Supply device and film forming device

Abstract

The present invention provides a supply device and a film forming device for suppressing the supply of electronic parts exceeding a specified amount. The supply device of the embodiment comprises: a chute having a plurality of chute holes through which electronic parts can pass one by one, the electronic parts having one end and the other end; a baffle having a plurality of baffle holes overlapping with the chute and through which the electronic parts are inserted; a mask having a mask hole overlapping with the baffle and through which the electronic parts are inserted, covering a part of the electronic parts; a receiving platform holding the mask and contacting one end of the electronic parts inserted into the mask hole; and a moving mechanism that moves the baffle between a first position in which the electronic parts can pass through the baffle hole from the chute hole but cannot pass through the mask hole from the baffle hole, and a second position in which the electronic parts cannot pass through the baffle hole from the chute hole but can pass through the mask hole from the baffle hole by moving the baffle.

Description

Technical Field

[0001] The invention relates to a supply device and a film forming device. Background Art

[0002] Currently, electronic components with external electrodes formed at both ends are very common as chip-shaped electronic components used in various electronic circuits. For example, a chip capacitor is formed by dividing a block obtained by laminating dielectric sheets with internal electrodes into rectangular single pieces. In addition, the external electrodes are formed by a conductive material that covers both sides of the rectangular component and is connected to the internal electrodes.

[0003] As a method for forming an external electrode, as shown in Patent Document 1, the following process is performed: the electronic component is held by inserting the other end into a holding hole of a holding plate in a manner that one end of the electronic component is exposed, and a paste of a conductive material is attached to the exposed end to form an external electrode. In this case, the electronic component is supplied to an array plate and is dropped one by one into a plurality of array holes formed in the array plate, changes its posture according to the array holes, and is guided to fall into the holding hole of the holding plate and inserted into the holding hole.

[0004] At this time, the electronic components supplied to the arrangement plate may not necessarily fall into the holding holes. Therefore, the following process is performed: in order to increase the probability that the electronic components supplied to the arrangement plate fall into the holding holes through the arrangement holes, more electronic components than the number of holding holes are put into the arrangement plate. For example, a large number of electronic components contained in a chip hopper that is larger than the number of holding holes are taken out and supplied to the arrangement plate.

[0005] [Prior art literature]

[0006] [Patent Document]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 09-232113 Summary of the invention

[0008] [Problems to be solved by the invention]

[0009] However, if the electronic components are supplied in a quantity exceeding the prescribed quantity, that is, if the electronic components are put into the arrangement plate in a quantity exceeding the number of the holding holes, the electronic components that have not entered the holding holes (the electronic components that are not held on the holding plate) will remain on the arrangement plate. In particular, the electronic components that have entered the arrangement holes may be placed directly above the electronic components that have entered the holding holes. In this way, when the arrangement plate is separated from the holding plate, the electronic components remaining in the arrangement holes, or even the electronic components remaining on the arrangement plate, fall through the arrangement holes and are placed on the holding plate or on the electronic components normally held on the holding plate, hindering the subsequent step of attaching the conductive material. Therefore, due to the supply of such electronic components exceeding the number of the holding holes, a step of recovering the electronic components that have not entered the holding holes is required. However, in the case of recovering the electronic components that have not entered the holding holes by a recovery device such as a suction device, there is a concern that even the electronic components that have entered the holding holes are recovered, and a step of resupply is required, which reduces productivity. In order to prevent this situation, in the case of recovering the electronic components that have not entered the holding holes one by one by manual operations, it takes time to recover and productivity is reduced. Furthermore, since the electronic parts to be processed are small chip-shaped parts used in various electronic circuits, if the electronic parts that fail to enter the holding holes fall from the holding plate to the bottom surface of the supply device below, it is difficult to find and recover them. Thus, when the number of electronic parts supplied is greater than the number of holding holes, it is difficult to recover the electronic parts that fail to enter the holding holes, which reduces productivity.

[0010] The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a supply device and a film forming device that suppress the supply of electronic components exceeding a predetermined amount and improve productivity.

[0011] [Technical means to solve the problem]

[0012] In order to achieve the above purpose, the supply device of the embodiment comprises: a slide groove having a plurality of slide groove holes through which electronic parts can pass one by one, and the electronic parts have one end and the other end; a baffle having a plurality of baffle holes overlapping with the slide groove and for the electronic parts to be inserted through the slide groove holes; a mask having a mask hole overlapping with the baffle and for the electronic parts to be inserted through the baffle holes, covering a portion of the electronic parts; a supporting platform holding the mask and connected to one end of the electronic parts inserted into the mask hole; and a moving mechanism, which enables at least any one of the slide groove, the baffle and the mask to move relative to each other between a first position at which the electronic parts can pass through the baffle holes from the slide groove holes but cannot pass through the mask holes from the baffle holes and a second position at which the electronic parts cannot pass through the baffle holes from the slide groove holes but can pass through the mask holes from the baffle holes.

[0013] Furthermore, a film forming apparatus according to an embodiment includes the supply device and a film forming processing unit that forms a film on the electronic component.

[0014] [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a supply device and a film forming device that suppress the supply of electronic components exceeding a predetermined amount and improve productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The electronic component to be supplied in the embodiment is shown in a perspective view (A), a cross-sectional view (B), and a perspective view (C) showing a state where the electronic component has entered a mask hole.

[0017] Figure 2 It is a simplified structural diagram showing a film forming apparatus according to an embodiment.

[0018] Figure 3 1. It is a top view (A) and a partial cross-sectional side view (B) showing a supply device according to an embodiment.

[0019] Figure 4 Yes means Figure 3 A partial cross-sectional side view (A) of the electronic component when it is accommodated, and a partial cross-sectional side view (B) of the electronic component when it is supplied.

[0020] Figure 5 It shows a top view of the chute and the baffle (A), a sectional view along the AA arrow (B), a side view of the chute (C), a side view of the baffle (D), and a sectional view along the BB arrow (E).

[0021] Figure 6 1 and 2 are a top view (A) and a cross-sectional view taken along the line BB of the mask (B).

[0022] Figure 7 The top view (A) and the CC arrow cross-sectional view (B) of the support platform are shown.

[0023] Figure 8 It is a cross-sectional view showing a standby state of a mask (A) and a state where the mask is mounted on a shutter (B).

[0024] Fig. 9 It is a cross-sectional view showing a state where the adsorption part is positioned on the mask (A) and a state where the electronic component is dropped (B).

[0025] Fig.10 It is a cross-sectional view showing a state where the mask is separated from the shutter (A) and a state where the shutter is moved in the horizontal direction (B).

[0026] Fig.11It is a cross-sectional view showing a state where excess electronic components are sucked (A) and a state where the pusher is lowered to hold the receiving platform 250 in the holding hole (B).

[0027] Fig.12 (A) to Fig.12 (F) is an explanatory diagram showing the order of supplying electronic components to the mask.

[0028] Fig.13 (A) to Fig.13 (C) is an explanatory diagram showing the order of inverting the mask.

