Ejector pin assembly and carrier mechanism

Abstract

The application discloses a pin assembly and a bearing mechanism. The pin assembly comprises a carrier plate and a plurality of pins. The carrier plate comprises a first surface, which comprises a first region and a second region arranged around the periphery of the first region. At least part of the pins is located on one side of the first surface and is distributed in the first region and the second region. The top surface of the pin, which is away from the first surface, has a first height from the first surface. The first height of the pin in the first region is smaller than the first height of the pin in the second region. Through the above scheme, the contact stress between the pin assembly and the glass substrate is optimized, the mura defect on the glass substrate is improved, and the service life of the pin assembly is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a pin assembly and a bearing mechanism. BACKGROUND

[0002] In the production process of flexible panel, the glass substrate needs to be subjected to water removal baking treatment in a baking chamber. The glass substrate is first contacted and placed on the pin assembly of the tray under the action of the mechanical arm, and then the mechanical arm is separated from the glass substrate, the glass substrate is supported by the pin assembly, and the glass substrate is heated and dried in the baking chamber.

[0003] Because the glass substrate will have a large instantaneous stress concentration when it first contacts the pin during placement on the pin assembly, mura defects (dark spots, bright spots, etc. due to uneven stress) and other adverse phenomena will occur at the position of the glass substrate in contact with the pin, thereby affecting the production yield of the display panel. SUMMARY

[0004] The technical problem solved by the present application is to provide a pin assembly and a bearing mechanism to optimize the contact stress of the pin assembly and the glass substrate, improve the mura defects on the glass substrate, and prolong the service life of the pin assembly.

[0005] To solve the above technical problems, one technical solution adopted by the present application is to provide a pin assembly, comprising a carrier plate and a plurality of pins, the carrier plate comprising a first surface, the first surface comprising a first region and a second region arranged around the periphery of the first region; at least part of the pins are located on one side of the first surface and distributed in the first region and the second region, and the top surface of the pin away from the first surface has a first height from the first surface; the first height of the pins in the first region is less than the first height of the pins in the second region

[0006] Optionally, the second region comprises a transition region arranged around the periphery of the first region, and an edge region arranged around the periphery of the transition region;

[0007] Wherein, the first height of the pins in the transition region is less than the first height of the pins in the edge region;

[0008] Optionally, the first height of all the pins in the edge region is the same;

[0009] And / or, the first height of all the pins in the first region is the same;

[0010] And / or, the first height of at least part of the pins in the transition region is different.

[0011] Optionally, the greater the minimum distance between the center point of the ejector pin located in the transition region and the center point of the ejector pin located in the first region, the greater the first height of the ejector pin located in the transition region.

[0012] Optionally, the transition region is arranged in a rectangular ring, and the transition region comprises a corner sub-region, a first connecting sub-region located between two adjacent corner sub-regions in the first direction, and a second connecting sub-region located between two adjacent corner sub-regions in the second direction.

[0013] Optionally, the first height of the ejector pin located in the corner sub-region is greater than the first height of the ejector pin located in the first connecting sub-region and the second connecting sub-region.

[0014] Optionally, the first height of the ejector pin located in the second connecting sub-region is less than the first height of the ejector pin located in the corner sub-region and greater than the first height of the ejector pin located in the first connecting sub-region.

[0015] Optionally, the distance between the adjacent ejector pins arranged in the first direction is greater than the distance between the adjacent ejector pins arranged in the second direction.

[0016] Optionally, the difference between the first height of the ejector pin located in the second connecting sub-region and the first height of the ejector pin located in the corner sub-region is greater than or equal to 0.8 mm and less than or equal to 1.2 mm; and / or,

[0017] The difference between the first height of the ejector pin located in the second connecting sub-region and the first height of the ejector pin located in the first connecting sub-region is greater than or equal to 0.8 mm and less than or equal to 1.2 mm.

[0018] Optionally, the ejector pin comprises a support body, and in the extension direction of the first height, the support body comprises a bottom, a transition portion and a top portion connected in sequence, and the side of the top portion away from the bottom is a top surface.

[0019] Optionally, the cross-sectional dimension of the top portion is greater than the cross-sectional dimension of the bottom portion, and in the direction of the bottom pointing to the top portion, the cross-sectional dimension of the transition portion gradually increases; the cross section is perpendicular to the extension direction of the first height.

[0020] Optionally, the outer peripheral surface of the transition portion is a curved surface.

[0021] Optionally, the top portion, the transition portion and the bottom portion are all circular in the orthographic projection on the first surface.

