Display panel and display device

Abstract

The embodiment of the present invention discloses a display panel and a display device, wherein the display panel includes a display area, a bending area and a binding area, wherein the binding area is bent along the bending area to the non-light-emitting side of the display area, and a driver chip is arranged in the binding area, and the display panel also includes a padding block arranged between the display area and the binding area along the thickness direction of the display panel, wherein at least one heat dissipation structure is arranged in the padding block, and the heat dissipation structure and the driver chip at least partially overlap along the thickness direction of the display panel. The above technical solution improves the heat dissipation effect of the driver chip by arranging a heat dissipation structure in the padding block between the display area and the binding area, and the heat dissipation structure and the driver chip at least partially overlap along the thickness direction of the display panel, thereby conducting away the heat generated during the operation of the driver chip through the heat dissipation structure.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In existing display products, the heat generated by the driver chip during operation cannot be dissipated in time, and the heat dissipation performance of the driver chip is poor, which affects the working performance and life of the driver chip. Summary of the invention

[0003] The embodiments of the present invention provide a display panel and a display device, which improve the heat dissipation effect of the driving chip and enhance the display effect of the display panel by arranging a heat dissipation structure at a position corresponding to the driving chip.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, comprising a display area, a bending area and a binding area, wherein the binding area is bent along the bending area to a non-light emitting side of the display area, and a driving chip is disposed in the binding area;

[0005] The display panel further comprises a spacer block disposed between the display area and the binding area along the thickness direction of the display panel; at least one heat dissipation structure is disposed in the spacer block;

[0006] Along the thickness direction of the display panel, the heat dissipation structure and the driving chip at least partially overlap.

[0007] In a second aspect, an embodiment of the present invention further provides a display device, comprising the display panel described in the first aspect.

[0008] The display panel provided by the present invention includes a padding block arranged between a display area and a binding area, and at least one heat dissipation structure is arranged in the padding block. Along the thickness direction of the display panel, the heat dissipation structure and the driving chip at least partially overlap, that is, at least one heat dissipation structure is also arranged at a position corresponding to the driving chip in the padding block. The heat accumulated at the position of the driving chip is exported through the heat dissipation structure, thereby improving the heat dissipation effect of the driving chip and improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, although the drawings described below are some specific embodiments of the present invention, for those skilled in the art, the basic concepts of the device structure, driving method and manufacturing method disclosed and suggested by the various embodiments of the present invention can be expanded and extended to other structures and drawings, and there is no doubt that these should be within the scope of the claims of the present invention.

[0010] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0011] Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction;

[0012] Figure 3 It is a structural schematic diagram of a heightening block provided by an embodiment of the present invention;

[0013] Figure 4 is a schematic structural diagram of another pad block provided by an embodiment of the present invention;

[0014] Figure 5 is a schematic structural diagram of another pad block provided by an embodiment of the present invention;

[0015] Figure 6 It is a schematic diagram of a top view of a heightening block provided by an embodiment of the present invention;

[0016] Figure 7 is a schematic diagram of a top view of another type of padding block provided by an embodiment of the present invention;

[0017] Figure 8 yes Figure 1 Another schematic diagram of the cross-section structure along the A-A' direction;

[0018] Fig. 9 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described through implementation methods with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the basic concepts disclosed and suggested by the embodiments of the present invention, all other embodiments obtained by those skilled in the art are within the scope of protection of the present invention.

[0020] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention, Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction. Figure 1 and Figure 2The display panel includes a display area AA, a bending area AB and a binding area AC. The binding area AC is bent along the bending area AB to the non-light-emitting side of the display area AA, and a driver chip 10 is arranged in the binding area AC. The display panel also includes a padding block 20 arranged between the display area AA and the binding area AC along the thickness direction of the display panel. At least one heat dissipation structure 21 is arranged in the padding block 20. Along the thickness direction of the display panel, the heat dissipation structure 21 at least partially overlaps with the driver chip 10.

[0021] For details, see Figure 2 The display panel may include a flexible substrate 30, which may be a flexible polymer material, such as polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) to ensure that the display panel can be bent.

