An irradiation device for implant surface modification

Abstract

The present invention discloses an irradiation device for implant surface modification, comprising: at least one excimer lamp tube and an electrode assembly; the excimer lamp tube is disposed on the electrode assembly, the implant is located within the irradiation range of the excimer lamp tube, and the electrode assembly is electrically connected to an external power supply. The excimer lamp tube is one (or formed by multiple ones surrounding in a ring shape), and the (surrounded) irradiation area is the working area. The implant is placed in the working area for irradiation modification. The electrode assembly is at both ends of the excimer lamp tube, used to perform high-voltage and high-frequency bombardment on the rare gas in the excimer lamp tube, so as to obtain ultraviolet light with a specific wavelength, and then perform modification irradiation on the implant (which can be a denture or a bone, etc.). Through the design of the above structure, a simple modification lamp can be obtained, which is used for the surface modification of small implants, with a simple, compact structure, convenient to use, and easy to store, assemble and disassemble.

Description

Technical Field

[0001] The present invention relates to the technical field of implant surface modification, and more specifically, the present invention relates to an irradiation device for implant surface modification. Background Art

[0002] The surface modification treatment method using 172 nm UV light is a structure in which the implant to be modified and the light source are spaced apart by a predetermined distance and the implant is irradiated. Therefore, in order to uniformly irradiate the entire surface of the implant with light, the general method is to perform the treatment while maintaining the predetermined distance between the implant and the light source and rotating the implant. Using this method, the treatment time required for the surface modification treatment of the implant is about 20 to 30 minutes, and the structure of the traditional modification irradiation device is complex, and assembly, use, and storage are all very inconvenient. Therefore, how to make the modification lamp small, portable, easy to assemble, store, and use is one of the technical problems to be solved in this application. And it is also necessary to propose an irradiation device for implant surface modification, which can improve the efficiency of implant surface modification on the basis of facilitating the storage, disassembly, and assembly of the modification lamp. Summary of the Invention

[0003] In the summary of the invention part, a series of simplified concepts are introduced, which will be further described in detail in the detailed implementation part. The summary of the invention part of the present invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0004] To at least partially solve the above problems, the present invention provides a modification lamp, comprising: at least one excimer lamp tube and an electrode assembly; the excimer lamp tube is arranged on the electrode assembly, the implant is within the irradiation range of the excimer lamp tube, and the electrode assembly is electrically connected to an external power supply.

[0005] Preferably, the electrode assembly includes a low-voltage electrode and a high-voltage electrode, the high-voltage electrode is arranged at the upper end of the excimer lamp tube, the low-voltage electrode is arranged at the lower end of the excimer lamp tube, and both the high-voltage electrode and the low-voltage electrode are electrically connected to an external power supply.

[0006] Preferably, the low-voltage electrode is connected to the base through an insulating block, at least three excimer lamp tubes are arranged, multiple excimer lamp tubes are arranged in parallel with each other, and multiple excimer lamp tubes are arranged in a surrounding manner, and the middle space surrounded by the excimer lamp tubes is the irradiation working area.

[0007] Preferably, the high-voltage electrode is disposed inside the excimer lamp tube, and the lead-out portion of the high-voltage electrode is led out from the upper end of the excimer lamp tube. A protective cap is provided at the upper end of the excimer lamp tube, and the lead-out portion of the high-voltage electrode is led out from the wire outlet hole of the protective cap.

[0008] The present invention provides an irradiation device for implant surface modification, comprising: the modification lamp, a sealed tank, and a vacuum pumping device. The modification lamp is disposed inside the sealed tank, and the vacuum pumping device is used to maintain a vacuum state inside the sealed tank. The implant is located inside the sealed tank and within the irradiation range of the excimer lamp tube.

[0009] Preferably, the sealed tank includes the base, an outer shell, and an upper cover; the base and the upper cover are respectively located at both ends of the outer shell. A wire lead-out hole is provided on the upper cover, and the wire of the high-voltage electrode is led out through the wire lead-out hole. The vacuum pumping device is used to pump the air out of the sealed tank.

[0010] Preferably, a placement hole is provided on the base, and the placement hole penetrates through the base, the insulating block, and the low-voltage electrode.

[0011] Preferably, a sealing bracket is provided inside the placement hole. The implant is located at the top of the sealing bracket. A placement table is provided at the top of the sealing bracket, and the implant is disposed on the placement table. A blocking portion is provided on the side wall of the sealing bracket, and the shape of the blocking portion is adapted to the shape of the placement hole. A lifting device is provided at the bottom of the sealing bracket, and the lifting device is used to control the sealing bracket to insert the implant from the placement hole into the irradiation range of the excimer lamp tube for irradiation.

