A wave-absorbing thermally conductive material, tape, electronic components, and a method for preparing the tape.

Abstract

This invention discloses a microwave absorbing thermal conductive material, an adhesive tape, electronic components, and a method for preparing the adhesive tape, belonging to the field of polymer materials technology. By weight, the microwave absorbing thermal conductive material comprises: 60-100 parts binder, 5-40 parts tackifying resin, 0.1-5 parts thickener, 1-5 parts dispersant, 0.5-3 parts coupling agent, 0.1-3 parts defoamer, 0.1-3 parts wetting agent, 20-50 parts microwave absorbing agent, and 20-60 parts thermal conductive agent. The microwave absorbing thermal conductive material provided by this invention, when applied to electronic components, exhibits low thermal resistance and can reduce interference from external electromagnetic waves, thus addressing the requirements of electronic components for both microwave absorption and heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of materials technology, and in particular to a wave-absorbing and heat-conducting material, tape, electronic components, and a method for preparing the tape. Background Technology

[0002] Electronic systems contain numerous electronic components. The electromagnetic waves generated by these high-frequency, miniature, and integrated electronic components can interfere with each other. Therefore, existing technologies cover electromagnetically sensitive electronic components with absorbing sheets to reduce electromagnetic noise interference and ensure normal operation. Sources of electromagnetic interference include electromagnetic waves from other electronic components or reflected electromagnetic waves from the sensitive components. The thicker the existing absorbing sheet, the better its absorption effect, thus mitigating electromagnetic interference. However, thicker absorbing sheets are less conducive to heat dissipation for electronic components, and the double-sided adhesive connecting the absorbing sheet and the electronic component increases the thermal resistance of the material, putting the electronic component at high risk of overheating.

[0003] Currently, there are two main methods for achieving microwave absorption and heat conduction: one is to attach heat-dissipating materials such as thermally conductive graphite or copper to the microwave absorbing material, and the other is to combine a thermally conductive silicon wafer with the microwave absorbing material. However, both methods have some problems. The first method does not significantly improve the thermal conductivity of the microwave absorbing material itself; it only increases the reflection and absorption of electromagnetic waves. The second method improves the overall heat dissipation performance, but the thermal resistance of the microwave absorbing material is much higher than that of the thermally conductive silicon wafer, so the overall heat dissipation performance still does not reach the ideal level. For example, patent CN104558973B provides a high-performance microwave absorbing and heat dissipation composite material patent, which uses fluorocarbon resin and nano-carbon to form a 100-1000 micrometer microwave absorbing and heat-conducting sheet, coated with a 10-200 micrometer titanium dioxide coating layer. This method has relatively low magnetic permeability and poor microwave absorption performance. Furthermore, the titanium dioxide coating on top increases thermal resistance, making heat dissipation worse. Patent CN104972708A provides a dual-function composite material for absorbing and dissipating heat and its manufacturing method. A metal transition layer is manufactured on a graphite film by vapor phase method. A metal thermal conductive layer is sprayed or electroplated on the surface of the metal transition layer. An absorbing film is made on the other side of the graphite film by pressing, rotating, strip coating, printing, spraying or roller coating. This process does not have an intermediate bonding transition layer, so there is no additional increase in thermal resistance. However, the cost of manufacturing the metal transition layer by vapor phase method is high. The second and third spraying, electroplating of the metal thermal conductive layer, spraying, and roller coating of the absorbing paste, and the multiple spraying and roller coating processes can easily cause uneven thickness, making process control difficult and also easily leading to unstable absorbing and thermal conductive performance. Summary of the Invention

[0004] This invention provides a microwave absorbing thermal conductive material, a tape, electronic components, and a method for preparing the tape. When this microwave absorbing thermal conductive material is applied to electronic components, it has low thermal resistance and can reduce the interference of external electromagnetic waves on electronic components, thus solving the requirements of electronic components for both microwave absorption and heat dissipation.