[0022] Optionally, the ejector pin further comprises a body, and the body is detachably connected with the support body.

[0023] Optionally, in the extension direction of the first height, the transition portion comprises a first sub-transition portion and a second sub-transition portion connected with each other, and the first sub-transition portion is located between the second sub-transition portion and the bottom.

[0024] The outer circumferential surface of the first sub-transition part is a first arc surface concave inward, and the outer circumferential surface of the second sub-transition part is a second arc surface convex outward.

[0025] Optionally, the radius of curvature of the second arc surface is greater than or equal to the radius of curvature of the first arc surface.

[0026] Optionally, the first arc surface and the second arc surface are tangent at the connection therebetween.

[0027] Optionally, the first arc surface and the outer circumferential surface of the bottom are tangent at the connection therebetween, and the second arc surface and the outer circumferential surface of the top are tangent at the connection therebetween.

[0028] Optionally, in the extension direction of the first height, the height of the top is greater than or equal to 1 mm and less than or equal to 2 mm; and / or,

[0029] The sum of the height of the top and the height of the transition part is greater than or equal to 3.5 mm and less than or equal to 5.5 mm; and / or,

[0030] The diameter of the top is greater than or equal to 1.8 mm and less than or equal to 2.2 mm; the diameter of the bottom is greater than or equal to 0.9 mm and less than or equal to 1.1 mm; and / or,

[0031] The radius of curvature of the second arc surface is greater than or equal to 1.5 mm and less than or equal to 2 mm, and the radius of curvature of the first arc surface is greater than or equal to 1 mm and less than or equal to 1.5 mm.

[0032] To solve the above technical problems, one technical scheme adopted by the present application is to provide a bearing mechanism, which comprises the needle assembly in any of the embodiments; the load plate is provided with a via hole corresponding to the position of the needle; the bearing mechanism further comprises a driving assembly connected with the plurality of needles, for driving the plurality of needles to move synchronously in the extension direction of the first height.

[0033] The beneficial effects of the present application are: different from the prior art, the needle assembly and the load plate of the bearing mechanism of the present application are distributed with needles of different heights, wherein the height of the needle gradually increases from the center to the periphery. The glass substrate is in a suspended state before being placed on the needle, and the glass substrate in the suspended state appears a center sinking form under the action of its own gravity. Since the end of the needle also presents a form of lower center and higher periphery, the distance between each position on the lower surface of the glass substrate and the end of the corresponding needle is relatively consistent, and when the glass substrate is placed on the needle, the stress distribution of the glass substrate and each needle is relatively uniform, and the problem of local stress concentration is not easy to occur. On the one hand, the problem of excessive stress at local position on the glass substrate is not easy to occur, thereby reducing the probability of mura defect of the glass substrate; on the other hand, the stress distribution of each needle is more uniform, thereby improving the service life of the needle. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a side view of a top pin assembly according to an embodiment of the present application;

[0035] Figure 2 is a top view of a top pin assembly according to an embodiment of the present application; Figure 1

[0036] Figure 3 is a top view of a top pin assembly according to another embodiment of the present application;

[0037] Figure 4 is a top view of a top pin assembly according to another embodiment of the present application;

[0038] Figure 5 is a top view of a top pin assembly according to yet another embodiment of the present application;

[0039] Figure 6 is a comparison table of stress distribution of a top pin assembly according to two embodiments of the present application;

[0040] Figure 7 is a top view of a top pin assembly according to yet another embodiment of the present application;

[0041] Figure 8 is a partial structural schematic view of a top pin assembly according to an embodiment of the present application;

[0042] Figure 9 is a comparison table of defective rate of a glass substrate using a top pin assembly according to two embodiments of the present application. DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and effects of the present application clearer and more explicit, the present application is further described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0044] Reference is made to Figure 1 , Figure 1 is a side view of a top pin assembly according to an embodiment of the present application. The top pin assembly of the present application comprises a carrier plate 2 and a plurality of top pins 1, the carrier plate 2 comprises a first surface 2a; the first surface 2a comprises a first area a and a second area aa arranged around the periphery of the first area a; at least part of the top pins 1 is located on one side of the first surface 2a and distributed in the first area a and the second area aa, and the top surface of the top pin 1 away from the first surface 2a has a first height H; the first height H of the top pin 1 in the first area a is less than the first height of the top pin in the second area aa.

[0045] ​Specifically, in one embodiment, in a direction away from the center of the area surrounded by the plurality of ejector pins 1 (Pin), Figure 1 A direction), the first height H of the plurality of ejector pins 1 gradually increases.

