Micro-component repair method and display panel

Abstract

The present application discloses a micro-component repair method and a display panel. The micro-component repair method includes providing a driving substrate, the driving substrate includes a device area and a detection area, the device area is provided with a plurality of micro-components, and the detection area is provided with a plurality of defective micro-component samples; using the same repair method to simultaneously repair the defective micro-components in the device area and the defective micro-component samples in the detection area, and testing the repaired detection area to obtain the repair yield of the defective micro-component samples, and use the repair yield of the defective micro-component samples as the repair yield of the defective micro-components in the device area. In the above manner, the present application can improve the repair yield of defective micro-components.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a micro-component repair method and a display panel. Background Art

[0002] In recent years, semiconductor lighting technology has become increasingly mature, costs have continued to decline, and the industry scale has tended to be saturated, which has provided a better light source for the development of LED (Light-emitting Diode) display technology. Micro-LED display technology, which uses micron-sized LEDs as light-emitting pixel units, has the advantages of high brightness, high response speed, low power consumption, and long life, and has become a research hotspot for people pursuing a new generation of display technology. However, Micro-LEDs are difficult to grow directly on glass substrates, and transfer technology is required to transfer Micro-LEDs grown on other substrates to glass substrates. However, during the transfer process, abnormalities such as device damage are prone to occur, and the defective microcomponents need to be repaired.

[0003] In the process of Micro-LED industrialization, Micro-LED detection and repair is a big problem. Since a single Micro-LED chip reaches the micron level, the number of LED chips that need to be transferred on the Micro-LED display of a 5-inch smartphone will also be millions. The transfer of millions of micron-level chips and the control of yield and precision are the current technical difficulties. In addition, when the micron-level LED chip is damaged, how to detect and repair the bad pixels in the millions or even tens of millions of chips is also a big challenge. Summary of the invention

[0004] In view of this, the main technical problem to be solved by the present application is to provide a micro-component repair method and a display panel, which can improve the repair yield of defective micro-components.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a micro-component repair method, the method comprising providing a driving substrate, the driving substrate comprising a device area and a detection area, the device area is provided with a plurality of micro-components, and the detection area is provided with a plurality of defective micro-component samples; using the same repair method to simultaneously repair the defective micro-components in the device area and the defective micro-component samples in the detection area; detecting the detection area after the repair treatment to obtain the repair yield of the defective micro-component samples, and using the repair yield of the defective micro-component samples as the repair yield of the device area.

[0006] Among them, the method also includes: determining whether the repair yield of the defective microcomponent sample is less than a first preset value; in response to the repair yield being less than the first preset value, again executing the step of using the same repair method to simultaneously repair the defective microcomponents in the device area and the defective microcomponent samples in the detection area.

[0007] The method further includes: determining whether the number of times the repair yield of the defective microcomponent sample is less than a first preset value is greater than a second preset value; in response to the number of times the repair yield of the defective microcomponent sample is less than the first preset value being greater than the second preset value, adjusting the repair method or replacing it with a new repair method.

[0008] Among them, using the same repair method, the defective microcomponents in the device area and the defective microcomponent samples in the detection area are repaired at the same time, including: using a transfer head with multiple protrusions to pick up good microcomponents from the supply substrate, each protrusion corresponding to the absorption of one good microcomponent; aligning the transfer head with the driving substrate; adjusting the expansion and contraction amount of the protrusions to adjust the relative position of the good microcomponents and the driving substrate, and then placing good microcomponents only at the positions where microcomponents are missing on the driving substrate, and filling and repairing the vacant microcomponent positions of the driving substrate.

[0009] Among them, the defective microcomponent sample at least includes a verification defect, the verification defect is a microcomponent missing type defect, and the microcomponents on both sides of the verification defect are good microcomponents, so as to use the verified defect to verify whether the repair failure is caused by abnormal adjustment of the expansion and contraction amount of the protrusion.

[0010] The minimum retraction length of the protrusion is greater than the height of the good micro-component.

[0011] The detection area is arranged around the device area.