[0022] The flexible substrate 30 may include a display area AA, a bending area AB and a binding area AC, wherein the display area AA includes a plurality of display devices (not shown in the figure), and the binding area AC includes various metal traces, various interfaces and circuit structures connected in the display area AA, such as a VT test port, an ESD protection structure, a power signal line, etc. Specifically, a driver chip 10 is provided in the binding area AC, and the driver chip 10 can be provided on a side of the flexible substrate 30 close to the non-light-emitting side. The display function or touch function of the display panel can be controlled by the driver chip 10 to achieve normal display of the display panel. Then, the binding area AC is bent along the bending area AB to the non-light-emitting side of the display area AA through the flexible substrate 30, so that the area of ​​the lower step area or the fan-out area of ​​the display device can be reduced, thereby reducing the proportion of the non-display area, improving the screen-to-body ratio of the display panel, and realizing a narrow frame of the display panel.

[0023] It is understandable that there is usually a certain blank area between the film layers of the display area AA and the binding area AC, which will cause the plane where the display area AA of the display panel is located to intersect with the plane where the binding area AC is located, and then during the binding process of the binding area AC, the film layer on the display panel is damaged due to uneven force. Therefore, by setting a padding block 20 between the display area AA and the binding area AC, and along the thickness direction of the display panel, the padding block 20 is staggered with the bending area AB, and the padding block 20 is used to compensate for the difference in film thickness between the display area AA and the binding area AC, so that the plane where the display area AA is located is parallel to the plane where the binding area AC is located, ensuring that the film layer on the display panel is uniformly stressed during the binding process. In addition, the padding block 20 can have a certain hardness to prevent the display panel from being squeezed and deformed, and / or the padding block 20 can have a certain elasticity to prevent the display panel from being damaged due to local stress.

[0024] In the prior art, the material of the pad block 20 is usually polyethylene terephthalate (PET), which has poor thermal conductivity, low thermal conductivity, and poor heat dissipation effect. In the COP (Chip on Panel) solution, the driver chip is bound to the display panel and is located on the non-light-emitting side of the display panel. Due to the material limitation of the pad block 20, the pad block 20 located between the display area AA and the binding area AC cannot dissipate heat for the driver chip in time, which will cause heat to accumulate at the driver chip, causing the position of the display panel corresponding to the driver chip to have a color cast problem when displaying. To this end, the embodiment of the present invention arranges at least one heat dissipation structure 21 in the pad block 20, and along the thickness direction of the display panel, the heat dissipation structure 21 at least partially overlaps with the driver chip 10, and then the heat dissipation structure 21 arranged directly above the driver chip 10 is used to export the heat accumulated at the position of the driver chip 10, thereby improving the heat dissipation effect of the driver chip 10. In the COP solution, the heat at the position corresponding to the driver chip 10 on the display panel can be dissipated in time, thereby improving the color cast problem of the display panel.

[0025] It should be noted that the embodiment of the present invention may also include a first support layer 30 and a second support layer 40 located between the display area AA and the binding area AC. The first support layer 30 may be located on the side of the padding block 20 close to the display area AA, and the second support layer 40 may be located on the side of the padding block 20 close to the binding area AA. The padding block 20 may be located between the first support layer 30 and the second support layer 40, wherein the first support layer 30 and the second support layer 40 are used to support the display panel, and a foam structure 50 is also provided on the side of the first support layer 30 close to the padding block 20. The foam structure 50 can absorb external impact force and play a buffering role. In addition, the display panel also includes other structures required for the normal operation of the display panel, which will not be described one by one here.

[0026] It is understandable that the second support layer 40 and the flexible substrate 30 between the driver chip 10 and the padding block 20 in the above structure are thinner and can be made of materials with good thermal conductivity, thereby having little effect on the heat dissipation effect of the driver chip 10 .

[0027] In summary, the display panel provided by the embodiment of the present invention, by setting at least one heat dissipation structure in the pad block, the heat dissipation structure and the driver chip at least partially overlap along the thickness direction of the display panel, that is, by setting the heat dissipation structure at least at the position corresponding to the driver chip in the pad block, the heat accumulated on the driver chip is exported through at least one heat dissipation structure, thereby improving the heat dissipation effect of the driver chip. At the same time, in the COP scheme, since the heat dissipation effect of the driver chip is improved, the heat at the driver chip position can be exported in time, thereby improving the color cast problem caused by heat accumulation at the driver chip position in the display panel.