[0046] The ejector pin assembly can be used to support a substrate, such as a glass substrate. In one embodiment, the first surface 2a can be moved away from the center direction of the area surrounded by the plurality of ejector pins 1 ( Figure 1 The glass substrate 3 is divided into a first area and a plurality of annular areas that expand outward in sequence along the A direction. Along the A direction, the average values ​​of the first heights H of the ejector pins 1 in the plurality of areas increase from the inside to the outside. The first heights H of the ejector pins 1 in each area may be different or the same. However, to ensure support for the glass substrate 3, the first heights H of the ejector pins 1 in the outermost annular area may be the same. There is no limit to the number of annular areas and it can be adaptively adjusted according to the number of ejector pins 1.

[0047] The ejector pin 1 of the present application extends above the carrier plate 2 to support the glass substrate 3 above. The first height H of the ejector pin 1 gradually increases from the center (e.g., corresponding to the center area of ​​the glass substrate 3) to the periphery. The glass substrate 3 is in a suspended state before being placed on the ejector pin 1. The glass substrate 3 in the suspended state sinks in the center under the action of its own gravity (e.g., Figure 1 As shown in the figure, since the top surface of ejector pins 1 also gradually increases in height from the first region toward the outer regions, the distance between each location on the lower surface of glass substrate 3 and the corresponding top surface of ejector pin 1 is relatively consistent. When glass substrate 3 is placed on the ejector pin assembly and the two components first come into contact, the stress distribution between glass substrate 3 and each ejector pin 1 is relatively uniform, making it less likely for transient stress concentrations to occur in localized locations. This reduces the likelihood of localized transient stress on glass substrate 3, thereby reducing the probability of mura defects on glass substrate 3. Furthermore, the stress distribution across each ejector pin 1 is more uniform, thereby extending the service life of ejector pin 1.

[0048] See Figure 2 , Figure 2 yes Figure 1 In this embodiment, the second area aa includes a transition area b disposed around the periphery of the first area a, and an edge area c disposed around the periphery of the transition area b; wherein the first height of the ejector pins 1 in the transition area b is less than the first height of the ejector pins 1 in the edge area c. Figure 2 As shown, the area surrounded by the ejector pins 1 is divided into three areas from the center to the periphery, and the first heights of the ejector pins 1 in the three areas increase from the inside to the outside, which conforms to the shape of the glass substrate gradually sinking from the outside to the inside, and is convenient for adjusting the first height of the ejector pins 1. Figure 2The matrix distribution shown has a rectangular ring structure for both the transition region b and the edge region c; multiple ejector pins 1 can also be distributed in a circular array as Figure 3 shown, Figure 3 is a top view of another embodiment of the ejector pin assembly of the present application, where the transition region b and the edge region c are both circular rings; of course, in other embodiments, the ejector pins 1 can also be distributed in an elliptical array or a square array, etc. The first region a can be rectangular, circular, elliptical, square, etc.

[0049] Optionally, all the ejector pins 1 located within the edge region c have the same first height. The ejector pins 1 located within the edge region c of the ejector pin assembly correspond to the edge of the supported glass substrate 3, and their sinking amount is extremely small. Moreover, the ejector pins 1 within the edge region c usually receive the greatest stress, that is, they have the greatest supporting force, and the exactly same first height further enhances the supporting force of the ejector pins 1 within the edge region c on the glass substrate 3. Optionally, all the ejector pins 1 located within the first region a have the same first height. All the ejector pins 1 located within the transition region b can have exactly the same first height, such as Figure 3 all the ejector pins 1 within the circular ring-shaped transition region b shown have the same first height, or at least some of the ejector pins 1 located within the transition region b can have different first heights.

