between the side and the bottom of the first protrusion 303 located in the edge region 20.

[0083] Specifically, the first protrusion 303 may include a side, a bottom, and a top. The side and top of the first protrusion 303 have good heat dissipation, while the bottom of the first protrusion 303 has weaker heat dissipation due to heat accumulation. By setting the angle θ between the side and bottom of the first protrusion 303 in the middle region 10 to be smaller than the angle θ between the side and bottom of the first protrusion 303 in the edge region 20, the slope of the side of the first protrusion 303 in the middle region 10 is gentler, while the slope of the side of the first protrusion 303 in the edge region 20 is steeper. This results in a longer side of the first protrusion 303 in the middle region 10, providing a larger heat dissipation area, and a shorter side of the first protrusion 303 in the edge region 20, providing a smaller heat dissipation area. This configuration allows for better heat dissipation in the middle region 10 of the light-emitting panel 100, further improving the heat exchange capacity of the light-emitting panel 100 and thus improving its heat dissipation efficiency.

[0084] Optionally, based on the above embodiments, see also... Figure 8 From the middle region 10 to the edge region 20, the angle θ between the side and bottom edge of the first protrusion 303 gradually increases.

[0085] Specifically, this design allows for more even heat dissipation. Since heat tends to concentrate in the central region 10 of the light-emitting panel 100, making heat dissipation difficult, while the edge region 20 dissipates heat more easily, the angle θ between the side and bottom edge of the first protrusion 303 gradually increases from the central region 10 to the edge region 20. This causes the side edge of the first protrusion 303 of the heat dissipation layer 31 to gradually decrease from the central region 10 to the edge region 20, thus gradually reducing the heat dissipation area of ​​the first protrusion 303 from the central region 10 to the edge region 20. This allows the area of ​​the heat dissipation layer 31 to be set according to heat dissipation needs. This design not only ensures good heat conduction and dissipation of the heat dissipation layer 31 but also saves material. Furthermore, this design also makes the surface temperature of the light-emitting panel 100 more uniform, further improving its service life.

[0086] Optionally, based on the above embodiments, further combinations can be made. Figures 3 to 8 Along the direction perpendicular to the substrate 1, the shape of the cross section of the first protrusion 303 includes at least one of trapezoidal, rectangular, triangular or semi-circular; the thickness d of the heat dissipation layer 31 ranges from 1um to 100um; the height H of the first protrusion 303 ranges from 1um to 1mm; the distance between two adjacent first protrusions 303 can range from 1um to 10mm.

[0087] Specifically, the shape of the cross-section of the first protrusion 303 along the direction perpendicular to the substrate 1 can be configured as at least one of trapezoidal, rectangular, triangular, or semi-circular shapes, as needed. Preferably, see below. Figure 8 Along the direction perpendicular to the substrate 1, the cross-sectional shape of the first protrusion 303 is set to trapezoidal, which further increases the heat dissipation area of ​​the first protrusion 303 and further improves the service life of the light-emitting panel 100.

[0088] If the height H of the first protrusion 303 is too low, it will affect heat dissipation; if the height H of the first protrusion 303 is too high, it will result in an excessively thick light-emitting panel 100. By setting the height H of the first protrusion 303 to a range of 1µm-1mm, the heat dissipation layer 31 can effectively conduct heat to the air on the side of the heat dissipation layer 31 away from the substrate 1, while also facilitating the thinning of the light-emitting panel 100, further improving the practicality and service life of the light-emitting panel 100.

[0089] The distance between two adjacent first protrusions 303 can range from 1µm to 10mm. This arrangement ensures that the width between two adjacent first protrusions 303 is greater than twice that of the thermal boundary layer, which facilitates the effective dissipation of heat from the sides of the first protrusions 303 into the air. The thermal boundary layer is the boundary layer between the air layer with higher heat dissipation efficiency on the side of the heat dissipation layer 31 away from the substrate and the air layer with lower heat dissipation efficiency. In this embodiment, the light-emitting layer 2 and the encapsulation layer 3 of the light-emitting panel 100 are equivalent to a heating plate. Since the heating plate is placed in the air, heat energy will be transferred to the air through heat conduction. The temperature of the air closer to the heating plate is higher, and the temperature of the air farther away from the heating plate is lower. When the air is heated, its volume expands, its density decreases, and its buoyancy increases. Therefore, the air will flow from bottom to top. Because cold air is constantly replenished from below, the hot air below will become less and less, and the hot air will gradually accumulate at the top, making the hot air layer continuously thicker. This hot air layer is the thermal boundary layer. The thicker the thermal boundary layer, the less easily the heat energy is released. By setting the distance between two adjacent first protrusions 303 to a range of 1µm-10mm, the distance between two adjacent first protrusions 303 is greater than twice that of the thermal boundary layer. This setting allows the heat in the area between the first protrusions 303 of the heat dissipation layer 31 of the light-emitting panel 100 to be dissipated better, further improving the heat exchange capacity of the light-emitting panel 100 and thus improving the heat dissipation efficiency of the light-emitting panel 100.