[0028] It should be noted that, along the thickness direction of the display panel, the heat dissipation structure 21 and the driver chip 10 at least partially overlap, that is, the heat dissipation structure 21 can be set only at the position of the padding block 20 corresponding to the driver chip 10, or the heat dissipation structure 21 can be set at the position of the padding block 20 corresponding to the driver chip 10, as well as at other positions. The setting method of the heat dissipation structure 21 is described below in conjunction with a specific embodiment.

[0029] Optional, Figure 3 is a structural schematic diagram of a heightening block provided by an embodiment of the present invention, Figure 4 is a schematic diagram of the structure of another pad block provided in an embodiment of the present invention, see Figure 3 and Figure 4 The pad block 20 includes a substrate layer 22, a first adhesive layer 23 and a second adhesive layer 24. The substrate layer 22 is located between the first adhesive layer 23 and the second adhesive layer 24. Along the thickness direction of the display panel, the heat dissipation structure 21 at least penetrates the substrate layer 22.

[0030] Specifically, the padding block 20 includes a first adhesive layer 23, a second adhesive layer 24, and a substrate layer 22 located between the first adhesive layer 23 and the second adhesive layer 24. Along the thickness direction of the display panel, the first adhesive layer 23, the second adhesive layer 24 and the substrate layer 22 can be overlapped. In addition, the padding block 20 also includes a protective film located on the side of the first adhesive layer 23 away from the substrate layer 22, and a release film located on the side of the second adhesive layer 24 away from the substrate layer 22. When the padding block 20 is set in the blank area, the padding block 20 is set between the foam structure 50 and the second support layer 40 by removing the protective film and the release film, and the padding block 21 is fixed by the first adhesive layer 23 and the second adhesive layer 24. The material of the substrate layer 22 can be polyethylene terephthalate (PET), and the first adhesive layer 23 and the second adhesive layer 24 can be pressure-sensitive adhesives. The padding block 20 is bonded between the second support layer 40 and the foam structure 50 through short-term low-pressure surface contact. The heat dissipation structure 21 is arranged in the padding block 20, wherein the heat dissipation structure 21 can be a whole layer structure, that is, only one heat dissipation structure 21 is arranged in the padding block 20, and along the thickness direction of the display panel, the whole heat dissipation structure 21 at least partially overlaps with the driving chip 10. At this time, since the heat dissipation structure 21 is a whole block structure, if the heat dissipation structure 21 completely penetrates the first adhesive layer 23 and the second adhesive layer 24, it will cause insufficient adhesion of the padding block 20 and easily separate from the second supporting layer 40 and the foam structure 50. Therefore, by setting the heat dissipation structure 21 along the thickness direction of the display panel, at least penetrate the substrate layer 22, such as Figure 3 As shown, the heat dissipation structure 21 can only penetrate the substrate layer 22, so that the heat dissipation effect of the driver chip can be improved, and the process is simple and easy to implement, or as shown in FIG. Figure 4As shown, the heat dissipation structure 21 completely penetrates the substrate layer 22 and may partially penetrate the first adhesive layer 23 and the second adhesive layer 24 , thereby ensuring the adhesion between the first adhesive layer 23 and the second adhesive layer 24 while further improving the heat dissipation effect of the driver chip.

[0031] Optional, continue to see Figure 2 and Figure 4 , the heat dissipation structure 21 is embedded in the first adhesive layer 23, the thickness of the heat dissipation structure 21 embedded in the first adhesive layer 23 is h1, the thickness of the first adhesive layer 23 is h2, wherein h1 / h2≤2 / 3, and / or, the heat dissipation structure 21 is embedded in the second adhesive layer 24, the thickness of the heat dissipation structure 21 embedded in the second adhesive layer 24 is h2, the thickness of the second adhesive layer 24 is h4, wherein h3 / h4≤2 / 3.

