Ultrasonic module, display device and display device manufacturing method

Abstract

The present invention relates to an ultrasonic module, a display device, and a method for manufacturing a display device. The ultrasonic module includes a driving circuit, a receiving electrode layer stacked in sequence, a first ultrasonic component, and at least one second ultrasonic component. The first ultrasonic component includes a first piezoelectric layer and a first transmitting electrode layer; the first transmitting electrode layer is electrically connected to the driving circuit; when the first transmitting electrode layer is energized, the first ultrasonic component is turned on and the first piezoelectric layer generates a first ultrasonic wave; the second ultrasonic component includes a second piezoelectric layer and a second transmitting electrode layer, and the second transmitting electrode layer is electrically connected to the driving circuit; when the second transmitting electrode layer is energized, the second ultrasonic component is turned on and the second piezoelectric layer generates a second ultrasonic wave; the driving circuit is configured to enable the first ultrasonic component to be turned on and change the conduction state of each second ultrasonic component to change the amplitude of the ultrasonic wave generated by the ultrasonic module.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic fingerprint recognition, and in particular to an ultrasonic module, a display device, and a method for manufacturing the display device. Background Art

[0002] As people's awareness of information security grows, more and more display devices are adopting fingerprint recognition technology. To achieve better visual effects, full-screen displays with under-display fingerprint recognition have emerged. Ultrasonic fingerprint recognition, with its strong penetration and excellent recognition performance, has become a key development direction for under-display fingerprint recognition in full-screen displays.

[0003] The existing ultrasonic fingerprint recognition component includes a stacked cover plate, a display substrate, and an ultrasonic module. Among them, the ultrasonic module includes a piezoelectric layer and an electrode layer; the display substrate and the ultrasonic module are sequentially attached under the cover plate. When the driver chip outputs a discontinuous sinusoidal voltage at any time and applies it to the display substrate and the electrode layer, the piezoelectric layer can convert the electrical signal into a discontinuous ultrasonic signal and transmit it, so that when the smart terminal is in black screen state, when the user presses the fingerprint chip sensing area with a long finger, the fingerprint unlocking can successfully wake up the screen. However, since the thickness and material of the cover plates of different manufacturers are different, and the cover plates of different thicknesses and materials will affect the sensitivity of the ultrasonic waves at the cover plates, the thickness of the piezoelectric layer required for the cover plates of different thicknesses and materials is different. This requires the display device to constantly debug and assemble piezoelectric layers of different thicknesses during the preparation of new products, and the whole process is relatively time-consuming. Summary of the Invention

[0004] Based on this, it is necessary to provide an ultrasonic module to address the technical problem that during the preparation of new products of display devices, piezoelectric layers of different thicknesses need to be constantly debugged and assembled, and the entire process is relatively time-consuming.

[0005] An ultrasonic module comprising a driving circuit, a receiving electrode layer stacked in sequence along the thickness direction of the ultrasonic module, a first ultrasonic component, and at least one second ultrasonic component;

[0006] The first ultrasonic component includes a first piezoelectric layer and a first transmitting electrode layer; the first piezoelectric layer is arranged between the receiving electrode layer and the first transmitting electrode layer, and the first transmitting electrode layer is electrically connected to the driving circuit; when the first transmitting electrode layer is energized, the first ultrasonic component is turned on and the first piezoelectric layer generates a first ultrasonic wave;

[0007] The second ultrasonic component includes a second piezoelectric layer and a second emitting electrode layer, the second emitting electrode layer being arranged on a side of the second piezoelectric layer facing away from the first ultrasonic component, and the second emitting electrode layer being electrically connected to a driving circuit; when the second emitting electrode layer is energized, the second ultrasonic component is turned on and the second piezoelectric layer generates a second ultrasonic wave;

[0008] The receiving electrode layer is used to receive the first ultrasonic wave and / or the second ultrasonic wave reflected by the identification object;

[0009] The driving circuit is configured to enable the first ultrasonic component to be conductive and change the conductive state of each of the second ultrasonic components to change the amplitude of the ultrasonic wave generated by the ultrasonic module.

[0010] In one embodiment, the driving circuit includes a control switch and a control circuit; the control switch is electrically connected to the first emitting electrode layer and the second emitting electrode layer, and the control circuit is electrically connected to the first emitting electrode layer and the second emitting electrode layer;

[0011] The control switch can control the first emitting electrode layer and / or the second emitting electrode layer to be energized according to the on-off status of the control circuit.

[0012] In one embodiment, the thickness of the first piezoelectric layer is h1, and h1 satisfies the following conditions:

[0013] 5μm≤h1≤12μm;

[0014] The thickness of the second piezoelectric layer is h2, and h2 satisfies the following conditions:

[0015] 5μm≤h2≤12μm.

