Chemical mechanical polishing drive assembly

By introducing a vibration damping shaft system into the chemical mechanical polishing equipment, vibration energy is absorbed and converted, solving the problem of equipment instability caused by bearing head vibration, and improving the stability of wafer grinding and the service life of the equipment.

CN116175403BActive Publication Date: 2026-04-14HWATSING TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202211708144.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-28
Publication Date
2026-04-14
Estimated Expiration
2042-12-28

AI Technical Summary

Technical Problem

Existing chemical mechanical polishing equipment suffers from vibration problems in the bearing head, especially during high-pressure polishing, which exacerbates the vibration, leading to equipment instability and affecting wafer polishing quality.

Method used

A chemical mechanical polishing drive assembly including a vibration damping shaft system was designed, comprising a first, second, and third vibration damping module, which absorbs horizontal, vertical, and lateral vibrations respectively. Vibration energy is absorbed and converted through structures such as wing plates, damping columns, and vibrating cores to prevent vibration transmission and loosening.

Benefits of technology

Without increasing the weight of the drive frame, it effectively absorbs vibrations in different degrees of freedom, improves the stability of wafer grinding and the service life of the equipment, prevents parts from loosening, and improves polishing quality.

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Abstract

The application provides a chemical mechanical polishing driving assembly, comprising a driving unit, a driving frame, a rotary joint, a bearing head and a damping shaft system; the damping shaft system comprises a first damping module and a second damping module to absorb vibration in horizontal and / or vertical directions respectively. The damping shaft system provided by the application absorbs vibration energy in different degrees of freedom without increasing the self weight of the driving frame, blocks the transmission path of the vibration energy, prevents the loosening and even failure of parts due to vibration, and improves the stability of wafer grinding quality to some extent.
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