[0032] Specifically, when the heat dissipation structure 21 is a whole layer structure, if the heat dissipation structure 21 only penetrates the substrate layer 22, the heat dissipation structure 21 needs to transfer heat through the whole second adhesive layer 24, and then absorb the heat accumulated on the driver chip 10, and the heat dissipation efficiency is poor. Therefore, on the basis that the heat dissipation structure 21 completely penetrates the substrate layer 22, part of the heat dissipation structure 21 can also be embedded in the second adhesive layer 24, which reduces the distance between the heat dissipation structure 21 and the driver chip 10, and can timely absorb the heat of the driver chip 10. Further, the thickness of the heat dissipation structure 21 embedded in the second adhesive layer 24 is recorded as h3, and the thickness of the second adhesive layer 24 is recorded as h4, then h3 / h4≤2 / 3, that is, the thickness of the heat dissipation structure 21 embedded in the second adhesive layer 24 needs to be less than or equal to two-thirds of the thickness of the second adhesive layer 23. In this way, on the basis of improving the heat dissipation effect of the driver chip 10, the adhesion between the first adhesive layer 23 and the second adhesive layer 24 is guaranteed.

[0033] Furthermore, part of the heat dissipation structure 21 can also be embedded in the first adhesive layer 23, and then the heat absorbed by the heat dissipation structure 21 can be conducted out through the thinned first adhesive layer 23. The thickness of the heat dissipation structure 21 embedded in the first adhesive layer 23 is h1, and the thickness of the first adhesive layer 23 is h2, then h1 / h2≤2 / 3, that is, the thickness of the heat dissipation structure 21 embedded in the first adhesive layer 23 needs to be less than or equal to two-thirds of the thickness of the second adhesive layer 24. In this way, on the basis of improving the heat dissipation effect of the driver chip, the adhesion between the first adhesive layer 23 and the second adhesive layer 24 is guaranteed. In addition, the heat dissipation structure 21 can also be embedded in the first adhesive layer 23 and the second adhesive layer 24 at the same time, and then through the thinned first adhesive layer 23 and the second adhesive layer 24, on the basis of improving the heat dissipation effect of the driver chip, the adhesion between the first adhesive layer 23 and the second adhesive layer 24 is guaranteed.

[0034] It can be understood that the above content describes the case where the heat dissipation structure 21 is a whole-layer structure, and the following describes the case where the heat dissipation structure 21 includes multiple heat dissipation sub-parts in combination with the embodiment.

[0035] Optional, Figure 5 is a schematic diagram of the structure of another pad block provided in an embodiment of the present invention, see Figure 2 and Figure 5 The heat dissipation structure 21 includes a plurality of independently arranged first heat dissipation divisions 210. Along the thickness direction of the display panel, the first heat dissipation divisions 210 at least partially overlap with the driving chip 10, and the first heat dissipation divisions 210 penetrate the first adhesive layer 23, the substrate layer 22 and the second adhesive layer 24.

[0036] Specifically, when the heat dissipation structure 21 includes multiple independent first heat dissipation divisions 210, that is, there are intervals between adjacent first heat dissipation divisions 210, at this time, the first heat dissipation division 210 can be set to completely penetrate the first adhesive layer 23, the substrate layer 22 and the second adhesive layer 24 along the thickness direction of the display panel, so that the first heat dissipation division 210 can directly contact the second supporting layer 40, which greatly improves the heat dissipation effect of the driving chip 10. At the same time, the padding block 20 is fixed between the second supporting layer 40 and the foam structure 50 through the first adhesive layer 23 and the second adhesive layer 24 located between the adjacent first heat dissipation divisions 210, which ensures the adhesiveness of the padding block 20, that is, while satisfying the bonding and supporting functions, the heat dissipation effect of the driving chip 10 is further improved.

[0037] Based on the above embodiments, continue to refer to Figure 2 and Figure 5 , multiple first heat dissipation divisions 210 are evenly spaced and arranged along the first direction X, and the first direction X is parallel to the extension direction of the long side of the driver chip 10. Specifically, multiple first heat dissipation divisions 210 completely penetrate the first adhesive layer 23, the substrate layer 22, and the second adhesive layer 24, and multiple first heat dissipation divisions 210 are evenly spaced and arranged along the extension direction of the long side of the driver chip 10, so that the heat dissipation at the position corresponding to the driver chip 10 in the padding block 20 is uniform, ensuring that the display effect at the position corresponding to the driver chip 10 in the display panel is better.