[0016] In one embodiment, the h1 is 5 μm; and the h2 is 6 μm or 7 μm.

[0017] In one embodiment, the number of the second ultrasonic components is two, and the two second ultrasonic components are stacked along the thickness direction of the ultrasonic module.

[0018] The present invention also provides a display device, which includes a display substrate and a cover plate, wherein the display substrate is connected to the cover plate; the display device also includes the ultrasonic module described in any one of the above embodiments, wherein the ultrasonic module is connected to the side of the display substrate away from the cover plate, which can solve at least one of the above technical problems.

[0019] The present invention further provides a method for manufacturing a display device, which is used to prepare the above-mentioned display device and can solve at least one of the above-mentioned technical problems. The method is characterized in that the method comprises:

[0020] Providing the cover plate and the display substrate in a stacked arrangement;

[0021] The ultrasonic module is formed on a side of the display substrate away from the cover plate.

[0022] In one embodiment, the manufacturing method further comprises:

[0023] turning on the first ultrasonic component and measuring the basic amplitude of the ultrasonic wave generated by the first ultrasonic component at the cover plate;

[0024] conducting the first ultrasonic component and at least one of the second ultrasonic components, and measuring a comparative amplitude of ultrasonic waves jointly generated by the first ultrasonic component and at least one of the second ultrasonic components at the cover plate;

[0025] The conduction quantity of the second ultrasonic component is determined according to the magnitudes of the basic amplitude and the comparative amplitude.

[0026] In one embodiment, the number of the second ultrasonic components is two, and the two second ultrasonic components are stacked along the thickness direction of the ultrasonic module; the step of conducting the first ultrasonic component and at least one of the second ultrasonic components, and measuring the comparative amplitude of the ultrasonic waves jointly generated by the first ultrasonic component and at least one of the second ultrasonic components at the cover plate specifically includes:

[0027] Conducting the first ultrasonic component and the second ultrasonic component stacked adjacent to the first ultrasonic component, and measuring a first comparative amplitude of ultrasonic waves generated by the first ultrasonic component and the second ultrasonic component stacked adjacent to the first ultrasonic component at the cover plate;

[0028] The first ultrasonic component and the two second ultrasonic components are turned on, and a second comparative amplitude of the ultrasonic wave generated jointly by the first ultrasonic component and the two second ultrasonic components at the cover plate is measured.

[0029] In one embodiment, the step of determining the conduction number of the second ultrasonic component according to the magnitude of the basic amplitude and the comparison amplitude specifically includes:

[0030] If the basic amplitude is greater than or equal to the first comparison amplitude and the second comparison amplitude, the conduction number of the second ultrasonic component is 0;

[0031] If the first comparison amplitude is greater than or equal to the basic amplitude and the second comparison amplitude, the number of conduction of the second ultrasonic component is 1, and the second ultrasonic component stacked adjacent to the first ultrasonic component is conducted;

[0032] If the second comparison amplitude is greater than or equal to the basic amplitude and the first comparison amplitude, the conduction number of the second ultrasonic component is 2.

[0033] When the ultrasonic module is connected to a display substrate and a cover plate to form a display device, when the driving circuit controls the first emitting electrode layer to be energized, the first ultrasonic component is turned on, causing the first piezoelectric layer to generate a first ultrasonic wave. The first ultrasonic wave is emitted to the surface of the identification object and then reflected and received by the receiving electrode layer. When the driving circuit controls the second emitting electrode layer to be energized, the second ultrasonic component is turned on, causing the second piezoelectric layer to generate a second ultrasonic wave. The second ultrasonic wave and the first ultrasonic wave are superimposed and transmitted to the surface of the identification object and then reflected and received by the receiving electrode layer. The driving circuit controls the conduction state of the second ultrasonic component to change the amplitude of the ultrasonic wave generated by the ultrasonic module at the cover plate. The user can ultimately determine the conduction state of the second ultrasonic component based on the change in the amplitude of the ultrasonic wave generated at the cover plate after the second ultrasonic component is turned on. Because the ultrasonic module uses the driving circuit to control the conduction state of the second ultrasonic component to adjust the amplitude of the ultrasonic wave generated at the cover plate, there is no need to constantly adjust and assemble piezoelectric layers of different thicknesses, making the entire display device more time-saving and convenient during the production of new products.

[0034] The present invention also provides a display device, which includes a display substrate and a cover plate, wherein the display substrate is connected to the cover plate; the display device also includes the ultrasonic module described in any one of the above embodiments, wherein the ultrasonic module is connected to the side of the display substrate away from the cover plate, and can achieve at least one of the above technical effects.