[0012] The detection area is arranged in an area of ​​the driving substrate where no driving circuit is arranged.

[0013] Wherein, using the same repair method to repair defective micro-components in the device area and defective micro-component samples in the detection area at the same time includes: removing defective micro-components to form micro-component vacancies on the driving substrate.

[0014] The micro-components in the detection area are not electrically connected to the driving circuit of the driving substrate.

[0015] The defective micro-component samples include one or more of missing micro-components, flipped micro-components, tilted micro-components, and displaced micro-components.

[0016] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a display panel, which includes a driving substrate and a light-emitting device, the driving substrate includes a display area and a non-display area; the light-emitting device includes micro-elements, the micro-elements are respectively arranged in the display area and the non-display area, and the micro-elements located in the non-display area do not emit light normally.

[0017] The beneficial effects of the present application are as follows: Different from the prior art, the repair method provided by the present application sets a detection area on the driving substrate, and a plurality of defective micro-component samples are preset in the detection area. While repairing the defective micro-components in the device area of ​​the driving substrate, the defective micro-component samples in the detection area are also repaired. The repair effect of the device area is judged by statistically analyzing the repair status of the defective micro-component samples in the detection area. In this way, the micro-components can be repaired quickly, and the repair effect can be tested to determine whether the repair is effective, so as to adjust the repair strategy in time and improve the repair yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. In addition, these drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application for those skilled in the art by referring to specific embodiments.

[0019] Figure 1 It is a structural schematic diagram of an embodiment of a driving substrate of the present application;

[0020] Figure 2 It is a schematic diagram of the process of an embodiment of the micro-component repair method of the present application;

[0021] Figure 3 is a schematic diagram of a driving substrate provided in an embodiment of a micro-component repair method of the present application;

[0022] Figure 4 is a schematic diagram of a transfer device provided in an embodiment of a micro-component repair method of the present application;

[0023] Figure 5 It is a schematic diagram of bonding with a driving substrate in alignment in one embodiment of a micro-component repair method of the present application;

[0024] Figure 6 is a schematic diagram of a repaired driving substrate in an embodiment of a micro-component repair method of the present application;

[0025] Figure 7 It is a schematic diagram of the detection area in an embodiment of the micro-component repair method of the present application. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0027] The present application provides a method for repairing microcomponents, in which a detection area is set on a driving substrate, and a plurality of defective microcomponent samples are preset in the detection area. While repairing the defective microcomponents in the device area of ​​the driving substrate, the defective microcomponent samples in the detection area are also repaired. The repair effect of the device area is judged by counting the repair conditions of the defective microcomponent samples in the detection area. In this way, the microcomponents can be repaired quickly, and the repair effect can be tested to determine whether the repair is effective.

[0028] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of an embodiment of the driving substrate of the present application. In this embodiment, the driving substrate 10 includes a device area 110 and a detection area 120 . The device area 110 is provided with a plurality of micro-components 20 , and the detection area 120 is provided with a plurality of defective micro-component samples 30 .

[0029] The driving substrate 10 includes a driving area and a non-driving area. Generally, the driving area corresponds to the display area, and the non-driving area corresponds to the non-display area. The non-driving area may be arranged around the driving area. The driving area is provided with a driving circuit and a contact electrode for receiving the microcomponent 20 and bonding with the electrode of the microcomponent 20 to form a device area 110. Various forms of transfer methods can be used to transfer the microcomponent 20 to the driving substrate 10. For example, a transfer device with a transfer head can be used to transfer the microcomponent 20 from the supply substrate to the driving substrate 10 after the transfer head is adsorbed; an intermediate substrate can also be used to first transfer the microcomponent 20 from the supply substrate to the intermediate substrate, and then from the intermediate substrate to the driving substrate 10, and the microcomponent 20 is transferred from the supply substrate to the driving substrate 10 by bonding between the substrates; a fluid transfer method can also be used to transfer the microcomponent 20, etc. The present case does not limit the transfer method of the microcomponent 20, and any method that can achieve the transfer of the microcomponent 20 can be applied.