[0029] [Explanation of Symbols]

[0030] 1: Film forming device

[0031] 2: Supply device

[0032] 3: Film forming processing department

[0033] 4: Control device

[0034] 31: Chamber

[0035] 32: Transport Department

[0036] 33: Pre-processing department

[0037] 34, 35: Film forming section

[0038] 200: Baffle

[0039] 201: plate body

[0040] 202: Baffle hole

[0041] 203: Guide

[0042] 204: Liang Department

[0043] 210: Containment

[0044] 211: Container

[0045] 211a: Partition

[0046] 211b: Inclined surface

[0047] 212: Support table

[0048] 212a: Feet

[0049] 220: Chute

[0050] 221: plate body

[0051] 222: Slide hole

[0052] 223: Next door

[0053] 224: Support feet

[0054] 225: Partition

[0055] 230: Vibration mechanism

[0056] 231: Vibration table

[0057] 231b: Receiving hole

[0058] 232: Abutment

[0059] 240: Mask

[0060] 241: plate body

[0061] 242: Mask hole

[0062] 243: Restriction hole

[0063] 244: Liang Department

[0064] 245: Partition

[0065] 250: Supporting platform

[0066] 251: plate body

[0067] 252: Support

[0068] 253: Restriction Department

[0069] 260: Lifting mechanism

[0070] 261: Thruster

[0071] 261a: Loading table

[0072] 261b: Axis

[0073] 262: Driving source

[0074] 270: Mobile mechanism

[0075] 280: Removal of mechanism

[0076] 281: Pick-up mechanism

[0077] 282: Guidance Agency

[0078] 283: Mobile

[0079] 284: Adsorption Department

[0080] 284a: Adsorption board

[0081] 284b: Support plate

[0082] 284c: Pillar

[0083] 285: Adsorption force imparting part

[0084] 285a: Magnetic component

[0085] 285b: Support plate

[0086] 285c: connection / separation mechanism

[0087] 286: Pillar Department

[0088] 287: Arm

[0089] 288: Guidance Department

[0090] 290: Transport Agency

[0091] 291: Motor

[0092] 292: Rotating table

[0093] 292a: Holding hole

[0094] 311: Exhaust

[0095] 321: Rotating table

[0096] 322: Driving source

[0097] 323: Sealed body

[0098] 324: Thruster

[0099] 331: Processing Room

[0100] 341, 351: Film forming room

[0101] 342, 352: Target

[0102] Axc, Axh, Axs, Axm: Axes

[0103] C: Electronic parts

[0104] Dx: moving distance

[0105] E: Electrode

[0106] En: Internal electrode

[0107] F: Noodles

[0108] R: Electrode formation area

[0109] X, Y, Z: direction. DETAILED DESCRIPTION

[0110] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the drawings.

[0111] [Electronic parts]

[0112] like Figure 1 As shown in (A), the electronic component C formed by the present embodiment is a chip-shaped electronic component C having electrodes E made of a conductive material formed at both ends. In this way, the electronic component C has one end and the other end where the electrodes E are formed. For example, components such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has a rectangular parallelepiped, a cubic shape, or a thin plate-shaped outer shape, and the electrodes E are closely formed in a manner that covers an area including a pair of opposite side surfaces in a box-like manner. The area where the electrodes E are formed is set as an electrode forming area R.

[0113] Figure 1 (B) is a cross-sectional view of a laminated ceramic capacitor obtained by laminating dielectric sheets having internal electrodes En as an electronic component C. A pair of electrodes E formed on the outer surface of the electronic component C is a multilayer structure in which multiple layers of conductive materials are overlapped, and are electrically connected to the internal electrodes En of the electronic component C. In this embodiment, a copper (Cu) film is formed as a seed layer of the electrode E on titanium (Ti) as a base layer for improving adhesion. Subsequently, the copper (Cu) is attached to the electrode forming region R by electrolytic plating using the seed layer as a seed, thereby completing the formation of the electronic component C having the electrode E. Since the base layer and the seed layer also become part of the electrode E, the film formation of these layers is also expressed as "film formation of the electrode E" in the following description of this embodiment.

[0114] In the following description, a straight line passing through the center of a pair of side surfaces covered by the electrode E is referred to as the axis Axc of the electronic component C. In the present embodiment, for example, as the electronic component C, a very small electronic component having a length of 0.6 mm in the direction of the axis Axc, a length of 0.2 mm in the direction of the axis Axc of the electrode E, and a rectangular cross section orthogonal to the axis Axc of the electrode E of 0.3 mm×0.3 mm can be used as the object. However, the present invention can be applied to electronic components C smaller or larger than this.

[0115] [summary]

[0116] like Figure 2 As shown in FIG. 1 , the film forming apparatus 1 of this embodiment includes a supply device 2, a film forming processing unit 3, and a control device 4. Figure 1As shown in (C), the supply device 2 supplies the electronic component C to the film forming processing unit 3 in a state where the area other than one of the electrode forming areas R is covered by inserting the electronic component C into the mask hole 242. The film forming processing unit 3 forms a film of the electrode material in the electrode forming area R that is not covered and exposed. In addition, in the following description, the horizontal arrangement direction of the supply device 2 and the film forming processing unit 3 is set as the X direction, the horizontal direction orthogonal to this is set as the Y direction, and the vertical direction is set as the Z direction. The electronic component C is inserted into the mask hole 242 in a manner such that the axis Axc is along the Z direction. In addition, as described later, the mask hole 242 is provided in the mask 240.

[0117] [Supply device]

[0118] like Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in (B), the supply device 2 includes a storage portion 210, a chute 220, a baffle 200, a moving mechanism 270, a vibration mechanism 230, a mask 240, a receiving platform 250, a removal mechanism 280, and a conveying mechanism 290.

[0119] (Containment Department)

[0120] The storage section 210 stores a plurality of electronic components C before forming electrodes E, i.e., before film formation. The storage section 210 has a container 211 and a support table 212. The container 211 is a box-shaped body with an opening at the top, and a plurality of partitions 211a serving as recesses are provided at the horizontal inner bottom. The plurality of partitions 211a are arranged in a matrix, and each partition 211a stores a plurality of electronic components C that are previously placed. A portion of the inner side surface of the container 211 is structured as follows, i.e., an inclined surface 211b inclined toward the inner bottom, so that the electronic components C placed from the upper edge of the container 211 slide toward the inner bottom. The support table 212 is a table that supports the container 211 in the horizontal direction, such as Figure 3 As shown in (B), it is installed on the installation surface of the supply device 2 by four legs 212a.

[0121] (Chute)

[0122] The chute 220 guides the plurality of electronic components C transferred from the receiving portion 210 to each of the plurality of mask holes 242. Figure 5 (A) Figure 5 (B) Figure 5 (C) Figure 5As shown in (E), the slide groove 220 has a plate body 221, a slide groove hole 222, and a partition wall 223. The plate body 221 is a rectangular plate-shaped body. The slide groove holes 222 are multiple holes through which the electronic components C can pass one by one. Each slide groove hole 222 penetrates in a direction perpendicular to the surface of the plate body 221, and guides the passing electronic components C to the mask hole 242 via the baffle hole 202 of the baffle 200 described later. The slide groove hole 222 is a quadrangular pyramid shape that expands toward the side for inserting the electronic component C, that is, the upper end side, so that the electronic component C can easily enter. In addition, a straight line in the Z direction passing through the center of the slide groove hole 222 is set as the axis Axs.

[0123] The partition wall 223 is vertically arranged on the surface of the plate body 221 in a lattice shape. The plurality of rectangular areas surrounded by the partition wall 223 constitute a plurality of partitions 225 arranged in a matrix shape. A plurality of slide slot holes 222 are formed in each partition 225 in a matrix shape. That is, the partition wall 223 includes a plurality of slide slot holes 222 to form a partition 225 to which the electronic components C are supplied. The position of each partition 225 corresponds one-to-one to the position of each partition 211a of the receiving portion 210.

[0124] Since the interior of the chute 220 is divided into a plurality of partitions 225 by the partition walls 223, when the electronic components C are guided to the mask holes 242, as described later, even if the chute 220 vibrates, the electronic components C supplied to each partition 225 are prevented from moving to other partitions 225 by the partition walls 223 and enter the chute holes 222 in each partition 225. Therefore, when the chute 220 vibrates, the electronic components C can be prevented from moving to other areas and being unevenly distributed.

[0125] Furthermore, since a large amount of electronic components C are supplied and arranged at one time, the plate body 221 of the chute 220 has a large area, and sometimes bends, bends, or strains may occur. If bends, bends, or strains occur, the electronic components C tend to move to a specific portion of the plate body 221, and cannot be evenly supplied to the mask hole 242. Since the partition wall 223 is provided throughout the area of ​​the plate body 221 to which the electronic components C are supplied, it functions as a beam, improves the strength of the plate body 221, and prevents bends, bends, or strains.

