Array integrated microwave photonics system with low radio frequency crosstalk

Abstract

The present disclosure provides an array integrated microwave photonics system with low radio frequency crosstalk, including: a plurality of microwave photonics modules, each microwave photonics module including: a laser, which is an indium phosphide-based chip and is suitable for emitting an optical carrier; a modulator, which is a lithium niobate-based chip or a silicon-based chip and is suitable for receiving the optical carrier and modulating the optical carrier according to an externally input radio frequency signal to obtain a modulated signal; a packaging housing, wherein a plurality of isolation plates are stacked at intervals inside the packaging housing to divide the packaging housing into a plurality of channels, and the microwave photonics modules are respectively arranged in the channels, so that the isolation plates separate the microwave photonics modules in adjacent channels. By arranging the packaging housing, the microwave photonics system is integrated in an array in the vertical direction. By arranging an isolation layer, the microwave photonics systems in each channel are partitioned to reduce the radio frequency signal crosstalk between adjacent channels. Photonic leads are used to reduce the end-face optical reflection, so that the integrated microwave photonics system can stably operate in multiple channels simultaneously.

Description

Technical Field

[0001] The present disclosure relates to the technical field of microwave photon integration, and particularly to an array integrated microwave photon system with low radio frequency crosstalk. Background Art

[0002] In a microwave photon system, the use of discrete devices not only occupies a large amount of space, but also generates huge coupling losses, resulting in a decline in the performance of the system. The use of an integrated system can reduce the floor area, lower the optical coupling loss, and improve the system performance, which has important applications in the communication field.

[0003] A microwave photon integrated emission system usually includes a laser and a modulator. In the prior art, the laser and the modulator are optically coupled in a butt-coupling manner, but this coupling method has a large optical loss, and there will be strong optical reflection back to the laser at the coupling interface, resulting in the unstable operation of the laser and even damage to the laser. In order to avoid optical reflection, an optical isolator is added between the laser and the modulator, which can reduce the influence of optical reflection on the laser. However, adding an optical isolator not only increases the complexity of the system, but also introduces a large insertion loss and increases the power requirement for the laser.

[0004] In order to achieve multi-channel signal output, a planar array structure is usually adopted during array integration. This not only makes the planar area too large, causing the system to lose the advantage of integration, but also due to the too-close distance between adjacent channels, the radio frequency signal is very likely to cause signal crosstalk between channels during input, seriously affecting the system function. Summary of the Invention

[0005] To solve at least one of the technical problems in the prior art, the present disclosure provides an integrated microwave photon system. By setting a package housing for array integration, the volume of the multi-channel array system is reduced, and the floor area on the plane is only one Nth of that of the traditional N-channel array system, enabling the integration of the microwave photon system. By setting an isolation layer to separate the microwave photon systems in each channel, the problem of radio frequency signal crosstalk between adjacent channels input to the microwave photon system is avoided, enabling the integrated microwave photon system to operate stably in multiple channels simultaneously.

[0006] As an aspect of the present disclosure, an array integrated microwave photonic system with low radio frequency crosstalk is provided, including: a plurality of microwave photonic modules and a packaging case. Each microwave photonic module includes: a laser and a modulator. The laser is an indium phosphide-based chip suitable for emitting an optical carrier; the modulator is a lithium niobate-based chip or a silicon-based chip suitable for receiving the optical carrier and modulating the optical carrier according to an externally input radio frequency signal to obtain a modulated signal. A plurality of isolation plates are stacked at intervals inside the packaging case to divide the packaging case into a plurality of channels, and the microwave photonic modules are respectively arranged in the channels such that the isolation plates separate the microwave photonic modules in adjacent channels.

[0007] According to an embodiment of the present disclosure, each of the microwave photonic modules further includes: a substrate. The laser and the modulator are bonded to the substrate to integrate the laser and the modulator onto the substrate.

[0008] According to an embodiment of the present disclosure, each of the microwave photonic modules further includes: a first photonic lead, arranged between the laser and the modulator, suitable for transmitting the optical carrier.

[0009] According to an embodiment of the present disclosure, each of the microwave photonic modules further includes: a signal processor and a detector. The signal processor is suitable for receiving the modulated signal and performing filtering processing on the modulated signal to obtain a filtered signal. The detector is suitable for receiving the filtered signal and performing photoelectric conversion on the filtered signal. Among them, the detector is the indium phosphide-based chip, and the signal processor is the lithium niobate-based chip or the silicon-based chip.