[0005] To solve one or more of the above-mentioned technical problems, the technical solution adopted in this application is:

[0006] In a first aspect, a microwave absorbing and thermally conductive material is provided, wherein, by weight, the components of the microwave absorbing and thermally conductive material include:

[0007] 60-100 parts binder, 5-40 parts tackifying resin, 0.1-5 parts thickener, 0.1-5 parts dispersant, 0.5-3 parts coupling agent, 0.1-3 parts defoamer, 0.1-3 parts wetting agent, 10-40 parts microwave absorber, and 20-60 parts thermal conductive agent.

[0008] Furthermore, the adhesive includes at least one of aqueous EVA emulsion, aqueous acrylic emulsion, and aqueous polyurethane emulsion.

[0009] Furthermore, the dispersant includes at least one of acidic polymers and alkylamides.

[0010] Furthermore, the tackifying resin includes at least one of waterborne rosin resin and waterborne terpene resin.

[0011] Furthermore, the thickener includes at least one of a polyurethane thickener and a polyacrylate copolymer.

[0012] Furthermore, the coupling agent includes a silane coupling agent, preferably including at least one of γ-aminopropyltriethoxysilane and γ-(2,3-epoxypropoxy)propyltrimethoxysilane.

[0013] Furthermore, the wetting agent includes at least one of acetylational diol ethoxylate compound and polyether siloxane copolymer.

[0014] Furthermore, the microwave absorbing agent includes at least one of carbonyl iron powder, ferrite powder, iron-nickel alloy powder, and two-dimensional soft magnetic powder.

[0015] Furthermore, the two-dimensional soft magnetic powder includes at least one of the following: iron-silicon alloy micro powder, permalloy micro powder, iron-silicon-aluminum alloy micro powder, iron-silicon-chromium alloy micro powder, iron-copper-boron alloy micro powder, iron-copper-silicon-boron-cobalt alloy micro powder, iron-copper-boron-nickel alloy micro powder, and iron-copper-silicon-boron-carbon-vanadium alloy micro powder.

[0016] Furthermore, the thermal conductive agent includes at least one of carbon nanotubes, carbon nanofibers, artificial graphite, aluminum nitride, boron nitride, and graphene.

[0017] Furthermore, the composition of the microwave absorbing and thermally conductive material includes:

[0018] 70-90 parts binder, 15-35 parts tackifying resin, 0.1-3 parts thickener, 0.5-2 parts dispersant, 0.5-2 parts coupling agent, 0.3-0.8 parts defoamer, 0.5-1 part wetting agent, 25-45 parts microwave absorber and 25-55 parts thermal conductive agent.

[0019] Secondly, a tape is also provided, which has either microwave absorbing and thermally conductive or shielding and thermally conductive functions. The tape includes: the microwave absorbing and thermally conductive material and a substrate, wherein the microwave absorbing and thermally conductive material is coated as a microwave absorbing and thermally conductive adhesive layer on one surface of the substrate.

[0020] Furthermore, the substrate includes a microwave absorbing sheet, a graphene film, an aluminum film, or a copper film.

[0021] Furthermore, the tape also includes:

[0022] The protective film is connected to the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate.

[0023] Thirdly, a method for preparing adhesive tape is also provided, comprising:

[0024] Lay the substrate flat on the polyester film;

[0025] A semi-finished product is obtained by coating the substrate with a wave-absorbing and heat-conducting material as a wave-absorbing and heat-conducting adhesive layer on the side away from the polyester film.

[0026] The semi-finished product is dried and matured;

[0027] The tape is obtained by covering the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate with a protective film.

[0028] Fourthly, an electronic component is also provided, including a component body and the tape, wherein when the tape is connected to the component body, the component body and the substrate are located on opposite sides of the microwave absorbing and thermally conductive adhesive.