[0126] Furthermore, the positions of the partitions 225 of the chute 220 correspond one-to-one to the positions of the partitions 211a of the receiving section 210. In addition, by pre-distributing and receiving a plurality of electronic components C in each partition 211a of the receiving section 210, and moving the received electronic components C to the corresponding partitions 225 of the chute 220 by adsorbing the received electronic components C in each partition 211a, the plurality of electronic components C can be evenly distributed within the surface of the chute 220.

[0127] (Baffle)

[0128] like Figure 5 (A) Figure 5 (B) Figure 5 (D) Figure 5 As shown in (E), the baffle 200 has a plate body 201, a baffle hole 202, a guide 203, and a beam portion 204. The plate body 201 is a rectangular plate-shaped body. The baffle hole 202 overlaps with the slide groove 220, and a plurality of baffle holes 202 are provided corresponding to each slide groove hole 222, so that the electronic component C can be inserted through the slide groove hole 222. Each baffle hole 202 is a prism-shaped hole that penetrates in a direction perpendicular to the surface of the plate body 201, and the axis Axc of the inserted electronic component C is consistent in the vertical direction. The straight line in the vertical direction passing through the center of the baffle hole 202 is set as the axis Axh. The length of the baffle hole 202 in the direction of the axis Axh is the same as the length of the electronic component C in the direction of the axis Axc.

[0129] The size of the cross section perpendicular to the axis Axh of the baffle hole 202 only needs to be such that the electronic component C falls down due to its own weight and is inserted with the axis Axc in the vertical direction. That is, the cross section perpendicular to the axis Axh of the baffle hole 202 is slightly larger than the cross section perpendicular to the axis Axc of the electronic component C, and smaller than the size that causes the axis Axc to be inserted tilted relative to the vertical direction. However, it is set larger than the size required for press-in.

[0130] The guide 203 is a member that supports the baffle 200 in a manner that it can slide relative to the slide groove 220. The guide 203 is provided along both sides of the plate body 201 in the Y direction, holds the two opposite sides of the plate body 221 of the slide groove 220, and is provided slidably in the Y direction. By moving the baffle 200 relative to the slide groove 220 in the Y direction, the relative position of the baffle hole 202 and the slide groove hole 222, and the relative position of the baffle hole 202 and the mask hole 242 described later can be changed. The beam portion 204 is a pair of plate-like bodies provided in the X direction in a manner that crosses the two ends of the guide 203, and reinforces the guide 203.

[0131] (Mobile mechanism)

[0132] The moving mechanism 270 is a mechanism for relatively moving the slide 220, the baffle 200 and the mask 240 in the horizontal direction. The moving mechanism 270 changes the relative positions of the slide 220, the baffle 200 and the mask 240 between the first position and the second position. Figure 8 (B) Fig. 9 (A) Fig. 9 (B) Fig.10 (A) Fig.12 (A) Fig.12 (B) Fig.12 As shown in (C), the first position is a position where the electronic component C can pass through the baffle hole 202 from the slide slot hole 222, but the electronic component C cannot pass through the mask hole 242 from the baffle hole 202. Fig.10 (B) Fig.11 (A) Fig.12 (D) Fig.12 As shown in (E), the second position is a position where the electronic component C cannot pass through the baffle hole 202 from the slide slot hole 222 , but the electronic component C can pass through the mask hole 242 from the baffle hole 202 .

[0133] The moving mechanism 270 of this embodiment is an air cylinder provided on the plate body 221 of the slide groove 220, and moves the baffle 200 in the Y direction through the driving rod installed on the baffle 200. The moving mechanism 270 is provided at a position that can push the substantially central portion of the beam portion 204 where both ends of the guide 203 are connected (see Figure 5 (A)). The moving mechanism 270 moves the midpoint of the beam 204 arranged in a direction (X direction) perpendicular to the moving direction (Y direction) of the baffle 200 along the moving direction. As a result, the moving mechanism 270 moves the baffle hole 202 arranged on the central side of the baffle 200 and the baffle holes 202 arranged on both end sides by the same distance. Therefore, regardless of the configuration position of the baffle hole 202, multiple baffle holes 202 can be moved equally in the Y direction. For example, the moving mechanism 270 moves the mask hole 242 by a moving distance Dx of about half the length of the mask hole 242 in the horizontal direction, so that the axis Axh of the baffle hole 202 is consistent with the axis Axm of the mask hole 242 (refer to Figure 8 (B) Fig.10 (B) Fig.12 (A) Fig.12 (D)).

[0134] (Vibration mechanism)

[0135] The vibration mechanism 230 promotes the insertion of the electronic component C into the mask hole 242 by vibrating the slide groove 220, the baffle 200, and the mask 240 described later. Figure 3 (A) Figure 3As shown in (B), the vibration mechanism 230 has a vibration table 231 and a base 232. The vibration table 231 is a plate-like body in the horizontal direction. On the vibration table 231, the chute 220 is supported in the horizontal direction via the support legs 224. The support legs 224 are prism-shaped extending in the X direction, and are spacers that are provided on both sides of the lower surface of the plate body 221 facing the Y direction, and are fixed at a predetermined interval between the plate body 221 and the vibration table 231. Between this plate body 221 and the vibration table 231, the baffle 200 is inserted in a manner that allows horizontal movement in the Y direction. The base 232 is provided on the installation surface of the supply device 2, and supports the vibration table 231 at a position offset from the chute 220 in the X direction. That is, it is arranged in alignment with the conveying mechanism 290 described later. The vibration table 231 is supported on the base 232 at one end thereof so that the other end overlaps with the mask 240 conveyed by the conveying mechanism 290 in a plan view. A receiving hole 231b for inserting the mask 240 and a receiving platform 250 described later is provided in a portion of the vibration table 231 that overlaps with the mask 240 conveyed by the conveying mechanism 290 in a plan view. The chute 220 and the baffle 200 are supported on the vibration table 231 in a horizontal direction so that they are located above the receiving hole 231b.

[0136] The vibration table 231 is set in a vibrating state by operating an oscillating body built into the base 232. As a result, the chute 220 supported by the vibration table 231 vibrates together with the vibration table 231. And the vibration is transmitted to the baffle 200, the mask 240 and the receiving platform 250 connected to the chute 220, and vibrates. As the oscillating body, for example, an electromagnetic coil, a motor, or a piezoelectric element is used. The vibration direction and vibration intensity can be appropriately set.

[0137] (Mask)

[0138] like Figure 6 (A) Figure 6As shown in (B), the mask 240 has a plate body 241, a mask hole 242, a limiting hole 243, and a beam portion 244. The plate body 241 is a circular plate-like body. The mask holes 242 are multiple holes that cover a portion of the electronic components C, which are transferred from the storage portion 210 and supplied to the chute 220, through the chute holes 222 of the chute 220 overlapping the baffle 200 and the baffle holes 202 of the baffle 200 overlapping the mask 240. Each mask hole 242 is a prism-shaped hole that penetrates in a direction perpendicular to the surface of the plate body 241, and the axis Axc of the inserted electronic component C is consistent in the vertical direction. A straight line in the vertical direction passing through the center of the mask hole 242 is set as the axis Axm. The length of the mask hole 242 in the direction of the axis Axm is shorter than the length of the electronic component C in the direction of the axis Axc. More specifically, the length of the mask hole 242 in the axis Axm direction is the same as the length of the electronic component C in the axis Axc direction outside one of the electrode forming regions R. That is, the length of the mask hole 242 in the axis Axm direction is the same as the length of the non-sputtered region of the electronic component C in the axis Axc direction (see Figure 1 (C)).

[0139] The size of the cross section perpendicular to the axis Axm of the mask hole 242 only needs to be such that the electronic component C falls and is inserted due to its own weight, and the axis Axc becomes the vertical direction. That is, the inner diameter of the mask hole 242 has an inner diameter that the electronic component C can pass through, and the cross section perpendicular to the axis Axm of the mask hole 242 is slightly larger than the cross section perpendicular to the axis Axc of the electronic component C, and smaller than the size that causes the axis Axc to be inserted obliquely with respect to the vertical direction. However, it is set larger than the size required for press-in.

