Integrated circuit test facility for extremely low temperature and high current coupling conditions

Abstract

The present invention discloses an integrated circuit testing mechanism for use under conditions of extreme low temperature and high current coupling, which belongs to the field of integrated circuit testing and includes a main frame, a control box, a power system, a liquid supply system, a sensor and lighting system, and a power supply system. Before the start of the test, the internal temperature of the box is set to a predetermined temperature by controlling the host computer and the box door is closed. After the test starts, the tested integrated circuit is placed on a sample stand in a conversion chamber via a weather-resistant power cord and the conversion chamber door is sealed. After the temperature of the conversion chamber is lowered from room temperature to a predetermined temperature by controlling the host computer, the box door is opened and the tested integrated circuit is transferred to the test platform by a multi-degree-of-freedom manipulator. The present invention can carry out tests of extreme low temperature and high current coupling for the extreme environmental conditions faced by integrated circuits, and study reliability indicators such as IMC diffusion of interconnected solder joints of integrated circuits under conditions of extreme low temperature and high current coupling.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit testing, and in particular to an integrated circuit testing mechanism used under conditions of extreme low temperature and large current coupling. Background Art

[0002] With the rapid advancement of aerospace technology, human exploration of outer space has shifted from Earth orbit to the more distant and complex environment of deep space. Spacecraft encounter various complex and harsh operating environments during deep space exploration, including extreme low temperatures (below -150°C), which pose a severe challenge to the reliability of integrated circuits within spacecraft.

[0003] In integrated circuits, solder joints play the role of electrical connection and support. Relevant research shows that solder joints are the weakest part of integrated circuits, and most integrated circuit failures are caused by solder joint failures. As the integration of integrated circuits becomes higher and higher, their packaging forms are developing in the direction of density and miniaturization. As a result, the size of interconnected solder joints is getting smaller and smaller, which causes the current density flowing through the solder joints to become larger and larger. In addition to facing an extremely low temperature working environment, the integrated circuits carried on spacecraft must also withstand the test of high-density current flowing through the solder joints. A large number of studies have shown that when the current density flowing through the solder joints exceeds 1×10 4 A / cm 2 When the solder joints are connected, electromigration will occur, which can easily lead to failure of the interconnection solder joints.

[0004] Therefore, there is an urgent need for integrated circuit testing institutions that can provide extreme low temperature environments and high current coupling conditions. Summary of the Invention

[0005] The object of the present invention is to provide an integrated circuit test mechanism for use under extremely low temperature and high current coupling conditions, so as to solve the problems in the background technology.

[0006] To solve the above technical problems, the present invention provides an integrated circuit testing mechanism for use under extremely low temperature and high current coupling conditions, comprising:

[0007] The main framework provides the overall architecture for the integrated circuit test organization;

[0008] The control box provides a control system for the integrated circuit test organization through the relevant control host and human-computer interaction peripherals;

[0009] The power system provides a test platform and power source for the integrated circuit test facility, enabling the transfer of integrated circuits within the test facility;

[0010] The liquid supply system provides ultra-low temperature environment conditions for integrated circuit testing institutions.

[0011] In one embodiment, the main frame includes a box body, a conversion chamber and support legs; the box body and the conversion chamber are fixedly connected by bolts, and the support legs are arranged at the bottom outside the box body.

[0012] In one embodiment, the box body includes a low-temperature insulation layer, a thermal insulation layer, a first liquid inlet, a second liquid inlet, a first sample inlet, a box door, a first sealing strip, a transmission port, and an observation window; the conversion chamber includes a third liquid inlet, a second sample inlet, a conversion chamber door, a second sealing strip, a sample placement table, and a third sealing strip;

[0013] The low-temperature thermal insulation layer and the thermal insulation layer are located in the box body, and the thermal insulation layer is located on the inner side of the low-temperature thermal insulation layer, and the thermal insulation layer is filled with aerogel material; a sealing strip is embedded in the box body, and when the box door is closed, it is squeezed with the sealing strip to form a seal;

[0014] The first injection port is provided inside the connection area between the box and the conversion chamber, the box door is located on the outside of the box, the observation window is provided on the front of the box, and the third sealing strip is provided at the second injection port.