[0010] According to an embodiment of the present disclosure, the laser, the modulator, the signal processor, and the detector are respectively bonded to the substrate, wherein the detector and the modulator are diagonally arranged.

[0011] According to an embodiment of the present disclosure, each of the microwave photonic modules further includes: a second photonic lead, arranged between the signal processor and the detector, suitable for transmitting the filtered signal.

[0012] According to an embodiment of the present disclosure, the first photonic lead and the second photonic lead are free-form polymer waveguides manufactured by nanotechnology and include a core layer and a cladding layer coated on the core layer. The core layer is a polymer material, and the cladding layer is formed by curing a refractive index matching liquid coated on the core layer, wherein the refractive index of the cladding layer is less than the refractive index of the core layer.

[0013] According to an embodiment of the present disclosure, the material of the packaging case is kovar alloy.

[0014] According to an embodiment of the present disclosure, the spacing range between the isolation plates includes 7 mm - 11 mm.

[0015] According to an embodiment of the present disclosure, at least one side surface of the encapsulation housing adjacent to the end surface for inputting the radio frequency signal is used for emitting the modulation signal.

[0016] According to an embodiment of the present disclosure, the present disclosure provides an array integrated microwave photonic system with low radio frequency crosstalk. By arranging an encapsulation housing to integrally arrange multiple microwave photonic modules in the vertical direction, the volume of the multi-channel array system is reduced, and the floor area on the plane is only one Nth of that of the conventional N-channel array system, enabling the integration of the microwave photonic system. By arranging an isolation layer to partition the microwave photonic systems in each channel, the problem of mutual crosstalk of the radio frequency signals input to the microwave photonic systems between adjacent channels is avoided, enabling the integrated microwave photonic system to stably operate in multiple channels simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. schematically shows a perspective view of an integrated microwave photonic system according to an embodiment of the present disclosure;

[0018] Figure 2 FIG. schematically shows a system diagram of a microwave photonic module according to an embodiment of the present disclosure; and

[0019] Figure 3 FIG. schematically shows a system diagram of a microwave photonic module according to another embodiment of the present disclosure.

[0020] DESCRIPTION OF REFERENCE NUMERALS:

[0021] 1 - microwave photonic module;

[0022] 11 - laser;

[0023] 12 - modulator;

[0024] 13 - substrate;

[0025] 14 - first photonic lead;

[0026] 15 - signal processor;

[0027] 16 - detector;

[0028] 17 - second photonic lead;

[0029] 2 - encapsulation housing;

[0030] 21 - isolation plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] To make the objectives, technical solutions and advantages of the present disclosure more apparent, the following provides a further detailed description of the present disclosure in conjunction with specific embodiments and with reference to the accompanying drawings. However, the present disclosure can be implemented in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided to make the disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated, and like reference numerals designate like elements throughout.

[0032] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In the following detailed description, for the sake of explanation, numerous specific details are set forth in order to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is obvious that one or more embodiments can be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0033] The terms used herein are merely for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0034] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0035] To facilitate the understanding of the technical solutions of the present disclosure by those skilled in the art, the following technical terms are explained.

[0036] In cases where expressions similar to "at least one of A, B, and C, etc." are used, generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). In cases where expressions similar to "at least one of A, B, or C, etc." are used, generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, or C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0037] Figure 1 A perspective view of an integrated microwave photonic system according to an embodiment of the present disclosure is schematically shown. Figure 2 A system diagram of a microwave photonic module according to an embodiment of the present disclosure is schematically shown.

[0038] As one aspect of the present disclosure, an array integrated microwave photonic system with low radio frequency crosstalk is provided, such as Figure 1 As shown, it includes: a plurality of microwave photon modules 1 and a packaging tube shell 2. Figure 2 As shown, each microwave photon module 1 includes: a laser 11 and a modulator 12. The laser 11 is an indium phosphide-based chip, suitable for transmitting an optical carrier; the modulator 12 is a lithium niobate-based chip or a silicon-based chip, suitable for receiving an optical carrier and modulating the optical carrier according to an externally input radio frequency signal to obtain a modulated signal. A plurality of isolation plates 21 are stacked at intervals inside the package tube shell 2 to divide the package tube shell 2 into a plurality of channels. The microwave photon modules 1 are respectively arranged in the channels, so that the isolation plates 21 separate the microwave photon modules 1 of adjacent channels.