[0140] Furthermore, when forming the electrode E by sputtering described later, the size of the cross section perpendicular to the axis Axm of the mask hole 242 is preferably smaller than the size of the film forming material entering from the gap formed between the mask hole 242 and the electronic component C.

[0141] The mask hole 242 of this embodiment is connected to the receiving platform 250 by the lower end of the inserted electronic component C, so that only the electrode forming area R on the upper end side is exposed and the other areas are covered (see Figure 1 (C)). A plurality of mask holes 242 are provided in a matrix in each of the plurality of partitions 245 arranged in a matrix.

[0142] When the slide slot 220, the baffle plate 200 and the mask 240 are in the first position, the positions of the slide slot hole 222 and the baffle plate hole 202 are consistent, but the positions of the baffle plate hole 202 and the mask hole 242 are offset. That is, since the axis Axs of the slide slot hole 222 is consistent with the axis Axh of the baffle plate hole 202, the opening at the lower end of the slide slot hole 222 matches the opening at the upper end of the baffle plate hole 202 and there is no offset in the horizontal direction (XY direction and θ direction), so the electronic component C can pass through. Since the axis Axh of the baffle plate hole 202 and the axis Axm of the mask hole 242 are offset in the horizontal direction, the opening at the lower end of the baffle plate hole 202 and the opening at the upper end of the mask hole 242 are offset, so the electronic component C cannot pass through. The length of the offset is a moving distance Dx (refer to Figure 8 (B) Fig.12 (A)).

[0143] When the slide slot 220, the baffle plate 200 and the mask 240 are in the second position, the positions of the slide slot hole 222 and the baffle plate hole 202 are offset, but the positions of the baffle plate hole 202 and the mask hole 242 are consistent. That is, since the axis Axs of the slide slot hole 222 and the axis Axh of the baffle plate hole 202 are offset in the horizontal direction, the opening at the lower end of the slide slot hole 222 and the opening at the upper end of the baffle plate hole 202 are offset, so the electronic component C cannot pass through. Since the axis Axh of the baffle plate hole 202 and the axis Axm of the mask hole 242 are consistent, there is no offset in the horizontal direction (XY direction and θ direction) and they are consistent, so the electronic component C can pass through. The moving distance of the baffle plate 200 from the first position to the second position is the moving distance Dx (refer to) which is about half of the length of the mask hole 242 in the horizontal direction. Fig.10 (B) Fig.12 (D)).

[0144] The limiting hole 243 is a through hole for aligning the mask 240 with respect to the receiving platform 250 and preventing positional deviation by inserting a limiting portion 253 of the receiving platform 250 described later. The limiting hole 243 of this embodiment is a cylindrical shape corresponding to the shape of the limiting portion 253. The beam portion 244 is a thin plate fixed to the lower surface of the plate body 241 in a manner that the area other than the partition 245 becomes thicker, thereby improving the strength of the plate body 241 and preventing bending or strain.

[0145] (Supporting platform)

[0146] The receiving platform 250 is a platform that holds the mask 240 and is connected to one end of the electronic component C inserted into the mask hole 242. In this embodiment, the electronic component C is inserted into the mask hole 242 in the vertical direction, so that one end of the electronic component C connected to the receiving platform 250 becomes the lower side, and the other end on the opposite side becomes the upper side. In the following description, one end of the electronic component C and the end of the mask hole 242 corresponding thereto are referred to as the lower end, and the other end of the electronic component C and the end of the mask hole 242 corresponding thereto are referred to as the upper end, but the direction of the electronic component C and the mask hole 242 is not limited thereto. In addition, there is a possibility that both ends of the electronic component C are one end (lower end) and the other end (upper end).

[0147] like Figure 7 (A) Figure 7 As shown in (B), the support platform 250 has a plate body 251, a support portion 252, and a limiting portion 253. The plate body 251 is a circular plate-like member having the same diameter as the mask 240. The support portion 252 is a rectangular plate-like body fixed to one side of the plate body 251. When the mask 240 overlaps on the support platform 250, the support portion 252 is provided at a position blocking the lower end of the mask hole 242 in each partition 245. In addition, the support portion 252 is provided at a position that does not overlap with the beam portion 244 of the mask 240.

[0148] The limiting part 253 is a cylindrical pin and is provided at a position corresponding to the limiting hole 243 of the mask 240 , and by being inserted into the limiting hole 243 , the receiving platform 250 and the mask 240 are aligned and positional deviation is prevented.

[0149] (Lifting mechanism)

[0150] like Figure 3 (A) Figure 3 As shown in (B), the lifting mechanism 260 is a mechanism for lifting the support platform 250 and the mask 240 between a receiving position (a position where the mask 240 contacts the baffle 200) received in the receiving hole 231b and a position away from the receiving position downward (a position where the mask 240 leaves the baffle 200 and waits).

[0151] The lifting mechanism 260 includes a pusher 261 and a driving source 262. The pusher 261 includes a mounting table 261a on which the receiving table 250 is mounted, and a shaft 261b that supports the mounting table 261a. The driving source 262 is a motor that moves the shaft 261b up and down.

[0152] (Remove mechanism)

[0153] The removal mechanism 280 is a mechanism for removing electronic components C other than the electronic components C inserted into the mask hole 242 from the slide groove 220. Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in (B) , the removal mechanism 280 includes a pickup mechanism 281 and a guide mechanism 282 .

[0154] The pickup mechanism 281 is a mechanism for picking up the electronic component C from the storage section 210 or the slide 220. The pickup mechanism 281 includes a moving body 283, a suction unit 284, and a suction force imparting unit 285. The moving body 283 moves between the storage section 210 and the slide 220. The moving body 283 is a base member having a prism shape on a truncated pyramid with a widened end and carrying the suction unit 284 and the suction force imparting unit 285. The moving body 283 is movably provided between the storage section 210 and the slide 220 through the guide mechanism 282.

[0155] The adsorption portion 284 is a unit portion for adsorbing electronic components C in order to pick up the electronic components C. The adsorption portion 284 has an adsorption plate 284a, a support plate 284b, and a support column 284c. The adsorption plate 284a is a component for adsorbing electronic components C. The adsorption plates 284a are rectangular plate-like bodies respectively arranged at positions corresponding to the respective partitions 225 of the chute 220, and adsorb electronic components C by applying a magnetic force from an adsorption force applying portion 285 described later. The size of the horizontal plane of the adsorption plate 284a is smaller than the area surrounded by the partition wall 223 so as to be able to approach the chute hole 222 of each partition 225. In addition, the position of each adsorption plate 284a also corresponds to each partition 211a of the container 211.

[0156] The support plate 284b is a rectangular plate-shaped body on which the adsorption plate 284a is installed. The size of the support plate 284b covers the entire area of ​​the slide slot hole 222 in which the slide slot 220 is formed. The adsorption plate 284a and the support plate 284b are formed to a thickness that is passed by magnetic force. The material of the adsorption plate 284a and the support plate 284b is not particularly limited, and can be metal or non-metal such as resin. For example, stainless steel is used as the adsorption plate 284a and the support plate 284b. The pillar 284c is a pillar that fixes the support plate 284b to the moving body 283. The upper end of the pillar 284c is fixed to the bottom of the moving body 283, and the lower end is fixed to the support plate 284b. As a result, the support plate 284b is supported in the horizontal direction at a distance from the bottom surface of the moving body 283.