[0012] Preferably, a sealing plug is provided in the wire lead-out hole. The sealing plug includes a compression sleeve and a two-way sleeve. Both the compression sleeve and the two-way sleeve are elastic members. Both the compression sleeve and the two-way sleeve are sleeved on the wire of the electrode assembly. The compression sleeve is located inside the upper cover, and the two-way sleeve penetrates through the wire lead-out hole.

[0013] Preferably, the two-way sleeve includes an outer sealing section, a transition section, an inner sealing section, and a folding section. The outer sealing section is connected to one end of the inner sealing section through the transition section. The other end of the inner sealing section is connected to the end of the folding section. The outer sealing section is located at the outer opening of the wire lead-out hole. The inner sealing section is located at the inner opening of the wire lead-out hole. The transition section is located inside the wire lead-out hole. The compression sleeve includes an insertion section and a shaping section. The insertion section is inserted into the transition section, and the shape of the shaping section is adapted to the inner sealing section and the folding section.

[0014] Preferably, the placement table includes a transparent platform and a reflective cone. The bottom of the reflective cone is connected to the top of the sealing bracket. The transparent platform is arranged on the top surface of the reflective cone. The implant is placed on the transparent platform. The inner wall of the reflective cone is a total reflection mirror surface. Several layers of reflective platforms are arranged on the inner wall of the reflective cone. A convex lens is arranged at the bottom of the reflective cone, and the bottom surface of the convex lens is a total reflection mirror surface.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects:

[0016] The excimer lamp tube is one (or formed by multiple ones surrounding in a ring). The (surrounded) irradiation area is the working area. The implant is placed in the working area for irradiation modification. The electrode assembly is at both ends of the excimer lamp tube, used to bombard the rare gas in the excimer lamp tube with high voltage and high frequency, so as to obtain ultraviolet light with a specific wavelength (such as ultraviolet light with a wavelength of 172nm that can be used for light modification), and then perform modification irradiation on the implant (which can be a small implant such as a denture or bone, or can also be a medium or large implant). Through the design of the above structure, a simple modification lamp can be obtained for the surface modification of implants, with a simple, small and convenient structure for use, and convenient for storage, assembly and disassembly.

[0017] For the irradiation device for implant surface modification of the present invention, other advantages, objectives and features of the present invention will be partially reflected by the following description, and will also be understood by those skilled in the art through the research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are used to provide further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0019] Figure 1 It is a schematic structural diagram of the irradiation device for implant surface modification of the present invention.

[0020] Figure 2 It is a cross-sectional view of the irradiation device for implant surface modification of the present invention.

[0021] Figure 3a It is a cross-sectional view of the irradiation device for implant surface modification of the present invention.

[0022] Figure 3b It is a cross-sectional view of the sealing bracket in the irradiation device for implant surface modification of the present invention.

[0023] Figure 4 It is an exploded view of the sealing plug in the irradiation device for implant surface modification of the present invention.

[0024] Figure 5 Schematic diagram of the application of the sealing plug in the irradiation device for implant surface modification according to the present invention.

[0025] Figure 6 Exploded view of the placement table in the irradiation device for implant surface modification according to the present invention.

[0026] Figure 7 Schematic diagram of the structure of the bottom of the placement table in the irradiation device for implant surface modification according to the present invention.

[0027] Figure 8 Schematic diagram of the light reflected by the placement table in the irradiation device for implant surface modification according to the present invention.

[0028] Figures 9-11 Top, internal and bottom physical diagrams of the first implementation manner of the modification lamp in the irradiation device for implant surface modification according to the present invention.

[0029] Figure 12a , b are schematic diagrams of the excimer lamp tube (with high-voltage electrodes inside) of the second implementation manner of the modification lamp.

[0030] Figure 12c Physical diagram of the excimer lamp tube (with high-voltage electrodes inside) of the second implementation manner of the modification lamp.

[0031] Figures 13-14 Physical diagrams of the excimer lamp tube (with high-voltage electrodes inside) of the second implementation manner of the modification lamp without a protective cap and with a protective cap.