[0050] Optionally, continue to refer to Figure 2 , in one embodiment, the first heights of the ejector pins 1 located within the transition region b are different, where the greater the minimum distance corresponding to the ejector pins 1 located within the transition region b, the greater its first height H. The minimum distance is the minimum value of the distance between the center point of the ejector pin 1 located within the transition region b and the center point of the ejector pin 1 located within the first region a. Specifically, taking the Figure 2 shown ejector pin assembly as an example, this ejector pin assembly includes 30 ejector pins 1 distributed in a matrix, where 5 ejector pins 1 are distributed along the first direction ( Figure 2 the X direction in Figure 2 ), 6 ejector pins 1 are distributed along the second direction ( Figure 2 the Y direction in Figure 2 ), and the minimum distances corresponding to the ejector pins 1 located within the transition region b are the distances d1, d2, and d3 between the center points of the first transition ejector pin 1b, the second transition ejector pin 1c, and the third transition ejector pin 1d and the center point of the first central ejector pin 1a respectively (the first central ejector pin 1a is the ejector pin 1 within the first region a that is closest to the first transition ejector pin 1b, the second transition ejector pin 1c, and the third transition ejector pin 1d). Among them, d1 < d2 < d3, the first height of the first transition ejector pin 1b is less than the first height of the second transition ejector pin 1c, and the first height of the second transition ejector pin 1c is less than the first height of the third transition ejector pin 1d. By refining the height distribution of the ejector pins 1 in the transition region b, the probability of stress concentration of the ejector pins 1 in the transition region b is further reduced. In other embodiments, the transition region b can also be circular ring-shaped or elliptical ring-shaped.

[0051] Referring to Figure 4 , Figure 4 is a top view of another embodiment of the needle assembly of the present application. In this embodiment, the transition region b and the edge region c are both elliptical rings, the distance between the center point of the fourth transition needle 1e and the fifth transition needle 1f in the transition region b and the center point of the first center needle 1a (the first center needle 1a is the needle 1 closest to the fourth transition needle 1e and the fifth transition needle 1f in the first region a) is d4 and d5 respectively, wherein d4 < d5, the first height of the fourth transition needle 1e is less than the first height of the fifth transition needle 1f.

[0052] Optionally, referring to Figure 5 , Figure 5 is a top view of another embodiment of the needle assembly of the present application. In this embodiment, the transition region b is arranged in a rectangular ring, the transition region b comprises a corner sub-region b3, a first connecting sub-region b1 between two adjacent corner sub-regions b3 in the first direction X, and a second connecting sub-region b2 between two adjacent corner sub-regions b3 in the second direction Y; wherein the first height of the needle 1 located in the corner sub-region b3 is greater than the first height of the needle 1 located in the first connecting sub-region b1 and the second connecting sub-region b2. Optionally, the first direction X and the second direction Y intersect, for example, the first direction X and the second direction Y are perpendicular. In this way, the order of the pin point contact with the glass substrate is ensured to be appropriate, and the stress brought by the glass substrate is more uniform. The height distribution makes the support force of each pin more reasonable, and the phenomenon of instantaneous stress concentration of a few pins in individual regions does not occur. Optionally, the transition region b can be arranged in a square ring. The transition region b can be arranged in a rectangular ring, the first direction X can be the width direction thereof, and the second direction Y can be the length direction thereof.

[0053] Optionally, the first height of the needle 1 located in the second connecting sub-region b2 is less than the first height of the needle 1 located in the corner sub-region b3, and the first height of the needle 1 located in the second connecting sub-region b2 is equal to the first height of the needle 1 located in the first connecting sub-region b1. The needles are arranged in a rectangular array, the row direction can correspond to the first direction X, and the column direction can correspond to the second direction Y. The distance d2 between adjacent needles 1 in each row is equal to the distance d1 between adjacent needles 1 in each column.

[0054] Optionally, the first height of the pins 1 located in the second sub-connection region b2 is less than the first height of the pins 1 located in the top corner sub-region b3 and greater than the first height of the pins 1 located in the first sub-connection region b1, so as to further improve the stress uniformity when the glass substrate contacts the pins. The distance between adjacent pins 1 arranged in the first direction X is greater than the distance between adjacent pins 1 arranged in the second direction Y. The number of pins arranged in the second direction Y in the second sub-connection region b2 is greater than the number of pins arranged in the first direction X in the first sub-connection region b1. Optionally, the first region a can be a rectangular region, and the number of pins 1 in the first region a can be one or more. The long side of the first region a is adjacent to the second sub-connection region b2, and the short side of the first region a is adjacent to the first sub-connection region b1. Optionally, the transition region b is arranged in a rectangular ring. The distance d2 between adjacent pins 1 in each row is greater than the distance d1 between adjacent pins 1 in each column.

[0055] Optionally, the difference between the first height of the pins 1 located in the second sub-connection region b2 and the first height of the pins 1 located in the top corner sub-region b3 is greater than or equal to 0.8 mm and less than or equal to 1.2 mm (for example, 0.9 mm, 1.0 mm, 1.1 mm). Optionally, the difference between the first height of the pins 1 located in the second sub-connection region b2 and the first height of the pins 1 located in the first sub-connection region b1 is greater than or equal to 0.8 mm and less than or equal to 1.2 mm (for example, 0.9 mm, 1.0 mm, 1.1 mm).