[0157] The adsorption force imparting section 285 imparts adsorption force to the adsorption plate 284a. The adsorption force imparting section 285 imparts a magnetic force for adsorbing the electronic component C to the surface facing the receiving section 210 of the adsorption plate 284a across the support plate 284b. The adsorption force imparting section 285 has a magnetic member 285a, a retaining plate 285b, and a contact / separation mechanism 285c. The magnetic member 285a is, for example, a permanent magnet. The size of the horizontal plane of the magnetic member 285a is about the same as that of the adsorption plate 284a. The retaining plate 285b is about the same as that of the support plate 284b of the adsorption section 284, and is disposed between the support plate 284b and the bottom of the movable body 283. On the retaining plate 285b, the magnetic member 285a is respectively installed at a position corresponding to each adsorption plate 284a across the support plate 284b.

[0158] The contact / separation mechanism 285c adsorbs and releases the electronic component C by moving the magnetic member 285a and the adsorption plate 284a relative to each other. The contact / separation mechanism 285c of the present embodiment is disposed at the bottom of the movable body 283, and supports the magnetic member 285a in a lifting manner. As the contact / separation mechanism 285c, for example, an air cylinder is used. The contact / separation mechanism 285c supports the retaining plate 285b in the horizontal direction, and by lowering the magnetic member 285a and contacting the support plate 284b, the adsorption plate 284a exerts the adsorption force due to the magnetic force through the support plate 284b. Moreover, the contact / separation mechanism 285c loses the adsorption force due to the magnetic force in the adsorption plate 284a by raising the magnetic member 285a and leaving the support plate 284b.

[0159] The guide mechanism 282 is a mechanism for moving the moving body 283 between the storage section 210 and the slide groove 220. The guide mechanism 282 includes a support portion 286, an arm portion 287, and a guide portion 288. The support portion 286 is a pair of corner column members erected on the support table 212 of the storage section 210. The arm portion 287 is a corner column member supported in the horizontal direction by the support portion 286, and extends from a position above the container 211 to a position above the storage hole 231b of the vibration table 231. The guide portion 288 is a two-axis moving mechanism combining linear guides in the X direction and the Z direction, and is provided on the arm portion 287. The moving body 283 is supported by the guide portion 288 via a slider. Thus, the guide mechanism 282 can transfer the electronic component C adsorbed on the adsorption portion 284 between the storage section 210 and the slide groove 220.

[0160] (Transportation Agency)

[0161] like Figure 3 (A) Figure 3As shown in (B), the conveying mechanism 290 is a mechanism for conveying the mask 240 in which the electronic component C has been inserted into the mask hole 242 between the supply device 2 and the film forming processing unit 3. The conveying mechanism 290 of this embodiment has a rotating table 292 that is intermittently rotated by a motor 291. A plurality of holding holes 292a as through holes are formed at equal intervals on the rotating table 292. The receiving table 250 is held by the holding holes 292a.

[0162] A step (see FIG. 2 ) for holding the receiving platform 250 on which the mask 240 is placed is formed at the inner edge of the holding hole 292a. Figure 8 (A) Figure 8 (B)). Whenever the rotating table 292 stops due to intermittent rotation, the holding hole 292a comes to the right below the receiving hole 231b of the vibrating table 231. The pusher 261 of the lifting mechanism 260 moves the receiving table 250 carrying the mask 240 between the holding hole 292a and the receiving hole 231b of the rotating table 292.

[0163] [Film Forming Processing Department]

[0164] The film forming processing unit 3 is a device that forms a film using plasma on the portion of the electronic component C exposed from the mask hole 242, that is, the electrode forming region R. Figure 2 As shown, the film forming processing unit 3 includes a chamber 31, a conveying unit 32, a pre-processing unit 33, a film forming unit 34, and a film forming unit 35. The chamber 31 is a container whose interior can be made into a vacuum by exhaust gas generated by an exhaust unit 311. The exhaust unit 311 has a pipe and an exhaust circuit (not shown) connected to the exhaust port. The conveying unit 32 includes a rotating table 321, a driving source 322, a sealing body 323, and a pusher 324.

[0165] The rotating table 321 is a circular platform that intermittently rotates the receiving table 250 that has been loaded into the chamber 31 to move to each of the pre-processing section 33, the film forming section 34, the film forming section 35, and the load interlock section described later. The sealing body 323 is a member for sealing each section to be isolated from the chamber 31. The receiving table 250 is mounted on the sealing body 323 and is held in holding holes provided at equal intervals on the rotating table 321. The pusher 324 raises and lowers the sealing body 323 at positions corresponding to each section of the film forming processing section 3.

[0166] In addition, although not shown in the figure, the film forming processing section 3 has a loading and unloading section for loading and unloading the receiving table 250 carrying the mask 240 into and out of the chamber 31, and a loading interlocking section that can load the receiving table 250 carrying the mask 240 into and out of the chamber 31 through the loading and unloading section while maintaining the vacuum in the chamber 31.

[0167] The pretreatment unit 33 performs surface treatment on the electrode forming region R by plasma. The surface treatment is, for example, ion bombardment treatment, which uses ions generated by plasma in the treatment gas to clean the surface of the electrode forming region R. The pretreatment unit 33 has a treatment chamber 331 provided on the top side of the chamber 31, sealed by a rising sealing body 323, and performs surface treatment on the electrode forming region R exposed from the mask 240.

[0168] The film forming units 34 and 35 perform film forming processing on the electrode forming region R of the electronic component C by sputtering. Sputtering is a process in which ions generated by plasma in the sputtering gas cause the film forming material ejected from the targets 342 and 352 to be deposited on the surface of the electrode forming region R. The film forming units 34 and 35 have film forming chambers 341 and 351 which are provided on the top side of the chamber 31 and sealed by the rising sealing body 323, and perform film forming processing on the electrode forming region R exposed from the mask 240.

[0169] Targets 342 and 352 containing film-forming materials are provided in the film-forming chambers 341 and 351. Targets 342 and 352 are components formed of film-forming materials that are deposited on the electronic component C by sputtering to form a film. Targets 342 and 352 are held by a backing plate not shown in the figure and are connected to a power supply via electrodes. As a film-forming material for the base layer, for example, Ti is used, and as a seed layer for the electrode E, for example, Cu, Au, Ag, etc. are used. Among them, various materials can be applied as long as they are materials that can be formed into films by sputtering. In addition, in the present embodiment, the base layer is formed in the film-forming section 34, and the seed layer of the electrode E is formed in the film-forming section 35. As a material for the base layer, for example, titanium (Ti) is used, and as a material for the seed layer of the electrode E, for example, copper (Cu) is used.

[0170] In this embodiment, two film forming units 34 and 35 are provided to form two layers of the base layer and the seed layer, but if the base layer is not required, only one film forming unit may be provided. Furthermore, if more layers of film formation are required, two or more film forming units may be provided.

[0171] [Control device]

[0172] The control device 4 is a device for controlling each part of the film forming device 1 (see Figure 2 The control device 4 may be composed of a computer operating according to a prescribed program. The control content of the control device 4 is programmed and executed by a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU).

[0173] For example, the control device 4 controls the vibration of the vibration table 231 performed by the vibration mechanism 230, the lifting and lowering of the receiving platform 250 and the mask 240 performed by the lifting mechanism 260, the movement of the baffle 200 performed by the moving mechanism 270, the input and removal of the electronic parts C performed by the removal mechanism 280, the transportation of the receiving platform 250 performed by the transportation mechanism 290, the loading and unloading of the receiving platform 250 into and out of the chamber 31 performed by the loading and unloading section, the plasma treatment performed by the pretreatment section 33, the film forming treatment performed by the film forming section 35, the transportation of the receiving platform 250 performed by the transportation section 32, etc. through the program as described above.

[0174] [action]

[0175] The film forming apparatus 1 of the present embodiment described above is described in detail below. Figure 1 to Figure 7 In addition, refer to Figure 8 to Figure 13 The illustration diagram explains the film forming process on the electronic component C. Figure 8 to Figure 12 and Figure 3 In addition, as a premise for explanation, as Figure 4 As shown in (A), a plurality of electronic components C are put into the container 211 of the storage section 210 in advance, and each partition 211a contains a plurality of electronic components C. The number of electronic components C contained in each partition 211a is greater than the number of chute holes 222 of each partition 225 in the chute 220, the number of baffle holes 202 in the baffle 200, and the number of mask holes 242 of each partition 245 in the mask 240. Moreover, by grinding with a flat plate, etc., the positions of the electronic components C contained in each partition 211a can be averaged so as to be evenly close in each partition 211a.