[0035] The present invention also provides a method for manufacturing a display device, which is used to prepare the above-mentioned display device and can achieve at least one of the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of an ultrasonic module provided by one embodiment of the present invention being installed on a display device;

[0037] Figure 2 for Figure 1 Schematic diagram of the connection between the ultrasonic module and the ink layer in the display device and the TFT substrate;

[0038] Figure 3 for Figure 1A schematic diagram of the connection between the control switch, the control circuit, the first emitting electrode layer and the second emitting electrode layer in the ultrasonic module shown;

[0039] Figure 4 A schematic diagram of an ultrasonic module provided by a second embodiment of the present invention being mounted on a display device;

[0040] Figure 5 This is a flow chart of a method for manufacturing a display device provided by one embodiment of the present invention.

[0041] Figure numerals: 100 - ultrasonic module; 110 - first ultrasonic component; 111 - first piezoelectric layer; 112 - first emitting electrode layer; 120 - second ultrasonic component; 121 - second piezoelectric layer; 122 - second emitting electrode layer; 130 - receiving electrode layer; 200 - display substrate; 210 - TFT substrate; 211 - first binding area; 212 - second binding area; 220 - adhesive layer; 230 - OLED layer; 300 - cover plate; 400 - ink layer; 500 - control switch; 600 - control circuit. DETAILED DESCRIPTION

[0042] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0045] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0046] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0047] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0048] In a display device manufactured using fingerprint recognition technology, the different thicknesses and materials of the cover plate 300 can affect the ultrasonic sensing amount. However, since each display device has its own design considerations, different display devices require different piezoelectric layer thicknesses in the ultrasonic module 100 to achieve optimal fingerprint recognition. For example, when the thickness of the piezoelectric layer and the emitter electrode layer in the ultrasonic module 100 of the display device is originally set, the corresponding cover plate 300 thickness for optimal drive is 0.5 mm. However, due to design requirements, the thickness of the cover plate 300 in the display device needs to be adjusted to 0.4 mm or 0.6 mm. In this case, the thickness of the piezoelectric layer and the emitter electrode layer in the ultrasonic module 100 needs to be adjusted to achieve optimal drive of the cover plate 300. In the prior art, the optimal drive of the cover plate 300 is achieved by repeatedly adjusting the thickness of the piezoelectric layer and the emitter electrode layer. However, this debugging method makes the entire new product manufacturing process very time-consuming and labor-intensive. Therefore, to address this technical problem, the present invention provides an ultrasonic module.

[0049] See Figures 1-4 , Figure 1 A schematic diagram showing an ultrasonic module 100 provided by an embodiment of the present invention is mounted on a display device; Figure 2 Shown Figure 1 Schematic diagram showing the connection between the ultrasonic module 100, the ink layer 400 and the TFT substrate 210 in the display device; Figure 3 Shown Figure 1 A schematic diagram of the connection between the control switch 500, the control circuit 600, and the first emitting electrode layer 112 and the second emitting electrode layer 122 in the ultrasonic module 100 is shown; Figure 4 FIG. 1 is a schematic diagram showing an ultrasonic module 100 provided by a second embodiment of the present invention being installed on a display device.

[0050] An ultrasonic module provided by an embodiment of the present invention includes a driving circuit, a receiving electrode layer 130 stacked in sequence along the thickness direction of the ultrasonic module, a first ultrasonic component 110 and at least one second ultrasonic component 120. Specifically, the thickness direction of the ultrasonic module is Figure 1 and Figure 4 The first ultrasonic component 110 includes a first piezoelectric layer 111 and a first emitting electrode layer 112. The first piezoelectric layer 111 is disposed between the receiving electrode layer 130 and the first emitting electrode layer 112, and the first emitting electrode layer 112 is electrically connected to a driving circuit. When the first emitting electrode layer 112 is energized, the first ultrasonic component 110 is turned on and the first piezoelectric layer 111 generates a first ultrasonic wave. The second ultrasonic component 120 includes a second piezoelectric layer 121 and a second emitting electrode layer 122. The second emitting electrode layer 122 is disposed on a side of the second piezoelectric layer 121 facing away from the first ultrasonic component 110, and the second emitting electrode layer 122 is electrically connected to the driving circuit. When the second emitting electrode layer 122 is energized, the second ultrasonic component 120 is turned on and the second piezoelectric layer 121 generates a second ultrasonic wave.