[0032] In the figure: 1 excimer lamp tube, 2 sealed tank, 21 base, 22 outer shell, 23 upper cover, 3 implant, 4 sealing plug, 41 compression sleeve, 411 insertion section, 412 shaping section, 42 double-way sleeve, 421 outer sealing section, 422 transition section, 423 inner sealing section, 424 folding section, 5 low-voltage electrode, 6 high-voltage electrode, 7 insulating block, 8 sealing bracket, 81 blocking part, 82 lifting device, 9 placement table, 91 transparent platform, 92 reflection cone barrel. Detailed implementation manners

[0033] The following further elaborates on the present invention in conjunction with the accompanying drawings and embodiments, so that those skilled in the art can implement it with reference to the text of the specification.

[0034] It should be understood that terms such as "having", "comprising", and "including" as used herein do not exclude the presence or addition of one or more other elements or their combinations.

[0035] Such as Figures 1-11As shown in the figure, the present invention provides a modified lamp, comprising: at least one excimer lamp tube 1 and an electrode assembly; the excimer lamp tube 1 is arranged on the electrode assembly, and the implant 3 is located within the irradiation range of the excimer lamp tube 1, and the electrode assembly is electrically connected to an external power supply.

[0036] The working principle and beneficial effects of the above technical solution: The excimer lamp tube 1 is one (or formed by multiple ones surrounding in a ring), and the (surrounded) irradiation area is the working area. The implant 3 is placed in the working area for irradiation modification. The electrode assembly is at both ends of the excimer lamp tube 1 and is used to bombard the rare gas in the excimer lamp tube 1 with high voltage and high frequency, so as to obtain ultraviolet light with a specific wavelength (such as ultraviolet light with a wavelength of 172nm that can be used for light modification), and then perform modification irradiation on the implant 3 (which can be a small implant such as a denture or a bone, or can also be a medium or large implant). Through the design of the above structure, a simple modified lamp can be obtained for the surface modification of implants, with a simple, small and convenient structure for use, and convenient for storage, assembly and disassembly.

[0037] In the first embodiment, the electrode assembly includes a low-voltage electrode 5 and a high-voltage electrode 6. The high-voltage electrode 6 is arranged at the upper end of the excimer lamp tube 1, and the low-voltage electrode 5 is arranged at the lower end of the excimer lamp tube 1. Both the high-voltage electrode 6 and the low-voltage electrode 5 are electrically connected to an external power supply. The low-voltage electrode 5 is connected to the base 21 through an insulating block 7, and the surface of the high-voltage electrode 6 is wrapped with an insulating material to prevent creepage between high voltage and the outside or between high voltage and the implant 3. At least three excimer lamp tubes 1 are arranged, and multiple excimer lamp tubes 1 are arranged in parallel with each other and are arranged in a surrounding manner. The middle space surrounded by the excimer lamp tubes 1 is the irradiation working area.

[0038] The working principle and beneficial effects of the above technical solution: When performing the surface modification of the implant 3, the implant 3 is placed into the working area from the placement hole, and it should be ensured that the implant 3 is located between the low-voltage electrode 5 and the high-voltage electrode 6, so as to ensure the irradiation area of the implant 3. The electrode assembly is turned on, and the low-voltage electrode 5 and the high-voltage electrode 6 bombard the rare gas in the excimer lamp tube 1 with high frequency and high voltage, thereby generating ultraviolet light, and the ultraviolet light irradiates on the implant 3 to modify it. After 1 - 2 minutes (the time required for different implants 3 can be adjusted according to the actual situation. For example, teeth can generally be completed in 10 seconds), the electrode assembly is turned off, and the modification of the implant 3 is completed. In this embodiment, at least three excimer lamp tubes 1 are arranged in a surrounding manner to obtain a surrounding modified light irradiation on the implant 3, so as to ensure the uniformity of the light irradiation and the consistency of the light intensity of the implant 3, thereby avoiding repeatedly rotating the implant 3 or the modified lamp for irradiation.

[0039] In the second embodiment, the high-voltage electrode 6 is fixed inside the excimer lamp tube 1 by a fixing member, and the lead-out portion of the high-voltage electrode 6 is led out from the upper end of the excimer lamp tube 1. A protective cap is provided at the upper end of the excimer lamp tube 1, and the lead-out portion of the high-voltage electrode 6 is led out from the wire outlet hole of the protective cap.

[0040] The working principle and beneficial effects of the above technical solution: The fixing member is spring-shaped, used to fix the electrode and serve as an electrode lead wire. The high-voltage electrode 6 is arranged inside the excimer lamp tube 1, and the circuit is led out from the upper end. A protective cap is provided at the upper end of the excimer lamp tube 1 to connect the high-voltage electrodes 6 in series, and potting is carried out inside the protective cap to prevent creepage.