[0039] According to the embodiments of the present disclosure, an array-integrated microwave photonic system with low RF crosstalk is provided in the present disclosure. A plurality of microwave photonic modules 1 are integrated in an array in a vertical direction by setting a packaging tube shell 2, thereby reducing the volume of the multi-channel array system. The footprint on the plane is only one-Nth of the traditional N-channel (N is a positive integer) array system, so that the microwave photonic system is integrated. The microwave photonic system between each channel is separated by setting an isolation layer, thereby avoiding the problem of mutual crosstalk of RF signals input into the microwave photonic system between adjacent channels, so that the integrated microwave photonic system can operate stably with multiple channels at the same time.

[0040] According to an embodiment of the present disclosure, the wavelength of the optical carrier emitted by the laser 11 is a communication wavelength (800nm-1600nm).

[0041] In an exemplary embodiment, the laser 11 is an indium phosphide (InP) based distributed feedback (DFB) laser.

[0042] In an illustrative embodiment, the wavelength of the optical carrier emitted by the laser 11 is 1550 nm.

[0043] In an illustrative embodiment, the modulator 12 is a lithium niobate (LN) based electro-optic modulator 12 .

[0044] According to an embodiment of the present disclosure, the packaging tube shell 2 is suitable for packaging a plurality of microwave photonic modules 1 stacked inside.

[0045] In a schematic embodiment, 20 partition plates 21 are stacked at intervals inside the encapsulation housing 2 to divide the encapsulation housing 2 into 21 channels, and 21 microwave photonic modules 1 are respectively disposed in the 21 channels.

[0046] In a schematic embodiment, 5 partition plates 21 are stacked at intervals inside the encapsulation housing 2 to divide the encapsulation housing 2 into 6 channels, and 5 microwave photonic modules 1 can be respectively disposed in any 5 channels of the encapsulation housing 2 according to actual needs.

[0047] According to an embodiment of the present disclosure, the encapsulation housing 2 can be configured as any one of a cube, a cuboid or a cylinder.

[0048] In a schematic embodiment, the encapsulation housing 2 is configured as a cuboid, including the body of the encapsulation housing 2, an upper cover and a plurality of partition plates 21. Signal channels equal in number to the channels are respectively disposed on any two adjacent side surfaces of the partition plate 21 body. Among the two adjacent side surfaces, the signal channels on one side surface are used to receive radio frequency signals, and the signal channels on the other side surface are used to emit modulated signals. The partition plates 21 are stacked at intervals inside the encapsulation housing 2, wherein the partition plates 21 are detachably connected to the encapsulation housing 2.

[0049] During manufacturing, a plurality of microwave photonic modules 1 are respectively fixed to a plurality of partition plates 21. According to the installation positions of the lasers 11 and the modulators 12, the directions of the partition plates 21 are adjusted so that the modulators 12 are located between two adjacent side surfaces with signal channels, and the directions of all the partition plates 21 with microwave photonic modules 1 are unified. The partition plates 21 with microwave photonic modules 1 whose directions are adjusted are sequentially fixed inside the encapsulation housing 2 from bottom to top, and finally the upper cover is encapsulated.

[0050] In another schematic embodiment, the partition plates 21 are slidably connected to the encapsulation housing 2, and any side surface of the encapsulation housing 2 intersecting with the sliding direction of the partition plates 21 is used for radio frequency signal input or modulated signal output, and for the partition plates 21 to enter or exit the encapsulation housing 2.

[0051] According to an embodiment of the present disclosure, as Figure 2 shown, each microwave photonic module 1 further includes: a substrate 13. The lasers 11 and the modulators 12 are bonded to the substrate 13 to integrate the lasers 11 and the modulators 12 onto the substrate 13, realizing monolithic integration.

[0052] In a schematic embodiment, the substrate 13 can be adhered to the partition plate to realize the fixed connection between the microwave photonic module 1 and the encapsulation housing 2.