[0038] For further information, see Figure 5, along the first direction X, the width of the first heat dissipation division 210 is D1, and the spacing between two adjacent first heat dissipation divisions 210 is D2, wherein D1=D2. Specifically, when the heat dissipation structure 21 includes multiple independent first heat dissipation divisions 210, and the multiple independent first heat dissipation divisions 210 completely penetrate the first adhesive layer 23, the substrate layer 22, and the second adhesive layer 24, since the first heat dissipation division 210 is in direct contact with the second support layer 40, the heat dissipation effect of the driver chip 10 can be further improved. The larger the contact area between the first heat dissipation division 210 and the second support layer 40, the better the heat dissipation effect of the driver chip 10. However, the spacing between adjacent first heat dissipation divisions 210 cannot be too small. Too small spacing will result in a smaller contact area between the first adhesive layer 23 and the foam structure 50, or a smaller contact area between the second adhesive layer 24 and the second support layer 40, thereby resulting in a poor bonding effect of the pad 20. To this end, the width of the first heat dissipation division 210 is recorded as D1, and the distance between two adjacent first heat dissipation divisions 210 is recorded as D2, wherein D1=D2, that is, the width of the first heat dissipation division 210 is equal to the distance between two adjacent first heat dissipation divisions 210. In this way, while further improving the heat dissipation effect of the driver chip 10, the bonding effect of the pad block 20 is guaranteed.

[0039] It is understandable that the above content describes that the heat dissipation sub-unit is only provided at the position corresponding to the driver chip 10 . The following specifically describes the case where the heat dissipation sub-unit is provided at the position corresponding to the driver chip 10 and at other positions of the pad block 20 .

[0040] Optional, Figure 6 is a schematic diagram of a top view of a cushion block provided by an embodiment of the present invention, see Figure 2 and Figure 6 The heat dissipation structure 21 includes a plurality of first heat dissipation structures 220 and a plurality of second heat dissipation structures 230. The area where the padding block 20 is located includes a first padding area 201 and a second padding area 202. Along the thickness direction of the display panel, the first padding area 201 overlaps with the driver chip 10, and the second padding area 202 does not overlap with the driver chip 10. The first heat dissipation structure 220 is located in the first padding area 201, and the second heat dissipation structure 230 is located in the second padding area 202. Within a unit area, the coverage area of ​​the first heat dissipation structure 220 in the first padding area 201 is greater than the coverage area of ​​the second heat dissipation structure 230 in the second padding area 202.

[0041] For details, see Figure 2 and Figure 6The padding block 20 is divided into two areas, namely, a first padding area 201 in the padding block 20 that completely overlaps with the driver chip 10 along the thickness direction of the display panel, and a second padding area 202 in the padding block 20 that is staggered from the driver chip 10. The first padding area 201 includes a plurality of first heat dissipation structures 220, and the second padding area 202 includes a plurality of second heat dissipation structures 230. The second padding area 202 can surround the first padding area 201. Since the driver chip 10 needs to control the display function or touch function of the display panel, the second elevated area 202 in the elevated block 20 that is staggered from the driver chip 10 has a smaller heat dissipation requirement than the first elevated area 201 in the elevated block 20 that completely overlaps with the driver chip 10. Therefore, within a unit area, the coverage area of ​​the first heat dissipation structure 220 in the first elevated area 201 can be set to be larger than the coverage area of ​​the second heat dissipation structure 230 in the second elevated area 202. In this way, while improving the heat dissipation effect of the driver chip 10, the heat dissipation effect of other electrical components at the position corresponding to the elevated block 20 in the display panel can also be improved.

[0042] It should be noted that within a unit area, the coverage area of ​​the first heat dissipation structure 220 in the first elevated area 201 is greater than the coverage area of ​​the second heat dissipation structure 230 in the second elevated area 202, which can be understood as within a unit area, the proportion of the first heat dissipation structure 220 in the first elevated area 201 within the unit area is greater than the proportion of the second heat dissipation structure 230 in the second elevated area 202 within the unit area. In addition, Figure 5 This is only an implementation method that meets the above requirements. In the embodiment of the present invention, the size and arrangement density of the first heat dissipation structure 220 and the second heat dissipation structure 230 are not limited. It is only necessary to ensure that, within a unit area, the coverage area of ​​the first heat dissipation structure 220 in the first elevated region 201 is greater than the coverage area of ​​the second heat dissipation structure 230 in the second elevated region 202.