[0030] Since the size of micro components 20 is mostly in the micron range, the batch transfer process has high requirements for yield and precision control. If you are not careful, the device will be defective, resulting in a decrease in yield. For example, the electrode of the micro component 20 falls off, the micro component 20 is misaligned and tilted, flipped, and the micro component 20 falls to form a vacancy, etc., resulting in certain defects on the drive substrate 10 after transfer. Figure 1 As shown, the micro-components 20 are arranged in an array in the device region 110 . Most of the micro-components 20 are correct, but there are some defects such as vacancies and deflections.

[0031] In order to improve the yield of the driving substrate 10, in addition to improving and optimizing the transfer method of the microcomponent 20, the defective devices can also be repaired to improve the yield. During the repair, generally the defective devices are first found and located, and then the defective devices are replaced, supplemented, etc. However, even after the secondary repair, there is a possibility of unsuccessful repair, that is, after the secondary repair, the microcomponent 20 may also be offset, rotated, upright, flipped, missing, etc. Therefore, after the repair, the repair yield needs to be tested to check the repair effect. In order to improve the yield, multiple repairs can be performed. If multiple repairs cannot achieve the ideal yield, it is necessary to find the cause of the defect. However, due to the large number of devices on the driving substrate 10, there are many factors that cause defects, especially after multiple rounds of repairs, it is difficult to judge whether the original defect has not been repaired, or whether it is because the repair method is not suitable and secondary damage has been caused, etc., which brings great difficulties to repair and detection, which is not conducive to process improvement.

[0032] Based on this, the present application provides a solution, in which a detection area 120 is set on the driving substrate 10, and defects that may occur during the transfer or repair of the microcomponent 20 are pre-set in the detection area 120. Specifically, the detection area 120 is provided with the same microcomponents 20 as the device area 110, and the microcomponents 20 in the detection area 120 are destroyed to form a plurality of defective microcomponent samples 30. For example, a plurality of defective microcomponent samples 30 such as the microcomponent 20 being offset, rotated, upright, flipped, missing, etc. are set in the detection area 120, that is, the defective microcomponent samples include one or more of missing microcomponents, flipped microcomponents, tilted microcomponents, and offset microcomponents. The specific defect samples are shown as follows Figure 1As shown. When the defective microcomponents in the device area 110 are repaired, the defective microcomponent samples 30 in the detection area 120 are also repaired. After the repair is completed, the repair results of the detection area 120 are evaluated. That is, it is determined whether the defective microcomponent samples 30 in the detection area 120 have been successfully repaired, so as to evaluate whether the repair method is feasible. If the defective microcomponent samples 30 in the detection area 120 are completely repaired, it can be explained to a certain extent that the repair method itself is relatively reliable and has a high repair yield; if the defective microcomponent samples 30 in the detection area 120 have defects that have not been repaired, it means that the repair method may have loopholes, and the repaired area may still have bad spots and need to be repaired again. At the same time, because the defective microcomponents in the detection area 120 are all pre-set, their defective states are relatively clear, and it is easy to compare before and after repair; and the detection area is relatively small and easier to detect. When actually performing the repair process, the device area 110 and the inspection area 120 can be modified at the same time, and the modification method is consistent; therefore, the repair yield of the inspection area 120 can reflect the repair yield of the device area 110 to a certain extent. Therefore, the method provided in the present application further evaluates the repair yield of the device area by setting up the inspection area and evaluating the repair yield of the inspection area; and can improve the efficiency of evaluating the repair yield.

[0033] The detection area 120 can be set in the non-driving area of ​​the driving substrate 10. One or more detection areas 120 can be set. The defective micro-component samples 30 in different detection areas 120 can be of different types to increase the diversity of the defective micro-component samples 30 and make the detection results more reliable. The detection area 120 can be retained in the final product or cut out in the subsequent process. The size of the detection area 120 can be adapted to the idle area of ​​the driving substrate 10 so as not to affect the normal function of the driving substrate 10. Figure 1 The detection area 120 shown in the figure is only an example, and the size of the detection area 120 is based on the actual free space of the driving substrate 10 .