[0056] Specifically, in the present embodiment, the first height of the 2 pins 1 located in the first region a is 64.0 mm, the first height of the 2 pins 1 located in the first sub-connection region b1 is 65.5 mm, the first height of the 4 pins 1 located in the second sub-connection region b2 is 66.5 mm, the difference between the first height of the pins 1 located in the second sub-connection region b2 and the first height of the pins 1 located in the first sub-connection region b1 is 1 mm, the first height of the 4 pins 1 located in the top corner sub-region b3 is 67.5 mm, the difference between the first height of the pins 1 located in the top corner sub-region b3 and the first height of the pins 1 located in the second sub-connection region b2 is 1 mm, and the first height of the 18 pins 1 located in the edge region c is 69.5 mm.

[0057] As shown in FIG. 1, the first region a is a rectangular region, and the number of pins 1 in the first region a is one. The long side of the first region a is adjacent to the second sub-connection region b2, and the short side of the first region a is adjacent to the first sub-connection region b1. The transition region b is arranged in a rectangular ring. The distance d2 between adjacent pins 1 in each row is greater than the distance d1 between adjacent pins 1 in each column. Figure 6 Figure 6 ​is a stress distribution comparison table of the needle assembly under two schemes. Scheme one: the needles 1 in the needle assembly only have two first heights, wherein the first height of the needles 1 located in the first area a is 64.0 mm, and the first height of the needles 1 located in the second area (including the transition area b and the edge area c) is 69.5 mm. Scheme two: the first height of the needles 1 in the first area a, and the first connecting sub-area b1, the second connecting sub-area b2, the top corner sub-area b3 in the transition area b, and the edge area c of the needle assembly increases in turn, as shown in Figure 5 It can be seen from Figure 6 that the maximum stress of the needles 1 in scheme two is greatly reduced; the distribution of the maximum stress of the needles 1 in the needle assembly in different areas in scheme two is more uniform.

[0058] Alternatively, referring to Figure 7 , Figure 7 is a top view of another embodiment of the needle assembly of the present application. In the present embodiment, the transition area b comprises the first connecting sub-area b1 and the second connecting sub-area b2; wherein the first height of the needles 1 located in the second connecting sub-area b2 is greater than the first height of the needles 1 located in the first connecting sub-area b1. Specifically, in the present embodiment, the first height of the 2 needles 1 located in the first area a is 64.0 mm, the first height of the 2 needles 1 located in the first connecting sub-area b1 is 65.5 mm, the first height of the 4 needles 1 located in the second connecting sub-area b2 is 66.5 mm, and the first height of the 22 needles 1 located in the edge area c is 69.5 mm.

[0059] Alternatively, referring to Figure 8 , Figure 8Figure 1 is a schematic view of a partial structure of an embodiment of the needle assembly of the present application, the needle 1 comprises a support body 11, in the extension direction of the first height H, the support body 11 comprises a bottom portion 113, a transition portion 112 and a top portion 111 connected in sequence, the side of the top portion 111 away from the bottom portion 113 is the top surface of the needle 1. Among them, the cross-sectional size of the top portion 111 is larger than the cross-sectional size of the bottom portion 113, and the cross-sectional size of the transition portion 112 gradually increases along the direction from the bottom portion 113 to the top portion 111; the cross section is perpendicular to the extension direction of the first height H. The setting of the transition portion 112 reduces the stress concentration phenomenon of the needle 1 due to the large size difference between the top portion 111 and the bottom portion 113. Optionally, the outer peripheral surface of the transition portion 112 is a curved surface; optionally, the curved surface can include multiple arc surfaces. Optionally, the first radial size of the top portion 111 is larger than the second radial size of the bottom portion 113, and the radial size of the transition portion 112 increases from the second radial size to the first radial size in an arc shape. Because the radial size of the top portion 111 is larger than the radial size of the bottom portion 113, on the one hand, the contact area of the needle 1 with the glass substrate above is enlarged, and the stress between the needle 1 and the glass substrate is reduced. On the other hand, because the radial size of the transition portion 112 gradually changes in the axial direction and smoothly transitions from the top portion 111 to the bottom portion 113, the stress concentration phenomenon of the needle 1 due to the sudden change of the radial size on the transition portion 112 is reduced, thereby reducing the probability of damage to the needle 1, thereby improving the overall life of the needle assembly, solving the problem that if part of the needle 1 in the needle assembly is damaged and fails, the remaining needles 1 will have to share more pressure, thereby causing the stress on the remaining needles 1 to increase, further accelerating the damage and failure of the remaining needles 1, and reducing the overall life of the needle assembly.