[0043] In one embodiment, see Figure 6 , the arrangement density of the first heat dissipation structure 220 in the first elevated area 201 is greater than the arrangement density of the second heat dissipation structure 230 in the second elevated area 202. Figure 5Along the thickness direction of the display panel, the coverage area of ​​the projection of the first heat dissipation structure 220 and the coverage area of ​​the projection of the second heat dissipation structure 230 can be equal. Since the heat dissipation demand in the second elevated area 202 is relatively small, the first heat dissipation structures 220 in the first elevated area 201 can be arranged to be more concentrated and have a good heat dissipation effect, and the second heat dissipation structures 220 in the second elevated area 201 can be arranged to be more dispersed, that is, the arrangement density of the first heat dissipation structures 220 in the first elevated area 201 is set to be greater than the arrangement density of the second heat dissipation structures 230 in the second elevated area 202, so that the coverage area of ​​the first heat dissipation structure 220 in the first elevated area 201 per unit area is greater than the coverage area of ​​the second heat dissipation structure 230 in the second elevated area 202, which can reduce the production cost while ensuring the heat dissipation effect at the position corresponding to the second elevated area 201 in the display panel.

[0044] In yet another embodiment, Figure 7 FIG. 1 is a top view of another type of heightening block provided by an embodiment of the present invention. Figure 2 and Figure 7 , the coverage area of ​​each first heat dissipation structure 220 in the first elevated area 201 is greater than the coverage area of ​​each second heat dissipation structure 230 in the second elevated area 202. Specifically, in this embodiment, the arrangement density of the first heat dissipation structures 220 in the first elevated area 201 can be set equal to the arrangement density of the second heat dissipation structures 230 in the second elevated area 202, that is, the spacing between two adjacent first heat dissipation structures 220 in the first elevated area 201 is equal to the spacing between two adjacent second heat dissipation structures 230 in the second elevated area 202. Since the heat dissipation demand in the second elevated area 202 is relatively small, the coverage area of ​​the projection of each first heat dissipation structure 220 in the first elevated area 201 can be set along the thickness direction of the display panel. The coverage area of ​​the projection of each second heat dissipation structure 230 in the second elevated area 202 is smaller, that is, the coverage area of ​​each first heat dissipation structure 220 in the first elevated area 201 is larger than the coverage area of ​​each second heat dissipation structure 230 in the second elevated area 202. Similarly, within a unit area, the coverage area of ​​the first heat dissipation structure 220 in the first elevated area 201 is larger than the coverage area of ​​the second heat dissipation structure 230 in the second elevated area 202. While ensuring the heat dissipation effect at the position corresponding to the second elevated area 201 in the display panel, the production cost can be reduced.

[0045] Optional, Figure 8 yes Figure 1 Another cross-sectional structure diagram along the A-A' direction, see Figure 8 The display panel further includes a first supporting layer 30 disposed in the display area AA and a heat conducting layer 60 disposed between the first supporting layer 30 and the padding block 20 , and the heat dissipation structure 21 is in contact with the heat conducting layer 60 .

[0046] For details, see Figure 8 The display panel includes a heat-conducting layer 60, which is located on the side of the padding block 20 away from the second supporting layer 40, and the heat-conducting layer 60 is in contact with the padding block 20. In this way, when the heat dissipation structure 21 completely penetrates the padding block 20, the heat dissipation structure 21 can directly contact the heat-conducting layer 60, which can further improve the heat extraction efficiency of the heat dissipation structure 21, thereby improving the heat dissipation effect of the driver chip 10. The heat-conducting layer 60 can be a copper foil layer. By arranging the copper foil layer between the first supporting layer 30 and the padding block 20, while playing a buffering role on the stress acting on the display panel, the heat transferred in the heat dissipation structure 21 can be extracted in time, thereby improving the heat dissipation effect of the driver chip 10.