[0015] A second sealing strip is provided at the connection interface between the box body and the conversion chamber. The conversion chamber door is provided on the conversion chamber. The sample placement table is provided in the conversion chamber. The third liquid inlet is communicated with the conversion chamber.

[0016] In one embodiment, the control box includes a control host, a human-computer interaction peripheral and an emergency stop button, and the control box is fixedly connected to the box body by bolts;

[0017] The control host is located inside the control box and controls the operation of the test platform, the supply rate of liquid nitrogen and the test temperature during the test;

[0018] The human-computer interaction peripheral provides an operation interface for the test personnel and is connected to the control host. The emergency stop button is located outside the control box.

[0019] In one embodiment, the power system includes a platform support frame, a test platform, a telescopic track and a multi-degree-of-freedom manipulator; the top of the platform support frame is fixedly connected to the test platform by bolts, the bottom of the platform support frame is connected to one end of the telescopic track, and the other end of the telescopic track is fixed to the transmission port by a sealed riveted connection; a transmission belt is embedded in the telescopic track, and the multi-degree-of-freedom manipulator is arranged in the middle position of the test platform.

[0020] In one embodiment, the liquid supply system includes a main liquid supply system and an auxiliary liquid supply system; the main liquid supply system includes a main liquid nitrogen pump, a main liquid supply pipeline 1 and a main liquid supply pipeline 2, and the auxiliary liquid supply system includes an auxiliary liquid nitrogen pump and an auxiliary liquid supply pipeline;

[0021] The main liquid nitrogen pump is arranged on the outer top of the control box, and the auxiliary liquid nitrogen pump is arranged on the outer top of the box body; the auxiliary liquid supply pipeline is connected to the liquid inlet three, the main liquid supply pipeline one is connected to the liquid inlet one, and the main liquid supply pipeline two is connected to the liquid inlet two.

[0022] In one embodiment, the integrated circuit test mechanism further includes a sensing and lighting system and a power supply system;

[0023] The sensing and lighting system is for lighting inside the box, and includes temperature sensors and lighting lamps; the temperature sensors are located at the four inner corners of the box, and the lighting lamps are located at the inner top of the box;

[0024] The power supply system supplies power to the integrated circuit to be tested, and includes a test-specific power supply and a power line; the dedicated power supply and the power line are connected.

[0025] In one embodiment, the power cord is a weather-resistant power cord.

[0026] In one embodiment, the material of the first sealing strip is silicone rubber, and the material of the second sealing strip and the third sealing strip is EPDM rubber.

[0027] In one embodiment, the second main liquid supply pipe is provided with a vent hole, which is connected to the low-temperature insulation layer.

[0028] In an integrated circuit test mechanism for use under extremely low temperature and high current coupling conditions provided by the present invention, before the test begins, the internal temperature of the box is set to a predetermined temperature and the box door is closed by controlling the host. After the test begins, the tested integrated circuit is placed in the conversion chamber sample platform through a weather-resistant power cord and the conversion chamber door is sealed. After the temperature of the conversion chamber is lowered from room temperature to a predetermined temperature by controlling the host, the box door is opened and the tested integrated circuit is transferred to the test platform by a multi-degree-of-freedom manipulator. The use of the conversion chamber can not only save the preparation time for the test, but also gradually reduce the temperature in a small space to prevent instantaneous temperature changes from causing additional damage to the tested integrated circuit. The mechanism of the present invention can carry out extreme low temperature and high current coupling tests for the extreme environmental conditions faced by integrated circuits, and study the reliability indicators of integrated circuit interconnect solder joints under extremely low temperature and high current coupling conditions, such as IMC diffusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1It is a partial cross-sectional view of an integrated circuit test mechanism provided by the present invention for use under extremely low temperature and high current coupling conditions.

[0030] Figure 2 This is a front view of an integrated circuit test mechanism provided by the present invention for use under extremely low temperature and high current coupling conditions.

[0031] Figure 3 This is an enlarged view of the connection between the box body and the conversion chamber.