[0176] Moreover, if Figure 8 As shown in (A), a receiving platform 250 carrying a mask 240 is placed on a receiving platform 261a of a pusher 261. At this time, by inserting the limiting portion 253 of the receiving platform 250 into the limiting hole 243 of the mask 240, the mask 240 and the receiving platform 250 are aligned and prevented from shifting. Figure 8 As shown in (B), the stage 261a is raised by the pusher 261, so that the mask 240 is in contact with the lower surface of the baffle 200. At this time, the baffle 200 is in the first position where the baffle hole 202 and the slide slot hole 222 coincide with each other, and the baffle hole 202 deviates from the mask hole 242 in the X direction. Moreover, at this time, the overlapping area of ​​the baffle hole 202 and the slide slot hole 222 is larger than the surface F in the direction orthogonal to the axis Axc of the electronic component C (refer to Figure 1 The area of ​​(C)).

[0177] (Supply Action)

[0178] First, the supply operation of the electronic components C will be described. Figure 4 As shown in (A), the moving body 283 of the pickup mechanism 281 is horizontally moved by the guide mechanism 282 and positioned above the container 211. At this time, since the holding plate 285b is lowered by the contact / separation mechanism 285c, the magnetic member 285a is in contact with the support plate 284b, and thus the adsorption force brought by the magnetic force is exerted on the adsorption plate 284a via the support plate 284b.

[0179] Next, the moving body 283 of the picking mechanism 281 is lowered by the guide mechanism 282, so that each adsorption plate 284a approaches each partition 211a of the container 211. Thus, each adsorption plate 284a uses magnetic force to adsorb and hold multiple electronic components C. Then, the moving body 283 of the picking mechanism 281 is raised by the guide mechanism 282 to pick up the electronic components C from the container 211. Subsequently, the moving body 283 is horizontally moved by the guide mechanism 282 and positioned above the slide trough 220. Then, as shown in FIG. Figure 4 (B) Fig. 9 (A) Fig.12 As shown in (A), the moving body 283 descends, and the adsorption plate 284a approaches each partition 225 of the chute 220.

[0180] Then, if Fig. 9 (B) Fig.12 As shown in (B), the holding plate 285b is raised by the connection / separation mechanism 285c, and the magnetic member 285a leaves the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. Therefore, the electronic parts C adsorbed on each adsorption plate 284a fall to each partition 225 of the chute 220. In addition, the moving body 283 is raised by the guide mechanism 282, thereby the adsorption plate 284a is evacuated from each partition 225 of the chute 220. In this way, the electronic parts C are supplied to the chute 220. Subsequently, the holding plate 285b is lowered by the connection / separation mechanism 285c, and the magnetic member 285a is connected to the support plate 284b, thereby returning to the state where the magnetic force acts on each adsorption plate 284a.

[0181] Furthermore, by vibrating the vibration table 231 using the vibration mechanism 230, the chute 220, the baffle 200, the mask 240 and the receiving table 250 are vibrated. Fig.10 (A) Fig.12 As shown in (C), the electronic components C accommodated in each partition 225 of the slide groove 220 enter from the upper end side of the slide groove hole 222 one by one, are guided in a manner such that the axis Axc becomes vertical in the process of passing through the slide groove hole 222, and fall into the baffle hole 202.

[0182] Since the baffle plate 200 is in the first position, the electronic component C that has entered the baffle plate hole 202 is in contact with the upper surface of the mask 240 that deviates from the mask hole 242 through its lower end, and does not fall into the mask hole 242. In addition, there is a case where the electronic component C that has entered the baffle plate hole 202 is carried by the electronic component C that has entered the slide slot hole 222. Since the length of the axis Axh direction of the baffle plate hole 202 is the same as the length of the axis Axc of the electronic component C, the boundary between the electronic component C that has entered the slide slot hole 222 and the electronic component C that has entered the baffle plate hole 202 and the lower surface of the slide slot 220 form the same horizontal plane, so the slide slot 220 can move in the horizontal direction.

[0183] And, if Fig.10 (B) Fig.12 As shown in (D), the baffle 200 is moved in the Y direction by the moving mechanism 270. The moving distance Dx at this time is a distance of about half the length of the mask hole 242 in the horizontal direction. Therefore, since the axis Axh of the baffle hole 202 deviates from the axis Axs of the slide slot hole 222, the electronic component C that has entered the baffle hole 202 is prevented from falling. Moreover, since the axis Axh of the baffle hole 202 is consistent with the axis Axm of the mask hole 242, the electronic component C that has entered the baffle hole 202 falls into the mask hole 242. In this way, the electronic component C that has entered the mask hole 242 is connected to the support portion 252 of the receiving platform 250 through its lower end, and only the electrode forming area R on the upper end side is exposed from the mask hole 242. Among them, the electrode forming area R exposed from the mask hole 242 enters the baffle hole 202.

[0184] In addition, the moving distance Dx is not limited to a distance of about half the length of the mask hole 242 in the horizontal direction. It is sufficient to prevent the electronic component C from falling from the slide slot hole 222. In order to prevent the electronic component C from moving between the slide slot hole 222 and the baffle hole 202, the moving distance can be a distance at which the area of ​​the surface where the slide slot hole 222 overlaps the baffle hole 202 is smaller than the area of ​​the surface F in the direction orthogonal to the axis Axc of the electronic component C.

[0185] In this state, if Fig.11 (A) Fig.12As shown in (E), by utilizing the guide mechanism 282 to move the movable body 283 toward the top of the slide 220 and then descend, the adsorption plate 284a is descended and approaches each partition 225 of the slide 220. Thus, each adsorption plate 284a utilizes magnetic force to adsorb and hold the electronic components C in each partition 225. At this time, the magnetic force to be adsorbed acts not only on the electronic components C that have entered the slide hole 222, but also on the electronic components C that have entered the mask hole 242. However, the electronic components C that have entered the mask hole 242 are restricted in movement by the slide 220 and are therefore not adsorbed. Then, the movable body 283 is raised by the guide mechanism 282, and the electronic components C are picked up and removed from the slide 220. Subsequently, the movable body 283 is horizontally moved by the guide mechanism 282 and moves horizontally toward the top of the container 211. Furthermore, the movable body 283 descends, and the adsorption plate 284a approaches each partition 211a of the container 211 (refer to Figure 4 (B) Figure 4 (A)).

[0186] Subsequently, by utilizing the contact / separation mechanism 285c, the holding plate 285b rises, and the magnetic member 285a leaves the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. Therefore, the electronic components C adsorbed on each adsorption plate 284a fall to each partition 211a of the container 211. Furthermore, the moving body 283 rises through the guide mechanism 282, thereby the adsorption plate 284a is evacuated from each partition 211a of the container 211. In this way, the electronic components C are removed from the chute 220.

[0187] At the same time as the removal of the remaining electronic components C in the above chute 220, Fig.11 (B) Fig.12 As shown in (F), the support table 250 with the mask 240 is lowered by lowering the support table 261a of the pusher 261, and the support table 250 is held in the holding hole 292a of the rotating table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 remains on the support table 250.

[0188] Furthermore, the pusher 261 is moved downward and away from the receiving platform 250 and the rotating platform 292. Furthermore, the rotating platform 292 intermittently rotates, and the receiving platform 250 held in the holding hole 292a comes to a position where it can be carried in by the carrying-in and carrying-out unit, so the carrying-in and carrying-out unit carries the receiving platform 250 into the chamber 31 via the load interlock unit and is mounted on the sealing body 323 on the rotating platform 321.