[0051] When only the first transmitting electrode layer 112 is conductive, the receiving electrode layer 130 is used to receive the first ultrasonic wave reflected by the identification object; when both the first transmitting electrode layer 112 and the second transmitting electrode layer 122 are conductive, the receiving electrode layer 130 is used to receive the first and second ultrasonic waves transmitted by the identification object. The driving circuit is configured to turn on the first ultrasonic component 110 and change the conductive state of each second ultrasonic component 120 to change the amplitude of the ultrasonic wave generated by the ultrasonic module 100. Specifically, the identification object can be a human finger.

[0052] When the ultrasonic module is connected to the display substrate 200 and the cover plate 300 to form a display device, when the driving circuit controls the first emitting electrode layer 112 to be energized, the first ultrasonic component 110 is turned on, causing the first piezoelectric layer 111 to generate a first ultrasonic wave. The first ultrasonic wave is emitted to the surface of the identification object, reflected, and received by the receiving electrode layer 130. When the driving circuit controls the second emitting electrode layer 122 to be energized, the second ultrasonic component 120 is turned on, causing the second piezoelectric layer 121 to generate a second ultrasonic wave. The second ultrasonic wave and the first ultrasonic wave are superimposed and emitted to the surface of the identification object, reflected, and received by the receiving electrode layer 130. The driving circuit controls the conduction state of the second ultrasonic component 120, thereby changing the amplitude of the ultrasonic wave generated by the ultrasonic module at the cover plate 300. The user can ultimately determine the conduction state of the second ultrasonic component 120 based on the change in the amplitude of the ultrasonic wave generated at the cover plate 300 after the second ultrasonic component 120 is turned on.

[0053] Since the ultrasonic module changes the conduction state of the second ultrasonic component 120 through the control of the driving circuit, thereby adjusting the amplitude of the ultrasonic wave generated at the cover plate 300, there is no need to constantly debug and assemble piezoelectric layers of different thicknesses. The entire display device is more time-saving and convenient during the preparation of new products.

[0054] It should be noted that when the optimal driving combination of the ultrasonic components of the cover 300 is found through the changes in the amplitude of the ultrasonic waves generated at the cover 300, the switching circuit S / W circuit of the driving circuit will be set to fix the on and off of the driving circuit, so that during the later use of the display device, the ultrasonic intensity generated by the ultrasonic module each time is a fixed optimal size.

[0055] See also Figure 1 In one specific embodiment, there are two second ultrasonic assemblies 120, which are stacked along the thickness direction of the ultrasonic module. In another specific embodiment, there is one second ultrasonic assembly 120. Of course, in other embodiments, the number of second ultrasonic assemblies 120 may also be three, four, etc., and this is not particularly limited and can be adaptively modified and adjusted based on the actual thickness of the cover plate 300.

[0056] In one specific embodiment, the emitter electrode layer, the first emitter electrode layer 112, and the second emitter electrode layer 122 are made of ITO (indium tin oxide), which reduces the thickness of the entire ultrasonic module and provides a finer and smoother surface than Ag paste. Of course, in other embodiments, other conductive materials such as Ag paste may also be used.

[0057] The structure of the ultrasonic module is described in detail below.

[0058] See also Figure 3 The driving circuit of the ultrasound module provided in one embodiment of the present invention includes a control switch 500 and a control circuit 600. The control switch 500 is electrically connected to the first emitting electrode layer 112 and the second emitting electrode layer 122, and the control circuit 600 is electrically connected to the first emitting electrode layer 112 and the second emitting electrode layer 122. The control switch 500 can control the power supply to the first emitting electrode layer 112 and / or the second emitting electrode layer 122 by controlling the on / off state of the control circuit 600. By controlling the on / off state of the control switch 500 and the control circuit 600, the power supply to the first emitting electrode layer 112, the power supply to the second emitting electrode layer 122, or the power supply to both the first emitting electrode layer 112 and the second emitting electrode layer 122 can be achieved, which is very simple and convenient.

[0059] In one embodiment, the thickness of the first piezoelectric layer 111 is h1, and h1 satisfies the condition: 5μm≤h1≤12μm. By setting the thickness h1 of the first piezoelectric layer 111 to be greater than or equal to 5μm and less than or equal to 12μm, the thickness of the first piezoelectric layer 111 is within a preferred range, effectively avoiding the situation where the deformation effect of the first piezoelectric layer 111 is poor when the thickness of the first piezoelectric layer 111 is small, thereby making the first ultrasonic wave generated by the first piezoelectric layer 111 less stable; it can also avoid the situation where the thickness of the first piezoelectric layer 111 is large, resulting in a large thickness of the entire ultrasonic module, thereby making the thickness of the final display device large, which does not meet the design concept and requirements of lighter and thinner weight. In one specific embodiment, h1 is 5μm. In another specific embodiment, h1 is 12μm. In another specific embodiment, h1 is 7μm.