[0029] The beneficial effects of the technical solution provided by the embodiments of the present invention are as follows:

[0030] The microwave absorbing and thermally conductive material provided in this invention possesses thermal conductivity while also exhibiting microwave absorption and low dielectric properties by adding thermally conductive agents (such as aluminum nitride or boron nitride) to the adhesive. This not only expands the absorption bandwidth but also increases impedance matching and reduces electromagnetic wave reflectivity. Simultaneously, the addition of microwave absorbing powder achieves both microwave absorption and thermal conductivity. Furthermore, when used as an adhesive layer, microwave absorption and thermal conductivity are simultaneously integrated within the adhesive layer, preventing an increase in overall thermal resistance caused by the combination of the microwave absorbing sheet and the thermally conductive sheet. It also reduces the impact of the high thermal resistance of the double-sided adhesive itself (even a thin layer of 10 micrometers can significantly increase thermal resistance) on thermal conductivity. Applying this microwave absorbing and thermally conductive material as an adhesive layer in electronic components results in low thermal resistance and reduces interference from external electromagnetic waves, thus addressing the requirements of electronic components for both microwave absorption / shielding and heat dissipation. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of the tape provided in an embodiment of the present invention;

[0033] Figure 2 This is a flowchart of the tape preparation method provided in the embodiments of this application. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0035] As described in the background section, existing microwave absorbing sheets or materials used for electronic components have some problems. To address these issues, this invention proposes a novel microwave absorbing and thermally conductive material.

[0036] In a preferred embodiment of the present invention, the components of the microwave absorbing and thermally conductive material, by weight fraction, include: 60-100 parts binder, 5-40 parts tackifying resin, 0.1-5 parts thickener, 0.1-5 parts dispersant, 0.5-3 parts coupling agent, 0.1-3 parts defoamer, 0.1-3 parts wetting agent, 20-50 parts microwave absorbing agent, and 20-60 parts thermally conductive agent.

[0037] The microwave absorbing and thermally conductive material can be applied as an adhesive to the surface of electronic components. Furthermore, a substrate can be applied to the surface of the microwave absorbing and thermally conductive material to protect its surface and provide support.

[0038] This microwave-absorbing and thermally conductive material is produced by adding thermally conductive agents (such as high filler content and high thermal conductivity) to the binder.

[0039] The addition of powders (often called "powders") imparts thermal conductivity to the material, while the addition of microwave-absorbing powders allows it to simultaneously achieve both microwave absorption and thermal conductivity. Furthermore, when this microwave-absorbing and thermally conductive material is used as an adhesive layer, both microwave absorption and thermal conductivity are achieved.

[0040] Simultaneously, the adhesive layer avoids the overall increase in thermal resistance caused by the combination of the absorbing sheet and the thermally conductive sheet, and also reduces the impact of the high thermal resistance of the double-sided adhesive itself (even a very thin layer of double-sided adhesive, only 10 micrometers thick, can significantly increase thermal resistance) on thermal conductivity. Using this absorbing and thermally conductive material as an adhesive layer in electronic components results in lower thermal resistance.

[0041] It can also reduce the interference of external electromagnetic waves on electronic components and solve the requirements of electronic components for both wave absorption and heat dissipation.

[0042] In addition, it should be noted that when electronic components are used, the microwave absorbing and heat-conducting material directly contacts the interface of the electronic components that requires microwave absorption and heat conduction, and there is no double-sided adhesive transition layer, which makes the heat conduction efficiency higher.

[0043] Furthermore, the adhesive includes at least one of aqueous EVA emulsion, aqueous acrylic emulsion, and aqueous polyurethane emulsion.

[0044] Furthermore, the dispersant includes at least one of the following: acidic polymers, alkylamides, block copolymers with anchoring groups, and polyacrylates.

[0045] Furthermore, the tackifying resin includes at least one of waterborne rosin resin and waterborne terpene resin.

[0046] Further, the thickener includes at least one of a polyurethane thickener and an acrylate copolymer. Further, the coupling agent includes a silane coupling agent, preferably Dow Corning Z-6011 or Dow Corning...

[0047] At least one of Ning Z-6040.

[0048] Furthermore, the wetting agent includes at least one of acetylational diol ethoxylate compound and polyether siloxane copolymer.

[0049] Furthermore, the wave-absorbing and heat-conducting material may also include a plasticizer, which includes one or more of the following: phthalic acid derivatives, phthalic acid isomers, tetrahydrophthalic acid derivatives, phosphate bio-based materials, adipic acid derivatives, sebacic acid derivatives, azelaic acid derivatives, and citric acid derivatives.