[0032] Figure 4 This is the front view of the lighting lamp and temperature sensor. DETAILED DESCRIPTION

[0033] The following, combined with the accompanying drawings and specific embodiments, further details the integrated circuit testing mechanism for operating under extremely low temperature and high current coupling conditions proposed by the present invention. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are greatly simplified and not to exact scale, and are intended solely to facilitate and clarify the purpose of illustrating the embodiments of the present invention.

[0034] The present invention provides an integrated circuit test mechanism for use under extremely low temperature and high current coupling conditions, including a main frame, a control box, a power system, a liquid supply system, a sensor and lighting system, and a power supply system. Figures 1 to 4 , Figure 1 A partial cross-sectional view of an integrated circuit test mechanism of the present invention; Figure 2 It is a front view of the integrated circuit test mechanism of the present invention; Figure 3 This is an enlarged view of the connection between the box body and the conversion bin; Figure 4 This is the front view of the lighting lamp and temperature sensor.

[0035] The main frame includes a box 110, a conversion chamber 120, and support legs 130. The box 110 includes a low-temperature insulation layer 111, a thermal insulation layer 112, a liquid inlet 113, a liquid inlet 2 114, a sample inlet 115, a box door 116, a sealing strip 117, a transmission port 118, and an observation window 119. The conversion chamber 120 includes a liquid inlet 3 121, a sample inlet 2 122, a conversion chamber door 123, a sealing strip 2 124, a sample placement platform 125, and a sealing strip 3 126. The support legs 130 are located on the outer bottom of the box 110. The control box includes a control host 210, a human-computer interaction peripheral 220, and an emergency stop button 230. The power system includes a platform support frame 310, a test platform 320, a telescopic track 330, and a multi-degree-of-freedom manipulator 340. The liquid supply system includes a main liquid supply system and a secondary liquid supply system; the main liquid supply system includes a main liquid nitrogen pump 411, a main liquid supply pipeline 1 412, and a main liquid supply pipeline 2 413; the secondary liquid supply system includes a secondary liquid nitrogen pump 421 and a secondary liquid supply pipeline 422. The sensing and lighting system includes a temperature sensor 510 and a lighting lamp 520. The power supply system includes a dedicated power supply 610 for testing and a power cord 620.

[0036] Furthermore, the box body 110 and the conversion chamber 120 are fixedly connected by bolts. The connection interface between the box body 110 and the conversion chamber 120 is provided with the sealing strip 2 124. The sealing strip 117 is embedded in the box body 110. When the box body door 116 is closed, it is squeezed with the sealing strip 117 to form a seal. Figure 3The first liquid inlet 113 is connected to the first main liquid supply pipe 412, the second liquid inlet 114 is connected to the second main liquid supply pipe 413, and the first sample inlet 115 is located inside the connection area between the housing 110 and the conversion chamber 120. The transmission port 118 is fixed to the telescopic rail 330 via a sealing riveted connection, and is used to place the telescopic rail 330. The third liquid inlet 121 is connected to the secondary liquid supply pipe 422, the third sealing strip 126 is located at the second sample inlet 122, and the sample placement platform 125 is located inside the conversion chamber 120. The control box is fixedly connected to the housing 110 via bolts. The control host 210 is located inside the control box and is connected to the human-computer interaction peripheral 220. The emergency stop button 230 is located outside the control box. The top of the platform support frame 310 is fixedly connected to the test platform 320 by bolts, and the bottom of the platform support frame 310 is connected to the telescopic track 330, in which a transmission belt (not shown) is nested. The multi-degree-of-freedom manipulator 340 is located at the middle position of the test platform 320. The main liquid nitrogen pump 411 is located at the upper outer side of the control box, and the auxiliary liquid nitrogen pump 421 is located at the upper outer side of the casing 110. The temperature sensor 510 is located at the inner four corners of the casing 110, and the illuminator 520 is located at the inner upper part of the casing 110. The dedicated power supply 610 is connected to the power cord 620.

[0037] Furthermore, the material of the first sealing strip 117 is silicone rubber, and the material of the second sealing strip 124 and the third sealing strip 126 is EPDM rubber. The insulation layer 112 is filled with aerogel material. The second main liquid supply pipe 413 is provided with a vent. The power cord 620 is a weather-resistant power cord.