[0090] Figure 9 This is a schematic diagram of a light-emitting device provided in an embodiment of the present invention. Based on the above embodiment, see... Figure 9 The light-emitting device 200 provided in the embodiments of the present invention includes the light-emitting panel 100 proposed in any of the above embodiments, and has the beneficial effects of the light-emitting panel 100 proposed in any of the above embodiments, which will not be repeated here.

[0091] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A light-emitting panel, characterized in that, include: substrate; A light-emitting layer disposed on one side of the substrate; An encapsulation layer disposed on the side of the light-emitting layer away from the substrate; The encapsulation layer includes a heat dissipation layer, the surface area of ​​which is larger than the surface area of ​​the light-emitting layer; The light-emitting panel includes a central region and an edge region surrounding the central region; The heat dissipation area per unit of the heat dissipation layer located in the middle region is greater than the heat dissipation area per unit of the heat dissipation layer located in the edge region; From the middle region to the edge region, the unit heat dissipation area of ​​the heat dissipation layer gradually decreases; The heat dissipation area of ​​point P(a,b) on the light-emitting panel is proportional to the position parameters; The position parameters are calculated using the following formula: D = (a*b*2) / (a+b) (1) Where D is the position parameter, a is the distance from point P on the light-emitting panel to the first side of the light-emitting panel, and b is the distance from point P on the light-emitting panel to the second side of the light-emitting panel. The first side and the second side are set relative to each other.

2. The light-emitting panel according to claim 1, characterized in that, The encapsulation layer further includes: At least one first encapsulation layer is disposed on the side of the light-emitting layer away from the substrate; At least one second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate; The heat dissipation layer is disposed on the side of the second encapsulation layer away from the substrate, and the heat dissipation layer includes at least one first protrusion; Along a direction perpendicular to the light-emitting panel, the second encapsulation layer located on the outermost side of the light-emitting panel is doped with a thermally conductive material.

3. The light-emitting panel according to claim 2, characterized in that, Along the direction perpendicular to the light-emitting panel, the second encapsulation layer located on the outermost side of the light-emitting panel includes at least one second protrusion, and the first protrusion and the second protrusion are respectively provided in a one-to-one correspondence; The orthographic projection of the first protrusion on the substrate and the orthographic projection of the second protrusion on the substrate at least partially overlap; The material of the first encapsulation layer includes inorganic materials; The material of the second encapsulation layer includes organic materials; The material of the heat dissipation layer includes at least one of aluminum foil, copper foil, graphite, graphene, diamond film, or sapphire film.

4. The light-emitting panel according to claim 2, characterized in that, The height of the first protrusion located in the middle region is greater than the height of the first protrusion located in the edge region.

5. The light-emitting panel according to claim 4, characterized in that, The height of the first protrusion gradually decreases from the middle region to the edge region.

6. The light-emitting panel according to claim 2, characterized in that, The density of the first protrusion located in the middle region is greater than the density of the first protrusion located in the edge region.

7. The light-emitting panel according to claim 6, characterized in that, The density of the first protrusion gradually decreases in the direction from the middle region to the edge region.

8. The light-emitting panel according to claim 2, characterized in that, The first protrusion includes a side edge and a bottom edge; The angle between the side of the first protrusion located in the middle region and the bottom edge is smaller than the angle between the side of the first protrusion located in the edge region and the bottom edge.

9. The light-emitting panel according to claim 8, wherein the angle between the side of the first protrusion and the bottom edge gradually increases in the direction from the middle region to the edge region.

10. The light-emitting panel according to claim 2, characterized in that, Along the direction perpendicular to the substrate, the shape of the cross-section of the first protrusion includes at least one of trapezoidal, rectangular, triangular, or semi-circular. The thickness range of the heat dissipation layer includes: 1 μm - 100 μm; The height range of the first protrusion includes: 1 μm - 1 mm; The distance between two adjacent first protrusions ranges from 1µm to 10mm.

11. A light-emitting device, characterized in that, include: The light-emitting panel according to any one of claims 1 to 10.

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