[0041] The present invention provides an irradiation device for implant surface modification, including: a modification lamp, a sealed tank 2, and a vacuum pumping device. The modification lamp is arranged inside the sealed tank 2. The vacuum pumping device is used to maintain a vacuum state inside the sealed tank 2. The implant 3 is located inside the sealed tank 2 and within the irradiation range of the excimer lamp tube 1. The sealed tank 2 includes the base 21, the outer shell 22, and the upper cover 23. The outer shell 22 is tubular, and the base 21 and the upper cover 23 are respectively located at both ends of the outer shell 22. An opening is provided at the upper end of the upper cover 23, and the opening is connected to the upper cover 23 with an insulating material (insulating glue, ceramic). A wire lead-out hole is provided on the insulating material to ensure that high voltage does not cause creepage with the upper cover 23. The circuit of the high-voltage electrode 6 is led out through the wire lead-out hole and sealed with the wire lead-out hole by a sealing plug 4. The vacuum pumping device is used to pump vacuum inside the sealed tank 2. A placement hole is provided on the base 21, and the placement hole penetrates through the base 21, the insulating block 7, and the low-voltage electrode 5. A sealing bracket 8 is arranged inside the placement hole. The implant 3 is located at the top of the sealing bracket 8. A placement platform 9 is provided at the top of the sealing bracket 8, and the implant 3 is arranged on the placement platform 9. A blocking portion 81 is provided on the side wall of the sealing bracket 8, and the shape of the blocking portion 81 is adapted to the shape of the placement hole. A lifting device 82 is provided at the bottom of the sealing bracket 8, and the lifting device 82 is used to control the sealing bracket 8 to insert the implant 3 from the placement hole into the irradiation range of the excimer lamp tube 1 for irradiation.

[0042] Working principle and beneficial effects of the above technical solution: When performing surface modification of the implant 3, first use the sealing bracket 8 to install the implant 3 on the placement table 9. Then insert the sealing bracket 8 from the placement hole until the blocking portion 81 completely coincides with and seals the placement hole. Start the lifting device 82 to drive the sealing bracket 8 to insert from the placement hole into the irradiation range of the excimer lamp tube 1, so that the implant 3 moves into the working area, and it should be ensured that the implant 3 is located between the low-voltage electrode 5 and the high-voltage electrode 6 to ensure the irradiation area of the implant 3. Then start the vacuum pumping device to make the inside of the sealing tank 2 in a vacuum state. Turn on the electrode assembly, and the low-voltage electrode 5 and the high-voltage electrode 6 bombard the rare gas in the excimer lamp tube 1 at high frequency and high voltage to generate ultraviolet light. The ultraviolet light irradiates on the implant 3 to modify it. After 1-2 minutes (the time required for different implants 3 can be adjusted according to the actual situation. For example, teeth generally can be completed in 10 seconds), turn off the electrode assembly and the vacuum pumping device, and take out the modified implant 3 for use. The vacuum pumping device can keep the inside of the sealing tank 2 in a vacuum state, thereby improving the modification efficiency of the implant 3, and then performing modification irradiation on the implant 3 (which can be dentures or bones, etc.) in a vacuum environment. And the sealing tank 2 can be equipped according to the volume of the implant 3, so that the volume of this surface modification device is more compact and portable. The sealing tank 2 can also prevent the modified light from leaking out, enhance the irradiation effect, and at the same time protect the operator from being irradiated by the modified light.

[0043] In one embodiment, the sealing plug 4 includes a compression sleeve 41 and a two-way sleeve 42. Both the compression sleeve 41 and the two-way sleeve 42 are elastic members. The compression sleeve 41 and the two-way sleeve 42 are both sleeved on the circuit of the electrode assembly. The compression sleeve 41 is located inside the upper cover 23, and the two-way sleeve 42 penetrates through the circuit lead-out hole. The two-way sleeve 42 includes an outer sealing section 421, a transition section 422, an inner sealing section 423, and a folding section 424. The outer sealing section 421 is connected to one end of the inner sealing section 423 through the transition section 422. The other end of the inner sealing section 423 is connected to the end of the folding section 424. The outer sealing section 421 is located at the outer opening of the circuit lead-out hole, the inner sealing section 423 is located at the inner opening of the circuit lead-out hole, the transition section 422 is located inside the circuit lead-out hole. The compression sleeve 41 includes an insertion section 411 and a shaping section 412. The insertion section 411 is inserted into the transition section 422, and the shape of the shaping section 412 is adapted to the inner sealing section 423 and the folding section 424.