[0053] According to an embodiment of the present disclosure, as Figure 2As shown, each microwave photon module 1 further includes: a first photon lead 14, disposed between the laser 11 and the modulator 12, and adapted to transmit an optical carrier.

[0054] According to an embodiment of the present disclosure, the first photon lead 14 bonding technology is adopted to fabricate a photon lead using a polymer waveguide, realizing optical transmission between the laser 11 chip and the modulator 12 chip, having low transmission loss, reducing the optical loss in the system, effectively avoiding the end-face reflection of the modulator to the laser by using a bent photon lead, preventing the influence of light reflection on the working state of the laser, and no optical amplifier and optical isolator are required in the system, reducing the complexity and insertion loss of the system.

[0055] According to an embodiment of the present disclosure, there is a gap of less than 500 um between the laser 11 chip and the modulator 12 chip for fabricating the first photon lead 14.

[0056] According to an embodiment of the present disclosure, the gap range between the laser 11 chip and the modulator 12 chip includes any one of 50 um, 100 um, 200 um, 300 um, 500 um, etc.

[0057] According to an embodiment of the present disclosure, the material of the package housing 2 is kovar alloy.

[0058] According to an embodiment of the present disclosure, the spacing range between the respective partition plates 21 in the package housing 2 includes 7 mm - 11 mm.

[0059] According to an embodiment of the present disclosure, the spacing range between the partition plates 21 includes any one of 7 mm, 8 mm, 9 mm, 10.5 mm, 11 mm, etc.

[0060] According to an embodiment of the present disclosure, at least one side surface of the package housing 2 adjacent to the end surface of the input radio frequency signal is used for emitting a modulation signal.

[0061] In a schematic embodiment, the wavelengths of the output optical carriers of each laser are different from each other, and the wavelengths of the array light sources (modulation signals) emitted by the integrated microwave photon system are also different from each other, and different wavelength light source outputs can be realized in communication or used as the light source of a test system.

[0062] Figure 3 A system diagram of a microwave photon module according to another embodiment of the present disclosure is schematically shown.

[0063] According to an embodiment of the present disclosure, as Figure 3As shown, each microwave photon module 1 further includes: a signal processor 15 and a detector 16. The signal processor 15 is adapted to receive a modulation signal and perform filtering processing on the modulation signal to obtain a filtered signal. The detector 16 is adapted to receive the filtered signal and perform optoelectronic conversion on the filtered signal to output an electrical signal. Among them, the detector 16 is an indium phosphide-based chip, and the signal processor 15 is a lithium niobate-based chip or a silicon-based chip.

[0064] In a schematic embodiment, both the modulator 12 and the signal processor 15 are lithium niobate-based chips.

[0065] In a schematic embodiment, the modulator 12 is a lithium niobate-based chip, and the signal processor 15 is a silicon-based chip.

[0066] In a schematic embodiment, the modulator 12 is a lithium niobate electro-optic modulator, and the signal processor is a lithium niobate optical processor.

[0067] In a schematic embodiment, the signal processor is a lithium niobate microring for filtering the modulation signal.

[0068] In a schematic embodiment, the lithium niobate microring is an all-pass microring or an add-drop microring.

[0069] According to an embodiment of the present disclosure, any side surface of the package housing 2 can be used to transmit an electrical signal.

[0070] In a schematic embodiment, a side surface of the package housing 2 adjacent to the end face for inputting the radio frequency signal is used to transmit an electrical signal.

[0071] In a schematic embodiment, the detector is an InP-based communication band photodetector.

[0072] In the process of implementing the present disclosure, it is found that in the currently implemented monolithic integrated microwave photon system, due to the small area of a single integrated chip, there is a problem of radio frequency signal interference between the modulator and the detector, and the signal interference between the two limits the function of the entire integrated system.

[0073] According to an embodiment of the present disclosure, as Figure 3 shown, the laser 11, the modulator 12, the signal processor 15, and the detector 16 are respectively bonded to the substrate 13, wherein the detector 16 and the modulator 12 are arranged diagonally.

[0074] According to an embodiment of the present disclosure, two devices in the microwave photon module 1 that are prone to radio frequency signal interference, namely the modulator 12 and the detector 16, are arranged at diagonal positions on the substrate 13, ensuring the maximum distance between the modulator 12 and the detector 16 on the substrate 13, isolating the modulator 12 and the detector 16 on the substrate 13, and reducing the radio frequency signal interference between the modulator 12 and the detector 16.