[0038] Figure 1This is a schematic diagram of an integrated circuit testing mechanism for use under extreme low temperature and high current coupling conditions, according to the present invention. The tested integrated circuit is packaged in a BGA package. Before the test begins, the tester operates the human-computer interaction peripheral 220, runs the control host 210, places the multi-degree-of-freedom manipulator 340 inside the box 110, closes the box door 116, and activates the main liquid nitrogen pump 411. Liquid is supplied to the interior of the box 110 through the main liquid supply pipe 1 412 and the main liquid supply pipe 2 413. Liquid is also supplied to the low-temperature insulation layer 111 through the vent holes in the main liquid supply pipe 2 413. After a period of liquid supply, the interior of the box 110 reaches the predetermined test conditions. A test connection is made to the BGA integrated circuit via a power cord 620 outside the mechanism, and the power supply 610 is activated to power the BGA integrated circuit. Place the connected BGA integrated circuit on the sample placement table 125, close the conversion chamber door 123, operate the human-computer interaction peripheral 220, run the control host 210, turn on the auxiliary liquid nitrogen pump 421, and supply liquid to the interior of the conversion chamber 120 through the auxiliary liquid supply pipe 422. After maintaining the liquid supply for a period of time, the interior of the conversion chamber 120 reaches the predetermined test conditions, operate the human-computer interaction peripheral 220, run the control host 210, open the box door 116, move the BGA integrated circuit to the test platform 320 through the multi-degree-of-freedom manipulator 340, close the box door 116, and enter the test holding stage.

[0039] During the test hold phase, the temperature inside the box 110 is monitored in real time via temperature sensor 510 and fed back to the control host 210. Lighting 520 maintains a constant brightness inside the box 110, and the tester observes the interior of the box 110 through observation window 119. After the BGA integrated circuit test is completed, the human-computer interaction peripheral 220 is operated to run the control host 210, open the box door 116, and use the multi-degree-of-freedom manipulator 340 to transfer the BGA integrated circuit to the sample stage 125. The multi-degree-of-freedom manipulator 340 is then retracted, the box door 116 is closed, and the transfer chamber door 123 is opened to remove the BGA integrated circuit.

[0040] The package structure of the tested integrated circuit is not limited to the BGA package form, and can be expanded to other types of package structures such as SOP, DIP, CGA, etc.

[0041] The present invention provides an integrated circuit testing mechanism for use under extremely low temperature and high current coupling conditions. A control host 210 is used to control a main liquid nitrogen pump 411, which feeds liquid nitrogen into a box 110 through a first main liquid supply pipe 412 and a second main liquid supply pipe 413. This allows the temperature within the box 110 to reach below -150°C during testing. Vents provided on the second main liquid supply pipe 413 allow liquid nitrogen to flow into a low-temperature insulation layer 111. This, combined with an aerogel-filled insulation layer 112, stabilizes the internal temperature of the box 110. The internal temperature of the box 110 is monitored in real time by a temperature sensor 510. Before the test begins, the internal temperature of the box 110 is set to a predetermined temperature through the control host 210 and the box door 116 is closed. After the test begins, the tested integrated circuit is connected to the conversion chamber sample platform 125 via a weather-resistant power cord 620 and the conversion chamber door 123 is sealed. After the temperature of the conversion chamber 120 is lowered from room temperature to a predetermined temperature through the control host 210, the box door 116 is opened and the tested integrated circuit is transferred to the test platform 320 by the multi-degree-of-freedom manipulator 340. The use of the conversion chamber 120 not only saves test preparation time, but also gradually reduces the temperature in a small space, preventing instantaneous temperature changes from causing additional damage to the tested integrated circuit. The mechanism of the present invention can carry out extreme low temperature and high current coupling tests for the extreme environmental conditions faced by integrated circuits, and study the reliability indicators of integrated circuit interconnect solder joints under extreme low temperature and high current coupling conditions, such as IMC diffusion.