[0060] Optionally, in the direction from the bottom portion 113 to the top portion 111, the cross-sectional size of the top portion 111 and the bottom portion 113 is constant. The cross section of the top portion 111 can be circular, elliptical, square, rectangular or diamond-shaped, etc. The cross section of the bottom portion 113 can be circular, elliptical, square, rectangular or diamond-shaped, etc. The cross-sectional shape of the top portion 111 and the bottom portion 113 can be the same.

[0061] Optionally, the orthographic projection of the bottom portion 113 on the first surface 2a is located within the orthographic projection of the transition portion 112 on the first surface 2a, and the orthographic projection of the transition portion 112 on the first surface 2a is located within the orthographic projection of the top portion 111 on the first surface 2a.

[0062] Optionally, the support body 11 is an axisymmetric structure, and the symmetry axis of the support body 11 is parallel to the extension direction of the first height. Optionally, the top portion 111, the transition portion 112 and the bottom portion 113 are all axisymmetric structures. Optionally, the top portion 111, the transition portion 112 and the bottom portion 113 are circular in the orthographic projection on the first surface 2a. Optionally, the top portion 111 and the bottom portion 113 are both cylindrical, the first radius r1 of the top portion 111 is greater than the second radius r2 of the bottom portion 113, and the radius of the transition portion 112 increases from the second radius r2 to the first radius r1 in the direction from the bottom portion 113 to the top portion 111. Specifically, the diameter of the top portion 111 is greater than or equal to 1.8 mm and less than or equal to 2.2 mm (for example, 2 mm); the diameter of the bottom portion 113 is greater than or equal to 0.9 mm and less than or equal to 1.1 mm (for example, 1 mm). The support body 11 with a circular cross section is more uniform in stress, avoiding local stress concentration. In other embodiments, the orthographic projection of the top portion 111, the transition portion 112 and the bottom portion 113 on the first surface 2a can also be elliptical or polygonal, such as square, rectangular or rhombus, etc.

[0063] Optionally, the thimble 1 further comprises a body 12. The support body 11 can be located on the side of the body 12 away from the first surface 2a. The bottom portion 113 is located between the transition portion 112 and the body 12. The body 12 and the support body 11 (for example, the bottom portion 113) are detachably connected. When the support body 11 is damaged, it can be timely replaced by detaching from the body 12. Specifically, the support body 11 can be provided with external threads on the outer peripheral surface of the bottom portion 113, and the body 12 is provided with a corresponding threaded hole. The support body 11 can be threadedly connected with the body 12, which is convenient for disassembly on the one hand, and can quickly adjust the first height H of the thimble 1 by rotating the support body 11 on the other hand.

[0064] Optionally, continuing to refer to Figure 8In this embodiment, along the extension direction of the first height H, the transition portion 112 includes a first sub-transition portion 1121 and a second sub-transition portion 1122 that are interconnected, with the first sub-transition portion 1121 located between the second sub-transition portion 1122 and the bottom portion 113. The outer circumference of the first sub-transition portion 1121 forms a concave first arc surface, while the outer circumference of the second sub-transition portion 1122 forms a convex second arc surface. The cross-sectional dimensions of the first sub-transition portion 1121 gradually increase from the bottom portion 113 toward the top portion 111. The cross-sectional dimensions of the second sub-transition portion 1122 gradually increase from the bottom portion 113 toward the top portion 111. Since the radius of the top 111 is larger than the radius of the bottom 113, compared with setting one arc transition, setting two arcs can reduce the angle between the tangent of the second arc surface and the tangent of the outer peripheral surface of the top 111, and the angle between the tangent of the first arc surface and the tangent of the outer peripheral surface of the bottom 113, so that the transition is smoother, further reducing the stress concentration phenomenon. At the same time, since the concave and convex directions of the first arc surface and the second arc surface are opposite, the disassembly tool can be fixed at the junction of the first arc surface and the second arc surface, reducing the probability of slipping of the disassembly tool and improving the disassembly efficiency.