[0075] In a schematic embodiment, as Figure 3 shown, the detector 16 is placed in the upper right corner of the substrate 13, while the modulator 12 chip is placed in the lower left corner of the integrated chip.

[0076] According to an embodiment of the present disclosure, as Figure 3 shown, each microwave photon module 1 further includes: a second photon lead 17, arranged between the signal processor 15 and the detector 16, suitable for transmitting filtered signals.

[0077] According to an embodiment of the present disclosure, the first photon lead 14 and the second photon lead 17 are free-form polymer waveguides fabricated by nanofabrication and include a core layer and a cladding layer coated on the core layer. The core layer is made of a polymer material, and the cladding layer is formed by curing a refractive index matching liquid coated on the core layer. Since light propagates where the refractive index is high during light transmission, the refractive index of the cladding layer is less than that of the core layer, so that the laser propagates in the inner core of the photon lead.

[0078] According to an embodiment of the present disclosure, using the first photon lead 14 to connect the laser 11 and the modulator 12, and the second photon lead 17 to connect the signal processor 15 and the detector 16 can reduce the coupling loss between different chips to less than 1 dB, enabling the entire system to operate with high performance without the need for an optical amplifier.

[0079] According to an embodiment of the present disclosure, the core layers of the first photon lead 14 and the second photon lead 17 printed by two-photon lithography laser direct writing technology are both made of the polymer material SU-8, and the cladding layers are both made of Cargill laser liquid. The first photon lead 14 constructs an optical channel between the laser 11 and the modulator 12, the second photon lead 17 constructs an optical channel between the signal processor 15 and the detector 16, and the photon leads construct optical channels in any direction and at any angle.

[0080] In a schematic embodiment, as Figure 1 shown, the integrated microwave photon system includes: 4 microwave photon modules 1 and a packaging housing 2. Each microwave photon module 1 includes: a DFB laser 11 based on an indium phosphide chip and a first photon lead 14 of a modulator 12 on a lithium niobate chip.

[0081] The DFB laser 11 of each microwave photon module 1 emits an optical carrier wave, which is a laser with a communication wavelength of 1550 nm. The optical carrier wave is transmitted through the first photon lead 14 from the indium phosphide-based chip to the lithium niobate-based chip.

[0082] Four radio frequency signal input channels are provided on the first side of the package housing 2. The four radio frequency input channels are respectively connected to the channels of the package housing 2 so that the modulators 12 located in the respective channels of the package housing 2 receive radio frequency modulation signals respectively.

[0083] The modulator 12 modulates the received optical carrier wave according to the externally input radio frequency signal, and the modulation signal is emitted from the second side of the package housing 2 adjacent to the first side.

[0084] The present disclosure uses photon leads as bent waveguides and an integrated manner with vertical array arrangement, making the microwave photon system more suitable for practical applications, improving the stability of the signal transmitting end, and enhancing the performance of the system.

[0085] So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that the implementation manners not illustrated or described in the accompanying drawings or the text of the specification are all forms known to those of ordinary skill in the art and have not been described in detail. In addition, the definitions of the above elements and methods are not limited to the various specific structures, shapes or manners mentioned in the embodiments, and those of ordinary skill in the art can make simple changes or replacements to them.

[0086] Based on the above description, those skilled in the art should have a clear understanding of the low radio frequency crosstalk array microwave photon system provided by the present disclosure.

[0087] In summary, the present disclosure provides a low radio frequency crosstalk array microwave photon system. By setting the package housing 2 for array integration and using photon leads to achieve optical signal transmission between heterogeneous chips, it has the characteristics of small footprint, low radio frequency interference, and low coupling loss. It is an excellent microwave photon array integration solution and is of great significance in the direction of microwave photon integration.

[0088] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "rear", "left", "right", etc., are only references to the directions in the accompanying drawings and are not used to limit the protection scope of the present disclosure. Throughout the accompanying drawings, the same elements are represented by the same or similar reference numerals. When it may cause confusion in the understanding of the present disclosure, the conventional structures or configurations will be omitted, and the shapes and sizes of the components in the drawings do not reflect the actual sizes and proportions, but only illustrate the content of the embodiments of the present disclosure.