[0060] In one embodiment, the thickness of the second piezoelectric layer 121 is h2, and h2 satisfies the condition: 5μm≤h2≤12μm. By setting the thickness h2 of the second piezoelectric layer 121 to be greater than or equal to 5μm and less than or equal to 12μm, the thickness of the second piezoelectric layer 121 is within a preferred range, effectively avoiding the situation where the deformation effect of the second piezoelectric layer 121 is poor when the thickness of the second piezoelectric layer 121 is small, thereby making the second ultrasonic wave generated by the second piezoelectric layer 121 less stable. At the same time, it can also avoid the situation where the thickness of the second piezoelectric layer 121 is large, resulting in a large thickness of the entire ultrasonic module, which in turn makes the thickness of the final display device large, which does not meet the design concept and requirements of lighter and thinner weight. In one specific embodiment, h2 is 5μm. In another specific embodiment, h2 is 12μm. In another specific embodiment, h2 is 7μm.

[0061] In one specific embodiment, h1 is 5 μm. By setting h1 to 5 μm, the first piezoelectric layer 111 can have a relatively thin thickness while achieving a better deformation effect, thus meeting the lightweight design concept.

[0062] In one specific embodiment, h2 is 6 μm, and in another specific embodiment, h2 is 7 μm. By setting h2 to 6 μm or 7 μm, the thickness of the second piezoelectric layer 121 is slightly greater than the thickness of the first piezoelectric layer 111. This configuration not only makes it easier to distinguish the two during processing and preparation, but also ensures that the amplitude of the second ultrasonic wave generated by the second piezoelectric layer 121 is slightly greater than the amplitude of the first ultrasonic wave.

[0063] See also Figure 1 and Figure 3 The number of the second ultrasonic components 120 of the ultrasonic module provided by one embodiment of the present invention is two, and the two second ultrasonic components 120 are stacked along the thickness direction of the ultrasonic module. By setting the number of the second ultrasonic components 120 to two, and stacking the two second ultrasonic components 120 along the thickness direction of the ultrasonic module, specifically, the thickness direction of the ultrasonic module is Figure 1 The yy' direction in the diagram. When the driver circuit changes the conduction state of the second ultrasonic component 120, it can choose to disable the second ultrasonic component 120; it can also choose to enable a second ultrasonic component 120 stacked adjacent to the first ultrasonic component 110; or it can choose to enable both ultrasonic components. This allows for three different amplitudes of the ultrasonic waves generated at the cover plate 300, providing greater selectivity and a higher probability of compatibility with the cover plate 300.

[0064] It should be noted that when only one second ultrasonic component 120 is conducting, the second ultrasonic component 1 adjacent to the first ultrasonic component 110 is generally conducting, rather than the second ultrasonic component 2 adjacent to the ink layer 400. This is because when the middle second ultrasonic component 1 is not conducting, while the lower second ultrasonic component 2 is conducting, the second ultrasonic component 1 forms a structure similar to an air layer, which reduces the intensity of the second ultrasonic wave emitted by the second ultrasonic component 2.

[0065] It should be noted that when there are two second ultrasonic components 120, the ultrasonic module 100 has three piezoelectric layers: the first piezoelectric layer 111, the second piezoelectric layer 1, and the second piezoelectric layer 2. The thicknesses of these three piezoelectric layers can be set to the same, for example, the first piezoelectric layer 111, the second piezoelectric layer 1, and the second piezoelectric layer 2 are all 5 μm thick. Alternatively, they can be set to different, distinct thicknesses, for example, the first piezoelectric layer 111, the second piezoelectric layer 1, and the second piezoelectric layer 2 are 5 μm, 6 μm, and 7 μm thick, respectively, without any particular limitation.

[0066] It should be noted that there is no limit on the number of the second ultrasonic components 120, which can be as follows: Figure 4 The one shown can also be Figure 1 The two shown can of course also be three, four, etc.

[0067] In one specific embodiment, when the number of the second ultrasonic component 120 is one, the driving circuit selects two ultrasonic modules 100 to be turned on, namely the first ultrasonic component 110 , the first ultrasonic component 110 , and the second ultrasonic component 120 .

[0068] In another specific embodiment, when the number of second ultrasonic components 120 is two, the driving circuit selects three ultrasonic modules 100 to be turned on, namely, the first ultrasonic component 110, the first ultrasonic component 110 and the second ultrasonic component 1, and the first ultrasonic component 110 and two second ultrasonic components 120.