[0034] Below, the scheme of the present application will be described in detail by taking the transfer and repair of micro-components using a transfer device with a transfer head as an example, but is not limited to this, and the scheme of the present application is also applicable to other transfer and repair methods.

[0035] The micro-component transfer method specifically includes:

[0036] Step 1: Provide microcomponents and transfer equipment.

[0037] There are multiple micro-components, and the micro-components can be Micro-LED, a diode array of a photodiode array detector (Photo-diode Array, PDA), a MOS (Metal Oxide Semiconductor, MOS) device, a Micro-Electro-Mechanical Systems (Micro-Electro-Mechanical Systems, MEMS) device, etc., but are not limited to the examples listed here. In this application, the solution of this application is described in detail by taking the micro-component as Micro-LED as an example.

[0038] Wherein, a plurality of Micro-LEDs are formed on a supply substrate, and the supply substrate may be a sapphire substrate; that is, Micro-LEDs of a predetermined size and type may be grown on the sapphire substrate. In other embodiments, it is not limited to the sapphire substrate, and may be other substrates. For example, it may be a silicon-based substrate or a gallium nitride (GaN) substrate.

[0039] The transfer device includes a transfer head, on which a plurality of protrusions are arranged, and the protrusions have a certain adsorption capacity and can be used to adsorb Micro-LEDs to transfer Micro-LEDs. A vacuum nozzle may be arranged on the protrusions, or a viscous material may be coated on the protrusions to adsorb and fix the Micro-LED devices. The viscous material may be an organic viscous glue, and the specific type and molecular structure of the glue are not limited here. For example, the viscous material may be an organic adhesive, such as thermoplastic olefin polymers (polyvinyl acetate, polyvinyl alcohol, perchlorethylene, polyisobutylene, etc.), polyester, polyether, polyamide, polyacrylate, etc.; thermosetting epoxy resin, phenolic resin, etc.; or rubber-based styrene-butadiene rubber, butyl rubber, phenolic-nitrile rubber, phenolic-chloroprene rubber, etc. The viscous material may be directly coated; or a material with certain characteristics may be coated, such as a thermo- or photo-induced viscous material, which is not viscous under normal conditions but becomes viscous under heating or light conditions.

[0040] Step 2: Pick up the micro components on the supply substrate using the protrusions of the transfer head.

[0041] When using the transfer head to absorb the Micro-LED, precise alignment can be performed first, and the Micro-LED to be transferred can be selectively absorbed; or the Micro-LED on the supply substrate can be absorbed on the entire surface without alignment. After absorption, the supply substrate is laser-stripped, and the laser-stripped supply substrate is removed, leaving the Micro-LED device on the transfer head. In other embodiments, other stripping methods such as chemical etching can also be used to strip the supply substrate.

[0042] Step 3: Align and bond the picked-up micro-component to the driving substrate.

[0043] Specifically, the transfer head is aligned with the driving substrate, that is, the picked-up Micro-LED is aligned with the driving substrate, and the picked-up Micro-LED is aligned and bonded with the driving substrate to be received, wherein the electrodes of the Micro-LED should be aligned and bonded with the contact electrodes of the driving substrate to achieve bonding connection and complete the transfer of the Micro-LED.

[0044] All microcomponents to be transferred may be transferred at one time; or the microcomponents may be transferred selectively in batches, that is, during the microcomponent transfer process, the above steps 1-3 may be repeatedly performed until all microcomponents are transferred.

[0045] After all the transfers are completed, the driver substrate can be inspected for defects. If there are missing vacancies, they need to be repaired. If there are defective devices such as crystal flipping, crystal standing, offset, missing electrodes, etc., the defective devices need to be removed first, and then the vacancies need to be repaired.

[0046] See also Figure 2 , Figure 2 This is a flow chart of an embodiment of the micro-component repair method of the present application. In this embodiment, a transfer device with a transfer head is used to repair defective micro-components of a drive substrate. Specifically, it includes:

[0047] S210: providing a drive substrate to be repaired.