[0050] Furthermore, the microwave absorbing agent includes at least one of carbonyl iron powder, ferrite powder, iron-nickel alloy powder, and two-dimensional soft magnetic powder.

[0051] Furthermore, the two-dimensional soft magnetic powder includes at least one of the following: iron-silicon alloy micro powder, permalloy micro powder, iron-silicon-aluminum alloy micro powder, iron-silicon-chromium alloy micro powder, iron-copper-boron alloy micro powder, iron-copper-silicon-boron-cobalt alloy micro powder, iron-copper-boron-nickel alloy micro powder, and iron-copper-silicon-boron-carbon-vanadium alloy micro powder. Permalloy micro powder can also be referred to as iron-nickel alloy micro powder.

[0052] Furthermore, the thermal conductive agent includes at least one of carbon nanotubes, carbon nanofibers, artificial graphite, aluminum nitride, boron nitride, and graphene.

[0053] In a preferred embodiment, the components of the microwave absorbing and thermally conductive material include:

[0054] 70-90 parts binder, 15-35 parts tackifying resin, 0.1-3 parts thickener, 0.5-2 parts dispersant, 0.5-2 parts coupling agent, 0.5-1 part wetting agent, 0.3-0.8 parts defoamer, 25-45 parts microwave absorber and 25-55 parts thermal conductive agent.

[0055] In a more preferred embodiment, the components of the microwave absorbing and thermally conductive material include:

[0056] 75-85 parts binder, 20-30 parts tackifying resin, 0.3-1 part thickener, 1-1.5 parts dispersant, 0.8-1 part coupling agent, 0.4-0.6 parts defoamer, 0.5-1 part wetting agent, 30-42 parts microwave absorber and 30-50 parts thermal conductive agent.

[0057] In a preferred embodiment, the thermal conductive agent is a mixture of artificial graphite and aluminum nitride. The graphene film enables the microwave absorbing thermal conductive material to have both ultra-high lateral thermal conductivity and microwave absorption effect.

[0058] In a preferred embodiment, the microwave absorbing agent is a mixture of carbonyl iron powder and two-dimensional soft magnetic powder. Both have high microwave absorption performance in both low and high frequency absorption bandwidths, so that the microwave absorbing thermal conductive material has good microwave absorption performance at both high and low frequencies.

[0059] Corresponding to the above-mentioned heat-conducting and wave-absorbing material, the present invention also provides a tape having the heat-conducting and wave-absorbing material. Figure 1 This is a schematic diagram of the structure of the adhesive tape provided in an embodiment of the present invention. Specifically, as shown... Figure 1 As shown, the tape includes the microwave absorbing and thermally conductive material and the substrate provided in any of the above embodiments, and the microwave absorbing and thermally conductive material is coated on one surface of the substrate 20 as the microwave absorbing and thermally conductive adhesive layer 10.

[0060] The tape can be applied to the surface of electronic components, 5G RF chips, etc. The microwave absorption / shielding thermal conductive material can solve the requirements of electronic components for both microwave absorption / shielding and heat dissipation.

[0061] Furthermore, the substrate 20 includes a microwave absorbing sheet, a graphene film, an aluminum film, or a copper film, all of which have high thermal conductivity, which can further ensure the heat dissipation of electronic components.

[0062] In a preferred embodiment, the substrate 20 is an absorbing sheet that can absorb electromagnetic waves and perform secondary absorption on electromagnetic waves that pass through the magnetic material.

[0063] In a preferred embodiment, the substrate 20 is an aluminum film, which can reflect electromagnetic waves, improving the electromagnetic wave shielding performance by reflecting electromagnetic waves that have passed through the absorbing layer, and simultaneously absorbing the reflected electromagnetic waves a second time. This improves the absorption efficiency of the absorbing and heat-conducting material.

[0064] Furthermore, the tape also includes a protective film 30, which is connected to the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate. This protective film protects the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate when the tape is not in use. Preferably, the protective film comprises release paper. In use, after removing the protective film, the tape is simply adhered to the corresponding position on the electronic component.