[0189] like Figure 2As shown, the rotating table 321 transports the receiving table 250 to the pre-treatment unit 33, and uses the pusher 324 to raise the sealing body 323, so that the receiving table 250 carrying the mask 240 with the electronic component C inserted is accommodated in the processing chamber 331 and sealed. In the processing chamber 331, the electrode forming area R of the electronic component C exposed from the mask hole 242 is surface treated.

[0190] Furthermore, the rotating table 321 sequentially transports the receiving table 250 to the film forming section 34 and the film forming section 35, and similarly to the above, the sealing body 323 is raised and sealed by the pusher 324, and a film is formed on the electrode forming region R in the film forming chamber 341 and the film forming chamber 351. In this embodiment, a titanium film is formed in the film forming section 34, and a copper film is formed in the film forming section 35.

[0191] Then, the rotating table 321 transports the receiving table 250 to the loading / unloading position, and the loading / unloading unit carries the receiving table 250 out of the chamber 31 via the load lock unit. The carried-out receiving table 250 is held in the holding hole 292a of the rotating table 292.

[0192] Next, in order to form a film on the electrode forming region R on the opposite side of the electrode forming region R of the electronic component C where the film has been formed, the electronic component C is turned over. The mask 240 and the receiving table 250 with the electronic component C having the film formed on the electrode forming region R inserted therein are transported to a predetermined position for inversion by the rotating table 292. At the predetermined position, as shown in FIG. Fig.13 As shown in (A), a separately prepared receiving platform 250 is overlapped on the mask 240 on the receiving platform 250 positioned at a predetermined position, as shown in FIG. Fig.13 Inverted as shown in (B). In addition, the limiting portion 253 of the newly overlapped receiving platform 250 enters the limiting hole 243 of the mask 240 to perform alignment and prevent displacement. Moreover, the limiting portions 253 of the two overlapping receiving platforms 250 abut against each other, thereby defining the interval between the two receiving platforms 250.

[0193] The interval between the two overlapping receiving platforms 250 is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. The two receiving platforms 250 have the same shape and size. Therefore, the protrusion amount of the limiting portion 253 of each receiving platform 250 is the same. Moreover, the protrusion amount of the supporting portion 252 of each receiving platform 250 is the same. Therefore, twice the difference between the protrusion amount of the limiting portion 253 and the supporting portion 252 is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. That is, the difference between the protrusion amount of the limiting portion 253 and the supporting portion 252 is set to be half of the length set to be the same as or slightly larger than the length of the electronic component C in the axial direction. Moreover, the thickness of the plate body 241 of the mask 240 is thicker than the difference between the protrusion amount of the limiting portion 253 and the supporting portion 252, and thinner than twice the difference between the protrusion amount of the limiting portion 253 and the supporting portion 252. And it is the thickness that exposes the electrode forming region R of the electronic component C when overlapping on the supporting portion 252. Since such a dimensional relationship is set, the limiting portion 253 of the other receiving platform 250 can be inserted into the limiting hole 243 provided on the plate body 241 of the mask 240 placed on one of the receiving platforms 250. Furthermore, even if the two overlapping receiving platforms 250 are integrally reversed (or turned over), the electrode forming area R of the other end of the electronic component C that contacts the other receiving platform 250 remains exposed by the same amount as before the reversal.

[0194] The mask 240 is also inverted by this inversion, so the mask 240 descends and contacts the receiving platform 250 which becomes the lower side. As a result, the electrode forming region R on the opposite side of the film forming side in the electronic component C is exposed from the upper end of the mask hole 242. Fig.13 As shown in (C), the upper receiving platform 250 is removed. In this state, the receiving platform 250 is carried into the chamber 31 of the film forming processing unit 3 in the same manner as described above, and the exposed electrode forming region R is subjected to film forming processing. Thus, electrodes E are formed in the electrode forming regions R at both ends of the electronic component C. In addition, the stacking or removal of the receiving platform 250 can be performed by an operator or by a robot or the like.

[0195] [Effect]

[0196] (1) The supply device 2 of this embodiment comprises: a chute 220 having a plurality of chute holes 222 through which electronic components C can pass one by one, the electronic components C having one end and the other end; a baffle 200 having a plurality of baffle holes 202 overlapping with the chute 220 and through which the electronic components C are inserted; and a mask 240 having a mask hole 242 overlapping with the baffle 200 and through which the electronic components C are inserted, covering a portion of the electronic components C. A supporting platform 250 holds the mask 240 and is connected to one end of the electronic component C inserted into the mask hole 242; and a moving mechanism 270 moves the baffle 200 between a first position in which the electronic component C can pass through the baffle hole 202 from the slide slot hole 222 but cannot pass through the mask hole 242 from the baffle hole 202, and a second position in which the baffle 200 is moved so that the electronic component C cannot pass through the baffle hole 202 from the slide slot hole 222 but can pass through the mask hole 242 from the baffle hole 202.

[0197] Therefore, it is possible to provide a supply device and a film forming device that suppress the supply of electronic components exceeding a predetermined amount and improve productivity. Specifically, by moving the electronic component C from the chute hole 222 to the baffle hole 202 at the first position and moving the electronic component C from the baffle hole 202 to the mask hole 242 at the second position, the electronic component C can be supplied from the chute 220 to the mask 240. In the second position, since the baffle hole 202 is connected to the mask hole 242, but the chute hole 222 is not connected to the baffle hole 202, even if the electronic component C remains in the chute 220, it is possible to prevent excess electronic components C from falling. Therefore, the supply of electronic components C exceeding a predetermined amount is suppressed.

[0198] Furthermore, regardless of whether or not the operation of removing the electronic components C remaining in the chute 220 from the chute 220 is performed, the chute 220 can be separated from the mask 240. That is, the mask 240 holding the electronic components C can be transferred to the step of film forming processing without waiting for the operation of removing the remaining electronic components C, thereby shortening the cycle time.

[0199] In more detail, when the electronic component C is inserted into the mask hole 242, in order to improve the insertion rate, the electronic components C more than the number of the mask holes 242 are supplied to the chute 220. In this way, of course, there will be extra electronic components C that do not enter the mask hole 242. The extra electronic components C will remain on the chute 220. In addition, at this time, there is also the following situation: the electronic component C exists in the chute hole 222 of the portion where the electronic component C has been inserted in the mask hole 242. When the mask 240 is separated from the chute 220, the electronic component C existing in the chute hole 222 will fall from the chute 220 and scatter on the mask 240. In addition, the electronic components C remaining on the chute 220 may also fall from the chute 220 through the chute hole 222 and scatter on the mask 240. These electronic components C that fall on the mask 240 will be scattered in the film forming device 1 and cause malfunction or hinder film formation.

[0200] Therefore, before the mask 240 is separated from the slide groove 220, the excess electronic components C in the slide groove hole 222 must also be removed. If suction or adsorption is performed for the removal, the electronic components C inserted into the mask hole 242 may also be removed, thereby reducing the insertion rate and causing a decrease in productivity.

[0201] When the supply device 2 of this embodiment sucks (adsorbs) the electronic components C on the chute 220 or in the chute hole 222 through the removal mechanism 280, the electronic components C inserted into the mask hole 242 deviate from the hole of the chute 220, so it can be set to a state where they will not be sucked out through the chute hole 222. That is, the movement of the electronic components C in the mask hole 242 is restricted. Therefore, the electronic components C inserted into the mask hole 242 remain in the inserted state, and the removal mechanism 280 can effectively remove only the excess electronic components C other than the electronic components C inserted into the mask hole 242. As a result, the electronic components C scattered on the mask 240 can be eliminated without reducing productivity, and the excess electronic components C will not cause failures or hinder film formation.

[0202] (2) The length of the shutter hole 202 in the direction of the axis Axh is equal to the length of the electronic component C in the direction of the axis Axc. Therefore, even in a state where the electronic component C remains in the shutter hole 202, the shutter 200 can be moved.

[0203] (3) The moving mechanism 270 moves only the shutter 200. Therefore, the slide chute 220, the shutter 200, and the mask 240 can be relatively moved by a simple mechanism, and positioning to the first position and the second position becomes easy.