[0089] Unless otherwise noted, the numerical parameters set forth in the specification and attached claims are approximations and can vary depending upon the desired properties sought to be obtained by the present disclosure. In particular, all numerical values that denote the contents of components, reaction conditions, and the like set forth in the specification and claims should be understood to be modified in all instances by the term "about." In general, such expression means including variations of ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments from the specific recited amount.

[0090] As used in the specification and claims, ordinal numbers such as "first," "second," "third," etc. are used to modify corresponding elements and in and of themselves do not imply any ordinal number of such elements nor represent the order of one element with respect to another element or the order of manufacture. The use of such ordinal numbers is only to clearly distinguish one element having a certain name from another element having the same name.

[0091] Furthermore, unless specifically described or steps that must occur in a particular order, the order of the above steps is not limited to that listed above and can vary or be re-arranged according to the desired design. Also, the above embodiments can be used in combination with each other or with other embodiments based on considerations of design and reliability, i.e., the technical features in different embodiments can be freely combined to form more embodiments.

[0092] The specific embodiments described above further elaborate on the objectives, technical solutions, and beneficial effects of the present disclosure. It should be understood that the above are only specific embodiments of the present disclosure and are not used to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure should be included within the scope of protection of the present disclosure.

Claims

1. A vertically arrayed integrated microwave photonic system, comprising: A plurality of microwave photonic modules, each microwave photonic module comprising: A laser, which is an indium phosphide-based chip and is suitable for emitting an optical carrier; A modulator, which is a lithium niobate-based chip or a silicon-based chip and is suitable for receiving the optical carrier and modulating the optical carrier according to an externally input radio frequency signal to obtain a modulated signal; A packaging housing, wherein a plurality of separator plates are stacked at intervals inside the packaging housing to divide the packaging housing into a plurality of channels, and the microwave photonic modules are respectively arranged in the channels, so that the separator plates separate the microwave photonic modules in adjacent channels to avoid crosstalk between radio frequency signals input into the microwave photonic modules in adjacent channels.

2. The vertically arrayed integrated microwave photonic system according to claim 1, each of the microwave photonic modules further comprising: A substrate, to which the laser and the modulator are bonded to integrate the laser and the modulator onto the substrate.

3. The vertically arrayed integrated microwave photonic system according to claim 2, each of the microwave photonic modules further comprising: A first photonic lead, arranged between the laser and the modulator and suitable for transmitting the optical carrier.

4. The vertically arrayed integrated microwave photonic system according to claim 3, each of the microwave photonic modules further comprising: A signal processor, suitable for receiving the modulated signal and performing filtering processing on the modulated signal to obtain a filtered signal; A detector, suitable for receiving the filtered signal and performing photoelectric conversion on the filtered signal; Wherein, the detector is an indium phosphide-based chip, and the signal processor is a lithium niobate-based chip or a silicon-based chip.

5. The vertically arrayed integrated microwave photonic system according to claim 4, the laser, the modulator, the signal processor and the detector are respectively bonded to the substrate; Among them, The detector and the modulator are arranged diagonally.

6. The vertically arrayed integrated microwave photonic system according to claim 5, each of the microwave photonic modules further comprising: A second photonic lead, arranged between the signal processor and the detector and suitable for transmitting the filtered signal.

7. The vertically arrayed integrated microwave photonics system according to claim 6, wherein the first photonic lead and the second photonic lead are free-form polymer waveguides fabricated by nanomanufacturing, and comprise a core layer and a cladding layer coated on the core layer, the core layer is made of a polymer material, and the cladding layer is formed by curing a refractive index matching liquid coated on the core layer, wherein, The refractive index of the cladding is less than the refractive index of the core layer.

8. The vertically arrayed integrated microwave photonic system according to claim 1, the material of the packaging housing is kovar alloy.

9. The vertically arrayed integrated microwave photonic system according to any one of claims 1-8, the spacing range between the separator plates includes 7 mm - 11 mm.

10. The vertically arrayed integrated microwave photonic system according to any one of claims 1-3, at least one side surface of the packaging housing adjacent to the end surface for inputting the radio frequency signal is used for emitting the modulated signal.

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