[0065] As a preferred embodiment, the thickness of the substrate 20 is any value between 10 and 200 micrometers, for example, 10, 20 or 30 micrometers, or any point value within the above range. Due to space limitations, these will not be listed exhaustively here.

[0066] As a preferred embodiment, the thickness of the wave-absorbing and thermally conductive adhesive layer 10 is any value between 10 and 1000 micrometers, such as 10, 150, 280, 420, 550 or 980 micrometers, or any point value within the above range. Due to space limitations, these will not be listed exhaustively here.

[0067] Corresponding to the above-mentioned tape, this application also provides a method for preparing the tape. Figure 2 This is a flowchart of the tape preparation method provided in the embodiments of this application. Figure 2 As shown, the method for preparing the adhesive tape generally includes the following steps:

[0068] S10: Lay the substrate flat on the polyester film;

[0069] S20: The microwave absorbing and thermally conductive material is coated as a microwave absorbing and thermally conductive adhesive layer onto the side of the substrate away from the polyester film by a coating method to obtain a semi-finished product;

[0070] S30: Dry and mature the semi-finished product;

[0071] S40: A protective film is applied to the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate to obtain the tape.

[0072] Preferably, in the above S30, drying and maturation are achieved by an oven, and the drying and maturation time can be 5 to 35 minutes, preferably 20 minutes, and the temperature can be 50 to 100°C, preferably 60°C.

[0073] Preferably, in the above S40, the protective film is a release film.

[0074] The present invention also provides an electronic component, including a component body and an adhesive tape provided in any of the above embodiments, wherein when the adhesive tape is connected to the component body, the component body and the substrate are located on opposite sides of the microwave absorbing and thermally conductive adhesive.

[0075] The component body can be any component in the prior art.

[0076] The tape enables the electronic components to have good wave absorption and heat dissipation performance. The substrate can reflect or absorb electromagnetic waves and further improve heat dissipation performance.

[0077] All of the above-mentioned optional technical solutions can be combined in any way to form optional embodiments of the present invention, and will not be described in detail here.

[0078] The beneficial effects of this application will be further illustrated below with reference to embodiments and comparative examples.

[0079] Example 1

[0080] A microwave absorbing and thermally conductive material was prepared using 75 parts of Hanwha waterborne acrylic emulsion R-90 as a binder, 10 parts of waterborne terpene resin as a tackifying resin, 0.3 parts of acrylic copolymer as a thickener, 1.2 parts of BYK111 polyphosphate ester as a dispersant, 0.5 parts of Dow Corning Z6040 as a coupling agent, 0.5 parts of BASF mineral oil 8034A as a defoamer, 0.3 parts of Nippon Wonko Chemical Co., Ltd. anionic and nonionic mixed type WWET-3336 as a wetting agent, 35 parts of carbonyl iron powder as a microwave absorbing agent, and 40 parts of aluminum nitride as a thermally conductive agent.

[0081] To prepare the tape, a 150μm graphene film is used as the substrate. The substrate is laid flat on a polyester film. The microwave absorbing and thermally conductive material prepared above is coated as a microwave absorbing and thermally conductive adhesive layer on the side of the substrate away from the polyester film by a coating method to obtain a semi-finished product. The semi-finished product is dried and cured. A release film is then covered on the side of the microwave absorbing and thermally conductive adhesive layer away from the substrate to obtain the tape.

[0082] Example 2

[0083] The difference from Example 1 is that 30 parts of aluminum nitride are used as the thermal conductive agent.

[0084] Example 3

[0085] The difference from Example 1 is that 30 parts of carbonyl iron powder are used as the microwave absorber.

[0086] Example 4

[0087] The difference from Example 1 is that 40 parts of artificial graphite powder are used as the thermal conductive agent.

[0088] Example 5

[0089] The difference from Example 1 is that 35 parts of ferrite powder are used as the microwave absorber and 40 parts of artificial graphite powder are used as the thermal conductor.

[0090] Comparative Example 1

[0091] The difference from Example 1 is that 35 parts of barium sulfate are used as the microwave absorbing agent.

[0092] Comparative Example 2

[0093] The difference from Example 1 is that 40 parts of copper powder are used as the heat conductor.