[0065] Optionally, in this embodiment, the first curved surface and the second curved surface are tangent at their connection. Furthermore, the first curved surface is tangent at its connection to the outer circumference of the top 111, and the second curved surface is tangent at its connection to the outer circumference of the bottom 113. The three connections formed are chamfered corners: between the outer circumference of the top 111 and the second curved surface, between the first curved surface and the second curved surface, and between the first curved surface and the outer circumference of the bottom 113. The arc transition further reduces stress concentration at the junction, alleviates or reduces problems such as sudden stress concentration in the local structure, and has an excellent effect on improving the contact force of the pin.

[0066] Specifically, if Figure 8 As shown, optionally, in the extension direction of the first height H, when the height h1 of the top 111 is greater than or equal to 1mm and less than or equal to 2mm (for example, 1.2mm, 1.5mm, 1.8mm), the glass substrate can be better buffered when it first contacts the top 111. At the same time, because the top 111 has a certain height, the top corner of the top 111 is not likely to generate concentrated stress on the glass substrate. Optionally, the diameter of the top 111 is greater than or equal to 1.8mm and less than or equal to 2.2mm; the diameter of the bottom 113 is greater than or equal to 0.9mm and less than or equal to 1.1mm, which can alleviate the impact effect generated when the glass substrate first contacts, avoid the risk of the Pin contact surface being too small or too thin, and the height of the tray-shaped support body connected to the outside of the cylinder is not likely to be too large, which helps to reduce the processing and manufacturing cost of the tray-shaped support body.

[0067] Optionally, the sum of the height of the top portion 111 and the transition portion 112 (h1+h2) in the extension direction of the first height H is greater than or equal to 3.5 mm and less than or equal to 5.5 mm (for example, 4 mm, 4.5 mm, 5 mm), so as to ensure a relatively gentle transition of the radius of the transition portion 112.

[0068] Optionally, the radius of curvature of the second arc surface is greater than or equal to the radius of curvature of the first arc surface. Optionally, the radius of curvature R1 of the first arc surface is greater than or equal to 1 mm and less than or equal to 1.5 mm (for example, 1.2 mm, 1.4 mm), and optionally, the radius of curvature R2 of the second arc surface is greater than or equal to 1.5 mm and less than or equal to 2 mm (for example, 1.6 mm, 1.8 mm). In this radius range, the stress distribution on the transition portion 112 is uniform, and the service life of the lift pin 1 is long. The circular arc design transition is ingenious, which can reduce or eliminate the problem of stress concentration mutation in the local structure, and is excellent in improving the contact stress effect of the lift pin.

[0069] Figure 9 The table is a comparison table of mura defect rates of glass substrates when the lift pin assembly of the first and second schemes of the present application is applied. The mura defect rates of glass substrates of different process types are improved when the two different schemes are used. As can be seen from the table, the mura defect rate improvement effect of the second scheme is better than that of the first scheme.

[0070] Continuing to refer to Figure 8 The embodiment also provides a carrying mechanism, which comprises the lift pin assembly of any of the preceding embodiments; the position of the carrier plate 2 corresponding to the position of the lift pin 1 is provided with a via hole 21; and the carrying mechanism further comprises a driving assembly (not shown in the figure), which is connected with the plurality of lift pins 1 and is used to drive the plurality of lift pins 1 to move synchronously in the extension direction of the first height H. Specifically, before the glass substrate is placed on the lift pin assembly by the mechanical arm, the driving assembly drives the lift pins 1 to rise synchronously to the respective first height H; after the glass substrate is placed on the lift pin assembly by the mechanical arm, the baking mechanism bakes the glass substrate; and after the baking is completed, the driving assembly drives the plurality of lift pins 1 to lower the glass substrate and then transport and deliver the glass substrate to the next station.

[0071] The glass substrate baked under the carrying of the carrying mechanism of the embodiment is not prone to have the problem of excessive stress in the local position, thereby reducing the probability of mura defects of the glass substrate; and the stress distribution on each lift pin 1 is more uniform, thereby prolonging the service life of the lift pin 1.