[0069] In another specific embodiment, when the number of second ultrasonic components 120 is three, the driving circuit selects four ultrasonic modules 100 to be turned on, namely, the first ultrasonic component 110, the first ultrasonic component 110 and the second ultrasonic component 1, the first ultrasonic component 110 and the second ultrasonic component 1 and the second ultrasonic component 2, and the first ultrasonic component 110 and three second ultrasonic components 120.

[0070] The above-mentioned conduction method can avoid the situation where, when there are two or more second ultrasonic components 120, the middle second ultrasonic component 120 is not conductive and the second ultrasonic components 120 on the lower layer are conductive, the upper non-conductive second ultrasonic components 120 will form a structure similar to an air layer, and this air layer structure will reduce the intensity of the second ultrasonic wave emitted by the lower second ultrasonic component 120.

[0071] See also Figure 1 and Figure 4 The present invention further provides a display device, comprising a display substrate 200 and a cover plate 300, wherein the display substrate 200 is connected to the cover plate 300; the display device further comprises the ultrasonic module 100 described in any of the above embodiments, wherein the ultrasonic module 100 is connected to a side of the display substrate 200 facing away from the cover plate 300. At least one of the above technical effects can be achieved.

[0072] See also Figure 1 and Figure 4 The display substrate 200 of the display device provided by one embodiment of the present invention includes a stacked TFT substrate 210 (TFT: Thin Film Transistor), an adhesive layer 220, and an OLED layer 230 (OLED: Organic Light-Emitting Diode). The ultrasonic module 100 is arranged on the side of the TFT substrate 210 away from the adhesive layer 220, and the OLED layer 230 is arranged below the cover plate 300. The receiving electrode layer 130 is connected to the TFT substrate 210. A first binding area 211 and at least one second binding area 212 are provided on the TFT substrate 210. The first emitting electrode layer 112 is connected to the first binding area 211, and each second emitting electrode layer 122 is respectively connected to one of the second binding areas 212.

[0073] See also Figure 1 and Figure 4 The display device provided by one embodiment of the present invention further includes an ink layer 400 . The ink layer 400 is disposed on a side of the ultrasonic module 100 facing away from the display substrate 200 .

[0074] See also Figure 5 The present invention further provides a method for manufacturing a display device, which is used to manufacture the display device described in the above embodiment, and the manufacturing method includes:

[0075] S10: providing a cover plate 300 and a display substrate 200 that are stacked.

[0076] S20 : ​​forming an ultrasonic module 100 on a side of the display substrate 200 facing away from the cover plate 300 .

[0077] After providing a stacked cover plate 300 and display substrate 200, an ultrasonic module 100 is formed on the side of the display substrate 200 facing away from the cover plate 300. When the transmitting electrode layer of the ultrasonic module 100 is energized, the piezoelectric layer generates corresponding ultrasonic waves, and the receiving electrode layer 130 receives the ultrasonic waves reflected back from the identification object. Specifically, the identification object can be a human finger.

[0078] It should be noted that the thickness of the piezoelectric layer of each ultrasonic component in the ultrasonic module 100 of the present display device is usually pre-set with several sets of commonly used thicknesses. The intensity of the ultrasonic waves generated by these sets of preset thicknesses is estimated. If, during the preparation process, it is found that the intensity and induction of the ultrasonic waves generated by the ultrasonic module 100 at the cover plate 300 are not good, piezoelectric layers of other thicknesses are selected for preparation and testing. Compared with the method of constantly debugging and assembling piezoelectric layers of different thicknesses, this method reduces the number of times of debugging and assembling piezoelectric layers of different thicknesses, and the entire display device is more time-saving and convenient in the process of preparing new products.

[0079] In one embodiment, the manufacturing method further comprises:

[0080] S30 : Turning on the first ultrasonic component 110 and measuring the basic amplitude of the ultrasonic wave generated by the first ultrasonic component 110 at the cover plate 300 .

[0081] When the driving circuit controls the first emitting electrode layer 112 to be energized, the first ultrasonic component 110 is turned on, thereby causing the first piezoelectric layer 111 to generate a first ultrasonic wave. The first ultrasonic wave passes through the display substrate 200 and reaches the cover plate 300. The basic amplitude of the ultrasonic wave generated by the first ultrasonic component 110 at the cover plate 300 is measured using an oscilloscope.

[0082] S40 : Turning on the first ultrasonic component 110 and the at least one second ultrasonic component 120 , and measuring the comparative amplitude of the ultrasonic waves jointly generated by the first ultrasonic component 110 and the at least one second ultrasonic component 120 at the cover plate 300 .