[0042] The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. An integrated circuit test mechanism for use under extremely low temperature and high current coupling conditions, characterized in that: include: The main framework provides the overall architecture for the integrated circuit test organization; The control box provides a control system for the integrated circuit test organization through the relevant control host and human-computer interaction peripherals; The power system provides a test platform and power source for the integrated circuit test facility, enabling the transfer of integrated circuits within the test facility; Liquid supply system, providing ultra-low temperature environment conditions for integrated circuit testing institutions; The main frame includes a box body, a conversion chamber and support legs; the box body and the conversion chamber are fixedly connected by bolts, and the support legs are provided at the bottom outside the box body; The box body includes a low-temperature insulation layer, a thermal insulation layer, a first liquid inlet, a second liquid inlet, a first sample inlet, a box door, a first sealing strip, a transmission port, and an observation window; the conversion chamber includes a third liquid inlet, a second sample inlet, a conversion chamber door, a second sealing strip, a sample placement table, and a third sealing strip; The low-temperature thermal insulation layer and the thermal insulation layer are located in the box body, and the thermal insulation layer is located on the inner side of the low-temperature thermal insulation layer, and the thermal insulation layer is filled with aerogel material; a sealing strip is embedded in the box body, and when the box door is closed, it is squeezed with the sealing strip to form a seal; The first injection port is provided inside the connection area between the box and the conversion chamber, the box door is located on the outside of the box, the observation window is provided on the front of the box, and the third sealing strip is provided at the second injection port. A second sealing strip is provided at the connection interface between the box body and the conversion chamber, the conversion chamber door is provided on the conversion chamber, the sample placement table is provided in the conversion chamber, and the third liquid inlet is communicated with the conversion chamber; The liquid supply system includes a main liquid supply system and an auxiliary liquid supply system; the main liquid supply system includes a main liquid nitrogen pump, a main liquid supply pipeline 1 and a main liquid supply pipeline 2, and the auxiliary liquid supply system includes an auxiliary liquid nitrogen pump and an auxiliary liquid supply pipeline; The main liquid nitrogen pump is arranged on the outer top of the control box, and the auxiliary liquid nitrogen pump is arranged on the outer top of the box body; the auxiliary liquid supply pipeline is connected to the liquid inlet three, the main liquid supply pipeline one is connected to the liquid inlet one, and the main liquid supply pipeline two is connected to the liquid inlet two.

2. The integrated circuit testing mechanism for use under extreme low temperature and high current coupling conditions according to claim 1, characterized in that: The control box includes a control host, human-computer interaction peripherals and an emergency stop button, and the control box is fixedly connected to the box body by bolts; The control host is located inside the control box and controls the operation of the test platform, the supply rate of liquid nitrogen and the test temperature during the test; The human-computer interaction peripheral provides an operation interface for the test personnel and is connected to the control host. The emergency stop button is located outside the control box.

3. The integrated circuit testing mechanism for use under extremely low temperature and high current coupling conditions as claimed in claim 2, characterized in that: The power system includes a platform support frame, a test platform, a telescopic track and a multi-degree-of-freedom manipulator; the top of the platform support frame is fixedly connected to the test platform by bolts, the bottom of the platform support frame is connected to one end of the telescopic track, and the other end of the telescopic track is fixed to the transmission port by a sealed riveted connection; a transmission belt is embedded in the telescopic track, and the multi-degree-of-freedom manipulator is arranged in the middle position of the test platform.

4. The integrated circuit testing mechanism for use under extreme low temperature and high current coupling conditions as claimed in claim 3, characterized in that: The integrated circuit test mechanism also includes a sensing and lighting system and a power supply system; The sensing and lighting system is for lighting inside the box, and includes temperature sensors and lighting lamps; the temperature sensors are located at the four inner corners of the box, and the lighting lamps are located at the inner top of the box; The power supply system supplies power to the integrated circuit to be tested, and includes a test-specific power supply and a power line; the dedicated power supply and the power line are connected.

5. The integrated circuit testing mechanism for use under extreme low temperature and high current coupling conditions as claimed in claim 4, characterized in that: The power cord is a weather-resistant power cord.

6. The integrated circuit testing mechanism for use under extreme low temperature and high current coupling conditions as claimed in claim 5, characterized in that: The material of the first sealing strip is silicone rubber, and the materials of the second sealing strip and the third sealing strip are EPDM rubber.

7. The integrated circuit testing mechanism for use under extreme low temperature and high current coupling conditions according to claim 6, characterized in that: The second main liquid supply pipe is provided with a vent hole, which is communicated with the low-temperature insulation layer.

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