[0072] The above is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and the drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A needle assembly comprising: The application relates to a carrier plate and a plurality of pins. The carrier plate comprises a first surface, the first surface comprising a first region and a second region arranged around the periphery of the first region; The plurality of pins are arranged on one side of the first surface, distributed in the first region and the second region, and have a first height between the top surface of the pins and the first surface; The pins comprise a support body, and in the extension direction of the first height, the support body comprises a bottom, a transition portion and a top portion connected in sequence, and the top surface is located on the side of the top portion away from the bottom; The cross-sectional dimension of the top portion is greater than that of the bottom portion, and the cross-sectional dimension of the transition portion gradually increases in the direction from the bottom portion to the top portion; the cross-sectional direction is perpendicular to the extension direction of the first height; The outer peripheral surface of the transition portion is a curved surface; In the extension direction of the first height, the transition portion comprises a first sub-transition portion and a second sub-transition portion connected to each other, and the first sub-transition portion is located between the second sub-transition portion and the bottom portion; The outer peripheral surface of the first sub-transition portion is a concave first curved surface, and the outer peripheral surface of the second sub-transition portion is a convex second curved surface; The first curved surface and the second curved surface are tangent to each other at the connection position; the first curved surface is tangent to the outer peripheral surface of the bottom portion at the connection position, and the second curved surface is tangent to the outer peripheral surface of the top portion at the connection position; The second region comprises a transition region arranged around the periphery of the first region and an edge region arranged around the periphery of the transition region; The first height of the pins located in the transition region is smaller than the first height of the pins located in the edge region; The greater the minimum distance between the center point of the pins located in the transition region and the center point of the pins located in the first region, the greater the first height of the pins located in the transition region.

2. The pin assembly according to claim 1, wherein The first height of all the pins located in the edge region is the same; The first height of all the pins located in the first region is the same; The first height of at least part of the pins located in the transition region is different.

3. The pin assembly according to claim 1, wherein The transition region is arranged in the form of a rectangular ring, and the transition region comprises a top corner sub-region, a first connecting sub-region located between two adjacent top corner sub-regions in a first direction, and a second connecting sub-region located between two adjacent top corner sub-regions in a second direction; The first height of the pins located in the top corner sub-region is greater than the first height of the pins located in the first connecting sub-region and the second connecting sub-region.

4. The thimble assembly of claim 3, wherein, the first height of the pins in the second sub-connection region is less than the first height of the pins in the top corner sub-region and greater than the first height of the pins in the first sub-connection region; the distance between adjacent pins arranged in the first direction is greater than the distance between adjacent pins arranged in the second direction; the transition region is in the shape of an oblong ring, the first direction is the width direction of the transition region, and the second direction is the length direction of the transition region; the first region is an oblong region, the number of pins in the first region is multiple, the long side of the first region is adjacent to the second sub-connection region, and the short side of the first region is adjacent to the first sub-connection region; the number of pins arranged in the second direction in the second sub-connection region is greater than the number of pins arranged in the first direction in the first sub-connection region.

5. The pin assembly according to claim 4, wherein the number of pins in the first region is 2; and the number of pins in the transition region is 10.

6. The pin assembly according to claim 3, wherein the difference between the first height of the pins in the second sub-connection region and the first height of the pins in the top corner sub-region is greater than or equal to 0.8 mm and less than or equal to 1.2 mm; and / or the difference between the first height of the pins in the second sub-connection region and the first height of the pins in the first sub-connection region is greater than or equal to 0.8 mm and less than or equal to 1.2 mm.

7. The pin assembly according to claim 1, wherein the first region is an elliptical region, and the transition region and the edge region are both in the shape of an elliptical ring.

8. The pin assembly according to claim 7, wherein the number of pins in the first region is 2, and the number of pins in the transition region is 6.

9. The pin assembly according to any one of claims 1-8, wherein the top, the transition, and the bottom are all circular in the orthographic projection on the first surface.

10. The pin assembly according to claim 9, wherein the pin further comprises a body, and the body is detachably connected with the support body.

11. The pin assembly according to claim 9, wherein the radius of curvature of the second arc surface is greater than or equal to the radius of curvature of the first arc surface.

12. The pin assembly according to claim 11, wherein in the extension direction of the first height, the height of the top is greater than or equal to 1 mm and less than or equal to 2 mm; and / or the sum of the height of the top and the height of the transition is greater than or equal to 3.5 mm and less than or equal to 5.5 mm; and / or the diameter of the top is greater than or equal to 1.8 mm and less than or equal to 2.2 mm; the diameter of the bottom is greater than or equal to 0.9 mm and less than or equal to 1.1 mm; and / or The curvature radius of the second arc surface is greater than or equal to 1.5 mm and less than or equal to 2 mm, and the curvature radius of the first arc surface is greater than or equal to 1 mm and less than or equal to 1.5 mm.

13. A load bearing mechanism, characterized by, The needle assembly comprises a carrier plate, a plurality of needles arranged on the carrier plate, and a plurality of elastic members arranged between the carrier plate and the plurality of needles. The bearing mechanism further comprises a driving assembly connected with the plurality of needles for driving the plurality of needles to move synchronously along the extension direction of the first height.

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