[0094] Comparative Example 3

[0095] The difference from Example 1 is that 5 parts of aluminum nitride are used as the thermal conductive agent.

[0096] Comparative Example 4

[0097] The difference from Example 1 is that 5 parts of carbonyl iron are used as the microwave absorber.

[0098] The microwave absorption and thermal conductivity properties of the electronic components prepared in Examples 1 to 5 and Comparative Examples 1 to 4 were tested separately. The microwave absorption performance was tested using the bowing method. The thermal conductivity performance was tested using the steady-state heat flow method. The test results are shown in Table 1 below.

[0099] Table 1

[0100]

[0101]

[0102] The test results in Table 1 above show that:

[0103] A comparison of Examples 1 to 5 reveals that the microwave-absorbing and thermally conductive material using carbonyl iron powder as the microwave absorber and aluminum nitride as the thermally conductive agent exhibits superior performance in both microwave absorption and thermal conductivity compared to other solutions. Furthermore, reducing the content of carbonyl iron powder or aluminum nitride reduces both microwave absorption and thermal conductivity performance. This is because a certain amount of powder content is required to connect the thermally conductive powder with the powder that provides partial thermal conductivity in the microwave-absorbing zone to fully realize the thermal conductivity effect. This can also be seen by comparing the examples with the comparative examples. Moreover, a comparison of the examples with the comparative examples also reveals that the microwave-absorbing and thermally conductive material prepared using the specific content of microwave absorber and thermally conductive agent provided in this application exhibits superior performance in both microwave absorption and thermal conductivity.

[0104] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An adhesive layer prepared from a wave-absorbing heat-conducting material, characterized in that, The adhesive layer is applied to electronic components, and the microwave absorbing and thermally conductive material is in direct contact with the interfaces in the electronic components that require microwave absorption and thermal conductivity. The components of the microwave absorbing and thermally conductive material, by weight, include: The mixture comprises 60-100 parts binder, 5-40 parts tackifying resin, 0.1-5 parts thickener, 0.1-5 parts dispersant, 0.5-3 parts coupling agent, 0.1-3 parts defoamer, 0.1-3 parts wetting agent, 20-50 parts microwave absorber, and 20-60 parts thermal conductive agent; wherein the microwave absorber is carbonyl iron powder, and the thermal conductive agent is at least one of artificial graphite and aluminum nitride; the binder includes at least one of waterborne EVA emulsion, waterborne acrylic emulsion, and waterborne polyurethane emulsion.

2. The adhesive layer prepared from the wave-absorbing and heat-conducting material according to claim 1, characterized in that, The components of the microwave absorbing and thermally conductive material, by weight, include: 70-90 parts binder, 15-35 parts tackifying resin, 0.1-3 parts thickener, 0.5-2 parts dispersant, 0.5-2 parts coupling agent, 0.3-0.8 parts defoamer, 0.5-1 part wetting agent, 25-45 parts microwave absorber and 25-55 parts thermal conductive agent.

3. An adhesive tape, characterized by The invention includes an adhesive layer made of the heat-conducting material according to any one of claims 1 to 2 and a substrate, wherein the adhesive layer made of the heat-conducting material is coated on one surface of the substrate.

4. The adhesive tape according to claim 3, characterized in that The substrate includes a microwave absorbing sheet, a graphene film, an aluminum film, or a copper film.

5. The adhesive tape of claim 4, wherein Also includes: The protective film is connected to the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate.

6. A method for producing the adhesive tape according to any one of claims 4 to 5, characterized by, include: Lay the substrate flat on the polyester film; A semi-finished product is obtained by coating the adhesive layer prepared from the wave-absorbing and heat-conducting material according to any one of claims 1 to 2 onto the side of the substrate away from the polyester film by a coating method. The semi-finished product is dried and matured; The tape is obtained by covering the side of the microwave-absorbing and thermally conductive adhesive layer away from the substrate with a protective film.

7. An electronic component, characterized by It includes a component body and the tape according to any one of claims 3 to 5, wherein when the tape is connected to the component body, the component body and the substrate are located on opposite sides of the microwave absorbing and thermally conductive adhesive.

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