[0048] See also Figure 3 , Figure 3 It is a schematic diagram of a driving substrate provided in an embodiment of the micro-component repair method of the present application.

[0049] The driving substrate 10 includes a device area 110, and the device area 110 is provided with an array of Micro-LED devices 20, and the Micro-LED devices 20 can be transferred to the driving substrate 10 using the above transfer method. The Micro-LED device 20 can be a flip-chip structure or a vertical structure. The device area 110 also includes defective micro-components, which can be removed first to form micro-component vacancies, so that good micro-components can be replaced later for repair.

[0050] A detection area 120 is constructed on the driving substrate 10, wherein the detection area 120 is provided with a Micro-LED device 20 and a defective micro-component sample 30. The Micro-LED device 20 of the detection area 120 may be transferred together when the device area 110 is formed by transfer, or may be transferred by a separate transfer process. The defective micro-component sample 30 of the detection area 120 may be naturally formed during the transfer process; or may be formed by artificially destroying the Micro-LED device 20 according to preset requirements after the transfer, and the formation method is not limited here.

[0051] S230: Provide good quality micro components and transfer equipment.

[0052] See also Figure 4 , Figure 4 Schematic diagram of a transfer device provided in an embodiment of the micro-component repair method of the present application. A transfer device is provided, the transfer device comprising a transfer head 50, the transfer head 50 comprising a plurality of protrusions 51, a vacuum suction nozzle is provided on the protrusion 51, or a viscous material is coated on the protrusion to adsorb and fix the Micro-LED device 20. It can also be coated with a material with certain characteristics, such as a thermo- or photo-induced viscous material, which is not viscous under normal conditions but becomes viscous under heating or light conditions.

[0053] In this embodiment, the protrusion 51 of the transfer head 50 has a certain elasticity, that is, a certain expansion and contraction rate, and can be stretched or shortened, thereby being able to adjust the position of the adsorbed Micro-LED device relative to the driving substrate. Figure 4 As shown, it is possible to adjust from state a to state b.

[0054] Among them, the minimum retraction length of the protrusion 51 should be greater than the height of the Micro-LED device, for example, greater than 7 microns. In this case, after the picked-up Micro-LED device is aligned with the driving substrate, if there is already a Micro-LED device at the position on the driving substrate that is aligned with the Micro-LED device to be transferred, the corresponding protrusion can be controlled to retract and no longer release the Micro-LED device at this position; and for the position where the Micro-LED device is missing, the corresponding protrusion is controlled not to deform, thereby achieving replacement. By using this transfer head, when picking up good micro-components, there is no need to select alignment, but to pick them up as a whole. When they are released to be transferred, the height of the protrusion is adjusted as needed, and they are selectively released.

[0055] S250: Pick up good micro components on the supply substrate using the protrusions of the transfer head.

[0056] The picking process may be selective picking, where only the Micro-LED at the missing position is picked up, or the picking process may be overall picking, where no alignment is performed. In this embodiment, the Micro-LED on the supply substrate is preferably picked up on the entire surface.

[0057] S270: Align and bond the picked-up micro-component to the driving substrate.

[0058] See also Figure 5 and Figure 6 , Figure 5 It is a schematic diagram of bonding with a driving substrate in an embodiment of a micro-component repair method of the present application. Figure 6 It is a schematic diagram of a repaired driving substrate in an embodiment of a micro-component repair method of the present application.

[0059] Provide a driving substrate 10 on which a driving circuit and contact electrodes are disposed, align the transfer head with the driving substrate 10, and connect the electrodes of the Micro-LED device 20 with the contact electrodes. Release the Micro-LED device to complete the transfer of the Micro-LED device 20.

[0060] Among them, after the picked-up Micro-LED device is aligned with the driving substrate, if there is already a Micro-LED device at the position on the driving substrate that is aligned with the Micro-LED device to be transferred, the corresponding protrusion can be controlled to retract and the Micro-LED device will no longer be released at this position; and for the missing position, the corresponding protrusion is controlled not to deform, thereby achieving filling the position.