[0044] Working principle and beneficial effects of the above technical solution: The sealing plug 4 at the wire lead-out hole usually adopts an I-shaped sealing plug to achieve the effect of double-sided clamping and sealing. However, the I-shaped sealing plug is inconvenient to install, and the wire can slide relative to the inner wall of the I-shaped sealing plug, easily causing air leakage. At the same time, the wire is easily detached from the high-voltage electrode 6 and the low-voltage electrode 5 during the pulling process. Therefore, the sealing plug 4 in this application is required to achieve the effects of fixation, anti-sliding, and double-sided sealing. During installation, the double-sided sleeve 42 is first installed. Pinch the outer sealing section 421 with fingers to make it smaller than the aperture of the wire lead-out hole, and then penetrate it from the inside to the outside of the upper cover 23 through the wire lead-out hole until the outer sealing section 421 is completely pulled out from the wire lead-out hole. At this time, the transition section 422 is located inside the wire lead-out hole, and the inner sealing section 423 is stuck at the bottom opening of the wire lead-out hole to achieve self-fixation of the double-sided sleeve 42. Then, the pressing sleeve 41 is sleeved on the wire, and the wire is passed through the double-sided sleeve 42. After adjusting the position of the wire, the pressing sleeve 41 is pushed upward along the wire until the insertion section 411 is inserted into the transition section 422. At this time, under the extrusion of the wire, a firm connection is formed between the insertion section 411 and the transition section 422 and a sealing effect is achieved. At the same time, the inner sealing section 423 also has a sealing effect. Then, the shaping section 412 and the folding section 424 are folded (the shaping section 412 can be formed by enclosing multiple deformable strips), as Figure 5 shown, to prevent the sealing plug 4 from being pulled out from the wire lead-out hole. When evacuating, the outer sealing section 421 can be inserted into the opening of the wire lead-out hole to achieve sealing and prevent air leakage. When the wire is pulled outwards, the connection between the insertion section 411 and the transition section 422 becomes tighter to prevent the wire from being pulled and separated from the electrode assembly. The outward turning of the pressing sleeve 41 and the double-sided sleeve 42 can provide a pulling force for the sealing plug 4 towards the inside of the upper cover 23, thereby ensuring the sealing performance of the outer sealing section 421 and preventing the wire from being scratched by the wire lead-out hole due to swinging.

[0045] In one embodiment, the placement table 9 includes a transparent platform 91 and a reflective cone 92. The bottom of the reflective cone 92 is connected to the top of the sealing bracket 8, and the transparent platform 91 is arranged on the top surface of the reflective cone 92. The implant 3 is placed on the transparent platform 91. The inner wall of the reflective cone 92 is a total reflection mirror surface, and several layers of reflection platforms are arranged on the inner wall of the reflective cone 92. A convex lens is arranged at the bottom of the reflective cone 92, and the bottom surface of the convex lens is a total reflection mirror surface.

[0046] Working principle and beneficial effects of the above technical solution: To facilitate the irradiation of the implant 3 in the sealed tank 2, a placement table 9 can be provided on the sealed bracket 8 to conveniently place the implant 3. It is difficult to achieve the effect of comprehensive irradiation of the implant 3 by the traditional fixing frame method because whenever fixation is required, a part of the implant 3 will be blocked. Therefore, in this application, a placement table 9 is provided. The placement table 9 uses a transparent platform 91 to support the implant 3. Ultraviolet light can penetrate the transparent platform 91 and enter the reflection cone 92. A reflection platform and a convex lens are provided in the reflection cone 92. When the ultraviolet light is obliquely irradiated on the inner wall of the reflection cone 92, reflection will occur. When it is reflected to the convex lens at the bottom, a focusing effect will be formed to increase the intensity of the ultraviolet light (which can be regarded as a small ultraviolet light emission source). Subsequently, the ultraviolet light is reflected to the inner wall of the reflection cone 92 again through the total reflection mirror on the bottom surface of the convex lens, thereby forming reflected ultraviolet light that penetrates from the bottom of the transparent platform 91, and then irradiating and modifying the support surface of the implant 3 on the transparent platform 91 (such as Figure 8 shown). The reflection platform on the inner wall of the reflection cone 92 can prevent the incident light of the ultraviolet light from being at a right angle to the inner wall of the reflection cone 92, reducing the waste of the ultraviolet light source caused by the ultraviolet light returning along the incident line.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0048] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and embodiments. It can be fully applied to various fields suitable for the present invention. For those skilled in the art, additional modifications can be easily made. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrated examples described herein.