[0204] (4) The supply device 2 has a removal mechanism 280 for removing electronic components C other than the electronic components C inserted into the mask hole 242 from the chute 220. The movement of the electronic components C inserted into the mask hole 242 is restricted, so they are not sucked out through the chute hole 222. Therefore, only the electronic components C that have not entered the mask hole 242 and remain in the chute 220 and the chute hole 222 can be removed by the removal mechanism 280. Thus, when the chute 220 is separated from the mask 240, the supply of electronic components C exceeding a predetermined amount to the mask 240 can be suppressed.

[0205] (5) The removal mechanism 280 includes the suction portion 284 that suction-holds the electronic component C. Therefore, the electronic component C remaining in the slide groove 220 and the slide groove hole 222 can be suction-held and removed.

[0206] (6) The adsorption portion 284 has an adsorption plate 284a for adsorbing the electronic component C and an adsorption force imparting portion 285 for imparting adsorption force to the adsorption plate 284a. The adsorption force imparting portion 285 has a magnetic member 285a and a contact / separation mechanism 285c. The contact / separation mechanism 285c adsorbs and releases the electronic component C by moving the magnetic member 285a and the adsorption plate 284a relative to each other.

[0207] Therefore, by moving the magnetic member 285a relative to the adsorption plate 284a, the adsorption and release of the electronic components C over the entire surface of the chute 220 or the plurality of partitions 211a of the storage section 210 can be switched instantly, and the bias of the adsorption position or the falling position of the electronic components C can be reduced. Moreover, compared with suction by negative pressure, the routing of piping etc. is not required, and the structure can be simplified.

[0208] (7) The supply device 2 includes the storage section 210 for storing a plurality of electronic components C, and the removal mechanism 280 includes the guide mechanism 282 for transferring the electronic components C between the storage section 210 and the chute 220. Therefore, the electronic components C can be supplied and removed by a common mechanism.

[0209] [Modifications]

[0210] The present embodiment also considers the following modified examples.

[0211] (1) In the above embodiment, the moving mechanism 270 moves only the baffle 200 to place the chute 220, the baffle 200, and the mask 240 in the first position and the second position, but it is sufficient that at least one of the chute 220, the baffle 200, and the mask 240 is relatively moved. For example, the chute 220, the baffle 200, and the mask 240 may be placed in the first position and the second position by moving any one, any two, or all of them. In addition, the partition 225 of the chute 220 and the corresponding partition 211a of the receiving portion 210 and the partition 245 of the mask 240 may be one or more.

[0212] (2) The magnetic member 285a of the adsorption force imparting portion 285 is set as a permanent magnet in the above-mentioned form, but an electromagnet may also be used. In this case, there is no need to provide a mechanism for connecting / separating the magnetic member 285a, and the presence or absence of the suction force brought by the magnetic force can be switched by turning the current on and off. Moreover, the magnetic member 285a may also be an electromagnet, and the magnetic member 285a may also be combined with a mechanism for connecting / separating it. Even in this case, the influence of the magnetic force can be effectively blocked by the mechanism for connecting / separating the magnetic member 285a, so that even a small and lightweight electronic component C can be effectively released from adsorption and retention.

[0213] The adsorption portion may also include a suction port for holding the electronic component C by suctioning with negative pressure and a suction pipe for supplying negative pressure to the suction port. In this case, the adsorption force imparting portion is connected to the suction pipe as a negative pressure generating circuit for imparting suction force by negative pressure. Thus, even electronic components C of a material or shape that is difficult to adsorb by magnetic force can be adsorbed and held by negative pressure, and the electronic components C can be supplied by releasing the adsorption by stopping the negative pressure. The opening area of ​​the suction port is set to be less than the area of ​​the smallest surface of the electronic component C. The suction port can be set to a plurality of holes formed in the adsorption plate, or the suction port can be covered with an air-permeable porous material. Thus, the suction port can be reduced to suppress the phenomenon of the electronic component C being sucked into the suction pipe.

[0214] (3) The film forming processing unit 3 is not limited to an apparatus that forms a film by sputtering, but may be an apparatus that forms the electrode E by applying a conductive material to the electrode forming region R exposed from the mask hole 242 of the mask 240, or may be an apparatus that forms the electrode E by immersing the electrode forming region R in a conductive material.

[0215] The number of the partition 225 of the chute 220 only needs to be at least one. That is, it may be one or more. The number of the partition 245 of the mask 240 and the partition 211a of the storage section 210 only needs to be at least one. That is, it may be one or more.

[0216] (4) The support platform 250 may not have the support portion 252 and may be a flat surface. Furthermore, the mask 240 may not have the beam portion 244 only in the plate body 241 and may be a flat surface. The support platform 250 and the mask 240 may be integrally formed even if they are fixed. The limiting portion 253 may be a member such as the above-mentioned pin or a wall surrounding the mask 240.

[0217] (5) The electrode forming region R can be any region as long as it is a region on the outer surface of the electronic component C that is electrically connected to the internal electrode En and is a region at at least one end of the electronic component C. For example, the electrode forming region R can be a region at both ends or only one end of the electronic component C in the direction of the axis Axc. That is, the film forming processing unit 3 can form a film on at least one end of the electronic component C.

[0218] The electrode forming region R only needs to be a part of the electronic component C. For example, it may be a box-shaped region including the surface F in the direction of the axis Axc of the electronic component C, or it may be only the surface F in the direction of the axis Axc of the electronic component C (see Figure 1 ). That is, the mask hole 242 only needs to cover a portion of the electronic component C, and in particular includes a form that covers a portion or all of the side surface (surface along the axis Axc) of the electronic component C. When the mask hole 242 covers the entire side surface of the electronic component C, the electronic component C is held in the mask hole 242 with only the surface F in the direction orthogonal to the axis Axc exposed.

[0219] [Other embodiments]

[0220] The above describes the embodiments of the present invention and the modified examples of each part, but the embodiments and the modified examples of each part are presented as an example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and changes can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the invention described in the claims.

Claims

1. A supply device, comprising: A slide slot having a plurality of slide slot holes through which electronic components can pass one by one, wherein the electronic components have one end and another end; A baffle plate having a plurality of baffle plate holes overlapping the slide slot and allowing the electronic components to be inserted through the slide slot holes; A mask having a mask hole overlapping with the baffle plate and allowing the electronic component to be inserted through the baffle plate hole to cover a portion of the electronic component; A receiving platform, holding the mask and contacting one end of the electronic component inserted into the mask hole; a moving mechanism for relatively moving at least one of the slide slot, the baffle plate, and the mask between a first position where the electronic component can pass through the baffle plate hole from the slide slot hole but cannot pass through the mask hole from the baffle plate hole, and a second position where the electronic component cannot pass through the baffle plate hole from the slide slot hole but can pass through the mask hole from the baffle plate hole; as well as The removing mechanism removes the electronic components other than the electronic components inserted into the mask holes from the slide grooves. 2 . The supply device according to claim 1 , wherein the axial length of the baffle hole is the axial length of the electronic component. The supply device according to claim 1 , wherein the moving mechanism moves only the shutter. 4 . The supply device according to claim 1 , wherein the removal mechanism has a suction portion that suction-holds the electronic component.

5. The supply device according to claim 4, wherein the adsorption portion comprises: An adsorption plate for adsorbing the electronic components; and an adsorption force imparting unit for imparting adsorption force to the adsorption plate, The adsorption force imparting section includes a magnetic member and a contact / separation mechanism, and the contact / separation mechanism adsorbs and releases the electronic component by relatively moving the magnetic member and the adsorption plate.

6. The supply device according to claim 1, comprising: a housing portion for housing a plurality of the electronic components; The removal mechanism includes a guide mechanism for transferring the electronic component between the storage portion and the slide groove.

7. A film forming device, include: The supply device according to any one of claims 1 to 6; as well as The film forming processing unit forms a film on the electronic component.

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