[0061] Among them, the alignment transfer and filling of the detection area 120 are synchronized with the device area 110. After the filling repair, the filling situation of the detection area can be detected. Because the area of ​​the detection area is small and the defects are known, a simple microscope detection method can be used to concentrate on observing the before and after comparison effect of the secondary filling to promote the improvement of the yield of the secondary filling. That is, the repair yield of the defective micro-component sample can be used as the repair yield of the device area, or the repair yield of the device area can be inferred according to the yield of the defective micro-component sample; whether to repair again is determined according to the repair yield. For example, it is determined whether the repair yield of the defective micro-component sample is less than the first preset value; in response to the repair yield being less than the first preset value, the step of using the same repair method to repair the defective micro-components in the device area and the defective micro-component samples in the detection area at the same time is executed again until the repair yield reaches the predetermined value, so that there is basically no defect on the substrate. By detecting the defect situation in the detection area, it is checked whether it is completely repaired; by setting the detection area, it can be detected whether it is caused by equipment factors, such as insufficient retraction of the transfer head, etc., so as to facilitate adjustment, improve the filling yield, and avoid unnecessary repetition and waste. Specifically, it is determined whether the number of times the repair yield of the defective micro-component sample is less than the first preset value is greater than the second preset value; in response to the number of times the repair yield of the defective micro-component sample is less than the first preset value being greater than the second preset value, a new repair method is replaced or the repair method is optimized. That is, if the yield is poor after multiple repairs, it is necessary to consider whether it is a problem with the repair method itself and whether the repair method needs to be optimized. For example, whether it is caused by insufficient expansion and contraction rate of the transfer head can be verified by designing defective micro-component samples in the inspection area.

[0062] Among them, because the driver substrate contains many components and causes repair failure, there are many factors that cause bad pixels, and it is impossible to accurately detect the specific cause of the bad pixels. Especially if multiple filling operations are required, it is difficult to find out whether it is the original missing, the picking missing, or the missing caused by insufficient extension of the transfer head. In this application, by setting up a detection area and filling the determined defective area, the before-and-after comparison effects of the two fillings are compared, the causes of the defects are screened, and the yield of the secondary filling is improved.

[0063] See also Figure 7 , Figure 7 Schematic diagram of the inspection area in the first embodiment of the micro-component repair method of the present application. In this embodiment, the defective micro-component sample 30 in the inspection area 120 includes at least a verification defect 310, which is a micro-component missing defect, and the micro-components on both sides of the verification defect are normal, so as to use the verification defect 310 to verify whether the repair failure is caused by insufficient expansion and contraction of the protrusion.

[0064] Specifically, by presetting a micro-component missing situation in advance, there are three adjacent LEDs, the left and right LEDs are not missing, and the middle LED is missing. This method is used to verify whether the secondary replacement missing is caused by insufficient extension of the protrusion (H1-H2). If the extension of the transfer head cannot be greater than the height of the LED, the middle LED cannot contact the drive substrate, resulting in missing. In this way, using known defective micro-component samples, the cause of the defect can be more accurately known, and corrections can be made in a timely and accurate manner, saving costs and improving repair efficiency.

[0065] In the above embodiments, the substrate provided in the present application includes a detection area, and the detection area is provided with the same micro-components as the device area, and the detection area is damaged to form a defective area. By observing the degree of defect repair in the detection area, it is judged whether the repair of the device area is successful, and then the repair effect is detected, for example, whether the repair effect is due to the abnormality caused by the repair method itself, or the substrate. Under this method, the repair of the micro-components does not need to be precisely positioned, and the micro-components larger than the defect amount can be supplemented and transferred to repair the defective positions. At the same time, a detection area is also set up, and the detection area has a preset defective area. While repairing the device area of ​​the substrate, the detection area is also repaired; by observing the repair of the defects in the detection area, the repair effect of the device area can be judged. In this way, it is possible to quickly realize the repair of the micro-components, and the repair effect can be detected to determine whether the repair is effective. That is, the present application provides a detection method for quickly judging the effect of this repair method, and an experimental method for verifying the defect abnormality of this repair method.