Claims

1. An irradiation device for implant surface modification, characterized in that, Including: A modified lamp, a sealed tank (2) and a vacuum pumping device. The modified lamp includes at least one excimer lamp tube (1) and an electrode assembly. The electrode assembly includes a low-voltage electrode (5) and a high-voltage electrode (6). The low-voltage electrode (5) is connected to the base (21) through an insulating block (7). The modified lamp is arranged inside the sealed tank (2). The vacuum pumping device is used to maintain a vacuum state inside the sealed tank (2). An implant (3) is located inside the sealed tank (2) and within the irradiation range of the excimer lamp tube (1) of the modified lamp. The sealed tank (2) includes the base (21), a housing (22) and an upper cover (23). The base (21) and the upper cover (23) are respectively located at both ends of the housing (22). A wire lead-out hole is provided on the upper cover (23). The wire of the high-voltage electrode (6) is led out through the wire lead-out hole. The vacuum pumping device is used to pump the inside of the sealed tank (2) to a vacuum. It further includes a sealing plug (4). The sealing plug (4) seals the wire lead-out hole. The sealing plug (4) includes a compression sleeve (41) and a two-way sleeve (42). Both the compression sleeve (41) and the two-way sleeve (42) are elastic members. Both the compression sleeve (41) and the two-way sleeve (42) are sleeved on the wire of the electrode assembly. The compression sleeve (41) is located inside the upper cover (23). The two-way sleeve (42) penetrates through the wire lead-out hole. The two-way sleeve (42) includes an outer sealing section (421), a transition section (422), an inner sealing section (423) and a folding section (424). The outer sealing section (421) is connected to one end of the inner sealing section (423) through the transition section (422). The other end of the inner sealing section (423) is connected to the end of the folding section (424). The outer sealing section (421) is located at the outer opening of the wire lead-out hole. The inner sealing section (423) is located at the inner opening of the wire lead-out hole. The transition section (422) is located inside the wire lead-out hole. The compression sleeve (41) includes an insertion section (411) and a shaping section (412). The insertion section (411) is inserted into the transition section (422). The shape of the shaping section (412) is adapted to the inner sealing section (423) and the folding section (424).

2. The irradiation device for implant surface modification according to claim 1, characterized in that, A placement hole is provided on the base (21). The placement hole penetrates through the base (21), the insulating block (7) and the low-voltage electrode (5).

3. The irradiation device for implant surface modification according to claim 2, characterized in that, It further includes a sealing bracket (8). The implant (3) is located on top of the sealing bracket (8). A placement table (9) is provided on the top of the sealing bracket (8), and the implant (3) is arranged on the placement table (9). A blocking portion (81) is provided on the side wall of the sealing bracket (8), and the shape of the blocking portion (81) is adapted to the shape of the placement hole. A lifting device (82) is provided at the bottom of the sealing bracket (8), and the lifting device (82) is used to control the sealing bracket (8) to insert the implant (3) from the placement hole into the irradiation range of the excimer lamp tube (1) for irradiation.

4. The irradiation device for implant surface modification according to claim 1, characterized in that The excimer lamp tube (1) is arranged on the electrode assembly. The implant (3) is located within the irradiation range of the excimer lamp tube (1), and the electrode assembly is electrically connected to an external power supply.

5. The irradiation device for implant surface modification according to claim 4, characterized in that, The high-voltage electrode (6) is arranged at the upper end of the excimer lamp tube (1), and the low-voltage electrode (5) is arranged at the lower end of the excimer lamp tube (1). Both the high-voltage electrode (6) and the low-voltage electrode (5) are electrically connected to an external power supply.

6. The irradiation device for implant surface modification according to claim 5, characterized in that, The low-voltage electrode (5) is connected to the base (21) through an insulating block (7). At least three excimer lamp tubes (1) are provided, and multiple excimer lamp tubes (1) are arranged parallel to each other and are arranged in a surrounding manner. The middle space surrounded by the excimer lamp tubes (1) is the irradiation working area.

7. The irradiation device for implant surface modification according to claim 6, characterized in that, The high-voltage electrode (6) is arranged inside the excimer lamp tube (1), and the lead-out portion of the high-voltage electrode (6) is led out from the upper end of the excimer lamp tube (1). A protective cap is provided at the upper end of the excimer lamp tube (1), and the lead-out portion of the high-voltage electrode (6) is led out from the wire outlet hole of the protective cap.

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