[0047] Optionally, the heat dissipation structure 21 includes a graphite block, wherein the graphite block is a transitional crystal between atomic crystals, metal crystals and molecular crystals, the conductivity of the graphite block is one hundred times higher than that of general non-metallic minerals, and its thermal conductivity exceeds that of metal materials such as steel, iron, and lead, and has a higher thermal conductivity coefficient at room temperature, which can improve the heat accumulation at the position of the driver chip, thereby improving the problem of color cast of the display panel caused by the heating of the driver chip.

[0048] Based on the same inventive concept, an embodiment of the present invention further provides a display device. Fig. 9 FIG. 1 is a schematic diagram of a display device provided by an embodiment of the present invention. Fig. 9 As shown, the display device includes the display panel 01 in the above embodiment. The display device includes the display panel 01 of any embodiment of the present invention. Therefore, the display device provided by the embodiment of the present invention has the corresponding beneficial effects of the display panel 01 provided by the embodiment of the present invention, which will not be repeated here. Exemplarily, the display device can be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, which is not limited in the embodiment of the present invention.

[0049] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: It comprises a display area, a bending area and a binding area, wherein the binding area is bent along the bending area to the non-light-emitting side of the display area, and a driving chip is arranged in the binding area; The display panel further comprises a spacer block disposed between the display area and the binding area along the thickness direction of the display panel; at least one heat dissipation structure is disposed in the spacer block; Along the thickness direction of the display panel, the heat dissipation structure and the driving chip at least partially overlap; The heat dissipation structure includes a plurality of first heat dissipation structures and a plurality of second heat dissipation structures; the area where the padding block is located includes a first padding area and a second padding area; along the thickness direction of the display panel, the first padding area overlaps with the driving chip, and the second padding area does not overlap with the driving chip; The first heat dissipation structure is located in the first elevated area, and the second heat dissipation structure is located in the second elevated area; Within a unit area, a coverage area of ​​the first heat dissipation structure in the first elevated region is greater than a coverage area of ​​the second heat dissipation structure in the second elevated region.

2. The display panel according to claim 1, characterized in that: The padding block comprises a base material layer, a first adhesive layer and a second adhesive layer, wherein the base material layer is located between the first adhesive layer and the second adhesive layer; Along the thickness direction of the display panel, the heat dissipation structure at least penetrates the substrate layer.

3. The display panel according to claim 2, characterized in that: The heat dissipation structure is embedded in the first adhesive layer, the thickness of the heat dissipation structure embedded in the first adhesive layer is h1, and the thickness of the first adhesive layer is h2, wherein h1 / h2≤2 / 3; And / or, the heat dissipation structure is embedded in the second adhesive layer, and the thickness of the heat dissipation structure embedded in the second adhesive layer is h2, and the thickness of the second adhesive layer is h4, wherein h3 / h4≤2 / 3.

4. The display panel according to claim 2, characterized in that: The heat dissipation structure includes a plurality of independently arranged first heat dissipation sub-sections; Along the thickness direction of the display panel, the first heat dissipation section at least partially overlaps with the driving chip, and the first heat dissipation section penetrates the first adhesive layer, the substrate layer and the second adhesive layer.

5. The display panel according to claim 4, characterized in that: The plurality of first heat dissipation sections are evenly spaced and arranged along a first direction, and the first direction is parallel to an extension direction of a long side of the driving chip.

6. The display panel according to claim 5, characterized in that: Along the first direction, the width of the first heat dissipation division is D1, and the distance between two adjacent first heat dissipation divisions is D2, wherein D1=D2.

7. The display panel according to claim 1, characterized in that: An arrangement density of the first heat dissipation structures in the first elevated region is greater than an arrangement density of the second heat dissipation structures in the second elevated region.

8. The display panel according to claim 1, characterized in that: The coverage area of ​​each of the first heat dissipation structures in the first elevated region is greater than the coverage area of ​​each of the second heat dissipation structures in the second elevated region.

9. The display panel according to claim 1, characterized in that: The display panel further comprises a first supporting layer disposed in the display area and a heat conducting layer disposed between the first supporting layer and the padding block; The heat dissipation structure contacts the heat conductive layer.

10. The display panel according to claim 1, characterized in that: The heat dissipation structure includes a graphite block.

11. A display device, characterized in that: A display panel comprising any one of claims 1 to 10.

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