[0066] The present application also provides a display panel, the display panel includes a driving substrate and a light-emitting device, the driving substrate includes a display area and a non-display area; the light-emitting device includes a micro-component, the micro-component is respectively arranged in the display area and the non-display area, and the micro-component located in the non-display area does not emit light normally. The display panel uses the micro-component as the light-emitting device, which is transferred to the driving substrate by a batch transfer method. During the transfer process, the above-mentioned repair method can be used for repair to ensure the yield of the device.

[0067] In addition, in this application, unless otherwise clearly specified and limited, the terms "connected", "connected", "stacked" and the like should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A micro-component repair method, characterized in that: include: Providing a driving substrate, the driving substrate comprising a device area and a detection area, the device area is provided with a plurality of micro-components, and the detection area is provided with a plurality of defective micro-component samples; Using the same repair method to repair the defective micro-components in the device area and the defective micro-component samples in the inspection area at the same time; The inspection area after the repair process is inspected to obtain the repair yield of the defective micro-component sample, and the repair yield of the defective micro-component sample is used as the repair yield of the defective micro-component in the device area.

2. The micro-component repair method according to claim 1, characterized in that: The method further comprises: Determining whether the repair yield of the defective micro-component sample is less than a first preset value; In response to the repair yield being less than the first preset value, the step of using the same repair method to simultaneously repair the defective microcomponents in the device area and the defective microcomponent samples in the inspection area is performed again.

3. The micro-component repair method according to claim 2, characterized in that: The method further comprises: Determining whether the number of times that the repair yield of the defective micro-component sample is less than the first preset value is greater than a second preset value; In response to the number of times that the repair yield of the defective micro-component sample is less than the first preset value is greater than the second preset value, the repair method is adjusted or replaced with a new repair method.

4. The micro-component repair method according to claim 1, characterized in that: The method of using the same repair method to simultaneously repair the defective micro-components in the device area and the defective micro-component samples in the inspection area includes: Picking up good micro-components from the supply substrate using a transfer head with a plurality of protrusions, each of the protrusions correspondingly adsorbing one good micro-component; Aligning the transfer head with the drive substrate; The expansion and contraction amount of the protrusion is adjusted to adjust the relative position of the good micro-component and the driving substrate, and then the good micro-component is placed only at the position where the micro-component is missing on the driving substrate to fill and repair the vacant micro-component position of the driving substrate.

5. The micro-component repair method according to claim 4, characterized in that: The defective microcomponent sample at least includes a verification defect, which is a microcomponent missing defect, and the microcomponents on both sides of the verification defect are good microcomponents, so as to use the verification defect to verify whether the repair failure is caused by abnormal adjustment of the expansion and contraction amount of the protrusion.

6. The micro-component repair method according to claim 4, characterized in that: The minimum retraction length of the protrusion is greater than the height of the good micro-component.

7. The micro-component repair method according to any one of claims 1 to 6, characterized in that: The method of using the same repair method to simultaneously repair the defective micro-components in the device area and the defective micro-component samples in the inspection area includes: The defective micro-component is removed to form a micro-component vacancy on the driving substrate.

8. The micro-component repair method according to any one of claims 1 to 6, characterized in that: The detection area is arranged around the device area; or The detection area is arranged in an area of ​​the drive substrate where no drive circuit is arranged.

9. The micro-component repair method according to any one of claims 1 to 6, characterized in that: The defective micro-component samples include one or more of missing micro-components, flipped micro-components, tilted micro-components, and offset micro-components.

10. A display panel, characterized in that: include: A driving substrate, comprising a display area and a non-display area; The light emitting device comprises micro elements, wherein the micro elements are respectively arranged in the display area and the non-display area, and the micro elements located in the non-display area do not emit light normally.

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