[0083] When the driving circuit controls the first emitting electrode layer 112 and the second emitting electrode layer 122 to be energized, the first ultrasonic component 110 is turned on, causing the first piezoelectric layer 111 to generate a first ultrasonic wave and the second piezoelectric layer 121 to generate a second ultrasonic wave. The first and second ultrasonic waves then pass through the display substrate 200 and reach the cover plate 300. The basic amplitude of the ultrasonic wave formed by the superposition of the first and second ultrasonic waves at the cover plate 300 is measured using an oscilloscope.

[0084] S50: Determine the conduction number of the second ultrasonic component 120 according to the basic amplitude and the comparative amplitude.

[0085] The number of second ultrasonic components 120 that are turned on is ultimately determined based on the base amplitude and the comparison amplitude. Specifically, when the base amplitude is greater than or equal to the comparison amplitude, the number of second ultrasonic components 120 that are turned on is zero; when the base amplitude is less than the comparison amplitude, the second ultrasonic components 120 that generate the comparison amplitude are turned on.

[0086] In one embodiment, the number of the second ultrasonic components 120 is two, and the two second ultrasonic components 120 are stacked along the thickness direction of the ultrasonic module 100; step S40 specifically includes:

[0087] The first ultrasonic component 110 and the second ultrasonic component 120 stacked adjacent to the first ultrasonic component 110 are turned on, and a first comparative amplitude of the ultrasonic waves generated by the first ultrasonic component 110 and the second ultrasonic component 120 stacked adjacent to the first ultrasonic component 110 at the cover plate 300 is measured.

[0088] When there are two second ultrasonic components 120 , the first ultrasonic component 110 and the second ultrasonic component 120 stacked adjacent to the second ultrasonic component 120 can be turned on first, and then the first comparative amplitude at the cover plate 300 can be measured by an oscilloscope.

[0089] The first ultrasonic component 110 and the two second ultrasonic components 120 are turned on, and a second comparative amplitude of the ultrasonic waves generated by the first ultrasonic component 110 and the two second ultrasonic components 120 at the cover plate 300 is measured.

[0090] After the first comparative amplitude is measured, the first ultrasonic component 110 and the two second ultrasonic components 120 are turned on, and then the second comparative amplitude at the cover plate 300 is measured by an oscilloscope.

[0091] In one embodiment, step S50 specifically includes:

[0092] If the basic amplitude is greater than or equal to the first comparison amplitude and the second comparison amplitude, the conduction number of the second ultrasonic component 120 is 0; if the first comparison amplitude is greater than or equal to the basic amplitude and the second comparison amplitude, the conduction number of the second ultrasonic component 120 is 1, and the second ultrasonic component 120 stacked and adjacent to the first ultrasonic component 110 is conducted; if the second comparison amplitude is greater than or equal to the basic amplitude and the first comparison amplitude, the conduction number of the second ultrasonic component 120 is 2.

[0093] The basic amplitude, the first comparative amplitude, and the second comparative amplitude are measured by an oscilloscope, and then the sizes of the basic amplitude, the first comparative amplitude, and the second comparative amplitude are compared to determine the conduction status of the second ultrasonic component 120, thereby selecting the best driving combination of the ultrasonic module 100 for the cover plates 300 of different materials and thicknesses, avoiding the situation of constantly debugging and assembling piezoelectric layers of different thicknesses to find the best driving combination. The entire display device is more time-saving and convenient in the process of preparing new products.

[0094] It should be noted that in other embodiments, not only the amplitude of the ultrasonic waves generated at the cover plate 300 needs to be considered, but also the duration of the high amplitude. In one specific embodiment, the optimal ultrasonic drive of the ultrasonic module 100 relative to the cover plate 300 is to maintain the Vp-p at the plateau for a long period of time.

[0095] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. An ultrasonic module, characterized in that: It comprises a driving circuit, a receiving electrode layer (130) stacked in sequence along the thickness direction of the ultrasonic module, a first ultrasonic component (110), and at least one second ultrasonic component (120); The first ultrasonic component (110) comprises a first piezoelectric layer (111) and a first emitting electrode layer (112); the first piezoelectric layer (111) is arranged between the receiving electrode layer (130) and the first emitting electrode layer (112), and the first emitting electrode layer (112) is electrically connected to the driving circuit; when the first emitting electrode layer (112) is energized, the first ultrasonic component (110) is turned on and the first piezoelectric layer (111) generates a first ultrasonic wave; The second ultrasonic component (120) comprises a second piezoelectric layer (121) and a second emitting electrode layer (122); the second emitting electrode layer (122) is arranged on a side of the second piezoelectric layer (121) facing away from the first ultrasonic component (110), and the second emitting electrode layer (122) is electrically connected to a driving circuit; when the second emitting electrode layer (122) is energized, the second ultrasonic component (120) is turned on and the second piezoelectric layer (121) generates a second ultrasonic wave; The receiving electrode layer (130) is used to receive the first ultrasonic wave and / or the second ultrasonic wave reflected by the identification object; The driving circuit is configured to enable the first ultrasonic component (110) to be turned on, and to change the conduction state of each of the second ultrasonic components (120) to change the amplitude of the ultrasonic wave generated by the ultrasonic module.

2. The ultrasonic module according to claim 1, characterized in that: The driving circuit comprises a control switch (500) and a control circuit (600); the control switch (500) is electrically connected to the first emitting electrode layer (112) and the second emitting electrode layer (122); and the control circuit (600) is electrically connected to the first emitting electrode layer (112) and the second emitting electrode layer (122); The control switch (500) can control the first emitting electrode layer (112) and / or the second emitting electrode layer (122) to be energized according to the on-off condition of the control circuit (600).

3. The ultrasonic module according to claim 1, characterized in that: The thickness of the first piezoelectric layer (111) is h1, and h1 satisfies the following conditions: 5μm≤h1≤12μm; The thickness of the second piezoelectric layer (121) is h2, and h2 satisfies the condition: 5μm≤h2≤12μm.

4. The ultrasonic module according to claim 3, characterized in that: The h1 is 5 μm; the h2 is 6 μm or 7 μm.

5. The ultrasonic module according to any one of claims 1 to 4, characterized in that: The number of the second ultrasonic components (120) is two, and the two second ultrasonic components (120) are stacked along the thickness direction of the ultrasonic module.

6. A display device, characterized in that: The display device comprises a display substrate (200) and a cover plate (300), wherein the display substrate (200) is connected to the cover plate (300); the display device further comprises an ultrasonic module (100) according to any one of claims 1 to 5, wherein the ultrasonic module (100) is connected to a side of the display substrate (200) facing away from the cover plate (300).

7. A method for manufacturing a display device, for manufacturing the display device according to claim 6, characterized in that: The production method comprises: Providing the cover plate (300) and the display substrate (200) that are stacked; The ultrasonic module (100) is formed on a side of the display substrate (200) that is away from the cover plate (300).

8. The production method according to claim 7, characterized in that: The production method further comprises: turning on the first ultrasonic component (110) and measuring the basic amplitude of the ultrasonic wave generated by the first ultrasonic component (110) at the cover plate (300); Conducting the first ultrasonic component (110) and at least one of the second ultrasonic components (120), and measuring the comparative amplitude of ultrasonic waves generated by the first ultrasonic component (110) and at least one of the second ultrasonic components (120) at the cover plate (300); The conduction quantity of the second ultrasonic component (120) is determined according to the magnitudes of the basic amplitude and the comparative amplitude.

9. The production method according to claim 8, characterized in that: The number of the second ultrasonic components (120) is two, and the two second ultrasonic components (120) are stacked along the thickness direction of the ultrasonic module (100); the step of conducting the first ultrasonic component (110) and at least one of the second ultrasonic components (120), and measuring the comparative amplitude of the ultrasonic waves jointly generated by the first ultrasonic component (110) and at least one of the second ultrasonic components (120) at the cover plate (300) specifically comprises: Conducting the first ultrasonic component (110) and the second ultrasonic component (120) stacked adjacent to the first ultrasonic component (110), and measuring a first comparative amplitude of ultrasonic waves generated jointly by the first ultrasonic component (110) and the second ultrasonic component (120) stacked adjacent to the first ultrasonic component (110) at the cover plate (300); The first ultrasonic component (110) and the two second ultrasonic components (120) are turned on, and a second comparative amplitude of ultrasonic waves generated jointly by the first ultrasonic component (110) and the two second ultrasonic components (120) at the cover plate (300) is measured.

10. The manufacturing method according to claim 9, characterized in that: The step of determining the conduction number of the second ultrasonic component (120) according to the magnitude of the basic amplitude and the comparative amplitude specifically comprises: If the basic amplitude is greater than or equal to the first comparison amplitude and the second comparison amplitude, the conduction quantity of the second ultrasonic component (120) is 0; If the first comparison amplitude is greater than or equal to the basic amplitude and the second comparison amplitude, the conduction number of the second ultrasonic component (120) is 1, and the second ultrasonic component (120) stacked adjacent to the first ultrasonic component (110) is conducted; If the second comparison amplitude is greater than or equal to the basic amplitude and the first comparison amplitude, the conduction number of the second ultrasonic component (120) is 2.

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